EP3211974B1 - Procédé de fabrication d'une structure en couches sur une zone de surface d'un élément de construction et utilisation d'un dispositif pour effectuer ce procédé - Google Patents

Procédé de fabrication d'une structure en couches sur une zone de surface d'un élément de construction et utilisation d'un dispositif pour effectuer ce procédé Download PDF

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EP3211974B1
EP3211974B1 EP17157684.6A EP17157684A EP3211974B1 EP 3211974 B1 EP3211974 B1 EP 3211974B1 EP 17157684 A EP17157684 A EP 17157684A EP 3211974 B1 EP3211974 B1 EP 3211974B1
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Prior art keywords
particles
component
powder particles
plasma
surface region
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EP17157684.6A
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German (de)
English (en)
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EP3211974A1 (fr
EP3211974B8 (fr
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Marcus Schneider
Reinhold Riemensperger
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Riemensperger Reinhold
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/26Plasma torches
    • H05H1/32Plasma torches using an arc
    • H05H1/42Plasma torches using an arc with provisions for introducing materials into the plasma, e.g. powder, liquid
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/02Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/134Plasma spraying

Definitions

  • the present disclosure relates to a device, to a method for producing a layer structure or coating on a surface area of a component, and to a use of this device for carrying out this method.
  • the present disclosure relates to the use of an apparatus for performing a method of forming a layered structure on a surface area of a device, wherein powder particles having particles completely encased in a cladding material are activated in a physical-thermal plasma and then applied to a substrate become.
  • the cladding material of the cladding layer is effective as a protective layer and / or carrier for the actual particle core.
  • plasma flows are used to treat or coat surfaces.
  • plasmas are used, for example, in semiconductor technology for plasma etching and plasma-induced metal deposition.
  • functional layers such. B. Veraptungen or anti-adhesive layers applied.
  • plasmas are used for surface modification (eg roughening), for plasma-induced material deposition, for surface hardening or also for plasma oxidation.
  • the WO 2010/136777 A1 refers to a method of coating an article, initially providing a powder with coated particles.
  • the powder is spray-coated on a surface of the article to form a composite coating.
  • the spray coating can be carried out, for example, by means of a gas plasma spraying process.
  • the article may be, for example, an implant for a surgical or dental application.
  • the powder may include metal particles coated with calcium phosphates. Furthermore, the particles may contain bioactive substances.
  • a process for thermal spraying of metal oxide coated Ceramic particles on a substrate comprises a step of providing a plurality of metal oxide-coated particles of silicon carbide, silicon nitride, boron carbide or boron nitride, and further the step of thermally spraying the particles of step 1 onto the substrate.
  • the object underlying the present invention is thus to provide an improved concept for plasma-induced surface treatment and in particular for material deposition and surface coating using plasma.
  • a device for producing a layer structure at a surface region of a component comprises, for example, a powder delivery device for providing powder particles in a process region, wherein a powder particle in each case one or more having wholly surrounding particles with a cladding material, a plasma source for introducing a physical-thermal plasma into the process area to activate the provided powder particles in the process area with the physical-thermal plasma to a change, eg a reduction, the viscosity or a Changing the state of aggregation of at least a portion of the cladding material of the powder particles, and an applicator for applying the activated powder on the surface area of the device in order to obtain the particle-containing layer structure on the surface region of the device.
  • a powder delivery device for providing powder particles in a process region, wherein a powder particle in each case one or more having wholly surrounding particles with a cladding material
  • a plasma source for introducing a physical-thermal plasma into the process area to activate the provided powder particles in the process area with the physical-
  • one method of forming a layered structure on a surface area of a device includes providing powder particles in a process area, wherein a powder particle each comprises one or more particles completely surrounded by a cladding material, activating the powder particles in the process area with a physical-thermal plasma, to cause a reduction in the viscosity or a change in the state of aggregation of at least a part of the cladding material of the powder ponds, and an application of the activated powder particles on the surface region of the component in order to obtain the particle-containing layer structure on the surface region of the component.
  • the core idea of the present invention is to use specially formed powder particles for a plasma-induced layer generation, wherein the specially formed powder particles are thermally activated in a process area by means of a physical-thermal (hot) plasma and then applied to the surface region of the device to be treated be to form a desired layer structure or coating on the device.
  • the individual powder particles have a completely surrounded by a shell material particles.
  • the cladding material comprises a filler, wherein the cladding material present in the cladding material is effective as an antioxidant and / or catalyst for the material of the particle core and / or the cladding during the activation process.
  • a single powder particle may also have a plurality of particles completely surrounded by a shell material.
  • the plasma activation process (on average) can be carried out in a very defined and reproducible manner, so that the u.U. "sensitive" particles can be thermally and mechanically protected by the cladding material in the plasma activation process in an effective manner. Due to the complete sheathing of the particles relative to the ambient atmosphere, a simplified storage and a technically simplified transport of the powder particles in the process area is also possible because due to the hermetic shield against the ambient atmosphere an unwanted chemical reaction such. As oxidation of the particles can be prevented.
  • the inventive concept is particularly applicable to particles having a relatively large, average diameter, z. B. with a diameter of greater than 20 microns or 50 microns, effectively applicable.
  • the sheath material will at least partially liquefy upon activation and re-solidify upon impact with the surface of the component, such that the re-stiffened sheath material effects a (mechanically strong) connection between the component and the particle.
  • the sheath material when activated, will be at least partially or completely separated from the particle, i. for example, evaporate or disintegrate, the particles themselves, even when applied to the surface area of the device, e.g. under the action of the plasma jet, be connected to the surface region of the component (mechanically strong or cohesive).
  • the cladding material may be configured to hermetically shield the particles of the powder elements from the ambient atmosphere prior to the processing process. This can cause a chemical reaction, such as oxidation, of the particles be prevented in (high) high-energy plasma.
  • the thickness of the cladding material may be selected such that during activation with the physical-thermal plasma, the particulate material is not heated above a specific limit temperature T max of the core material, the limit temperature T max being particle-material-dependent.
  • the threshold temperature indicates the temperature to which the particulate material can be heated without (substantial) material degradation.
  • the sheath material may have a higher, e.g. have at least 1.5 times or twice as high specific heat capacity as the particulate material.
  • the particles can be covered relatively uniformly with the sheathing material.
  • the powder particle may be a multiple coating of different materials or different material compositions, e.g. a layer sequence of several different layers. These different layers may, for example, have different functions e.g. provide as a protective layer and / or as a carrier of oxidation and / or catalyst materials.
  • the particles (particle cores) of the powder particles may have an average diameter between 1 ⁇ m to 500 ⁇ m, 20 ⁇ m to 200 ⁇ m, 46 ⁇ m to 150 ⁇ m, or 50 ⁇ m to 100 ⁇ m.
  • the (physical) hardness of the particles may be higher than the hardness of the component material in the surface area to be treated. As a result, a friction value change can be effected on the surface region of the component by the applied particles.
  • the material of the particle may be a metal (e.g., Cu) or a carbon compound such as Cu. Diamond (industrial diamond), boron carbide, silicon carbide, etc. have.
  • the sheath material may be a metal, e.g. a soft metal such as nickel, copper, tin, etc. Further, the sheath material to a filler material (additive), wherein the existing in the sheath material additive as an antioxidant (antioxidant), such as. As phosphorus, and / or can be effective as a catalyst for the material of the particle core or the sheath during the plasma activation process.
  • the sheathing material may be an organic material, such as, e.g. As a polymeric material, have.
  • the surface area of the component to be provided with the layer structure can be preheated. Preheating the treating surface area of the Component may also cause a cleaning, eg degreasing, etc., this area before the particle application. During preheating, the surface area of the component to be treated can be heated so as to have a temperature, for example, between 80 ° C. and 150 ° C. in the subsequent application of the activated powder particles.
  • the applied layer structure may have a non-continuous distribution of the particles on the surface area with a surface occupation density of 5% to 50%, i. the particles are distributed over the treated surface area of the device.
  • the applied layer structure may form a continuous, uniform coating on the treated surface area of the device.
  • the activation temperature may be in the process range, i. in the mixing range of the physical-thermal plasma and the powder elements, be several 1000 K.
  • the powder particles may be conveyed from a powder reservoir into the process area, wherein the powder particle flow through the process area is selected to maintain the desired change in viscosity over a predefined average energy intake of the powder particle, and in particular the shell material during the residence time in the process area or the physical state of the cladding material.
  • a magnetic and / or electric field may be generated in the area between the process area (activation area) and the device surface to avoid the e.g. metallic powder particles and separated from the charged particles of the plasma stream as possible before impinging on the surface region.
  • Fig. 1 shows a schematic diagram of a device 100 for producing a layer structure 200 on a surface portion 202 of a device 204.
  • a powder conveyor 102 is provided to powder particles 104, z. B. from a powder reservoir (not shown in Fig. 1 ) in a process area 106.
  • a powder 104 each one (or more) particles 104-1, which is completely surrounded or coated with a cladding material 104-2.
  • the particles 104 - 1 of the powder particles 104 have an average diameter d 1
  • the covering material 104 - 2 may have a mean (average) layer thickness d 2 . This results in a mean total diameter D of the powder particles 104 with D ⁇ d 1 + 2 * d 2 .
  • a plasma source 108 is provided to a physical-thermal plasma 110, z. B. in the form of a plasma jet to introduce into the process area 106 and to thermally activate the there provided powder particles 104 which pass through the process area 106 with the physical-thermal plasma 110.
  • the "plasma activation” causes a reduction in the viscosity or a change in the instantaneous state of aggregation of at least part of the covering material 104-2 or of the entire covering material 104-2 of the powder particles 104.
  • the thinner (flowable) is the particular material.
  • the powder particles i. the particle cores 104-1 provided with a protective sheath 104-2, for example directly to an arc discharge zone, i. a high-energy plasma zone, wherein the cladding layer 104-2 can absorb the intense plasma / ion energy, resulting in a liquefaction (at least in a viscous state) of the material of the cladding 104-2.
  • arc discharge zone i. a high-energy plasma zone
  • the cladding layer 104-2 can absorb the intense plasma / ion energy, resulting in a liquefaction (at least in a viscous state) of the material of the cladding 104-2.
  • Other arrangements for generating the thermal plasma may also be used, as will be discussed below.
  • any intermediate stages may be effected between a liquefied (e.g., viscous) state of at least a portion of the shell material and a wholly liquid, or a gaseous state of at least a portion of the shell material 104-2 of the powder particles 104 upon further reduction of viscosity.
  • a change in the state of aggregation of at least a portion of the sheath material 104-2 of the powder particles 104 a change from a first (eg solid) state of the sheath material to a second (fluid or viscous) state of the sheath material may be considered, further reducing the viscosity of the fluid or viscous sheath material can take place.
  • a change in viscosity due to an increase in temperature of the cladding material 104-2 of the powder particles 104 may cause at least "increased flowability" (a viscous state) of at least a portion of the cladding material 104-2 of the powder particles 104 during plasma activation.
  • a sufficient increase in the plasticity or plastic deformability of the cladding material 104-2 can be considered by the plasma activation.
  • a third (gaseous) state of at least a portion of the shell material 104-2 of the powder particles 104 may be effected, ie a transition from the fluid state to the gaseous state.
  • the apparatus 100 further comprises an applicator 112 (e.g., a nozzle) for applying the powder particles 104 to the surface region 202 of the device 204 to obtain the layer structure 200 having the particles 104-1 on the surface region 202 of the device 204.
  • an applicator 112 e.g., a nozzle
  • the application device 112 is considered to be the section of the device 100 which effects the transfer of the activated powder particles 104 'from the process region 106 to the surface region 202 to be treated. If, for example, the process area 106 is arranged in an (optional) housing 114, the application device 112 can optionally be embodied as an outlet opening or also as a nozzle arrangement 116 in order to align the activated powder particles 104 'in the direction of the surface area 202 of the component 204 to be treated to raise it.
  • a so-called “hot plasma” is referred to as physical-thermal plasma (also known as thermal plasma), wherein a hot plasma is in thermal or in local thermal equilibrium.
  • thermal plasma also known as thermal plasma
  • the heavier particles, i. the positively charged ions have approximately the same temperature as the higher-energy electrons.
  • gases such as Aragon, nitrogen, helium or hydrogen are used as the plasma gas.
  • any plasma sources 108 for introducing the physical-thermal plasma 110 into the process area 106 can be used.
  • atmospheric pressure plasma sources or normal pressure plasma sources can also be used, in which the pressure in the process area 106 can correspond approximately to that of the surrounding atmosphere, ie the so-called normal pressure.
  • atmospheric pressure plasmas require no (closed) reaction vessel, which ensures the maintenance of a pressure level different from the atmospheric pressure or deviating gas atmospheres.
  • an AC excitation low-frequency Alternating currents
  • stimulating AC currents in the radio wave range microwave excitation
  • a DC excitation can be used.
  • a pulsed arc can be generated with a high-voltage discharge (5-15 kV, 10-100 kHz), whereby the process gas flows past this discharge path where it is excited and transferred to the plasma state.
  • This plasma 110 is brought into contact with the powder particles in the process area 106, so that the powder particles are activated by the physical-thermal plasma 110.
  • the activated powder particles 104 are then guided out of a housing opening (eg a nozzle head) onto the surface region 202 of the component 204 to be treated.
  • the powder particles 104 may be compressed using compressed air, i. H. Air / oxygen or inert gases (N, Ar, He, etc.) as a carrier gas, are introduced into the process area 106 for plasma activation without a chemical reaction, such as. B. oxidation of the particles 104-1, is to be feared before the plasma activation.
  • compressed air i. H. Air / oxygen or inert gases (N, Ar, He, etc.) as a carrier gas
  • a layer structure consisting of a large number of particles applied and distributed in a controlled manner (hard particles) or even a uniform layer structure 200 (in the form of a coating) can be formed on the surface 202 of the component 204 to be treated.
  • the cladding material 104-2 is at least partially liquefied and then applied by means of the application device 112 to the surface 202 of the component or carrier element 204 to be treated.
  • the cladding material 104-2 is heated by a power supply by means of the plasma, so that the viscosity of at least a part of the cladding material 104-2 increases or the state of aggregation of the cladding material 104-2 of a solid state in a liquid or at least viscous state changes. This may involve the entire sheath material 104-2 or at least a portion thereof.
  • the sheathing material 104-2 reconsolidates, as the temperature of the material of the device 204 in the surface area 202 to be treated is generally below the temperature of the cladding material 104-2 of the activated powder particles 104.
  • the cladding material 104-2 which is resolidified at the surface area 202, thus effects a (fixed) mechanical connection between the component 204 and the applied particles 104-1 of the powder particles 104.
  • FIG. 2a-b In a schematic sectional view or top view of some of the controlled particles 104-1 with the re-solidified casing material 104-2 on the treated surface area (in the form of a small section) of the device to be coated 204th
  • the cladding material 104-2 may be selected to separate the cladding material 104-2 from the particles (particle cores) 140-1 when it is plasma activated , H.
  • the particles are vaporized or disintegrated, in which case the particles can be firmly bonded or surface-melted onto the surface region 202 of the component 204 under the action of the plasma jet under the action of the plasma jet or can be melted thereon to form the layer structure or coating 200 on the surface area 202 of the device 204 to be treated.
  • the cladding material 104-2 is now further configured to hermetically shield the particles 104-1 (particle cores) of the powder particles 104 from the respective ambient atmosphere prior to the processing process and in particular before the plasma activation.
  • a chemical reaction of the material of the particle cores 104-1 such as.
  • As an oxidation of the particulate material with the ambient atmosphere, for. As air can be prevented.
  • the cladding material 104-2 and in particular the selected thickness d 2 of the cladding layer 104-2 is selected such that the particulate material is not heated above a limit temperature T max during the activation with the physical-thermal plasma, the limit temperature being determined, for example, by the Particle material (and its associated specific heat capacity) and on the average diameter of the particles depends.
  • the limit temperature indicates the temperature to which the particulate material without (essential) Material damage can be heated.
  • the cladding material 104-2 has a specific heat capacity greater than the particulate material by a factor of at least 2 (at least 5 or 10) higher.
  • the specific heat capacity of a material or body is the ratio of the heat supplied to the body to the temperature increase caused thereby.
  • the particles 104-1 can be covered relatively uniformly with the respective covering material 104-2.
  • the powder particles 104 may be a multiple coating of different materials or different material compositions, e.g. B. in the form of a layer sequence of several different layers have.
  • the different layers may have different physical functions during storage and subsequently during the plasma treatment and during application to the surface area of the component to be treated.
  • the outermost coating layer as a protective layer against external environmental influences, eg. B. against oxidation, while the underlying layer or layers (or constituents thereof) in the plasma activation as additives, for.
  • antioxidants and / or catalysts can be effective.
  • the particles 104-1 have, for example, an average diameter d 1 of 25 ⁇ m to 500 ⁇ m, 46 ⁇ m to 200 ⁇ m or 50 ⁇ m to 150 ⁇ m.
  • the desired mean diameter of the particle cores 104 - 1 results from specifying the desired electrical, dielectric, optical and / or mechanical properties of the resulting layer structure or coating 200 on the surface region 202 of the coating carrier 204 to be treated.
  • the physical hardness (eg penetration hardness according to eg Brinell, Vickers etc.) of the particles 104-1 is, for example, higher by a factor of at least 2 (or at least 5 or 10) than the hardness of the component material in the
  • a change in the coefficient of friction (for example increase in the coefficient of friction) of the treated surface region can be brought about by the particles applied.
  • the material of the particles / particle cores 104-1 may be, for example, a metal, such as. As copper Cu, a polymer or a carbon compound.
  • the material of the particles 104-1 for producing a continuous (eg conductive) coating may comprise, for example, copper, tin, nickel, etc.
  • the material of the particles may be diamond, industrial diamond, silicon carbide SiC, boron carbide B 4 C, tungsten carbide WC, nitrides, such as. Silicon nitride Si 3 N 4 , boron nitride Bn, boride, silicon dioxide Si 2 and / or aluminum dioxide Al 2 O 3 or combinations thereof (including high-melting glass materials).
  • the list is not to be considered exhaustive.
  • the sheath material 104-2 (the sheath layer) may be, for example, a metal, such as a metal. B. a soft metal such. As nickel, copper, tin, etc. have. Soft metals are, for example, low-melting metals.
  • the layer thickness d2 of the cladding material 104-2 may be in a range of 25 ⁇ m ⁇ 10 ⁇ m (or for example between 10 ⁇ m and 100 ⁇ m, 20 and 50 ⁇ m or 20 ⁇ m and 30 ⁇ m).
  • the cladding material 104-2 further comprises an additive material, wherein the adjunct material present in the cladding material 104-2 is used as an antioxidant (antioxidant, such as phosphorus, zinc, or as a catalyst (eg, rhodium, palladium, vanadium pentoxide , various Cu / Cr / Zn / Ag oxides) during the plasma activation process, ie during the plasma exposure, are effective.
  • antioxidant antioxidant
  • phosphorus such as phosphorus, zinc
  • a catalyst eg, rhodium, palladium, vanadium pentoxide , various Cu / Cr / Zn / Ag oxides
  • an organic sensor material in the electrical sense
  • an antioxidant e.g. Phosphorus
  • gold Au
  • a layer thickness of 0.03 ⁇ m for example, between 0.01 and 0.1 ⁇ m
  • a multiple coating can be formed.
  • the particle core may comprise an iron-containing (Fe termes) functional material, wherein the material of the sheath zinc (Zn) may have.
  • the zinc may serve as a sacrificial material after application to the exposed ferrous material (Fe).
  • the particle core may comprise a magnetic functional material, wherein the material of the sheath may comprise a soft metal.
  • the soft metal shell can act as a thermal protection, so that theSschen districts of the magnetic functional material, for example, in the plasma treatment no damage.
  • a typical decomposition temperature for the Weissschen districts starts at approx. 140 ° C.
  • the particle core comprises a catalytic material, which sheath may provide a dual function as a protective layer and "adhesive" layer.
  • the production of catalytic functional surfaces, such as plastic carriers, is e.g. made with a catalyst surface for chemical processes.
  • antioxidant in this context, a chemical compound is considered, the oxidation of other substances, d. H.
  • the particle cores 104-1 in the plasma treatment slowed down or completely prevented by, for example, binds the existing oxygen itself.
  • an oxidative degradation of the particulate material can be prevented or at least reduced.
  • Catalysts are substances which increase the reaction rate (eg in the case of plasma activation) by lowering the activation energy of a chemical reaction in the form of a reduction in the viscosity or a change in the state of matter.
  • the nickel material if nickel is used as cladding material 104-2, the nickel material z.
  • phosphorus may be added at a level of 5 to 25% and about 10% ⁇ 5% such that the resulting melting point of the nickel material (cladding material) decreases from a range of about 1400 ° C to about 850 ° C, so that the Time of the required plasma treatment can be reduced to the desired viscosity of the cladding material, d. H. of the nickel material, for subsequent application to the surface 202 of the device 204 to be treated.
  • the heat input into the particle cores 104-1 can be controlled or significantly reduced, so that the material of the particle cores 104-1 is exposed to a significantly reduced thermal load (heating, mechanical stress, etc.).
  • the sheath material 104-2 may be an organic material, such as an organic material.
  • B. have a polymeric material, further wherein the above materials for the Particle cores 104-1, ie, for example, metals or soft metals, polymer materials and / or carbon compounds can be used.
  • the sheathing material 104-2 will at least partially liquefy upon activation and resolidify upon impact with the surface of the component, such that the re-stiffened sheath material effects a mechanical connection between the component and the particle.
  • the sheath material upon activation, will be at least partially or completely separated from the particle, i. for example, evaporate or disintegrate, the particles then, when applied to the surface area of the device, e.g. under the action of the plasma jet, be connected to the surface region of the component (mechanically strong or cohesive).
  • particles 104-1 surrounding / encased completely with the cladding material 104-2 are introduced into a physical-thermal (hot) plasma, wherein the cladding material 104-2 acts as a carrier and / or protective layer of the particle 104-1 which is actually to be applied acts.
  • the sheath may comprise a metallic and / or organic material. Since the inventive concept can be used in particular for average particle diameter of greater than 25 microns and, for example, in a range between 50 microns and 150 microns, is for the warming (plasma activation) of the cladding material 104-2 with a corresponding specific gravity a (relative ) used high-energy plasma.
  • the powder particles 104 to be activated are in the process area only for a relatively short time, e.g. B. in a process chamber, are used process temperatures of some 1000 ° K in the plasma activation.
  • the cladding layer 104-2 can prevent or at least limit the damage on the material of the particle cores 104-1 themselves and in particular their damage due to the high activation temperatures Surface areas occur, and on the other hand result in mechanical stresses in the particulate material, because despite the high temperatures at the same time insufficient homogeneous heating of the particles 104-1 can be avoided, which can otherwise lead to stress cracks in the particles in the worst case.
  • the protective layer 104-2 may now be further effective, for example, to remove the particles 104-1 in the processing process, i. H. during storage, supply to the process area or during plasma activation, before other unwanted chemical reactions such. As an oxidation to protect.
  • the cladding material 104-2 is at least partially liquefied during its plasma activation, and solidifies again upon impact with the surface 202 of the component, so that the resolidified Casing material causes a mechanical connection between the component and the respective particles.
  • the particulate material 104-1 may include an organic material (s) to function as functional elements for an electronic sensor array.
  • the organic material of the cladding 104-2 may also have dielectric properties.
  • the particles 104-1 in the powder material 104 may include, for example, organic materials that exhibit their physical or electrical (eg, dielectric) properties through plasma activation and mechanical coupling to or over the surrounding cladding material at the surface region 202 of the substrate 204 to change.
  • the cladding material may act as a solder material, with the physical change (s) being communicated to the substrate 204.
  • the substrate 204 may be, for example, a printed circuit board or even a chip surface. Suitable substrate materials are, for example, steel or stainless steel, glass fiber reinforced plastic materials (CFRP), polyamides (PA), polymers in general, cast materials, aluminum components, magnesium parts, sintered parts, etc. The list is not to be considered exhaustive.
  • a particle 104-1 of an organic material may be completely encased with a metal material 104-2 (as a cladding).
  • the metal sheath is activated by means of thermal plasma, wherein the metal material acting as a protective layer is at least partially melted.
  • the at least viscous (doughy) metal material further protects the organic material (organics) of the particles 104-1 from the very high surface temperatures due to the plasma activation.
  • the activated powder particle (material) 104 leaves the process area, e.g.
  • the process chamber and impinges on the substrate surface 202 where the activated powder particle 104 is applied and
  • the at least viscous sheath material bonds, for example, to the substrate material (eg, bakes or fused), wherein at least parts of the organic particle 104-1 are affected by the kinetics (speed, mass and damping) of the application process on the substrate surface be exposed from the cladding material (metal material).
  • another embodiment may be to metallize glass particles 104-1, i. H. to be provided with a metal jacket 104-2, wherein the activated, coated glass particles 104 can be selectively applied to the surface 202 to be treated.
  • the glass particles 104-1 are at least partially exposed, while the metal material 104-1 is exposed, for example, to the deformation of the metallic covering material 104-2 as described above on the surface area 202 of the component 204 to be treated. positive-locking (mechanically strong) connection with the substrate material is received.
  • the glass particles are held in the desired position by the (deformed) metal material of the casing, much like a gem in its socket.
  • sapphire or diamond particles can be used instead of glass particles to obtain desired optical properties on the surface of the treated substrate material.
  • the embodiments illustrated above are of course equally applicable to a particulate protection layer system in which a particle 104-1 of an organic material is encased with a metal 104-2 (eg soft metal) to form the organic particulate core 104- 2 to protect against superficial thermal damage or destruction (burning or charring) during the plasma treatment.
  • a metal 104-2 eg soft metal
  • a copper (Cu) layer is to be patterned on the substrate 204
  • a copper powder 104 provided with an organic protective layer 104-2 may be used. That is, the particles 104-1 are copper particles, while the cladding material 104-2 includes, for example, an organic protective layer, e.g. B. a polymeric material having. This can prevent that the copper material of the particles 104-1 is already exposed in the storage container to chemical reactions, i. for example, begins to oxidize. Furthermore, any reactions may be faster under the higher activation temperatures.
  • the organic protective layer 104-2 which encases and protects the copper particles 104-1, thus simplifies the long-term storage of the metal powder 104 (copper powder), and in particular also inexpensive and easily usable process gases, for example even air (compressed air), can be used.
  • the metal powder 104-1 (eg copper powder) sheathed with the protective layer 104-2 now enters the process area 106, e.g. B. in a plasma processing chamber, is there plasma-activated, d. H. heated, wherein the protective layer 104-2 may optionally even be provided with a further antioxidant additive, such as phosphorus.
  • the protective layer 104-2 is now removed during the plasma activation process, e.g. B. from the metal particle 104-1 (eg., Copper particles) burned away, so that the pure metal powder 104-1 remains and subsequently applied oxide-free on the substrate surface 202 to be treated or can be melted.
  • the metal particle 104-1 eg., Copper particles
  • the surface area 202 of the component 204 to be provided with the layer structure 200 may also be preheated.
  • This preheating process can be carried out, for example, specifically by means of laser irradiation or by means of the physical-thermal plasma itself (without the powder particles 104) or also over a large area by means of an inductive process or a (continuous) furnace.
  • a cleaning of this surface area can be carried out before the particle application.
  • the preheating of the surface area of the device to be treated it may be heated so as to maintain a temperature between 50 ° C and 250 ° C, between 80 ° C and 130 ° C or between 100 ° C during subsequent application of the activated powder particle 104 and 120 ° C.
  • the applied layer structure 200 may, for example, not be continuous or continuous, the particles 104-1 having an occupancy of, for example, 5% to 50% (or for example 2% to 95%, 3% to 80% or 3% to 30%. ) of the surface area distributed over the treating surface area 202 of the device.
  • Fig. 2a-b show schematic representations in a top view and sectional view (along the section line AA) of an applied layer structure 200 on the surface region 202 of the component 204.
  • the assignment or distribution given above is based, for example, on a (single) overrun process (treatment process) of the surface area to be coated.
  • the overrun of the "surface area to be coated” can also be repeated several times in order to obtain, for example, the desired resulting coverage (up to 100%) of the surface area with the powder particles.
  • the applied layer structure can also form a continuous coating on the treated surface area of the component.
  • Fig. 2c shows a schematic perspective view of an applied coating on the surface region 202 of the component 204 by way of example.
  • the overrunning process (treatment process) of the "surface area to be coated” can be repeated (multiple times) in order to obtain, for example, a homogeneous (iW void-free) layer structure, resulting in layer thicknesses d S of several ⁇ m to several 100 ⁇ m can.
  • the activation temperature in the process area ie in the mixing area of plasma and powder elements 104, can be, for example, between 1000 ° K and 10,000 ° K.
  • the plasma can be generated for example by means of an arc.
  • the powder particles 104 may consist of a powder reservoir (not shown in FIG Fig. 1 ) are conveyed to process area 106.
  • the powder particle flow or throughput through the process area 106 is now selected, for example, in order to bring about the desired change in the viscosity or the state of aggregation of the shell material in the process area 106 via a predefined average energy consumption of the shell material.
  • a deflection arrangement (not shown in FIG Fig.
  • a magnetic and / or electric field in a region between the process area (activation area) 106 and the device surface 202 to separate the (metallic) powder particles from the plasma stream, for example, to prevent the plasma from striking the device surface to be treated.
  • first powder particles 104 are provided in a process region (step 302), wherein a powder particle in each case has one or more particles 104-1 completely surrounding with a shell material 104-2.
  • the powder particles 104 in the physical-thermal-plasma process area 106 are activated (step 304) to cause a change, eg, decrease in viscosity, or a change in state of aggregation of at least a portion of the cladding material of the powder particles.
  • the activated powder particles 104 are applied to the surface region 202 of the device 204 (step 306) to obtain the (particle-containing) layer structure 200 on the surface region of the device.
  • the encasing material may be at least partially liquefied and resolidified in the step of depositing 306 on the surface area of the component.
  • the cladding material may be at least partially separated from the particle, and in the applying step 306, the particles are then bonded to the surface area of the device.
  • an optional preheating step (not shown in FIG Fig. 3 ) to be provided with the layer structure surface area of the device to a preheating temperature in a range of 50 ° C to 250 ° C, 80 ° C to 150 ° C or 90 ° C to 130 ° C.
  • the optional preheating step may be performed inductively (eg eddy current), by laser radiation, by electron beam, by a continuous furnace or by the physical-thermal plasma itself.
  • Deposition step 306 may be performed to produce a non-continuous layer structure having a surface occupation density between 2% and 95% on the treated surface area of the device.
  • the application step 306 may be performed to create a (at least partially) continuous coating 200 on the treated surface area of the device.
  • the powder particles may be conveyed from a powder reservoir into the process area.
  • the powder particle flow through the process area can be selected such that a desired change in the viscosity of the sheathing material is effected via a predefined mean energy absorption of the sheathing material.
  • a magnetic and / or electric field may be generated in the region between the process region and the device surface to at least partially separate the activated powder particles from the plasma stream prior to impacting the surface region.
  • aspects have been described in the context of an apparatus for fabricating a layered structure on a surface area of a device, it should be understood that these aspects also constitute a description of the corresponding method of fabricating a layered structure on a surface area of a device such that a block or device a device is also to be understood as a corresponding method step or as a feature of a method step.
  • aspects described in connection with or as a method step also represent a description of a corresponding block or detail or feature of a corresponding device.
  • Some or all of the method steps may be performed by a hardware device (or using a hardware device). Apparatus) as performed using a microprocessor, a programmable computer or an electronic circuit. In some embodiments, some or more of the most important method steps may be performed by such an apparatus.
  • a device 100 for producing a layer structure 200 on a surface region 202 of a component 204 may have the following features: a powder delivery device 102 for supplying powder particles into a process region 106, wherein a powder particle 104 is in each case completely coated with a shell material 104.
  • a plasma source 108 for introducing a physical-thermal plasma 110 into the process area 106 to activate the powder particles 104 provided in the process area 106 with the physical-thermal plasma 110 to a change of state of aggregation or a Reducing the viscosity of at least a portion of the sheath material 104-2 of the powder particles 104, and an applicator 112 for applying the activated powder particles 104 on the surface area 202 of the device 204 to obtain the layer structure 200 on the surface region 202 of the device 204.
  • the cladding material 104-2 may be configured to hermetically shield the particles 104-1 of the powder elements 104 from the ambient atmosphere prior to the processing process.
  • the sheath material 104-2 may have a greater specific heat capacity than the material of the particles 104-1.
  • the powder particles 104 may each comprise a multiple sheath of different materials or different material compositions.
  • the particle cores 104-1 may have an average diameter of 25 ⁇ m to 250 ⁇ m or from 46 ⁇ m to 250 ⁇ m.
  • the hardness of the material of the particles 104 - 1 may be higher than the hardness of the component material in the surface region 202.
  • the hardness of the material of the particles 104 - 1 may be less than the hardness of the component material in the surface region 202.
  • the plasma source 108 may be configured to provide the physical-thermal plasma 110 such that the cladding material 104-2 at least partially liquefies upon activation thereof.
  • the plasma source 108 may be configured to provide the physical-thermal plasma 110 so that the cladding material 104 - 2 may be included whose activation in the process area is separated or vaporized by the particles 104-1.
  • the sheath material may comprise a filler material, wherein the filler present in the sheath material is effective as an antioxidant and / or catalyst for the material of the particle core and / or sheath during the activation process.
  • the sheath material may comprise a metal or polymer material.
  • the apparatus may further comprise a pre-heater configured to preheat the surface area 202 of the device 204 to be provided with the layered structure 200 to a preheat temperature within a range of fifty ° C to 250 ° C or 80 ° C to 130 ° C.
  • the preheating device can be designed to preheat the surface region 202 of the component to be provided with the layer structure 200 inductively, by means of laser radiation, by electron beam, by means of a continuous furnace or by means of the physical-thermal plasma itself.
  • a device 100 for producing a layer structure 200 on a surface region 202 of a component 204 may have the following features: a powder delivery device 102 for supplying powder particles into a process region 106, wherein a powder particle 104 is in each case completely coated with a shell material 104.
  • a plasma source 108 for introducing a physical-thermal plasma 110 into the process area 106 to activate the powder particles 104 provided in the process area 106 with the physical-thermal plasma 110 to a change of state of aggregation or a Reduction of the viscosity of at least a portion of the cladding material 104-2 of the powder 104 to cause particles
  • an applicator 112 for applying the activated powder 104 on the surface portion 202 of the device 204 to the layer structure 200 on de m surface region 202 of the device 204, wherein the cladding material 104-2 is formed to the particles 104-1 of the powder elements 104 before the processing process hermetically shielded from the ambient atmosphere; and wherein the sheath material comprises a filler material, wherein the filler material present in the sheath material is effective as an antioxidant or catalyst for the material of the particle core and / or the sheath during the activation process.
  • a method 300 for producing a layer structure at a surface region of a device may comprise the steps of: providing 302 powder particles in a process area, wherein a powder particle each having one or more completely surrounded by a shell material particles, activating 304 of the powder particles in the A process area with a physical-thermal plasma to cause a change in the aggregate state or a reduction in the viscosity of at least a portion of the cladding material of the powder ponds, and applying 306 the activated powder on the surface region of the device to obtain the layer structure on the surface region of the device ,
  • the cladding material in the step of activating 304, may be at least partially liquefied and resolidified in the step of applying 306 on the surface area of the component.
  • the shell material in the step of activating 304, the shell material may be separated or evaporated from the particle, and in the step of applying 306, the particles may be bonded to the surface portion of the device.
  • the method may further include the step of: preheating the surface area of the device to be provided with the layered structure to a preheating temperature in a range of 50 ° C to 250 ° C or 80 ° C up to 130 ° C.
  • the preheating step may be performed inductively, by laser radiation, by electron beam, by a continuous furnace, or by the physical-thermal plasma itself.
  • the applying step 306 may be performed to produce a non-continuous layer structure having a surface occupation density of between 2% and 95% on the treated surface area of the device.
  • the applying step 306 may be performed to produce a continuous coating on the treated surface area of the device.
  • the powder particles may be conveyed from a powder reservoir into the process area.
  • the powder particle flow through the process area may be selected to effect a desired change in the viscosity of the shroud material over a predefined average energy input of the sheath material.
  • a magnetic and / or electric field may be generated in the area between the process area and the device surface to at least partially separate the powder particles from the plasma stream ,
  • embodiments of the invention may be implemented in hardware or in software, or at least partially in hardware, or at least partially in software.
  • the implementation may be performed using a digital storage medium such as a floppy disk, a DVD, a BluRay disc, a CD, a ROM, a PROM, an EPROM, an EEPROM or FLASH memory, a hard disk, or other magnetic or optical Memory are stored on the electronically readable control signals are stored, which can cooperate with a programmable computer system or cooperate such that the respective method is performed. Therefore, the digital storage medium can be computer readable.
  • some embodiments according to the invention include a data carrier having electronically readable control signals capable of interacting with a programmable computer system such that one of the methods described herein is performed.
  • embodiments of the present disclosure may be implemented as a computer program product having a program code, wherein the program code is operable to perform one of the methods when the computer program product runs on a computer.
  • the program code can also be stored, for example, on a machine-readable carrier.
  • an embodiment of the method according to the invention is thus a computer program which has a program code for performing one of the methods described herein when the computer program runs on a computer.
  • Another embodiment of the present disclosure is thus a data carrier (or a digital storage medium or a computer readable medium) on which the computer program is recorded for performing one of the methods described herein.
  • the data carrier or the digital storage medium or the computer-readable medium are typically tangible and / or non-volatile.
  • Another embodiment of the present disclosure is thus a data stream or sequence of signals that represents the computer program for performing any of the methods described herein.
  • the data stream or the sequence of signals may be configured, for example, to be transferred via a data communication connection, for example via the Internet.
  • Another embodiment includes a processing device, such as a computer or a programmable logic device, that is configured or adapted to perform one of the methods described herein.
  • a processing device such as a computer or a programmable logic device
  • Another embodiment includes a computer on which the computer program is installed to perform one of the methods described herein.
  • Another embodiment according to the disclosure includes an apparatus or system configured to transmit a computer program for performing at least one of the methods described herein to a receiver.
  • the transmission can be done for example electronically or optically.
  • the receiver may be, for example, a computer, a mobile device, a storage device or a similar device.
  • the device or system may include a file server for transmitting the computer program to the recipient.
  • a programmable logic device eg, a field programmable gate array, an FPGA
  • a field programmable gate array may cooperate with a microprocessor to perform one of the methods described herein.
  • the methods are performed by any hardware device. This may be a universal hardware such as a computer processor (CPU) or hardware specific to the process, such as an ASIC.

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Claims (9)

  1. Procédé (300) pour produire une structure en couches (200) sur une zone de surface d'un composant (204), aux étapes suivantes consistant à:
    mettre à disposition (302) des particules de poudre (104) dans une zone de processus (106), où une particule de poudre présente chaque fois une ou plusieurs particules (104-1) entourées entièrement d'un matériau de revêtement (104-2),
    activer (304) les particules de poudre dans la zone de processus (106) par un plasma physico-thermique (110), pour provoquer une modification de l'état d'agrégation ou une réduction de la viscosité d'au moins une partie du matériau de revêtement (104-2) des particules de poudre (104), où le matériau de revêtement (104-2) présente un matériau additionnel, où le matériau additionnel présent dans le matériau de revêtement (104-2) agit comme agent antioxydant et/ou comme catalyseur pour le matériau de la particule (104-1) et/ou du revêtement pendant l'opération d'activation, et
    appliquer (306) les particules de poudre activées (104') sur la zone de surface du composant (204) pour obtenir la structure en couches (200) sur la zone de surface du composant (204),
    dans lequel, à l'étape d'activation (304), le matériau de revêtement (104-2) est au moins partiellement liquéfié et resolidifié à l'étape d'application (306) sur la zone de surface du composant, ou
    dans lequel, à l'étape d'activation (304), le matériau de revêtement (104-2) est séparé de la particule ou vaporisé et dans lequel, à l'étape d'application (306), les particules sont assemblées à la zone de surface du composant (204).
  2. Procédé selon la revendication 1, par ailleurs à l'étape suivante consistant à:
    préchauffer la zone de surface du composant (204) à pourvoir de la structure en couches à une température de préchauffage dans une plage de 50°C à 250°C, ou de 80°C à 130°C.
  3. Procédé selon l'une des revendications 1 ou 2, dans lequel, à l'étape (302) de mise à disposition, le flux de particules de poudre à travers la zone de processus est choisi de sorte que par une dissipation d'énergie moyenne prédéfinie du matériau de revêtement (104-2) soit provoquée une variation souhaitée de la viscosité du matériau de revêtement.
  4. Procédé selon l'une des revendications 1 à 3, dans lequel, à l'étape (306) d'application est généré un champ magnétique et/ou électrique dans la zone entre la zone de processus (106) et la surface du composant pour séparer les particules de poudre (104) au moins partiellement du flux de plasma.
  5. Procédé selon l'une des revendications 1 à 4, dans lequel le matériau de revêtement (104-2) est conçu pour protéger hermétiquement les particules (104-1) des particules de poudre (104) de l'atmosphère ambiante avant le processus de traitement.
  6. Procédé selon l'une des revendications 1 à 5, dans lequel le matériau de revêtement (104-2) présente une plus grande capacité calorifique spécifique que le matériau des particules (104-1).
  7. Procédé selon l'une des revendications 1 à 6, dans lequel les particules de poudre (104) présentent, chacune, un revêtement multiple de matériaux différents ou de compositions de matériau différentes.
  8. Utilisation d'un dispositif (100) pour la mise en oeuvre du procédé (300) selon l'une des revendications précédentes, dans laquelle le dispositif (100) présente:
    une zone de processus (106),
    un moyen de transport de poudre (102) qui est utilisé pour mettre à disposition les particules de poudre (104) dans la zone de processus (106),
    une source de plasma (108) qui est utilisée pour introduire le plasma physico-thermique (110) dans la zone de processus (106) pour activer les particules de poudre (104) mises à disposition dans la zone de processus (106) par le plasma physico-thermique (110) de sorte que soit provoquée une modification de l'état d'agrégation ou une réduction de la viscosité d'au moins une partie du matériau de revêtement (104-2) des particules de poudre (104), où le matériau additionnel présent dans le matériau de revêtement agit comme agent antioxydant et/ou comme catalyseur pour le matériau du noyau de particule et/ou du revêtement pendant l'opération d'activation, et
    un moyen d'application (112) qui est utilisé pour appliquer les particules de poudre activées (104) sur la zone de surface (202) du composant (204) pour obtenir la structure en couches (200) sur la zone de surface (202) du composant (204),
    dans lequel la source de plasma (108) est conçue pour activer les particules de poudre mises à disposition dans la zone de processus par un plasma physico-thermique de sorte que
    le matériau de revêtement (104-2) soit au moins partiellement liquéfié et resolidifié lors de l'application sur la zone de surface du composant (204), ou
    le matériau de revêtement (104-2) soit séparé de la particule (104-1) ou vaporisé,
    dans lequel, lors de l'application, les particules sont assemblées avec la zone de surface du composant (204).
  9. Utilisation selon la revendication 8, dans laquelle le dispositif (100) présente par ailleurs un moyen de préchauffage qui est conçu et qui est utilisé pour préchauffer la zone de surface (202) du composant (204) à pourvoir de la structure en couches (200) à une température de préchauffage qui se situe dans une plage de 50°C à 250°C ou de 80°C à 130°C.
EP17157684.6A 2016-02-23 2017-02-23 Procédé de fabrication d'une structure en couches sur une zone de surface d'un élément de construction et utilisation d'un dispositif pour effectuer ce procédé Active EP3211974B8 (fr)

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DE102019205745A1 (de) * 2019-04-18 2020-10-22 Ecocoat Gmbh Beschichtetes abrasives Werkzeug und Verfahren zum Herstellen desselben
CN112725793B (zh) * 2020-12-30 2023-02-28 安徽晨光高耐磨科技股份有限公司 一种侧挡板等离子体熔覆高熵粉耐磨层的工艺及侧挡板

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DE3538390A1 (de) * 1985-10-29 1987-04-30 Deutsche Forsch Luft Raumfahrt Beschichtung fuer ein substrat und verfahren zu dessen herstellung
DE3813804A1 (de) * 1988-04-23 1989-11-09 Glyco Metall Werke Schichtwerkstoff oder schichtwerkstueck und verfahren zu seiner herstellung
US7112758B2 (en) * 2003-01-10 2006-09-26 The University Of Connecticut Apparatus and method for solution plasma spraying
GB0909183D0 (en) * 2009-05-28 2009-07-08 Bedi Kathryn J Coating method
GB201219642D0 (en) * 2012-11-01 2012-12-12 Norwegian Univ Sci & Tech Ntnu Thermal spraying of ceramic materials
DE102013100084A1 (de) * 2013-01-07 2014-07-10 Reinhausen Plasma Gmbh Verfahren zur herstellung zumindest einer schicht einer feststoffbasierten dünnschichtbatterie, plasma-pulver-sprüher hierfür und feststoffbasierte dünnschichtbatterie

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