EP3479720B1 - Verfahren zum fassen eines steins - Google Patents
Verfahren zum fassen eines steins Download PDFInfo
- Publication number
- EP3479720B1 EP3479720B1 EP17200360.0A EP17200360A EP3479720B1 EP 3479720 B1 EP3479720 B1 EP 3479720B1 EP 17200360 A EP17200360 A EP 17200360A EP 3479720 B1 EP3479720 B1 EP 3479720B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- stone
- girdle
- substrate
- cavity
- pavilion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004575 stone Substances 0.000 title claims description 104
- 238000000034 method Methods 0.000 title claims description 44
- 238000002788 crimping Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims description 42
- 239000010410 layer Substances 0.000 claims description 31
- 230000002093 peripheral effect Effects 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- 239000010948 rhodium Substances 0.000 claims description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 2
- 238000000206 photolithography Methods 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 238000005323 electroforming Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 241000579895 Chlorostilbon Species 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 239000010976 emerald Substances 0.000 description 2
- 229910052876 emerald Inorganic materials 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000010437 gem Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 241001639412 Verres Species 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 239000002969 artificial stone Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- A—HUMAN NECESSITIES
- A44—HABERDASHERY; JEWELLERY
- A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
- A44C17/00—Gems or the like
- A44C17/04—Setting gems in jewellery; Setting-tools
-
- A—HUMAN NECESSITIES
- A44—HABERDASHERY; JEWELLERY
- A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
- A44C27/00—Making jewellery or other personal adornments
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/003—3D structures, e.g. superposed patterned layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/005—Jewels; Clockworks; Coins
-
- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B47/00—Time-pieces combined with other articles which do not interfere with the running or the time-keeping of the time-piece
- G04B47/04—Time-pieces combined with other articles which do not interfere with the running or the time-keeping of the time-piece with attached ornaments or amusement apparatus
- G04B47/042—Fastening of jewels and the like
Definitions
- the invention relates to a method of assembling a stone on a fixing support, said stone being cut to present a table, a crown, a rondist and a cylinder head.
- the invention also relates to a method of crimping on an element of a timepiece or jewelry item of a stone and of its fixing support obtained according to said assembly method.
- the method consists of providing a wax mandrel with a tubular base, depositing a conductive coating on the surface of the mandrel, depositing the stone in the tubular base, depositing a metal by electroforming on the conductive coating layer by layer, to fill the gap between the stone and the seat with this metal to keep the stone in position and to remove the mandrel and the conductive coating.
- the method according to the invention makes it possible to choose the dimensions of the housing, and more particularly the dimensions of the through hole, so as to adapt to the dimensional variations of the stones.
- the invention also relates to a method of crimping a stone onto an element of a timepiece or of jewelry comprising the mounting of the stone and its fixing support obtained according to the method as defined above on a kitten then attached to the timepiece or jewelry item or directly to the timepiece or jewelry item.
- the invention also relates to a timepiece or jewelry element comprising at least one stone assembled on its fixing support obtained according to the assembly method as defined above.
- the present invention relates to a method of assembling a stone 1 on a fixing support 2, said stone 1 being cut to present a table 3, a crown 4, a rondist 5 and a cylinder head 6.
- a stone is preferably a stone of natural origin, such as diamond or emerald, the dimensions of which can vary from one stone to another. It is obvious that the stone can be of any other nature, natural or synthetic, the method according to the invention can also be advantageously used for such stones.
- the first step a) of the method of assembling the stone 1 on a fixing support 2 according to the invention consists in providing a substrate 8 comprising at least one housing 10 in which said stone 1, said housing 10 is positioned being arranged to form between the substrate 8 and said stone 1 a peripheral free space 12 at least around the rounder 5 of stone 1, the bottom 14 of said peripheral free space 12 having a conductive surface 16.
- “Around the rounder” means that the the peripheral free space 12 is situated at least at the level of the rondist 5 and of zones 4a and 6a of the crown 4 and of the cylinder head 6 respectively contiguous with the rondiste 5.
- the dimensions of the through hole 18, in the plane of the substrate 8, are of dimensions smaller than the dimensions (generally called “diameter") of the rondist 5 of the stone 1 and the dimensions of the cavity 22, in the plane of the substrate 8, are greater than the diameter of the rondist 5 of the stone 1. Consequently, the cavity 22 has dimensions, in the plane of the substrate 8, greater than the dimensions of the through hole 18, the cavity 22 then comprising a central opening 24 corresponding to the hole through 18, and a peripheral zone comprising side walls 26 of resin and a bottom, that is to say the bottom 14 occupied by the conductive layer 16 of the substrate 8 around the through hole 18.
- the housing 10 therefore has a section T-shaped in the plane perpendicular to the substrate 8, as shown in the figure 2 .
- step e) comprises the use of a negative photosensitive resin 20, for example an SU8 resin, the UV irradiation of the photosensitive resin layer 20 through a mask corresponding to the outline of the desired mounting support, and removing the non-irradiated portion of the photosensitive resin layer 20 so as to obtain the cavity 22 whose outline corresponds to the outline of said desired mounting support.
- a negative photosensitive resin 20 for example an SU8 resin
- UV irradiation of the photosensitive resin layer 20 through a mask corresponding to the outline of the desired mounting support
- removing the non-irradiated portion of the photosensitive resin layer 20 so as to obtain the cavity 22 whose outline corresponds to the outline of said desired mounting support.
- step a) of the assembly method according to the invention continues with the placing of a stone 1 in each of the housings 10 formed.
- the dimensions of the cavity 22 and of the through hole 18 forming the housing 10 are chosen so that the cylinder head 6 of the stone 1 is partially housed in the through hole 18 to rest on the periphery of the central opening 24 of the cavity 22 , the rest of the breech 6 above the through hole 18 defining the zone 6a of the breech 6 contiguous to the rondist 5, and so that the rest of the stone 1 between said zone 6a of the breech 6 contiguous to the rondiste 5 and at least up to the level of zone 4a of the crown 4 contiguous to the rondiste 5 is housed in the cavity 22 so as to form between the stone 1 and the walls of the cavity 22, that is to say the side walls 26 and the bottom 14, said peripheral free space 12.
- the dimensions of the cavity 22 and of the through hole 18 are chosen so that the cylinder head 6 of the stone 1 is almost entirely housed in the through hole 18 so that the zone 6a of cylinder head 6 contiguous to the rondist 5 extends only immediately below the rondist 5, and the zone 4a of the crown 4 contiguous to the rondiste 5 extends only immediately above the rondiste 5 so as to form between the stone 1 and the walls of the cavity 22 , that is to say the side walls 26 and the bottom 14, said peripheral free space 12 only substantially around the traffic light 5, that is to say at the traffic light 5 and only immediately on either side said rondist 5, as shown in the figure 3 .
- the housing 10, and more particularly the cavity 22 has a height such that the table 3 of the stone 1 protrudes from said housing 10, and more particularly of the cavity 22, as shown in the figure 3 .
- the thickness of the resin layer 20 is chosen for this purpose.
- the only precise dimension of the stone that can be ensured being the "diameter" of the rondist 5 and its height, it is possible that the installation of the stone 1 is not done correctly, and does not allow to ensure a sufficient flatness from table 3 of stone 1.
- the assembly method according to the invention may comprise, between steps a) and b), a step f) of correcting the orientation of the stone.
- this step f) may include bringing the table 3 of the stone 1 into contact with a repositioning device 28 arranged to reposition the stone 1 in its housing 10.
- a repositioning device 28 comprises for example a rigid plate 30 coated a deformable mat or foam 32 making it possible to compensate for the heights of the stones 1.
- the repositioning device 28 is arranged so that the mat or foam 32 is brought into contact with the tables 3 of the stones positioned in their respective housings 10 on the substrate 8 so as to correct the orientation of said stones and to ensure the flatness of the tables 3 of the stones 1.
- Stage g) consists, for example, of introducing, by the free entry of the through hole 18, a retaining adhesive 34 around the cylinder head 6 of the stone 1 making it possible to fix the stone 1 in the housing 10.
- a sufficiently viscous holding glue which will not fill the finest interstices.
- the indium layer has the advantage of being deformed during the step f) of correcting the orientation of the stones by leveling the tables 3 and then being able to seal at the central opening 24 of the cavity 22.
- Stage g) is followed by a step h) of removal of the repositioning device 28 in order to be able to continue implementing the assembly process of the invention.
- step b) consists of depositing galvanically in said peripheral free space 12, from the bottom 14 of said peripheral free space 12 occupied by the conductive layer 16, a metal layer 36 at the level of the rondist 5 and zones 4a, 6a respectively.
- the metal layer 36 deposited in step b) is preferably made of a material chosen from the group comprising nickel, gold, silver, platinum, rhodium, palladium, copper and their alloys.
- the electroforming conditions in particular the composition of the baths, the geometry of the system, the voltages and current densities, are chosen for each metal or alloy to be electrodeposited according to techniques well known in the art of electroforming (cf. for example Di Bari GA "electroforming” Electroplating Engineering Handbook 4th Edition written by LJ Durney, published by Van Nostrand Reinhold Compagny Inc., NY USA 1984 ).
- the dimensions of the fixing support 2 are defined by the dimensions, in the plane of the substrate 8, of the through hole 18 and of the cavity 22, and by the height of the metal layer 36 deposited according to the galvanic deposition parameters.
- these parameters are chosen so that the metal layer 36 is deposited only substantially at the level of the rondist 5 and of the zones 4a, 6a respectively of the crown 4 and of the cylinder head 6 which extend only immediately on either side of the rondist 5 so that the fixing support 2 is positioned substantially around the rondist 5 only, as shown in the figure 8 .
- the fixing support 2 projects slightly over the zones 4a and 6a respectively of the crown 4 and of the cylinder head 6 contiguous to the rondist 5, but most of the crown 4 and of the cylinder head 6 remain free.
- step c) consists in releasing the stone 1 assembled on its fixing support 2 from the substrate 8.
- the silicon substrate 8 and the holding adhesive 34 are eliminated by dissolution.
- the assembly method according to the invention makes it possible to adapt to the dimensional variations of the stones 1 by providing in the substrate 8 through holes 18 of different diameters, adapted to the dimensions of said stones 1.
- FIGS. 7a to 7c show some variants of stones 1 assembled to their fixing support 2 which can be obtained by using different photolithographic exposure masks corresponding to the outline of the desired fixing support.
- the stone 1 assembled on its fixing support 2 thus released can be used in the crimping process according to the invention.
- Said method of crimping said stone onto an element of a timepiece or of jewelry comprises the assembly of the stone 1 and of its fixing support 2 obtained according to the assembly method as described above on a kitten 38 as shown in the figure 8 .
- the kitten 38 is then attached to the timepiece or jewelry item.
- the stone 1 and its fixing support 2 obtained according to the assembly method as described above are mounted directly on the timepiece or jewelry element.
- the mounting of the fixing support 2 carrying the stone 1 on the kitten 38 or directly on the timepiece or jewelry element can be carried out by clipping, chasing, crimping, bonding, etc.
- the timepiece or jewelry element may for example be a dial, a bezel, a rotating bezel, a middle part, a case horn, a crown, a needle, an index, a link or other bracelet element , an element of pendant, ring, necklace, etc., or any element of watchmaking / jewelry decor that can be set.
Claims (12)
- Verfahren zum Einsetzen eines Steins (1) an einem Befestigungsträger (2), wobei der Stein (1) so geschliffen ist, dass er eine Tafel (3), eine Krone (4), eine Rundiste (5) und einen Stumpf (6) aufweist, und das Einsetzverfahren die folgenden Schritte umfasst:a) Bereitstellen eines Substrats (8), das mindestens eine Aufnahme (10) umfasst, in der der Stein (1) positioniert ist, wobei die Aufnahme (10) so angeordnet ist, dass sie zwischen dem Substrat (8) und dem Stein (1) mindestens auf der Höhe der Rundiste (5) und der an die Rundiste (5) angrenzenden Bereiche (4a, 6a) der Krone (4) und des Stumpfs (6) einen peripheren freien Raum (12) bildet, und der periphere freie Raum (12) einen Boden (14) mit einer leitenden Oberfläche (16) aufweist;b) Galvanisches Abscheiden einer Metallschicht (36) im peripheren freien Raum (12) mindestens auf der Höhe der Rundiste (5) und der an die Rundiste (5) angrenzenden Bereiche (4a, 6a) der Krone (4) und des Stumpfs (6), um die Rundiste (5) in der Metallschicht (36) einzuschließen und so den Befestigungsträger (2) zu bilden;c) Lösen des Steins (1) und seines Befestigungsträgers (2) vom Substrat (8),wobei das Verfahren dadurch gekennzeichnet ist, dass das Substrat (8) und seine Aufnahme (10) entsprechend den folgenden Schritten hergestellt werden:d) Bereitstellen eines Substrats (8), das auf der Oberfläche eine leitende Schicht (16) aufweist, und Ausbilden mindestens eines Durchgangslochs (18) im Substrat (8),e) Bedecken des Substrats (8) mit einer lichtempfindlichen Harzschicht (20) und fotolitografisches Ausbilden eines Hohlraums (22) im lichtempfindlichen Harz (20), dessen Abmessungen auf der Ebene des Substrats (8) größer als die Abmessungen der Rundiste (5) des Steins (1) sind, sodass der Hohlraum (22) eine zentrale Öffnung (24) entsprechend dem Durchgangsloch (18) und einen peripheren Bereich umfasst, der Seitenwände (26) aus Harz und einen Boden (14) aufweist, der von der leitenden Schicht (16) des Substrats um das Durchgangsloch (18) herum eingenommen ist, wobei die Abmessungen des Hohlraums (22) und des Durchgangslochs (18), die die Aufnahme (10) bilden, so gewählt sind, dass der Stumpf (6) des Steins (1) teilweise im Durchgangsloch (18) aufgenommen ist, um auf der Peripherie der zentralen Öffnung (24) des Hohlraums (22) aufzuliegen, wobei der Rest des Stumpfs (6) oberhalb des Durchgangslochs (18) den an die Rundiste (5) angrenzenden Bereich (6a) des Stumpfs (6) definiert, und so, dass der Rest des Steins (1) zwischen dem an die Rundiste (5) angrenzenden Bereich (6a) des Stumpfs (6) und mindestens bis zur Höhe des an die Rundiste (5) angrenzenden Bereichs (4a) der Krone (4) im Hohlraum (22) aufgenommen ist, um zwischen dem Stein (1) und den Wänden (26, 14) des Hohlraums (22) den peripheren freien Raum (12) zu bilden.
- Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass die Abmessungen des Hohlraums (22) und des Durchgangslochs (18) so gewählt sind, dass der Stumpf (6) des Steins (1) fast vollständig im Durchgangsloch (18) aufgenommen wird, damit sich der an die Rundiste (5) angrenzende Bereich (6a) des Stumpfs (6) nur unmittelbar unterhalb der Rundiste (5) erstreckt und sich der an die Rundiste (5) angrenzende Bereich (4a) der Krone (4) nur unmittelbar oberhalb der Rundiste (5) erstreckt, um zwischen dem Stein (1) und den Wänden (26, 14) des Hohlraums (22), im Wesentlichen auf der Höhe der Rundiste (5) und der an die Rundiste (5) angrenzenden Bereiche (4a, 6a) der Krone (4) und des Stumpfs (6) den peripheren freien Raum (12) zu bilden.
- Verfahren nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass die Aufnahme (10) eine solche Höhe aufweist, dass die Tafel (3) des Steins (1) die Aufnahme (10) überragt.
- Verfahren nach Anspruch 3, dadurch gekennzeichnet, dass es zwischen den Schritten a) und b) einen Schritt f) zur Korrektur der Ausrichtung des Steins (1) umfasst.
- Verfahren nach Anspruch 4, dadurch gekennzeichnet, dass Schritt f) das In-Kontakt-Bringen der Tafel (3) des Steins (1) mit einer Vorrichtung (28) zur Neupositionierung des Steins (1) in seiner Aufnahme (10) umfasst
- Verfahren nach Anspruch 4 oder 5, dadurch gekennzeichnet, dass es zwischen den Schritten f) und b), einen Schritt g) zum Befestigen des Stumpfs (6) des Steins (1) im Durchgangsloch (18) umfasst.
- Verfahren nach den Ansprüchen 5 und 6, dadurch gekennzeichnet, dass auf Schritt g) ein Schritt h) zum Entfernen der Neupositionierungsvorrichtung (28) folgt.
- Verfahren nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass die in Schritt b) aufgebrachte Metallschicht (36) aus einem Material hergestellt ist, das aus der Gruppe ausgewählt ist, die Nickel, Gold, Silber, Platin, Rhodium, Palladium, Kupfer und ihre Legierungen umfasst.
- Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass Schritt e) die Verwendung eines negativen lichtempfindlichen Harzes (20), die UV-Bestrahlung der lichtempfindlichen Harzschicht (20) durch eine der gewünschten Kontur des Befestigungsträgers (2) entsprechende Maske und das Entfernen des nicht bestrahlten Teils der lichtempfindlichen Harzschicht (20) umfasst, um den Hohlraum (22) zu erhalten, dessen Kontur der Kontur des Befestigungsträgers (2) entspricht.
- Verfahren nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass das Substrat (8) auf einem Material basiert, dass aus der Gruppe ausgewählt ist, die Silicium, Keramik, Glas und ein Quarz umfasst.
- Verfahren zum Fassen eines Steins (1) auf einem Uhren- oder Schmuckelement, umfassend das Einsetzen des Steins (1) und seines entsprechend dem Einsetzverfahren nach den Ansprüchen 1 bis 10 erhaltenen Befestigungsträgers (2) an einem auf dem Uhren- oder Schmuckelement befestigten Futter (38).
- Uhren- oder Schmuckelement, umfassend mindestens einen Stein (1), der an seinem entsprechend dem Einsetzverfahren nach den Ansprüchen 1 bis 10 erhaltenen Befestigungsträger (2) eingesetzt ist.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP17200360.0A EP3479720B1 (de) | 2017-11-07 | 2017-11-07 | Verfahren zum fassen eines steins |
US16/140,852 US10743625B2 (en) | 2017-11-07 | 2018-09-25 | Method for crimping a stone |
JP2018189738A JP6703582B2 (ja) | 2017-11-07 | 2018-10-05 | 石をクリンプする方法 |
CN201811255717.5A CN109744668B (zh) | 2017-11-07 | 2018-10-26 | 用于压接宝石的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP17200360.0A EP3479720B1 (de) | 2017-11-07 | 2017-11-07 | Verfahren zum fassen eines steins |
Publications (2)
Publication Number | Publication Date |
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EP3479720A1 EP3479720A1 (de) | 2019-05-08 |
EP3479720B1 true EP3479720B1 (de) | 2020-03-25 |
Family
ID=60269703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP17200360.0A Active EP3479720B1 (de) | 2017-11-07 | 2017-11-07 | Verfahren zum fassen eines steins |
Country Status (4)
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US (1) | US10743625B2 (de) |
EP (1) | EP3479720B1 (de) |
JP (1) | JP6703582B2 (de) |
CN (1) | CN109744668B (de) |
Families Citing this family (6)
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EP3569091A1 (de) * | 2018-05-18 | 2019-11-20 | D. Swarovski KG | Verfahren zur herstellung eines dekorativen artikels, wie eines schmuckstückes |
EP3771359B1 (de) * | 2019-07-29 | 2023-05-10 | The Swatch Group Research and Development Ltd | Verfahren zum fassen eines steins |
CN111427252A (zh) * | 2020-03-26 | 2020-07-17 | 深圳市帕玛精品制造有限公司 | 手表装饰物的镶嵌方法 |
EP3954247B1 (de) * | 2020-08-11 | 2023-05-24 | Omega SA | Mit steinen verzierte schwarze komponente und ihr herstellungsverfahren |
CN113679154B (zh) * | 2021-08-24 | 2023-01-06 | 柳州市旭平首饰有限公司 | 一种宝石的镶嵌工艺 |
WO2023035287A1 (zh) * | 2021-09-13 | 2023-03-16 | 吕反修 | 一种金刚石膜涂层饰品以及制备金刚石膜涂层的方法 |
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JPH0431100A (ja) * | 1990-05-29 | 1992-02-03 | Seiko Epson Corp | 装飾部材の製造方法 |
JPH081297U (ja) * | 1992-03-31 | 1996-08-20 | 健治 宮川 | 電気鋳造で作られた装身具及び装飾品へ宝石を留める方法 |
JPH06240487A (ja) * | 1993-01-14 | 1994-08-30 | Yamada:Kk | 電鋳による装飾品の製造法 |
EP0620987A1 (de) * | 1993-04-22 | 1994-10-26 | Firma Franz Breuning | Schmucksteinbefestigung |
FR2754152B1 (fr) * | 1996-10-09 | 1998-12-24 | Pgcm Conception | Procede d'enchassement de pierres dans la surface d'un bijou realise par electroformage et bijou ainsi obtenu |
AT2273U1 (de) * | 1997-07-18 | 1998-08-25 | Swarovski & Co | Hohlschmuck |
DE19840116A1 (de) * | 1998-09-03 | 1999-03-25 | Gabriele Weinmann | Dekorierte Perle mit integriertem Schmuckelement |
JP2003248068A (ja) * | 2002-02-25 | 2003-09-05 | Seiko Epson Corp | 装飾品の製造方法、装飾材取付用工具、装飾材取付固定部構造、装飾品及び時計 |
US6668584B1 (en) * | 2002-05-07 | 2003-12-30 | Giuliano Tosti | Housing for setting a stone in jewelry |
JP2005290428A (ja) * | 2004-03-31 | 2005-10-20 | Seiko Instruments Inc | 装飾溝を含む電鋳部品の製造方法 |
US7140199B2 (en) * | 2004-04-06 | 2006-11-28 | Suberi Brothers | Mounting system for cut stones |
WO2006129303A2 (en) * | 2005-06-01 | 2006-12-07 | Camellia Diamonds Ltd. | Encrusted diamond |
AT8573U1 (de) * | 2005-07-22 | 2006-10-15 | Swarovski & Co | Verfahren zum aufkleben von schmucksteinen |
ES2317419T3 (es) * | 2006-02-28 | 2009-04-16 | Blancpain S.A. | Procedimiento de engarce de piedras en un elemento soporte. |
DE06405114T1 (de) * | 2006-03-15 | 2008-04-24 | Doniar S.A. | LIGA Verfahren zur Herstellung einer einzel- oder mehrlagigen metallischen Struktur und damit hergestellte Struktur |
US20080066310A1 (en) * | 2006-09-05 | 2008-03-20 | Siu Chung Pang | Setting stones in the surface of electroformed piece |
US8215126B2 (en) * | 2007-03-01 | 2012-07-10 | Rany Mattar | Setting for gemstones, particularly diamonds |
AT507129B1 (de) * | 2008-07-23 | 2010-08-15 | Swarovski & Co | Verfahren zur herstellung einer schmucksteinanordnung |
WO2011064092A1 (fr) * | 2009-11-25 | 2011-06-03 | Dress Your Body Ag | Pièce de décoration serti invisible |
US8789251B2 (en) * | 2010-09-16 | 2014-07-29 | Edward D. Labow | Method and apparatus for embedding ornamental objects into sheet material |
US9084457B2 (en) * | 2011-06-03 | 2015-07-21 | Krush To Pleve Llc | Multiple piece jewelry piece and method of manufacture |
US20120304890A1 (en) * | 2011-06-03 | 2012-12-06 | Ron Rizzo | Slurry for jewelry pieces |
EP2884865B1 (de) * | 2012-08-20 | 2017-12-27 | Forever Mount, LLC | Lötverbindung zur befestigung von edelsteinen |
CN105077867B (zh) * | 2012-12-21 | 2018-01-09 | 奥米加股份有限公司 | 通过镶嵌形成的装饰件 |
CH707581B1 (fr) * | 2013-02-08 | 2020-01-15 | Les Ateliers Horlogers Dior Sa | Pièce pour l'horlogerie et procédé de fabrication d'une telle pièce. |
US9462859B2 (en) * | 2013-09-16 | 2016-10-11 | John William Disinger | Light emitting jewelry |
EP3090645B1 (de) * | 2015-05-04 | 2020-01-22 | The Swatch Group Research and Development Ltd. | Montageverfahren eines schmuckelements auf einer halterung, und entsprechende halterung |
DE102016222905B4 (de) * | 2016-11-21 | 2019-03-07 | Realization Desal Ag | Uhrglas und Verfahren zum Herstellen eines Uhrglases |
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- 2018-09-25 US US16/140,852 patent/US10743625B2/en active Active
- 2018-10-05 JP JP2018189738A patent/JP6703582B2/ja active Active
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JP6703582B2 (ja) | 2020-06-03 |
CN109744668B (zh) | 2020-11-06 |
EP3479720A1 (de) | 2019-05-08 |
US20190133270A1 (en) | 2019-05-09 |
US10743625B2 (en) | 2020-08-18 |
CN109744668A (zh) | 2019-05-14 |
JP2019084344A (ja) | 2019-06-06 |
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