EP4153796B1 - Bad zum chemischen polieren von aluminium und aluminiumlegierungen und verfahren zur verwendung eines solchen bades - Google Patents

Bad zum chemischen polieren von aluminium und aluminiumlegierungen und verfahren zur verwendung eines solchen bades Download PDF

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EP4153796B1
EP4153796B1 EP21728021.3A EP21728021A EP4153796B1 EP 4153796 B1 EP4153796 B1 EP 4153796B1 EP 21728021 A EP21728021 A EP 21728021A EP 4153796 B1 EP4153796 B1 EP 4153796B1
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Prior art keywords
bath
chemical polishing
mol
aluminum
concentration
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French (fr)
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EP4153796A1 (de
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Jérôme FRAYRET
Joffrey Tardelli
Loïc EXBRAYAT
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Institut de Recherche Technologique Materiaux Metallurgie et Procedes IRT M2P
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Institut de Recherche Technologique Materiaux Metallurgie et Procedes IRT M2P
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/02—Light metals
    • C23F3/03—Light metals with acidic solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/60—Treatment of workpieces or articles after build-up
    • B22F10/62—Treatment of workpieces or articles after build-up by chemical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
    • B33Y40/20—Post-treatment, e.g. curing, coating or polishing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0408—Light metal alloys
    • C22C1/0416—Aluminium-based alloys
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Definitions

  • the present invention generally relates to the field of surface treatment of aluminum or aluminum alloy parts, and in particular to the field of polishing of aluminum or aluminum alloy parts.
  • the invention is particularly intended for the polishing of parts produced by additive manufacturing.
  • Additive manufacturing or 3D printing constitutes a major axis of R&D in France and around the world, making it possible to produce three-dimensional polymer or metal parts from powders. Due to the method of production by successive fusions of powders, additive manufacturing processes make it possible to produce parts with complex geometries but also to consider the production of new alloy grades not accessible by traditional metallurgy while limiting the quantities of raw materials needed. Additive manufacturing is a particularly interesting technology for the aerospace, automotive or naval industries with a view to improving the performance and weight reduction of structures.
  • powder bed additive manufacturing processes intrinsically lead to the creation of parts whose final surface state presents the stigma of being produced from powders with, in particular, surface roughness (expressed by the parameter Ra) between 5 and 25 ⁇ m depending on the process, i.e. significantly greater than the roughness of a machined part (of the order of a few microns).
  • the parts produced are generally characterized by the presence of partially melted particles on the extreme surface which may present a risk of detachment in service and thus degrade the performance of these parts (blocking of pipes, entrainment of particles in hydraulic systems, reduction in static and dynamic mechanical properties, etc.).
  • polishing processes such as electropolishing or plasma or laser polishing but these processes require the use of current or even lasers with a high induced cost.
  • the use of lasers or work with high electrical intensities requires special protection for operators.
  • these complex processes need fine control of their parameters. Concerning electropolishing baths, they are also difficult to manage because they are very hygroscopic and dehydration steps are necessary periodically.
  • So-called chemical polishing processes consisting of immersing the part to be treated in a bath, called a chemical polishing bath, containing acidic or basic compounds as well as oxidizing agents, without application of an electric current or a laser, are more simple to implement.
  • the first bath includes 50 mL of nitric acid, 250 mL of sulfuric acid and phosphoric acid, and 3 g of nickel sulfate.
  • the second bath includes 60 mL of nitric acid, 750 mL of sulfuric acid and 160 mL of phosphoric acid, and 2.5 g of copper nitrate.
  • polishing baths are known from the article “ Chemical polishing of aluminum and its alloys” by J. HERENGUEL and R. SECOND, METALLURGICAL REVIEW. XLVIII. No. 4. 1951, p1-5 .
  • the polishing solutions offered contain 80 to 95% by weight of phosphoric and sulfuric acid, with 3 to 10% by weight of nitric acid, at temperatures between 85 and 120°C.
  • the surface finish obtained is excellent, but the treatment times are very short, from 30 s to 1 min.
  • the US 3,425,881 describes a so-called polishing solution, but which is closer to 'shining', that is to say whose objective is to smooth out bumps and have a shiny finish.
  • the bath includes sulfuric and phosphoric acid, nitric acid, copper, ammonia and aluminum.
  • polishing baths for aluminum parts are described in the CN 106757039 B , US 4530735 A And FR 1093415 A .
  • the objective of the invention is to provide a polishing bath for aluminum parts which makes it possible to obtain a surface having an average roughness (Ra) less than 5 ⁇ m and limited material removal, typically less than 300 ⁇ m.
  • the present invention relates to a chemical polishing bath for aluminum and aluminum alloy parts, and to a process using such a bath.
  • the objective of chemical polishing is to reduce the surface roughness of a metal part, through an operation of selective dissolution of a layer of material of variable thickness, which can range from tens of nanometers to several tens of nanometers. micrometers.
  • This material removal is done chemically, using reagents which can be acidic or basic in nature, but also have oxidizing properties.
  • the dissolution caused by the chemical polishing process has a direct impact on the dimensional appearance of the part even if this is not the desired objective, which differentiates it from the chemical machining process whose only objective is to reduce the dimensions of the part (several tens or hundreds of microns), so as to reach a target value.
  • the principle of chemical polishing is also different from that of chemical pickling, which is more similar to the chemical machining process.
  • the objective of chemical stripping is to eliminate a layer of oxide, of which the thickness is of the order of a few microns, without impacting the dimensional characteristics of the part and its surface roughness but making it possible to promote the adhesion of the surface treatment applied subsequently.
  • polishing means reducing the surface roughness of a part, by modifying its dimensions as little as possible.
  • One of the merits of the invention is to have identified compounds, and their respective concentrations, which allow a significant reduction in roughness, without significantly increasing the haircut, whereas these two effects generally require antagonistic parameters.
  • the solution according to the invention comprises an oxidizing agent, which will attack the surface of the aluminum part, a complexing agent of the aluminum oxide.
  • the density of the bath is controlled by the mixture of sulfuric acid and phosphoric acid. Indeed, in order to obtain a polishing effect, the present bath has a viscosity, or density, generally greater than that of other chemical etching solutions, e.g. of the chemical machining type. Thus, aggression of the present solution is different from conventional pickling or chemical machining solutions, despite the use of reagents which may be similar.
  • the two acids used sulfuric acid and phosphoric acid
  • the arrival of H + ions, coming from these two acids, near the surface to be polished is also limited by their diffusion, which makes it possible to control their attack function.
  • the greater viscosity of the polishing solution makes it possible to slow down the phenomena of diffusion of chemical species from the solution towards the surface of the part where they have been consumed.
  • the goal is to make diffusion slower than reaction kinetics.
  • the surface is thus depleted of attacking agents (oxidizing agent, sulfuric acid or phosphoric acid) and complexing agents, because they have been consumed faster than they reach the surface. Their arrival therefore takes place first near the tops of the reliefs of the surfaces to be polished where their action will have priority. While the hollows will not see as many reagents (attacking agents and complexing agents), these having already been consumed by a reaction on the most raised points of the part. This phenomenon is thus responsible for a polishing effect on the surface by selective dissolution of surface roughness.
  • talking about an increase in the viscosity of the bath is equivalent to talking about an increase in its density, and vice versa.
  • the effectiveness of the present chemical polishing bath is based on the control of the kinetics of diffusion of oxidizing agents and complexing agents within the bath towards the surface of the part to be polished, as well as the kinetics reaction of oxidizing agents with the surface of the part to be polished.
  • the principle of action of the chemical polishing bath according to the invention is as follows. An appropriate viscosity (increased compared to conventional chemical etching baths) of the chemical polishing bath makes it possible to slow down the phenomena of diffusion of active chemical species (here the oxidizing agents and complexing agents) from the solution towards the surface of the part . Near the surface, the active species are consumed, which induces a local depletion of the bath.
  • the active species diffuse from the bath towards the surface, and in doing so they react as soon as they enter into contact with the surface to be polished.
  • the most accessible zones being the tops of the peaks causing the surface roughness, attack on the tops is favored, which allows a reduction in the relief of the surface and therefore in the overall roughness of the part.
  • the chemical polishing bath according to the invention has been particularly developed for the polishing of parts resulting from additive manufacturing techniques, but can be applied to all kinds of parts made of aluminum or aluminum alloy, whatever the process of obtaining .
  • the dimensions and/or geometries can be very varied.
  • the aluminum part to be treated may be part of a component. That is to say that the aluminum part to be treated can be combined with another material, to which it is juxtaposed or superimposed.
  • the fluorinated complexing agent added to the chemical polishing bath is chosen from NH 4 F, HF, NaF, HF, KF, HF, SiF 6 or their mixtures.
  • the role of the fluoride complexing agent in the invention is to combine with the oxidized aluminum (Al 2 O 3 , AlO(OH) or Al(OH) 3 ) which forms on the surface of the part under the attack of the oxidizing agent, or which can be in solution.
  • the preferred inorganic complexing agents are in the form of a fluorinated salt and hydrofluoric acid. In other words, it is a weak acid in the presence of its anion, the fluoride ion or F - .
  • the complexing agent used also has a buffer function, which makes it possible to control the pH of the chemical polishing bath.
  • fluoride ions are capable of complexing a variety of metals, which is interesting in the case of aluminum alloy parts. Furthermore, fluorides are extremely stable complexing agents in solution, and the risk of them being degraded over time and forming poorly controlled by-products is minimal.
  • the fluoride complexing agent is present at a concentration between 0.6 and 1.2 mol/L, preferably between 0.8 and 1.1 mol/L.
  • the oxidizing agent is present at a concentration between 1.3 and 2 mol/L, preferably between 1.4 and 1.6 mol/L.
  • phosphoric acid is present at a concentration between 11 and 13 mol/L, preferably between 11.5 and 12 mol/L, and/or sulfuric acid at a concentration between 1.6 and 3 mol /L, preferably between 1.7 and 2.2 mol/L.
  • Copper is generally introduced into the polishing bath in the form of a soluble salt in order to promote copper dispersion and a homogeneous copper concentration in the bath.
  • copper is added to the chemical polishing bath because it catalyzes the oxidation of the surface of the aluminum or aluminum alloy part to be polished.
  • As a catalyst its consumption is very low because it is regenerated after its reaction with the substrate by the action of nitric acid.
  • the added copper salt is preferably chosen from the group consisting of copper sulfate, copper nitrate or a mixture thereof.
  • the copper is added to the polishing bath in the form of copper sulfate, because the sulfate ions associated with copper are already present in said polishing bath due to the use of sulfuric acid, which reduces the risk parasitic reaction linked to the introduction of other elements into the reaction medium.
  • Copper is preferably present at a level of 0.10 to 0.20 mol/L.
  • the polishing bath becomes charged with dissolved aluminum, due to the chemical attack taking place on the surface roughness. It is possible to regenerate such a bath after use by simply adding the compounds consumed during polishing, in particular oxidizing and complexing agents, and in this case the regenerated bath always contains aluminum, which is also the case for baths traditional chemical polishing. However, traditional baths are destroyed when the aluminum concentration becomes too high. The presence of aluminum can in fact disrupt the functioning of the bath, and harm polishing performance, which results in particular in the slowing down of reaction kinetics which could penalize the principle of polishing and competition with the diffusion of reagents. (oxidizing agents and complexing agents).
  • the aluminum is present at a concentration ranging from approximately 1 to 50 g/L, i.e. 0.037 and 1.85 mol/L, preferably at a concentration ranging from approximately 1 to 30 g/L, i.e. 0.037. and 1.1 mol/L.
  • concentrations being more lower than what is traditionally observed for a chemical pickling bath for example, the bath used here is therefore indeed a polishing bath.
  • the bath has a density ranging from 1.6 to 1.8 g/cm 3 .
  • the concentration ranges mentioned must be understood in the broadest possible sense, i.e. by including the upper and lower limit values of said concentration ranges.
  • the term “approximately” means a range of values between ⁇ 10% of the indicated value.
  • the invention proposes a process for chemical polishing of a part made of aluminum or aluminum alloy, or a part thereof using the chemical polishing bath as described above.
  • these concentrations can be determined by dosage.
  • the determination of the different chemical species can be carried out by acid-base titration in a non-aqueous medium, by thermo-titration or by spectrophotometry.
  • the temperature of the polishing bath during immersion of the part to be polished is between 70°C and 100°C, preferably between 80°C and 90°C.
  • the duration of immersion of the aluminum or aluminum alloy part in the polishing bath is between 5 and 15 minutes, preferably between 7 and 12 minutes, even more preferably the duration of immersion is equal 10 minutes away.
  • the temperature of the bath has an influence on the reaction kinetics of the polishing process, and in particular on the attack speed of the aluminum. The higher the temperature, the more quickly the attacking agents (oxidizing agent, sulfuric acid or phosphoric acid) and complexing agents act. The difference that exists between the reaction speed of the reagents and their diffusion is accentuated, which improves the polishing process and the results obtained, ie a reduction in surface roughness while limiting the reduction.
  • the haircut observed for a part polished using a chemical polishing bath or a chemical polishing process according to the invention has a haircut of less than 300 ⁇ m.
  • the parameter Sa can be considered more relevant than Ra when it comes to quantifying the roughness, or a reduction in roughness, of a surface because it is an arithmetic average roughness measured on a surface and not more only along a line like Ra.
  • the aluminum or aluminum alloy parts polished using a chemical polishing bath according to the invention advantageously have a Sa of the order of 1 ⁇ m.
  • the expression “of the order of 1 ⁇ m” means between 1 and 5 ⁇ m.
  • a degreasing and/or chemical stripping step can be carried out on the surface of the part to be polished before the step of immersing said part or the part thereof to be polished, in the polishing bath.
  • chemical Such a step of preparing the surface makes it possible to clean it and in particular to facilitate access thereto to the oxidizing and/or complexing agents reacting with said surface during the chemical polishing process, increasing its effectiveness.
  • the chemical polishing bath according to the invention or the process using such a bath are particularly well suited to aluminum alloys.
  • the present chemical polishing bath as well as the present polishing process have been developed in particular for aluminum alloys belonging to the 10000 to 70000 series, in particular to the 40000 alloy family, more particularly the aluminum alloy is AS7G06 alloy of type 42200. As is known in the field, these alloys are particularly difficult to polish due to their high silicon (Si) content while being widely used in particular in the automobile industry, which increases the interest in the development of such a chemical polishing bath.
  • the part to be polished in whole or in part using a chemical polishing bath according to the invention or the process using such a bath is a part made of aluminum or an aluminum alloy obtained by a process additive manufacturing, or three-dimensional printing.
  • the present chemical polishing bath or the present chemical polishing process finds particular application for the treatment of parts produced for the aerospace, aeronautics and automobile industries, to eliminate surface irregularities and thus prevent the risk of particle separation. of the surface of said parts in service, which could generate functional problems linked to their use such as the blocking of pipes, or the reduction of their static and/or dynamic mechanical properties.
  • the present invention surprisingly provides a polishing bath allowing a significant reduction in roughness, without increasing the haircut, whereas these two effects generally require antagonistic parameters.
  • the increased viscosity of the bath controlled by the sulfuric and phosphoric acids, slows down the phenomena of diffusion of chemical species from the solution towards the surface of the part. This depletion of the surface in active species, due to their consumption in the vicinity of the surface, is responsible for a polishing effect on the surface by selective dissolution of the surface relief.
  • AS7G06 aluminum alloy parts referenced from A to D from the same additive manufacturing process are in the form of a plate measuring 60 x 40x 6 mm.
  • the so-called upper side is the side on which the layers of material are added one after the other during the manufacturing process, while the lower side is the opposite side.
  • the plates first underwent a step of degreasing and chemical stripping with nitric acid in order to prepare their surface, according to conventional processes well known to those skilled in the art.
  • the four parts A to D are then each partially covered using self-adhesive masking tape.
  • the partially masked aluminum alloy parts A and B thus obtained were then subjected to chemical polishing processes using polishing baths of different compositions referenced 1 and 2, according to two preferred but non-limiting embodiments of the invention. .
  • the partially masked aluminum alloy parts C and D thus obtained were subjected to chemical polishing processes using comparative polishing baths, of different compositions and not in accordance with the present invention, referenced 3 and 4.
  • the four different baths 1 to 4 were carried out in similar tanks, with solution volumes of 4 L; their compositions are detailed in Table 1.
  • the high viscosity of the polishing bath typically density of 1.6 to 1.8 g/cm 3
  • the local inhomogeneities of concentrations due to the thickness of the diffusion layer
  • the agitation of the bath when the part to be treated is immersed in it is strictly controlled.
  • the bath is preferably stirred with a lower stirring speed when the part to be polished is immersed (treatment phase) than during the preparation of the polishing bath (homogenization phase). This stirring speed is typically between 5 and 10 L/min during the treatment phase and around 100 L/min during the homogenization phases.
  • stirring speed values are given by way of example only and do not constitute a limitation of the present invention.
  • the speed of agitation influences the renewal of the chemical species present in the layer of liquid, called the diffusion layer, in the vicinity of the part to be treated, a lower speed of agitation allows the formation of a diffusion layer thicker, which slows down the diffusion of reagents and promotes polishing.
  • the treated part After immersion in the polishing bath, the treated part is rinsed then observed under a confocal microscope in order to determine the reduction in its roughness and its haircut.
  • the self-adhesive masking tape is removed and an area comprising a treated surface and an untreated surface (because previously masked by the self-adhesive masking tape) is observed using an Olympus DSX510 microscope .
  • the topography of each surface is recorded and analyzed in order to determine the reduction due to the removal of material and the variations in roughness parameters due to the polishing effect of the different baths.
  • parts A to D obtained by the additive manufacturing process have a similar surface condition before polishing.
  • parts A to D After polishing, parts A to D all suffered a reduction on each of their faces (Table 2).
  • THE Fig.2b and Fig.3b as well as Table 2 indicate a strong reduction in the surface relief of the parts treated with the two baths according to the invention, and therefore a polishing of parts A and B.
  • part B has a greater discount than part A (Table 2), which can be linked to a catalyst concentration doubled between bath 2 and bath 1. The catalyst in fact favors the chemical attack and therefore haircut.
  • bath 3 is a chemical machining bath and not a chemical polishing bath.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
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Claims (14)

  1. Chemisches Polierbad zum Polieren eines Werkstücks aus Aluminium oder aus Aluminiumlegierung, oder eines Teils eines solchen, wobei das chemische Polierbad Folgendes umfasst:
    - ein Oxidationsmittel, das dazu befähigt ist, Aluminium anzugreifen, wobei es aus Salpetersäure, Wasserstoffperoxid, Permanganat oder einer von deren Mischungen ausgewählt ist, in einer Konzentration von 1,2 bis 3,0 mol/L;
    - ein Fluorid-Komplexierungsmittel, das dazu befähigt ist, einen Komplex mit dem oxidierten Aluminium zu bilden, in einer Konzentration von 0,3 bis 1,6 mol/L;
    - einen Katalysator, bei dem es sich insbesondere um Kupfer handelt; und
    - Phosphorsäure in einer Konzentration von 10,10 bis 14,30 mol/L sowie Schwefelsäure in einer Konzentration von 1,50 bis 3,60 mol/L.
  2. Chemisches Polierbad nach Anspruch 1, wobei das Fluorid-Komplexierungsmittel dem Bad in Form von NH4F.HF, NaF.HF, KF.HF, SiF6 oder deren Mischungen zugesetzt wird.
  3. Chemisches Polierbad nach Anspruch 1 oder 2, wobei das Fluorid-Komplexierungsmittel in einer Konzentration von 0,6 bis 1,2 mol/L, vorzugsweise von 0,8 bis 1,1 mol/L, vorliegt.
  4. Chemisches Polierbad nach einem beliebigen der vorhergehenden Ansprüche, wobei das Oxidationsmittel in einer Konzentration von 1,3 bis 2 mol/L, vorzugsweise von 1,4 bis 1,6 mol/L, vorliegt.
  5. Chemisches Polierbad nach einem beliebigen der vorhergehenden Ansprüche, wobei die Phosphorsäure in einer Konzentration von 11 bis 13 mol/L, vorzugsweise von 11,5 bis 12 mol/L, vorliegt und/oder die Schwefelsäure in einer Konzentration von 1,6 bis 3 mol/L, vorzugsweise von 1,7 bis 2,2 mol/L, vorliegt.
  6. Chemisches Polierbad nach einem beliebigen der vorhergehenden Ansprüche, wobei das Kupfer zu 0,10 bis 0,20 mol/L vorliegt; und es dem Bad vorzugsweise in Form eines Kupfersalzes zugesetzt wird, wobei das Kupfersalz aus einer Gruppe ausgewählt ist, die sich aus Kupfersulfat, Kupfernitrat oder deren Mischungen zusammensetzt.
  7. Chemisches Polierbad nach einem beliebigen der vorhergehenden Ansprüche, wobei es Aluminium umfasst, das in einer Konzentration im Bereich von ungefähr 1 bis 50 g/L, entsprechend zwischen 0,037 und 1,85 mol/L, vorzugsweise in einer Konzentration im Bereich von ungefähr 1 bis 30 g/L, entsprechend zwischen 0,037 und 1,1 mol/L, vorliegt.
  8. Chemisches Polierbad nach einem beliebigen der vorhergehenden Ansprüche, wobei das Bad eine Dichte im Bereich von 1,6 bis 1,8 g/cm3 aufweist.
  9. Chemisches Polierverfahren zum Polieren eines Werkstücks aus Aluminium oder aus Aluminiumlegierung, oder eines Teils eines solchen, wobei es die folgenden Schritte umfasst:
    (i) Bereitstellen eines chemischen Polierbades nach einem beliebigen der vorhergehenden Ansprüche;
    (ii) Eintauchen eines zu polierenden Werkstücks aus Aluminium oder aus Aluminiumlegierung, oder eines Teils eines solchen, in das chemische Polierbad, welches vorzugsweise bei einer Temperatur im Bereich von 70 °C bis 100 °C, insbesondere von 80 °C bis 90 °C, gehalten wird;
    (iii) Entnehmen des Werkstücks nach einer vorbestimmten Eintauchdauer.
  10. Chemisches Polierverfahren nach Anspruch 9, wobei die Eintauchdauer im Bereich von 5 bis 15 Minuten, vorzugsweise im Bereich von 7 bis 12 Minuten liegt, wobei die Eintauchdauer mit noch größerem Vorzug 10 Minuten beträgt.
  11. Chemisches Polierverfahren nach Anspruch 9 oder 10, wobei das Bad während des Eintauchens gerührt wird, vorzugsweise mit einer Rührgeschwindigkeit im Bereich von 5 bis 10 L/min.
  12. Chemisches Polierverfahren nach Anspruch 9, 10 oder 11, wobei das zu polierende Werkstück aus Aluminium oder aus Aluminiumlegierung, oder das Teil eines solchen, einem Schritt des Entfettens und/oder chemischen Beizens unterzogen wird, bevor es in das chemische Polierbad eingetaucht wird.
  13. Chemisches Polierbad nach einem der Ansprüche 1 bis 8, oder chemisches Polierverfahren nach einem der Ansprüche 9 bis 12, wobei das zu polierende Werkstück, oder das Teil eines solchen, aus einer Aluminiumlegierung ist, welche den Serien 10000 bis 70000 angehört, besonders der Legierungsfamilie 40000, wobei es sich bei der Aluminiumlegierung insbesondere um die Legierung AS7G06 des Typs 42200 handelt.
  14. Chemisches Polierbad nach einem der Ansprüche 1 bis 8, oder chemisches Polierverfahren nach einem der Ansprüche 9 bis 12, wobei das zu polierende Werkstück aus Aluminium oder aus Aluminiumlegierung mittels eines additiven Fertigungsverfahrens erhalten wird.
EP21728021.3A 2020-05-20 2021-05-19 Bad zum chemischen polieren von aluminium und aluminiumlegierungen und verfahren zur verwendung eines solchen bades Active EP4153796B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2005136A FR3110604B1 (fr) 2020-05-20 2020-05-20 Bain de polissage chimique pour aluminium et alliages d'aluminium, et procédé utilisant un tel bain
PCT/EP2021/063294 WO2021234001A1 (fr) 2020-05-20 2021-05-19 Bain de polissage chimique pour aluminium et alliages d'aluminium, et procédé utilisant un tel bain

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EP4153796A1 EP4153796A1 (de) 2023-03-29
EP4153796B1 true EP4153796B1 (de) 2024-05-08

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US (1) US20230193476A1 (de)
EP (1) EP4153796B1 (de)
FR (1) FR3110604B1 (de)
WO (1) WO2021234001A1 (de)

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Publication number Priority date Publication date Assignee Title
FR1093415A (fr) * 1953-02-20 1955-05-04 Acorn Anodising Company Ltd Brillantage de l'aluminium
US3425881A (en) 1965-06-28 1969-02-04 Samuel L Cohn Chemical polishing of aluminum and aluminum alloys
US4530735A (en) * 1982-09-28 1985-07-23 Whitehurst Associates, Inc. Wet-process phosphoric acid brightening reagent for aluminum
CN106757039B (zh) * 2017-02-23 2019-03-26 浙江大学 一种铝氧化抛光液及其制备方法

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FR3110604B1 (fr) 2022-06-10
FR3110604A1 (fr) 2021-11-26
EP4153796A1 (de) 2023-03-29
WO2021234001A1 (fr) 2021-11-25
US20230193476A1 (en) 2023-06-22

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