EP3319166B1 - Dielektrisches filter, sende-empfänger und basisstation - Google Patents
Dielektrisches filter, sende-empfänger und basisstation Download PDFInfo
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- EP3319166B1 EP3319166B1 EP15909085.1A EP15909085A EP3319166B1 EP 3319166 B1 EP3319166 B1 EP 3319166B1 EP 15909085 A EP15909085 A EP 15909085A EP 3319166 B1 EP3319166 B1 EP 3319166B1
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- Prior art keywords
- dielectric filter
- hole
- blind hole
- debug
- dielectric
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- 230000008878 coupling Effects 0.000 claims description 40
- 238000010168 coupling process Methods 0.000 claims description 40
- 238000005859 coupling reaction Methods 0.000 claims description 40
- 238000006880 cross-coupling reaction Methods 0.000 claims description 20
- 230000005540 biological transmission Effects 0.000 claims description 15
- 230000001939 inductive effect Effects 0.000 claims description 12
- 238000004891 communication Methods 0.000 description 9
- 239000003989 dielectric material Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
- H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
- H01P1/2088—Integrated in a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
- H01P1/2053—Comb or interdigital filters; Cascaded coaxial cavities the coaxial cavity resonators being disposed parall to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
- H01P1/2056—Comb filters or interdigital filters with metallised resonator holes in a dielectric block
Definitions
- the present invention relates to a communication device component, and in particular, to a dielectric filter, a transceiver, and a base station.
- a dielectric filter has become an indispensable part in a modern mobile communications technology, and is widely applied to various mobile communications systems, to filter out a noise wave or an interference signal other than a communication signal frequency.
- the dielectric filter needs to use cross coupling to implement high selectivity of the dielectric filter.
- Cross coupling has two forms: capacitive coupling and inductive coupling.
- capacitive coupling a transmission zero is formed at a low end of a dielectric filter response, so as to form high selectivity at the low end of the dielectric filter.
- inductive coupling a transmission zero is formed at a high end of a dielectric filter response, so as to form high selectivity at the high end of the dielectric filter.
- a transmission zero of the dielectric filter usually can implement only inductive coupling.
- an additional structure such as a PCB or a cable needs to be bridged to a dielectric, or a near-cavity structure of non-cross coupling needs to be used.
- CA 2914434 A1 discloses embodiments that relate to the technical field of communications device components, and provide a dielectric resonator and a dielectric filter, a transceiver and a base station using the same, which solve the problem that a loss indicator of existing dielectric resonators cannot meet filtering requirements of a base station.
- the dielectric resonator comprises a body made of a solid dielectric material, wherein a recess is arranged on the surface of the body, and the surface of the body and the surface of the recess are covered by a conductive layer.
- a dielectric filter comprises at least two of the dielectric resonators.
- Another dielectric filter comprises a body made of a solid dielectric material, wherein at least two recesses are arranged on the surface of the body, a hole and/or groove is arranged between two adjacent recesses, and the surface of the body is covered by a conductive layer.
- the transceiver comprises the dielectric filter.
- the base station comprises the transceiver.
- WO 2014/190536 A1 discloses embodiments that provide a dielectric filter, which relates to the technical field of communication device assemblies and solves the problem that it is difficult for a solid dielectric filter to realize capacitive coupling.
- the dielectric filter provided in the embodiments of the disclosure comprises at least two dielectric resonators, and each dielectric resonator comprises a body made of a solid dielectric material and a debugging hole located on the surface of the body; the bodies of all the dielectric resonators included in the dielectric filter constitute a body of the dielectric filter, and the dielectric filter further comprises: at least one negative coupling hole, wherein each negative coupling hole is located on a position of the surface of the body where two dielectric resonators are connected, and the located position thereof is connected to the two dielectric resonators; and a conducting layer covering the surface of the body of the dielectric filter, the surface of the debugging hole and the surface of the negative coupling hole.
- the embodiments of the disclosure are mainly used for
- US 4,246,555 A discloses that multiple coupled high Q cavities are used to generate odd order elliptic function band-pass filters using a minimum number of cavities connected by simple and resonant coupling elements.
- a specific embodiment of a 3-pole, 20 MHz band-pass wave guide cavity filter centered at 3890 MHz is disclosed. Couplings between cavities may be either on the end walls or the side walls.
- the simple coupling elements may be simple coupling holes, and the resonant coupling elements may be a non-shorting screw in a window between cavities.
- Embodiments of the present invention provide a dielectric filter, to resolve a prior-art problem that an existing dielectric filter that can implement capacitive coupling occupies large space.
- an embodiment of this application provides a dielectric as defined in the appended claims.
- New structures inside the dielectric filter, the transceiver, and the base station provided in the embodiments of the present invention are used to implement capacitive coupling. This simplifies a manufacturing process, and further minimizes a structure of the dielectric filter.
- the embodiments of the present invention creatively propose a novel structure of a dielectric filter, to implement capacitive coupling without cascading an additional structure to a dielectric.
- the embodiments of the present invention are described in detail below with reference to the accompanying drawings. It should be noted that the accompanying drawings provided in the embodiments of the present invention are merely examples used to describe the embodiments of the present invention, and are not intended to limit the protection scope of the present invention.
- the dielectric filter includes at least three resonant cavities.
- a dielectric filter includes four resonant cavities.
- a main structure of a dielectric resonator includes a body (1).
- Four debug holes (11, 12, 13, and 14) are respectively disposed in four corners of the body (1).
- Through holes (101 and 102) are disposed between adjacent debug holes.
- the through hole is disposed through an upper surface and a lower surface of the body (1).
- both the through holes (101 and 102) are designed to be of a strip shape, and two ends of the through hole are respectively bent towards somewhere between two adjacent debug holes.
- the through hole (101) is used as an example.
- the through hole (101) is of a strip shape, and disposed through the upper surface and the lower surface of the body (1).
- One end (1011) of the strip shape of the through hole (101) is bent towards somewhere between the debug hole (11) and the debug hole (12), and the other end is bent towards somewhere between the debug hole (11) and the debug hole (14).
- the through hole (101) separates the debug hole (11) from another debug hole (such as 12 and 14), so that a resonant cavity is formed around the debug hole (11).
- the through hole (101) and the through hole (102) together separate the four debug holes, so that a single resonant cavity is separately formed around each debug hole. Therefore, the dielectric resonator shown in FIG. 1 includes four resonant cavities.
- each debug hole is disposed through the upper surface of the body (1), and the other end goes deep into the body (1), so as to form a concavity.
- a depth of the debug hole may be designed and manufactured according to a need, and different resonance frequencies can be obtained in formed resonant cavities by setting different depths for the debug holes. Depths of the debug holes may all be set according to a specific application scenario, and the depths may be set to be the same or different.
- a resonant cavity formed around the debug hole (12) and a resonant cavity formed around the debug hole (14) are not adjacent to each other.
- a blind hole (100) is disposed at a location shown in FIG. 1 : the blind hole (100) is disposed between the debug hole (12) and the debug hole (14).
- the blind hole (100) in this embodiment is designed to be of a strip shape.
- An upper end of the blind hole (100) is disposed through the upper surface of the body (1), and a lower end of the blind hole may be set according to a required depth.
- One end of the blind hole (100) is near to the resonant cavity formed by the debug hole (12), and the other end is near to the resonant cavity formed by the debug hole (14). Neither of the two ends of the blind hole (100) communicates with the debug hole (12) and the debug hole (14).
- the blind hole (100) communicates with neither of the through holes (101 and 102) that are located on two sides of the blind hole (100).
- the through hole and the debug hole in this embodiment of the present invention may be of a square shape, a circular shape, a strip shape, an oval shape, or another shape in plane. This is not limited in this embodiment of the present invention.
- the body (1) is generally made of a solid dielectric material, preferentially ceramics. With a relatively high dielectric constant, relatively excellent hardness and heat resistance, the ceramics have become a common solid dielectric material in the field of dielectric filters. Certainly, another material such as glass and an electrical-insulating macromolecular polymer known to a person skilled in the art may alternatively be selected as a dielectric material.
- the dielectric filter may be obtained in the following manner: forming the all-in-one body (1) with the debug hole, the through hole, and the blind hole; and then performing surface metallization such as surface plating on the body. In this way, the body of the dielectric resonator included in the dielectric filter is continuous.
- a manufacturing process of the dielectric filter can be simpler.
- a dielectric filter with more cavities is shown in FIG. 7 .
- the dielectric filter with more resonant cavities may be formed by means of cascading to a fixed structure with three cavities (as shown in FIG. 6 ) or four cavities.
- a blind hole is disposed between non-adjacent resonant cavities, to implement cross coupling.
- the blind hole (100) is related to coupling of the dielectric filter.
- a cross coupling form of the dielectric filter may be determined by determining a depth of the blind hole (100).
- the depth of the blind hole herein is a depth that the blind hole reaches into the inside of the body (1) of the dielectric filter from the upper surface of the dielectric filter.
- polarity of cross coupling of the dielectric filter can change from inductive coupling to capacitive coupling.
- the depth of the blind hole may be set according to a need in an actual application scenario, so that a degree of cross coupling varies.
- the depth of the blind hole is usually fixed after the depth of the blind hole is determined according to a need in an actual application scenario. Specifically, the depth of the blind hole is fixed after a corresponding depth of the blind hole is determined according to a desired cross coupling characteristic of the dielectric filter, such as a corresponding desired degree of inductive coupling. Correspondingly, the depth of the blind hole may alternatively be fixed after a corresponding desired degree of capacitive coupling is determined.
- the implementation of a fixed blind hole depth can ensure quality during manufacture, and can keep the quality stable in subsequent use as no parameter deviates.
- the depth of the blind hole of the dielectric filter may alternatively be designed to be tunable to adapt to application scenarios that require different parameters.
- the depth of the blind hole may be set according to a need in an actual application scenario, such as a frequency of a transmission zero or a desired degree of inductive coupling or capacitive coupling. This is not limited herein.
- blind hole there is one blind hole (100) between two non-adjacent resonant cavities, but more blind holes may alternatively be designed.
- a blind hole quantity, position, depth, and the like may be determined according to an actually required transmission zero quantity and/or frequency.
- a width of the blind hole (100) is related to the transmission zero. Specifically, a larger width of the blind hole indicates a smaller relative location of the transmission zero, and the relative location of the transmission zero to a location of a central frequency of the dielectric filter is greater than 1.
- the blind hole itself also has a resonance frequency.
- the resonance frequency of the blind hole is usually not used for resonance of a passband of the body of the filter. That is, the resonance frequency of the blind hole may be higher than a resonance frequency of the passband of the filter, or may be lower than a resonance frequency of the passband of the filter.
- cross coupling is inductive coupling.
- cross coupling is capacitive coupling.
- the resonance frequency of the blind hole may be determined by the depth of the blind hole. As the depth of the blind hole increases, the resonance frequency of the blind hole gradually decreases.
- cross coupling switches from inductive coupling to capacitive coupling.
- a depth of a blind hole is 2/5 of a total height of the dielectric filter
- cross coupling is inductive coupling
- a transmission zero is on the right side of a passband, as shown in FIG. 4 .
- the depth of the blind hole changes to 3/5 of the total height
- cross coupling is capacitive coupling
- the transmission zero is on the left side of the passband, as shown in FIG. 5 .
- a conducting layer is attached to the surface of the dielectric resonator, and conducting layers may also be attached to concave surfaces of the blind hole, the through hole, and the debug hole.
- the blind hole is disposed between the non-adjacent resonant cavities.
- capacitive coupling can be implemented inside the dielectric resonator without cascading an additional external structure, so that miniaturization of the dielectric filter is implemented.
- this solution simplifies a manufacturing process of a structure that implements cross coupling.
- the dielectric filter provided in this embodiment of the present invention is mainly applied to a radio frequency front end of a high-power wireless communications base station.
- An embodiment of the present invention further provides a transceiver.
- the dielectric filter provided in the foregoing embodiment is used in the transceiver.
- the dielectric filter may be configured to filter a radio frequency signal.
- An embodiment of the present invention further provides a base station.
- the transceiver provided in the foregoing embodiment is used in the base station.
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Claims (10)
- Dielektrischer Filter, umfassend einen dielektrischen Körper (1), wobei der dielektrische Filter ferner Folgendes umfasst:mindestens drei Resonanzhohlräume, die durch eine Fläche des Körpers (1) gebunden sind,wobei jeder Resonanzhohlraum ein Debug-Loch (11-14) umfasst, das Debug-Loch im Körper angeordnet ist und ein erstes Ende des Debug-Lochs durch eine obere Fläche des Körpers hindurch angeordnet ist, und ein zweites Ende des Debug-Lochs tief in den Körper hineinreicht, jedes Debug-Loch und der Hüllkörper des Debug-Lochs einen einzelnen Resonanzhohlraum bilden, der dielektrische Filter ferner ein Blindloch (100) umfasst, das zwischen zwei Resonanzhohlräumen angeordnet ist, die nicht aneinander angrenzen, das Blindloch nicht mit dem Debug-Loch verbunden ist und das Blindloch dazu konfiguriert ist, eine Kreuzkopplung zu implementieren, und der dielektrische Filter ferner mindestens ein Durchgangsloch (101, 102) umfasst,dadurch gekennzeichnet, dass das Blindloch in Form einer Nut vorliegt und mindestens ein Durchgangsloch eine Streifenform aufweist, wobei beide Enden des Durchgangslochs in Richtung irgendeiner Stelle zwischen zwei benachbarten Debug-Löchern gebogen sind.
- Dielektrischer Filter nach Anspruch 1, wobei eine Tiefe des Blindlochs (100) mit einer Übertragungsnullstelle des dielektrischen Filters zusammenhängt.
- Dielektrischer Filter nach Anspruch 1 oder 2, wobei die Tiefe des Blindlochs (100) eine Kreuzkopplungspolarität des dielektrischen Filters bestimmt und die Polarität der Kreuzkopplung eine induktive Kopplung oder eine kapazitive Kopplung umfasst.
- Dielektrischer Filter nach Anspruch 3, wobei die Tiefe des Blindlochs (100) einen Grad der Kreuzkopplung des dielektrischen Filters bestimmt.
- Dielektrischer Filter nach einem der Ansprüche 1 bis 4, wobei die Tiefe des Blindlochs (100) mit der Polarität der Kreuzkopplung zusammenhängt und, wenn die Tiefe des Blindlochs zunimmt, die Polarität der Kreuzkopplung von einer induktiven Kopplung zu einer kapazitiven Kopplung wechselt.
- Dielektrischer Filter nach einem der Ansprüche 1 bis 5, wobei eine Breite des Blindlochs (100) mit der Übertragungsnullstelle zusammenhängt.
- Dielektrischer Filter nach Anspruch 6, wobei der Umstand, dass eine Breite des Blindlochs (100) mit der Übertragungsnullstelle zusammenhängt, Folgendes umfasst:
eine größere Breite des Blindlochs zeigt eine kleinere relative Position der Übertragungsnullstelle an, und die Position der Übertragungsnullstelle in Bezug auf eine zentrale Frequenz des dielektrischen Filters ist größer als 1. - Dielektrischer Filter nach einem der Ansprüche 1 bis 7, wobei eine Tiefe des Debug-Lochs (11-14) eine Resonanzfrequenz eines Resonanzhohlraums bestimmt, der dem Debug-Loch entspricht.
- Sendeempfänger, umfassend den dielektrischen Filter nach einem der Ansprüche 1 bis 8.
- Basisstation, umfassend den Sendeempfänger nach Anspruch 9.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2015/095791 WO2017088174A1 (zh) | 2015-11-27 | 2015-11-27 | 介质滤波器,收发信机及基站 |
Publications (3)
Publication Number | Publication Date |
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EP3319166A1 EP3319166A1 (de) | 2018-05-09 |
EP3319166A4 EP3319166A4 (de) | 2018-09-12 |
EP3319166B1 true EP3319166B1 (de) | 2020-07-01 |
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Application Number | Title | Priority Date | Filing Date |
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EP15909085.1A Active EP3319166B1 (de) | 2015-11-27 | 2015-11-27 | Dielektrisches filter, sende-empfänger und basisstation |
Country Status (4)
Country | Link |
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EP (1) | EP3319166B1 (de) |
JP (1) | JP6572391B2 (de) |
CN (2) | CN112886161B (de) |
WO (1) | WO2017088174A1 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108987863A (zh) * | 2018-09-18 | 2018-12-11 | 苏州市协诚五金制品有限公司 | 一种双零点交叉耦合陶瓷滤波器 |
CN109461995A (zh) * | 2018-12-27 | 2019-03-12 | 苏州艾福电子通讯有限公司 | 一种采用陶瓷介质的波导滤波器 |
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WO2020145590A1 (ko) * | 2019-01-08 | 2020-07-16 | 주식회사 케이엠더블유 | 도파관 필터 |
CN109546270B (zh) * | 2019-01-11 | 2020-07-28 | 华为技术有限公司 | 一种滤波器 |
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EP4037093A4 (de) * | 2019-09-27 | 2023-06-07 | Mobi Antenna Technologies (Shenzhen) Co., Ltd. | Keramischer dielektrischer filter |
CN115066806A (zh) * | 2019-11-13 | 2022-09-16 | 株式会社Kmw | 介质陶瓷滤波器 |
US10950918B1 (en) | 2019-12-02 | 2021-03-16 | The Chinese University Of Hong Kong | Dual-mode monoblock dielectric filter |
US11139548B2 (en) | 2019-12-02 | 2021-10-05 | The Chinese University Of Hong Kong | Dual-mode monoblock dielectric filter and control elements |
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KR102448010B1 (ko) * | 2020-11-24 | 2022-09-27 | (주)파트론 | 웨이브가이드 필터 |
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CN115528395A (zh) * | 2021-06-25 | 2022-12-27 | 华为技术有限公司 | 四角元件结构、介质滤波器及基站设备 |
CN117638435A (zh) * | 2023-12-05 | 2024-03-01 | 南京林业大学 | 一种交叉耦合介质波导滤波器和通信设备 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4246555A (en) * | 1978-07-19 | 1981-01-20 | Communications Satellite Corporation | Odd order elliptic function narrow band-pass microwave filter |
US4453146A (en) * | 1982-09-27 | 1984-06-05 | Ford Aerospace & Communications Corporation | Dual-mode dielectric loaded cavity filter with nonadjacent mode couplings |
JPS6119201A (ja) * | 1984-07-05 | 1986-01-28 | Murata Mfg Co Ltd | 分布定数形フイルタ |
JPS62161202A (ja) * | 1986-01-10 | 1987-07-17 | Tdk Corp | アンテナ共用器 |
US5608363A (en) * | 1994-04-01 | 1997-03-04 | Com Dev Ltd. | Folded single mode dielectric resonator filter with cross couplings between non-sequential adjacent resonators and cross diagonal couplings between non-sequential contiguous resonators |
JP3389819B2 (ja) * | 1996-06-10 | 2003-03-24 | 株式会社村田製作所 | 誘電体導波管型共振器 |
JP3506013B2 (ja) * | 1997-09-04 | 2004-03-15 | 株式会社村田製作所 | 多重モード誘電体共振器装置、誘電体フィルタ、複合誘電体フィルタ、合成器、分配器および通信装置 |
JPH11220307A (ja) * | 1998-01-30 | 1999-08-10 | Toko Inc | 誘電体フィルタ |
TW406467B (en) * | 1998-07-08 | 2000-09-21 | Samsung Electro Mech | Dielectric filter |
JP3580162B2 (ja) * | 1999-02-25 | 2004-10-20 | 株式会社村田製作所 | 誘電体フィルタ、誘電体デュプレクサ、通信機装置 |
JP2002158512A (ja) * | 2000-09-08 | 2002-05-31 | Murata Mfg Co Ltd | 誘電体共振器、誘電体フィルタ、誘電体デュプレクサ、および通信装置 |
JP3788369B2 (ja) * | 2001-04-10 | 2006-06-21 | 株式会社村田製作所 | 誘電体フィルタ、誘電体デュプレクサ、および通信装置 |
JP2004304761A (ja) * | 2003-03-18 | 2004-10-28 | Murata Mfg Co Ltd | チップ型共振部品 |
DE10320620B3 (de) * | 2003-05-08 | 2004-11-04 | Kathrein-Werke Kg | Hochfrequenzweiche |
WO2008019307A2 (en) * | 2006-08-04 | 2008-02-14 | Dielectric Laboratories, Inc. | Wideband dielectric waveguide filter |
CN102361117B (zh) * | 2011-09-29 | 2014-04-02 | 武汉虹信通信技术有限责任公司 | 一种基于容性交叉耦合飞杆的同轴腔体谐振器 |
CN202474159U (zh) * | 2012-01-10 | 2012-10-03 | 深圳市大富科技股份有限公司 | 一种腔体滤波器及腔体滤波器的交叉耦合结构 |
CN102544658A (zh) * | 2012-01-10 | 2012-07-04 | 深圳市大富科技股份有限公司 | 一种腔体滤波器及腔体滤波器的交叉耦合结构 |
CN202616376U (zh) * | 2012-06-19 | 2012-12-19 | 成都赛纳赛德科技有限公司 | 一种可调带阻滤波器 |
CN202797211U (zh) * | 2012-09-20 | 2013-03-13 | 武汉凡谷电子技术股份有限公司 | 滤波器容性交叉耦合结构 |
CN103855448A (zh) * | 2012-12-03 | 2014-06-11 | 武汉凡谷电子技术股份有限公司 | Tm模介质滤波器 |
WO2014190536A1 (zh) * | 2013-05-31 | 2014-12-04 | 华为技术有限公司 | 介质滤波器,收发信机及基站 |
EP2993727B1 (de) * | 2013-06-04 | 2019-03-20 | Huawei Technologies Co., Ltd. | Dielektrischer resonator und dielektrisches filter, sendeempfangsvorrichtung und basisstation damit |
CN204088527U (zh) * | 2014-10-13 | 2015-01-07 | 世达普(苏州)通信设备有限公司 | 具有正负可变换交叉耦合的波导双工器 |
CN104900951B (zh) * | 2015-04-08 | 2018-06-05 | 华为技术有限公司 | 介质滤波器和通信设备 |
CN105006615A (zh) * | 2015-07-15 | 2015-10-28 | 南京航空航天大学 | 一种siw带通滤波器 |
-
2015
- 2015-11-27 CN CN202110050984.4A patent/CN112886161B/zh active Active
- 2015-11-27 CN CN201580079291.0A patent/CN107534197B/zh active Active
- 2015-11-27 EP EP15909085.1A patent/EP3319166B1/de active Active
- 2015-11-27 JP JP2018530953A patent/JP6572391B2/ja active Active
- 2015-11-27 WO PCT/CN2015/095791 patent/WO2017088174A1/zh active Application Filing
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CN107534197B (zh) | 2021-01-15 |
WO2017088174A1 (zh) | 2017-06-01 |
CN107534197A (zh) | 2018-01-02 |
EP3319166A4 (de) | 2018-09-12 |
JP6572391B2 (ja) | 2019-09-11 |
JP2018526949A (ja) | 2018-09-13 |
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EP3319166A1 (de) | 2018-05-09 |
CN112886161B (zh) | 2022-03-29 |
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