EP3234219A1 - Plattierbadzusammensetzung und verfahren zum stromlosen plattieren von palladium - Google Patents
Plattierbadzusammensetzung und verfahren zum stromlosen plattieren von palladiumInfo
- Publication number
- EP3234219A1 EP3234219A1 EP15813382.7A EP15813382A EP3234219A1 EP 3234219 A1 EP3234219 A1 EP 3234219A1 EP 15813382 A EP15813382 A EP 15813382A EP 3234219 A1 EP3234219 A1 EP 3234219A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- palladium
- plating bath
- group
- bath composition
- diamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims abstract description 300
- 229910052763 palladium Inorganic materials 0.000 title claims abstract description 166
- 238000007747 plating Methods 0.000 title claims abstract description 159
- 239000000203 mixture Substances 0.000 title claims abstract description 97
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000007772 electroless plating Methods 0.000 title abstract description 11
- 238000000151 deposition Methods 0.000 claims abstract description 120
- 230000008021 deposition Effects 0.000 claims abstract description 105
- -1 palladium ions Chemical class 0.000 claims abstract description 102
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 32
- 125000000217 alkyl group Chemical group 0.000 claims description 39
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N pentanal Chemical compound CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 claims description 28
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 25
- 125000004432 carbon atom Chemical group C* 0.000 claims description 25
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 21
- 239000008139 complexing agent Substances 0.000 claims description 20
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 claims description 16
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 13
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 12
- JARKCYVAAOWBJS-UHFFFAOYSA-N hexanal Chemical compound CCCCCC=O JARKCYVAAOWBJS-UHFFFAOYSA-N 0.000 claims description 12
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 10
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 claims description 10
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 10
- 125000003118 aryl group Chemical group 0.000 claims description 10
- 235000019253 formic acid Nutrition 0.000 claims description 10
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 claims description 9
- 235000019256 formaldehyde Nutrition 0.000 claims description 9
- 150000002148 esters Chemical class 0.000 claims description 7
- 150000003839 salts Chemical class 0.000 claims description 5
- 125000003107 substituted aryl group Chemical group 0.000 claims description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- 150000002367 halogens Chemical class 0.000 claims description 4
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 4
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 4
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- DTUQWGWMVIHBKE-UHFFFAOYSA-N phenylacetaldehyde Chemical compound O=CCC1=CC=CC=C1 DTUQWGWMVIHBKE-UHFFFAOYSA-N 0.000 claims description 4
- CJKRXEBLWJVYJD-UHFFFAOYSA-N N,N'-diethylethylenediamine Chemical compound CCNCCNCC CJKRXEBLWJVYJD-UHFFFAOYSA-N 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 claims description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 claims description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 3
- SCZVXVGZMZRGRU-UHFFFAOYSA-N n'-ethylethane-1,2-diamine Chemical compound CCNCCN SCZVXVGZMZRGRU-UHFFFAOYSA-N 0.000 claims description 3
- KFIGICHILYTCJF-UHFFFAOYSA-N n'-methylethane-1,2-diamine Chemical compound CNCCN KFIGICHILYTCJF-UHFFFAOYSA-N 0.000 claims description 3
- KVKFRMCSXWQSNT-UHFFFAOYSA-N n,n'-dimethylethane-1,2-diamine Chemical compound CNCCNC KVKFRMCSXWQSNT-UHFFFAOYSA-N 0.000 claims description 3
- 125000001624 naphthyl group Chemical group 0.000 claims description 3
- YJVFFLUZDVXJQI-UHFFFAOYSA-L palladium(ii) acetate Chemical compound [Pd+2].CC([O-])=O.CC([O-])=O YJVFFLUZDVXJQI-UHFFFAOYSA-L 0.000 claims description 3
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 3
- 150000003141 primary amines Chemical class 0.000 claims description 3
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 3
- 150000003335 secondary amines Chemical class 0.000 claims description 3
- 125000001424 substituent group Chemical group 0.000 claims description 3
- 150000003512 tertiary amines Chemical class 0.000 claims description 3
- BTOWBQGNGVCREL-UHFFFAOYSA-N 1,1-dichloro-n-ethylethane-1,2-diamine Chemical compound CCNC(Cl)(Cl)CN BTOWBQGNGVCREL-UHFFFAOYSA-N 0.000 claims description 2
- FNJNSTLVQCDKLP-UHFFFAOYSA-N 1,2-dichloroethane-1,2-diamine Chemical compound NC(Cl)C(N)Cl FNJNSTLVQCDKLP-UHFFFAOYSA-N 0.000 claims description 2
- 125000004493 2-methylbut-1-yl group Chemical group CC(C*)CC 0.000 claims description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 2
- RFNQIJYTSJSEJL-UHFFFAOYSA-N ClC(C(NC)Cl)NC Chemical compound ClC(C(NC)Cl)NC RFNQIJYTSJSEJL-UHFFFAOYSA-N 0.000 claims description 2
- QADLQZGFSGORBX-UHFFFAOYSA-N ClC(C(NCC)Cl)NCC Chemical compound ClC(C(NCC)Cl)NCC QADLQZGFSGORBX-UHFFFAOYSA-N 0.000 claims description 2
- RFQGYXRCVNHIPA-UHFFFAOYSA-N ClC(CN)(NC)Cl Chemical compound ClC(CN)(NC)Cl RFQGYXRCVNHIPA-UHFFFAOYSA-N 0.000 claims description 2
- 150000004675 formic acid derivatives Chemical class 0.000 claims description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 2
- 125000003538 pentan-3-yl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 claims 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 claims 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical compound [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 claims 1
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000011159 matrix material Substances 0.000 description 10
- 239000004280 Sodium formate Substances 0.000 description 9
- HLBBKKJFGFRGMU-UHFFFAOYSA-M sodium formate Chemical compound [Na+].[O-]C=O HLBBKKJFGFRGMU-UHFFFAOYSA-M 0.000 description 9
- 235000019254 sodium formate Nutrition 0.000 description 9
- 230000004913 activation Effects 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- 239000000243 solution Substances 0.000 description 6
- 239000003381 stabilizer Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 239000011630 iodine Substances 0.000 description 3
- 150000002940 palladium Chemical class 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 238000004876 x-ray fluorescence Methods 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical class NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- WBJINCZRORDGAQ-UHFFFAOYSA-N ethyl formate Chemical compound CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 2
- 229940012017 ethylenediamine Drugs 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- TZIHFWKZFHZASV-UHFFFAOYSA-N methyl formate Chemical compound COC=O TZIHFWKZFHZASV-UHFFFAOYSA-N 0.000 description 2
- 229910001453 nickel ion Inorganic materials 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical class NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- SJBOEHIKNDEHHO-UHFFFAOYSA-N 2-[2-aminoethyl(carboxymethyl)amino]acetic acid Chemical class NCCN(CC(O)=O)CC(O)=O SJBOEHIKNDEHHO-UHFFFAOYSA-N 0.000 description 1
- QDAWXRKTSATEOP-UHFFFAOYSA-N 2-acetylbenzoic acid Chemical compound CC(=O)C1=CC=CC=C1C(O)=O QDAWXRKTSATEOP-UHFFFAOYSA-N 0.000 description 1
- RXFCIXRFAJRBSG-UHFFFAOYSA-N 3,2,3-tetramine Chemical class NCCCNCCNCCCN RXFCIXRFAJRBSG-UHFFFAOYSA-N 0.000 description 1
- VYWYYJYRVSBHJQ-UHFFFAOYSA-N 3,5-dinitrobenzoic acid Chemical compound OC(=O)C1=CC([N+]([O-])=O)=CC([N+]([O-])=O)=C1 VYWYYJYRVSBHJQ-UHFFFAOYSA-N 0.000 description 1
- LWFUFLREGJMOIZ-UHFFFAOYSA-N 3,5-dinitrosalicylic acid Chemical compound OC(=O)C1=CC([N+]([O-])=O)=CC([N+]([O-])=O)=C1O LWFUFLREGJMOIZ-UHFFFAOYSA-N 0.000 description 1
- OTLNPYWUJOZPPA-UHFFFAOYSA-N 4-nitrobenzoic acid Chemical compound OC(=O)C1=CC=C([N+]([O-])=O)C=C1 OTLNPYWUJOZPPA-UHFFFAOYSA-N 0.000 description 1
- BTJIUGUIPKRLHP-UHFFFAOYSA-N 4-nitrophenol Chemical compound OC1=CC=C([N+]([O-])=O)C=C1 BTJIUGUIPKRLHP-UHFFFAOYSA-N 0.000 description 1
- ZIIGSRYPZWDGBT-UHFFFAOYSA-N 610-30-0 Chemical compound OC(=O)C1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O ZIIGSRYPZWDGBT-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical class OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 1
- ZALYCGKBKHHGAF-UHFFFAOYSA-N N-Ethyl-N-methyl-1,2-ethanediamine Chemical compound CCN(C)CCN ZALYCGKBKHHGAF-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- KFNNIILCVOLYIR-UHFFFAOYSA-N Propyl formate Chemical compound CCCOC=O KFNNIILCVOLYIR-UHFFFAOYSA-N 0.000 description 1
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical class NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229940095076 benzaldehyde Drugs 0.000 description 1
- OTBHHUPVCYLGQO-UHFFFAOYSA-N bis(3-aminopropyl)amine Chemical class NCCCNCCCN OTBHHUPVCYLGQO-UHFFFAOYSA-N 0.000 description 1
- 239000008364 bulk solution Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- XTEGARKTQYYJKE-UHFFFAOYSA-M chlorate Inorganic materials [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- IUNMPGNGSSIWFP-UHFFFAOYSA-N dimethylaminopropylamine Chemical class CN(C)CCCN IUNMPGNGSSIWFP-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 150000002169 ethanolamines Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- YUKZJEQIDOFUPV-UHFFFAOYSA-N n',n'-diethyl-n,n-dimethylethane-1,2-diamine Chemical compound CCN(CC)CCN(C)C YUKZJEQIDOFUPV-UHFFFAOYSA-N 0.000 description 1
- MKDYQLJYEBWUIG-UHFFFAOYSA-N n',n'-diethyl-n-methylethane-1,2-diamine Chemical compound CCN(CC)CCNC MKDYQLJYEBWUIG-UHFFFAOYSA-N 0.000 description 1
- UDGSVBYJWHOHNN-UHFFFAOYSA-N n',n'-diethylethane-1,2-diamine Chemical compound CCN(CC)CCN UDGSVBYJWHOHNN-UHFFFAOYSA-N 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical class CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- DILRJUIACXKSQE-UHFFFAOYSA-N n',n'-dimethylethane-1,2-diamine Chemical compound CN(C)CCN DILRJUIACXKSQE-UHFFFAOYSA-N 0.000 description 1
- LSHROXHEILXKHM-UHFFFAOYSA-N n'-[2-[2-[2-(2-aminoethylamino)ethylamino]ethylamino]ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCCNCCNCCN LSHROXHEILXKHM-UHFFFAOYSA-N 0.000 description 1
- KQNNOGJHLWDFHO-UHFFFAOYSA-N n'-ethyl-n,n'-dimethylethane-1,2-diamine Chemical compound CCN(C)CCNC KQNNOGJHLWDFHO-UHFFFAOYSA-N 0.000 description 1
- ZOBHKNDSXINZGQ-UHFFFAOYSA-N n'-ethyl-n,n,n'-trimethylethane-1,2-diamine Chemical compound CCN(C)CCN(C)C ZOBHKNDSXINZGQ-UHFFFAOYSA-N 0.000 description 1
- MXJYVLYENVWKQX-UHFFFAOYSA-N n'-ethyl-n-methylethane-1,2-diamine Chemical compound CCNCCNC MXJYVLYENVWKQX-UHFFFAOYSA-N 0.000 description 1
- QHJABUZHRJTCAR-UHFFFAOYSA-N n'-methylpropane-1,3-diamine Chemical class CNCCCN QHJABUZHRJTCAR-UHFFFAOYSA-N 0.000 description 1
- IHFOKWPYAWVPAK-UHFFFAOYSA-N n,n',n'-triethyl-n-methylethane-1,2-diamine Chemical compound CCN(C)CCN(CC)CC IHFOKWPYAWVPAK-UHFFFAOYSA-N 0.000 description 1
- HDCAZTXEZQWTIJ-UHFFFAOYSA-N n,n',n'-triethylethane-1,2-diamine Chemical compound CCNCCN(CC)CC HDCAZTXEZQWTIJ-UHFFFAOYSA-N 0.000 description 1
- HVOYZOQVDYHUPF-UHFFFAOYSA-N n,n',n'-trimethylethane-1,2-diamine Chemical compound CNCCN(C)C HVOYZOQVDYHUPF-UHFFFAOYSA-N 0.000 description 1
- KEUXZGFIRAKFAG-UHFFFAOYSA-N n,n'-diethyl-n'-methylethane-1,2-diamine Chemical compound CCNCCN(C)CC KEUXZGFIRAKFAG-UHFFFAOYSA-N 0.000 description 1
- BWTBHGDNJBIYAQ-UHFFFAOYSA-N n,n'-diethyl-n,n'-dimethylethane-1,2-diamine Chemical compound CCN(C)CCN(C)CC BWTBHGDNJBIYAQ-UHFFFAOYSA-N 0.000 description 1
- DIHKMUNUGQVFES-UHFFFAOYSA-N n,n,n',n'-tetraethylethane-1,2-diamine Chemical compound CCN(CC)CCN(CC)CC DIHKMUNUGQVFES-UHFFFAOYSA-N 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000013110 organic ligand Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000002941 palladium compounds Chemical class 0.000 description 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 1
- GPNDARIEYHPYAY-UHFFFAOYSA-N palladium(ii) nitrate Chemical compound [Pd+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O GPNDARIEYHPYAY-UHFFFAOYSA-N 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- HTIMQENIYIHRMC-UHFFFAOYSA-N propane-1,1,2-triamine Chemical class CC(N)C(N)N HTIMQENIYIHRMC-UHFFFAOYSA-N 0.000 description 1
- XNYADZUHUHIGRZ-UHFFFAOYSA-N propane-1,1,3-triamine Chemical class NCCC(N)N XNYADZUHUHIGRZ-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 1
- 229940081974 saccharin Drugs 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 229960001124 trientine Drugs 0.000 description 1
- 238000009681 x-ray fluorescence measurement Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
Definitions
- the present invention relates to aqueous plating bath compositions and methods for electroless plating of palladium in the manufacture of printed circuit boards, IC substrates and for metallization of semiconductor wafers.
- Electroless deposition of palladium in the manufacture of printed circuit boards, IC substrates and the like as well as metallization of semiconductor wafers is an established technique.
- the palladium layers are used for example as barrier layers and/or wire-bondable and solderable finishes.
- Electroless palladium plating bath compositions comprising a source for palladium ions, a nitrogenated complexing agent and a reducing agent selected from formic acid and derivatives thereof are disclosed in US 5,882,736. Such electroless palladium plating bath compositions are suited to deposit pure palladium in contrast to plating bath compositions containing hypophosphite as reducing agent which result in palladium-phosphorous alloy layers.
- US patent 4,424,241 describes an electroless plating solution comprising palladium, organic ligands and reducing agents, i.a. formaldehyde and formic acid.
- the reducing agents are used in high concentrations. According to US patent 4,424,241 concentrations too low slow the deposition rate.
- the deposition rate constantly decreases during bath life and a deposition rate too low finally terminates the life time of an electroless palladium plating bath. This is due to the catalytic effect of already deposited palladium and the autocatalytic deposition mechanism.
- changing the temperature of an electroless palladium plating bath is used for regulating the deposition rate and duration of bath life. Increasing the bath temperature also increases the deposition rate. But operating the bath at a higher temperature simultaneously increases the risk of destabilising the bath.
- the stability of such a plating bath means that the plating bath is stable against decomposition, i.e. the undesired precipitation of metallic palladium in the plating bath itself. Accordingly, destabilising an electroless palladium plating bath in turn shortens the bath life. Due to the high price of palladium early discarding of an electroless palladium plating bath is undesired for economic reasons as well.
- an aqueous plating bath composition for elec- troless deposition of palladium comprising
- (iii) at least one aldehyde compound according to Formula (I) wherein R is selected from the group consisting of -H; unsubstituted or substituted, linear alkyl groups comprising 1 to 10 carbon atoms; and unsubstituted or substituted, branched alkyl groups comprising 3 to 10 carbon atoms; and unsubstituted or substituted aryl groups; and wherein the at least one aldehyde compound according to Formula (I) has a concentration ranging from 0.01 to 25 mg/l.
- the aqueous plating bath composition according to the present invention is called the composition or the composition according to the present invention herein.
- the terms “plating” and “depositing” are used interchangeably herein.
- the aldehyde compounds according to Formula (I) provide the aqueous plating bath composition according to the present invention with an increased deposition rate for palladium, in particular for pure palladium, and a prolonged life time. Although increasing the deposition rate, the aldehyde compounds according to Formula (I) do not impair the stability of the aqueous plating bath composition according to the present invention against undesired decomposition. Adding the aldehyde compounds according to Formula (I) to an electroless palladium plating bath allows for adjusting the deposition rate to a constant range over the bath life time.
- the aldehyde compounds according to Formula (I) of the present invention activate electroless palladium plating baths having a low deposition rate even when freshly prepared and reactivate aged electroless palladium plating baths.
- the aldehyde compounds according to Formula (I) of the present invention allow for electrolessly depositing palladium layers at lower temperatures.
- Figure 1 shows the deposition rate of an aqueous plating bath composition containing formaldehyde.
- Figure 2 shows the deposition rate of an aqueous plating bath composition containing n-propanal.
- Figure 3 shows the deposition rate of an aqueous plating bath composition containing n-pentanal in a concentration range of 0.25 to 1 .25 mg/l.
- Figure 4 shows the deposition rate of an aqueous plating bath composition containing n-pentanal in a concentration range of 1 to 10 mg/l.
- the aqueous plating bath composition comprises (iii) at least one aldehyde compound according to Formula (I)
- R is selected from the group consisting of -H; unsubstituted or substituted, linear alkyl groups comprising 1 to 10 carbon atoms; and unsubstituted or substituted, branched alkyl groups comprising 3 to 10 carbon atoms; and unsubstituted or substituted aryl groups; and wherein the at least one aldehyde compound according to Formula (I) has a concentration ranging from 0.01 to 25 mg/l.
- R may be -H. In another embodiment R is preferably not -H.
- R is selected from the group consisting of -H; unsubstituted or substituted, linear alkyl groups comprising 1 to 10 carbon atoms; and unsubstituted or substituted, branched alkyl groups comprising 3 to 10 carbon atoms.
- R is selected from the group consisting of unsubstituted or substituted, linear alkyl groups comprising 1 to 10 carbon at- oms; and unsubstituted or substituted, branched alkyl groups comprising 3 to 10 carbon atoms.
- the unsubstituted or substituted, linear alkyl groups are preferably selected from unsubstituted or substituted, linear alkyl groups comprising 1 to 8 carbon atoms; more preferably 1 to 5 carbon atoms, even more preferably from 2 to 5 carbon atoms.
- the unsubstituted or substituted, linear alkyl groups are selected from the group comprising n-pentyl group, n-butyl group, n-propyl group, ethyl group and methyl group; further more preferably from n-butyl group, n-propyl group, ethyl group, and methyl group; most preferably from n-butyl group, n-propyl group, and ethyl group.
- the unsubstituted or substituted, branched alkyl groups are preferably selected from unsubstituted or substituted, branched alkyl groups comprising 3 to 8 carbon atoms; more preferably 3 to 5 carbon atoms.
- the unsubstituted or substituted, branched alkyl groups are selected from the group comprising 2-pentyl (sec-pentyl) group, 3-pentyl group, 2- methylbutyl group, 3-methylbutyl (iso-pentyl) group, 3-methylbut-2-yl group, 2- methylbut-2-yl group; 2,2-dimethylpropyl (neo-pentyl) group, iso-butyl group, sec-butyl group, tert-butyl group, and iso-propyl group; most preferably from iso- butyl group, sec-butyl group, and iso-propyl group.
- the unsubstituted or substituted aryl groups are preferably selected from unsubstituted or substituted aryl groups comprising 6 to 10 carbon atoms; more preferably from unsubstituted or substituted phenyl groups and unsubstituted or substituted naphthyl groups; most preferably from unsubstituted or substituted phenyl groups.
- the linear alkyl groups, the branched alkyl groups, or the aryl groups are preferably substituted.
- the substituents are se- lected independently from each other from the group comprising amino, carboxyl, ester, mercapto, hydroxyl, methoxy, ethoxy, methyl, ethyl, halogen, such as fluorine, chlorine, bromine, iodine; allyl, vinyl, and aryl groups; preferably from amino, carboxyl, ester, hydroxyl, methoxy, ethoxy, methyl, ethyl, halogen, such as fluorine, chlorine, bromine, iodine; and aryl groups; even more preferably from carboxyl, ester, hydroxyl, methoxy, ethoxy, methyl, ethyl, halogen, such as fluorine, chlorine, bromine, iodine; and aryl groups.
- the at least one aldehyde compound according to Formula (I) is selected from the group comprising hexanal (hexanaldehyde), pentanal (valeraldehyde), butanal (butyraldehyde), propanal (propionaldehyde), ethanal (acetaldehyde), methanal (formaldehyde), phenylmethanal (benzalde- hyde), and 2-phenylacetaldehyde; preferably from n-hexanal, n-pentanal, n- butanal, n-propanal, and ethanal; more preferably from n-pentanal, n-butanal, n- propanal, and ethanal, even more preferably from n-hexanal, n-pentanal, n- butanal, and n-propanal.
- alkyl refers to a hydrocarbon radical with the general chemical formula C n H 2n+ i , n being an integer from 1 to 10.
- Alkyl residues according to the present invention can be linear and/or branched and they are preferably saturated.
- linear alkyl groups comprising 1 to 10 carbon atoms means linear alkyl groups having a number of overall C atoms ranging from 1 to 10, respectively.
- Branched alkyl groups comprising 3 to 10 carbon atoms means branched alkyl groups in which the sum of C atoms in the main chain plus C atoms in the branching chains results in a number of overall C atoms ranging from 3 to 10, respectively.
- Linear alkyl groups comprising 1 to 8 carbon atoms or branched alkyl groups comprising 3 to 8 carbon atoms for example include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl or octyl.
- Linear alkyl groups comprising 1 to 5 carbon atoms or branched alkyl groups comprising 3 to 5 carbon atoms for example include methyl, ethyl, propyl, butyl, or pentyl.
- aryl refers to ring-shaped aromatic hydrocarbon radicals, for example phenyl or naphthyl.
- alkyl and/or aryl can be substituted by replacing an H-atom in each case by a substituent as outlined above for the linear alkyl groups, the branched alkyl groups, and/or the aryl groups.
- the at least one aldehyde compound according to Formula (I) has a concentration in the aqueous plating bath composition according to the present invention ranging from 0.01 to 25 mg/l ; preferably from 0.01 to 10 mg/l, more preferably from 0.1 to 10 mg/l.
- aldehyde compounds increase the deposition rate of electroless palladium plating baths when contained therein in a concentration below the one used for aldehyde reducing agents.
- the aqueous plating bath composition according to the present invention comprises at least one source for palladium ions.
- the at least one source for palladium ions is a water soluble palladium compound. More preferably, the at least one source for palladium ions is selected from the group comprising palladium chloride, palladium acetate, palladium sulfate and palladium perchlo- rate.
- complex compounds comprising a palladium ion and a com- plexing agent, preferably a nitrogenated complexing agent, for palladium ions can be added to the plating bath instead of forming such a complex compound in the plating bath by adding a palladium salt and said complexing agent for palladium ions to the plating bath as separate ingredients.
- Suitable complex compounds as sources for palladium ions are for example complex compounds comprising palladium ions and complexing agents; preferably nitrogenated complexing agents; more preferably ethane-1 ,2-diamine and/or alkyl substituted ethane-1 ,2-diamines.
- Suitable complex compounds may further comprise coun- ter ions to palladium ions; preferably chloride, acetate, sulfate or perchlorate.
- Suitable nitrogenated complexing agents and alkyl substituted ethane-1 ,2- diamines are defined below as complexing agents.
- suitable complex compounds as sources for palladium ions are for example dichloro ethane-1 ,2- diamine palladium diacetato ethane-1 ,2-diamine palladium; dichloro N - methylethane-1 ,2-diamine palladium; diacetato N -methylethane-1 ,2-diamine; dichloro N ,N 2 -dimethylethane-1 ,2-diamine; diacetato N ,N 2 -dimethylethane- 1 ,2-diamine; dichloro N -ethylethane-1 ,2-diamine; diacetato N -ethylethane-1 ,2- diamine, dichloro N ,N 2 -diethylethane-1 ,2-diamine; and diacetato N ,N 2 - diethylethane-1 ,2-diamine.
- the concentration of palladium ions in the composition ranges from 0.5 to 500 mmol/l, preferably from 1 to 100 mmol/l.
- the aqueous plating bath composition according to the present invention further comprises at least one reducing agent for palladium ions.
- the reducing agent makes the plating bath an autocatalytic, i.e. an electroless plating bath. Palladium ions are reduced to metallic palladium in the presence of said reducing agent.
- This plating mechanism differentiates the plating bath according to the present invention from 1 ) immersion-type palladium plating baths which do not contain a reducing agent for palladium ions and 2) plating baths for electroplating of palladium which require an external electrical current in order to deposit a palladium layer.
- the at least one reducing agent is preferably a chemical reducing agent. Reducing agents provide the electrons necessary to reduce metal ions to their metallic form and thereby form a metal deposit on a substrate.
- the at least one reducing agent is a reducing agent for depositing pure palladium deposits.
- Pure palladium deposits are deposits containing palladium in an amount ranging from 98.0 to 99.99 wt.-% or higher, preferably from 99.0 to 99.99 wt.-% or higher.
- the at least one reducing agent for palladium ions is selected from the group consisting of hydrazine, formic acid, derivatives of the aforementioned and salts thereof.
- the at least one reducing agent for palladium ions is selected from the group consisting of formic acid, derivatives of formic acid and salts of the aforementioned.
- the formic acid derivatives are selected from esters of formic acid.
- esters of formic acid are selected from the group consisting of formic acid methylester, formic acid ethylester and formic acid propylester.
- Suitable counter ions for salts of formic acid are for example selected from hydrogen, lithium, sodium, potassium and ammonium.
- the aqueous plating bath composition according to the present invention is particularly suitable for depositing palladium layers in the presence of formic acid, derivatives and salts of the aforementioned as reducing agent.
- the at least one reducing agent is not formaldehyde.
- the concentration of the at least one reducing agent in the aqueous plating bath composition according to the present invention ranges from 10 to 1000 mmol/l.
- the molar ratio of the reducing agent for palladium ions and the palladium ions in the composition according to the present invention ranges from 1 : 10 to 10 : 1 ; more preferably from 1 : 5 to 5 : 1 ; even more preferably from 1 : 3 to 3 : 1 .
- the aqueous plating bath composition of the present invention is particularly suitable for depositing pure palladium layers. Pure palladium layers are particu- larly suitable for high temperature applications like in motor control units as pure palladium layers allow for sufficient thermal stability of bonded or soldered connections.
- Hypophosphite ions and/or amine borane compounds and/or sodium borhydride are not suitable as the reducing agent because palladium alloy layers are deposited from such plating bath compositions.
- the aqueous plating bath composition according to the present invention may further comprise at least one complexing agent for palladium ions.
- a complex- ing agent (sometimes also referred to as chelating agent) keeps metal ions dissolved and prevents their undesired precipitation from solution.
- the at least one complexing agent is a nitrogenated complexing agent for palladium ions. More preferably, the at least one nitrogenated complexing agent is selected from the group comprising primary amines, secondary amines and tertiary amines. Even more preferably, the at least one nitrogenated complexing agent is selected from the group comprising diamines, triamines, tetraamines and higher homologues thereof.
- Suitable amines are for example ethane-1 ,2-diamine (NH 2 -CH 2 -CH 2 -NH 2 , ethylene diamine); alkyl substituted ethane-1 ,2-diamines; 1 ,3-diamino-propane; 1 ,2-bis (3-amino-propyl-amino)-ethane; diethylene-triamine; diethylene-triamine- penta-acetic acid; N-(2-hydroxy-ethyl)-ethylene-diamine; ethylene-diamine-N,N- diacetic acid; 1 ,2-diamino-propyl-amine; 1 ,3-diamino-propyl-amine; 3-(methyl- amino)-propyl-amine; 3-(dimethyl-amino)-propyl-amine; 3-(diethyl-amino)- propyl-amine; bis-(3-amino-propyl)-amine; 1 ,2-bis
- Suitable alkyl substituted ethane-1 ,2-diamines are for example N - methylethane-1 ,2-diamine (CH 3 -NH-CH 2 -CH 2 -NH 2 ) ; N ,N 2 -dimethylethane-1 ,2- diamine (CH3-NH-CH2-CH2-NH-CH3) ; N ,N -dimethylethane-1 ,2-diamine ((CH 3 ) 2 -N-CH 2 -CH 2 -NH 2 ); N ,N ,N 2 -trimethylethane-1 ,2-diamine ((CH 3 ) 2 -N-CH 2 - CH 2 -NH-CH 3 ); N ,N ,N 2 ,N 2 -tetramethylethane-1 ,2-diamine ((CH 3 ) 2 -N-CH 2 -CH 2 - N-(CH 3 ) 2 ); N -ethylethane-1 ,2-di
- the mole ratio of the complexing agent for palladium ions and palladium ions in the composition according to the present invention ranges from 1 : 1 to 50 : 1 .
- the aqueous plating bath composition according to the present invention may further comprise at least one stabilizing agent.
- Stabilizing agents also referred to as stabilizers, are compounds that stabilize an electroless metal plating solution against undesired outplating in the bulk solution and spontaneous decomposition.
- the term "outplating" means undesired and/or uncontrolled deposition of the metal on surfaces other than substrate surfaces.
- the at least one stabilizing agent may be selected from the group comprising compounds of the elements selenium, tellurium, copper, nickel, and iron and/or mercapto-benzothiazole, seleno-cyanates, thiourea, saccharin, ferro-cyanates; 4-nitrobenzoic acid; 3,5-dinitrobenzoic acid; 2,4-dinitrobenzoic acid; 2-hydroxy- 3,5-dinitrobenzoic acid; 2-acetylbenzoic acid; 4-nitrophenol and their corresponding ammonium, sodium and potassium salts.
- the concentration of such further stabilizing agents in the composition according to the present invention ranges from 0.01 to 500 mg/l, more preferably from 0.1 to 200 mg/l, even more preferably from 1 to 200 mg/l, and most preferably from 10 to 100 mg/l.
- the aqueous plating bath composition according to the present invention is an acidic plating bath.
- the pH-value of the aqueous plating bath composition more preferably ranges from 4 to 7 because the composition is unstable at a pH-value below 4. Even more preferably, the pH-value of the composition ranges from 5 to 6.
- the composition is prone to deposit palladium onto the substrate by immersion-type plating resulting in a weak adhesion between the palladium layer and the subjacent substrate.
- a plating bath composition having a pH-value above 7 would attack organic resist materials such as solder mask materials which may also be a part of the substrate.
- the present invention further relates to a method for electroless palladium plating comprising the steps of
- the substrate has a metal surface.
- Palladium plating or deposition of palladium is preferably carried out by contacting a substrate having a metal surface with the composition according to the present invention and thereby depositing a layer of palladium onto at least a portion of the metal surface of the substrate.
- the metal surface or the portion thereof to be coated with palladium is selected from the group comprising copper, copper alloys, nickel, nickel alloys, cobalt, cobalt alloys, platinum, platinum alloys, gold, gold alloys, and gallium arsenide.
- the metal surface or the portion thereof to be coated is for example part of a printed circuit board, an IC substrate or a semiconducting wafer.
- Palladium layers are used for example on semiconducting wafers as noble metal, wire-bondable and solderable finishes of semiconductor chips, light emitting diodes (LED) or solar cells.
- Suitable methods for contacting the substrate with the aqueous plating bath composition are for example dipping the substrate into the composition or spraying the composition onto the substrate.
- the substrate is contacted with the aqueous plating bath composition according to step b) at a temperature of 30 to 95°C, more preferably of 30 to 85°C, even more preferably of 50 to 85°C, yet even more preferably of 30 to 65°C.
- the substrate is contacted with the composition for 1 to 60 min, more preferably 10 to 20 min.
- the substrate is contacted with the aqueous plating bath composition to give a palladium plated layer ranging in thickness from 0.01 to 5.0 ⁇ , more preferably from 0.02 to 2.0 ⁇ and even more preferably from 0.05 to 0.5 ⁇ .
- the thickness of palladium layers was measured by x-ray fluorescence (XRF) which is well known to persons skilled in the art.
- XRF x-ray fluorescence
- the XRF measurements make use of the characteristic fluorescence radiation emitted from a sample (sub- strate, deposit) being excited with x-rays. By evaluating the wavelength and intensities and assuming a layered structure of the sample, layer thicknesses can be calculated.
- a thin activation layer of palladium is first deposited onto the substrate, preferably a substrate having a metal surface, by an immersion-type plating method (exchange reaction) followed by palladium deposition from the aqueous plating bath composition according to the present invention.
- a suitable aqueous activation bath may comprise a palladium salt such as palladium acetate, palladium sulfate and palladium nitrate, a complexing agent for palladium ions such as primary amines, secondary amines, tertiary amines and ethanolamines and an acid such as nitric acid, sulfuric acid and methane sulfonic acid.
- a palladium salt such as palladium acetate, palladium sulfate and palladium nitrate
- a complexing agent for palladium ions such as primary amines, secondary amines, tertiary amines and ethanolamines
- an acid such as nitric acid, sulfuric acid and methane sulfonic acid.
- such an activation bath further contains an oxidizing agent such as nitrate ions, perchlorate ions, chlorate ions, perborate ions, peri- odate ions, peroxo-disulfate ions and peroxide ions.
- an oxidizing agent such as nitrate ions, perchlorate ions, chlorate ions, perborate ions, peri- odate ions, peroxo-disulfate ions and peroxide ions.
- the concentration of the palladium salt in the aqueous activation bath ranges from 0.005 to 20 g/l, preferably from 0.05 to 2.0 g/l.
- the concentration of the complexing agent for palladium ions ranges from 0.01 to 80 g/l, preferably from 0.1 to 8 g/l.
- the pH-value of the aqueous activation bath preferably ranges from 0 to 5, preferably from 1 to 4.
- the substrates are immersed in the aqueous activation bath at 25 to 30°C for one to four minutes.
- the metal surface of the substrate Prior to immersing the substrate in an aqueous activation bath, the metal surface of the substrate is cleaned.
- etch cleaning is usually carried out in oxidizing, acidic solutions, for example a solution of sulfuric acid and hydrogen peroxide.
- acidic solution such as, for example, a sulfuric acid solution.
- the aldehyde compounds according to Formula (I) of the present invention increase the deposition rate of aqueous plating bath compositions for electroless deposition of palladium, in particular for electroless deposition of pure palladium.
- the aqueous plating bath compositions are activated and the deposition process is accelerated. This contributes to acceleration of the manufacturing process.
- the deposition rate of known electroless palladium deposition baths usually constantly decreases during bath life. Thus, a longer plating time is required to obtain palladium layers of the same thickness and quality when plating with an aged palladium deposition bath compared to a freshly prepared palladium deposition bath.
- Adding the aldehyde compounds according to Formula (I) to an electroless palladium plating bath allows for adjusting the deposition rate to a constant range over the bath life time, in particular to a constant high range of deposition rate over the bath life. This ensures depositing palladium layers of constant thickness throughout the life time of an electroless palladium plating bath and facilitates process control of the manufacturing process.
- the deposition bath is no more suited for depositing palladium and has to be discarded. Adjusting the deposition rate to a constant range over the bath life time, in particular to a constant high range, also prolongs the life time of an electroless palladium plating bath.
- the aldehyde compounds according to Formula (I) of the present invention activate electroless palladium plating baths having a low deposition rate even when freshly prepared. Further, the aldehyde compounds according to Formula (I) of the present invention reactivate aged electroless palladium plating baths.
- Aged electroless palladium plating bath means herein an electro- less palladium plating bath already used for plating and whose deposition rate already dropped during such usage. Reactivating means herein that the aldehyde compounds according to Formula (I) also increase the deposition rate of an aged electroless palladium plating bath.
- regulating the deposition rate and duration of bath life is achieved by increasing the bath temperature to between 55 to 95°C during deposition.
- a raised temperature of the electroless palladium plating baths has several disadvantages. Operating the bath at a higher temperature increases the risk of destabilising the bath. It requires higher energy consumption. It is of disadvantage for layers of some metals also present on the substrate to be plated. For example, aluminium or copper layers suffer corrosion when present on a substrate which is plated with palladium from a deposition bath at higher temperatures.
- the aldehyde compounds according to Formula (I) of the present invention allow for electro- lessly depositing palladium layers at lower temperatures ranging from 30 to 65 °C. Thus, stability of the aqueous plating bath compositions of the present invention is maintained and corrosion of metal layers also present on the substrate during deposition of palladium from the composition is prevented.
- the present invention further relates to a method for adjusting the deposition rate to a constant range over the life time of any electroless palladium deposition bath, the method comprises the steps of c) providing any electroless palladium deposition bath, and d) adding at least one aldehyde compound according to Formula (I) as defined above to the electroless palladium deposition bath.
- the electroless palladium deposition bath may be any electroless palladium deposition bath, e.g. any aqueous electroless palladium deposition bath.
- the electroless palladium deposition bath is the aqueous plating bath composition according to the present invention.
- the electroless palladium deposition bath may be a freshly prepared electroless palladium deposition bath.
- the electroless palladium deposition bath may be already used for some time for plating.
- the electroless palladium deposition bath is a bath for electroless deposition of pure palladium.
- the deposition rate or the concentration of the at least one aldehyde compound according to Formula (I) may be determined during plating or storage. If the deposition rate or the concentration of the at least one aldehyde compound according to Formula (I) are below a threshold value, the at least one aldehyde compound according to Formula (I) is replenished. Replenishment is performed by adding the at least one aldehyde compound according to Formula (I) to the electroless palladium deposition baths.
- the at least one aldehyde compound according to Formula (I) may be added as a solid or a powder or may be dissolved in a solvent prior to its addition to the electroless palladium deposition baths.
- suitable solvents are water; acids like sulphuric acid, hydrochloric acid, phosphoric acid; alkaline solutions like solutions of sodium hydroxide or potassium hydroxide; and organic solvents like propanol, ethanol, methanol.
- the electroless palladium deposition bath may be already used for some time for plating and the deposition rate has dropped in relation to the initial deposition rate.
- the present invention relates to a method for reactivating the aqueous electroless palladium deposition bath, the method comprises the steps of e) providing an already used aqueous electroless palladium deposition bath, wherein its deposition rate has dropped in relation to its initial deposition rate, and f) adding at least one aldehyde compound according to Formula (I) as defined above , and thereby increasing its deposition rate.
- the present invention further relates to uses of the aldehyde compounds according to Formula (I) for accelerating palladium deposition from any electroless palladium deposition bath, and/or adjusting the deposition rate to a constant range over the life time of any electroless palladium deposition bath, and/or reactivating an electroless palladium deposition bath already used for plating, wherein its deposition rate has dropped in relation to its initial deposition rate.
- Test chips made of silicon covered with a Si0 2 layer and having four dies each were used as substrates.
- Each die had several isolated pads of an aluminum- copper alloy on its surface. The pads had different sizes ranging from 10 ⁇ to 1000 ⁇ in diameter and distances between pads ranged from 20 ⁇ to 1000 ⁇ .
- test chips were already pre-treated by double-zincation. Afterwards, the test chips were nickel plated using an electroless nickel plating bath (Xenolyte Ni MP, product of Atotech GmbH) containing a nickel(ll) salt, a reducing agent for nickel ions, a complexing agent for nickel ions and a stabilizer.
- the nickel plating bath had a pH value of 4.5 and was held at 87 °C during plating.
- the test chips were immersed into the nickel plating bath for 10 minutes and a nickel layer of 3 ⁇ thickness was plated onto the test chips. Afterwards, the test chips were rinsed in deionized water and subjected to a palladium plating bath.
- a plating bath matrix (Xenolyte Pd LL, product of Atotech GmbH) having a pH-value of 5.5 and comprising water, palladium ions, sodium formate as reducing agent for palladium ions and ethylene diamine as complexing agent for palladium ions was used throughout all examples. Sodium formate of different manufacturing batches having different purities was used in the examples. Different amounts of the aldehyde compounds according to Formula (I) of the present invention were added to 2 I of individual palladium plating bath matrices throughout examples 1 to 4. The aqueous plating bath compositions were held at 55 °C during plating. The substrates were immersed into the aqueous plating bath compositions for 6 minutes. Afterwards, the substrates were rinsed with deionized water for 1 minute and dried with air pressure.
- the thickness of the palladium layers deposited in various aqueous plating bath compositions tested was determined with an X-ray fluorescence method (XRF; Fischer, Fischerscope® X-Ray XDV®-1 1 ). The thickness was measured on four palladium pads for each substrate. The deposition rate for each aqueous plating bath composition was calculated by dividing the measured thickness of the palladium layers deposited by the plating time of 6 minutes. The mean values of deposition rates for each substrate are presented in Examples 1 to 4 below.
- Example 1 was performed with plating bath matrices containing different batches of sodium formate, namely batch 2 having high purity and batch 3 having lower purity. 0 to 10 mg/l of formaldehyde were added to the plating bath matrices.
- the aqueous plating bath compositions and plating results are summarised in Table 1 and shown in Figure 1 .
- Example 2 was performed with plating bath matrices containing different batches of sodium formate, namely batch 2 having high purity and batch 3 having lower purity. 0 to 10 mg/l of n-propanal were added to the plating bath matrices.
- the aqueous plating bath compositions and plating results are summarised in Table 2 and shown in Figure 2.
- Table 2 Deposition rate of aqueous plating bath compositions containing n- propanal
- n-pentanal 0 to 1 .25 mg/l of n-pentanal were added to the plating bath matrix.
- the plating bath matrix contained sodium formate of manufacturing batch 1 having highest purity.
- the aqueous plating bath compositions and plating results are summarised in Table 3 and shown in Figure 3.
- Table 3 Deposition rate of aqueous plating bath compositions containing n- pentanal
- the plating bath matrix contained sodium formate of manufacturing batch 2 having high purity.
- the aqueous plating bath compositions and plating results are summarised in Table 4 and shown in Figure 4.
- Examples 1 to 4 showed that the deposition rate of aqueous plating bath compositions containing aldehyde compounds according to Formula (I) were higher compared to compositions lacking the aldehyde compounds. The deposition rate increased with increasing concentration of the aldehyde compounds.
- the deposition rates for compositions having no aldehyde compounds contained therein differ from each other due to the different batches of sodium formate used therein.
- the deposits obtained from aqueous plating bath compositions with or without aldehyde compounds according to Formula (I) had a purity of between 98 to 99.99 wt.-%, were ductile, had a grey to white colour and adhered very well to the substrates.
- Example 5 0 to 50 mg/l of n-pentanal were added to the plating bath matrix.
- the plating bath matrix contained sodium formate of manufacturing batch 2 having high purity.
- the aqueous plating bath compositions and plating results are summarised in Table 5.
- Table 5 Deposition rate of aqueous plating bath compositions containing n- pentanal
- the plating bath matrix contained sodium formate of manufacturing batch 1 having highest purity.
- the aqueous plating bath compositions and plating results are summarised in Table 6.
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PCT/EP2015/080138 WO2016097084A1 (en) | 2014-12-17 | 2015-12-17 | Plating bath composition and method for electroless plating of palladium |
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CN107002242B (zh) * | 2014-12-17 | 2020-02-11 | 埃托特克德国有限公司 | 用于化学镀钯的镀浴组合物和方法 |
CN108027976B (zh) * | 2015-09-11 | 2021-10-29 | 富士胶片株式会社 | 行驶支援装置以及基于行驶支援装置的行驶支援方法 |
TWI707061B (zh) * | 2015-11-27 | 2020-10-11 | 德商德國艾托特克公司 | 鈀之電鍍浴組合物及無電電鍍方法 |
EP3504355A1 (de) * | 2016-08-23 | 2019-07-03 | ATOTECH Deutschland GmbH | Verfahren zur direkten abscheidung von palladium auf eine nichtaktivierte oberfläche eines gallium-nitrid-halbleiters |
WO2019163665A1 (ja) * | 2018-02-20 | 2019-08-29 | 上村工業株式会社 | 無電解パラジウムめっき液、およびパラジウム皮膜 |
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CA968908A (en) * | 1971-07-29 | 1975-06-10 | Photocircuits Division Of Kollmorgen Corporation | Sensitized substrates for chemical metallization |
US4424241A (en) * | 1982-09-27 | 1984-01-03 | Bell Telephone Laboratories, Incorporated | Electroless palladium process |
JPH02205388A (ja) * | 1989-02-03 | 1990-08-15 | Hitachi Chem Co Ltd | 半導体光触媒を用いた無電解めっきによるプリント回路の製造法 |
JP2538461B2 (ja) * | 1991-02-22 | 1996-09-25 | 奥野製薬工業株式会社 | 無電解金めっき方法 |
US5882736A (en) * | 1993-05-13 | 1999-03-16 | Atotech Deutschland Gmbh | palladium layers deposition process |
DE4415211A1 (de) * | 1993-05-13 | 1994-12-08 | Atotech Deutschland Gmbh | Verfahren zur Abscheidung von Palladiumschichten |
US6207128B1 (en) * | 1997-05-05 | 2001-03-27 | Akzo Nobel N.V. | Method of producing a catalyst |
JPH1161425A (ja) * | 1997-08-27 | 1999-03-05 | Ebara Yuujiraito Kk | パラジウム−スズ被膜の導電性向上方法 |
JP3972158B2 (ja) * | 1998-03-24 | 2007-09-05 | 石原薬品株式会社 | 無電解パラジウムメッキ液 |
JP3437980B2 (ja) * | 2000-04-10 | 2003-08-18 | 有限会社関東学院大学表面工学研究所 | 無電解パラジウム−ニッケルめっき浴およびこれを用いるめっき方法ならびにこの方法により得られるめっき製品 |
US6645567B2 (en) * | 2001-12-19 | 2003-11-11 | Intel Corporation | Electroless plating bath composition and method of using |
JP2006083446A (ja) * | 2004-09-17 | 2006-03-30 | Okuno Chem Ind Co Ltd | 無電解パラジウム−銀合金めっき液 |
JP4351736B2 (ja) * | 2008-02-04 | 2009-10-28 | 積水化学工業株式会社 | メッキ構造体 |
JP4511623B1 (ja) * | 2009-05-08 | 2010-07-28 | 小島化学薬品株式会社 | 無電解パラジウムめっき液 |
JP5253369B2 (ja) * | 2009-12-18 | 2013-07-31 | 公益財団法人地球環境産業技術研究機構 | 複合体の製造方法 |
DE102010012204B4 (de) * | 2010-03-19 | 2019-01-24 | MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) | Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten |
US8236999B2 (en) * | 2010-12-16 | 2012-08-07 | Energia Technologies, Inc. | Methods of deoxygenation and systems for fuel production |
EP2581470B1 (de) * | 2011-10-12 | 2016-09-28 | ATOTECH Deutschland GmbH | Stromlose palladiumplattierungsbadzusammensetzung |
US20140072706A1 (en) * | 2012-09-11 | 2014-03-13 | Ernest Long | Direct Electroless Palladium Plating on Copper |
KR101469683B1 (ko) * | 2013-05-31 | 2014-12-05 | 주식회사 불스원신소재 | 무전해 및 전해 연속 공정에 의해 제조된 구리 및 니켈 도금 탄소 섬유를 이용한 전자파 차폐 복합재의 제조 방법 및 전자파 차폐 복합재 |
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CN107109653A (zh) | 2017-08-29 |
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US20170321327A1 (en) | 2017-11-09 |
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