WO2015195023A1 - Ensemble conducteur comprenant une enveloppe externe tubulaire élastique - Google Patents

Ensemble conducteur comprenant une enveloppe externe tubulaire élastique Download PDF

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Publication number
WO2015195023A1
WO2015195023A1 PCT/SE2015/000037 SE2015000037W WO2015195023A1 WO 2015195023 A1 WO2015195023 A1 WO 2015195023A1 SE 2015000037 W SE2015000037 W SE 2015000037W WO 2015195023 A1 WO2015195023 A1 WO 2015195023A1
Authority
WO
WIPO (PCT)
Prior art keywords
outer casing
conductor assembly
sensor
cavity
circuit board
Prior art date
Application number
PCT/SE2015/000037
Other languages
English (en)
Inventor
Bengt KÄLLBÄCK
Tiberiu BAGAIAN
Tobias ROKOSCH
Original Assignee
Cathprint Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cathprint Ab filed Critical Cathprint Ab
Priority to EP15809576.0A priority Critical patent/EP3157606A4/fr
Publication of WO2015195023A1 publication Critical patent/WO2015195023A1/fr

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M25/00—Catheters; Hollow probes
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
    • A61B5/021—Measuring pressure in heart or blood vessels
    • A61B5/0215—Measuring pressure in heart or blood vessels by means inserted into the body
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/149—Housings of immersion sensor, e.g. where the sensor is immersed in the measuring medium or for in vivo measurements, e.g. by using catheter tips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/16—Details of sensor housings or probes; Details of structural supports for sensors
    • A61B2562/166—Details of sensor housings or probes; Details of structural supports for sensors the sensor is mounted on a specially adapted printed circuit board
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6846—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive
    • A61B5/6847—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive mounted on an invasive device
    • A61B5/6852—Catheters
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M25/00—Catheters; Hollow probes
    • A61M2025/0001—Catheters; Hollow probes for pressure measurement
    • A61M2025/0002—Catheters; Hollow probes for pressure measurement with a pressure sensor at the distal end
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Definitions

  • a conductor assembly comprising a resilient tubular outer casing
  • the present invention relates to a conductor assembly according to the preamble of the independent claim.
  • Elongated, flexible conductor assemblies used as catheters, or that form part of a catheter are less suitable for use with certain types of sensors that are affected by external mechanical impact.
  • many types of pressure sensors may be affected by mechanical influences other than fluid pressure. Bending of such a conductor assembly comprising a pressure sensor would give a misleading pressure reading.
  • One purpose of the invention is therefore to provide a conductor assembly which reduces the effect of bending of the conductor assembly on a sensor comprised in the assembly.
  • the invention relates to a conductor assembly comprising a resilient tubular outer casing 1 with a flexible printed circuit board 6 in the interior of outer casing. At least one sensor 3 is mounted On the circuit board. At least one cavity 8a-c of the outer casing adjacent to the sensor is filled with a rigid filling material 9, where the rigid filling material extends in the lengthwise direction of the tubular outer casing 1 at least from one side of the sensor to the opposite side of the sensor.
  • the conductor assembly's outer casing 1 may include at least one opening 7a-c to at least one cavity 8a-c in the outer casing adjacent to the sensor, through which the filling material can be supplied in liquid form.
  • the conductor assembly has two cavities 8a-b in the outer casing on the side of the flexible printed board 6 where the sensor is mounted, one on each side of the sensor, and a third cavity 8c is on the side of the flexible circuit board 6 which is on the opposite side of the sensor.
  • the length of at least one of the cavities 8a-c in the outer casing is restricted by bumps 4a-f that define the cavity.
  • the propagation of added filler material is governed by these bumps to the relevant space.
  • the conductor assembly constitutes a catheter or part of a catheter.
  • Fig. 1 shows a conductor assembly according to known technology in partial cross section, seen from above
  • Fig. 2 shows the conductor assembly according to known technology in cross section, seen from the side
  • Fig. 3 shows the conductor assembly according to known technology in cross section, seen from the side when bending the assembly
  • Fig. 4 shows a conductor assembly according to the invention in sectional side view in a first production step
  • Fig. 5 shows the conductor assembly according to the invention in a second production step
  • Fig. 6 shows the conductor assembly according to the invention in a third production step Description of a preferred embodiment
  • Figures 1-3 show a conductor assembly according to known technology for comparison with the invention.
  • the conductor assembly consists of an elongated member where electrical conductor lines extend in the element's longitudinal direction.
  • the conductor assembly may constitute a catheter.
  • Fig. 1 shows a conductor assembly according to known technology in partial cross section, seen from above.
  • the conductor assembly comprises a cylindrical outer casing 1 inside which a flexible printed circuit board extends in the cylindrical outer casing along the longitudinal
  • a pressure sensor 3 mounted to measure fluid pressure on the surface of the conductor assembly.
  • the pressure sensor is mounted below an opening in the cylindrical outer housing 1 and the entire opening is covered with a resilient, elastic material such as silicone.
  • the silicone extends to the pressure sensor and covers it, so that the pressure on the silicone surface on the opening of the cylindrical outer casing is transferred to the pressure sensor.
  • the silicone also seals the opening so that liquid or gas from the conductor assembly's surroundings cannot penetrate into the conductor assembly's interior.
  • Fig. 2 shows the conductor assembly according to known technology in cross section seen from the side, and it illustrates how the flexible printed circuit board extends in the middle of the cylindrical outer casing.
  • the pressure sensor 3 is attached to the PCB upper side and is electrically connected to the solder pads on the flex board with electrically conducting wires 5. To protect the electrical conductor attachment points on the solder pads those are covered with a bump 4 of a protective material, typically a rigid adhesive.
  • the silicone which transfers the pressure of the conductor assembly's environment to the pressure sensor has been injected through the opening in the cylindrical outer case and covers all of the pressure sensor's immediate surroundings up to the bump 4.
  • Fig. 3 shows the conductor assembly according to known technology in cross section seen from the side when bending the assembly. Since the conductor assembly is flexible, it can be bent all along its length which affects he pressure sensor. The bending of the conductor assembly gives a stress in the silicone which the pressure sensor perceives as a pressure change relative to the actual pressure at the conductor assembly's outer surface. In the figure, this effect is illustrated in an exaggerated way - the pressure sensor has a rhombus shape - to accentuate the problem. The effect is in reality much lower but bending of the conductor assembly still gives an incorrect pressure measurement. Bending of the conductor assembly may also affect other types of sensors than pressure gauges so that false readings may be obtained.
  • Fig. 4 shows a conductor assembly according to the invention in sectional side view in a first production step.
  • the conductor assembly comprises - in a manner corresponding to known technology - a cylindrical outer casing and in its interior extends a flexible printed circuit board 6.
  • a pressure sensor 3 is attached and it is electrically connected to the bonding pads on the board with electrical conductors.
  • the bond pads are covered by an approximately hemispherical bump 4c of a protective material of a relatively rigid substance, typically a rigid adhesive.
  • the semi-spherical bump 4c extends across the flexible circuit board's top surface from one edge of the board to the opposite edge and from the board surface up to the cylindrical outer casing's inner surface. Hence the bump seals the interior of the outer casing so that no viscous fluids can pass the bump.
  • the conductor assembly according to the invention in addition comprises another three bumps 4a, b, d on the board's upper side and in addition two bumps 4e-f on the bottom of the board. All the bumps are approximately the same shape and seals the inside of the conductor assembly in a similar fashion.
  • two bumps 4a-b are arranged with a space between them defining a first cavity 8a.
  • a first opening that constitutes a connection between the first cavity and the conductor assembly's surroundings.
  • two bumps 4c-d are arranged with a space between them forming a second cavity 8b.
  • a second opening that constitutes a connection between the second cavity and the conductor assembly's surroundings.
  • the pressure sensor is surrounded by two humps 4b-c, one on each side, and the space between them is filled with silicone conveying pressure from the conductor assembly's surroundings via an opening in the cylindrical outer casing to the pressure sensor. When the silicone is supplied to this cavity, these two bumps prevent the silicone to flow out of the cavity.
  • Fig. 5 shows the conductor assembly according to the invention in a second production step in which an adhesive 9 has been supplied to all three cavities 8a-c.
  • the third cavity 8c has two openings 7c-d, and adhesive is typically supplied through the opening 7c, and air is forced out through the second opening.
  • the first and second cavities could be provided with two openings each, but in the embodiment shown the cavity volumes are so small that it was deemed unnecessary.
  • the adhesive After that the adhesive has been injected into the cavities in liquid form, it cures and solidifies so that the portion of the conductor assembly surrounded by adhesive 9 forms a rigid portion. When the rest of the device is bent, this part remains immobile hence the pressure sensor is unaffected by any bending of the conductor assembly.
  • Fig. 6 shows the conductor assembly of the invention in a third production step, where a rigid cylindrical additional casing 10 has been pulled over the rigid portion of the conductor assembly.
  • the additional casing 10 covers the openings 7a-d.
  • the additional casing causes the conductor device as a whole to have a nearly fully smooth surface and also gives additional stability to the rigid part.
  • the bumps limit the spread of the adhesive when it is supplied in liquid form, but adhesive could in principle be supplied without limiting bumps. It would however be much more difficult to control the spread of the adhesive.
  • One of the bumps 4c also protects the bonding wires to the sensor, so there is a standard process available for producing such bumps when mounting components on flexible PCBs.
  • Dispensing an adhesive in liquid form into the cavities where it subsequently is cured and solidifies is an efficient way to provide a rigid portion of the conductor assembly.
  • the denotation adhesive is used for this substance, by this concept is in this context meant any substance that from being a liquid harden into a solid substance.
  • the silicone surrounding the pressure sensor is a good way to protect the sensor and to provide an almost smooth surface of the conductor assembly but is not quite necessary.

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Biomedical Technology (AREA)
  • Veterinary Medicine (AREA)
  • Public Health (AREA)
  • General Health & Medical Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Biophysics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cardiology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Pulmonology (AREA)
  • Hematology (AREA)
  • Anesthesiology (AREA)
  • Physiology (AREA)
  • Manufacturing & Machinery (AREA)
  • Vascular Medicine (AREA)
  • Optics & Photonics (AREA)
  • Pathology (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Measuring Fluid Pressure (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)

Abstract

La présente invention concerne un ensemble conducteur comprenant une enveloppe externe tubulaire élastique (1) avec une carte de circuit imprimé flexible (6) située dans l'intérieur de l'enveloppe externe. Un capteur (3) est placé sur la carte de circuit imprimé. Une cavité (8a-c) dans l'enveloppe externe adjacente au capteur est remplie d'un matériau de remplissage rigide (9). Ledit matériau de remplissage rigide s'étend dans le sens de la longueur de l'enveloppe externe tubulaire (1) au moins depuis un côté du capteur jusqu'au côté opposé du capteur. Cela signifie que le capteur n'est pas affecté si l'ensemble conducteur est cintré, ni affecté d'une autre manière mécaniquement. L'enveloppe externe de l'ensemble conducteur (1) comprend une ouverture (7a-c) sur une cavité (8a-c) dans l'enveloppe externe reliée au capteur, à travers laquelle un matériau de remplissage peut être fourni sous forme liquide. Généralement, l'ensemble conducteur comprend deux cavités (8a-b) dans l'enveloppe externe sur le côté de la carte de circuit imprimé flexible (6) sur lequel est monté le capteur, les deux cavités se trouvant sur l'un ou l'autre côté du capteur, et une troisième cavité (8c) dans l'enveloppe externe sur le côté de la carte de circuit imprimé flexible (6) qui est en regard du capteur. Dans un mode de réalisation avantageux, l'extension d'au moins une cavité (8a-c) dans l'enveloppe externe est limitée par des bosses (4a-f) sur chaque côté de la cavité, définissant ainsi la cavité. La propagation du matériau de remplissage injecté dépend de ces bosses dans l'espace concerné. D'une manière générale, l'ensemble conducteur est un cathéter ou une partie d'un cathéter.
PCT/SE2015/000037 2014-06-19 2015-06-17 Ensemble conducteur comprenant une enveloppe externe tubulaire élastique WO2015195023A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP15809576.0A EP3157606A4 (fr) 2014-06-19 2015-06-17 Ensemble conducteur comprenant une enveloppe externe tubulaire élastique

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE1400311A SE539551C2 (sv) 2014-06-19 2014-06-19 Ledaranordning med ett eftergivligt rörformat ytterhölje medett flexibelt mönsterkort i ytterhöljets inre
SE1400311-5 2014-06-19

Publications (1)

Publication Number Publication Date
WO2015195023A1 true WO2015195023A1 (fr) 2015-12-23

Family

ID=54935862

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE2015/000037 WO2015195023A1 (fr) 2014-06-19 2015-06-17 Ensemble conducteur comprenant une enveloppe externe tubulaire élastique

Country Status (3)

Country Link
EP (1) EP3157606A4 (fr)
SE (1) SE539551C2 (fr)
WO (1) WO2015195023A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020036788A1 (fr) * 2018-08-13 2020-02-20 Medtronic Vascular, Inc. Cathéter de mesure du flux de réserve coronaire (ffr) à capteur de pression suspendu et son procédé de fabrication

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4274423A (en) * 1977-12-15 1981-06-23 Kabushiki Kaisha Toyota Chuo Kenkyusho Catheter tip pressure transducer
US6394986B1 (en) * 1999-11-06 2002-05-28 Millar Instruments, Inc. Pressure sensing module for a catheter pressure transducer
US20050054905A1 (en) * 2003-09-09 2005-03-10 Corl Paul D. Apparatus for ascertaining blood characteristics and probe for use therewith
EP1671669A1 (fr) * 2004-12-15 2006-06-21 Nitto Denko Corporation Cathéter comprenant un circuit imprimé flexible et son procédé de fabrication
WO2013074036A1 (fr) * 2011-11-16 2013-05-23 Cathprint Ab Composant de cathéter

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040230114A1 (en) * 2003-03-18 2004-11-18 Clatterbaugh Guy V. MRI flex circuit catheter imaging coil
JP4648063B2 (ja) * 2005-04-19 2011-03-09 日東電工株式会社 カテーテル用フレキシブル配線回路基板、並びに、該フレキシブル配線回路基板を用いたカテーテル及びその製造方法
WO2007139479A1 (fr) * 2006-06-01 2007-12-06 Cathprint Ab cathÉter tubulaire pour utilisation invasive et procÉdÉ de fabrication de celui-ci

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4274423A (en) * 1977-12-15 1981-06-23 Kabushiki Kaisha Toyota Chuo Kenkyusho Catheter tip pressure transducer
US6394986B1 (en) * 1999-11-06 2002-05-28 Millar Instruments, Inc. Pressure sensing module for a catheter pressure transducer
US20050054905A1 (en) * 2003-09-09 2005-03-10 Corl Paul D. Apparatus for ascertaining blood characteristics and probe for use therewith
EP1671669A1 (fr) * 2004-12-15 2006-06-21 Nitto Denko Corporation Cathéter comprenant un circuit imprimé flexible et son procédé de fabrication
WO2013074036A1 (fr) * 2011-11-16 2013-05-23 Cathprint Ab Composant de cathéter

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3157606A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020036788A1 (fr) * 2018-08-13 2020-02-20 Medtronic Vascular, Inc. Cathéter de mesure du flux de réserve coronaire (ffr) à capteur de pression suspendu et son procédé de fabrication
US11185244B2 (en) 2018-08-13 2021-11-30 Medtronic Vascular, Inc. FFR catheter with suspended pressure sensor

Also Published As

Publication number Publication date
SE539551C2 (sv) 2017-10-10
EP3157606A1 (fr) 2017-04-26
SE1400311A1 (sv) 2015-12-20
EP3157606A4 (fr) 2018-04-04

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