EP1506576A1 - Dispositifs de refroidissement pour refroidir des composants electriques, module constitue d'un dispositif de refroidissement et de composants electriques, ensemble compose d'un dispositif de refroidissement ou d'un module et d'un support - Google Patents

Dispositifs de refroidissement pour refroidir des composants electriques, module constitue d'un dispositif de refroidissement et de composants electriques, ensemble compose d'un dispositif de refroidissement ou d'un module et d'un support

Info

Publication number
EP1506576A1
EP1506576A1 EP03729881A EP03729881A EP1506576A1 EP 1506576 A1 EP1506576 A1 EP 1506576A1 EP 03729881 A EP03729881 A EP 03729881A EP 03729881 A EP03729881 A EP 03729881A EP 1506576 A1 EP1506576 A1 EP 1506576A1
Authority
EP
European Patent Office
Prior art keywords
hollow body
cooling fluid
cooling
cooling device
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03729881A
Other languages
German (de)
English (en)
Inventor
Karl Exel
Jürgen SCHULZ-HARDER
Guy Lefranc
Kai Kriegel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Curamik Electronics GmbH
Siemens AG
Original Assignee
Curamik Electronics GmbH
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Curamik Electronics GmbH, Siemens AG filed Critical Curamik Electronics GmbH
Publication of EP1506576A1 publication Critical patent/EP1506576A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • Cooling devices for cooling electrical components, module of cooling device and electrical components, and arrangement of cooling device or module and carrier body
  • the invention relates to a cooling device for cooling one or more electrical components according to the preamble of claim 1 or claim 3, a module comprising such a cooling device and electrical components fastened thereon, an arrangement comprising such a cooling device and a carrier body and an arrangement comprising such Module and from such a carrier body.
  • a cooling device of the type mentioned is known from ÜS Patent No. 6 014 312.
  • This known cooling device has a hollow body for passing the cooling fluid between the two flat surfaces of the hollow body facing away from one another, which essentially consists of a plurality of layers of metal stacked one on top of the other, which are connected to one another in a flat manner and each of which has a multiplicity of small openings which are arranged overlap from layer to layer and form paths for the cooling fluid through the layer stack.
  • Two large openings are also formed in each layer, between which the small openings of this layer are arranged.
  • the large openings are arranged one above the other in the layer stack and thereby form two cooling fluid collecting cavities in the hollow body between the flat, flat surfaces of the hollow body which face away from one another and are defined by closed outer layers of the layer stack.
  • Each electrical component to be cooled must be fastened to one of the two flat-side surfaces of the hollow body, which is made of a layer of heat-conducting and electrical insulating ceramic of the hollow body is electrically isolated from the cooling fluid in the hollow body.
  • the layer made of ceramic can be applied on one flat-side surface of the hollow body or can be arranged between two of the layers made of metal of the hollow body.
  • Each of the two cooling fluid collecting cavities is assigned a cooling fluid opening for introducing or discharging the cooling fluid into or out of this cooling fluid collecting cavity, which is formed in the other flat flat surface of the hollow body, which is otherwise also closed.
  • Each cooling fluid collection cavity has a larger diameter than the cooling fluid opening assigned to it.
  • the hollow body is to be fastened on a flat surface of a support body in such a way that the flat other flat-side surface of the hollow body and the flat surface of the support body face each other and contact one another over the entire surface.
  • the carrier body can be a plate or have a structure of a plurality of cooling fluid channels distributed over the entire carrier body for supplying and removing cooling fluid.
  • the invention aims at an improved cooling fluid line in a cooling device of the type mentioned.
  • An improved cooling fluid line can be obtained according to the invention in a cooling device of the type mentioned in that, according to the characterizing part of claim 1, the other flat-side surface of the hollow body between the cooling fluid openings is concavely curved and elastically deformable, and that a fastening device is provided for Attach the hollow body on the flat surface of the carrier body in such a way that the concave other flat side Surface of the hollow body and the flat surface of the support body are pressed against each other with elastic flat deformation of the concave other flat surface of the hollow body.
  • the cooling device according to claim 1 has the advantage that it can be attached in a simple manner to a flat surface of a carrier body that does not have a structure of a plurality of cooling fluid channels distributed over the entire carrier body, but advantageously only one cooling fluid channel per cooling fluid opening of the cooling device for supplying or discharging the cooling fluid to or from this cooling fluid opening, and there is also the particular advantage that this cooling fluid opening and this cooling fluid channel during the process of attaching the cooling device to the carrier body easily and in the simplest way simply by means of a common O-ring can be sealed against leakage of cooling fluid to the environment.
  • the cooling fluid can accordingly advantageously be supplied to or derived from the cooling device through a single cooling fluid channel in the carrier body of the assigned cooling fluid opening, and the production of such a channel is simple.
  • a cooling fluid channel can be a through hole that can be produced by drilling in the carrier body.
  • the support body has a flat surface, in each cooling fluid opening in the concave curved other flat surface of the hollow body of the cooling device, one mouth of a cooling fluid channel formed in the support body for supply or supply Deriving cooling fluid is arranged that
  • each cooling fluid opening of the cooling device is opposite the mouth of the carrier body associated with this cooling fluid opening, wherein - between these facing surfaces of the carrier body and the cooling device, O-rings made of elastic material are arranged, each of which has a cooling fluid opening of the cooling device and surrounds the mouth of the fluid channel of the carrier body opposite this cooling fluid opening, and that
  • the cooling device and the carrier body are fastened to one another by the fastening device of the cooling device in such a way that the concavely curved other flat-side surface of the hollow body of the cooling device is elastically flattened and each O-ring is squeezed between this flattened surface and the flat surface of the carrier body, so that it seals the cooling fluid opening of the cooling device and the opening of the cooling fluid channel of the carrier body opposite this cooling fluid opening, both of which this O-ring surrounds closed, from the environment in a fluid-tight manner.
  • each cooling fluid opening of the cooling device and the mouth of the cooling fluid channel opposite this cooling fluid opening are automatically sealed in a fluid-tight manner from the surroundings, and a particularly simple cooling fluid line is advantageously realized.
  • the concave, curved, flat-sided other surface of the hollow body is an essential prerequisite for the feasibility of simply attaching the cooling fluid device to the carrier body, since only with it can a sufficiently strong pressure be exerted on the O-rings arranged in the cooling fluid openings to pinch them.
  • An elastically deformable flat flat-side other surface of the hollow body would deform in a comparatively convex manner and thus disadvantageously relieve rather than strain an O-ring.
  • the fastening device of the cooling device according to claim 1 can advantageously be implemented in a simple manner by at least one threaded hole formed in the hollow body between the two cooling fluid openings,
  • the concavely curved, flat-sided other surface of the hollow body of the cooling device opposite the flat surface of the support body can be drawn onto the support body and pressed flat.
  • the fastening device preferably and advantageously has two threaded holes formed in the hollow body between the two cooling fluid openings,
  • Cooling fluid can leak from the hollow body
  • the support body only requires through holes at the locations of the threaded holes in the hollow body of the cooling device.
  • a through hole can, for example, simply be a bore through which the threaded bolt can be inserted or screwed.
  • An improved cooling fluid line can also be obtained in a cooling device of the type mentioned at the outset in that, according to the characterizing part of claim 3, a cooling fluid guiding device is formed in the hollow body between the cooling fluid openings, which guides the cooling fluid introduced into the hollow body through a cooling fluid opening Guides hollow body laterally past the center between the cooling fluid openings of the hollow body to the other cooling fluid opening.
  • a fluid line in the hollow body which is better concentrated on the components to be cooled and thus a better cooling effect on these components can advantageously be obtained.
  • Components that are not to be cooled for example busbars that become less warm, can advantageously be fastened on the one flat surface above the coolant-free center of the hollow body.
  • the cooling fluid guide device requires at least one deflecting surface which is arranged in the vicinity of a cooling fluid opening and which deflects the cooling fluid supplied through this cooling fluid opening and a direct flow of the supplied cooling fluid from this cooling fluid opening to the other cooling fluid opening, that is to say prevented by the center between the two cooling fluid openings.
  • a deflection surface can be implemented in various ways.
  • the cooling fluid guide device has a solid web made of heat-conducting material and formed centrally in the hollow body,
  • the deflection surface of the cooling fluid guide device can be realized simply by an end face of the web, which is opposite a cooling fluid opening through which the cooling fluid is supplied.
  • the deflection surface can be freely selected in individual cases due to the shape of this front end.
  • this free end can be a prism-shaped, pointed end of the web.
  • the web has an end face which is opposite a cooling fluid opening and which has a curve.
  • the solid web advantageously also acts as an additional heat sink and improves the cooling effect of the cooling device.
  • a threaded hole in the hollow body is advantageously arranged in the web.
  • the cooling fluid guide device can be spaced from an edge of a cooling fluid opening or can extend as far as the edge of a cooling fluid opening.
  • Such a structure improves the heat dissipation and thus the cooling effect of the cooling device and can be implemented in a wide variety of ways, for example by means of a grid and / or a meshed fabric and / or a sponge.
  • the structure made of the highly thermally conductive material preferably has small cavities, each of which is surrounded by this material and which are connected to one another, and / or small channels, each of which is surrounded by this material and connects the two cooling fluid openings to one another.
  • Such structures include, for example, a grid, a sponge, the structures resulting from the aforementioned US Pat. No. 6,014,312, etc.
  • the hollow body of a cooling device according to the invention can be constructed with a layer stack of layers with wells made of heat-conducting material with small holes, the holes being offset from one another from layer to layer but overlapping one another , With this construction, a solid web in the hollow body can be realized simply by hole-free regions of the layers which lie one above the other in the stack.
  • the structure made of the good heat-conducting material advantageously extends to an edge of a cooling fluid opening, in contrast to a cooler according to US Pat. No. 6,014,312.
  • the structure can surround the edge of the cooling fluid opening in a closed manner, or it can itself also only extend along a partial section of this edge and not over the entire edge, in particular when a cooling fluid guide device reaches as far as the edge of this cooling fluid opening.
  • a cooling device in a particularly preferred embodiment, be it configured according to claim 1 or claim 3 or according to a combination of these two claims
  • the hollow body on electrically conductive material
  • - Is or are the one or more attached to the cooling device electrical components by a layer of good heat and electrically insulating material from the cooling fluid in the hollow body, which is parallel to the flat surface of the hollow body and firmly connected to the hollow body.
  • the layer of good heat-conducting and electrically insulating material is preferably applied to one flat-side surface of the hollow body of the cooling device.
  • the hollow body has a stack of layers of electrically conductive material, it can also be arranged between two such layers.
  • a layer of electrically conductive material arranged on the side of the layer of highly thermally conductive and electrically insulating material facing away from the hollow body, be it a layer of the stack or a subsequently applied layer of electrically conductive material, is preferably structured, for example in electrical conductor tracks which in the case of electrical components to be cooled in the form of power semiconductor components, there may be busbars.
  • the layer of electrically conductive material can extend all over the entire hollow body.
  • the layer is made of the good heat-conducting and electrically insulating material is divided into separate sections.
  • the layer of the good heat-conducting and electrically insulating material preferably has ceramic material, the electrically conductive material of the hollow body preferably copper.
  • the layer of the heat-conducting and electrically insulating material that is firmly connected to the hollow body has a smaller coefficient of thermal expansion than the hollow body.
  • This method simply consists in that the layer of the good heat-conducting and electrically insulating material is firmly connected to the hollow body at elevated temperature and the layer and hollow body are then cooled. When it cools down, the material of the hollow body contracts more than the material of the electrically insulating layer and, on account of this “bimetal effect”, automatically generates it elastically deformable concave other flat surface of the hollow body.
  • an electrically insulating layer coated with metal is soldered onto the flat surface of the hollow body made of metal.
  • the layer and the hollow body heat up and expand differently, the hollow body more than the layer.
  • the solder solidifies, the hollow body and the layer bond firmly to one another at a still high temperature.
  • the hollow body contracts more than the layer firmly connected to it, so that after cooling the other flat-side surface of the hollow body is concavely curved and can be elastically deformed.
  • this "bimorph or bimetallic effect” has been a disruptive effect and efforts have been made to avoid it, for example in order to achieve flat, flat surfaces of the hollow body, e.g. by using an electrically insulating layer of the same material on each flat-side surface of the hollow body.
  • the invention has turned away from this and makes targeted use of the “bimorph or bimetal effect”.
  • the “bimorph or bimetal effect” can advantageously be used, regardless of whether or not the hollow body has a cooling fluid guide device, in particular a solid web.
  • the cooling devices according to the invention also create a novel module with such a cooling device and one or more electrical components, which is or are attached to one flat-side surface of the hollow body of the cooling device.
  • This module can advantageously be attached to the carrier body with the aid of the O-rings just as easily and as described above in relation to the cooling device alone without electrical components.
  • a carrier body which has a flat surface, in each cooling fluid opening in the concave other flat surface of the hollow body of the cooling device of the module, an opening assigned to this cooling fluid opening of a cooling fluid channel formed in the carrier body for supplying or discharging cooling fluid, that
  • Cooling device of the module facing each other and arranged such that each cooling fluid opening of the cooling device of the module is opposite the mouth of the fluid channel of the carrier body associated with this cooling fluid opening, wherein
  • O-rings made of elastic material are arranged, each of which surrounds a cooling fluid opening of the cooling device of the module and the mouth of the carrier body opposite this cooling fluid opening that closed
  • the cooling device and the carrier body are fastened to one another by the fastening device of the cooling device such that the concavely curved other flat-side surface of the hollow body of the cooling device of the module is elastically flattened and each O-ring is squeezed between this flattened surface and the flat surface of the carrier body is such that it covers the cooling fluid opening of the cooling device of the module and the opening of the cooling fluid channel of the carrier body opposite this cooling fluid opening, both of these O-rings surrounds closed, seals fluid-tight against the environment.
  • the module can advantageously also with a cooling device, which has a cooling fluid guide device, and with
  • the one or more attached components is or are arranged next to the cooling fluid guide device in the region of the cooling fluid flowing past the center between the cooling fluid openings of the hollow body and to the other cooling fluid opening.
  • electrical components which generate different amounts of heat during operation are preferably and advantageously arranged one after the other in the flow direction of the cooling fluid flowing past the center between the cooling fluid openings of the hollow body and the other cooling fluid opening in such a way that on a component that is relatively less Generates heat, followed by a component that generates relatively more heat.
  • a module mentioned above is preferably a power semiconductor module, that is to say that at least one electrical component of this module is a power semiconductor component.
  • the invention also provides a novel arrangement of a cooling device and a carrier body, which is specified in claim 21, and a novel arrangement of a module and a carrier body is also provided, which is specified in claim 22.
  • the carrier body is part of an electrical transmission.
  • the carrier body is part of an electrical
  • Water is preferably used as the cooling fluid, but other fluids such as oil can also be used.
  • Figure 1 is a perspective view of a power semiconductor module to which the invention is applied;
  • FIG. 2 shows a vertical longitudinal section through the module according to FIG. 1, taken along section line II-II in FIG. 1;
  • 3a shows a vertical cross section taken along the section line III-III in FIG. 1 through the module according to FIG. 1;
  • FIG. 3b shows the lower part of the vertical cross section according to FIG. 3a, which, in contrast to FIG. 3a, shows a concave other flat surface of the hollow body of the module;
  • FIG. 4 shows a horizontal section through the module according to FIG. 1, taken along the section line IV-IV in FIG. 1;
  • FIG. 5 shows the upper part of the vertical longitudinal section according to FIG. 2, which, in contrast to FIG. 2, divided one
  • FIG. 6 shows the part of FIG. 3a surrounded by circle B in an enlarged representation
  • Figure 7 in the sectional view of Figure 2 shows an arrangement of a module and a support body, which also shows an arrangement of a cooling device and the support body, the support body being shown only in fragments
  • the exemplary power semiconductor module shown in FIG. 1 and generally designated 1 ' has an exemplary cooling device 1 according to the invention and an arrangement 2 comprising a plurality of electrical components to be cooled in the form of power semiconductor components 20 and 20', each of which faces away from one another flat-side surfaces 101 and 102 of a substantially flat plate-shaped hollow body 10 of the cooling device 1 and made of a good heat-conducting material, for example copper, is fastened.
  • the power semiconductor components 20 and 20 ′ are fastened on the flat-side surface 101 of the hollow body 10, so that the surface 101 forms one flat-side surface and the surface 102 forms the other flat-side surface of the hollow body 10.
  • the power semiconductor components 20 and 20 ′ could equally well be attached to surface 102, so that then surface 102 would be one flat-side surface and surface 101 would be the other flat-side surface of hollow body 10.
  • the hollow body 10 serves to pass a cooling fluid 3 (indicated in FIGS. 2 and 4 by bold arrows, the directional arrows of which also indicate the direction of flow of the cooling fluid) through the hollow body 10 between its two flat surfaces 101 and 102.
  • the cooling fluid 3 consists, for example, of water ,
  • the hollow body 10 is flat in the form of a plate and essentially has a rectangular shape with a central longitudinal axis A.
  • the arrangement 2 composed of the power semiconductor components 20 and 20 'is not fastened directly on the essentially rectangular one flat side surface 101 of the hollow body 10, but on a surface 180 facing away from the hollow body 10 of an essentially rectangular layer 18 made of highly heat-conducting and electrically insulating ceramic material, which is applied to one flat-side surface 101 of the hollow body 10 and fastened thereon by soldering.
  • the arrangement 2 is electrically insulated from the hollow body 10 by this electrically insulating layer 18.
  • electrical components that are not to be cooled such as, for example, busbars 21, are also fixed to the surface 180 of the electrically insulating layer 18.
  • the electrical components 20, 20 ', 21 of the module 1' as far as they are visible at all, have been omitted for the sake of simplicity of illustration.
  • two cooling fluid openings 11 are arranged at a distance from one another for introducing and discharging the cooling fluid 3 into and out of the hollow body 10.
  • the hollow body 10 is one on a flat surface 41
  • the other flat-side surface 102 of the hollow body 10 is concavely curved and elastically deformable between the cooling fluid openings 11, and a fastening device 5 for fastening the hollow body 10 on the flat surface 41 of the carrier body 4 is provided in such a way that the concavely curved other flat-side surface 102 of the hollow body 10 and the flat surface 41 of the carrier body 4 are pressed against one another with elastic flat deformation of the concave other flat surface 102 of the hollow body 10.
  • the other flat-side surface 102 of the hollow body 10 is predominantly in the direction of the longitudinal axis A of the hollow body 10 curved, can additionally or alternatively also be curved in the direction of the line III-III or IV-IV in FIG. 1 perpendicular to the longitudinal axis A, as is indicated in FIG. 3b.
  • the fastening device 5 has, for example, two threaded holes 12 formed in the hollow body 10 between the two cooling fluid openings 11 and each having an internal thread, each of which is sealed in a fluid-tight manner against the cooling fluid 3 in the hollow body 10, so that no cooling fluid 3 from the hollow body 10 is through this threaded hole 12 can leak to the outside, and each of which in the concave other flat surface 102 of the hollow body 10 has a threaded hole opening 120 through which a threaded bolt 13 projecting through the carrier body 4 with an external thread is to be screwed into the threaded hole 12 in order to cooler 1 or module 1 'and to fix carrier body 4 to one another.
  • the threaded holes 12 are preferably arranged on the longitudinal axis A of the hollow body 10 and in each case close to a cooling fluid opening 11.
  • Each threaded hole 12 is defined, for example, by a bush 121 with an internal thread inserted into the hollow body 10 and made of a material that is harder than the material of the hollow body 10.
  • each threaded hole 12 is a through hole which extends across the entire hollow body 10 and also in the one flat surface
  • a threaded hole 12 may also be a blind hole that only the threaded hole opening 120 in the other flat surface
  • a cooling fluid guide device 6 is also formed in the hollow body 10 between the cooling fluid openings 11, which guides the cooling fluid 3 introduced into the hollow body 10 through a cooling fluid opening 11 in the hollow body 10 laterally past the center 110 between the cooling fluid openings 11 of the hollow body 10 and to the other cooling fluid opening 11 ,
  • the cooling fluid guide device 6 is preferably designed in such a way that it has a solid web 60, which is formed centrally in the hollow body 10 and is made of a good heat-conducting material and connects the two flat surfaces 101 and 102 of the hollow body 10, which is impermeable to the cooling fluid 3 is elongated along a connecting line 111 (see FIG. 2) between the two cooling fluid openings 11 and on its two long sides 62 flows along the cooling fluid 3 introduced into the hollow body 10 through a cooling fluid opening 11 in the hollow body 10 to the other cooling fluid opening 11.
  • the web 60 has an end face 61 opposite each cooling fluid opening 11.
  • the front end 61 of the web 60 which is opposite and adjacent to the cooling fluid opening 11, through which the cooling fluid 3 is introduced into the hollow body 10 and which is, for example, the left cooling fluid opening 11 in FIGS. 2 and 4, defines a deflection surface for deflecting the in the cooling fluid 3 introduced into the hollow body 10.
  • This deflection surface is preferably defined by a curve 610 of this end 61.
  • the web 60 is essentially mirror-symmetrical with respect to the center 110 between the cooling fluid openings 11 of the hollow body, so that the other front end 61 of the web 60, which in the example is the one for discharging the cooling fluid 3 opposite the right cooling fluid opening 11 serving the hollow body, has a curve 610.
  • a rounding 610 another, for example pointed, shape can also be selected.
  • the front ends 61 of the web 60 are arranged at a distance from the cooling fluid openings 11. It could also be set up in such a way that one or each end 61 of the web 60 reaches to the edge 112 of a cooling fluid opening 11.
  • the threaded holes 12 of the hollow body 10 are preferably arranged in the web 60 and preferably close to the front ends 61 of the web 60. If the material of the web 60 is sufficiently hard, bushings 121 with an internal thread can be dispensed with, and a threaded hole 12 with an internal thread can be made directly in the web 60.
  • a structure 17 is preferably formed from a good heat-conducting material, through which the cooling fluid 3 can flow, which provides the flowing cooling fluid 3 with an enlarged contact surface and which is in good heat-conducting contact with the flat surfaces 101 and 102 of the hollow body 10 and with the Bridge 60 stands.
  • Structure 17 made of the highly thermally conductive material is preferably designed such that it has small cavities 171, each of which is surrounded by this material and which are connected to one another and / or has small channels 172, each of which is surrounded by this material and connects the two cooling fluid openings 11 to one another.
  • the structure 17 can thus, like any corresponding structure resulting from the said US Pat. No. 6,014,312, be produced by a stack of layers each having a multiplicity of small holes, with the difference being that in the present structure 17, the layers in the area of the web 60 must not have any holes.
  • the solid web 60 is advantageously formed automatically by stacking hole-free regions of the layers on top of one another.
  • the structure 17 can also be formed, for example, by filling a cavity of the hollow body 10 surrounding the already existing solid web 60 with lattice material and / or meshed fabric and / or a sponge, each of which has a good heat-conductive material and which is in close heat-conductive contact with the flat surfaces 101 and 102 of the hollow body 10 and the solid web 60.
  • the present structure 17 preferably extends from the highly heat-conducting material to the edge 112 of a cooling fluid opening 11. Since the front ends 61 of the web 60 do not, for example, reach the edge 112 of the cooling fluid openings, the structure 17 extending to the edge 112 of a cooling fluid opening 11 can advantageously even surround this edge in a closed manner.
  • the layer 18 made of the highly heat-conducting and electrically insulating material is applied and fixed over the entire surface of the hollow body 10.
  • an electrically coated metal layer 108 is coated on the surface 181 of this layer 18 facing away from the surface 180 of the electrically insulating layer 18 and facing the hollow body. risch insulating layer 18 soldered to a flat surface 101 of the hollow body 10 made of metal by means of a solder 109.
  • the electrically insulating layer 18 has a relatively smaller coefficient of thermal expansion ⁇ 1 and the hollow body 10 has a relatively larger coefficient of thermal expansion ⁇ 2.
  • the electrically insulating layer 18 and hollow body 10 heat up and expand differently, the hollow body 10 more than the layer 18.
  • the hollow body 10 and the layer 18 bond firmly to one another at a still high temperature.
  • the hollow body 10 contracts more than the layer 18 firmly connected to it, so that after cooling the other flat-side surface 102 of the hollow body is concavely curved by itself and can be elastically deformed.
  • the layer 18 Due to the tension prevailing between the electrically insulating layer 18 and the hollow body 10 during the subsequent attachment to the carrier body 4, there is a certain tendency for the layer 18 to become detached from the hollow body 10. This can be reduced if the layer 18 consists of the highly thermally conductive and electrically insulating material, as indicated in Figure 18, is divided into separate sections 18 '.
  • the hollow body 10 made of copper has a length of approximately 100 mm, a width of approximately 60 mm, a thickness of about 3.5 mm and is formed from a stack of copper layers.
  • the cooling fluid arranged on the longitudinal axis A symmetrically to the center 110 Openings 11 are spaced approximately 85 mm apart and each have an opening diameter of approximately 5.5 mm.
  • the threaded holes 12, likewise arranged symmetrically on the longitudinal axis A with respect to the center 110, are at a distance of approximately 65 mm from one another and each have an opening diameter of approximately 4 mm.
  • the soldered electrically insulating layer 18, which is undivided and extends essentially over the entire rectangular, flat surface 101 of the hollow body 10, is made of Al 2 O 3 and has a thickness of approximately 0.4 mm.
  • the other rectangular flat surface 102 of the hollow body 10 which is elastically concavely curved along the longitudinal axis A has a maximum curvature depth t of approximately 100 ⁇ m in the center 110 with respect to the front ends 105 of the hollow body 10.
  • the power semiconductor components 20 and 20 ′ attached to the electrically insulating layer 18 of the cooling device are a plan view of the surface 180 of this layer 18 next to the web 60 along the two long sides 62 of the web 60 (see FIG. 4 ) are arranged one after the other and are located above the cooling fluid 3 flowing in the hollow body 10 along these two longitudinal sides 62.
  • each longitudinal side 62 of the web 60 for example, a row of six power semiconductor components 20, 20 'is arranged, which are arranged in succession in the flow direction of the cooling fluid 3 flowing along the longitudinal sides 62 (see FIG. 4).
  • Two first power semiconductor components 20 in each row are, for example, IGBTs
  • two power semiconductor components 20 'following them are, for example, diodes
  • two power semiconductor components 20 following these diodes 20' are again IGBTs.
  • the diodes 20 ' produce more heat during operation than the IGBTs 20, and therefore, for reasons of an optimal cooling effect by the cooling device 1, the two diodes 20' are arranged in each row between the two pairs of IGBTs 20.
  • the IGBTs 20 and diodes 20 are electrically connected in a certain manner to current bars 21 arranged on the electrically insulating layer 18.
  • a single bus bar 21 can be arranged above the web 60, or two or more stacked and electrically insulated bus bars 21 can be arranged above the web 60, and / or other bus bars 21 can be arranged, for example, between the layer 18 and the power semiconductor components 20 , 20 'individually or also stacked one above the other and arranged electrically insulated from one another on the electrically insulating layer 18.
  • the busbars 21 and other electrical lines can be produced by structuring one or more layers of electrically conductive material on the electrically insulating layer 18.
  • pantographs for the busbars 21 are designated by 22.
  • FIG. 7 shows how a cooling device 1 or a module 1 ′ with a carrier body 4 forms an arrangement 1 ′′ out of the cooling device 1 and out of the carrier body 4 or respectively an arrangement 1 ′′ is formed from the module 1 ′ and the carrier body 4.
  • the carrier body 4 which is only shown in fragments, is designed in such a way that it has a flat surface 41, in which, for each cooling fluid opening 11 in the concavely curved other flat-side surface 102 of the hollow body 10 of the cooling device 1, an orifice 401 associated with this cooling fluid opening 11 is formed in a carrier body 4
  • Cooling fluid channel 40 for supplying or discharging cooling fluid 3 to or from the hollow body 10 is arranged.
  • the flat surface 41 of the carrier body 4 and the concave other flat surface 102 of the hollow body 10 of the cooling device 1 face each other and are arranged such that each cooling fluid opening 11 of the cooling device 1 is opposite the mouth 401 of the carrier body 4 assigned to this cooling fluid opening 11.
  • O-rings 7 Arranged between these mutually facing surfaces 41 and 102 of the carrier body 4 and the cooling device 1 are O-rings 7 made of elastic material, each of which closes a cooling fluid opening 11 of the cooling device 1 and the opening 401 of the fluid channel 40 of the carrier body 4 opposite this cooling fluid opening 11 surrounds.
  • the cooling device 1 and the carrier body 4 are fastened to one another by the fastening device 5 of the cooling device 1 in such a way that the concave other flat surface 102 of the hollow body 10 of the cooling device 1 in
  • Each O-ring 7 is arranged, for example, in a recess 410 in the flat surface 41 of the carrier body 4 so that it does not slip sideways when the arrangement 1 ′′ or 1 ′′ ′′ is assembled.
  • a recess could alternatively or additionally also be formed in the other flat-side surface 102 of the hollow body 10.
  • the assembly takes place, for example, in such a way that, after the cooling device 1 or the module 1 'and the support body 4 have been arranged, the other flat surface 102 of the Hollow body 10 and the flat surface 41 of the support body 4 facing each other and the O-rings 7 are arranged in the correct position between them that the threaded bolts 13 through through holes 134 formed in the support body 4, which are exactly opposite the openings 120 of the threaded holes 12 in the hollow body , inserted and then screwed into the threaded holes 12, and that then on the side of a surface 42 of the carrier body 4, which faces away from the flat surface 41 of the carrier body 4, a nut 13 'is screwed onto each threaded bolt 13 projecting through the carrier body 4 and then tightened so that the other flax Surface 102 of the hollow body 10 is flattened, the O-rings are squeezed and the hollow body 10 and carrier body 4 are firmly
  • a through hole 134 formed in the carrier body 4 can also be a threaded hole with an internal thread, through which the threaded bolt 13 can be screwed for screwing into a threaded hole 12 in the hollow body 10.
  • FIG. 7 actually shows an arrangement 1 ′′ ′′ of module 1 ′ and carrier body 4. The arrangement 1 ′′ of the cooling device 1 and the carrier body 4 arises when the electrical components 20, 20 ′ and 21 shown are disregarded.
  • the carrier body 4 is preferably part of an electrical transmission 4 ', in particular an electrical transmission 4' for a motor vehicle for cooling power semiconductor components required for the electrical supply of the part.
  • the cooling device 1 and the module 1 ' are characterized by their extremely flat design, which is particularly good for installation in tight spaces

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dispositif de refroidissement (1) pour refroidir un ou plusieurs composants semi-conducteurs de puissance (20, 20'), ce dispositif comprenant un corps creux (10) plat en forme de plaque en cuivre, servant au passage d'un fluide de refroidissement (3). Sur un côté plat (101) du corps creux sont fixés des composants et l'autre côté plat (101) comporte deux ouvertures (11) pour la pénétration du fluide de refroidissement dans le corps creux et son évacuation hors de celui-ci, le deuxième côté plat présentant une forme concave et élastique entre les deux ouvertures. Un dispositif de fixation (5) permet de placer le côté concave sur la surface plate (41) d'un support (4), de sorte que le côté concave et la surface plate sont pressés l'un contre l'autre par la déformation élastique plane du côté concave, les ouvertures pour le fluide de refroidissement étant fluidiquement étanches par des joints toriques. Dans le corps creux se trouve également une entretoise (60) massive qui relie les côtés plats. La présente invention porte également sur un module (1') constitué de ce dispositif de refroidissement et sur un ensemble (1'', 1''') composé dudit dispositif de refroidissement ou du module et du support. Le dispositif de refroidissement selon l'invention s'avère utile dans les transmissions électriques, notamment pour les véhicules à moteur.
EP03729881A 2002-05-22 2003-05-09 Dispositifs de refroidissement pour refroidir des composants electriques, module constitue d'un dispositif de refroidissement et de composants electriques, ensemble compose d'un dispositif de refroidissement ou d'un module et d'un support Withdrawn EP1506576A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10222681 2002-05-22
DE10222681 2002-05-22
PCT/DE2003/001498 WO2003098686A1 (fr) 2002-05-22 2003-05-09 Dispositifs de refroidissement pour refroidir des composants electriques, module constitue d'un dispositif de refroidissement et de composants electriques, ensemble compose d'un dispositif de refroidissement ou d'un module et d'un support

Publications (1)

Publication Number Publication Date
EP1506576A1 true EP1506576A1 (fr) 2005-02-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP03729881A Withdrawn EP1506576A1 (fr) 2002-05-22 2003-05-09 Dispositifs de refroidissement pour refroidir des composants electriques, module constitue d'un dispositif de refroidissement et de composants electriques, ensemble compose d'un dispositif de refroidissement ou d'un module et d'un support

Country Status (6)

Country Link
US (1) US7187545B2 (fr)
EP (1) EP1506576A1 (fr)
JP (1) JP2005531133A (fr)
AU (1) AU2003240418A1 (fr)
DE (1) DE10393078D2 (fr)
WO (1) WO2003098686A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005315157A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、冷却装置および電子機器
JP2005317796A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、冷却装置および電子機器
TWI240608B (en) * 2004-05-13 2005-09-21 Delta Electronics Inc Electronic apparatus with heat-dissipating structure
US9645618B2 (en) * 2014-07-31 2017-05-09 Google Technology Holdings LLC Skin oscillation convective cooling
EP3352214A1 (fr) 2017-01-23 2018-07-25 Siemens Aktiengesellschaft Module à semi-conducteur avec tolérance de concavité

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DE2903685A1 (de) * 1979-01-31 1980-08-14 Siemens Ag Kuehlvorrichtung zur kuehlung von elektrischen bauelementen, insbesondere von integrierten bausteinen
CA1203640A (fr) 1983-02-07 1986-04-22 Faquir C. Mittal Dispositif refroidisseur de puces a circuit integre
IT1201836B (it) 1986-07-17 1989-02-02 Sgs Microelettronica Spa Dispositivo a semiconduttore montato in un contenitore segmentato altamente flessibile e fornite di dissipatore termico
DE3940933C2 (de) 1989-12-12 1996-08-01 Eupec Gmbh & Co Kg Verfahren zum Verformen einer Basisplatte für Halbleitermodule und Vorrichtung zum Durchführen des Verfahrens
DE19643717A1 (de) 1996-10-23 1998-04-30 Asea Brown Boveri Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul
DE19710783C2 (de) * 1997-03-17 2003-08-21 Curamik Electronics Gmbh Kühler zur Verwendung als Wärmesenke für elektrische Bauelemente oder Schaltkreise
DE19925510A1 (de) 1999-06-04 2000-12-14 Schulz Harder Juergen Kühler zur Verwendung als Wärmesenke für elektrische oder elektronische Komponenten
US6386278B1 (en) 1998-08-04 2002-05-14 Jurgen Schulz-Harder Cooler
DE10009864A1 (de) * 2000-03-01 2001-09-13 Fluidtech Gmbh Kühlvorrichtung
US7209355B2 (en) * 2002-05-15 2007-04-24 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
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See references of WO03098686A1 *

Also Published As

Publication number Publication date
DE10393078D2 (de) 2005-05-12
AU2003240418A1 (en) 2003-12-02
JP2005531133A (ja) 2005-10-13
WO2003098686A1 (fr) 2003-11-27
US7187545B2 (en) 2007-03-06
US20050213304A1 (en) 2005-09-29
AU2003240418A8 (en) 2003-12-02

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