EP3031937A1 - Kupferlegierung, feinblech aus kupferlegierung und verfahren zur herstellung einer kupferlegierung - Google Patents

Kupferlegierung, feinblech aus kupferlegierung und verfahren zur herstellung einer kupferlegierung Download PDF

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Publication number
EP3031937A1
EP3031937A1 EP14834900.4A EP14834900A EP3031937A1 EP 3031937 A1 EP3031937 A1 EP 3031937A1 EP 14834900 A EP14834900 A EP 14834900A EP 3031937 A1 EP3031937 A1 EP 3031937A1
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EP
European Patent Office
Prior art keywords
copper alloy
mass
contained
amount
less
Prior art date
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EP14834900.4A
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English (en)
French (fr)
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EP3031937A4 (de
Inventor
Kazunari Maki
Kenichiro SUEHIRO
Shuhei ARISAWA
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Mitsubishi Shindoh Co Ltd
Mitsubishi Materials Corp
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Mitsubishi Shindoh Co Ltd
Mitsubishi Materials Corp
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Publication of EP3031937A1 publication Critical patent/EP3031937A1/de
Publication of EP3031937A4 publication Critical patent/EP3031937A4/de
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/001—Continuous casting of metals, i.e. casting in indefinite lengths of specific alloys
    • B22D11/004—Copper alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D21/00—Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedure; Selection of compositions therefor
    • B22D21/02—Casting exceedingly oxidisable non-ferrous metals, e.g. in inert atmosphere
    • B22D21/025—Casting heavy metals with high melting point, i.e. 1000 - 1600 degrees C, e.g. Co 1490 degrees C, Ni 1450 degrees C, Mn 1240 degrees C, Cu 1083 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Definitions

  • the present invention relates to a copper alloy, a copper alloy thin sheet, and a method of manufacturing a copper alloy that are suitable as a copper alloy sheet strip that is used, for example, in household electrical appliances, semiconductor components such as a lead frame for a semiconductor device, electrical and electronic component materials such as a printed wiring board, switch components, bus bars, mechanism components such as a connector, industrial apparatuses, and the like.
  • a Cu-Fe-P-based copper alloy that contains Fe and P is typically used in the related art.
  • a copper alloy (CDA19400 alloy), which contains 2.1 to 2.7% by mass of Fe, 0.015 to 0.15% by mass of P, and 0.05 to 0.20% by mass of Zn, is exemplified.
  • the CDA19400 alloy is an international standard alloy that is defined in Copper Development Association (CDA).
  • the above-described CDA19400 alloy is a precipitation strengthening type alloy in which Fe or an intermetallic compound such as Fe-P is allowed to precipitate in a copper parent phase, and is excellent in strength, conductivity, and thermal conductivity. Accordingly, the CDA19400 alloy is widely used for various usages.
  • the CDA19400 alloy is demanded to have further higher strength or conductivity, and excellent bending workability.
  • the above-described lead frame, connector, and the like are manufactured by etching or punching the copper alloy thin sheet.
  • punching the copper alloy thin sheet that is composed of the CDA19400 alloy and the like there is a problem that abrasion in a mold is significant, and it is necessary to replace the mold after use for a short time.
  • PTL 1 and PTL 2 suggest that C is added to the Cu-Fe-P-based alloy so as to suppress cracking in a hot-rolling process, and to improve characteristics such as punching mold abrasion resistance.
  • Mg and the like are added so as to improve characteristics such as strength of the Cu-Fe-P-based alloy.
  • the invention has been made in consideration of the above-described circumstances, and an object thereof is to provide a copper alloy, a copper alloy thin sheet, and a method of manufacturing a copper alloy capable of suppressing occurrence of a surface defect and a shape defect in a Cu-Fe-P-based alloy.
  • the present inventors have conducted extensive research to solve the problem. As a result, it was proven that surface defects and shape defects, which occur in the Cu-Fe-P-based alloy such as the CDA19400 alloy, are formed when iron alloy particles containing Fe and C are exposed to a surface of the copper alloy thin sheet.
  • a copper alloy containing 1.5 to 2.7% by mass of Fe, 0.008 to 0.15% by mass of P, and 0.01 to 0.5% by mass of Zn, the balance being Cu and inevitable impurities.
  • the amount of C contained as one of the inevitable impurities is less than 3 ppm by mass.
  • the amount of C contained as one of the inevitable impurities is regulated to be less than 3 ppm by mass.
  • C is an element that has a function of promoting liquid phase separation between a liquid phase that contains Fe as a main component and C, and a liquid phase that contains Cu as a main component. Therefore, when the amount of C contained increases, a coarse Fe-C crystallized product is likely to be generated in an ingot. Accordingly, when regulating the amount of C contained as described above, it is possible to suppress occurrence of the coarse Fe-C crystallized product, and it is possible to greatly reduce surface defects due to iron alloy particles. In addition, it is possible to suppress a shape defect of a product which is caused by the coarse Fe-C crystallized product.
  • the copper alloy of the invention may further contain one or both of 0.003 to 0.5% by mass of Ni and 0.003 to 0.5% by mass of Sn.
  • Ni or Sn is solid-soluted in a parent phase of Cu. Accordingly, it is possible to realize an improvement in the strength of the Cu-Fe-P-based copper alloy.
  • the copper alloy of the invention may further contain at least one of Mg, Ca, Sr, Ba, rare-earth elements, Zr, Si, Al, Be, Ti, and Co in a range of 0.0007 to 0.5% by mass.
  • the amount of Mn contained as one of the inevitable impurities may be 20 ppm by mass or less, and the amount of Ta contained as one of the inevitable impurities may be 1 ppm by mass or less.
  • a copper alloy thin sheet that is composed of the above-described copper alloy.
  • the number of surface defects, which have a length of 200 ⁇ m or greater and are formed when iron alloy particles containing Fe and C are exposed to a surface, are 5 pieces/m 2 or less. More preferably, the number of the surface defects having a length of 200 ⁇ m or greater is 2 pieces/m 2 or less, and still more preferably less than 1 piece/m 2 .
  • the thickness of the thin sheet may be 0.5 mm or less.
  • the copper alloy thin sheet is composed of a copper alloy in which the amount of C contained as one of the inevitable impurities is suppressed to be low. Accordingly, occurrence of iron alloy particles containing Fe and C is suppressed, and it is possible to suppress occurrence of the surface defects which are caused by the iron alloy particles. In addition, it is possible to suppress the shape defect of a product which is caused by the coarse Fe-C crystallized product. In addition, when the number of the surface defects having a length of 200 ⁇ m or greater is 5 pieces/m 2 or less, it is possible to significantly decrease a product failure rate when performing pressing, etching, or silver plating.
  • the sheet thickness of the copper alloy thin sheet is 0.5 mm or less and surface defects of 200 ⁇ m or greater exist, there is a concern that defects also exist in a thickness direction. Therefore, for example, when machining a precise shape such as pressing and etching, the surface defects may cause a failure. From the above-described viewpoint, when the sheet thickness of the copper alloy thin sheet is 0.2 mm or less, the effect of the invention is further exhibited. When considering the manufacturing cost of the copper alloy thin sheet and the effect that is obtained, it is preferable that the lower limit of the sheet thickness of the thin sheet be set to 0.05 mm, but there is no limitation thereto.
  • a method for manufacturing a copper alloy.
  • the method includes a melting process of melting a raw material to produce a copper alloy molten metal, a high-temperature holding process of holding the copper alloy molten metal at 1300°C or higher, and a casting process of supplying the copper alloy molten metal, which is held at 1300°C or higher, into a mold so as to obtain an ingot.
  • the method of manufacturing a copper alloy includes the high-temperature holding process of holding the copper alloy molten metal at 1300°C or higher, and the casting process of supplying the copper alloy molten metal, which is held at a temperature as high as 1300°C or higher, into a mold so as to obtain an ingot. Accordingly, in the copper alloy molten metal, it is possible to suppress the liquid phase separation between the liquid phase that contains Fe as a main component and C, and the liquid phase that contains Cu as a main component, and it is possible to suppress generation of the coarse Fe-C crystallized product. Accordingly, it is possible to reduce the surface defects which are caused by the iron alloy particles. In addition, it is possible to suppress the shape defect of the product which is caused by the coarse Fe-C crystallized product.
  • a copper alloy capable of suppressing occurrence of a surface defect and a shape defect in a Cu-Fe-P-based alloy.
  • the copper alloy according to the first embodiment of the invention contains 1.5 to 2.7% by mass of Fe, 0.008 to 0.15% by mass of P, and 0.01 to 0.5% by mass of Zn, the balance being Cu and inevitable impurities.
  • the amount of C contained as one of the inevitable impurities is less than 3 ppm by mass.
  • Fe is solid-soluted in a parent phase of Cu, and generates P-containing precipitates (Fe-P compounds).
  • Fe-P compounds P-containing precipitates
  • the amount of Fe contained is 1.5 to 2.7% by mass. It is preferable that the amount of Fe contained be set in a range of 1.8 to 2.6% by mass so as to reliably exhibit the above-described operation effect.
  • P is an element having a deoxidizing operation.
  • P generates Fe-P compounds in combination with Fe.
  • the strength and the hardness are improved without decreasing the conductivity.
  • the amount of P contained is 0.008 to 0.15% by mass. It is preferable that the amount of P contained be set in a range of 0.01 to 0.05% by mass so as to reliably exhibit the above-described operation effect.
  • Zn is an element that is solid-soluted in the parent phase of Cu and has an operation of improving solder thermal-peeling resistance.
  • the amount of Zn contained is 0.01 to 0.5% by mass. It is preferable that the amount of Zn contained be set in a range of 0.05 to 0.35% by mass so as to reliably exhibit the above-described operation effect.
  • C is contained in the above-described copper alloy as an inevitable impurity.
  • a surface defect of a copper alloy thin sheet greatly increases. A result obtained by observing an example of the surface defect with an optical microscope is illustrated in FIG. 1 .
  • the surface defect that is observed in this embodiment is caused by iron alloy particles containing Fe and C.
  • the Fe element when melting and casting the above-described copper alloy, the Fe element is present in a state of being melted in a liquid phase that contains Cu as a main component.
  • C when C is present in an amount that is equal to or greater than a constant amount, in a copper alloy molten metal, the liquid phase that contains Cu as a main component, and a liquid phase that contains Fe as a main component and C are separated from each other.
  • a coarse Fe-C crystallized product is present in an ingot.
  • iron alloy particles which are caused by the coarse Fe-C crystallized product, are exposed to a surface of the copper alloy thin sheet, and the above-described surface defect occurs.
  • a shape defect occurs due to the iron alloy particles.
  • the amount of C contained is limited to be less than 3 ppm by mass. It is preferable that the amount of C contained be set to be less than 2 ppm by mass so as to reliably accomplish suppression of the surface defect and the shape defect.
  • Examples of the inevitable impurities other than C include Ni, Sn, Mg, Ca, Sr, Ba, rare-earth elements, Zr, Si, Al, Be, Ti, H, Li, B, N, O, F, Na, S, Cl, K, V, Cr, Mn, Co, Ga, Ge, As, Se, Br, Rb, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sb, Te, I, Cs, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, Bi, and the like. It is preferable that these inevitable impurities be contained in a total amount of 0.3% by mass or less. When considering the manufacturing cost of the copper alloy and an effect that is obtained, the lower limit of the total amount of the inevitable impurities is preferably 0.1% by mass, but there is no limitation thereto.
  • a copper alloy molten metal is generated by melting a copper raw material, pure iron, Zn or a Cu-Zn parent alloy, and P or a Cu-P parent alloy.
  • the copper raw material so-called 4N Cu having purity of 99.99% by mass or greater is preferable.
  • the pure iron so-called 3N Fe having purity of 99.9% by mass or greater or so-called 4N Fe having purity of 99.99% by mass or greater is preferable.
  • Ar is preferable.
  • a melting temperature is set to, for example, 1100 to 1300°C.
  • a temperature of the copper alloy molten metal that is obtained is raised to 1300°C or higher and is held at the temperature.
  • the temperature be set in a range of 1300 to 1500°C, and holding time is set in a range of 1 minute to 24 hours.
  • the copper alloy molten metal that is held at a temperature of 1300°C or higher is poured into a mold in a state of being held at the high temperature, thereby producing an ingot. According to this, the ingot of the copper alloy according to this embodiment is produced.
  • a cooling rate during casting be as fast as possible.
  • the cooling rate from 1300 to 900°C be 5 °C/s or greater, more preferably 10 °C/s or greater.
  • the upper limit of the cooling rate be 200 °C/s, but there is no limitation thereto.
  • Hot-rolling is performed in a reducing atmosphere under a condition of 750 to 1000°C.
  • Cold-rolling reduction is set to 40 to 95%, heat treatment is performed at 400 to 700°C, and final annealing is performed at 200 to 350°C after final rolling.
  • the number of surface defects which have a length of 200 ⁇ m or greater and are formed when the iron alloy particles containing Fe and C are exposed to a surface, is 5 pieces/m 2 or less.
  • the number of surface defects having a length of 200 ⁇ m or greater is 2 pieces/m 2 or less, and more preferably 1 piece/m 2 or less.
  • the amount of C, which is one of the inevitable impurities is less than 3 ppm by mass, it is possible to suppress generation of the coarse Fe-C crystallized product in the ingot. Accordingly, it is possible to suppress formation of the iron alloy particles which are caused by the coarse Fe-C crystallized product, and it is possible to greatly reduce occurrence of the surface defect. In addition, it is possible to suppress a shape defect of a product.
  • the manufacturing method according to this embodiment includes the high-temperature holding process S02 of holding the copper alloy molten metal at a high temperature of 1300°C or higher, and the casting process S03 of supplying the copper alloy molten metal, which is held at 1300°C or higher, into a mold to manufacture the ingot, it is possible to suppress generation of the coarse Fe-C crystallized product.
  • the copper alloy according to the second embodiment of the invention contains 1.5 to 2.7% by mass of Fe, 0.008 to 0.15% by mass of P, 0.01 to 0.5% by mass of Zn, any one or both of 0.003 to 0.5% by mass of Ni and 0.003 to 0.5% by mass of Sn, and at least one or more of Mg, Ca, Sr, Ba, rare-earth elements, Zr, Si, Al, Be, Ti, and Co in a range of 0.0007 to 0.5% by mass, the balance being Cu and inevitable impurities.
  • the amount of C contained as one of the inevitable impurities is less than 3 ppm by mass.
  • Ni is solid-soluted in the parent phase of Cu, and has an operation of improving the strength and lead bending fatigue resistant characteristics (repetitive bending fatigue resistant characteristics).
  • the amount of Ni contained is 0.003 to 0.5% by mass. It is preferable that the amount of Ni contained be set in a range of 0.008 to 0.2% by mass so as to reliably exhibit the above-described operation effect.
  • Sn is solid-soluted in the parent phase of Cu, and has an operation of improving the strength and solderability.
  • the amount of Sn contained is 0.003 to 0.5% by mass. It is preferable that the amount of Sn contained be set in a range of 0.008 to 0.2% by mass so as to reliably exhibit the above-described operation effect.
  • Mg, Ca, Sr, Ba, rare-earth elements, Zr, Si, Al, Be, Ti, and Co are solid-soluted in the parent phase of Copper, or are present as a precipitate or a crystallized product, and have an operation of improving the strength of the Cu-Fe-P-based alloy and an operation of improving punching mold abrasion resistance.
  • the amount of Mg, Ca, Sr, Ba, the rare-earth elements, Zr, Si, Al, Be, Ti, and Co, which are contained, is 0.0007 to 0.5% by mass.
  • the amount of Mg, Ca, Sr, Ba, the rare-earth elements, Zr, Si, Al, Be, Ti, and Co, which are contained, be set in a range of 0.005 to 0.15% by mass so as to reliably exhibit the above-described operation effect.
  • the rare-earth elements represent Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu.
  • Examples of the inevitable impurities other than C include H, Li, B, N, O, F, Na, S, Cl, K, V, Cr, Mn, Ga, Ge, As, Se, Br, Rb, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sb, Te, I, Cs, Hf, Ta, W, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, Bi, and the like. It is preferable that the total amount of the inevitable impurities be 0.3% by mass or less. When considering the manufacturing cost of the copper alloy and the effect that is obtained, it is preferable that the lower limit of the total amount of the inevitable impurities be set to 0.1% by mass, but there is no limitation thereto.
  • the copper alloy according to the second embodiment is manufactured by the melting process S01, the high-temperature holding process S02 of the molten metal, and the casting process S03.
  • the melting process S01 for addition ofNi, Sn, Mg, Ca, Sr, Ba, the rare-earth elements, Zr, Si, Al, Be, Ti, and Co, metal element elementary substances or parent alloys containing the elements are used.
  • the amount of C contained is less than 3 ppm by mass, it is possible to suppress formation of the iron alloy particles containing Fe and C, and it is possible to greatly reduce occurrence of the surface defect. In addition, it is possible to suppress the shape defect in a product.
  • the copper alloy according to the third embodiment of the invention contains 1.5 to 2.7% by mass of Fe, 0.008 to 0.15% by mass of P, and 0.01 to 0.5% by mass of Zn, the balance being Cu and inevitable impurities.
  • the amount of C contained as one of the inevitable impurities is less than 3 ppm by mass
  • the amount of Mn contained as one of the inevitable impurities is 20 ppm by mass or less
  • the amount of Ta contained as one of the inevitable impurities is 1 ppm by mass or less.
  • Mn and Ta are inevitable impurities, and are contained in the above-described copper alloy.
  • the Fe element when melting and casting the above-described copper alloy, the Fe element is present in a state of being melted in a liquid phase that contains Cu as a main component.
  • C in an amount that is equal to or greater than a constant amount, in the copper alloy molten metal, the liquid phase that contains Cu as a main component, and a liquid phase that contains Fe as a main component and C are separated from each other.
  • Mn and Ta are elements which are contained in the liquid phase that contains Fe as a main component and C, and may promote the liquid phase separation.
  • the amount of C contained is limited to be less than 3 ppm by mass
  • the amount of Mn contained is limited to 20 ppm by mass or less
  • the amount of Ta contained is limited to 1 ppm by mass or less.
  • the amount of C contained be set to be less than 2 ppm by mass, the amount of Mn contained is less than 15 ppm by mass, and the amount of Ta contained is less than 0.7 ppm by mass so as to reliably accomplish suppression of the surface defect and the shape defect.
  • Examples of the inevitable impurities other than C, Mn, and Ta include Ni, Sn, Mg, Ca, Sr, Ba, rare-earth elements, Zr, Si, Al, Be, Ti, H, Li, B, N, O, F, Na, S, Cl, K, V, Cr, Co, Ga, Ge, As, Se, Br, Rb, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, In, Sb, Te, I, Cs, Hf, W, Re, Os, Ir, Pt, Au, Hg, Tl, Pb, Bi, and the like. It is preferable that the total amount of the inevitable impurities be 0.3% by mass or less. When considering the manufacturing cost of the copper alloy and the effect that is obtained, the lower limit of the total amount of the inevitable impurities is preferably 0.1% by mass, but there is no limitation thereto.
  • the copper alloy according to the third embodiment is manufactured by the melting process S01, the high-temperature holding process S02 of the molten metal, and the casting process S03.
  • the melting process S01 it is preferable to use a raw material in which the amount of Mn and Ta contained is small. Particularly, there is a high possibility that the element Mn is mixed-in from an iron-based raw material and the like. Accordingly, it is preferable that the iron-based raw material be carefully selected and used.
  • an Fe raw material which contains 0.1% by mass or less of Mn and 0.005% by mass or less of Ta, is used.
  • the amount of C contained as one of the inevitable impurities is less than 3 ppm by mass, the amount of Mn contained as one of the inevitable impurities is 20 ppm or less, and the amount of Ta contained as one of the inevitable impurities is 1 ppm by mass or less, it is possible to suppress the liquid phase separation in the copper alloy molten metal and the formation of the iron alloy particles containing Fe and C. As a result, it is possible to greatly reduce occurrence of the surface defect. In addition, it is possible to suppress the shape defect of a product.
  • the element C may be prevented from being mixed-in through careful selection of a raw material that is used.
  • the element C may be mixed-in from an iron-based raw material and the like. Accordingly, it is preferable that the iron-based raw material be carefully selected and used.
  • any one or both of 0.003 to 0.5% by mass of Ni and 0.003 to 0.5% by mass of Sn may be contained, and at least of Mg, Ca, Sr, Ba, rare-earth elements, Zr, Si, Al, Be, Ti, and Co may be contained in a range of 0.0007 to 0.5% by mass.
  • a copper raw material composed of oxygen-free copper (ASTM B152 C10100), which had purity of 99.99% by mass or greater and in which the amount of C contained was 1 ppm by mass or less, was prepared.
  • the copper raw material was placed in an alumina crucible, and was melted by using a high-frequency melting furnace that was set to an Ar gas atmosphere.
  • raw materials pure iron, a Cu-Zn parent alloy, a Cu-Ni parent alloy, a Cu-Sn parent alloy, a Cu-P parent alloy, and raw materials or parent alloys of Mg, Ca, Sr, Ba, rare-earth elements, Zr, Si, Al, Be, Ti, and Co were added to the resultant copper molten metal, which was obtained, according to the necessity, and then melting was performed at 1200°C in an Ar atmosphere for preparation in a component composition illustrated in Table 1. Then, the resultant molten metal that was prepared was poured into a water-cooled copper mold to produce an ingot. In addition, the amount of C contained in each raw material was 10 ppm by mass or less.
  • the size of the ingot that was produced was set to have a thickness of approximately 30 mm, a width of approximately 150 mm, and a length of approximately 200 mm.
  • high-purity iron purity of 99.99% by mass
  • a cooling rate from 1300 to 900°C when the temperature of the molten metal was set to 1300°C, and a cooling rate from 1200 to 900°C when the temperature of the molten metal was set to 1200°C were set to approximately 10 °C/s or greater.
  • the ingot, which was obtained, was heated at 950°C, and hot-rolling was performed up to a thickness of 5.0 mm. After the hot-rolling, surface grinding was performed to remove an oxidized film, and the thickness was set to 4.0 mm.
  • a heating process was performed at 450°C for 1 hour, and final cold-rolling was performed to produce a strip material having a thickness of approximately 0.1 mm and a width of approximately 150 mm.
  • a heating process was performed at 250°C for 1 hour as final annealing, and a strip material, which was obtained, was set as a strip material for evaluation of characteristics.
  • all of the heat treatments were performed in an Ar atmosphere.
  • compositions of Table 1 Fe, P, Zn, and other additional elements were measured with a glow discharge mass spectrometer (GD-MS), and C was measured with an infrared absorption spectrometry.
  • GD-MS glow discharge mass spectrometer
  • a test specimen of No. 13B which is defined in JIS Z 2241: 2011 (based on ISO 6892-1: 2009), was collected from the strip material for evaluation of characteristics, and 0.2% proof stress was measured in accordance with an offset method.
  • test specimen was collected in such a manner that a tensile direction during a tensile test becomes parallel to a rolling direction of the strip material for evaluation of characteristics.
  • the number of surface defects which had a length of 200 ⁇ m or greater and were formed when foreign substances were exposed to a surface, was inspected.
  • the length of the defects was set to the maximum length of a surface damage, which occurred when the foreign substances were exposed to the surface, in the rolling direction.
  • an average number of defects (pieces/m 2 ) was calculated.
  • a copper raw material composed of oxygen-free copper (ASTM B152 C10100), which had purity of 99.99% by mass or greater and in which the amount of C contained was 1 ppm by mass or less, the amount of Mn contained was 0.1 ppm by mass or less, and the amount of Ta contained was 0.1 ppm by mass or less, was prepared.
  • the copper raw material was placed in an alumina crucible, and was melted by using a high-frequency melting furnace that was set to an Ar gas atmosphere.
  • a strip material for evaluation of characteristics having a thickness of approximately 0.1 mm and a width of approximately 150 mm was produced by the same method as in Example 1 by using the ingot.
  • both front and rear surfaces of 50 sheets of copper strips of 0.2 m 2 which were obtained from the strip material for evaluation of characteristics, were observed for more detailed evaluation, and the number of surface defects, which had a length of 200 ⁇ m or greater and were formed when foreign substances were exposed to a surface, was inspected.
  • the length of the defects was set to the maximum length of a surface damage, which occurred when the foreign substances were exposed to the surface, in the rolling direction.
  • an average number of defects (pieces/m 2 ) was calculated.
  • Fe, P, and Zn were measured with an inductively coupled plasma atomic emission spectrometer (ICP-AES). Mn, Ta, and other additional elements were measured with the glow discharge mass spectrometer (GD-MS).
  • ICP-AES inductively coupled plasma atomic emission spectrometer
  • GD-MS glow discharge mass spectrometer
  • the copper alloy thin sheet, and the method of manufacturing a copper alloy according to the invention it is possible to suppress occurrence of the surface defects and the shape defect in the Cu-Fe-P-based alloy.

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EP14834900.4A 2013-08-09 2014-08-08 Kupferlegierung, feinblech aus kupferlegierung und verfahren zur herstellung einer kupferlegierung Withdrawn EP3031937A4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013167045 2013-08-09
JP2014116287A JP5866410B2 (ja) 2013-08-09 2014-06-04 銅合金薄板および銅合金薄板の製造方法
PCT/JP2014/070981 WO2015020187A1 (ja) 2013-08-09 2014-08-08 銅合金、銅合金薄板および銅合金の製造方法

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EP3031937A1 true EP3031937A1 (de) 2016-06-15
EP3031937A4 EP3031937A4 (de) 2017-07-05

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EP (1) EP3031937A4 (de)
JP (1) JP5866410B2 (de)
KR (1) KR102213955B1 (de)
CN (1) CN105452500B (de)
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CN105452500B (zh) 2017-08-15
JP5866410B2 (ja) 2016-02-17
TW201522670A (zh) 2015-06-16
KR20160041914A (ko) 2016-04-18
CN105452500A (zh) 2016-03-30
WO2015020187A1 (ja) 2015-02-12
TWI522483B (zh) 2016-02-21
JP2015057511A (ja) 2015-03-26
KR102213955B1 (ko) 2021-02-09

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