EP3438299A1 - Alliage de cuivre pour matériel électronique et électrique, bande de tôle en alliage de cuivre pour matériel électronique et électrique, composant pour matériel électronique et électrique, borne, barre omnibus et pièce mobile pour des relais - Google Patents

Alliage de cuivre pour matériel électronique et électrique, bande de tôle en alliage de cuivre pour matériel électronique et électrique, composant pour matériel électronique et électrique, borne, barre omnibus et pièce mobile pour des relais Download PDF

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Publication number
EP3438299A1
EP3438299A1 EP17775267.2A EP17775267A EP3438299A1 EP 3438299 A1 EP3438299 A1 EP 3438299A1 EP 17775267 A EP17775267 A EP 17775267A EP 3438299 A1 EP3438299 A1 EP 3438299A1
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EP
European Patent Office
Prior art keywords
electronic
electrical equipment
copper alloy
mass
content
Prior art date
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Granted
Application number
EP17775267.2A
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German (de)
English (en)
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EP3438299B1 (fr
EP3438299A4 (fr
Inventor
Hirotaka Matsunaga
Kazunari Maki
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Priority claimed from PCT/JP2017/012993 external-priority patent/WO2017170733A1/fr
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Publication of EP3438299A4 publication Critical patent/EP3438299A4/fr
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/46—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for sheet metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/14—Terminal arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/54—Contact arrangements
    • H01H50/56—Contact spring sets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members

Definitions

  • the invention of the present application relates to a copper alloy for electronic and electrical equipment suitable for a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar, and a copper alloy plate strip for electronic and electrical equipment, a component for electronic and electrical equipment, a terminal, a busbar, and a movable piece for a relay formed of the copper alloy for electronic and electrical equipment.
  • a terminal such as a connector or a press fit
  • a movable piece for a relay a lead frame, or a busbar
  • a copper alloy plate strip for electronic and electrical equipment
  • a component for electronic and electrical equipment a terminal, a busbar, and a movable piece for a relay formed of the copper alloy for electronic and electrical equipment.
  • a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar, copper or a copper alloy with high conductivity has been used.
  • the material constituting the component for electronic and electrical equipment is required to have high strength or excellent bending workability.
  • a terminal such as a connector used in a high-temperature environment such as an engine room of a vehicle is required to have stress relaxation resistance.
  • a Cu-Mg-based alloy is suggested in PTLs 1 and 2 as the material used for the terminal such as a connector or a press fit or the component for electronic and electrical equipment such as a movable piece for a relay, a lead frame, or a busbar.
  • the content of O or the content of S is not considered. Therefore, there is a concern that defects occur during processing due to generation of inclusions formed of Mg oxide or Mg sulfide and thus the cold workability and the bending workability are degraded. Further, since the content of H is not considered, there is a concern that defects occur during processing due to the occurrence of blow-hole defects in an ingot and thus the cold workability and the bending workability are degraded. In addition, since the content of C is not considered, there is a concern that the cold workability is degraded due to defects caused by C during casting.
  • the present invention has been made in consideration of the above-described circumstances, and an object thereof is to provide a copper alloy for electronic and electrical equipment, a copper alloy plate strip for electronic and electrical equipment, a component for electronic and electrical equipment, a terminal, a busbar, and a movable piece for a relay with excellent conductivity, cold workability, bending workability, and castability.
  • a copper alloy for electronic and electrical equipment (hereinafter, referred to as a "copper alloy for electronic and electrical equipment of the present disclosure”) is provided, including: 0.15 mass% or greater and less than 0.35 mass% of Mg; 0.0005 mass% or greater and less than 0.01 mass% of P; and a remainder which is formed of Cu and unavoidable impurities, in which a conductivity is greater than 75% IACS, a content [Mg] (mass%) of Mg and a content [P] (mass%) of P satisfy a relational expression of [Mg] + 20 ⁇ [P] ⁇ 0.5, and a content of H is 10 mass ppm or less, a content of O is 100 mass ppm or less, a content of S is 50 mass ppm or less, and a content of C is 10 mass ppm or less.
  • the content of Mg is 0.15 mass% or greater and less than 0.35 mass%. Therefore, by solid-dissolving Mg in a mother phase of copper, the strength and the stress relaxation resistance can be improved without significantly degrading the conductivity.
  • the content of P is 0.0005 mass% or greater and less than 0.01 mass%, the castability can be improved.
  • the content [Mg] of Mg and the content [P] of P satisfy a relational expression of [Mg] + 20 ⁇ [P] ⁇ 0.5 in terms of mass ratio, generation of a coarse crystallized material containing Mg and P can be suppressed and degradation of cold workability and bending workability can be suppressed.
  • the content of O is 100 mass ppm or less and the content of S is 50 mass ppm or less, inclusions formed of Mg oxide or Mg sulfide can be reduced and the occurrence of defects during processing can be suppressed. Moreover, consumption of Mg can be prevented by reacting with O and S and deterioration of mechanical characteristics can be suppressed.
  • the content of H is 10 mass ppm or less, the occurrence of blow-hole defects in an ingot can be suppressed and the occurrence of defects during processing can be suppressed.
  • the content of C is 10 mass ppm or less, the cold workability can be ensured and the occurrence of defects during processing can be suppressed.
  • the alloy can be used for applications where pure copper has been used in the related art.
  • the content [Mg] (mass%) of Mg and the content [P] (mass%) of P satisfy a relational expression of [Mg]/[P] ⁇ 400.
  • the castability can be reliably improved by specifying the ratio between the content of Mg that decreases the castability and the content of P that improves the castability, as described above.
  • a 0.2% proof stress measured at the time of a tensile test performed in a direction orthogonal to a rolling direction is 300 MPa or greater.
  • the copper alloy is not easily deformed and is particularly suitable as a copper alloy constituting a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar.
  • a residual stress ratio is 50% or greater under conditions of 150°C for 1000 hours.
  • the alloy can be applied as a material of a component for electronic equipment to be used in a high-temperature environment such as an engine room.
  • a copper alloy plate strip for electronic and electrical equipment according to another aspect of the invention of the present application (hereinafter, referred to as a "copper alloy plate strip for electronic and electrical equipment”) includes the copper alloy for electronic and electrical equipment.
  • the copper alloy plate strip for electronic and electrical equipment since the copper alloy plate strip is formed of the copper alloy for electronic and electrical equipment, the conductivity, the strength, the cold workability, the bending workability, and the stress relaxation resistance are excellent. Accordingly, the copper alloy plate strip is particularly suitable as a material of a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar.
  • the copper alloy plate strip for electronic and electrical equipment of the invention of the present application includes a plate material and a strip formed by winding the plate material in a coil shape.
  • the copper alloy plate strip for electronic and electrical equipment of the invention of the present application, it is preferable that the copper alloy plate strip includes a Sn plating layer or a Ag plating layer on a surface of the copper alloy plate strip.
  • the copper alloy plate strip since the surface of the copper alloy plate strip has a Sn plating layer or a Ag plating layer, the copper alloy plate strip is particularly suitable as a material of a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar.
  • the "Sn plating” includes pure Sn plating or Sn alloy plating
  • the "Ag plating" includes pure Ag plating or Ag alloy plating.
  • a component for electronic and electrical equipment according to another aspect of the invention of the present application includes the copper alloy plate strip for electronic and electrical equipment described above. Further, as the component for electronic and electrical equipment of the invention of the present application, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, and a busbar are exemplified.
  • the component for electronic and electrical equipment with such a configuration is produced using the copper alloy plate strip for electronic and electrical equipment described above, excellent characteristics can be exhibited even in a case of miniaturization and reduction in thickness.
  • the component includes a Sn plating layer or a Ag plating layer on a surface of the component.
  • the Sn plating layer and the Ag plating layer may be formed on the copper alloy plate strip for electronic and electrical equipment in advance or may be formed after the component for electronic and electrical equipment is formed.
  • a terminal according to another aspect of the invention of the present application includes the copper alloy plate strip for electronic and electrical equipment described above.
  • the terminal with such a configuration is produced using the copper alloy plate strip for electronic and electrical equipment described above, excellent characteristics can be exhibited even in a case of miniaturization and reduction in thickness.
  • the terminal includes a Sn plating layer or a Ag plating layer on a surface of the terminal.
  • the Sn plating layer and the Ag plating layer may be formed on the copper alloy plate strip for electronic and electrical equipment in advance or may be formed after the terminal is formed.
  • a busbar according to another aspect of the invention of the present application (hereinafter, referred to as a "busbar of the invention of the present application") includes the copper alloy plate strip for electronic and electrical equipment described above.
  • busbar with such a configuration is produced using the copper alloy plate strip for electronic and electrical equipment described above, excellent characteristics can be exhibited even in a case of miniaturization and reduction in thickness.
  • the busbar includes a Sn plating layer or a Ag plating layer on a surface of the busbar.
  • the Sn plating layer and the Ag plating layer may be formed on the copper alloy plate strip for electronic and electrical equipment in advance or may be formed after the busbar is formed.
  • a movable piece for a relay according to another aspect of the invention of the present application includes the copper alloy plate strip for electronic and electrical equipment described above.
  • the movable piece for a relay with such a configuration is produced using the copper alloy plate strip for electronic and electrical equipment described above, excellent characteristics can be exhibited even in a case of miniaturization and reduction in thickness.
  • the movable piece for a relay of the invention of the present application includes a Sn plating layer or a Ag plating layer on a surface of the movable piece. Further, the Sn plating layer and the Ag plating layer may be formed on the copper alloy plate strip for electronic and electrical equipment in advance or may be formed after the movable piece for a relay is formed.
  • a copper alloy for electronic and electrical equipment a copper alloy plate strip for electronic and electrical equipment, a component for electronic and electrical equipment, a terminal, a busbar, and a movable piece for a relay with excellent conductivity, cold workability, bending workability, and castability.
  • FIG. 1 is a flow chart showing a method of producing a copper alloy for electronic and electrical equipment according to the present embodiment.
  • the copper alloy for electronic and electrical equipment has a composition of 0.15 mass% or greater and less than 0.35 mass% of Mg; 0.0005 mass% or greater and less than 0.01 mass% of P; and the remainder formed of Cu and unavoidable impurities.
  • the conductivity is greater than 75% IACS.
  • the content [Mg] (mass%) of Mg and the content [P] (mass%) of P satisfy a relational expression of [Mg] + 20 ⁇ [P] ⁇ 0.5.
  • the content of H is 10 mass ppm or less
  • the content of O is 100 mass ppm or less
  • the content of S is 50 mass ppm or less
  • the content of C is 10 mass ppm or less.
  • the content [Mg] (mass%) of Mg and the content [P] (mass%) of P satisfy a relational expression of [Mg]/[P] ⁇ 400.
  • the 0.2% proof stress measured at the time of a tensile test performed in a direction orthogonal to a rolling direction is 300 MPa or greater.
  • a rolled material of the copper alloy for electronic and electrical equipment is used, and the 0.2% proof stress measured at the time of the tensile test performed in a direction orthogonal to the rolling direction in the final step of rolling is specified as described above.
  • the residual stress ratio is 50% or greater under conditions of 150°C for 1000 hours.
  • Mg is an element having a function of improving the strength and the stress relaxation resistance without significantly degrading the conductivity through solid solution in a mother phase of a copper alloy.
  • the content of Mg is set to be 0.15 mass% or greater and less than 0.35 mass%.
  • the lower limit of the content of Mg is set to preferably 0.16 mass% or greater and more preferably 0.17 mass% or greater. Further, in order to reliably suppress degradation of the conductivity and degradation of the castability, the upper limit of the content of Mg is set to preferably 0.30 mass% or less and more preferably 0.28 mass% or less.
  • P is an element having a function of improving the castability.
  • the content of P is set to be 0.0005 mass% or greater and less than 0.01 mass%.
  • the lower limit of the content of P is set to preferably 0.0007 mass% and more preferably 0.001 mass%.
  • the upper limit of the content of P is set to preferably less than 0.009 mass%, more preferably less than 0.008 mass%, and preferably 0.0075 mass% or less. Further, the upper limit thereof is set to even still more preferably 0.0060 mass% or less and most preferably less than 0.0050 mass%.
  • [Mg] + 20 ⁇ [P] is set to less than 0.5. Further, in order to reliably suppress coarsening and densification of the crystallized material and to suppress the occurrence of cracking during the cold working and the bend working, [Mg] + 20 ⁇ [P] is set to preferably less than 0.48 and more preferably less than 0.46. Further, [Mg] + 20 ⁇ [P] is set to still more preferably less than 0.44 and most preferably less than 0.42. Mg / P ⁇ 400
  • Mg is an element having a function of increasing the viscosity of the molten copper alloy and decreasing the castability, it is necessary to optimize the ratio between the content of Mg and the content of P in order to reliably improve the castability.
  • [Mg]/[P] is set to 400 or less. In order to further improve the castability, [Mg]/[P] is set to preferably 350 or less and more preferably 300 or less.
  • the lower limit of [Mg]/[P] is set to preferably greater than 20 and more preferably greater than 25.
  • H is an element that becomes water vapor by being connected with O during casting and allows blow-hole defects to occur in an ingot. Defects such as cracking during casting and swelling and peeling during rolling are caused by the blow-hole defects. It is known that the strength and the stress corrosion cracking characteristics deteriorate because the defects such as cracking, swelling, and peeling lead to stress concentration and cause fracture.
  • the content of H is greater than 10 mass ppm, the above-described blow-hole defects easily occur.
  • the content of H is specified to 10 mass ppm or less. Further, in order to further suppress the occurrence of the blow-hole defects, the content of H is set to preferably 4 mass ppm or less and more preferably 2 mass ppm or less.
  • the lower limit of the content of H is not particularly limited, but extreme reduction of the content of H results in an increase of production cost. Therefore, the content of H is typically 0.1 mass ppm or greater.
  • O is an element that reacts with each component element in a copper alloy to form oxides. Since these oxides serve as a starting point of fracture, the cold workability is degraded and the bending workability also deteriorates. Further, in a case where the content of O is greater than 100 mass ppm, since Mg is consumed due to the reaction between O and Mg, there is a concern that the solid solution amount of Mg in a mother phase of Cu is decreased and the mechanical characteristics deteriorate.
  • the content of O is specified to 100 mass ppm or less.
  • the content of O is particularly preferably 50 mass ppm or less and more preferably 20 mass ppm or less.
  • the lower limit of the content of O is not particularly limited, but extreme reduction of the content of O results in an increase of production cost. Therefore, the content of O is typically 0.1 mass ppm or greater.
  • S is an element that is present on a crystal grain boundary in the form of an intermetallic compound or a complex sulfide.
  • the intermetallic compound or the complex sulfide present on the grain boundary causes grain boundary cracks during hot working and working cracks. Further, since the intermetallic compound or the complex sulfide serves as a starting point of fracture, the cold workability or bend workability deteriorates. Further, since Mg is consumed due to the reaction between S and Mg, there is a concern that the solid solution amount of Mg in a mother phase of Cu is decreased and the mechanical characteristics deteriorate.
  • the content of S is specified to 50 mass ppm or less.
  • the content of S is particularly preferably 40 mass ppm or less and more preferably 30 mass ppm or less.
  • the lower limit of the content of S is not particularly limited, but extreme reduction of the content of S results in an increase of production cost. Therefore, the content of S is typically 1 mass ppm or greater.
  • C is an element that is used to coat the surface of molten metal during melting and casting for the purpose of deoxidizing the molten metal and may be unavoidably mixed. In a case where the content of C is greater than 10 mass ppm, the mixture of C during the casting is increased.
  • the element C or a complex carbide and segregation of a solid solution of C deteriorate the cold workability.
  • the content of C is specified to 10 mass ppm or less.
  • the content of C is particularly preferably 5 mass ppm or less and more preferably 1 mass ppm or less.
  • the lower limit of the content of C is not particularly limited, but extreme reduction of the content of C results in an increase of production cost. Therefore, the content of C is typically 0.1 mass ppm or greater.
  • unavoidable impurities include Ag, B, Ca, Sr, Ba, Sc, Y, rare earth elements, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Re, Fe, Ru, Os, Co, Se, Te, Rh, Ir, Ni, Pd, Pt, Au, Zn, Cd, Hg, Al, Ga, In, Ge, Sn, As, Sb, Tl, Pb, Bi, Be, N, Si, and Li. Since these unavoidable elements have a function of decreasing the conductivity, the total amount thereof is set to 0.1 mass% or less.
  • the total amount of the unavoidable elements is set to less than 500 mass ppm.
  • the content of Sn is set to less than 50 mass ppm.
  • the total amount of these elements is set to less than 500 mass ppm.
  • the alloy by setting the conductivity to greater than 75% IACS, the alloy can be satisfactorily used as a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar.
  • the conductivity is set to preferably greater than 76% IACS, more preferably greater than 77% IACS, still more preferably greater than 78% IACS, and even still more preferably greater than 80% IACS.
  • the alloy for electronic and electrical equipment by setting the 0.2% proof stress to 300 MPa or greater, the alloy becomes particularly suitable as a material of a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar. Further, in the present embodiment, the 0.2% proof stress measured at the time of the tensile test performed in a direction orthogonal to the rolling direction is set to 300 MPa or greater.
  • the 0.2% proof stress described above is set to preferably 325 MPa or greater and more preferably 350 MPa or greater.
  • the residual stress ratio is set to 50% or greater under conditions of 150°C for 1000 hours as described above.
  • the copper alloy for electronic equipment according to the present embodiment can be applied as a terminal to be used in a high-temperature environment such as the periphery of an engine room of a vehicle.
  • the residual stress ratio measured at the time of a stress relaxation test performed in a direction orthogonal to the rolling direction is set to is set to 50% or greater under conditions of 150°C for 1000 hours.
  • the residual stress ratio is set to preferably 60% or greater under conditions of 150°C for 1000 hours and more preferably 70% or greater under conditions of 150°C for 1000 hours.
  • the above-described elements are added to molten copper obtained by melting the copper raw material to adjust components, thereby producing a molten copper alloy. Further, a single element, a mother alloy, or the like can be used for addition of various elements. In addition, raw materials containing the above-described elements may be melted together with the copper raw material. Further, a recycled material or a scrap material of the present alloy may be used.
  • the molten copper so-called 4 NCu having a purity of 99.99 mass% or greater or so-called 5 NCu having a purity of 99.999 mass% or greater is preferably used.
  • raw materials with small contents of these elements are selected and used. Specifically, it is preferable to use a raw material having a H content of 0.5 mass ppm or less, an O content of 2.0 mass ppm or less, a S content of 5.0 mass ppm or less, and a C content of 1.0 mass ppm or less.
  • the holding time at the time of melting is set to the minimum by performing atmosphere melting using an inert gas atmosphere (for example, Ar gas) in which the vapor pressure of H 2 O is low.
  • an inert gas atmosphere for example, Ar gas
  • the molten copper alloy in which the components have been adjusted is injected into a mold to produce an ingot.
  • the size of the crystallized material can be set to be finer by increasing the solidification rate. Accordingly, the cooling rate of the molten metal is set to preferably 0.1°C/sec or greater, more preferably 0.5°C/sec or greater, and most preferably 1°C/sec or greater.
  • a heat treatment is performed for homogenization and solutionization of the obtained ingot.
  • Intermetallic compounds and the like containing Cu and Mg, as the main components, generated due to concentration through the segregation of Mg in the process of solidification are present in the ingot.
  • Mg is allowed to be homogeneously diffused or solid-dissolved in a mother phase in the ingot by performing the heat treatment of heating the ingot to a temperature range of 400°C to 900°C for the purpose of eliminating or reducing the segregation and the intermetallic compounds.
  • this homogenizing and solutionizing step S02 is performed in a non-oxidizing or reducing atmosphere.
  • the copper material heated to a temperature range of 400°C to 900°C is cooled to a temperature of 200°C or lower at a cooling rate of 60°C/min or greater.
  • the heating temperature is set to be in a range of 400°C to 900°C.
  • the heating temperature is set to more preferably 500°C to 850°C and still more preferably 520°C to 800°C.
  • Hot working may be performed for the purpose of increasing efficiency of roughening and homogenizing the structure.
  • the temperature condition in this hot working step S03 is not particularly limited, but is preferably set to be in a range of 400°C to 900°C. According to a cooling method after the working, it is preferable that the cooling is performed to a temperature of 200°C or lower at a cooling rate of 60°C/min or greater through water quenching or the like. Further, the working method is not particularly limited, and examples of the method which can be employed include rolling, drawing, extruding, groove rolling, forging, and pressing.
  • the temperature condition in this roughening step S04 is not particularly limited, but is set to be preferably in a range of -200°C to 200°C, which is the range for cold or warm working, and particularly preferably room temperature in order to suppress re-crystallization or improve dimensional accuracy.
  • the working ratio (rolling ratio) is preferably 20% or greater and more preferably 30% or greater.
  • the working method is not particularly limited, and examples of the method which can be employed include rolling, drawing, extruding, groove rolling, forging, and pressing.
  • a heat treatment is performed for the softening purpose after the roughening step S04.
  • a method of the heat treatment is not particularly limited, and the heat treatment is performed in a non-oxidizing atmosphere or a reducing atmosphere preferably in a holding temperature range of 400°C to 900°C for a holding time of 10 seconds to 10 hours.
  • the cooling method after the working is not particularly limited, but it is preferable that a method in which the cooling rate for water quenching or the like is set to 200°C/min or greater is used.
  • the roughening step S04 and the intermediate heat treatment step S05 may be repeatedly performed.
  • the temperature condition in this finishing step S06 is not particularly limited, but is set to be preferably in a range of -200°C to 200°C, which is the range for cold or warm working, and particularly preferably room temperature in order to suppress re-crystallization or softening.
  • the working ratio is appropriately selected such that the shape of the copper material approximates the final shape, but it is preferable that the working ratio is set to 20% or greater from the viewpoint of improving the strength through work hardening in the finishing step S06. In a case of further improving the strength, the working ratio is set to more preferably 30% or greater, still more preferably 40% or greater, and most preferably 60% or greater. Further, since the bending workability deteriorates due to an increase of the working ratio, it is preferable that the working ratio is set to 99% or less.
  • the heat treatment temperature is set to be in a range of 100°C to 800°C. Further, in this finish heat treatment step S07, it is necessary to set heat treatment conditions (the temperature, the time, and the cooling rate) for the purpose of avoiding a significant decrease of the strength due to re-crystallization. For example, it is preferable that the material is held at 300°C for 1 second to 120 seconds. This heat treatment is performed in a non-oxidizing or reducing atmosphere.
  • a method of performing the heat treatment is not particularly limited, but it is preferable that the heat treatment is performed using a continuous annealing furnace for a short period of time from the viewpoint of the effects of reducing the production cost.
  • finishing step S06 and the finish heat treatment step S07 may be repeatedly performed.
  • a copper alloy plate strip for electronic and electrical equipment (a plate material or a strip obtained by forming a plate material in a coil shape) according to the present embodiment is produced.
  • the plate thickness of the copper alloy plate strip for electronic and electrical equipment is greater than 0.05 mm and 3.0 mm or less and preferably greater than 0.1 mm and less than 3.0 mm.
  • the plate thickness of the copper alloy plate strip for electronic and electrical equipment is 0.05 mm or less, the copper alloy plate strip is not suitable for use as a conductor in high current applications.
  • the plate thickness is greater than 3.0 mm, it is difficult to carry out press punching.
  • the copper alloy plate strip for electronic and electrical equipment may be used as a component for electronic and electrical equipment as it is, but a Sn plating layer or a Ag plating layer having a film thickness of 0.1 to 100 ⁇ m may be formed on one or both plate surfaces. At this time, it is preferable that the plate thickness of the copper alloy plate strip for electronic and electrical equipment is set to 10 to 1000 times the thickness of the plating layer.
  • the copper alloy for electronic and electrical equipment (the copper alloy plate strip for electronic and electrical equipment) according to the present embodiment as a material, for example, a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar is formed by performing punching or bending on the material.
  • the content of Mg is 0.15 mass% or greater and less than 0.35 mass%. Therefore, by solid-dissolving Mg in a mother phase of copper, the strength and the stress relaxation resistance can be improved without significantly degrading the conductivity.
  • the content of P is 0.0005 mass% or greater and less than 0.01 mass%, the viscosity of the molten copper alloy can be decreased so that the castability can be improved.
  • the copper alloy for electronic and electrical equipment since the conductivity is greater than 75% IACS, the copper alloy can be used for applications requiring high conductivity.
  • the content of O is 100 mass ppm or less and the content of S is 50 mass ppm or less, inclusions formed of Mg oxide and Mg sulfide can be reduced.
  • the content of H is 10 mass ppm or less, the occurrence of blow-hole defects in an ingot can be suppressed.
  • the content of C is 10 mass ppm or less, the cold workability can be ensured.
  • the occurrence of defects at the time of working can be suppressed so that the cold workability and the bending workability can be remarkably improved.
  • the content [Mg] (mass%) of Mg and the content [P] (mass%) of P satisfy a relational expression of [Mg]/[P] ⁇ 400, the ratio between the content of Mg that degrades the castability and the content of P that improves the castability is optimized, the viscosity of the molten copper alloy can be decreased due to the effects of addition of P, and the castability can be reliably improved.
  • the copper alloy for electronic and electrical equipment since the 0.2% proof stress is 300 MPa or greater and the residual stress ratio is 50% or greater under conditions of 150°C for 1000 hours, the strength and the stress relaxation resistance are excellent. Therefore, the copper alloy is particularly suitable as a material of a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar.
  • the copper alloy plate strip for electronic and electrical equipment is formed of the copper alloy for electronic and electrical equipment described above, a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar can be produced by performing bending working or the like on this copper alloy plate strip for electronic and electrical equipment.
  • the plate strip is particularly suitable as a material of a component for electronic and electrical equipment, for example, a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar.
  • the component for electronic and electrical equipment (a terminal such as a connector or a press fit, a movable piece for a relay, a lead frame, or a busbar) according to the present embodiment is formed of the copper alloy for electronic and electrical equipment described above, excellent characteristics can be exhibited even in a case of miniaturization and reduction in thickness.
  • the copper alloy for electronic and electrical equipment the copper alloy plate strip for electronic and electrical equipment, and the component for electronic and electrical equipment (such as a terminal or a busbar) according to the embodiment of the invention of the present application have been described, but the invention of the present application is not limited thereto and can be appropriately changed within the range not departing from the technical ideas of the invention.
  • the method of producing the copper alloy for electronic and electrical equipment is not limited to the description of the embodiment, and the copper alloy may be produced by appropriately selecting a production method of the related art.
  • Selected copper having a H content of 0.1 mass ppm or less, an O content of 1.0 mass ppm or less, a S content of 1.0 mass ppm or less, a C content of 0.3 mass ppm or less, and a Cu purity of 99.99 mass% or greater was prepared as a raw material, a high-purity alumina crucible was charged with the copper, and the copper was melted in a high-purity Ar gas (a dew point of -80°C or lower) atmosphere using a high-frequency melting furnace.
  • a high-purity Ar gas a dew point of -80°C or lower
  • an Ar-N 2 -H 2 and Ar-O 2 mixed gas atmosphere was prepared as the atmosphere at the time of melting using high-purity Ar gas (a dew point of -80°C or lower), high-purity N 2 gas (a dew point of -80°C or lower), high-purity O 2 gas (a dew point of -80°C or lower), and high-purity H 2 gas (a dew point of -80°C or lower).
  • Ar gas a dew point of -80°C or lower
  • high-purity N 2 gas a dew point of -80°C or lower
  • high-purity O 2 gas a dew point of -80°C or lower
  • high-purity H 2 gas a dew point of -80°C or lower
  • Example 11 of the present invention a carbon mold was used in Example 11 of the present invention
  • a heat insulating material (isowool) mold was used in Example 28 of the present invention
  • a copper alloy mold having a water cooling function was used in Examples 1 to 10, 12 to 27, and 29 to 37 and Comparative Examples 1 to 11 as a casting mold.
  • the size of an ingot was set to have a thickness of approximately 20 mm, a width of approximately 200 mm, and a length of approximately 300 mm.
  • the vicinity of the casting surface was chamfered from the obtained ingot such that a block having a size of 16 mm ⁇ 200 mm ⁇ 100 mm was cut out.
  • This block was heated for 4 hours under the temperature conditions listed in Tables 3 and 4 in an Ar gas atmosphere and was subjected to a homogenizing and solutionizing treatment.
  • the copper material which had been subjected to a heat treatment was appropriately cut to have a shape suitable as the final shape and surface grinding was performed.
  • rough rolling was performed at room temperature and a rolling ratio listed in Tables 3 and 4.
  • the obtained strip was subjected to an intermediate heat treatment under the conditions listed in Tables 3 and 4 in an Ar gas atmosphere. Thereafter, water quenching was performed.
  • finish rolling was performed at a rolling ratio listed in Tables 3 and 4 so that a thin plate having a thickness of 0.5 mm and a width of approximately 200 mm was produced.
  • finish rolling was performed after the surface thereof was coated with rolling oil.
  • the components were analyzed using the thin plate for evaluating characteristics obtained in the above-described manner.
  • Mg and P were analyzed according to inductively coupled plasma atomic emission spectrophotometry.
  • H was analyzed according to a thermal conductivity method, and O, S, and C were analyzed according to an infrared absorption method.
  • the depth of the surface roughening indicates the depth of surface roughening formed toward the central portion from an end portion of an ingot.
  • test pieces specified in JIS Z 2241 were collected from each strip for evaluating characteristics and the 0.2% proof stress was measured according to the offset method in JIS Z 2241. Further, the test pieces were collected in a direction orthogonal to the rolling direction. The evaluation results are listed in Tables 5 and 6.
  • the measurement was performed such that the tensile test was performed ten times using the above-described No. 13B test pieces, and the number of times that the tensile test pieces were broken in an elastic region before the 0.2% proof stress was counted was set as the breakage number of the tensile test.
  • the evaluation results are listed in Tables 5 and 6.
  • the elastic region indicates a region that satisfies a linear relationship in a stress-strain curve. As this breakage number becomes larger, the workability is degraded due to inclusions.
  • Test pieces having a width of 10 mm and a length of 150 mm were collected from each strip for evaluating characteristics and the electric resistance was calculated according to a 4-terminal method. Further, the dimension of each test piece was measured using a micrometer and the volume of the test piece was calculated. In addition, the conductivity was calculated from the measured electric resistance and volume. Further, the test pieces were collected such that the longitudinal directions thereof were perpendicular to the rolling direction of each strip for evaluating characteristics. The evaluation results are listed in Tables 5 and 6.
  • a stress relaxation resistance test was carried out by loading stress according to a method in conformity with a cantilever screw type in Japan Elongated Copper Association Technical Standard JCBA-T309:2004 and measuring the residual stress ratio after storage at a temperature of 150°C for 1000 hours.
  • test pieces (width of 10 mm) were collected in a direction orthogonal to the rolling direction from each strip for evaluating characteristics, the initial deflection displacement was set to 2 mm such that the maximum surface stress of each test piece was 80% of the proof stress, and the span length was adjusted.
  • the maximum surface stress was determined according to the following equation.
  • Maximum surface stress MPa 1.5 Et ⁇ 0 / L s 2
  • Residual stress ratio % 1 ⁇ ⁇ t / ⁇ 0 ⁇ 100
  • Bend working was performed in conformity with a 4 test method in Japan Elongated Copper Association Technical Standard JCBA-T307:2007.
  • a plurality of test pieces having a width of 10 mm and a length of 30 mm were collected from each thin plate for evaluating characteristics such that the bending axis was in a direction orthogonal to the rolling direction.
  • Comparative Example 8 the content of O was larger than the range of the invention of the present application (100 mass ppm or less). As a result of performing the tensile test ten times, the number of times that the tensile test pieces were broken in an elastic region was 8 times and deterioration of the workability due to inclusions was recognized. The bending workability was insufficient.

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JP7180102B2 (ja) * 2018-03-30 2022-11-30 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
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JP6863409B2 (ja) * 2018-12-26 2021-04-21 三菱マテリアル株式会社 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法
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Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3778318A (en) * 1969-02-24 1973-12-11 Cooper Range Co Copper base composition
JP2661462B2 (ja) * 1992-05-01 1997-10-08 三菱伸銅株式会社 繰り返し曲げ性にすぐれた直経：０．１ｍｍ以下のＣｕ合金極細線
JP3796784B2 (ja) * 1995-12-01 2006-07-12 三菱伸銅株式会社 コネクタ製造用銅合金薄板およびその薄板で製造したコネクタ
JP4756197B2 (ja) 2005-08-23 2011-08-24 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金およびその製造法
CN1924048A (zh) * 2005-08-31 2007-03-07 上海科泰铜业有限公司 汽车电器用高导电率铜镁合金
JP5311283B2 (ja) 2009-03-11 2013-10-09 住友電気工業株式会社 非水電解質電池、およびその製造方法
JP4516154B1 (ja) * 2009-12-23 2010-08-04 三菱伸銅株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金条材及びその製造方法
JP4563508B1 (ja) * 2010-02-24 2010-10-13 三菱伸銅株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金条材及びその製造方法
JP5848169B2 (ja) * 2012-03-14 2016-01-27 Ｄｏｗａメタルテック株式会社 銀めっき材
JP5189715B1 (ja) * 2012-04-04 2013-04-24 三菱伸銅株式会社 優れた耐疲労特性を有するＣｕ−Ｍｇ−Ｐ系銅合金板及びその製造方法
JP6054085B2 (ja) * 2012-07-24 2016-12-27 三菱伸銅株式会社 曲げ加工後のばね限界値特性及び耐疲労特性に優れたＣｕ−Ｍｇ−Ｐ系銅合金板及びその製造方法
JP6055242B2 (ja) * 2012-08-30 2016-12-27 三菱伸銅株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金Ｓｎめっき板及びその製造方法
JP6076724B2 (ja) 2012-12-06 2017-02-08 古河電気工業株式会社 銅合金材料およびその製造方法
JP5962707B2 (ja) * 2013-07-31 2016-08-03 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用銅合金塑性加工材の製造方法、電子・電気機器用部品及び端子
JP6140032B2 (ja) * 2013-08-30 2017-05-31 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法並びに通電部品
JP5847787B2 (ja) * 2013-11-26 2016-01-27 Jx日鉱日石金属株式会社 導電性及び応力緩和特性に優れる銅合金板
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US10128019B2 (en) * 2015-09-09 2018-11-13 Mitsubishi Materials Corporation Copper alloy for electronic/electrical device, plastically-worked copper alloy material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar

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US11920228B2 (en) 2019-12-10 2024-03-05 Mitsubishi Materials Corporation Copper alloy sheet, copper alloy sheet with plating film, and method for producing same

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