EP3199351B1 - Tintenstrahlkopf und tintenstrahlkopfherstellungsverfahren - Google Patents

Tintenstrahlkopf und tintenstrahlkopfherstellungsverfahren Download PDF

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Publication number
EP3199351B1
EP3199351B1 EP15843126.2A EP15843126A EP3199351B1 EP 3199351 B1 EP3199351 B1 EP 3199351B1 EP 15843126 A EP15843126 A EP 15843126A EP 3199351 B1 EP3199351 B1 EP 3199351B1
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EP
European Patent Office
Prior art keywords
electrode unit
piezoelectric element
connecting member
adjustment member
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP15843126.2A
Other languages
English (en)
French (fr)
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EP3199351A4 (de
EP3199351A1 (de
Inventor
Hironobu YAMAGUCHI
Yuichi Machida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Inc
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Konica Minolta Inc
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Filing date
Publication date
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Publication of EP3199351A1 publication Critical patent/EP3199351A1/de
Publication of EP3199351A4 publication Critical patent/EP3199351A4/de
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Publication of EP3199351B1 publication Critical patent/EP3199351B1/de
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14362—Assembling elements of heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/18—Electrical connection established using vias

Definitions

  • the present invention relates to an inkjet head and a method for manufacturing the inkjet head, particularly relates to the inkjet head capable of reliably achieving electrical connection, with a simple method, in performing electrical connection between an electrode on a head chip and wiring on a wiring substrate by equalizing a height of a contact surface.
  • Patent Literature 2 discloses a technique of equalizing the contact state of each of electrical connecting sites and preventing a partial contact failure by allowing the position where the first electrode unit comes in contact with the wiring and the position where the second electrode unit comes in contact with the wiring to have a same height in order to achieve reliable electrical connection between each of the first electrode unit and the second electrode unit formed on the piezoelectric element, with the wiring of the wiring substrate.
  • US 2008 049 077 A1 discloses a liquid transporting apparatus which includes a channel unit having a plurality of pressure chambers, a piezoelectric actuator having a vibration plate, a plurality of piezoelectric elements, a first electrode and second electrodes, and a flexible wiring member connected to the second electrodes.
  • a support section is provided on the surface of the vibration plate, not facing the pressure chambers. A surface of the support section which does not face the vibration plate is joined to the flexible wiring member to support the flexible wiring member.
  • US 2011 074 252 A1 discloses a method for manufacturing a piezoelectric actuator which includes: forming a diffusion-preventive layer having an electrical conductivity on a partial surface thereof on a surface of a vibration plate formed of a metallic material; forming a piezoelectric layer on the surfaces of the diffusion-preventive layer and the vibration plate; forming an electrode in an area of the piezoelectric layer which overlaps the partial surface of the diffusion-preventive layer having the electrical conductivity; forming an extraction electrode in an area of the piezoelectric layer which does not overlap the diffusion-preventive layer; and heating the piezoelectric layer and the vibration plate after the piezoelectric layer is formed so as to diffuse metallic atoms of the metallic material of which the vibration plate is formed to the piezoelectric layer, thereby making the extraction electrode be in conduction with the partial surface of the diffusion-preventive layer having the electrical conductivity.
  • Patent Literatures 1 and 2 has a configuration in which the bump is built on the first electrode unit formed on the piezoelectric element, and thus, an attempt to use high pressure to reliably achieve electrical connection in bonding when the wiring substrate is mutually pasted might cause the pressure to be concentrated on the bump on the surface of the first electrode unit and damage the piezoelectric element. This leads to a problem of occurrence of demands for high-accuracy pressure control at the time of pressure bonding.
  • Patent Literature 2 because of the configuration in which a bump provided on the first electrode unit and a bump provided on the second electrode unit, of the piezoelectric element, are connected with the wiring of the wiring substrate, there may be a case where bonding heights are not even and electrical connection becomes uncertain when the pressure at pressure bonding is not even.
  • an object of the present invention is to provide an inkjet head capable of reliably performing electrical connection using a novel and simple configuration that equalizes the height of the contact surface on the electrical connection between the electrode on the head chip and the wiring on the wiring substrate, and a method for manufacturing the inkjet head.
  • Fig. 1 is a cross-sectional diagram illustrating an exemplary inkjet head according to the present invention.
  • Fig. 2 is a plan view of a head chip of the inkjet head.
  • Fig. 3 is a partially enlarged cross-sectional diagram of the inkjet head.
  • An inkjet head 1 has an integrated stacked configuration formed with a head chip 10 and a wiring substrate 20, having a spacer substrate 30 therebetween. On an upper surface of the wiring substrate 20, a box-shaped manifold 40 is arranged. The inside of the manifold 40 is an ink storage chamber 41.
  • a Z-direction indicated with an arrow represents “lower” and the opposite direction thereof represents “upper”, relative to a state of the inkjet head 1 in Figs. 1 and 3 .
  • the direction with “above” or “up” represents a direction opposite to the Z-direction of the inkjet head 1 and the direction with “below “ or “down” represent a direction along the Z-direction.
  • “upper surface” represents a surface arranged in the direction opposite to the Z-direction of the inkjet head 1 and "lower surface” is a direction arranged in the Z-direction.
  • the head chip 10 is configured with a nozzle plate 11, an intermediate plate 12, a pressure chamber plate 13, and a vibration plate layer 14, stacked from the lower side in Fig. 3 .
  • the pressure chamber plate 13 is formed of a silicon (Si) substrate, for example.
  • the pressure chamber plate 13 includes a pressure chamber 131 that contains ink ejected from a nozzle 111 formed on the nozzle plate 11.
  • the number of pressure chambers 131 may be any, that is, it is sufficient to have at least one.
  • the present embodiment exemplifies the inkjet head 1 including a plurality of the pressure chambers 131.
  • the plurality of pressure chambers 131 is arrayed in the X-Y direction of the head chip 10 (refer to Fig. 2 ) when the head chip 10 is seen in plan view.
  • the pressure chamber 131 is formed so as to penetrate the pressure chamber plate 13. Accordingly, an upper wall of the pressure chamber 131 is formed with the vibration plate layer 14 and a lower wall is formed with the intermediate plate 12.
  • the vibration plate layer 14 is formed of a silicon oxide (SiO2) film, for example.
  • the vibration plate layer 14 includes, corresponding to the pressure chamber 131, an ink inflow port 132 that opens onto an upper surface of the head chip 10.
  • the intermediate plate 12 is formed of a glass substrate, for example.
  • the intermediate plate 12 includes, corresponding to the pressure chamber 131, a plurality of communication passages 121 that communicates with the inside of the pressure chamber 131.
  • the nozzle plate 11 is formed of a Si substrate, for example.
  • the nozzle plate 11 includes, corresponding to each of the communication passages 121 of the intermediate plate 12, a plurality of nozzles 111 opening onto a lower surface of the nozzle plate 11. Accordingly, the inkjet head 1 according to the present embodiment ejects ink downward from the nozzle 111.
  • the piezoelectric element 15 is provided on the upper surface of the head chip 10. Corresponding to each of the pressure chambers 131, the piezoelectric element 15 is arranged on an upper surface of the vibration plate layer 14 that forms an upper wall of the pressure chamber 131.
  • the piezoelectric element 15 according to the present embodiment is formed of a PZT thin film having a predetermined thickness. Since it is possible to etch the PZT thin film using a photolithography technology, making it possible to easily form a plurality of piezoelectric elements 15 arrayed in a predetermined pattern.
  • the piezoelectric element 15 includes a first electrode unit 151 and a second electrode unit 152.
  • the first electrode unit 151 is an individual electrode provided individually for each of the piezoelectric elements 15, formed on an upper surface of the piezoelectric element 15.
  • the second electrode unit 152 is a shared electrode for GND provided for the shared use by the plurality of piezoelectric elements 15, formed on a lower surface of the piezoelectric element 15.
  • the second electrode unit 152 is formed on the upper surface of the vibration plate layer 14, and the piezoelectric element 15 is mounted on an upper surface of the second electrode unit 152.
  • an upper surface of the first electrode unit 151 is arranged at a predetermined height H1 (refer to Fig. 3 ) .
  • the height H1 at which the upper surface of the first electrode unit 151 is arranged is defined as a height from the upper surface of the vibration plate layer 14 just below the piezoelectric element 15 to the upper surface of the first electrode unit 151, relative to the upper surface of the vibration plate layer 14. There is no bump provided on the upper surface of the first electrode unit 151
  • the second electrode unit 152 is formed so as to significantly protrude to the outside of a forming region of the piezoelectric element 15. Specifically, the second electrode unit 152 is formed toward an end portion arranged in a Y-direction of the head chip 10 and toward an end portion arranged in a direction opposite to the Y-direction, illustrated in Fig. 2 , so as to protrude to the outside of the forming region of piezoelectric element 15. With this configuration, a lead-out unit 153 is formed on the upper surface of the vibration plate layer 14. The lead-out unit 153 is formed of an electrode film same as that of the second electrode unit 152 (refer to Fig. 3 ). That is, the second electrode unit 152 is electrically drawn to the outside of the forming region of the piezoelectric element 15 by the lead-out unit 153, on the upper surface of the vibration plate layer 14.
  • the second electrode unit 152 is electrically drawn from the lead-out unit 153 shared by the plurality of piezoelectric elements 15. This configuration can integrate the second electrode unit 152 formed on the plurality of piezoelectric elements 15, onto the lead-out unit 153, making it possible to simplify electrical connection toward a plurality of the second electrode units 152.
  • An adjustment member 16 is provided on an upper surface of the lead-out unit 153.
  • the adjustment member 16 is a member for adjusting the height of an electrical connecting site for achieving electrical continuity between the lead-out unit 153 and a connecting member of the wiring substrate 20 to be described below.
  • the adjustment member 16 according to the present embodiment is formed so as to extend along the X-direction illustrated in Fig. 2 , on the upper surface of the lead-out unit 153 drawn in the vicinity of both end portions of the head chip 10.
  • the adjustment member 16 may be formed of a single member on the upper surface of the lead-out unit 153, or may be formed by stacking a plurality of layers on the upper surface of the lead-out unit 153.
  • Each of the adjustment members 16 in the vicinity of the both end portions of the head chip 10 is divided into two in the X-direction. With this configuration, it is possible to prevent the adjustment member 16 from being deformed or damaged by becoming too elongated. However, it is sufficient to have at least one adjustment member 16 in the present invention.
  • the adjustment member 16 is preferably formed of a material having Poisson's ratio of 0.4 or below. Typical Poisson's ratio of the piezoelectric element 15 is approximately 0.3. In addition, Poisson's ratio of gold bump typically used as a first connecting member 25 and a second connecting member 26, to be described below, of the wiring substrate 20 is approximately 0.44. Accordingly, it is possible to allow the first connecting member 25 and the second connecting member 26, connected with the piezoelectric element 15 and the adjustment member 16, to be more easily crushed compared with the piezoelectric element 15 and the adjustment member 16. With this configuration, it is possible to enhance reliability of electrical connection and reduce the load on the piezoelectric element 15.
  • a more preferable value is defined as the Poisson's ratio of the above-described material used as the adjustment member 16, in relation with the piezoelectric element 15. That is, it is more preferable that the adjustment member 16 uses a material having Poisson's ratio substantially equal to the Poisson's ratio of the piezoelectric element 15. This enables the degree of crush in both the connecting members 25 and 26 to be about the same degree when each of the first connecting member 25 and the second connecting member 26 is electrically connected with each of the upper surface of the first electrode unit 151 of the piezoelectric element 15 and an upper surface of the adjustment member 16. Accordingly, it is possible to substantially equalize the pressure applied to the piezoelectric element 15 and the pressure applied to the adjustment member 16, and thus to further enhance reliability of electrical connection and to further reduce the load on the piezoelectric element 15.
  • the adjustment member 16 exemplifies a preferred mode using a piezoelectric element of a same material as the piezoelectric element 15 provided for each of the pressure chambers 131, that is, using the PZT thin film. This makes it possible to easily substantially equalize the Poisson's ratio of the material used as the adjustment member 16 and the piezoelectric element 15. Moreover, it is possible to pattern the both with a same step.
  • the adjustment member 16 is formed by providing a third electrode unit 161 on the upper surface of the piezoelectric element.
  • the third electrode unit 161 can be formed with a step same as the steps of forming the first electrode unit 151 on the upper surface of the piezoelectric element 15.
  • the piezoelectric element 15 and the adjustment member 16 are patterned with a same step, including the first electrode unit 151 and the third electrode unit 161.
  • the first electrode unit 151 is provided on the upper surface of the piezoelectric element 15 and the third electrode unit 161 is provided on the upper surface of the adjustment member 16, these electrode units 151 and 161 are formed into sufficiently thin films compared with the piezoelectric element positioned below. Therefore, existence of these electrode units 151 and 161 can be disregarded in the hardness (Poisson's ratio) of the piezoelectric element 15 and the adjustment member 16 in a case where each of the first connecting member 25 and the second connecting member 26 of the wiring substrate 20 is connected with each of the first electrode unit 151 and the third electrode unit 161, respectively.
  • the upper surface of the adjustment member 16 is arranged to be substantially equal to the height H1 of the upper surface of the first electrode unit 151. If both surfaces can be patterned with a same step, it would be easy to form the both surfaces such that the height of the upper surfaces of the both can be arranged at a substantially equal height. Accordingly, it is possible to equalize, with a simple method, the height of the upper surface of the first electrode unit 151 and the height of the upper surface of the third electrode unit 161, on the head chip 10 electrically connected with the wiring of the wiring substrate 20.
  • the height of the upper surface of the adjustment member 16 is defined as a height from the upper surface of the vibration plate layer 14 just below the piezoelectric element 15 to the upper surface of the third electrode unit 161 of the adjustment member 16, relative to the height of the upper surface of the vibration plate layer 14. There is no bump provided on the upper surface of the third electrode unit 161.
  • the height of the upper surface of the adjustment member 16 being “substantially equal” to the height H1 of the upper surface of the first electrode unit 151 means that there may be variation in the height between the two heights, to the degree that can solve the problem of the present invention. Specifically, this mean that the value obtained by subtracting the height of the upper surface of the adjustment member 16 from the value of the height H1 of the upper surface of the first electrode unit 151 is within ⁇ 3% of the value of the height H1 of the upper surface of the first electrode unit 151. Of course, it is preferable that the height of the upper surface of the adjustment member 16 is equal to the height H1 of the upper surface of the first electrode unit 151.
  • the height of the upper surface of each of the first electrode unit 151 and the adjustment member 16 corresponds to an individual average value.
  • the upper surface of the adjustment member 16 has sufficiently a large area.
  • the third electrode unit 161 on the upper surface of the adjustment member 16 has an area equal or greater than the area of the first electrode unit 151 on the upper surface of one piezoelectric element 15. This facilitates positioning in the X-Y direction at the time of performing electrical connection with the connecting member of the wiring substrate 20 to be described below, making it possible to perform bonding operation of the wiring substrate 20 easily.
  • a through hole 162 that vertically penetrates the adjustment member 16 is formed on at least a part of the adjustment member 16. This configuration causes the lead-out unit 153 to face the inside of the through hole 162.
  • a sufficient amount of conductive material 163 is filled inside the through hole 162.
  • the conductive material 163 is a conductive material that is pasty when being filled and that is cured by heating after being filled, and more preferably, the conductive material 163 is conductive adhesive.
  • Part of the filled conductive material 163 overflows from the through hole 162, expanding over the third electrode unit 161 around the through hole 162. This allows electrical continuity between the third electrode unit 161 and the lead-out unit 153 via the conductive material 163. There is electrical continuity between the lead-out unit 153 and the second electrode unit 152 on the lower surface of the piezoelectric element 15, leading to electrical continuity between the third electrode unit 161 and second electrode unit 152 via the lead-out unit 153. Note that the conductive material 163 filled within the through hole 162 is cured after bonding of the wiring substrate 20.
  • the wiring substrate 20 includes a substrate main body 21 formed of a Si substrate, for example. On the lower surface of the substrate main body 21, there are first wiring 22 and second wiring 23.
  • the first wiring 22 is used to achieve electrical connection individually toward the first electrode unit 151 of the plurality of piezoelectric elements 15.
  • the second wiring 23 is used to achieve electrical connection that is shared by the second electrode unit 152 of the plurality of piezoelectric elements 15.
  • the first wiring 22 is drawn to the upper surface of the substrate main body 21 via a penetrating wiring unit 221 that penetrates the substrate main body 21, and is electrically connected to a first upper wiring unit 222.
  • the second wiring 23 is drawn to the upper surface of the substrate main body 21 via a penetrating wiring unit 231 that penetrates the substrate main body 21, and is electrically connected to a second upper wiring unit 232.
  • the first upper wiring unit 222 and the second upper wiring unit 232 are electrically connected with an FPC 50 illustrated in Fig. 1 .
  • a reference sign 24 represents a protection layer formed of SiO2 and polyimide, for example, provided on upper and lower surfaces of the substrate main body 21 and used for protecting the first wiring 22, the second wiring 23, the first upper wiring unit 222, and the second upper wiring unit 232.
  • the first connecting member 25 and the second connecting member 26 are provided on the lower surface of the wiring substrate 20.
  • the first connecting member 25 is an electrical connection member connected with the first electrode unit 151 on the head chip 10.
  • the second connecting member 26 is an electrical connection member connected with the second electrode unit 152 via the third electrode unit 161 and the lead-out unit 153 on the head chip 10.
  • the protection film 24 for the sites on which the first connecting member 25 and the second connecting member 26 are provided is removed, and the first wiring 22 and the second wiring 23 are exposed on the lower surface of the wiring substrate 20.
  • the first connecting member 25 has electrical continuity with the first wiring 22 and the second connecting member 26 has electrical continuity with the second wiring 23.
  • Each of the first connecting member 25 and the second connecting member 26 is formed in a shape of protrusion, from the lower surface of the wiring substrate 20, in the Z-direction in which the head chip 10 is arranged. Moreover, each of the tip position of the first connecting member 25 and the tip position of the second connecting member 26 is arranged to have a substantially equal height H2 (refer to Fig. 3 ) in the Z-direction in which the head chip 10 is arranged. This configuration facilitates electrical connection with the first electrode unit 151 and the third electrode unit 161, on the head chip 10.
  • the height of the tip position of each of the first connecting member 25 and the second connecting member 26 is defined, relative to a contact surface between the first connecting member 25 and the lower surface of the first wiring 22, as a height from the contact surface to the tip position of the first connecting member 25, and a height from the contact surface to the tip position of the second connecting member 26.
  • the tip position of the first connecting member 25 and the tip position of the second connecting member 26 being “substantially equal” means that there may be variation in the height between them, to the degree that can solve the problem of the present invention. Specifically, this means that the value obtained by subtracting the height of the tip position of the second connecting member 26 from the height of the tip position of the first connecting member 25 falls within ⁇ 10% of the height of the tip position of the first connecting member 25. Of course, it is preferable that the height of the tip positions of the first connecting member 25 is equal to the height of the second connecting member 26.
  • the height of each of the first connecting member 25 and the second connecting member 26 corresponds to an individual average value.
  • Each of the first connecting member 25 and the second connecting member 26 is formed of a conductive member.
  • the conductive member is a stud bump.
  • An exemplary stud bump is formed by first making a metal ball by applying electric discharge and melting to a tip of thin wire of metal such as Au, bonding the metal ball with the surface of each of the first wiring 22 and the second wiring 23 using heat and ultrasound, and tearing the metal thin wire off the metal ball so as to form the bump at a predetermined height of protrusion. This achieve a shape of the stud bump, including, at its base, a plateau-shaped or knob-shaped shoulder portion derived from the metal ball, and a conical shaped side surface.
  • the tip portion side of the stud bump includes a protrusion formed of a portion of metal thin wire protruding from the shoulder portion.
  • the protrusion is easily plastically deformable and therefore is free from the risk of damaging the piezoelectric element.
  • the stud bumping can easily form bumps with various heights of shoulder portion by varying the size of the metal ball, the size of the tip portion and the shoulder portion might differ depending on the size of the stud bump, leading to a difference in the degree of plastic deformation. Accordingly, in view of performing electrical connection more reliably by making plastic deformation on the first connecting member and the second connecting member to be on a similar level at the time of performing electrical connection, it would be preferable that the sizes of the first connecting member and the second connecting member are on a similar level.
  • the tip position of the stud bump is a tip position of the protrusion, formed by the metal thin wire torn off from the metal ball.
  • each of conductive materials 251 and 261 is applied onto each of the first connecting member 25 and a second connecting portion 26, respectively.
  • this configuration even when there is a slight error between the height of the first connecting member 25 and the height of the second connecting portion 26, it is possible to absorb the error, and thus, to further ensure electrical connection between the first connecting member 25 and the first electrode unit 151, and between the second connecting portion 26 and the third electrode unit 161. Moreover, there would be no need to apply excessive pressure at electrical connection.
  • each of the conductive materials 251 and 261 is a conductive material that is pasty when being applied and that is cured by heating after being applied, and more preferably, each of the conductive materials 251 and 261 is conductive adhesive.
  • conductive adhesive By using conductive adhesive, simultaneous pasting is possible between the first connecting member 25 and the first electrode unit 151, and between the second connecting portion 26 and the third electrode unit 161, in addition to electrical connection between them. This leads to further facilitation of the production steps of the inkjet head 1, including connection of the head chip 10 with the wiring substrate 20.
  • a reference sign 27 indicates an ink flow path for supplying the ink within the ink storage chamber 41 (refer to Fig. 1 ) to each of the pressure chambers 131 of the head chip 10 after penetrating the wiring substrate 20.
  • the spacer substrate 30 maintains a space between the head chip 10 and the wiring substrate 20 to a predetermined space and ensures a connection region therebetween, for connecting the piezoelectric element 15 with the first connecting member 25, and for connecting the adjustment member 16 with the second connecting member 26.
  • the spacer substrate 30 includes openings 31 and 32.
  • the opening 31 is formed corresponding to the arrangement position of the piezoelectric element 15 on the head chip 10.
  • the opening 32 is formed corresponding to the arrangement position of the adjustment member 16.
  • the openings 31 and 32 penetrate the spacer substrate 30, as illustrated in Fig. 3 .
  • the piezoelectric element 15 on the head chip 10 and the first connecting member 25 on the wiring substrate 20 are contained within the opening 31.
  • the adjustment member 16 on the head chip 10 and the second connecting member 26 on the wiring substrate 20 are contained within the opening 32.
  • each of the openings 32 is formed into a size that includes the two adjustment members 16 near each of the end portions of the head chip 10.
  • the spacer substrate 30 includes a through hole 33 configured to connect the ink inflow port 132 that opens onto the upper surface of the head chip 10, with the ink flow path 27 formed on the wiring substrate 20.
  • the spacer substrate 30 may be formed of any material.
  • the spacer substrate 30 uses alloy formed of 42 alloy (42Ni). Suitable surface treatment such as insulation treatment and rustproofing is applied to the spacer substrate 30.
  • a reference sign 34 indicates an air release groove for releasing the air within the openings 31 and 32 at the time of bonding of the head chip 10 and the wiring substrate 20, with the spacer member 30 sandwiched therebetween.
  • a reference sign 35 indicates a suction groove for sucking the spacer substrate 30 when moving the spacer substrate 30 by a moving apparatus (not illustrated). The air release groove 34 and the suction groove 35 are formed at a depth that would not penetrate the spacer substrate 30, from the upper surface of the spacer substrate 30.
  • the head chip 10 and the wiring substrate 20 are bonded with each other, sandwiching the spacer substrate 30 therebetween.
  • This bonding enables contact of the first connecting member 25 on the wiring substrate 20 onto the first electrode unit 151 on the piezoelectric element 15 so as to allow electrical connection, and at the same time, and simultaneously enables contact of the second connecting member 26 on the wiring substrate 20 onto the third electrode unit 161 of the adjustment member 16 so as to allow electrical connection.
  • the upper surface of the first electrode unit 151 of the piezoelectric element 15 and the upper surface of the third electrode unit 161 of the adjustment member 16 are arranged at the substantially equal height H1, and thus, the heights of the contact surfaces of both are substantially even. Moreover, there is no bump provided on the upper surface of each of the first electrode unit 151 and the third electrode unit 161. Accordingly, at pressure bonding of the head chip 10 with the wiring substrate 20, no uneven pressure is applied to the first electrode unit 151 and the third electrode unit 161. With this configuration, there is no need to perform high-accuracy pressure control to prevent damage on the piezoelectric element 15, or the like, leading to facilitation of reliable electrical connection.
  • the tip position of the first connecting member 25 and the tip position of the second connecting member 26 are arranged at a substantially equal height H2, making it possible to further facilitate reliable electrical connection.
  • the number of the second connecting member 26 electrically connected with the third electrode unit 161 of one adjustment member 16 is preferably more than one, as illustrated in Fig. 4(a) .
  • the plurality of second connecting members 26 it is possible to reduce current density. It is also possible to prevent the pressure at the time of pressure bonding of the second connecting member 26 with the third electrode unit 161 from being concentrated at one point.
  • a part of the second connecting members 26 among the plurality of second connecting members 26 is arranged so as to come in contact solely with the conductive material 163 filled into the through hole 162 to achieve electrical connection, as illustrated in Fig. 4 (b) .
  • a removal portion 241 is formed on the protection layer 24 covering the second wiring 23 so as to expose the second wiring 23 of a site that corresponds to the conductive material 163.
  • the conductive material 163 is formed at a height sufficient enough to be able to come in contact with the second wiring 23 exposed within the removal portion 241 when the second connecting portion 26 is electrically connected with the third electrode unit 161.
  • the wiring substrate 20 within which the first wiring 22 and the second wiring 23 are formed on the substrate main body 21, is prepared ( Fig. 5(a) ).
  • a first connecting portion 25 and the second connecting portion 26 are formed ( Fig. 5(b) ) respectively for each of the first wiring 22 and the second wiring 23 exposed on the lower surface of the wiring substrate 20.
  • the first connecting member 25 and the second connecting member 26 are formed (connecting member formation step) such that they have protruding shapes in the direction of arrangement of the head chip 10, and that the tip position of the first connecting portion 25 and the tip position of the second connecting portion 26 are arranged at the substantially equal height H2 in the Z-direction in which the head chip 10 is arranged.
  • each of the conductive materials 251 and 261 is applied to each of the first connecting member 25 and the second connecting member 26, as illustrated in Fig. 5(c) .
  • the conductive materials 251 and 261 can be applied in the following manner, for example. First, a film, with a predetermined thickness, of the conductive material is formed on a glass substrate. Then, the wiring substrate 20 is stacked on the glass substrate, allowing the tips of the first connecting member 25 and the second connecting member 26 to come in contact with the film of the conductive material. Thereafter, the conductive material on the glass substrate is transferred to the tip of the first connecting member 25 and the second connecting member 26 by separating the wiring substrate 20 from the glass substrate. With this procedure, it is possible to apply conductive material collectively onto tips of a plurality of the first connecting member 25 and a plurality of the second connecting member 26.
  • the head chip 10 on which the nozzle plate 11, the intermediate plate 12, the pressure chamber plate 13, and the vibration plate layer 14 are stacked, is prepared ( Fig. 6(a) ).
  • the second electrode unit 152 is stacked on the upper surface of the vibration plate layer 14 of the head chip 10.
  • the second electrode unit 152 can be formed by a sputtering method, for example, to have a predetermined pattern.
  • the lead-out unit 153 electrically drawn from the second electrode unit 152 to the outside of the forming region of the piezoelectric element 15 is simultaneously formed (lead-out unit formation step; Fig. 6(b) ) by extending the pattern of the second electrode unit 152 up to the neighborhood of the both end portions of the head chip 10. This can simplify the lead-out unit formation step.
  • the piezoelectric element 15 is stacked on the upper surface of the second electrode unit 152, and adjustment member 16 is stacked on an upper surface of the lead-out unit 153.
  • a PZT thin film with a predetermined thickness is stacked on the upper surface of the second electrode unit 152, and then, an electrode film to be the first electrode unit 151 is stacked with a predetermined thickness on a whole upper surface of the PZT thin film.
  • the PZT thin film and the electrode film are simultaneously stacked also on the upper surface of the lead-out unit 153.
  • the first electrode unit 151 and the third electrode unit 161 are patterned by etching the electrode film so as to achieve arrangement modes and shapes of the piezoelectric element 15 and the adjustment member 16, illustrated in Fig. 2 .
  • the piezoelectric element 15 on the pressure chamber 131 and the adjustment member 16 on the lead-out unit 153 are formed (piezoelectric element formation step, adjustment member formation step; Fig. 6(c) ) by etching the PZT thin film using the first electrode unit 151 and the third electrode unit 161 as masks.
  • the piezoelectric element 15 and the first electrode unit 151 on the second electrode unit 152, and the adjustment member 16 on the lead-out unit 153 are simultaneously formed with a same step, on the upper surface of the head chip 10.
  • This can simplify the manufacturing steps and easily form the piezoelectric element 15 and the adjustment member 16, for which the height of the upper surface of the first electrode unit 151 and the height of the upper surface of the third electrode unit 161 are equalized at the substantially equal height H1.
  • the spacer substrate 30 is bonded onto the upper surface of the head chip 10 ( Fig. 7(a) ).
  • the openings 31 and 32, and the through hole 33, are formed on the spacer substrate 30 beforehand.
  • the piezoelectric element 15 and the adjustment member 16 on the head chip 10 are contained within the openings 33 and 32, and the through hole 33 communicates with the ink inflow hole 132.
  • a conductive material 162 is filled into the through hole 162 of the adjustment member 16 using a needle 60, for example ( Fig. 7(b) ).
  • a needle 60 for example ( Fig. 7(b) ).
  • the adjustment member 16 is arranged within the opening 32, the adjustment member 16 is surrounded by a spacer member 30. This configuration can keep the conductive material 162 within the opening 32 even when it overflows from the upper surface of the adjustment member 16 and thus, can prevent a short circuit.
  • the wiring substrate 20 is bonded to the stack of the head chip 10 and the spacer substrate 30, from above (bonding step; Fig. 8 ).
  • the first connecting member 25 on the wiring substrate 20 comes in contact with the first electrode unit 151 on the piezoelectric element 15, and the second connecting member 26 comes in contact with the third electrode unit 161 of the adjustment member 16, leading to electrical connection respectively.
  • the upper surface of the first electrode unit 151 on the piezoelectric element 15 and the upper surface of the third electrode unit 161 of the adjustment member 16 have substantially an equal height on the head chip 10.
  • the tip position of the first connecting member 25 and the tip position of the second connecting member 26 have substantially an equal height on the wiring substrate 20. Therefore, these contact surfaces have a substantially even height. Accordingly, when the head chip 10 is pressure bonded with the wiring substrate 20, no uneven pressure is applied to each of electrical connecting sites. With this configuration, there is no need to perform high-accuracy pressure control to prevent damage on the piezoelectric element 15, or the like, leading to further facilitation of reliable electrical connection.
  • the manifold 40 illustrated in Fig. 1 is bonded on the upper surface of the wiring substrate 20, such that all ink supply holes 27 that open onto the upper surface of the wiring substrate 20 face the ink storage chamber 41 within the manifold 40.
  • This configuration completes the inkjet head 1 in which ink is supplied to all the pressure chambers 131 in a shared manner from the ink storage chamber 41.
  • adjustment member 16 forms the through hole 162
  • the conductive material 163 is filled into the groove 164 such that the lead-out unit 153 is electrically connected with the third electrode unit 161.
  • the piezoelectric element 15 may be a bulk piezoelectric element formed into a predetermined size and thickness in advance.
  • the bulk piezoelectric element is individually pasted at a position that corresponds to the pressure chamber 131 on the vibration plate layer 14.
  • a bulk piezoelectric element having a thickness equal to the thickness of the piezoelectric element 15 is preferably used as the piezoelectric element used in the adjustment member 16, and the adjustment member 16 is preferably formed by pasting the bulk piezoelectric element on the upper surface of the lead-out unit 153. This makes it possible to easily align the height of the upper surface of the first electrode unit 151 of the piezoelectric element 15 with the height of the upper surface of the adjustment member 16, at a substantially equal height.
  • the adjustment member 16 is made from a single material, it is possible to form with metal as a whole.
  • a metallic material formed into a predetermined shape with a predetermined thickness using metal such as Ni, Cu, and Al, on the lead-out unit 153 it is possible to provide electrical continuity between the adjustment member 16 itself and the lead-out unit 153.
  • metal such as Ni, Cu, and Al

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Claims (14)

  1. Ein Tintenstrahlkopf (1), umfassend:
    einen Kopfchip (10) mit einer Druckkammer (131), die konfiguriert ist, um aus einer Düse (111) auszustoßene Tinte zu enthalten, mit einem piezoelektrische Element (15), das entsprechend der Druckkammer (131) vorgesehen ist und eine erste Elektrodeneinheit (151) auf einer oberen Fläche und eine zweite Elektrodeneinheit (152) auf einer unteren Fläche enthält, und mit einer Herausführungseinheit (153), die elektrisch von der zweiten Elektrodeneinheit (152) zur Außenseite des piezoelektrischen Elements (15) gezogen ist; und
    ein Verdrahtungssubstrat (20), das oberhalb des Kopfchips (10) angeordnet ist und ein erstes Verbindungselement (25), das mit einem Zapfenbuckel ausgebildet ist, der elektrisch mit der ersten Elektrodeneinheit (151) des Kopfchips (10) verbunden ist, und ein zweites Verbindungselement (26), das mit einem Zapfenbuckel ausgebildet ist, der elektrisch mit der zweiten Elektrodeneinheit (152) über die Herausführungseinheit (153) verbunden ist, enthält
    wobei die Herausführungseinheit ein Einstellelement (16) umfasst, das eine obere Fläche umfasst, die auf einer Höhe angeordnet ist, die im Wesentlichen gleich der Höhe der ersten Elektrodeneinheit (151) ist, und bei der zumindest die obere Fläche eine elektrische Kontinuität mit der Herausführungseinheit (153) aufweist, und
    das erste Verbindungselement (25) des Verdrahtungssubstrats (20) elektrisch mit der ersten Elektrodeneinheit (151) verbunden ist, indem es in Kontakt mit einer oberen Fläche der ersten Elektrodeneinheit (151) kommt, und das zweite Verbindungselement (26) elektrisch mit der zweiten Elektrodeneinheit (152) über das Einstellelement (16) und die Herausführungseinheit (153) verbunden ist, indem es in Kontakt mit der oberen Fläche des Einstellelements (16) kommt.
  2. Der Tintenstrahlkopf (1) nach Anspruch 1,
    wobei das Einstellelement (16) aus einem Material mit einer Poissonzahl von 0,4 oder weniger gebildet ist.
  3. Der Tintenstrahlkopf (1) nach Anspruch 1 oder 2,
    wobei die obere Fläche des Einstellelements (16) eine Fläche aufweist, die gleich oder größer ist als die Fläche der ersten Elektrodeneinheit (151) auf der oberen Fläche des piezoelektrischen Elements (15), die entsprechend der Druckkammer (161) vorgesehen ist.
  4. Der Tintenstrahlkopf (1) nach Anspruch 1, 2 oder 3,
    wobei das Einstellelement (16) mit dem piezoelektrischen Element (15) ausgebildet ist, das auf einer oberen Oberfläche eine dritte Elektrodeneinheit (161) aufweist, die eine elektrische Kontinuität mit der Durchführungseinheit (153) aufweist.
  5. Der Tintenstrahlkopf (1) nach Anspruch 4,
    wobei das in dem Einstellelement (16) verwendete piezoelektrische Element (15) ein in einer Höhenrichtung durchgehendes Loch (162) oder eine quer zur Höhenrichtung geschnittene Nut aufweist, und
    die dritte Elektrodeneinheit (161) und die Herausführungseinheit (153) über ein leitendes Material elektrisch miteinander verbunden sind, indem das leitende Material in das Loch (162) oder die Nut eingefüllt wird.
  6. Der Tintenstrahlkopf (1) nach Anspruch 5,
    wobei es eine Mehrzahl von zweiten Verbindungselementen (26) gibt, und ein Teil der zweiten Verbindungselemente (26) unter der Mehrzahl von zweiten Verbindungselementen (26) ausschließlich mit dem in das Loch (162) oder die Nut eingefüllten leitfähigen Material in Kontakt ist.
  7. Der Tintenstrahlkopf (1) nach einem der Ansprüche 1 bis 5,
    wobei eine Mehrzahl der zweiten Verbindungselemente (26) vorhanden ist und die Mehrzahl der zweiten Verbindungselemente (26) elektrisch mit der oberen Fläche des Justierelements (16) verbunden ist, die von der Mehrzahl der zweiten Verbindungselemente (26) gemeinsam genutzt wird.
  8. Der Tintenstrahlkopf (1) nach einem der Ansprüche 1 bis 7,
    wobei eine Mehrzahl der Druckkammern (131) vorhanden ist und die einzelnen zweiten Elektrodeneinheiten (152), die auf einer Mehrzahl der piezoelektrischen Elemente (15) ausgebildet sind, die entsprechend den Druckkammern (13) vorgesehen sind, durch die Herausführungseinheit (153), die von der Mehrzahl der zweiten Elektrodeneinheiten (152) gemeinsam genutzt wird, elektrisch gezogen werden.
  9. Der Tintenstrahlkopf (1) nach einem der Ansprüche 1 bis 8,
    wobei die Spitzenpositionen des ersten Verbindungselements (25) und des zweiten Verbindungselements (26) in einer Anordnungsrichtung des Kopfchips (10) auf im Wesentlichen gleicher Höhe angeordnet sind.
  10. Der Tintenstrahlkopf (1) nach einem der Ansprüche 1 bis 9,
    wobei sowohl das erste Verbindungselement (25) als auch das zweite Verbindungselement (26) ein aufgebrachtes leitfähiges Material (261) aufweisen und über das leitfähige Material (261) mit der Oberseite der ersten Elektrodeneinheit (151) und der Oberseite des Einstellelement (16) elektrisch verbunden ist.
  11. Verfahren zur Herstellung eines Tintenstrahlkopfes (1) mit
    einen Kopfchip (10) mit einer Druckkammer (131), die konfiguriert ist, um aus einer Düse (111) auszustoßene Tinte zu enthalten, mit einem piezoelektrischen Element (15), das entsprechend der Druckkammer (131) vorgesehen ist und eine erste Elektrodeneinheit (151) auf einer oberen Fläche und eine zweite Elektrodeneinheit (152) auf einer unteren Fläche enthält, und mit einer Herausführungseinheit (153), die elektrisch von der zweiten Elektrodeneinheit (152) zur Außenseite des piezoelektrischen Elements (15) gezogen ist; und
    ein Verdrahtungssubstrat (20), das oberhalb des Kopfchips (10) angeordnet ist und ein erstes Verbindungselement (25), das mit einem Zapfenbuckel ausgebildet ist, der elektrisch mit der ersten Elektrodeneinheit (151) des Kopfchips (10) verbunden ist, und ein zweites Verbindungselement (26), das mit einem Zapfenbuckel ausgebildet ist, der elektrisch mit der zweiten Elektrodeneinheit (152) über die Herausführungseinheit (153) verbunden ist, umfasst,
    wobei das Verfahren umfasst:
    einen Schritt zur Bildung eines piezoelektrischen Elements, bei dem auf dem Kopfchip (10) das piezoelektrische Element (15) gebildet wird, das die erste Elektrodeneinheit (151) und die zweite Elektrodeneinheit (152) enthält, die der Druckkammer (13) entsprechen;
    einen Ausführungseinheit-Bildungsschritt des Bildens der Ausführungseinheit (153) auf dem Kopfchip (10);
    einen Einstelement-Bildungsschritt zum Bilden eines Einstellelements (16) auf der Herausführungseinheit (153), das eine obere Fläche aufweist, die in einer Höhe angeordnet ist, die im Wesentlichen gleich der Höhe der ersten Elektrodeneinheit (151) ist, wobei die obere Fläche eine elektrische Kontinuität mit der Herausführungseinheit (153) aufweist; und
    einen Verbindungsschritt des Verbindens des Verdrahtungssubstrats (20) mit dem Kopfchip (10), um zu bewirken, dass das erste Verbindungselement (25) elektrisch mit der ersten Elektrodeneinheit (151) verbunden wird, indem das erste Verbindungselement (25) in Kontakt mit einer oberen Fläche der ersten Elektrodeneinheit (151) gebracht wird, und um zu bewirken, dass das zweite Verbindungselement (26) elektrisch mit der zweiten Elektrodeneinheit (152) über das Einstellelement (16) verbunden wird, indem das zweite Verbindungselement (26) in Kontakt mit der oberen Fläche des Einstellelements (16) gebracht wird.
  12. Das Verfahren zur Herstellung eines Tintenstrahlkopfes (1) nach Anspruch 11,
    wobei das Einstellelement (16) mit dem piezoelektrischen Element (15) ausgebildet ist, das auf einer oberen Oberfläche eine dritte Elektrodeneinheit (161) aufweist, die eine elektrische Kontinuität mit der Herausführungseinheit (153) hat, und
    das piezoelektrische Element (15), das in dem Einstellelement (16) verwendet wird, in dem Justierelement-Bildungsschritt gleichzeitig zu der Zeit des Bildens des piezoelektrischen Elements (15) entsprechend der Druckkammer (131) durch den Piezoelement-Bildungsschritt gebildet wird.
  13. Das Verfahren zur Herstellung eines Tintenstrahlkopfes (1) nach Anspruch 12,
    wobei das piezoelektrische Element (15) ein PZT-Dünnfilm ist und das piezoelektrische Element (15), das der Druckkammer (131) entspricht, und das piezoelektrische Element (15), das in dem Einstellelement (16) verwendet wird, gleichzeitig durch Ätzen des PZT-Dünnfilms strukturiert werden.
  14. Das Verfahren zur Herstellung eines Tintenstrahlkopfes (1) nach Anspruch 11, 12 oder 13, ferner umfassend
    einen Verbindungselement-Ausbildungsschritt des Ausbildens des ersten Verbindungselements (25) und des zweiten Verbindungselements (26) auf dem Verdrahtungssubstrat, so dass sie in einer Anordnungsrichtung des Kopfchips (10) vorstehende Formen aufweisen, und so, dass Spitzenpositionen der Verbindungselemente (26) in der Anordnungsrichtung des Kopfchips (10) auf im Wesentlichen gleichen Höhen angeordnet werden können.
EP15843126.2A 2014-09-24 2015-03-30 Tintenstrahlkopf und tintenstrahlkopfherstellungsverfahren Active EP3199351B1 (de)

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JP2002248765A (ja) * 2000-12-19 2002-09-03 Fuji Xerox Co Ltd インクジェット式記録ヘッドおよびインクジェット式記録装置
JP4362996B2 (ja) * 2001-08-22 2009-11-11 富士ゼロックス株式会社 格子状配列構造の圧電／電歪アクチュエータ及びその製造方法
JP2003072068A (ja) * 2001-08-31 2003-03-12 Fuji Xerox Co Ltd インクジェット記録ヘッド及びインクジェット記録装置
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