Classifications

• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/40—Adhesives in the form of films or foils characterised by release liners
  • C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B23/00—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose
  • B32B23/04—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose comprising such cellulosic plastic substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
  • B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
  • B32B7/04—Interconnection of layers
  • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J7/00—Adhesives in the form of films or foils
  • C09J7/40—Adhesives in the form of films or foils characterised by release liners
  • C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
  • B32B2307/51—Elastic
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/70—Other properties
  • B32B2307/748—Releasability
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2405/00—Adhesive articles, e.g. adhesive tapes
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2457/00—Electrical equipment
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
  • C09J153/02—Vinyl aromatic monomers and conjugated dienes
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
  • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2301/00—Additional features of adhesives in the form of films or foils
  • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
  • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2301/00—Additional features of adhesives in the form of films or foils
  • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
  • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2301/00—Additional features of adhesives in the form of films or foils
  • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
  • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2301/00—Additional features of adhesives in the form of films or foils
  • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2400/00—Presence of inorganic and organic materials
  • C09J2400/20—Presence of organic materials
  • C09J2400/28—Presence of paper
  • C09J2400/283—Presence of paper in the substrate
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2401/00—Presence of cellulose
  • C09J2401/006—Presence of cellulose in the substrate
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2429/00—Presence of polyvinyl alcohol
  • C09J2429/006—Presence of polyvinyl alcohol in the substrate
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2431/00—Presence of polyvinyl acetate
  • C09J2431/006—Presence of polyvinyl acetate in the substrate
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2453/00—Presence of block copolymer
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2459/00—Presence of polyacetal
  • C09J2459/006—Presence of polyacetal in the substrate
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2463/00—Presence of epoxy resin
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2467/00—Presence of polyester
  • C09J2467/005—Presence of polyester in the release coating
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2477/00—Presence of polyamide
  • C09J2477/006—Presence of polyamide in the substrate
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2481/00—Presence of sulfur containing polymers
  • C09J2481/006—Presence of sulfur containing polymers in the substrate
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J2483/00—Presence of polysiloxane
  • C09J2483/005—Presence of polysiloxane in the release coating

Definitions

• the present invention relates to the technical field of adhesives, as used for example for adhesive tapes.
• a new method for removing water from such adhesives is proposed, which is based essentially on the use of a suitably prepared release liner.
• the invention further relates to a producible by the process according to the invention adhesive tape and its use.
• Organic / inorganic electronic devices and optoelectronic devices are increasingly being used in commercial products or are about to be launched on the market.
• Such arrangements include inorganic or organic electronic structures, for example organic, organometallic or polymeric semiconductors or combinations thereof.
• the corresponding products are rigid or flexible depending on the desired application, whereby there is an increasing demand for flexible arrangements.
• non-impact printing such as thermal transfer printing, inkjet printing or digital printing
• vacuum processes such as chemical vapor deposition (CVD), physical vapor deposition (PVD), plasma-assisted chemical or physical deposition (PECVD), sputtering, (plasma) etching or vapor deposition are used.
• Electrophoretic or electrochromic structures or displays, organic or polymeric light-emitting diodes (OLEDs or PLEDs) in display and display devices or as illumination, as well as electroluminescent lamps, light, may be mentioned here as examples of (commercially available) or in their market potential interesting (opto) electronic applications emitting electrochemical cells (LEECs), organic solar cells such as dye or polymer solar cells, inorganic solar cells, in particular thin-film solar cells, based for example on the basis of silicon, germanium, copper, indium and selenium, perovskite solar cells, organic field-effect transistors, organic switching elements, organic optical amplifiers, organic laser diodes, organic or inorganic sensors or organic or inorganic based RFID transponder listed.
• OLEDs or PLEDs organic or polymeric light-emitting diodes
• OLEDs or PLEDs organic or polymeric light-emitting diodes
• electroluminescent lamps, light may be mentioned here as examples of (commercially available) or in their market potential interesting (
• a variety of electronic arrangements - especially when using organic materials - are sensitive to water vapor. During the lifetime of the electronic devices protection by an encapsulation is therefore required, otherwise the performance wears off over the period of use. Otherwise, under the influence of water vapor, electroluminescent lamps (EL lamps) or organic light-emitting diodes (OLEDs) can reduce the luminosity, electrophoretic displays (EP displays) the contrast or solar cells drastically reduce the efficiency within a short time.
• EL lamps electroluminescent lamps
• OLEDs organic light-emitting diodes
• EP displays electrophoretic displays
• liquid adhesives and adhesives based on epoxides are more frequently used as barrier adhesives, as described, for example, in WO 98/21287 A1, US Pat. No. 4,051,195 A and US Pat. No. 4,552,604.
• Her main field of application is edge bonding of rigid arrangements, but also moderately flexible arrangements. The curing takes place thermally or by means of UV radiation.
• the use of these liquid adhesives also brings a number of undesirable effects.
• VOCs volatile organic compounds
• the adhesive must be applied consuming on each individual component of the arrangement.
• the purchase of expensive dispensers and fixators is necessary to ensure accurate positioning.
• the type of application also prevents a fast continuous process. In the subsequently required lamination step, it may be difficult to achieve a defined layer thickness and bond width due to the low viscosity.
• An alternative is the use of adhesive or hot melt adhesives for sealing (opto) electronic structures.
• PSAs preference is given to using those which can be crosslinked after the bonding by introduced energy (for example actinic radiation or heat).
• energy for example actinic radiation or heat.
• Such compositions are described for example in US 2006/0100299 A1 and WO 2007/087281 A1. Their advantage lies in the fact that the barrier effect of the adhesives can be improved by the crosslinking.
• Hot-melt adhesives based on block copolymers or functionalized polymers are described, for example, in WO 2008/036707 A2, WO 2003/002684 A1, JP 2005-298703 A and US 2004/0216778 A1.
• An advantage of these adhesives is that no or very little substance is introduced into the structure to be encapsulated by the adhesives themselves, which damages the structure itself, whereas this problem is particularly relevant in reactive liquid adhesive systems, especially those based on acrylate or epoxy resin. Due to the high number of reactive groups, these systems have a relatively high polarity, so that in particular water is contained therein. The amount is usually in the range of less than 100 ppm to more than 1 wt .-%.
• liquid adhesives are mainly used as edge sealing of the electronic assemblies, wherein they are not in direct contact with the active electronic materials.
• Another way to address the problem of entrained permeates is to additionally include an absorbent material - a so-called getter - within the encapsulant, which binds out of the adhesive diffusing or permeating water or other permeates by, for example, absorbing or adsorbing them .
• Another measure is the equipment of the adhesive and / or the substrate and / or the cover of the electronic structure with such binding properties, as described for example in WO 2006/036393 A2, DE10 2009 036 970 A1 and DE 10 2009 036 968 A1 becomes.
• a getter is often also packaged, for example in the form of a bag filled with silica gel or zeolite. This getter is usually not in direct contact with the contents.
• a disadvantage of this method in particular the increased packaging costs.
• a specific problem occurs in the packaging of sheet adhesives, ie adhesive tapes or adhesive films: If these are stacked as blanks or wound into a roll, gas - for example air - is enclosed, which does not exchange with the other gas space remaining in the packaging located. Contained unwanted permeate, for example water vapor, so do not reach the packaging material in the getter and can thus pass into the adhesive.
• such tapes usually contain a temporary covering material, the so-called liner, as well as often a carrier material.
• liner a temporary covering material
• carrier material such as water, which can easily permeate in particular because of the large contact surface with the adhesive. Getter bags or pads placed in the package can not reliably intercept and bind the water.
• the residence time in the customary channel dryer systems is generally insufficient to sufficiently supply the adhesive and liner or carrier material with water to free. Such a slow manufacturing process would be uneconomical.
• the object of the present invention is therefore to provide a method with which an adhesive layer is protected both from water originating from the environment and from water trapped during winding or stacking and other processing steps, wherein the adhesive layer additionally comprises remaining water is released.
• a first general subject of the invention is thus a method for removing water from an adhesive and / or for protecting an adhesive from water from the environment, comprising
• the removal of water which can also be referred to as drying of the liner, takes place - according to the above subject of the invention - without the addition of desiccant in the liner itself, ie only by diffusion of moisture from the interior of the liner on the surface. There, the moisture is then separated from the liner. This can e.g. by evaporation, but also by absorption of moisture by another material, such as a desiccant, take place, which is temporarily brought into contact with the liner. "Temporarily bring into contact” means that the other material is removed from the release liner before the Liner is removed from the adhesive, in no case so the composite of liner and other material is removed in one piece from the adhesive.
• the water content of the release liner after drying is preferably ⁇ 1500 ppm, more preferably ⁇ 1000 ppm, in particular ⁇ 750 ppm.
• a lower water content of the liner advantageously allows a higher water absorption from the adhesive or the environment.
• the process according to the invention is in particular a process for removing water from an adhesive.
• the term "removal of water from an adhesive" in the context of the invention means that, after the adhesive and release liner have been contacted and water has been removed from the release liner, water is transported from the adhesive into the release liner At the time of contacting, the water content of the release liner is particularly preferably not more than 50%, in particular not more than 10%, of the water content of the adhesive.
• step a) takes place before step b).
• the adhesive When it comes into contact with the adhesive, it can be present as an adhesive composition film or it can be coated from a fluid phase onto the dried release liner. It is preferred if the fluid phase contains no water as a solvent or dispersant, otherwise the absorption capacity of the liner would be too quickly exhausted.
• step b) takes place before step a).
• the adhesive has a low water vapor permeation rate (WVTR), so that it can only be dried very slowly.
• WVTR of the release liner in this process variant is preferably more than 500 g / m 2 d.
• the liner can be dried relatively quickly in this case.
• the energy required for removing the water is introduced substantially from the side of the release liner, as can be achieved, for example, by convection, heat conduction or heat radiation.
• temperatures can be tolerated on the liner surface, which are above the tolerable temperature for the adhesive, for example because this otherwise decomposes, segregates or is affected by a chemical reaction.
• the surface temperature of the liner may advantageously be at least 20 ° C., often even more than 50 ° C., above the surface temperature of the adhesive.
• steps a) and b) take place on both sides of the adhesive.
• Adhesive tapes which are coated with adhesives on one or both sides, are usually wound into a roll in the form of an Archimedean spiral at the end of the production process.
• the adhesive tapes before wrapping with a cover material also referred to as a release material
• cover materials are known to the person skilled in the art under the name of liners and - generally and also used interchangeably in the context of the present text - release liners.
• cover of single or double sided Adhesive tapes are also used to cover pure adhesives (transfer adhesive tapes) and adhesive tape sections (for example labels).
• a liner is accordingly understood to mean a covering material having an anti-adhesive (abhesive) surface, which is applied directly to the composition for the temporary protection of an adhesive and can generally be removed by simply peeling off immediately before application of the adhesive.
• release liners also ensure that the adhesive is not contaminated before use.
• release liners can be adjusted by the nature and composition of the release materials so that the adhesive tape can be unrolled with the desired force (light or heavy).
• the release liners additionally ensure that the correct side of the adhesive is first exposed during unrolling.
• a liner is not part of an adhesive tape, but only an aid for its production, storage or for further processing.
• a liner is not firmly bonded to an adhesive layer, but the composite is only temporary and not permanent.
• a liner contains at least one abhesive release layer.
• abhesive expresses according to the invention that the separating layer has a lower adhesion to the adhesive to be covered than the adhesive to the application substrate provided in its application and optionally to the carrier material belonging to the adhesive.
• the material of the adhesive separating layer is preferably selected from the group consisting of silicones, fluorinated silicones, silicone copolymers, waxes, carbamates, fluoropolymers and polyolefins or mixtures of two or more of the substances mentioned.
• the material of the abhesive release layer is selected from silicones and polyolefins.
• the abhesive release layer-forming system is preferably adjusted so that virtually no diffusion of abhesive substances into the adhesive. If necessary, substances can still be removed analytically from the abhesive Prove coating, which, however, are due to mechanical abrasion.
• the abhesive separating layer preferably has virtually no vapor pressure at room temperature.
• the abhesive release layer consists of a silicone system.
• silicone systems for the preparation of such silicone systems crosslinkable silicones are preferably used. These include mixtures of crosslinking catalysts and so-called thermally curable condensation or addition-crosslinking polysiloxanes.
• condensation-crosslinking silicone systems tin compounds such as dibutyltin diacetate are frequently present as crosslinking catalysts in the mass.
• Silicone-based release agents on an addition-curing basis can be hardened by hydrosilylation. These release agents usually comprise the following components:
• alkenylated polydiorganosiloxane especially linear alkenyl-terminated polymers
• hydrosilylation catalysts for example, platinum or platinum compounds, such as, for example, the Karstedt catalyst (a Pt (O) complex compound) have prevailed.
• Karstedt catalyst a Pt (O) complex compound
• Thermally curing release coatings are thus often multicomponent systems, which typically consist of the following components:
• a linear or branched dimethylpolysiloxane which consists of about 80 to 200 dimethylpolysiloxane units and is stopped at the chain ends with vinyldimethylsiloxy units.
• Typical representatives are, for example, solvent-free, addition-curing silicone oils with terminal
• Vinyl groups such as Dehesive® 921 or 610, both commercially available from Wacker-Chemie GmbH;
• a linear or branched crosslinker which is usually composed of methylhydrogensiloxy and dimethylsiloxy units, wherein the chain ends either with trimethylsiloxy groups or
• Dimethylhydrogensiloxy groups are saturated.
• Typical representatives of this A product class are, for example, hydrogenpolysiloxanes with a high content of reactive Si-H, such as the crosslinkers V24, V90 or V06, which are commercially available from Wacker-Chemie GmbH;
• Units has. Typical representatives of this group are, for example, the release force regulators CRA® 17 or CRA® 42, commercially available from Wacker-Chemie GmbH;
• a silicon-soluble platinum catalyst such as, for example, a platinum divinyltetramethyldisiloxane complex, which is usually used as Karstedt's
• catalyst OL at Wacker-Chemie GmbH.
• photoactive catalysts so-called photoinitiators
• UV-curable cationically crosslinking siloxanes based on epoxide and / or vinyl ethers
• UV-curable, radically crosslinking siloxanes such as acrylate-modified siloxanes.
• electron beam curable silicone acrylates is possible.
• Corresponding systems may also contain other additives, such as stabilizers or leveling agents, depending on the intended use.
• Silicone-containing systems can be purchased commercially, for example from Dow Corning, Wacker or Rohm & Haas.
• silicone systems are polysiloxane block copolymers, for example with urea block, as are offered by the company Wacker under the trade name "Geniomer", or separation systems of fluorosilicone, which are used in particular in adhesive tapes with silicone adhesives.
• Polyolefinic release layers may consist of both thermoplastic, non-elastic and elastic materials.
• release liners can be based on polyethylene.
• Polyethylene can be used in the entire feasible density range of about 0.86 g / cm 3 to 1 g / cm 3 .
• low density polyethylenes are preferred because they often provide lower release forces.
• Separating layers with elastic properties can likewise consist of olefin-containing elastomers. Examples include both random copolymers and block copolymers. Exemplary block copolymers include ethylene-propylene rubbers, butyl rubber, polyisobutylene, ethylene block copolymers, and partially and fully hydrogenated styrene-diene block copolymers such as styrene-ethylene / butylene and styrene-ethylene / propylene block copolymers.
• Suitable release layers can also be provided by acrylate copolymers.
• Preferred embodiments of this variant are acrylate polymers having a static glass transition temperature (midpoint TG, determined by differential scanning calorimetry) below room temperature.
• the polymers are typically crosslinked.
• the crosslinking can be of a chemical or physical nature, as is realized, for example, in block copolymers.
• the abhesive release layer can be applied directly by means of a coating bar of solution, emulsion or dispersion.
• the dissolving, emulsifying or dispersing agent used can then be evaporated in this case in a commercially available dryer.
• a solvent-free coating by means of a nozzle or roller coating system is suitable.
• the abhesive layer can also be printed. Deep and screen printing processes are suitable for this purpose according to the prior art. Rotary printing processes are preferably used here. Furthermore, abhesive coatings can also be applied by spraying. This can be done by rotary spraying, optionally also electrostatically.
• the material of the abhesive release layer and the material of an optionally present carrier layer need not be present as homogeneous materials, but can also consist of mixtures of several materials.
• the materials can each be used to optimize the properties and / or processing with one or more additives such as resins, waxes, plasticizers, fillers, pigments, UV absorbers, light stabilizers, anti-aging agents, crosslinking agents, crosslinking promoters, defoamers, degassing agents, wetting agents, dispersing agents, rheology additives or elastomers blended.
• additives such as resins, waxes, plasticizers, fillers, pigments, UV absorbers, light stabilizers, anti-aging agents, crosslinking agents, crosslinking promoters, defoamers, degassing agents, wetting agents, dispersing agents, rheology additives or elastomers blended.
• the release liner of the process according to the invention consists only of the abhesive release layer.
• the liner contains at least one carrier layer.
• the abhesive separating layer can be applied directly to the carrier layer and at least partially cover it.
• an abhesive release layer is applied as a continuous (uninterrupted) outer layer, at least on the side of the carrier material facing the adhesive.
• the liner may also - regardless of the presence of a carrier layer - on both sides at least partially have an abhesive surface, which may be the same or different.
• a carrier material of a liner papers plastic-coated papers or films can be used, with films, especially dimensionally stable plastic or metal foils, are preferred.
• the carrier layer is therefore often composed of polyesters, in particular of polyethylene terephthalate, for example of biaxially oriented polyethylene terephthalate, or of polyolefins, in particular of polybutene, cyclo-olefin copolymer, polymethylpentene, polypropylene or polyethylene, for example of monoaxially oriented polypropylene, biaxially oriented polypropylene or biaxially stretched polyethylene. These materials usually have only a low water absorption capacity of less than 0.5 wt .-%.
• the release liner preferably comprises at least one plastic film having a water absorption capacity of more than 0.5% by weight, in particular more than 2% by weight.
• the material of the plastic film is selected from the group consisting of polyamide, polyamide copolymers, polyvinyl butyral, polyvinyl alcohol, polyvinyl acetate, cellulose acetate, Cellulose acetate derivatives, cellulose hydrate (cellophane), cellulose propionate, cellulose acetobutyrate, polysulfone and polysulfone derivatives.
• Papers or webs are also fundamentally suitable as the carrier material of the liner in the context of the invention. Papers are characterized by a particularly high water absorption and due to their porous structure by easy desiccation.
• the release liner of the process according to the invention contains a layer, in particular a carrier layer, with a Wasserdampfpermeationsrate of at least 1000 g / m 2 d at a thickness of 50 ⁇ .
• Releaseliner generally have a thickness of 10 to 250 ⁇ .
• Preferred for the process according to the invention is a liner with a thickness of more than 50 ⁇ m, since in this case a larger water absorption capacity is available.
• Particularly preferred is a liner with a thickness of more than 250 ⁇ , since hereby an even greater water absorption capacity can be provided.
• the liner of the process according to the invention preferably contains a barrier layer against water vapor.
• the release liner particularly preferably contains at least one layer having a water absorption capacity of more than 0.5% by weight, preferably of more than 2% by weight, and at least one layer having a barrier function against water vapor, in particular a layer having a WVTR of ⁇ 0.1 g / m 2 d, wherein the layer having a water absorption capacity of more than 0.5 wt .-% after contacting with the adhesive is disposed closer to the adhesive than the layer having the barrier function.
• a liner is preferably dried before being brought into contact with the adhesive layer.
• Such a barrier function may consist of organic or inorganic materials. Liner with barrier function are shown in detail in EP 2 078 608 A1.
• the liner contains at least one inorganic barrier layer.
• inorganic barrier layers are particularly well in vacuum (for example by evaporation, CVD, PVD, PECVD) or under atmospheric pressure (for example by means of atmospheric plasma, reactive corona discharge or flame pyrolysis) deposited metals or in particular metal compounds such as metal oxides, - nitrides or hydronitrides, for example Oxides or nitrides of silicon, boron, of aluminum, zirconium, hafnium or tellurium or indium tin oxide (ITO).
• ITO indium tin oxide
• doped layers of the abovementioned variants with further elements are also metal foils.
• the liner preferably contains at least one carrier layer and at least one barrier layer, wherein the barrier layer and the carrier layer are present as layers lying directly next to one another.
• a particularly suitable method for applying an inorganic barrier layer is high-power pulse magnetron sputtering and atomic layer deposition, which allow particularly permeation-proof layers to be realized with a low temperature load on the carrier layer.
• Preference is given to a permeation barrier of the carrier layer with barrier function or of the composite of carrier layer and barrier layer against water vapor (WVTR) of ⁇ 1 g / m 2 d, the value being based on the thickness of the composite of carrier layer and barrier layer used in each case in the liner, that is not normalized to a specific thickness.
• the WVTR is determined according to the invention at 38 ° C and 90% relative humidity to ASTM F-1249.
• the material of the adhesive separating layer preferably has a permeability to water vapor of at least 100 g / m 2 d, more preferably of at least 500 g / m 2 d, in each case based on a layer thickness of 50 ⁇ .
• the material of the adhesive separating layer is here understood to mean the pure separating layer material without a possible additive.
• the specified water vapor permeability of the separating layer material is advantageous in that the water vapor arrives particularly quickly and effectively to the dry carrier material, in particular from the side of the adhesive. Particular preference is therefore given to using a release layer based on silicone or acrylate.
• the release liner of the process according to the invention preferably consists of a carrier layer and an abhesive release layer, ie contains exclusively these two layers. This is advantageous because such a liner is more flexible than a multilayer liner and anchoring between the two layers is easier to achieve than with a multilayer liner. In addition, such a liner can be made with a lower material usage. Compared with a liner consisting only of the release layer, this embodiment has the advantage that the separation function and the mechanical stabilization function in two Layers are decoupled and thus in each case particularly suitable materials can be selected.
• the liner consists of a carrier layer, an abhesive separating layer and a primer layer arranged between carrier and separating layer.
• the liner of the process according to the invention is transparent, ie the transmission, measured according to ASTM D1003-00 (Procedure A), is greater than 50%, preferably greater than 75%.
• ASTM D1003-00 Procedure A
• the adhesive can be positioned more easily in the application.
• the liner of the method according to the invention is UV light impermeable, that is, the transmission in a wavelength range of 200 to 400 nm, measured according to ASTM D1003-00 (Procedure B) is less than 25%, preferably less than 10%.
• the adhesive can be protected from changes (for example, chemical reactions, aging, cross-linking) by the influence of UV light.
• Another object of the present invention is an at least one side and at least partially covered with a release liner adhesive tape which can be produced by a method according to the invention.
• the adhesive of the adhesive tape according to the invention is preferably a pressure-sensitive adhesive or an activatable adhesive and in particular an activatable pressure-sensitive adhesive.
• Adhesive adhesives are adhesives whose set film remains permanently tacky and tacky at room temperature in the dry state. Pressure-sensitive adhesives allow a permanent connection with the primer under relatively low pressure.
• PSAs known to the person skilled in the art, ie, for example, those based on acrylates and / or methacrylates, polyurethanes, natural rubbers, synthetic rubbers; Styrene block copolymer compositions having an elastomeric block of unsaturated or hydrogenated polydiene blocks such as polybutadiene, polyisoprene, copolymers from both and other, familiar to the expert elastomer blocks; Polyolefins, fluoropolymers and / or silicones.
• acrylate-based pressure-sensitive adhesives are mentioned in the context of this document, they should include PSAs based on methacrylates and on the basis of acrylates and methacrylates, even without explicit mention, unless expressly stated otherwise. Also within the meaning of the invention are combinations and mixtures of several base polymers as well as adhesive resins, fillers, anti-aging agents and crosslinkers additivtechnischtechnisches used, the list of additives is to be understood only as an example and not limiting.
• pressure-sensitive adhesives based on styrene block copolymers, polybutylenes, polyolefins or fluoropolymers, since these are distinguished by a high permeation barrier against water vapor and a low content of water.
• Adhesive compositions are considered as activatable adhesives, in which the bonding takes place by an energy input, for example by actinic radiation or heat.
• heat-adhesive adhesives can be classified into two categories: thermoplastic heat-activated adhesives (hot-melt adhesives) and reactive heat-activated adhesives (reactive adhesives). Also included are those adhesives which can be assigned to both categories, namely reactive thermoplastic heat-activated adhesive adhesives (reactive hot melt adhesives).
• Thermoplastic adhesives are based on polymers that reversibly soften when heated and solidify again during cooling.
• Particularly suitable thermoplastic adhesives have been found to be advantageous on the basis of polyolefins and copolymers of polyolefins and of their acid-modified derivatives, of ionomers, of thermoplastic polyurethanes, of polyamides and polyesters and copolymers thereof, and also of block copolymers such as styrene block copolymers.
• reactive heat-activated adhesive adhesives contain reactive components. The latter ingredients are also referred to as "reactive resins" in which the heating initiates a crosslinking process which, upon completion of the crosslinking reaction, ensures a durable, stable compound.
• Such adhesives preferably also contain elastic components, for example synthetic nitrile rubbers or styrene block copolymers. Due to their high flow viscosity, such elastic components impart to the heat-activated adhesive composition a particularly high dimensional stability, even under pressure.
• elastic components for example synthetic nitrile rubbers or styrene block copolymers. Due to their high flow viscosity, such elastic components impart to the heat-activated adhesive composition a particularly high dimensional stability, even under pressure.
• Radiation activated adhesives are also based on reactive components.
• the latter constituents may comprise, for example, polymers or reactive resins in which the irradiation initiates a crosslinking process which, upon completion of the crosslinking reaction, ensures a permanent stable compound.
• Such adhesives preferably also contain elastic components, as stated above.
• Activatable adhesives based on epoxides, oxetanes, (meth) acrylates or modified styrene block copolymers are preferably used.
• the adhesive preferably has a water content of less than 2000 ppm, more preferably less than 500 ppm, before it is brought into contact with the liner.
• the indication ppm refers to the relation of the total weight of water contained to the examined adhesive mass.
• the water content is determined according to the invention according to DIN 53715 (Karl Fischer titration) after storage of the test specimen for 24 hours at 23 ° C and 50% relative humidity.
• DIN 53715 Karl Fischer titration
• the adhesive has a Wasserdampfpermeationsrate (WVTR) of a maximum of 50 g / m 2 d, more preferably of at most 20 g / m 2 d, each based on a Klebemassedicke of 50 ⁇ . Due to the low water vapor permeation rate of the adhesive, less water from the environment diffuses through the adhesive through into the dried liner, which can thus fulfill its function longer. This facilitates, for example, the production and packaging of the adhesive tape.
• WVTR Wasserdampfpermeationsrate
• the adhesive tape according to the invention thus comprises at least one layer of a pressure-sensitive adhesive or of an activatable adhesive or, in particular, of an activatable pressure-sensitive adhesive.
• the adhesive tape may also contain further layers, for example one or more further adhesive layers or a carrier material.
• the adhesive tape preferably contains only one layer of an adhesive (transfer adhesive tape), since this makes the structure simple and, owing to the smaller material diversity, an optimization with regard to the water vapor permeation rate of the adhesive tape can be made easier. Furthermore, no carrier material hinders the diffusion of water vapor from the adhesive tape to the dried liner, whereby the adhesive tape can be freed of water in a particularly efficient manner.
• the thickness of the adhesive tape can comprise all the usual thicknesses, that is to say from 3 ⁇ m to 3000 ⁇ m. Preference is given to a thickness of between 25 and 100 ⁇ m, since adhesion and handling properties are particularly favorable in this area. Another preferred range is a thickness of 3 to 25 ⁇ , since in this area, the amount of permeating through the adhesive joint water can be kept low only by the small cross-sectional area of the adhesive joint in an encapsulation application. Furthermore, it has been found that such low adhesive tape thicknesses can be easily freed from permeates by the dried liner.
• the liner can be coated or printed on one side with the adhesive of the adhesive tape of solution or dispersion or 100% (for example from the melt), or the composite is produced by coextrusion.
• the carrier of the adhesive tape may be involved.
• the adhesive layer (s) can be crosslinked by heat or high-energy radiation.
• the above processes take place in an environment in which water is present only in low concentration or almost not at all. As an an example may be called a relative humidity of less than 30%, preferably less than 15%.
• the adhesive used can be blended with one or more additives such as tackifiers (resins), plasticizers, fillers, pigments, UV absorbers, light stabilizers, antiaging agents, crosslinking agents, crosslinking promoters or elastomers.
• additives such as tackifiers (resins), plasticizers, fillers, pigments, UV absorbers, light stabilizers, antiaging agents, crosslinking agents, crosslinking promoters or elastomers.
• the amount of the adhesive layer is preferably 10 to 200 g / m 2 , preferably 25 to 120 g / m 2 , where "amount” is understood to mean the amount after any removal of water or solvent.
• a further subject of the present invention is the use of an adhesive tape produced by the process according to the invention and at least partially and at least partially covered with the release liner for encapsulating an optoelectronic device and / or an organic electronic device.
• Another object of the invention is a release liner, which comprises at least one support material and at least one release layer and which is characterized in that the release liner is in the form of a roll and not touch the side surfaces of two adjacent layers of the release liner directly. This facilitates the drying of the liner.
• individual spacers are wrapped in the Archimedean spiral of the scroll.
• a membrane having a Wasserdampfpermeationsrate of at least 1000 g / m 2 d is wrapped at a thickness of 50 ⁇ between the adjacent layers of the release liner.
• the membrane preferably textile fabrics such as nonwovens, fabrics, scrims, knitted or the like are used. But also suitable are open-cell foams and papers.
• the membrane may also be part of the liner itself, that is to say be used as a carrier material.
• the support material is preferably simultaneously water-absorbing as well as permeation-open medium. Examples
• the SBBS contains about 68% by weight diblock content.
• the solvent used was a mixture of toluene and acetone in the ratio 2: 1
• the solvent used was methyl ethyl ketone.
• the adhesives were stored for 72 hours at 23 ° C and 50% relative humidity.
• the water content of the adhesives was determined in each case before the lamination with the liner.
• the silicone system used is an addition-curing silicone system from Wacker.
• 9.75 g of DEH 915 (a vinyl-functionalized polydimethylsiloxane) was mixed with 0.33 g of V24 (a methylhydrogenpolysiloxane) and 0.08 g of Kat OL (a platinum catalyst, also known as "Karstedt catalyst") Liners were commercial liners based on a 75 ⁇ thick PET film (Silphan S75 M371 the company Siliconature, Italy, Liner 3) and on the basis of a paper (KS 900 white 52B 20 Laufenberg, Krefeld, Liner 4) used.
• the liners were conditioned or dried under different climates for different lengths:
• the liners were sealed in vacuum-sealed bags made of a permeation-tight film laminate (polyester film-aluminum foil sealant film) and removed just prior to use.
• the water content was determined according to DIN 53715 (Karl Fischer titration). The measurement was carried out on a Karl Fischer Coulometer 851 in conjunction with an ovensampler (oven temperature 140 ° C.). With a weight of about 0.3 g, a triple determination was carried out in each case. The water content is the arithmetic mean of the measurements.
• the method according to the invention is suitable for removing water from an adhesive.
• no appreciable drying takes place and / or a sufficiently dry level is achieved, e.g. an application for encapsulating sensitive organic electronic structures.
• the adhesive K3 from the solution was coated directly onto the conditioned in Klima C liners L1 and L3 and dried at 120 ° C for 15 min on a hot plate, the liner side of the composite was on the hot plate.
• Example 25 shows that even with simultaneous drying of an adhesive
• Continuous furnace can be realized at a process speed of 10 m / min
• Comparative Example 10 shows that Liner 3 can not be sufficiently predried under drying conditions typical for a continuous oven in order to effect a substantial drying of the adhesive.
• Example 26 shows that this is possible with liner 4, which in particular could be attributed to the very large water absorption capacity of the liner. This is more than 0.5 wt .-%.

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• Organic Chemistry (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Adhesive Tapes (AREA)
• Electroluminescent Light Sources (AREA)
• Laminated Bodies (AREA)

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• 2013
  • 2013-11-18 DE DE102013223451.1A patent/DE102013223451A1/de not_active Withdrawn
• 2014
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  • 2014-11-11 CN CN201480062965.1A patent/CN105745292B/zh active Active
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  • 2014-11-11 WO PCT/EP2014/074251 patent/WO2015071250A2/de active Application Filing
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