EP3455861A2 - Composant céramique multi couches et sa méthode de production - Google Patents

Composant céramique multi couches et sa méthode de production

Info

Publication number
EP3455861A2
EP3455861A2 EP17725880.3A EP17725880A EP3455861A2 EP 3455861 A2 EP3455861 A2 EP 3455861A2 EP 17725880 A EP17725880 A EP 17725880A EP 3455861 A2 EP3455861 A2 EP 3455861A2
Authority
EP
European Patent Office
Prior art keywords
ceramic
functional
substrate
multilayer component
green
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP17725880.3A
Other languages
German (de)
English (en)
Inventor
Thomas Feichtinger
Bernhard Döllgast
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
TDK Electronics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Electronics AG filed Critical TDK Electronics AG
Publication of EP3455861A2 publication Critical patent/EP3455861A2/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/20—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by pyrolytic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed as one or more layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed as one or more layers or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/102—Varistor boundary, e.g. surface layers

Definitions

  • the present invention relates to a ceramic multilayer coating component.
  • the invention further relates to a procedural ⁇ ren for producing a ceramic multilayer component.
  • a procedural ⁇ ren for producing a ceramic multilayer component for the integration of functionalities in multilayer components, for example, the integration of a completely closed electronic ceramics or functional ceramics into an inert organic material is known.
  • the structure of a support of a functional ceramic itself, such as a varistor ceramic known.
  • additional surface layers for example of glass or polymer, required to protect the functional ceramic from external influences.
  • a multilayer component has an inert ceramic Sub ⁇ strate.
  • inert is in this context understood to that one surface of the ceramic substrate has a ho ⁇ hen insulation resistance.
  • the high insulation resistance ⁇ stand protects the surface of the substrate against external ⁇ A flows of high insulation resistance makes the surface. for example, insensitive to electrochemical processes, such as the deposition of metallic layers on the surface.
  • the high insulation resistance makes the Oberflä ⁇ surface of the substrate further resistant to aggressive medi- s, eg aggressive fluxing agents which are used for example in soldering ⁇ processes.
  • the multilayer element has at least onegnacske ⁇ Ramik.
  • the multilayer component can also have more than one functional ceramic.
  • the on Much ⁇ layer component-two, three, five, ten or more functional ⁇ ceramics The functional ceramic serves to provide specific functionalities of the multilayer component.
  • the functional ceramic serves to integrate the specific functions into the substrate. Various functional ceramics can thereby Different or identical functionali ⁇ activities provide.
  • the ceramic substrate serves as a carrier for the functional ceramics.
  • the functional ceramic is completely enclosed by the ceramic substrate.
  • the functional ceramic is surrounded on all sides by the inert, dielectric ceramic material of the substrate.
  • the functional ceramic has specific properties, beispiels-, to a defined shape and size, to integrate thejanske ⁇ Ramik in the ceramic substrate.
  • the functional ceramic is granular, spherical, disc-shaped, elliptical or cubical.
  • the functional ceramic has a diameter of less than or equal to 100 ym, for example 50 ym.
  • the ceramic substrate has specific properties to integrate the functional ceramic into the substrate. So a recess is provided in an inner region of the substrate, into which the functional ceramic is introduced during the production of the multilayer component. Thejanske ⁇ ramik is completely arranged in the interior of the substrate.
  • the ceramic substrate comprises a LTCC (low temperature cofired ceramics) ceramic.
  • LTCC low temperature cofired ceramics
  • the LTCC technology makes it possible to realize ceramic Mehr Anlagenbauelemen ⁇ te with multiple metallization layers in which a plurality of passive components such as printed conductors, resistors, capacitors and inductors can be integrated.
  • the LTCC ceramic preferably has a low dielectric constant. Thus, undesirable Parasi ⁇ mentary electrical effects such as parasitic capacitances of the sub ⁇ strats are suppressed.
  • the multilayer component has a multiplicity of functional ceramics.
  • the functional ceramics have different properties.
  • the functional ceramics for example, have different Ausdeh ⁇ expansion coefficient and / or different sintering tempera ⁇ tures.
  • the at least one functional ceramic on a HTCC ceramic is well above 1000 ° C, for example at 1500 ° C.
  • the grain structure of the HTCC ceramic is not affected by the processing (baking) of the LTCC ceramic of the substrate at temperatures well below 1000 ° C. The functionality of the functional ceramic in the substrate thus remains even after baking the LTCC ceramic.
  • the functional ceramic comprises a varistor, a negative temperature coefficient (NTC) ceramic, a PTC (positive temperature coefficient) ceramic or a ferrite.
  • NTC negative temperature coefficient
  • PTC positive temperature coefficient
  • the functional ceramic is designed as an ESD protection element.
  • various functionalities of the multilayer component can be provided by the functional ceramic.
  • a method for producing a multilayer component is described. ⁇ go through the Ver described above multilayer ⁇ component-is preferably produced. All of the features described in co ⁇ hang with the multilayer component, and look for the method application and vice versa.
  • a first step preferably at least onegnacskera ⁇ mik, several functional ceramics prepared.
  • functional ceramics can be produced with different functionalities.
  • the respective functional ceramic is a ceramic spray granules, a ceramic powder and / or ceramic greensheets.
  • the Sprühgra ⁇ granulate, ceramic powder and / or the green sheets are screened, pressed and sintered.
  • the functional ceramic is in this manufacturing process at temperatures greater than or equal to 1000 ° C, for example 1300 ° C or 1500 ° C, gesin ⁇ tert.
  • the functional ceramic can be given a wide variety of geometric shapes.
  • the functional ceramic may comprise a sintered grain, a sintered ball, a sintered chip or a sintered cube.
  • LTCC green films are provided, which have at least one recess.
  • the green ⁇ layers are stacked on top of each other.
  • the recess is provided by stamping or lasering the green sheets and completely penetrates the green sheets provided.
  • electrode structures are provided on at least part of the green sheets, for example printed.
  • the electrode structures have ⁇ example, silver and / or palladium.
  • the application of the electrode structures is preferably carried out before the provided green sheets are stacked.
  • the recess is equipped with the functional ceramic and the functional ceramic is accurately shaken into the recess.
  • ceramic cover foils are in
  • Green state provided. These are placed on the top and bottom of the stack of green sheets.
  • the cover sheets are free of the recess, so that the func- Onskeramik surrounded on all sides by ceramic material.
  • the green sheets and the cover sheets are laminated to a green pile and pressed.
  • the recesses completely penetrate the green pile.
  • the recesses are arranged in ⁇ a region of the green stack which is spatially separated from the region in which the functional ceramic is disposed.
  • the green stack is sintered.
  • the green stack is sintered at a temperature which is at ⁇ play, 150 ° C below the sintering temperature of the function ⁇ onskeramik.
  • Green pile influenced.
  • the LTCC Kera ⁇ mik with defined sintering shrinkage in the z direction and low shrinkage in the x and y-direction, there is a crack-free ⁇ em enclosing the functional ceramic by the ceramic substrate.
  • the ceramic material of the substrate can fit precisely on the functional ceramic.
  • a gap may also remain between the functional ceramic and the material of the ceramic substrate.
  • external contacts are provided on outer surfaces of the sintered green stack. For example, a silver paste is applied to the front side of the sintered green sheet and then baked.
  • the thus created multilayer element comprises Wenig ⁇ least one fully in the ceramic substrate, inte ⁇ te functional ceramics.
  • the multilayer component can be exposed to harsh ambient conditions ( high temperatures, aggressive media) without the functional ceramic being damaged.
  • the multilayer device may further used in applications ⁇ the in which the reduction of unwanted parasitic electrical effects (for example, the parasitic capacitance) of the substrate plays a role.
  • a langle ⁇ biges and adaptive multilayer component is provided.
  • FIG. 1 shows a schematic representation of a multilayer component
  • FIG. 2 shows a sectional view of a multilayer component according to a first exemplary embodiment
  • FIG. 3 is a sectional view of a multilayer component according to a second exemplary embodiment
  • FIG. 4 shows a horizontal sectional view of the multilayer component according to FIG. 3,
  • FIG. 5 shows a horizontal sectional view of the multilayer component according to FIG. 3 according to a further exemplary embodiment
  • FIG. 6 is a sectional view of a multilayer component according to a third exemplary embodiment
  • FIG. 7 is a sectional view of a multilayer component according to a fourth exemplary embodiment, FIG.
  • FIG. 8a shows a step in the manufacture of a multilayer component, according to the invention
  • Figure 8b a further process step in the development of a herstel ⁇ Learnbauele- ments according to the invention
  • FIG. 8c shows a further method step in the production of a multilayer component according to the invention
  • Figure 8d a further process step in the development of a herstel ⁇ Dahlbauele- ments according to the invention.
  • FIG. 1 shows a schematic representation of a multilayer component 100.
  • the multilayer component 100 has a substrate 1.
  • the substrate 1 preferably comprises an inert dielectric ceramic carrier.
  • inert is meant in this context that a surface of the substrate 1 has a high insulation resistance.
  • the high insulation resistance makes the surface of the sub ⁇ strats 1 insensitive to electrochemical processes such as the deposition of metallic layers, such as layers comprising Ni, Z, Ag or Ad, on the surface of the substrate 1.
  • the high insulation resistance makes the surface of the substrate 1 also insensitive aggres ⁇ sive media, such as aggressive fluxing agents which are used for example for soldering processes. This ag ⁇ sive media, the surface attack and lead to unwanted side effects, such as short circuits and leakage currents.
  • the substrate 1 is preferably a multilayer ceramic.
  • the substrate 1 preferably comprises an LTCC ceramic.
  • ⁇ DERS particular preferable for the substrate 1 to a glass-ceramic.
  • the multilayer component 100 furthermore has a multiplicity of functional ceramics 2, for example two, three, five or 10 functional ceramics 2.
  • the functional ceramics 2 are arranged within the substrate 1.
  • the functional ceramics 2 are completely enclosed by the substrate 1.
  • the Funkti ⁇ onskeramiken 2 are spatially separated from each other and electrically isolated.
  • the respective functional ceramic 2 preferably has a HTCC ceramic.
  • the respective functional ceramic 2 may comprise ZnO-Pr (varistor), MnNiX (NTC ceramic), BaTi0 3 (PTC ceramic) or a ferrite, depending on the desired function and mode of action of the respective functional ceramic 2
  • a plurality of functional ceramics 2 may also have the same composition.
  • each functional ceramic 2 may also be designed differently for realizing various desired functions within the substrate 1.
  • the func ⁇ onskeramiken 2 are protected from external influences. Additional surface protective layers for the functional ceramics, such as, for example, glass or polymer layers, are therefore superfluous.
  • FIG. 2 shows a sectional illustration of a multilayer component 100 according to a first exemplary embodiment.
  • FIG. 2 shows a multilayer component 100 with ceramic substrate 1 and an integrated wafer varistor as functional ceramic 2.
  • the functional ceramic 2 preferably has a plastic-molded varistor such as, for example, an SMD CU varistor or a ThermoFuse varistor.
  • the functional ceramic 2 is disc-shaped.
  • the functional ceramic 2 preferably has a metal disc.
  • the functional ceramic is a disc varistor.
  • the substrate 1 has internal electrodes 4.
  • the inner electric ⁇ 4 are arranged between (not explicitly shown) ceramic layers of the substrate. 1
  • the mecanicelektro- to 4 are used for electrically contacting the functional ceramics 2.
  • the functional ceramics 2 is arranged in a (not explicitly shown) recess 6 in the interior of the sub ⁇ strats. 1
  • the inner electrodes 4 extend to the Edge of this recess 6 to the functional ceramic 2
  • the functional ceramic 2 has external contacts 3.
  • the outer contacts 3 are formed on outer surfaces, here the upper and lower side of the functional ceramic 2. For example, it han ⁇ punched at the outer contacts 3 to metal layers at the top and bottom of the functional ceramic 2.
  • the internal electrodes 4 are connected electrically conducting tend to the external contacts. 3
  • outer electrodes 5 are further arranged for electrical contacting of the multilayer component 100.
  • the outer electrodes 5 are electrically connected in alternation with internal electrodes 4 of different polarity.
  • the multilayer component 100 shown in FIG. 2 is designed for high-temperature applications at 150 ° C.
  • the inert surface of the substrate 1 serves to protect the integrated disc varistor, which is specified for maximum operating temperatures up to 85 ° C., from the high temperatures.
  • FIG. 3 shows a sectional view of a multilayer ⁇ device 100 according to a second embodiment.
  • the clamping voltage occurs in an ESD event along with a certain surge current to the device. ever higher than the clamping voltage occurring at the varistor with the same current, the greater the electrical power and thus ultimately the energy that the varistor must absorb. For smaller clamping voltages thus a higher current carrying capacity is achieved in order to achieve the same energy consumption.
  • the multilayer component 100 has the substrate 1 described above.
  • the functional ceramic 2 is arranged or embedded in a recess 6 within the substrate 1.
  • the recess 6 allows the introduction of the functional ceramic 2 in the substrate 1 during the manufacturing process. In ⁇ play, the recess 6 to a sintered Via or a sintered via individual layers of the substrate. 1
  • the recess 6 is characterized in particular by the fact that it does not completely penetrate the substrate 1.
  • the embedded in the recess 6 functional ceramic 2 from all sides, that is completely, surrounded by the material of the substrate 1.
  • the recess 6 and / or the functional ceramic 2 may be formed so that the functional ceramic 2 is so enclosed by the substrate 1 that no gap between the material of the substrate 1 and the functional ceramic 2 remains (see Figure 2).
  • the recess 6 but may also be formed so that a gap between the radio ⁇ tion ceramics 2 and the material of the substrate 1 remains (see Figure 3), the recess 6 thus even after completion development of the multilayer component 100 is discernible. This may particularly be required if the material of functional ceramics 2 and the substrate 1 has different Ausdeh ⁇ expansion coefficient to cracks or damage to the Multilayer component 100 in the further processing, in ⁇ example, when soldering to avoid.
  • the functional ceramic 2 is formed in the form of a ball in this embodiment.
  • the functional ceramics have preferably 2 ⁇ as a Varistorkugel.
  • the functional ceramic 2 has, for example, ZnO-PrCo.
  • the functional ceramic ⁇ 2 is a sintered ZnO PrCo grain.
  • the functional ceramic 2 has a low capacity.
  • the capacity of the functional ceramic is 0.5 pF or less, for example, 0.47 pF.
  • the functional ceramic 2 has a
  • the substrate 1 has a very low Dielektrizi ⁇ tuschskonstante epsilon.
  • the dielectric constant of the substrate is less than 50, preferably less than 10.
  • the low the ⁇ lektrizticianskonstante the surrounding substrate 1 serves the parasitic capacitance of the substrate 1 to suppress.
  • the substrate 1 also has the internal electrodes 4 already mentioned in connection with FIG.
  • the outer electrodes 5 are finally arranged for electrical contacting of the multilayer component 100.
  • the inner electrodes 4 are used for electrical contacting of the functional ceramic 2 and extend to the edge of the recess 6, to contact the functional ceramic 2 electrically.
  • the respective inner electrode 4 can be shaped differently (see FIGS. 4 and 5).
  • the jeweili ⁇ ge internal electrode 4 may be in the region of the feed to the function ⁇ onskeramik have a constriction 4b ( Figure 5). This is particularly advantageous when the functional ceramic 2 is spherical.
  • the respective inner electrode 4 can be targeted through the constriction 4b and ge ⁇ precisely be electrically connected with the functional ceramic. 2
  • the respective inner electrode 4 may have a web 4a or web-shaped connection region for electrically contacting the functional ceramic 2 (FIG. 4).
  • the functional ceramic ⁇ 2 has a larger horizontal extent, so formed as elliptical game at ⁇ .
  • the internal electrode 4 for connecting the functional ceramics 2 are also conceivable in ⁇ particular embodiments.
  • FIG. 6 shows a sectional view of a multilayer component 100 according to a third exemplary embodiment.
  • a multi-layer device 100 in an overall LED Stalt carrier with integrated ESD protection Darge ⁇ represents.
  • the multilayer component 100 has a heat source 10, in ⁇ example, an LED on.
  • the heat source 10 is about Kon ⁇ clock surfaces 9 on the underside of the heat source 10, wherein ⁇ play an electrically conducting metallic layer, electrically connected to the outer contacts 5 of the substrate 1.
  • the per ⁇ stays awhile external contact 5 is arranged at the top of the substrate 1 and connected via a soldered connection 8 with the respective contact surface.
  • the substrate 1 has vias or plated-through holes 7.
  • the respective through-hole 7 completely penetrates the substrate 1 in the vertical direction.
  • the respective through-connection 7 is electrically conductively connected to one outer contact 5 in each case.
  • On the underside of the substrate 1 further outer electrodes 5 are arranged, which are electrically connected to the respective through-connection 7.
  • the internal electrodes 4 in this exemplary embodiment do not extend as far as the side surfaces of the substrate 1, but are connected in an electrically conductive manner to the plated-through holes 7.
  • the substrate 1 can also have a thermal contact 11, for example for a temperature sensor.
  • the heat contact 11 can, for example, a metal filled Via aufwei ⁇ sen.
  • the functional ceramics 2 is for example spherical excluded forms, sintered, and introduced into the recess 6 within the sub ⁇ strats 1, so that the functional ceramic 2 of al ⁇ len pages provide completely around ⁇ through the material of the substrate. 1
  • the functional ceramic 2 serves in this embodiment as an ESD protection structure.
  • the functional ceramic 2 is a varistor chip.
  • the heat source 10, which is very sensitive to ⁇ voltages as they can for example be triggered by an ESD pulse, is using the functional Onskeramik 2 effectively protected against these surges or surges.
  • FIG. 7 shows a sectional view of a multilayer component 100 according to a fourth exemplary embodiment.
  • ⁇ into special 100 is shown in Ge ⁇ Stalt a LED support with integrated ESD protection and temperature sensor in Figure 7, a multi-layer component.
  • multilayer component 100 ⁇ be enrolled.
  • a second functional ceramic 2 is embedded in the substrate 1. The two functional ceramics 2 are spatially separated from each other and each completely surrounded by the Materi ⁇ al of the substrate 1.
  • a first functional ceramic 2 which is shown in FIG. 7 in the lower region of the substrate 1, serves as an ESD structure and protects the heat source 10, for example an LED, against overvoltages.
  • the first functional ceramic 2 is designed as a varistor chip.
  • a second functional ceramic 2 which is shown in FIG. 7 in the upper region of the substrate 1, is designed as a thermistor (NTC thermistor).
  • the second functional ceramic 2 is an NTC temperature sensor.
  • the substrate 1 has a thermal contact 11.
  • the thermal contact 11 is lei ⁇ tend connected to the second functional ceramic 2.
  • the heat contact 11 is in the form of a via, for example
  • the via extends from the top of the substrate 1 to the second function ⁇ ceramic. 2
  • the functional ceramics 2 in the inert dielectric ceramic base may function ceramics 2 properties with completely different egg, such as sintering temperature, and expansion coefficient, together integrated into the substrate 1 ⁇ the. This makes it possible to realize extremely adaptive and flexible multilayer components 100.
  • a method for producing a multilayer component 100 will be described in connection with FIGS. 8a to 8d. All features which have been explained for the multilayer components 100 in connection with FIGS. 1 to 7 are also applicable to the method and vice versa.
  • At least one functional ceramic 2 is produced.
  • a plurality of different functional ceramics 2 are produced, depending on the specific requirements for the multilayer component 100.
  • their production can be very different. All functional ceramics 2 have in common that they are sintered prior to introduction into the substrate 1.
  • 2 ceramic powder is provided for the production of functional ceramics and doped with dopants, such as ZnO. Subsequently, the powder is sintered ge ⁇ . This takes place at temperatures of greater than or equal to 1000 ° C and less than or equal to 1300 ° C, for example at
  • aontskera ⁇ mik 2 results in the form of a sintered grain, which is for example as SMD varistor application.
  • a varistor chip is to be formed as a functional ceramic 2
  • granules of sintered grains are provided, screened and pressed, as described above.
  • the pressed pellets are then sintered (1000 ° CT ⁇ 1300 ° C) and processed into a junnförmi ⁇ gen Varistorchip.
  • the Varis ⁇ torchip is metallized by sputtering or screen printing.
  • LTCC green sheets are provided to form the substrate 1.
  • the green sheets contain, for example, a ceramic powder, a binder and a glass component.
  • the green sheets 15 are stacked on top of each other to form a stack.
  • By laser ablation, or punching is Wenig ⁇ least introduced into the green sheets 15 a recess. 6
  • the recess serves to introduce the functional ceramic 2 into the green stack 16 in a later method step.
  • the number of recesses 6 which are incorporated into the green sheets 15, thereby corresponding to the number of function ⁇ onskeramiken 2 in the finished multilayer component 100th
  • metal structures for forming the internal electrodes 4 are provided, for example, printed on at least a portion of the green sheets.
  • the application of the metal structures is preferably carried out before the provided green sheets 15 are stacked together.
  • the metal structures include, for example, Ag, Cu, Pd, or a combination thereof.
  • the metal structures can be shaped specifically in particular in a connection region for connecting the functional ceramic 2, as has been described in connection with FIGS. 4 and 5.
  • the at least one functional ceramic 2 is introduced into the recess 6 (FIG. 8 a).
  • the off ⁇ savings 6 is equipped with the functional ceramic 2 and this is then shaken.
  • ceramic cover films 13 are provided in the green state (FIG. 8 a). These are arranged on the top and the bottom of the stack of green sheets 15. The cover films 13 are free of the recess 6, so that the functional ceramic 2 is now surrounded on all sides by ceramic material. This is followed by lamination and pressing of the green sheets 13, 15 into a green stack 16 (FIG. 8b). By punching or laser processes further recesses for producing the vias 7 in the green sheets 13, 15 are introduced. These recesses completely penetrate the green stack 16 from the green sheets 15 and the cover sheets 13. To produce the respective plated-through hole 7, the recess is filled after a sintering step with a bonding material, for example by depositing egg ⁇ nes metal from a solution. Preferably, the Ausspa ⁇ tion is filled completely.
  • the metal contains or is, for example, copper, silver and / or palladium.
  • the green stack 16 is sintered (FIG. 8c).
  • the green stack 16 is ge ⁇ sintered at a temperature which is below the sintering temperature of the ceramic functional ⁇ . 2
  • the sintering temperature of the green stack is 150 ° C below the sintering temperature for the
  • the sintering temperature is between 750 ° C and 900 ° C, with the limits included.
  • the sintering of the green stack 16 occurs at 800 ° C or 850 ° C.
  • the sintering causes the green films 13, 15 to fade.
  • the suitable selection of the LTCC ceramic with defined shrinkage in the z-direction and low shrinkage in the x and y directions enables crack-free enclosing of the functional ceramic 2.
  • the external contacts 5 are provided on outer surfaces of the sintered green stack 16.
  • a silver paste 14 is disposed on at least a portion of the outer surfaces ( Figure 8d) and then baked.
  • Figure 8d The description of the objects given here is not limited to the individual specific embodiments. Rather, the features of the individual embodiments - as far as technically reasonable - can be combined with each other.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Led Device Packages (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

L'invention concerne un composant multicouches (100) présentant un substrat céramique (1) inerte et au moins une céramique fonctionnelle (2), cette dernière (2) étant entièrement entourée par le substrat céramique (1). L'invention concerne également un procédé de fabrication d'un composant multicouches (100).
EP17725880.3A 2016-05-10 2017-05-05 Composant céramique multi couches et sa méthode de production Pending EP3455861A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016108604.5A DE102016108604A1 (de) 2016-05-10 2016-05-10 Vielschichtbauelement und Verfahren zur Herstellung eines Vielschichtbauelements
PCT/EP2017/060783 WO2017194408A2 (fr) 2016-05-10 2017-05-05 Composant multicouches et procédé de fabrication d'un composant multicouches

Publications (1)

Publication Number Publication Date
EP3455861A2 true EP3455861A2 (fr) 2019-03-20

Family

ID=58772847

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17725880.3A Pending EP3455861A2 (fr) 2016-05-10 2017-05-05 Composant céramique multi couches et sa méthode de production

Country Status (7)

Country Link
US (1) US20190287702A1 (fr)
EP (1) EP3455861A2 (fr)
JP (1) JP2019523545A (fr)
CN (1) CN109416963A (fr)
DE (1) DE102016108604A1 (fr)
TW (1) TW201808625A (fr)
WO (1) WO2017194408A2 (fr)

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JP2019523545A (ja) 2019-08-22
TW201808625A (zh) 2018-03-16
DE102016108604A1 (de) 2017-11-16
US20190287702A1 (en) 2019-09-19
WO2017194408A3 (fr) 2018-01-18
CN109416963A (zh) 2019-03-01

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