EP3356083B1 - Lumineszentes substrat mit schleifpartikeln und verfahren zur herstellung davon - Google Patents

Lumineszentes substrat mit schleifpartikeln und verfahren zur herstellung davon Download PDF

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Publication number
EP3356083B1
EP3356083B1 EP16777646.7A EP16777646A EP3356083B1 EP 3356083 B1 EP3356083 B1 EP 3356083B1 EP 16777646 A EP16777646 A EP 16777646A EP 3356083 B1 EP3356083 B1 EP 3356083B1
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EP
European Patent Office
Prior art keywords
coating
substrate
abrasive
binder
abrasive particles
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EP16777646.7A
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English (en)
French (fr)
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EP3356083A1 (de
Inventor
Mathieu Debourdeau
Amal Chabli
Fabrice Coustier
Bruno Laguitton
Jean-Pierre Simonato
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Thermocompact SA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Thermocompact SA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/346—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties utilised during polishing, or grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Definitions

  • the present invention relates to a substrate, for example a wire, containing abrasive particles, as defined in the preamble of claim 1.
  • the field of use of the present invention relates in particular to the sawing and polishing of materials such as silicon, sapphire or silicon carbide.
  • the abrasive devices are manufactured by placing abrasive particles on a substrate by means of a binder.
  • abrasive device is for example known from the document WO 02/074492 A2 .
  • This technique makes it possible to obtain sawing or polishing devices, for example polishing mats, cutting or polishing wheels, or cutting wires.
  • the binder makes it possible to bond the abrasive particles and the substrate. It is usually made of resin or metal.
  • the present invention solves this problem by integrating a luminescent compound into an abrasive device.
  • the Applicant has developed an abrasive device incorporating at least one luminescent compound to facilitate control of its surface condition.
  • the coated abrasive particles of C2 are in contact with the binder C1 and with the coating C3.
  • the binder C1 completely covers the substrate
  • the coating C2 completely covers the abrasive particles
  • the coating C3 completely covers the binder C1 and the abrasive particles.
  • the substrate may especially be chosen from the group comprising: a steel wire; a textile; and a metal plate. It may be a saw wire, a polishing cloth, or a grinder disk for example.
  • the substrate is a wire comprising a steel core and having a circular cross section, advantageously a steel wire whose diameter is between 60 micrometers and 1.5 millimeters.
  • a core whose diameter is between 200 micrometers and 1 millimeter is particularly suitable for cutting silicon bricks into ingots.
  • a core whose diameter is between 70 and 200 microns is particularly suitable for cutting silicon wafers (better known as wafers in bricks).
  • the core of the wire is generally in the form of a wire whose tensile strength is advantageously greater than 2000 or 3000 MPa, but generally less than 5000 MPa.
  • the core may have an elongation at break, that is to say the increase in the length of the core before it breaks, advantageously greater than 1%, even more advantageously greater than 2%. However, it remains preferentially less than 10 or 5%.
  • the core of the wire is an electrically conductive material, that is to say a material whose resistivity is less than 10 -5 ohm.m at 20 ° C, and in particular steel.
  • the steel core may especially be of a material selected from the group consisting of carbon steel, ferritic stainless steel, austenitic stainless steel, and brass steel. Carbon steel preferably contains between 0.6 and 0.8% by weight of this element.
  • the binder C1 makes it possible to bond the abrasive particles and the substrate.
  • the binder C1 is preferably metallic. It may especially consist of a layer of nickel and / or cobalt, for example a nickel / cobalt alloy whose cobalt content is between 20% and 85% by weight relative to the weight of the Ni / Co alloy. advantageously between 37 and 65%.
  • Layer means a film covering the substrate, of homogeneous composition.
  • the coating C3 is also metallic. It may especially consist of a layer of nickel and / or cobalt, for example a nickel / cobalt alloy whose cobalt content is between 10 and 90% by weight relative to the weight of the Ni / Co alloy, advantageously between 20% and 85%, more preferably between 37 and 65%.
  • the binder C1 and the coating C3 advantageously consist of metals or alloys of metals, for example Ni / Co, different from each other.
  • the binder C1 in contact with the substrate may have a hardness greater than that of the coating C3, to ensure the maintenance of the abrasive particles on the substrate.
  • the C3 coating is generally very resistant to abrasion, but also ductile to prevent cracking. This problem of cracking can be encountered when the substrate is a wire, and more precisely during the mechanical stressing of this wire. For this, it is preferable that the coating layer C3 has sufficient ductility. In this respect, it can be seen whether the ductility of the outer layer is sufficient, by subjecting the wire to a simple tensile test until it breaks.
  • the binder C1 and the coating C3 are made of a nickel / cobalt alloy, whose cobalt content is between 20% and 85% by weight relative to the weight of the Ni / Co alloy ( independently from C1 to C3).
  • the coating C3 is advantageously a Ni / Co alloy containing more cobalt than the binder C1.
  • the C3 coating exhibits superior abrasion resistance properties with respect to the high percentage of cobalt.
  • the C3 coating has higher hardness properties than the C1 binder alloy because of its adapted composition, the C3 layer being harder than the C1 layer because of a higher percentage of cobalt.
  • the hardness of the binder C1 or the coating C3, in particular of Ni / Co alloy can be improved by introducing sulfur.
  • This can in particular be carried out according to the method described hereinafter, by introducing sodium saccharinate (C 7 H 4 NO 3 S, Na 2 H 2 O) in an electrolyte bath making it possible to form the binder layer C1. or C3 coating.
  • the binder C1 and / or the coating C3, for example of Ni / Co alloy may contain from 100 to 1000 ppm (parts per million) by weight of sulfur, preferably from 300 to 700 ppm.
  • C1 binder contains sulfur. Indeed, the addition of sulfur increases the hardness of the binder, but it reduces the ductility.
  • a high sulfur content of the coating C3 can cause cracking thereof particularly when the substrate is a wire which is stretched in the cutting zone. This cracking passes water, and it electrolytically contacts the substrate with the binder. It follows a corrosion of the substrate which becomes progressively unusable.
  • the binder C1 and the coating C3 can in particular be obtained by successive electrolytic deposition of metals, and more particularly of metal alloys of Ni / Co type.
  • the metal layers constituting the binder C1 and the coating C3 advantageously have a hardness of between 300 and 800 Hv, advantageously between 300 and 500 Hv.
  • the hardness of a layer of metal or metal alloy is measured using a micro-durometer according to the techniques forming part of the general knowledge of those skilled in the art.
  • a Vickers indenter is generally used, with a load compatible with the thickness of the layer. This charge is generally between 1 gram-force and 100 gram-strength. If the impression left by the Vickers indenter is too big compared to the thickness of the layer (even with a low load), we can use a Knoop indenter (narrower), and convert the Knoop hardness value. in Vickers hardness, using a conversion table.
  • the abrasive particles are coated with a layer of C2.
  • This coating C2 is advantageously metallic, more preferably a material selected from the group comprising nickel, cobalt, iron, copper, and titanium.
  • the abrasive particles are advantageously made of a material chosen from the group comprising silicon carbide SiC; silica SiO 2 ; tungsten carbide WC; silicon nitride Si 3 N 4 ; cubic boron nitride cBN; CrO 2 chromium dioxide; Al 2 O 3 aluminum oxide; Diamonds ; and diamonds pre-coated with nickel, iron, cobalt, copper, or titanium, or their alloys.
  • the abrasive substrate may comprise several types of distinct abrasive particles.
  • the abrasive particles consist of grains coated with a coating C2, which may be distinct from the binder C1 and the coating C3. This coating C2 at least partially covers each grain, advantageously completely.
  • the materials covering the grains, such as grains of diamonds, are, for example, nickel, cobalt, iron, copper, or titanium.
  • the total diameter of the particles is advantageously between 1 micrometer and 500 micrometers.
  • the diameter of the particles is preferably less than one third of the diameter of the core of the steel wire.
  • the diameter of the particles may be between 10 and 22 microns for a wire whose core has a diameter of 0.12 mm.
  • Diameter means the largest diameter (or the largest dimension) of the particles when they are not spherical.
  • the coating C2 covering the grain is made of a ferromagnetic material at the manufacturing temperature of the abrasive wire (electrolytic deposition of the abrasive particles - see the method described below).
  • Nickel, iron, and cobalt are examples. These metals can be alloyed with each other, and they can also contain hardening elements such as sulfur and phosphorus. It should be noted that phosphorus decreases the ferromagnetism of nickel, and that, in this case, it is necessary to limit its concentration.
  • the material forming the coating C2 is advantageously electrically conductive.
  • the coating C2 at least partially covers the abrasive particles, advantageously completely.
  • the portion of the grain in contact with the material to be cut or polished is devoid of coating, the latter being eroded at the first cutting operations, the same way that the coating C3.
  • the mass of the coating C2, relative to the total mass of the coated particles, is advantageously between 10% and 60%, especially in the case of diamond grains.
  • This coating C2 may in particular be deposited on the grains prior to the use of grains / abrasive particles in the method of manufacturing the abrasive substrate according to the invention.
  • the techniques that can be implemented for the deposition of a coating C2 on each of the grains include sputtering, but also electrolysis, chemical vapor deposition (CVD). Vapor Deposition "), and electrochemical electroless plating (Electroless Nickel Plating).
  • the abrasive substrate according to the invention comprises at least one luminescent compound.
  • This compound is advantageously in the form of luminescent particles, advantageously inorganic luminescent particles, and still more advantageously inorganic fluorescent particles.
  • the inorganic luminescent particles may advantageously be chosen from the group comprising the particles based on, and advantageously constituted by, metal oxide; metallic sesquioxide; metal oxyfluoride; vanadate metal; of metal fluoride, and mixtures thereof.
  • the particles are advantageously doped with one or more active centers of the family of lanthanides or of the family of transition elements.
  • the luminescent particles can be used in mixtures to create a luminescent optical code.
  • the luminescent particles are doped with ions of the family of lanthanides, advantageously europium.
  • the intensity of the luminescence depends on the doping rate and can go through a maximum.
  • the doping of these particles may vary from 0.5 to 50% relative to the number of moles of metal constituting the particles, more preferably from 1 to 5%.
  • markers ie several types of luminescent particles can be used to mark the substrate.
  • the amount of each type of incorporated particles may be different.
  • each type of particle can have its own signature.
  • the authentication of the substrate may require the detection of several particles at different wavelengths.
  • the particles may comprise within the same particle different optical signatures detectable at different wavelengths. It is then diptych or triptych particles for example.
  • the particles may have a spherical, cubic, cylindrical, parallelepipedic shape.
  • the size of the particles is defined by their largest average size, that is to say by their diameter when they are spherical, their average length when they are rod-shaped.
  • the luminescent particles are particles whose average size is advantageously between 4 and 1000 nanometers.
  • the particles are nanoparticles.
  • the average size of the nanoparticles is advantageously between 4 and 100 nanometers, more preferably between 20 and 50 nanometers.
  • the particles, and more advantageously the nanoparticles can be encapsulated (coated), in particular in a polysiloxane or silicon oxide matrix.
  • the new polysiloxane or silica surface can then be functionalized with organosilane coupling agents, such as substituted alkoxysilanes such as aminopropyltriethoxysilane or derivatives of the same family.
  • organosilane coupling agents such as substituted alkoxysilanes such as aminopropyltriethoxysilane or derivatives of the same family.
  • these surface modifications of the particles can affect the hydrophilic / hydrophobic character of the particles and thus modify the affinity and diffusivity of the inorganic luminescent particles within the binder C1, the coating C2 or the coating C3. A better homogeneity of the distribution of the luminescent particles can thus be obtained.
  • the particles When the particles are coated, their average size also remains within the size ranges mentioned above. In general, the coating increases the average particle size of the order of 5 to 15 nanometers.
  • At least one luminescent compound is integrated with the abrasive substrate. As already indicated, it can be integrated in the binder C1 and / or in the coating C2 and / or in the coating C3.
  • a luminescent compound CL1 can be introduced into the bath B1 so as to be incorporated in the binder C1.
  • a luminescent compound CL2 may be introduced beforehand into the coating C2.
  • a luminescent compound CL3 can be introduced into the bath B2 so as to be incorporated in the coating C3.
  • the luminescent compound is introduced in the form of an aqueous solution of nanoparticles or luminescent nanocolloids in a homogeneous aqueous solution (bath B 1 and / or bath B 2 ).
  • a homogeneous aqueous solution bath B 1 and / or bath B 2 .
  • the resulting aqueous solution is then subjected to the application of a known method of electrolytic (or galvanic) deposition on a substrate.
  • the luminescent compound When the luminescent compound is incorporated in the binder C1 or the coating C3, its amount may represent 0.05 to 5% by weight relative to the weight of the binder C1 or the coating C3, advantageously 0.1 to 1%.
  • the luminescent compound may have a concentration of between 0.01 and 5 g / 100 in the bath B 1 or B 2 , advantageously 0.5 to 1 g / 100.
  • the luminescent compound When the luminescent compound is integrated in the coating C2, its amount may represent 0.05 to 5% by weight relative to the weight of the coating C2, advantageously 0.1 to 1%.
  • the luminescent compound CL2 is integrated in C2 by means of an electrolyte bath in which the abrasive particles coated with a metal layer advantageously deposited by CVD are immersed.
  • the electrolyte baths B 1 and B 2 comprise metal ions forming the binder C1 and the coating C2. They may in particular comprise at least cobalt ions and / or nickel ions.
  • Co 2+ and Ni 2+ ions are generally introduced into the baths B 1 and B 2 .
  • other oxidation levels can coexist, but, in general, they are very minor in concentration in the electrolysis baths.
  • the bath B 2 may have a composition of metal ions, such as nickel and cobalt ions, distinct from that of the bath B 1 .
  • the bath B 2 is advantageously devoid of abrasive particles.
  • the coating C3 may be pure cobalt metal that resists abrasion.
  • the coating C3 may be covered by one or more layers.
  • the layer or layers covering the coating C3 may be obtained either by reiteration of the passage in the bath B 2 , or by passage through at least one other electrolytic bath comprising ions Co II and Ni II.
  • the baths B 1 and B 2 comprise, independently of one another, between 1 and 150 g / l of cobalt II ions and between 50 and 150 g / l of nickel ions II.
  • the bath B 1 comprises between 1 and 100 g / l of abrasive particles.
  • the hardness of the binder C1 or the coating C3 can also be improved by incorporation of sulfur.
  • the sulfur can be introduced in particular by addition of sodium saccharinate (C 7 H 4 NO 3 S, Na 2 H 2 O) in the electrolyte bath B 1 or B 2 , advantageously only in B 1 .
  • the quantity introduced may be between 1 and 10 g / l, advantageously of the order of 5 g / l.
  • the temperature of the bath B 1 or B 2 is advantageously between 60 and 90 ° C.
  • the abrasive substrate Once the abrasive substrate has been formed, it can be subjected to a lapping step which makes it possible to improve the performance of the abrasive substrate at the output of manufacture by discovering the abrasive particles.
  • the invention also relates to the use of the abrasive substrate described above, for sawing or polishing a material that can be chosen especially from the group comprising silicon, sapphire, and silicon carbide.
  • the abrasive substrate can be used in the production of wafers of silicon.
  • the abrasive substrate according to the material to be cut or polished. More particularly, the abrasive particles are chosen to be harder than the material to be cut or polished.
  • the present invention provides important advantages in the regular control of the abrasive properties of the abrasive substrate according to the invention.
  • the abrasive particles (2) coated with C2 ( figure 2 ) are in contact with the binder C1 and with the coating C3.
  • the abrasive substrate comprises at least one luminescent compound CL in the binder C1 and / or in the coating C2 and / or in the coating C3.
  • the presence of the luminescent compound CL can be detected by different devices.
  • the quality control and wear control of the abrasive substrate can be monitored by these devices that can excite the luminescent compounds, coupled with the acquisition of images.
  • the system of acquisition / observation of luminescence comprises a camera C and a lens O provided with a bandpass filter for selecting the emission wavelength of the luminescent compound integrated in the abrasive substrate.
  • the emission of the luminescent compound can be ensured by exposing the abrasive substrate SA to a filtered light source SL.
  • the luminescence acquisition system comprises an optical fiber spectrometer S, the illumination (excitation of the luminescent compound) being carried out by a laser La with a chosen wavelength and a spectrum width sufficiently fine to avoid any spurious signal.
  • the abrasive substrate SA comprises a plurality of luminescent compounds
  • one or more excitation sources may be used to detect all the luminescent compounds present in the abrasive substrate SA.
  • an image acquisition system comprising one or more optical filters may be used, the filters only allowing the desired wavelengths for measuring the quality or wear of the abrasive substrate.
  • the quantification of the detected signal is ensured by a calibration of the system with wear standards of the abrasive substrate so as to define two main thresholds, high and low threshold.
  • abrasive substrate prior to measuring its luminescence.
  • This cleaning eliminates any unwanted signals from dirt cutting or polishing. It can be made by high-pressure water jet just before the acquisition zone which itself is outside the cutting or polishing zone.
  • the figure 5 corresponds to a particular embodiment of the invention in which the abrasive substrate comprises a luminescent compound CL1 in the binder C1.
  • the abrasive substrate is replaced as soon as the signal L1 reaches a predefined threshold corresponding to a wear rate that does not allow it to perform its sawing or polishing function.
  • a calibration of the control device makes it possible to define this threshold.
  • This configuration makes it possible to monitor the wear of the abrasive substrate by monitoring the appearance of the signal L1 corresponding to the emission of the luminescent compound CL1. This signal appears as soon as abrasive particles (2) are torn from the substrate (1).
  • This embodiment (CL1 in C1) is particularly suitable for a diamond grinding wheel type substrate which requires regular brightening to discover the abrasive particles so as to maintain its abrasive power.
  • the presence of a luminescent compound in the binder C1 makes it possible to indicate the end of life of the tool.
  • the figure 6 corresponds to a particular embodiment of the invention in which the abrasive substrate comprises a luminescent compound CL2 in the coating C2.
  • wear of the abrasive substrate can be monitored by monitoring the decrease of the L2 signal.
  • the small amount of the layer C2 and thus CL2 around the particles has the disadvantage of limiting the dynamics of the measurement.
  • This embodiment is particularly suitable for a textile substrate.
  • a luminescent compound in the coating C2 makes it possible to control the abrasive quality of the carpet.
  • a sharp decrease in the signal emitted by the luminescent compound then corresponds to a decrease in the abrasive properties resulting from the loss of abrasive particles. It is then necessary to replace the carpet.
  • the figure 7 corresponds to a particular embodiment of the invention in which the abrasive substrate comprises a luminescent compound CL3 in the coating C3.
  • the presence of the luminescent compound CL3 in the coating C3 makes it possible to create a contrast between CL3 and the abrasive particles C2.
  • the luminescence signal comes from the coating C3. No signal is observed at the level of the diamonds when they have been ground, that is to say without the C3 coating.
  • This configuration makes it possible to follow the wear of the wire thanks to a predefined low signal threshold commanding the stopping of the machine as soon as this threshold is reached.
  • the abrasive substrate according to the invention can also comprise simultaneously two or three luminescent compounds among CL1 (in C1), CL2 (in C2) and CL3 (in C3).
  • This embodiment makes it possible to improve the monitoring of the quality and wear of the abrasive substrate from its manufacture until its change.
  • the binder C1 and / or the coating C2 of the abrasive particles may respectively comprise the luminescent compounds CL1 and CL2.
  • the emission of CL1 and / or the absence or decrease of the emission of CL2 demonstrates the reduction of the abrasive power, triggering the replacement of the abrasive substrate.
  • the galvanic treatment is carried out on a brass substrate at a temperature of 50 ° C.
  • the galvanic deposition is carried out with mechanical stirring of the electrolyte bath so as to maintain the dispersion of the particles in solution.
  • Electrolytic deposition is accomplished by passing a current between two electrodes in the aqueous electrolyte bath.
  • the substrate to be covered corresponds to one of the electrodes (cathode).
  • the skilled person will use his knowledge to determine the nature (intensity, potential) of the current to be applied, depending on the geometry, the distance between electrodes, the nature of the metal ions or their concentration in solution ( see in particular: Galvanotechnical Treaty, Louis Lacourcelle, 1997, Galva-Conseils Edition ).
  • the current flow conditions, the reaction time and the geometry of the electrodes in the bath are interdependent and are fixed so as to obtain a layer 4 microns thick covering the surface of the cathode at the end of the deposition time ( 1 minute).
  • the solution thus prepared is homogeneous. It is not a dispersion requiring permanent agitation.
  • the cationic nanocolloid solution used has a migration behavior towards the cathode similar to that of the metal ions used in the solution to form a metal deposit under the influence of a galvanic current.
  • the resulting substrate has fluorescent zones but distributed very heterogeneously.
  • the solution of luminescent compounds does not interfere with the migration of ions and nanoparticles in homogeneous solution under the effect of the current. It is possible to form a smooth metal surface. On the other hand, the presence of particles in suspension disturbs the deposition of the metal layer, rendering it rough, heterogeneous and discontinuous.
  • the third curve of the figure 8 optimizes the excitation of the luminescent compound for better efficiency.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Claims (10)

  1. Ein Schleifmittel zum Sägen oder Polieren, umfassend:
    - ein Substrat (1),
    - ein Bindemittel C1, das mindestens einen Teil des Substrats bedeckt;
    - Schleifteilchen (2) mit einer mindestens teilweisen Umhüllung C2;
    - eine Beschichtung C3, die das Bindemittel C1 und die mit C2 umhüllten Schleifteilchen bedeckt;
    die mit C2 umhüllten Schleifteilchen stehen in Kontakt mit dem Bindemittel C1 und mit der Beschichtung C3;
    wobei das Schleifmittel durch mindestens eine lumineszierende Verbindung gekennzeichnet ist.
  2. Substrat gemäß Anspruch 1, dadurch gekennzeichnet, dass:
    - das Substrat ausgewählt wird aus der Gruppe umfassend Stahldraht; Textil, Metallplatten;
    - das Bindemittel C1 aus mindestens einer Schicht einer Nickel/ Kobalt- Legierung besteht, deren Kobaltgehalt zwischen 20 und 85 Gewichts-% bezogen auf das Gewicht der Ni/Co- Legierung beträgt;
    - bei der Beschichtung C2 der Schleifteilchen handelt es sich um ein Material ausgewählt aus der Gruppe bestehend aus Nickel, Kobalt, Eisen, Kupfer und Titan;
    - die Beschichtung C3 besteht aus mindestens einer Schicht einer Nickel/ KobaltLegierung, deren Kobaltgehalt zwischen 10 und 90 Gewichts-% bezogen auf das Gewicht der Ni/Co- Legierung beträgt.
  3. Schleifsmittel gemäß Anspruch 1 oder 2 dadurch gekennzeichnet, dass es eine lumineszierende Verbindung CL1 im Bindemittel C1 enthält.
  4. Schleifsmittel gemäß einem der Ansprüche 1 bis 3 dadurch gekennzeichnet, dass es eine lumineszierende Verbindung CL2 in der Umhüllung C2 enthält.
  5. Schleifsmittel gemäß Anspruch 1 oder 4, dadurch gekennzeichnet, dass es eine lumineszierende Verbindung CL3 in der Beschichtung C3 enthält.
  6. Schleifsmittel gemäß einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass das Substrat enthält:
    - eine lumineszierende Verbindung CL1 im Bindemittel C1;
    - eine lumineszierende Verbindung CL2 in der Umhüllung C2;
    - 5- eine lumineszierende Verbindung CL3 in der Beschichtung C3;
    CL1, CL2 und CL3 unterscheiden sich voneinander.
  7. Schleifsmittel gemäß einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass die Schleifteilchen aus einem Material bestehen, ausgewählt aus der Gruppen umfassend Siliziumkarbid SiC; Kieselsäure SiO2; Wolframkarbid WC; Siliziumnitrid Si3N4; kubisches Bornitrid cBN; Chromdioxid CrO2; Aluminiumoxid Al2O3; Diamanten und mit Nickel, Eisen, Kobalt, Kupfer und Titan oder ihren Legierungen vorbeschichtete Diamanten.
  8. Schleifsmittel gemäß einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass die lumineszierende Verbindung ausgewählt wird aus der Gruppe aus Metalloxid, Metallsesquioxid; Metalloxifluorid, Metallvanadat, Metallfluorid und ihren Mischungen.
  9. Verfahren zur Herstellung eines Schleifsmittels (1)
    - das Gegenstand der Ansprüche 1 bis 8 ist, und das die folgenden Schritte umfasst:
    - Bildung eines abrasiven Substrats durch elektrolytisches Abscheiden auf einem Substrat eines Bindemittels C1 und von Schleifteilchen (2) durch Passage durch ein Schleifteilchen enthaltendes Elektrolytbad B1,
    • wobei diese Schleifteilchen zumindest teilweise eine Umhüllung C2 aufweisen,
    • das Bindemittel C1, mindestens einen Teil des Substrats bedeckt;
    - elektrolytisches Abscheiden auf einem Substrat eines Bindemittels C3 und von Schleifteilchen durch Passage durch ein Schleifteilchen enthaltendes Elektrolytbad B2;
    • die Beschichtung C3 mindestens einen Teil des Bindemittels C1 und der Schleifteilchen bedeckt;
    • die Schleifteilchen in Kontakt mit dem Bindemittel C1 und mit der Beschichtung C3 stehen,
    - wobei der Fertigungsprozess gekennzeichnet ist durch die Integration mindestens einer lumineszierenden Verbindung in mindestens eine Schicht zwischen dem Bindemittel C1, der Umhüllung C2 oder der Beschichtung C3.
  10. Verfahren zur Herstellung eines Schleifsmittels gemäß Anspruch 9, dadurch gekennzeichnet, dass die lumineszierende Verbindung in der Form einer wässrigen Lösung lumineszierender Nanoteilchen oder Nanokolloide in das Bad B1 oder B2 eingeführt werden.
EP16777646.7A 2015-09-30 2016-09-29 Lumineszentes substrat mit schleifpartikeln und verfahren zur herstellung davon Active EP3356083B1 (de)

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FR1559281A FR3041650B1 (fr) 2015-09-30 2015-09-30 Substrat luminescent contenant des particules abrasives, et son procede de preparation
PCT/EP2016/073177 WO2017055394A1 (fr) 2015-09-30 2016-09-29 Substrat luminescent contenant des particules abrasives, et son procede de preparation

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FR3056428B1 (fr) 2016-09-26 2018-10-19 Thermocompact Procede de decoupe de tranches dans un lingot en materiau dur
JP2021523839A (ja) * 2018-03-30 2021-09-09 サンーゴバン アブレイシブズ，インコーポレイティド コーティングを含む研磨物品
CN116141215B (zh) * 2022-08-04 2024-08-27 华侨大学 一种含稀土化合物的软胶抛光垫的制备方法

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WO2017055394A1 (fr) 2017-04-06
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EP3356083A1 (de) 2018-08-08
JP6543766B2 (ja) 2019-07-10
JP2018538149A (ja) 2018-12-27
FR3041650B1 (fr) 2017-10-20
US20180257200A1 (en) 2018-09-13
US10357869B2 (en) 2019-07-23
FR3041650A1 (fr) 2017-03-31

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