EP3248064A1 - Procédé de réduction du temps d'assemblage des films ordonnes de copolymère a blocs - Google Patents
Procédé de réduction du temps d'assemblage des films ordonnes de copolymère a blocsInfo
- Publication number
- EP3248064A1 EP3248064A1 EP16703593.0A EP16703593A EP3248064A1 EP 3248064 A1 EP3248064 A1 EP 3248064A1 EP 16703593 A EP16703593 A EP 16703593A EP 3248064 A1 EP3248064 A1 EP 3248064A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- todt
- block copolymer
- block
- mixture
- copolymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/003—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor characterised by the choice of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/34—Component parts, details or accessories; Auxiliary operations
- B29C41/46—Heating or cooling
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0085—Copolymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2353/00—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2453/00—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
Definitions
- the present invention relates to a method for reducing the assembly time of an ordered film comprising a block copolymer (BCP).
- BCP block copolymer
- the invention also relates to the compositions used to obtain these ordered films and the ordered films thus obtained which can be used in particular as masks in the field of lithography.
- the method which is the subject of the invention is particularly useful when it comes to obtaining large-area ordered films in times compatible with industrial production without this being to the detriment of the defectivity.
- the nanostructuration of a block copolymer of a surface treated by the process of the invention can take the forms such as cylindrical (hexagonal symmetry (symmetry of hexagonal network primitive "6mm") according to the notation of Hermann-Mauguin, or tetragonal / quadratic ("4mm” tetragonal lattice symmetry),, spherical (hexagonal symmetry ("6mm” or “6 / mmm” primitive hexagonal lattice symmetry), or tetragonal / quadratic (“4mm” tetragonal lattice symmetry) , or cubic (network symmetry "”)), Lamellar, or gyroid.
- the preferred form of nanostructuring is of the hexagonal cylindrical type.
- the method for self-assembly of block copolymers on a treated surface according to the invention is governed by thermodynamic laws.
- each cylinder is surrounded by 6 equidistant neighboring cylinders if there is no defect.
- Several types of defects can thus be identified. The first type is based on the evaluation of the number of neighbors around a cylinder constituted by the arrangement of the block copolymer, also called coordination defects. If five or seven cylinders surround the cylinder considered, it will be considered that there is a lack of coordination.
- the second type of defect considers the average distance between the cylinders surrounding the cylinder considered.
- the firing required for the self-assembly of a block copolymer can take times ranging from several minutes to several hours. .
- the method of the invention makes it possible to obtain nanostructured assemblies in the form of ordered films with a reduction in the time required for correct assembly compared to what is observed when only one block copolymer is used.
- the invention relates to a method for reducing the assembly time of an ordered film of block copolymer, said ordered film comprising a mixture of at least one block copolymer having an order - disorder transition temperature (TODT) and at least one Tg with at least one compound having no TODT, this mixture having a TODT lower than the TODT of the block copolymer alone, the process comprising the following steps:
- any block copolymer, whatever its associated morphology, may be used in the context of the invention, whether it concerns of diblock copolymer, linear or star triblock, linear multiblock, comb or star.
- these are diblock or triblock copolymers, and more preferably diblock copolymers.
- the order-disorder transition temperature TODT which corresponds to a phase separation of the constituent blocks of the block copolymer can be measured in different ways, such as DSC (differential scanning calorimetry, differential thermal analysis), SAXS (small angle X ray scattering, small angle X-ray scattering), static birefringence, dynamic mechanical analysis, DMA or any other method to visualize the temperature at which a phase separation occurs (corresponding to the disorder order transition). A combination of these techniques can also be used.
- n m-block copolymers n being an integer between 1 and 10 inclusive.
- n is between 1 and 5, inclusive, and preferably n is between 1 and 2 inclusive, and even more preferably n is 1, where m is an integer between 1 and 10, terminals included.
- m is between 1 and 5, inclusive, and preferably, m is between 1 and 4, including terminals, and more preferably m is equal to 1.
- block copolymers may be synthesized by any techniques known to those skilled in the art, among which mention may be made of polycondensation, ring-opening polymerization, anionic, cationic or radical polymerization, these techniques being controllable or not, and combined between they or not.
- radical polymerization they may be controlled by any known technique such as NMP ("Nitroxide Mediated Polymerization"), RAFT ("Reversible Addition and Fragmentation Transfer”), ATRP (“Atom Transfer Radical Polymerization") , INIFERTER ("Initiator-Transfer-Termination"), RITP ("Reverse Iodine Transfer Polymerization"), ITP (“Iodine Transfer Polymerization”).
- the block copolymers are prepared by controlled radical polymerization, more particularly by controlled polymerization with nitroxides, in particular N-tert-butyl-1-diethylphosphono-2,2-dimethylpropyl nitroxide. .
- the block copolymers are prepared by anionic polymerization.
- the constituent monomers of the block copolymers will be chosen from the following monomers: at least one monomer vinylic, vinylidene, diene, olefinic, allylic or (meth) acrylic.
- This monomer is chosen more particularly from vinylaromatic monomers such as styrene or substituted styrenes, in particular alpha-methylstyrene, silylated styrenes, acrylic monomers such as acrylic acid or its salts, alkyl acrylates and cycloalkyl acrylates.
- aryl such as methyl acrylate, ethyl acrylate, butyl acrylate, ethylhexyl acrylate or phenyl acrylate, hydroxyalkyl acrylates such as 2-hydroxyethyl acrylate, alkyl ether acrylates such as 2-methoxyethyl acrylate, alkoxy- or aryloxy-polyalkylene glycol acrylates such as methoxypolyethylene glycol acrylates, ethoxypolyethylene glycol acrylates, methoxypolypropylene glycol acrylates, methoxypolyethylene glycol-polypropylene glycol acrylates or mixtures thereof, acrylates of aminoalkyl such as 2- (dimethylamino) ethyl acrylate (ADAME), fluorinated acrylates, silyl acrylates, phosphor acrylates such as alkylene glycol phosphate acrylates, glycidyl, dicyclopentenyl
- the monomers will be chosen, without limitation, from the following monomers: At least one vinyl, vinylidene, diene, olefinic, allylic or (meth) acrylic monomer. These monomers are chosen more particularly from vinylaromatic monomers such as styrene or substituted styrenes, in particular alpha-methylstyrene, and acrylic monomers such as alkyl, cycloalkyl or aryl acrylates, such as methyl acrylate, dicyclohexyl acrylate and the like.
- vinylaromatic monomers such as styrene or substituted styrenes, in particular alpha-methylstyrene
- acrylic monomers such as alkyl, cycloalkyl or aryl acrylates, such as methyl acrylate, dicyclohexyl acrylate and the like.
- ether alkyl acrylates such as 2-methoxyethyl acrylate, alkoxy- or aryloxy-polyalkylene glycol acrylates such as methoxypolyethylene glycol acrylates, ethoxypolyethylene glycol acrylates and the like.
- methoxypolypropylene glycol acrylates methoxypolyethylene glycol-polypropylene glycol acrylates or mixtures thereof, aminoalkyl acrylates such as 2- (dimethylamino) ethyl acrylate (ADAME), fluorinated acrylates, silyl acrylates, phosphorus acrylates such as alkylene glycol phosphate acrylates, glycidyl acrylates, dicyclopentenyloxyethyl acrylates, methylene glycol alkyl, cycloalkyl, alkenyl or aryl acrylates such as methyl methacrylate (MMA), lauryl, cyclohexyl, allyl, phenyl or naphthyl, methacrylates of ether alkyl such as methacrylate 2-ethoxyethyl, alkoxy- or aryloxy-polyalkylene glycol methacrylates such as methoxypolyethylene glycol methacrylates,
- the block copolymers having an order-disorder transition temperature consist of block copolymer one of which blocks comprises a styrene monomer and the other block comprises a methacrylic monomer; more preferably, the block copolymers consist of block copolymer one of which blocks comprises styrene and the other block comprises methyl methacrylate.
- the compounds which do not have an order-disorder transition temperature will be chosen from block copolymers, as defined above, but also random copolymers, homopolymers and gradient copolymers. According to a preferred variant, the compounds are homopolymers or random copolymers and have a monomer composition identical to that of one of the block copolymer blocks having a TOD.
- the homopolymers or random copolymers comprise styrene or methacrylic monomers.
- random homopolymers or copolymers include styrene or methyl methacrylate.
- the compounds that do not have an order-disorder transition temperature will also be chosen from plasticizers, among which non-limiting examples are branched or linear phthalates such as di-n-octyl, dibutyl, -2-ethylhexyl phatalate, di-ethylhexyl, diisononyl, di-isodecyl, benzylbutyl, diethyl, di-cyclohexyl, dimethyl, linear di-undecyl, di-tridecyl linear, chlorinated paraffins, trimellitates, branched or linear, in particular di-trimellitate; ethyl hexyl, aliphatic esters or polymeric esters, epoxides, adipates, citrates, benzoates.
- plasticizers among which non-limiting examples are branched or linear phthalates such as di-n-octyl, dibutyl, -2-ethy
- the compounds that do not have an order-disorder transition temperature will also be chosen from fillers among which may be mentioned mineral fillers such as carbon black, nanotubes, of carbon or not, fibers, ground or not, stabilizing agents. (light, in particular UV, and heat), dyes, inorganic or organic photosensitive pigments such as porphyrins, photoinitiators, that is to say compounds capable of generating radicals under irradiation.
- mineral fillers such as carbon black, nanotubes, of carbon or not, fibers, ground or not, stabilizing agents. (light, in particular UV, and heat), dyes, inorganic or organic photosensitive pigments such as porphyrins, photoinitiators, that is to say compounds capable of generating radicals under irradiation.
- Compounds that do not have an order-disorder transition temperature will also be chosen from ionic compounds, polymeric or non-polymeric.
- a combination of the compounds mentioned may also be used in the context of the invention, such as a block copolymer having no TODT and a statistical copolymer or homopolymer having no TODT.
- a block copolymer having a TODT, a block copolymer which does not have TODT and a charge, a homopolymer or a random copolymer, for example having no TODT may be mixed.
- the invention therefore also relates to compositions comprising at least one block copolymer having a TODT and at least one compound, this or these compounds having no TODT.
- the TODT of the mixture which is the subject of the invention should be less than the TODT of the block copolymer organized alone, but should be greater than the glass transition temperature, measured by DSC (differential enthalpy analysis, Tg) of the block presenting the highest Tg. .
- DSC differential enthalpy analysis
- the composition comprising a block copolymer having an order-disorder transition temperature and at least one compound having no order-disorder transition temperature will exhibit a self-assembly at a lower temperature than that of the block-only copolymer.
- the ordered films obtained according to the invention have an assembly kinetics of less than 10 minutes, preferably less than 3 minutes and more preferably less than 1 minute.
- the baking temperatures allowing the self-assembly will be between the glass transition temperature, measured by DSC (differential enthalpy analysis, Tg) of the block having the highest Tg and the TODT of the mixture, preferably between 1 and 50 ° C. below the TODT of the mixture, preferably between 10 and 30 ° C below the TODT of the mixture, and more preferably between 10 and 20 ° C below the TODT of the mixture.
- DSC differential enthalpy analysis
- the product of the assembly temperature and the assembly time of the mixture comprising at least one BCP exhibiting at least one Tg and one TODT and at least one compound having no TODT is less than produces the assembly temperature and the time of assembly of a single block copolymer having a TODT, the temperatures being expressed in ° C and the assembly times being expressed in minutes.
- the method of the invention allows the deposition of ordered film on a surface such as silicon, silicon having a native or thermal oxide layer, germanium, platinum, tungsten, gold, titanium nitrides, graphenes, BARC (bottom anti-reflective coating) or any other anti-reflective layer used in lithography. Sometimes it may be necessary to prepare the surface. Among the known possibilities, there is deposited on the surface a random copolymer whose monomers may be identical in whole or in part to those used in the block copolymer composition and / or the compound to be deposited. In a pioneering article Mansky et al. (Science, vol 275 pages 1458-1460, 1997) describes this technology well, now well known to those skilled in the art.
- the surfaces may be said to be “free” (planar and homogeneous surface both from a topographic and chemical point of view) or to have structures for guiding the block copolymer "pattern", whether this guidance is chemical guidance type (called “chemistry-epitaxy guidance”) or physical / topographical guidance (called “graphoepitaxy guidance”).
- a solution of the block copolymer composition is deposited on the surface and then the solvent is evaporated according to techniques known to those skilled in the art such as the so-called “spin coating” technique, “Doctor Blade” “Knife system”, “slot die System” but any other technique can be used such as a dry deposit, that is to say without going through a prior dissolution.
- a heat treatment or solvent vapor is carried out, a combination of the two treatments, or any other treatment known to those skilled in the art, which allows the block copolymer composition to organize itself properly by nanostructuring itself, and so to establish the ordered film.
- the firing is carried out thermally at a temperature below the TODT of the mixture of copolymers with a compound.
- the nanostructuring of a block copolymer mixture having a TODT and a compound deposited on a surface processed by the process of the invention can take the forms such as cylindrical (hexagonal symmetry (symmetry of hexagonal network primitive "6mm") according to the Hermann-mauguin notation, or tetragonal / quadratic (symmetry of the original tetragonal network "4mm”) ), spherical (hexagonal symmetry ("6mm” or “6 / mmm” hexagonal lattice symmetry), or tetragonal / quadratic (“4mm” tetragonal lattice symmetry), or cubic (“mH” lattice symmetry)) , lamellar, or gyroid.
- the preferred form of nanostructuring is of the hexagonal cylindrical type.
- Example 1 T odt measurement by dynamic mechanical analysis. Two different molecular weight PS- ⁇ -PAM copolymers are synthesized by anionic polymerization, but commercially available products can also be used. The characterizations of these products are summarized in Table No. 1.
- the AMD makes it possible to measure the conservation modulus G 'and the loss module G' 'of the material and to determine the damping factor tanA defined as the ratio G' '/ G'.
- the measurements are made on an ARES type viscoelastic meter, on which the PLANS 25mm geometry is installed.
- the Air gap adjustment is performed at the initial temperature of 100 ° C.
- the sample pellet is placed between the planes inside the oven heated to 100 ° C, a slight normal force is applied to ensure the sample-to-plane contact and thus avoid slip problems that could distort the measurement. torque and therefore modules.
- the temperature sweep is performed at the frequency of 1Hz.
- the initial strain applied to the sample is 0.1%, then it is automatically adjusted to stay above the sensor sensitivity limit of 0.2 cm. boy Wut.
- the temperature varies from 100 to 260 ° C in the bearing mode with one measurement every two degrees and a temperature equilibrium time of 30 seconds before the measurement.
- the lower molecular weight block copolymer After the rubber tray, the lower molecular weight block copolymer has a G 'lower than G''thus reflecting the destructuring of the copolymer, hence the order-disorder transition.
- the T odt is thus defined as being the first intersection between G 'and G''.
- T odt is not observed in the case of the copolymer of higher molar mass, where at any time G 'remains greater than G ". This block copolymer do not present T odt below its degradation temperature.
- Table 2 The results of AMD analysis are summarized in Table 2 and the associated graphs are in Figure No. 1.
- Example 2 Films resulting from the self-assembly of block copolymers.
- the silicon substrates are cleaved into 2.5x2.5cm pieces, then the residual particles are removed under a stream of nitrogen.
- the substrates can be cleaned with either an oxygen plasma or a piranha solution (H 2 SO 4 / H 2 O 2 mixture in a proportion of 2: 1 by volume) for a few minutes and rinsed with distilled water.
- a solution of PS-r-PMMA as described in WO2013083919 typically 2% by weight in PGMEA (propylene glycol ether-methyl acetate)
- S / MMA composition is then deposited on the clean substrate by spin coating (or any another suitable technique known to those skilled in the art to make this deposit) so as to obtain a film ⁇ 70nm thick.
- the substrate is annealed at 220 ° C for 10 minutes (or any other suitable temperature / time pair) so as to perform the covalent grafting of a monolayer of molecules on the substrate; the excess of non-grafted molecules is removed by rinsing with PGMEA.
- the PS-j-PMMA block copolymer ("BCP") or block copolymer blend solution (typically 1% by mass in PGMEA) is dispensed onto the functionalized substrate by spin coating (or another technique) in order to obtain a dry film of desired thickness.
- the film is then annealed according to the chosen technique, for example a thermal annealing at 230 ° C.
- the substrate can be immersed for a few minutes in acetic acid and then rinsed with distilled water, or the film can undergo a very mild oxygen plasma, or a combination of these two techniques, in order to to increase the contrast between the different phases of the block copolymer film in order to facilitate imaging of the nanostructures by the chosen technique (SEM, AFM ).
- the block copolymer (or mixing) solution When the block copolymer (or mixing) solution is dispensed onto the functionalized substrate, the final BCP film thickness is set at 50 nm, and the annealing for self-organization of the nanostructures is carried out at 230.degree. a variable time ranging from 5 to 20 minutes, as illustrated in FIG.
- the block copolymer mixture produced is a mixture between the reference BCPs No. 2 and No. 3, at a level of 6: 4 (60% of No. 2 mixed with 40% of No. 3). It is noted that the mixture can be made either in the solid state (for example by mixing the BCPs in powder form) or in the liquid state (for example by mixing solutions of pure BCPs of the same concentrations; concentrations of the solutions are different, mixing will be done in order to respect the fixed ratio).
- PCO "Reference # 1" serves as a reference system for the study.
- the imaging is performed on a scanning electron microscope "CD - SEM H9300" from Hitachi. Images are taken at a constant magnification of 100,000, to facilitate comparison between different systems; each image measures 1349nm * 1349nm.
- FIG. 2 the assembly obtained for different assembly times is visualized with the block-only and mixed copolymer compositions.
- Mixed copolymer compositions exhibit less defect for the same assembly times. For a given defect rate it means that the mixed copolymer compositions will assemble more quickly.
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- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1550463A FR3031748B1 (fr) | 2015-01-21 | 2015-01-21 | Procede de reduction du temps d'assemblage des films ordones de copolymere a blocs |
PCT/FR2016/050116 WO2016116708A1 (fr) | 2015-01-21 | 2016-01-21 | Procédé de réduction du temps d'assemblage des films ordonnes de copolymère a blocs |
Publications (1)
Publication Number | Publication Date |
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EP3248064A1 true EP3248064A1 (fr) | 2017-11-29 |
Family
ID=53298499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP16703593.0A Withdrawn EP3248064A1 (fr) | 2015-01-21 | 2016-01-21 | Procédé de réduction du temps d'assemblage des films ordonnes de copolymère a blocs |
Country Status (9)
Country | Link |
---|---|
US (1) | US20180015645A1 (fr) |
EP (1) | EP3248064A1 (fr) |
JP (1) | JP2018505275A (fr) |
KR (1) | KR20170118743A (fr) |
CN (1) | CN107430330A (fr) |
FR (1) | FR3031748B1 (fr) |
SG (1) | SG11201705897YA (fr) |
TW (1) | TWI631170B (fr) |
WO (1) | WO2016116708A1 (fr) |
Family Cites Families (16)
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JP4127682B2 (ja) * | 1999-06-07 | 2008-07-30 | 株式会社東芝 | パターン形成方法 |
JP3940546B2 (ja) * | 1999-06-07 | 2007-07-04 | 株式会社東芝 | パターン形成方法およびパターン形成材料 |
US8133534B2 (en) * | 2004-11-22 | 2012-03-13 | Wisconsin Alumni Research Foundation | Methods and compositions for forming patterns with isolated or discrete features using block copolymer materials |
FR2911609B1 (fr) * | 2007-01-19 | 2009-03-06 | Rhodia Recherches & Tech | Copolymere dibloc comprenant des unites derivant du styrene et des unites derivant d'acide acrylique |
JP2008231233A (ja) * | 2007-03-20 | 2008-10-02 | Kyoto Univ | 高分子薄膜、パターン基板、磁気記録用パターン媒体及びこれらの製造方法 |
KR20090083091A (ko) * | 2008-01-29 | 2009-08-03 | 삼성전자주식회사 | 블록 공중합체를 이용한 미세 패턴 형성 방법 |
US8425982B2 (en) * | 2008-03-21 | 2013-04-23 | Micron Technology, Inc. | Methods of improving long range order in self-assembly of block copolymer films with ionic liquids |
JP5281386B2 (ja) * | 2008-12-22 | 2013-09-04 | 株式会社日立製作所 | 高分子薄膜及びパターン媒体並びにこれらの製造方法 |
US8821978B2 (en) * | 2009-12-18 | 2014-09-02 | International Business Machines Corporation | Methods of directed self-assembly and layered structures formed therefrom |
FR2983773B1 (fr) | 2011-12-09 | 2014-10-24 | Arkema France | Procede de preparation de surfaces |
US8513356B1 (en) * | 2012-02-10 | 2013-08-20 | Dow Global Technologies Llc | Diblock copolymer blend composition |
JP5887244B2 (ja) * | 2012-09-28 | 2016-03-16 | 富士フイルム株式会社 | パターン形成用自己組織化組成物、それを用いたブロックコポリマーの自己組織化によるパターン形成方法、及び自己組織化パターン、並びに電子デバイスの製造方法 |
US20140377965A1 (en) * | 2013-06-19 | 2014-12-25 | Globalfoundries Inc. | Directed self-assembly (dsa) formulations used to form dsa-based lithography films |
FR3031749B1 (fr) * | 2015-01-21 | 2018-09-28 | Arkema France | Procede d'amelioration de l'uniformite de dimension critique de films ordonnes de copolymeres a blocs |
FR3031751B1 (fr) * | 2015-01-21 | 2018-10-05 | Arkema France | Procede de reduction des defauts dans un film ordonne de copolymere a blocs |
FR3031750B1 (fr) * | 2015-01-21 | 2018-09-28 | Arkema France | Procede d'obtention de films ordonnes epais et de periodes elevees comprenant un copolymere a blocs |
-
2015
- 2015-01-21 FR FR1550463A patent/FR3031748B1/fr not_active Expired - Fee Related
-
2016
- 2016-01-21 CN CN201680017300.8A patent/CN107430330A/zh active Pending
- 2016-01-21 SG SG11201705897YA patent/SG11201705897YA/en unknown
- 2016-01-21 TW TW105101875A patent/TWI631170B/zh not_active IP Right Cessation
- 2016-01-21 JP JP2017537916A patent/JP2018505275A/ja active Pending
- 2016-01-21 US US15/545,134 patent/US20180015645A1/en not_active Abandoned
- 2016-01-21 WO PCT/FR2016/050116 patent/WO2016116708A1/fr active Application Filing
- 2016-01-21 KR KR1020177023117A patent/KR20170118743A/ko not_active Application Discontinuation
- 2016-01-21 EP EP16703593.0A patent/EP3248064A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO2016116708A1 (fr) | 2016-07-28 |
FR3031748B1 (fr) | 2018-09-28 |
KR20170118743A (ko) | 2017-10-25 |
JP2018505275A (ja) | 2018-02-22 |
FR3031748A1 (fr) | 2016-07-22 |
SG11201705897YA (en) | 2017-08-30 |
US20180015645A1 (en) | 2018-01-18 |
TW201641581A (zh) | 2016-12-01 |
TWI631170B (zh) | 2018-08-01 |
CN107430330A (zh) | 2017-12-01 |
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