EP3157606A1 - Ensemble conducteur comprenant une enveloppe externe tubulaire élastique - Google Patents

Ensemble conducteur comprenant une enveloppe externe tubulaire élastique

Info

Publication number
EP3157606A1
EP3157606A1 EP15809576.0A EP15809576A EP3157606A1 EP 3157606 A1 EP3157606 A1 EP 3157606A1 EP 15809576 A EP15809576 A EP 15809576A EP 3157606 A1 EP3157606 A1 EP 3157606A1
Authority
EP
European Patent Office
Prior art keywords
outer casing
conductor assembly
sensor
cavity
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15809576.0A
Other languages
German (de)
English (en)
Other versions
EP3157606A4 (fr
Inventor
Bengt KÄLLBÄCK
Tiberiu BAGAIAN
Tobias ROKOSCH
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CATHPRINT AB
Original Assignee
CATHPRINT AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CATHPRINT AB filed Critical CATHPRINT AB
Publication of EP3157606A1 publication Critical patent/EP3157606A1/fr
Publication of EP3157606A4 publication Critical patent/EP3157606A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M25/00—Catheters; Hollow probes
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
    • A61B5/021—Measuring pressure in heart or blood vessels
    • A61B5/0215—Measuring pressure in heart or blood vessels by means inserted into the body
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/149—Housings of immersion sensor, e.g. where the sensor is immersed in the measuring medium or for in vivo measurements, e.g. by using catheter tips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/16—Details of sensor housings or probes; Details of structural supports for sensors
    • A61B2562/166—Details of sensor housings or probes; Details of structural supports for sensors the sensor is mounted on a specially adapted printed circuit board
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6846—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive
    • A61B5/6847—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive mounted on an invasive device
    • A61B5/6852—Catheters
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M25/00—Catheters; Hollow probes
    • A61M2025/0001—Catheters; Hollow probes for pressure measurement
    • A61M2025/0002—Catheters; Hollow probes for pressure measurement with a pressure sensor at the distal end
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Definitions

  • a conductor assembly comprising a resilient tubular outer casing
  • the present invention relates to a conductor assembly according to the preamble of the independent claim.
  • Elongated, flexible conductor assemblies used as catheters, or that form part of a catheter are less suitable for use with certain types of sensors that are affected by external mechanical impact.
  • many types of pressure sensors may be affected by mechanical influences other than fluid pressure. Bending of such a conductor assembly comprising a pressure sensor would give a misleading pressure reading.
  • One purpose of the invention is therefore to provide a conductor assembly which reduces the effect of bending of the conductor assembly on a sensor comprised in the assembly.
  • the invention relates to a conductor assembly comprising a resilient tubular outer casing 1 with a flexible printed circuit board 6 in the interior of outer casing. At least one sensor 3 is mounted On the circuit board. At least one cavity 8a-c of the outer casing adjacent to the sensor is filled with a rigid filling material 9, where the rigid filling material extends in the lengthwise direction of the tubular outer casing 1 at least from one side of the sensor to the opposite side of the sensor.
  • the conductor assembly's outer casing 1 may include at least one opening 7a-c to at least one cavity 8a-c in the outer casing adjacent to the sensor, through which the filling material can be supplied in liquid form.
  • the conductor assembly has two cavities 8a-b in the outer casing on the side of the flexible printed board 6 where the sensor is mounted, one on each side of the sensor, and a third cavity 8c is on the side of the flexible circuit board 6 which is on the opposite side of the sensor.
  • the length of at least one of the cavities 8a-c in the outer casing is restricted by bumps 4a-f that define the cavity.
  • the propagation of added filler material is governed by these bumps to the relevant space.
  • the conductor assembly constitutes a catheter or part of a catheter.
  • Fig. 1 shows a conductor assembly according to known technology in partial cross section, seen from above
  • Fig. 2 shows the conductor assembly according to known technology in cross section, seen from the side
  • Fig. 3 shows the conductor assembly according to known technology in cross section, seen from the side when bending the assembly
  • Fig. 4 shows a conductor assembly according to the invention in sectional side view in a first production step
  • Fig. 5 shows the conductor assembly according to the invention in a second production step
  • Fig. 6 shows the conductor assembly according to the invention in a third production step Description of a preferred embodiment
  • Figures 1-3 show a conductor assembly according to known technology for comparison with the invention.
  • the conductor assembly consists of an elongated member where electrical conductor lines extend in the element's longitudinal direction.
  • the conductor assembly may constitute a catheter.
  • Fig. 1 shows a conductor assembly according to known technology in partial cross section, seen from above.
  • the conductor assembly comprises a cylindrical outer casing 1 inside which a flexible printed circuit board extends in the cylindrical outer casing along the longitudinal
  • a pressure sensor 3 mounted to measure fluid pressure on the surface of the conductor assembly.
  • the pressure sensor is mounted below an opening in the cylindrical outer housing 1 and the entire opening is covered with a resilient, elastic material such as silicone.
  • the silicone extends to the pressure sensor and covers it, so that the pressure on the silicone surface on the opening of the cylindrical outer casing is transferred to the pressure sensor.
  • the silicone also seals the opening so that liquid or gas from the conductor assembly's surroundings cannot penetrate into the conductor assembly's interior.
  • Fig. 2 shows the conductor assembly according to known technology in cross section seen from the side, and it illustrates how the flexible printed circuit board extends in the middle of the cylindrical outer casing.
  • the pressure sensor 3 is attached to the PCB upper side and is electrically connected to the solder pads on the flex board with electrically conducting wires 5. To protect the electrical conductor attachment points on the solder pads those are covered with a bump 4 of a protective material, typically a rigid adhesive.
  • the silicone which transfers the pressure of the conductor assembly's environment to the pressure sensor has been injected through the opening in the cylindrical outer case and covers all of the pressure sensor's immediate surroundings up to the bump 4.
  • Fig. 3 shows the conductor assembly according to known technology in cross section seen from the side when bending the assembly. Since the conductor assembly is flexible, it can be bent all along its length which affects he pressure sensor. The bending of the conductor assembly gives a stress in the silicone which the pressure sensor perceives as a pressure change relative to the actual pressure at the conductor assembly's outer surface. In the figure, this effect is illustrated in an exaggerated way - the pressure sensor has a rhombus shape - to accentuate the problem. The effect is in reality much lower but bending of the conductor assembly still gives an incorrect pressure measurement. Bending of the conductor assembly may also affect other types of sensors than pressure gauges so that false readings may be obtained.
  • Fig. 4 shows a conductor assembly according to the invention in sectional side view in a first production step.
  • the conductor assembly comprises - in a manner corresponding to known technology - a cylindrical outer casing and in its interior extends a flexible printed circuit board 6.
  • a pressure sensor 3 is attached and it is electrically connected to the bonding pads on the board with electrical conductors.
  • the bond pads are covered by an approximately hemispherical bump 4c of a protective material of a relatively rigid substance, typically a rigid adhesive.
  • the semi-spherical bump 4c extends across the flexible circuit board's top surface from one edge of the board to the opposite edge and from the board surface up to the cylindrical outer casing's inner surface. Hence the bump seals the interior of the outer casing so that no viscous fluids can pass the bump.
  • the conductor assembly according to the invention in addition comprises another three bumps 4a, b, d on the board's upper side and in addition two bumps 4e-f on the bottom of the board. All the bumps are approximately the same shape and seals the inside of the conductor assembly in a similar fashion.
  • two bumps 4a-b are arranged with a space between them defining a first cavity 8a.
  • a first opening that constitutes a connection between the first cavity and the conductor assembly's surroundings.
  • two bumps 4c-d are arranged with a space between them forming a second cavity 8b.
  • a second opening that constitutes a connection between the second cavity and the conductor assembly's surroundings.
  • the pressure sensor is surrounded by two humps 4b-c, one on each side, and the space between them is filled with silicone conveying pressure from the conductor assembly's surroundings via an opening in the cylindrical outer casing to the pressure sensor. When the silicone is supplied to this cavity, these two bumps prevent the silicone to flow out of the cavity.
  • Fig. 5 shows the conductor assembly according to the invention in a second production step in which an adhesive 9 has been supplied to all three cavities 8a-c.
  • the third cavity 8c has two openings 7c-d, and adhesive is typically supplied through the opening 7c, and air is forced out through the second opening.
  • the first and second cavities could be provided with two openings each, but in the embodiment shown the cavity volumes are so small that it was deemed unnecessary.
  • the adhesive After that the adhesive has been injected into the cavities in liquid form, it cures and solidifies so that the portion of the conductor assembly surrounded by adhesive 9 forms a rigid portion. When the rest of the device is bent, this part remains immobile hence the pressure sensor is unaffected by any bending of the conductor assembly.
  • Fig. 6 shows the conductor assembly of the invention in a third production step, where a rigid cylindrical additional casing 10 has been pulled over the rigid portion of the conductor assembly.
  • the additional casing 10 covers the openings 7a-d.
  • the additional casing causes the conductor device as a whole to have a nearly fully smooth surface and also gives additional stability to the rigid part.
  • the bumps limit the spread of the adhesive when it is supplied in liquid form, but adhesive could in principle be supplied without limiting bumps. It would however be much more difficult to control the spread of the adhesive.
  • One of the bumps 4c also protects the bonding wires to the sensor, so there is a standard process available for producing such bumps when mounting components on flexible PCBs.
  • Dispensing an adhesive in liquid form into the cavities where it subsequently is cured and solidifies is an efficient way to provide a rigid portion of the conductor assembly.
  • the denotation adhesive is used for this substance, by this concept is in this context meant any substance that from being a liquid harden into a solid substance.
  • the silicone surrounding the pressure sensor is a good way to protect the sensor and to provide an almost smooth surface of the conductor assembly but is not quite necessary.

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Veterinary Medicine (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Cardiology (AREA)
  • Anesthesiology (AREA)
  • Pulmonology (AREA)
  • Hematology (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Vascular Medicine (AREA)
  • Physiology (AREA)
  • Pathology (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

La présente invention concerne un ensemble conducteur comprenant une enveloppe externe tubulaire élastique (1) avec une carte de circuit imprimé flexible (6) située dans l'intérieur de l'enveloppe externe. Un capteur (3) est placé sur la carte de circuit imprimé. Une cavité (8a-c) dans l'enveloppe externe adjacente au capteur est remplie d'un matériau de remplissage rigide (9). Ledit matériau de remplissage rigide s'étend dans le sens de la longueur de l'enveloppe externe tubulaire (1) au moins depuis un côté du capteur jusqu'au côté opposé du capteur. Cela signifie que le capteur n'est pas affecté si l'ensemble conducteur est cintré, ni affecté d'une autre manière mécaniquement. L'enveloppe externe de l'ensemble conducteur (1) comprend une ouverture (7a-c) sur une cavité (8a-c) dans l'enveloppe externe reliée au capteur, à travers laquelle un matériau de remplissage peut être fourni sous forme liquide. Généralement, l'ensemble conducteur comprend deux cavités (8a-b) dans l'enveloppe externe sur le côté de la carte de circuit imprimé flexible (6) sur lequel est monté le capteur, les deux cavités se trouvant sur l'un ou l'autre côté du capteur, et une troisième cavité (8c) dans l'enveloppe externe sur le côté de la carte de circuit imprimé flexible (6) qui est en regard du capteur. Dans un mode de réalisation avantageux, l'extension d'au moins une cavité (8a-c) dans l'enveloppe externe est limitée par des bosses (4a-f) sur chaque côté de la cavité, définissant ainsi la cavité. La propagation du matériau de remplissage injecté dépend de ces bosses dans l'espace concerné. D'une manière générale, l'ensemble conducteur est un cathéter ou une partie d'un cathéter.
EP15809576.0A 2014-06-19 2015-06-17 Ensemble conducteur comprenant une enveloppe externe tubulaire élastique Withdrawn EP3157606A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE1400311A SE539551C2 (sv) 2014-06-19 2014-06-19 Ledaranordning med ett eftergivligt rörformat ytterhölje medett flexibelt mönsterkort i ytterhöljets inre
PCT/SE2015/000037 WO2015195023A1 (fr) 2014-06-19 2015-06-17 Ensemble conducteur comprenant une enveloppe externe tubulaire élastique

Publications (2)

Publication Number Publication Date
EP3157606A1 true EP3157606A1 (fr) 2017-04-26
EP3157606A4 EP3157606A4 (fr) 2018-04-04

Family

ID=54935862

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15809576.0A Withdrawn EP3157606A4 (fr) 2014-06-19 2015-06-17 Ensemble conducteur comprenant une enveloppe externe tubulaire élastique

Country Status (3)

Country Link
EP (1) EP3157606A4 (fr)
SE (1) SE539551C2 (fr)
WO (1) WO2015195023A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11185244B2 (en) * 2018-08-13 2021-11-30 Medtronic Vascular, Inc. FFR catheter with suspended pressure sensor

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921495B2 (ja) * 1977-12-15 1984-05-21 株式会社豊田中央研究所 細管型圧力計
US6394986B1 (en) * 1999-11-06 2002-05-28 Millar Instruments, Inc. Pressure sensing module for a catheter pressure transducer
US20040230114A1 (en) * 2003-03-18 2004-11-18 Clatterbaugh Guy V. MRI flex circuit catheter imaging coil
US7630747B2 (en) * 2003-09-09 2009-12-08 Keimar, Inc. Apparatus for ascertaining blood characteristics and probe for use therewith
JP4426430B2 (ja) * 2004-12-15 2010-03-03 日東電工株式会社 カテーテル及びその製造方法
JP4648063B2 (ja) * 2005-04-19 2011-03-09 日東電工株式会社 カテーテル用フレキシブル配線回路基板、並びに、該フレキシブル配線回路基板を用いたカテーテル及びその製造方法
EP2032201B1 (fr) * 2006-06-01 2013-04-03 Cathprint AB Catheter tubulaire pour utilisation invasive et procede de fabrication de celui-ci
WO2013074036A1 (fr) * 2011-11-16 2013-05-23 Cathprint Ab Composant de cathéter

Also Published As

Publication number Publication date
SE1400311A1 (sv) 2015-12-20
SE539551C2 (sv) 2017-10-10
EP3157606A4 (fr) 2018-04-04
WO2015195023A1 (fr) 2015-12-23

Similar Documents

Publication Publication Date Title
US7722362B2 (en) Sensor adaptor circuit housing incapsulating connection of an input connector with a wire
JP2018044956A5 (fr)
CN102714031B (zh) 具有阻尼装置的传感器
TWI582399B (zh) 壓力感測器及壓力感測器模組
JP2006231059A (ja) センサ−ガイドワイヤ・アセンブリ
EP2924814A1 (fr) Appareil et procédé de montage de circuit utilisant un cadre de montage segmenté
US9638600B2 (en) Electrical interconnect for pressure sensor in a process variable transmitter
JP5462332B2 (ja) 超音波センサー装置
WO2016171597A1 (fr) Carte de circuit imprimé flexible dotée de composants montés
US9955917B2 (en) Planar logic board for ablation catheter with force measurement functionality
US7036380B2 (en) Sensor device
KR20180077231A (ko) 센서 조립체
EP3157606A1 (fr) Ensemble conducteur comprenant une enveloppe externe tubulaire élastique
CN104903125B (zh) 用于轮胎补片中的压电装置的一个向上、一个向下的连接结构
JP6990693B2 (ja) 回路基板アセンブリ
KR20150052599A (ko) 압력센서
EP2889598A1 (fr) Capteur de pression
US11146893B2 (en) Sensor system, sensor arrangement, and assembly method using solder for sealing
JP2019020251A (ja) センサーユニット
JP6601396B2 (ja) 電子機器およびその製造方法
JP6476036B2 (ja) 圧力センサ
KR101628267B1 (ko) 압력센서
KR101942704B1 (ko) 센서, 센서 유닛, 및 센서 유닛의 제조 방법
CN107250751B (zh) 液压传感器、液压控制单元和组件以及车辆制动系统
US9854676B2 (en) Assembly comprising at least an electrical component mounted on a substrate, a component suitable for such an assembly as well as a method for mounting an electrical component on a substrate

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20170117

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20180306

RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 1/02 20060101ALI20180228BHEP

Ipc: G01L 7/00 20060101ALI20180228BHEP

Ipc: A61B 5/0215 20060101ALI20180228BHEP

Ipc: H05K 1/18 20060101ALI20180228BHEP

Ipc: A61B 5/00 20060101ALI20180228BHEP

Ipc: H05K 3/28 20060101ALI20180228BHEP

Ipc: A61M 25/00 20060101AFI20180228BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20181003