EP2973659A4 - MORE ZONE HEATER - Google Patents

MORE ZONE HEATER

Info

Publication number
EP2973659A4
EP2973659A4 EP14764068.4A EP14764068A EP2973659A4 EP 2973659 A4 EP2973659 A4 EP 2973659A4 EP 14764068 A EP14764068 A EP 14764068A EP 2973659 A4 EP2973659 A4 EP 2973659A4
Authority
EP
European Patent Office
Prior art keywords
heating device
multizone heating
multizone
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14764068.4A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2973659A1 (en
Inventor
Brent D Elliot
Frank Balma
Alfred Grant Elliot
Alexander Veytser
Dennis G Rex
Richard E Schuster
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Watlow Electric Manufacturing Co
Original Assignee
Component Re Engineering Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/831,670 external-priority patent/US9984866B2/en
Application filed by Component Re Engineering Co Inc filed Critical Component Re Engineering Co Inc
Publication of EP2973659A1 publication Critical patent/EP2973659A1/en
Publication of EP2973659A4 publication Critical patent/EP2973659A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/037—Heaters with zones of different power density

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Surface Heating Bodies (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
EP14764068.4A 2013-03-15 2014-03-14 MORE ZONE HEATER Withdrawn EP2973659A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/831,670 US9984866B2 (en) 2012-06-12 2013-03-15 Multiple zone heater
PCT/US2014/028937 WO2014144502A1 (en) 2012-06-12 2014-03-14 Multiple zone heater

Publications (2)

Publication Number Publication Date
EP2973659A1 EP2973659A1 (en) 2016-01-20
EP2973659A4 true EP2973659A4 (en) 2016-11-09

Family

ID=53040011

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14764068.4A Withdrawn EP2973659A4 (en) 2013-03-15 2014-03-14 MORE ZONE HEATER

Country Status (5)

Country Link
EP (1) EP2973659A4 (enrdf_load_stackoverflow)
JP (1) JP6382295B2 (enrdf_load_stackoverflow)
KR (1) KR102171734B1 (enrdf_load_stackoverflow)
CN (1) CN105518825B (enrdf_load_stackoverflow)
TW (2) TWI632589B (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102461150B1 (ko) 2015-09-18 2022-11-01 삼성전자주식회사 3차원 반도체 메모리 장치
CN111373487B (zh) * 2017-10-24 2024-09-24 沃特洛电气制造公司 设有陶瓷绝缘体和铝套的电连接器及其制造方法
US11961747B2 (en) * 2018-03-28 2024-04-16 Kyocera Corporation Heater and heater system
KR102608397B1 (ko) * 2018-10-16 2023-12-01 주식회사 미코세라믹스 미들 영역 독립 제어 세라믹 히터
JP6775099B1 (ja) * 2018-12-20 2020-10-28 日本碍子株式会社 セラミックヒータ
US20210111059A1 (en) * 2019-10-12 2021-04-15 Applies Materials, Inc. Wafer Heater With Backside And Integrated Bevel Purge
JP7202322B2 (ja) * 2020-02-03 2023-01-11 日本碍子株式会社 セラミックヒータ
JP7240341B2 (ja) 2020-02-03 2023-03-15 日本碍子株式会社 セラミックヒータ及び熱電対ガイド
JP7360992B2 (ja) * 2020-06-02 2023-10-13 京セラ株式会社 端子付構造体
KR102242589B1 (ko) * 2020-09-09 2021-04-21 주식회사 미코세라믹스 세라믹 히터
JP2024172480A (ja) * 2023-05-31 2024-12-12 株式会社Kokusai Electric 基板処理方法、半導体装置の製造方法、基板処理装置及びプログラム
KR102844318B1 (ko) 2023-12-19 2025-08-08 주식회사 에스지에스코리아 멀티 존 히터의 제어 장치 및 제어 방법

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4854495A (en) * 1986-06-20 1989-08-08 Hitachi, Ltd. Sealing structure, method of soldering and process for preparing sealing structure
US20020050246A1 (en) * 2000-06-09 2002-05-02 Applied Materials, Inc. Full area temperature controlled electrostatic chuck and method of fabricating same
US20080093315A1 (en) * 2004-10-29 2008-04-24 Epicrew Corporation Support for Semiconductor Substrate
US20110005686A1 (en) * 2008-03-11 2011-01-13 Tokyo Electron Limited Loading table structure and processing device
JP2012080103A (ja) * 2010-10-01 2012-04-19 Ngk Insulators Ltd サセプター及びその製法
US20120211933A1 (en) * 2010-09-24 2012-08-23 Ngk Insulators, Ltd. Semiconductor manufacturing apparatus member
WO2012118606A2 (en) * 2011-03-01 2012-09-07 Applied Materials, Inc. Thin heated substrate support

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6583638B2 (en) * 1999-01-26 2003-06-24 Trio-Tech International Temperature-controlled semiconductor wafer chuck system
JP3897563B2 (ja) * 2001-10-24 2007-03-28 日本碍子株式会社 加熱装置
JP4098112B2 (ja) * 2003-02-14 2008-06-11 日本発条株式会社 ヒータユニット
JP4238772B2 (ja) * 2003-05-07 2009-03-18 東京エレクトロン株式会社 載置台構造及び熱処理装置
JP2005166354A (ja) * 2003-12-01 2005-06-23 Ngk Insulators Ltd セラミックヒーター
JP4787568B2 (ja) * 2004-11-16 2011-10-05 日本碍子株式会社 接合剤、窒化アルミニウム接合体及びその製造方法
JP4640842B2 (ja) * 2006-10-11 2011-03-02 日本碍子株式会社 加熱装置
JP5791412B2 (ja) * 2010-07-26 2015-10-07 日本碍子株式会社 セラミックヒーター
JP5855402B2 (ja) * 2010-09-24 2016-02-09 日本碍子株式会社 サセプター及びその製法
US20120211484A1 (en) * 2011-02-23 2012-08-23 Applied Materials, Inc. Methods and apparatus for a multi-zone pedestal heater

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4854495A (en) * 1986-06-20 1989-08-08 Hitachi, Ltd. Sealing structure, method of soldering and process for preparing sealing structure
US20020050246A1 (en) * 2000-06-09 2002-05-02 Applied Materials, Inc. Full area temperature controlled electrostatic chuck and method of fabricating same
US20080093315A1 (en) * 2004-10-29 2008-04-24 Epicrew Corporation Support for Semiconductor Substrate
US20110005686A1 (en) * 2008-03-11 2011-01-13 Tokyo Electron Limited Loading table structure and processing device
US20120211933A1 (en) * 2010-09-24 2012-08-23 Ngk Insulators, Ltd. Semiconductor manufacturing apparatus member
JP2012080103A (ja) * 2010-10-01 2012-04-19 Ngk Insulators Ltd サセプター及びその製法
WO2012118606A2 (en) * 2011-03-01 2012-09-07 Applied Materials, Inc. Thin heated substrate support

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014144502A1 *

Also Published As

Publication number Publication date
KR102171734B1 (ko) 2020-10-29
JP6382295B2 (ja) 2018-08-29
CN105518825A (zh) 2016-04-20
EP2973659A1 (en) 2016-01-20
KR20150132515A (ko) 2015-11-25
TW201506989A (zh) 2015-02-16
JP2016522881A (ja) 2016-08-04
CN105518825B (zh) 2018-02-06
TWI632589B (zh) 2018-08-11
TWM644795U (zh) 2023-08-11

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