EP3313670B1 - Verfahren und vorrichtung zum übertragen eines dekorabschnitts einer prägefolie - Google Patents

Verfahren und vorrichtung zum übertragen eines dekorabschnitts einer prägefolie Download PDF

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Publication number
EP3313670B1
EP3313670B1 EP16727161.8A EP16727161A EP3313670B1 EP 3313670 B1 EP3313670 B1 EP 3313670B1 EP 16727161 A EP16727161 A EP 16727161A EP 3313670 B1 EP3313670 B1 EP 3313670B1
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EP
European Patent Office
Prior art keywords
embossing
pressing surface
substrate
pressing
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP16727161.8A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3313670B8 (de
EP3313670A1 (de
Inventor
Markus Burkhardt
Tibor MANNSFELD
Gerhard AMMON
Thomas Löchner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hinderer and Muehlich & Co KG GmbH
Leonhard Kurz Stiftung and Co KG
Original Assignee
Hinderer and Muehlich & Co KG GmbH
Leonhard Kurz Stiftung and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102015110077.0A external-priority patent/DE102015110077A1/de
Application filed by Hinderer and Muehlich & Co KG GmbH, Leonhard Kurz Stiftung and Co KG filed Critical Hinderer and Muehlich & Co KG GmbH
Publication of EP3313670A1 publication Critical patent/EP3313670A1/de
Application granted granted Critical
Publication of EP3313670B1 publication Critical patent/EP3313670B1/de
Publication of EP3313670B8 publication Critical patent/EP3313670B8/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
    • B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
    • B44C1/17—Dry transfer
    • B44C1/1712—Decalcomanias applied under heat and pressure, e.g. provided with a heat activable adhesive
    • B44C1/1729—Hot stamping techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B44B5/02—Dies; Accessories
    • B44B5/028—Heated dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F19/00—Apparatus or machines for carrying out printing operations combined with other operations
    • B41F19/02—Apparatus or machines for carrying out printing operations combined with other operations with embossing
    • B41F19/06—Printing and embossing between a negative and a positive forme after inking and wiping the negative forme; Printing from an ink band treated with colour or "gold"
    • B41F19/064—Presses of the reciprocating type
    • B41F19/068—Presses of the reciprocating type motor-driven
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B44B5/02—Dies; Accessories

Definitions

  • the invention relates to a method and a device for transferring a decorative section of an embossing foil to a substrate.
  • embossing foils which contain, in particular, strongly cross-linking lacquer systems in the lacquer package, for example UV-cross-linking lacquer systems and/or lacquer systems with a high layer thickness, ie with a thickness greater than 5 ⁇ m of the transfer layer without a carrier film, it is very difficult to do so to create a clean separating edge during the embossing. In these cases, the film composite is not separated at the edge of the application tool, but in an undefined position.
  • the strong crosslinking leads to the formation of comparatively long or very long polymer chains in the paints, which influences the physical properties of the paints accordingly.
  • a comparatively Hard and brittle varnish breaks indefinitely during embossing, which can result in varnish flakes of different sizes as undesirable contamination.
  • a comparatively soft and elastic varnish for example, cannot break or can only break incompletely during embossing or can crack in an undefined manner, so that in the worst case scenario no separating edge is created.
  • embossing of this type stray residues of the transfer layer designed as a lacquer package, the aforementioned so-called flakes, are formed, which lead to contamination of the machines and thus to increased cleaning effort during the further processing of the embossed substrate. In extreme cases, these flakes can significantly increase production waste.
  • Flakes are parts of the transfer layer that have been detached from the carrier film and have not been applied to the substrate.
  • the flakes hang, without adhering to the substrate, on the parts of a decorative section applied to the substrate that adhere to the substrate and can either get stuck there or tear off in an uncontrollable manner during the further processing process, thereby causing corresponding disruptions in the processing process of the embossing film and/or the substrate cause.
  • Flakes can be very small, especially in the micrometer range and therefore, for example, dust-like, but can also be comparatively large, especially in the range of several millimeters or even centimeters in at least one direction of expansion.
  • a method and device for simultaneous hot stamping and cutting are described.
  • a decorative section is embossed onto a substrate and, in the same operation, the substrate with the embossed decorative section is cut out from the carrier film, which previously provided the decorative section, and the substrate.
  • US 5,517,336 A discloses a trading card with an interactive image and the production of such a trading card.
  • a decorative section is applied to the trading card using hot stamping.
  • the embossing foil, which previously provided the decorative section, is then removed from the trading card in the areas in which hot stamping was not carried out.
  • the object of the present invention is to provide an improved method that combines the advantages of a stable embossing film with the clean separation of the decorative sections from the carrier film.
  • the method according to the invention has the advantage that by forming, that is, mechanically pressing or imprinting the compression section in the transfer layer, a defined breaking edge is formed without damaging the carrier film.
  • the layers of the transfer layer are mechanically loaded in such a way that a predetermined breaking point can form at a defined position, which breaks easily under bending stress.
  • the bending stress is exerted in particular by the subsequent detachment of the carrier film from the applied decorative section at a specific detachment angle relative to the substrate.
  • the clean separation that can be achieved between the decorative section and the remaining embossing foil during transfer or when transferring the transfer layer from the carrier foil as a decorative section to the substrate is possible for every type Application, ie embossing or applying to the substrate, is advantageous.
  • the decorative section is applied, transferred or transferred, i.e. embossed, from the carrier layer to the substrate practically endlessly without taking into account the relative position between the substrate and the decorative section.
  • the decorative section is applied in a defined relative position to the substrate or transferred to it, for example in order to get a previously applied, for example printed, decoration in accordance with, ie in register with, the decorative section.
  • complementary partial decorations can be produced from printed decoration and embossed decoration, with a clean separation of the decorative section between these partial decorations being advantageous, in particular even necessary.
  • Register or register or register accuracy or register accuracy is to be understood as a positional accuracy of two or more elements and/or layers, here in particular the substrate and the embossing foil and/or the decorative section, relative to one another.
  • the register accuracy should be within a specified tolerance and be as low as possible.
  • the register accuracy of several elements and/or layers to one another is an important feature in order to increase process reliability.
  • the precise positioning can be carried out in particular by means of sensory, preferably optically detectable registration marks or register marks. These registration marks or register marks can either represent special separate elements or areas or layers or can themselves be part of the elements or areas or layers to be positioned.
  • Residual embossing foil is understood to mean the part of the embossing foil that does not include the decorative section of the embossing foil or a portion of this part.
  • the ratio of the pressing pressure to the embossing pressure can be in a range from greater than 1:1 to 10,000:1.
  • the pressing pressure is applied in a linear section or at least partially linear section.
  • This section can, for example, be elongated, straight, but also jagged or wavy.
  • the section can have an open shape, in particular as the line shapes mentioned, or alternatively also a closed contour, for example in a circular shape, elliptical shape, triangular shape or polygonal shape, in particular in a star shape.
  • the shape of the section at least partially determines the shape of the decorative section transferred to the substrate.
  • an embossing film designed as a strip can be processed in such a way that pieces of the transfer layer, which is also strip-shaped, are applied to the substrate as a decorative section and a pressure applied, for example in a line, defines the frontal outer edge of the applied decorative section.
  • an embossing film designed as a surface section can be processed in such a way that partial surface portions thereof, in particular so-called smaller patches, are applied to the substrate as a decorative section and a
  • pressing pressure applied with a closed contour defines the circumferential outer edge of the applied decorative section as a patch.
  • the width of the linear section can be in a range from 0.02 mm to 1 mm, in particular from 0.02 mm to 0.2 mm.
  • the distance of the at least one compression section from the edge of the decorative section is in a range of 0 mm to 2 mm.
  • the extent of the decorative section corresponds to the extent of the embossing surface of the embossing stamp.
  • the embossing device has the advantage that a compression section is formed in the transfer layer by the pressing surface of the folding element, that is to say is mechanically pressed or embossed without damaging the carrier film.
  • the layers of the transfer layer are mechanically loaded in such a way that a predetermined breaking point can form at a defined position, which breaks easily under bending stress.
  • the bending stress is exerted in particular by the subsequent detachment of the carrier film at a specific detachment angle relative to the substrate from the decorative section applied to the substrate.
  • the pressing surface is designed as a linear, spherical, rounded shape.
  • the spherical design has the advantage that the pressing surface does not act as a cutting edge and therefore no indentation in the carrier film and therefore does not damage the carrier film or otherwise mechanically weaken it.
  • the width of the pressing surface can be in a range from 0.02 mm to 1 mm, in particular from 0.02 mm to 0.2 mm.
  • the width is the effective width of the pressing surface, i.e. the width of the effective cross section.
  • the folding element can be connected in one piece to the embossing die or, alternatively, can be present as a separate component which is attached to the embossing die.
  • the pressing surface is aligned with the embossing surface.
  • the pressing surface is arranged with a projection parallel to the embossing surface or in the vertical direction closer to the embossing foil than the embossing surface.
  • the pressing surface should not protrude more than 50% of the thickness of the carrier film in order to definitely avoid damage to the carrier film.
  • projections of in particular 10% to 20% of the thickness of the carrier film are sufficient to achieve a clean separation with as little mechanical stress as possible on the carrier film.
  • the projection of the pressing surface relative to the embossing surface is larger, in particular 50% to 1000%, preferably 50% to 700% of the thickness of the carrier film. This supports a clean separation of transfer layers, which have a high level of mechanical stability.
  • the supernatant amounted to about 50% to about 1000%, preferably about 50% to about 700%, of the thickness of the carrier film.
  • the carrier film in these experiments was made of PET.
  • the width of the pressing surface was approximately 0.01 mm to approximately 0.10 mm, preferably approximately 0.02 mm to approximately 0.05 mm.
  • the distance between the pressing surface and the embossing surface was approximately 0 mm, that is, the pressing surface and the embossing surface are arranged directly adjacent to each other with no distance between them.
  • the carrier film can have a thickness of 10 ⁇ m to 50 ⁇ m. Tests have shown that the carrier film should not be less than a certain thickness, in particular 10 ⁇ m, because the mechanical stress on the carrier film caused by the pressing surface could otherwise lead to the film tearing during further processing.
  • the carrier film can consist of a single layer of film or alternatively can consist of a laminate made of different or the same films.
  • the distance between the pressing surface and the embossing surface can be in a range of 0 mm to 2 mm. This small distance affects the appearance of the transferred decorative section as little as possible.
  • the distance between the pressing surface and the embossing surface is approximately 0.1 mm to 2 mm. This distance is advantageous so that there is an alternating load on the embossing foil the adjacent arrangement of embossing surface, distance and pressing surface acts and a predetermined breaking point can thereby form in the layers of the transfer layer in a particularly advantageous manner.
  • the embossing foil can expand upwards, in particular into the distance, whereas the embossing foil is pressed downwards under the embossing surface and the pressing surface.
  • a distance can be dispensed with entirely because the pressing surface then acts separately on the embossing foil for a certain time when the embossing die is lowered onto the embossing foil and the embossing foil can avoid being pressed in the areas adjacent to the pressing surface and no separate distance has to be necessary for this.
  • a distance can also be provided in this case in addition to the projection.
  • an underlay element below the substrate, that is to say on the side of the substrate facing away from the pressing surface and the embossing surface, at least in the area of the pressing surface acting on the substrate.
  • This base element in particular has a thickness of approximately 0.5 ⁇ m to 200 ⁇ m, preferably of approximately 0.5 ⁇ m to 100 ⁇ m, and can increase the effect of the pressing surface on the substrate in such a way that the substrate is compressed somewhat more strongly between the pressing surface and the base element. is compressed. This allows the creation of a predetermined breaking point to be promoted even better.
  • the base element is preferably made of a material with similar properties to the substrate, for example paper or plastic.
  • the base element can also be made of metal or metal alloys or silicone.
  • the base element can be a single element or can also be composed of several elements placed one on top of the other, so that an accurate and sensitive adjustment of the overall thickness of the base element can be carried out using these individual elements, each with a small thickness.
  • Such an individual element can be, for example, 0.5 ⁇ m to 50 ⁇ m, in particular 5 ⁇ m to 35 ⁇ m thick.
  • the appearance of the transferred decorative section is also determined by the nature of the substrate, in particular its surface roughness.
  • the pressing surface interacts with the substrate as a counter-pressure element. The lower the surface roughness of the substrate, the more defined this interaction is and the more precisely the transferred decorative section can be separated.
  • the distance can be adjusted by means of a spacer element arranged between the folding element and the embossing punch.
  • the spacer element can be, for example, a spacer plate or a spacer disk. It is also possible to stack several spacer elements on top of each other in order to be able to adjust the distance sensitively.
  • the distance can be adjusted by means of an adjusting device arranged between the folding element and the embossing die is.
  • an adjusting screw with a fine thread can be provided as an adjusting device.
  • the pressing surface is designed to be vertically adjustable. This version can be used in particular in test operations or to adapt to different qualities of the embossing foil.
  • the folding element can have elongated holes through which fastening screws pass, the pressing surface arranged on the folding element being vertically adjustable after loosening the fastening screws.
  • one or more spacer plates can be arranged between a straightening plate and the embossing surface and then the folding element can be lowered so that the pressing surface rests flush on the straightening plate.
  • the flush support can be checked, for example, using the light gap method. After tightening the fastening screws, the spacer plate(s) can be removed and the embossing stamp can be inserted into the embossing station.
  • the pressing surface is designed to be vertically adjustable by an adjusting device arranged between the folding element and the embossing die.
  • the adjusting device can be designed as a screw gear. Because of the desired sensitive adjustment in the micrometer range, it is advantageous to provide a differential screw gear whose output path is determined by the difference in the thread pitches of the two interacting screws.
  • the adjusting device is designed as a cam mechanism.
  • An eccentric gear can advantageously be provided as a cam gear, the eccentricity of which determines the maximum adjustment path.
  • the folding element and the embossing stamp are formed in one piece.
  • the one-piece design can preferably be provided to form a folding element that encloses the entire embossing surface, or to provide an embossing die intended for series use.
  • the distance between the pressing surface and the embossing surface is designed as a groove.
  • the groove can be introduced with high precision, for example, by laser processing.
  • the Fig. 1 and 2 show a first exemplary embodiment of the embossing device 1 according to the invention in a schematic representation.
  • the embossing device 1 is designed as a stroke embossing device and for the roll-to-roll process, in which both a substrate 2 to be embossed and an embossing film 3 are provided on supply rolls 4.
  • the embossing film 3 comprises a carrier film 31, a release layer 32, a transfer layer 33 and an adhesive layer 34 (see Fig. 3 ).
  • the structure of the embossing foil 3 is further down Fig. 9 described in more detail.
  • the embossing foil 3 and the substrate 2 are fed to an embossing station 5 with a vertically movable embossing stamp 6, the substrate 2 resting with its underside on an embossing base 7 in the embossing station 5.
  • the embossing foil 3 lies with its adhesive layer 34 on the top of the substrate 2.
  • the embossing die can also be used as a rolling one Embossing wheel or be designed as a curved embossing stamp that rolls over its curvature.
  • the embossing stamp 6 has a heated embossing surface 6p on its end face facing the embossing base 7, the dimensions of the embossing surface 6p defining the dimensions of a decorative section 3d to be transferred from the embossing foil 3 to the substrate.
  • a folding element 8 is arranged with a linear pressing surface 8p spaced from the edge of the embossing surface 6p (see Fig. 3 ).
  • the pressing surface 8p is designed as a spherical surface. The distance a of the pressing surface 8p from the edge of the embossing surface 6p is approximately 0.1 mm to 0.2 mm.
  • the pressing surface 8p is aligned with the embossing surface 6p in a plane parallel to the embossing foil and the substrate, so it does not protrude from the embossing surface 6p in the direction of the embossing foil.
  • the pressing surface 8p it is also possible for the pressing surface 8p to protrude downwards (in the direction of the embossing film) relative to the embossing surface 6p by a maximum of 50% of the thickness of the carrier film 31.
  • the embossing stamp 6 is arranged at a distance from the embossing film 3 and the substrate 2 ( Fig. 1 ).
  • the embossing stamp 6 is lowered onto the embossing film 3 and the substrate 2 and applies the embossing film 3 to the substrate 2, forming an embossing pressure p p .
  • the heated embossing surface 6p of the embossing stamp 6 activates the adhesive layer 34 of the embossing foil 3 in the area of the embossing surface 6p and connects the embossing foil 3 in the area of the decorative section 3d to the substrate 2.
  • the embossing foil 3 is in the area of the pressing surface 8p, forming a pressing pressure p k pressed together, with material of the embossing foil 3 on the side of the pressing surface 8p is displaced.
  • the pressing pressure p k the layers of the embossing film 3 arranged below the carrier film 31 are mechanically loaded in a band-shaped compression section 8v. These layers are primarily lacquer layers.
  • the lacquer layers are deformed differently in a small space due to the mechanical load acting in the area of the pressing surface 8p and the simultaneous relief in the area of the distance between the embossing surface 6p and the pressing surface 8p, that a predetermined breaking point is formed in the area of the compression section 8v, which breaks under the bending stress caused by the removal of the carrier film.
  • the embossing die 6 is raised and returned to the first working position ( Fig.1 ) brought.
  • the carrier film 31 is downstream behind the Embossing station 5 guided over a deflection roller 10.
  • the carrier film 31 is removed from the transfer layer 33 behind the deflection roller 10 and a residual embossing film 3r, comprising the carrier film 31, remaining residues of the transfer layer 33 and the adhesive layer 34, is fed to a first winding roller 9.
  • the detachment of the carrier film 31 is supported by the detachment layer 32.
  • the embossed substrate 2 is fed to a second take-up roll 9.
  • Pairs of transport rollers 11 are provided for transporting the substrate 2 and the embossing film 3.
  • the folding element 8 is in the in Fig. 1 to 3
  • First exemplary embodiment shown is formed in one piece with the embossing stamp 6.
  • a groove-shaped recess is provided to form a distance a between the pressing surface 8p and the edge of the embossing surface 6p.
  • the one in the Fig. 1 to 3 In a plan view not shown here, the recess shown in cross section can, for example, be elongated, straight, but also jagged or wavy.
  • the recess can have an open shape, in particular as the line shapes mentioned, or alternatively also a closed contour, for example in a circular shape, elliptical shape, triangular shape or polygonal shape, in particular in a star shape.
  • the embossing die 6 has a rectangular embossing surface 6p, with a folding element 8 being arranged on two opposite sides of the embossing die 6, the pressing surface 8p of which runs parallel to the adjacent edge of the embossing surface 6p.
  • the pressing surface 8p of the folding element 8 is aligned with the embossing surface 6p of the embossing punch 6.
  • the folding elements 8 and the embossing die 6 are connected to one another by fastening screws 12, which engage in threaded holes in the embossing die 6.
  • the distance a of the pressing edge 8k from the edge of the embossing surface 6p is determined by the thickness of a spacer plate 13 which is arranged between the folding element 8 and the embossing die 6. It is also possible to provide a stack of several thin spacer plates instead of one spacer plate in order to be able to adjust the distance a sensitively.
  • the third exemplary embodiment shown is designed like the one described above, with the difference that 8 elongated holes are provided in the folding element, through which the fastening screws 12 pass, and that the distance a of the pressing edge 6k from the edge of the embossing surface 6p is provided by spacer disks 14 instead of one Spacer plate is defined.
  • the elongated holes enable the depth of the pressing surface 8p of the folding element 8 to be adjusted relative to the embossing surface 6p.
  • a spacer plate can be arranged between a straightening plate and the embossing surface 6p and then the folding elements 8 can be lowered so that the pressing surfaces 8p lie flush on the straightening plate.
  • the flush support can be checked, for example, using the light gap method. After tightening the fastening screws 12, the spacer plate can be removed and the embossing stamp 6 can be inserted into the embossing station 5.
  • Figs. 6 and 7 show a fourth exemplary embodiment, in which the distance a of the pressing edge 8k from the edge of the embossing surface 6p is designed to be non-adjustable due to the formation of the folding element 8 with a recessed pressing surface 8p.
  • a depth adjustment of the pressing surface 8p of the folding element 8 is provided relative to the embossing surface 6p.
  • the depth adjustment is realized by a screw gear 15, which includes an adjusting screw 15s and an adjusting wheel 15e.
  • the adjusting screw 15s is designed with a fine thread.
  • the adjusting screw 15s is rigidly connected to the upper end portion of the folding element 8 and engages a threaded hole of the adjusting wheel 15e.
  • the adjustment wheel 15e can have a scale in order to be able to reproduce the adjustment path of the screw gear 15.
  • the embossing stamp 6 has a projecting upper end section in which the screw gear 15 is arranged.
  • the adjusting screw 15s is mounted in a through hole that extends vertically through the upper end section.
  • the adjusting wheel 15e is arranged in a horizontal slot-shaped receptacle of the upper end section of the embossing die 6 and is therefore not axially displaceable.
  • fastening screws 12 are provided, which pass through the elongated holes of the folding element 8.
  • a double screw gear 16 which comprises a first adjusting screw 16s and a second adjusting screw 26t, which are designed with different thread pitches, the first adjusting screw 16s being adjustable from the outside and in a vertical threaded hole of a projecting upper end portion of the embossing die 6 engages, and the second adjusting screw 16t engages in a central threaded hole of the first adjusting screw 16s and is rigidly connected to the upper end portion of the folding element 8.
  • Fig. 9 shows the layered structure of an embossing film 3 used in the embossing device 1 according to the invention, the schematic representation approximately representing the thickness ratios of the embossing film 3.
  • the carrier film 31 is designed as a PET film with a layer thickness of 19 ⁇ m.
  • the release layer arranged between the carrier film 31 and the transfer layer 33 is a lacquer layer with a thickness of 0.5 ⁇ m to 1 ⁇ m.
  • the thickness of the transfer layer 33 is between 5.5 ⁇ m and 70 ⁇ m.
  • the adhesive layer 34 is a hot-melt adhesive layer that can be activated thermally.
  • the adhesive layer 34 is made of PVC with a layer thickness of 1 ⁇ m to 10 ⁇ m.
  • the embossing temperature is in a range from 80 ° C to 250 ° C, preferably in a range from 100 ° C to 200 ° C, depending on the embossing station 5 and the substrate 2.
  • the embossing pressure is in a range from 1 kN/cm 2 to 10 kN/cm 2 .
  • the embossing time is in a range from 1 ms to 1000 ms, in particular in a range from 1 ms to 500 ms.

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  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Duplication Or Marking (AREA)
  • Decoration By Transfer Pictures (AREA)
  • Printing Methods (AREA)
EP16727161.8A 2015-06-23 2016-05-31 Verfahren und vorrichtung zum übertragen eines dekorabschnitts einer prägefolie Active EP3313670B8 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102015110077.0A DE102015110077A1 (de) 2015-06-23 2015-06-23 Verfahren und Vorrichtung zum Übertragen eines Dekorabschnitts einer Prägefolie
DE102015116514 2015-09-29
DE102015119888 2015-11-17
PCT/EP2016/062291 WO2016206926A1 (de) 2015-06-23 2016-05-31 Verfahren und vorrichtung zum übertragen eines dekorabschnitts einer prägefolie

Publications (3)

Publication Number Publication Date
EP3313670A1 EP3313670A1 (de) 2018-05-02
EP3313670B1 true EP3313670B1 (de) 2024-03-27
EP3313670B8 EP3313670B8 (de) 2024-07-24

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US (1) US10870311B2 (ja)
EP (1) EP3313670B8 (ja)
JP (1) JP7007265B2 (ja)
CN (1) CN107921812B (ja)
AU (1) AU2016282545B2 (ja)
CA (1) CA2987998C (ja)
ES (1) ES2977728T3 (ja)
RU (1) RU2719139C2 (ja)
WO (1) WO2016206926A1 (ja)

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CN109910444B (zh) * 2018-12-10 2020-04-21 福建省张氏新材料科技有限公司 一种转印标生产设备及其工艺
DE102019127325A1 (de) * 2019-10-10 2021-04-15 Leonhard Kurz Stiftung & Co. Kg Beschichtungsvorrichtung zur Beschichtung eines Grundkörpers sowie ein Verfahren
CN113459713A (zh) * 2021-06-01 2021-10-01 苏州众和软包装技术有限公司 一种立体烫效果的软包装膜生产工艺
KR102538207B1 (ko) * 2022-08-10 2023-05-31 김창수 리튬 포일 제조장치
US20240109363A1 (en) * 2022-09-30 2024-04-04 Hallmark Cards, Incorporated Glitter alternative

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US20200031160A1 (en) 2020-01-30
AU2016282545B2 (en) 2021-03-25
US10870311B2 (en) 2020-12-22
WO2016206926A1 (de) 2016-12-29
JP7007265B2 (ja) 2022-01-24
EP3313670B8 (de) 2024-07-24
ES2977728T3 (es) 2024-08-29
CA2987998A1 (en) 2016-12-29
AU2016282545A1 (en) 2018-01-18
RU2018102085A3 (ja) 2020-02-25
CN107921812B (zh) 2020-10-23
CA2987998C (en) 2023-07-11
CN107921812A (zh) 2018-04-17
RU2018102085A (ru) 2019-07-23
EP3313670A1 (de) 2018-05-02
RU2719139C2 (ru) 2020-04-17

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