EP2871250B1 - Highly heat conductive aluminum alloy for die casting, aluminum alloy die cast product using same, and heatsink using same - Google Patents
Highly heat conductive aluminum alloy for die casting, aluminum alloy die cast product using same, and heatsink using same Download PDFInfo
- Publication number
- EP2871250B1 EP2871250B1 EP12883779.6A EP12883779A EP2871250B1 EP 2871250 B1 EP2871250 B1 EP 2871250B1 EP 12883779 A EP12883779 A EP 12883779A EP 2871250 B1 EP2871250 B1 EP 2871250B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- aluminum alloy
- heat conductivity
- same
- die casting
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000838 Al alloy Inorganic materials 0.000 title claims description 65
- 238000004512 die casting Methods 0.000 title claims description 25
- 229910045601 alloy Inorganic materials 0.000 claims description 21
- 239000000956 alloy Substances 0.000 claims description 21
- 229910052742 iron Inorganic materials 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000012535 impurity Substances 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 28
- 239000010949 copper Substances 0.000 description 18
- 238000005266 casting Methods 0.000 description 17
- 230000017525 heat dissipation Effects 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000011282 treatment Methods 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/12—Alloys based on aluminium with copper as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/12—Alloys based on aluminium with copper as the next major constituent
- C22C21/14—Alloys based on aluminium with copper as the next major constituent with silicon
Definitions
- the present invention relates to an aluminum alloy for die casting, which is used for computers and electronic devices and is optimal as a member requiring heat dissipation characteristic such as housings for housing electronic components, heat-receiving blocks, or heatsinks, and an aluminum alloy die cast product using the alloy.
- a conventional aluminum alloy for die casting such as, for example, ADC12 specified by Japanese Industrial Standards JIS H5302 has a very small heat conductivity of less than half of that of pure aluminum (approximately 250 W/(m ⁇ K)), and cannot satisfy the heat conducting property that is required.
- Patent Literature 1 described below discloses a technology of preparing main components of Si, Mn, Fe, and Mg in a chemical composition of an aluminum alloy to be in a predetermined range.
- an aluminum alloy for pressure casting which has a heat conductivity not lower than 150 W/(m ⁇ K) and can be used as a heat dissipation member instead of pure aluminum, and an aluminum alloy casting product using the same alloy are provided.
- JP 2005-163077A discloses an aluminum alloy containing 0.5 to 2.0% Fe and ⁇ 0.4% Si, and the balance Al with inevitable impurities is subjected to homogenizing treatment at 450 to 580°C, is thereafter subjected to hot rolling, cold rolling, process annealing and final cold rolling, and is subsequently subjected to final annealing at 250 to 400°C to obtain aluminum foil of which thickness is 20 to 60 ⁇ m, and elongation in the directions of 0°, 45° and 90° to the rolling direction is all ⁇ 11%.
- JP H03-100145A discloses an alloy having a composition consisting of, by weight, 0.8-2.0% Fe, ⁇ 0.2% Si, and the balance Al with inevitable impurities is used as a stock.
- This alloy is subjected to DC casting at 35-150mm/min casting rate, and the resulting ingot is heat-treated at 550-630°C for 0.5-24hr. Subsequently, the ingot is rolled to the final plate thickness.
- intermetallic compounds are regulated so that those of ⁇ 5mum size comprise ⁇ 90% and the total content of the intermetallic compounds is regulated to 2.5-7%.; Further, the ratio between intermetallic compounds Al6Fe and Al3Fe is regulated to a value in the range satisfying an inequality.
- heat dissipation members can be mass produced through pressure casting.
- a main object of the invention is to develop a highly heat conductive aluminum alloy for die casting having excellent castability and capable of obtaining a heat conductivity not lower than 170 W/(m ⁇ K) without having heat treatment performed thereon, and an aluminum alloy die cast product using the same alloy.
- a first aspect of the present invention is a highly heat conductive aluminum alloy for die casting, having a feature of "containing Cu by not more than 2.30 wt%, Si by not more than 1.50 wt%, and Fe by 1.20 to 2.60 wt%, a remaining portion thereof being Al and unavoidable impurities.”
- the aluminum alloy of the present invention is to be used mainly as a heat dissipation member, it is important to have not only excellent castability and soldering resistance, but also excellent heat conductivity. Since the contain amount of the main components of Cu, Si, and Fe is in the above described range, the three requirements of castability, soldering resistance, and heat conductivity are satisfied.
- a second aspect of the present invention is an aluminum alloy die cast product obtained through die casting the aluminum alloy according to the first aspect.
- the aluminum alloy die cast product obtained through die casting the aluminum alloy of the first aspect has a heat conductivity of not lower than 170 W/(m ⁇ K) even without having heat treatment performed thereon.
- a third aspect of the present invention is a heatsink obtained through die casting the aluminum alloy according to the first aspect.
- a highly heat conductive aluminum alloy for die casting satisfying the requirement of heat conductivity with a heat conductivity of not lower than 170 W/(m ⁇ K) without compromising castability and soldering resistance at the time of die casting molding, and an aluminum alloy die cast product can be obtained.
- a highly heat conductive aluminum alloy for die casting (hereinafter, also referred to simply as "aluminum alloy” or “alloy”) of the present invention mainly contains Cu (copper) by not more than 2.30 wt%, Si (silicon) by not more than 1.50 wt%, and Fe (iron) by 1.20 to 2.60 wt%, and a remaining portion thereof is Al (aluminum) and unavoidable impurities.
- aluminum alloy mainly contains Cu (copper) by not more than 2.30 wt%, Si (silicon) by not more than 1.50 wt%, and Fe (iron) by 1.20 to 2.60 wt%, and a remaining portion thereof is Al (aluminum) and unavoidable impurities.
- Cu copper
- the content ratio of Cu with respect to the whole aluminum alloy is not more than 2.30 wt%, a heat conductivity of not lower than 170 W/(m ⁇ K) can be obtained.
- Cu is contained by 2.30 wt% at maximum in accordance with the required mechanical characteristics. It should be noted that when strength is not required for the aluminum alloy and heat conductivity is to be prioritized, the content ratio of Cu may be zero.
- Si is an element that improves tensile strength, 0.2%-yield strength, and hardness of an aluminum alloy, and improves fluidity when the aluminum alloy is melted and die-casted, but reduces the heat conductivity of the alloy.
- Si is contained by 1.50 wt% at maximum in accordance with the required mechanical characteristics. It should be noted that when strength is not required for the aluminum alloy and heat conductivity is to be prioritized, the content ratio of Si may be zero.
- Fe has an effect of preventing inferior release caused by soldering during die casting and contraction of a casting article in a mold.
- Fe has to be contained by, with respect to the total weight of the aluminum alloy, not lower than 1.20 wt% and more preferably not lower than 1.40 wt%.
- Fe is an element that reduces the heat conductivity of the alloy.
- the content ratio of Fe with respect to the whole aluminum alloy is not more than 2.60 wt%, a heat conductivity of not lower than 170 W/(m ⁇ K) can be obtained.
- Fe is contained in a range of 1.20 to 2.60 wt% in accordance with the required mechanical characteristics, heat conductivity, or castability.
- the aluminum alloy of the present invention contains, other than each of the main elements described above, Al, which forms a matrix, and unavoidable impurities.
- Al which forms a matrix
- unavoidable impurities although containing a smaller amount of the unavoidable impurities improves heat conductivity, increasing purity by reducing impurities is costly. Thus, it is necessary to accept impurities at a level not compromising the target heat conductivity, and one example of the type and amount of the impurities is Zn by not more than 0.1 wt%, Ti by not more than 0.05 wt%, Pb by not more than 0.06 wt%, Sn by not more than 0.05 wt%, Cr by not more than 0.10 wt%, and Ni by not more than 0.05 wt%.
- a material obtained by blending each of the elemental components of Al, Cu, Si, and Fe in the above described predetermined ratio is prepared.
- the material is added in a melting furnace such as a melting furnace with a fore hearth and a sealed melting furnace to melt the material.
- a melting furnace such as a melting furnace with a fore hearth and a sealed melting furnace to melt the material.
- refinement treatments such as dehydrogenation treatment and inclusion removal treatment are performed if necessary.
- the refined molten metal is poured in a predetermined mold and solidified to mold the molten metal of the aluminum alloy into an alloy base metal ingot.
- Die casting is mainly used when casting an aluminum alloy casting product (casting article) using the aluminum alloy of the present invention.
- the casting article can be efficiently mass produced by using die casting.
- solution treatment and aging treatment are performed if necessary.
- mechanical characteristics of the aluminum alloy casting product can be improved.
- the aluminum alloy die cast product using the alloy of the present invention has a heat conductivity of not lower than 170 W/(m ⁇ K) even without having heat treatment performed thereon, the aluminum alloy die cast product is particularly suitable in usage as a heat dissipation member such as a heatsink.
- heatsink refers to a component that is attached to a mechanical/electrical component that generates heat and whose purpose is to lower the temperature through dissipation of heat, and may take thousand different sizes and shapes depending on the use application.
- die casting was performed using a common die casting machine (DC250JMT manufactured by Toshiba Machine Co., Ltd.) with a clamping force of 250 ton at an injection speed 2.0 m/s and a casting pressure of 80 MPa, and the castability was visually examined.
- ⁇ One that did not present any trouble in castability
- x one that did present trouble in castability was represented as "x.”
- Table 1 shows the elemental composition, the heat conductivity, physical property measurement results, and castability of aluminum alloys, which are the object of the present invention, in Examples 1 to 11 and Comparative Examples 1 to 3.
- Example 1 0.22 0.18 1.49 192 142 16.9 72.3 34.7 ⁇
- Example 2 0.21 0.18 1.99 187 157 15.4 81.4 37.8 ⁇
- Example 3 0.02 0.44 2.07 176 161 16.0 84.1 37.2 ⁇
- Example 5 0.02 1.10 2.06 176 172 13.0 91.4 41.0 ⁇
- Example 6 0.02 1.40 2.05 171 176 11.9 94.7 43.3 ⁇
- Example 7 0.01 0.11 2.50 176
- the aluminum alloy of the present invention is required to have three excellent characteristics of castability, soldering resistance, and heat conductivity as described above.
- heat conductivity as described above, pure aluminum exhibits the best value of approximately 250 W/(m ⁇ K), and heat conductivity is reduced as various elements are added thereto (as in the case of each alloy shown in Table 1).
- FIG. 1 is a graph created based on data in Table 1 and shows the relationship between the heat conductivity and the percentage content of Cu. As shown in this graph, although the heat conductivity of an alloy gradually decreases associated with an increase in the content ratio of Cu with respect to the whole aluminum alloy, a heat conductivity of not lower than 170 W/(m ⁇ K) is maintained up to a content ratio of Cu of about 2.30 wt%. Thus, the heat conductivity can be considered satisfactory when the content ratio of Cu is in a range of not more than 2.30 wt%.
- FIG. 2 is a graph created based on the data in Table 1 and shows the relationship between the heat conductivity and the percentage content of Si. As shown in this graph, although the heat conductivity of an alloy decreases associated with an increase in the content ratio of Si with respect to the whole aluminum alloy, a heat conductivity of not lower than 170 W/(m ⁇ K) is maintained up to a content ratio of Si of about 1.50 wt%. Thus, the heat conductivity can be considered satisfactory when the content ratio of Si is in a range of not more than 1.50 wt%.
- FIG. 3 is a graph created based on the data in Table 1 and shows the relationship between the heat conductivity and the percentage content of Fe. As shown in this graph, although the heat conductivity of an alloy gradually decreases associated with an increase in the content ratio of Fe with respect to the whole aluminum alloy, a heat conductivity of not lower than 170 W/(m ⁇ K) is maintained up to a content ratio of Fe of about 2.60 wt%. Thus, the heat conductivity can be considered satisfactory when the content ratio of Fe is in a range of not more than 2.60 wt%.
Description
- The present invention relates to an aluminum alloy for die casting, which is used for computers and electronic devices and is optimal as a member requiring heat dissipation characteristic such as housings for housing electronic components, heat-receiving blocks, or heatsinks, and an aluminum alloy die cast product using the alloy.
- In an electronic device of the present time, since more heat is generated from the electronic device because of miniaturization, acceleration, and densification thereof, it has become essential to cool electronic components themselves housed in the device in order to sustain the performance of the electronic device. Thus, high heat conductivity is required for heat dissipation members having the electronic components mounted thereon.
- Conventionally, for this type of heat dissipation members such as, for example, a heat dissipation member having a large number of fins disposed on one surface or both surfaces thereof in a protruding manner, extrusion molding articles formed from aluminum alloys for wrought products or pure aluminum having excellent heat conduction (but having very inferior castability) have been used. Although users have been cutting those into required sizes and machining portions thereof corresponding to positions where electronic components are attached, the processing cost increases when the amount to be processed becomes enormous, generating a problem of high cost.
- As a response, the usage of pressure casting technology such as die casting has been discussed for manufacturing the heat dissipation member. However, a conventional aluminum alloy for die casting such as, for example, ADC12 specified by Japanese Industrial Standards JIS H5302 has a very small heat conductivity of less than half of that of pure aluminum (approximately 250 W/(m·K)), and cannot satisfy the heat conducting property that is required.
- As a solution for such problem, Patent Literature 1 described below discloses a technology of preparing main components of Si, Mn, Fe, and Mg in a chemical composition of an aluminum alloy to be in a predetermined range. With this technology, an aluminum alloy for pressure casting, which has a heat conductivity not lower than 150 W/(m·K) and can be used as a heat dissipation member instead of pure aluminum, and an aluminum alloy casting product using the same alloy are provided.
-
WO 2012/036181A1 discloses a material for aluminum alloy molded packages exerting excellent moldability. Specifically provided is a material for molded packages, the material being provided with an aluminum alloy foil which contains 0.8 to 1.7 mass % of Fe, 0.05 to 0.20 mass % of Si, 0.0025 to 0.0200 mass % of Cu, the remainder being Al or unavoidable impurities, and has an average crystal grain diameter of 20 µm or less. Moreover, the material is characterized in that the average value (YS) of the 0.2% proof strength at 0 degrees, 45 degrees and 90 degrees in relation to the rolling direction and the average value (TS) of the maximum tensile strength satisfy YS/TS=0.60. -
JP 2005-163077A -
JP H03-100145A - By using the aluminum alloy for heat casting set forth in Patent Literature 1 described above, heat dissipation members can be mass produced through pressure casting.
- However, in recent years, for heat dissipation members manufactured through pressure casting described above, usage of an alloy having a higher heat conductivity of not lower than 170 W/(m·K) is desired for some parts. When die casting is performed using the alloy set forth in Patent Literature 1 described above, it has been difficult to obtain a heat conductivity not lower than 170 W/(m·K) without having heat treatment performed thereon.
- Thus, a main object of the invention is to develop a highly heat conductive aluminum alloy for die casting having excellent castability and capable of obtaining a heat conductivity not lower than 170 W/(m·K) without having heat treatment performed thereon, and an aluminum alloy die cast product using the same alloy.
- A first aspect of the present invention is a highly heat conductive aluminum alloy for die casting, having a feature of "containing Cu by not more than 2.30 wt%, Si by not more than 1.50 wt%, and Fe by 1.20 to 2.60 wt%, a remaining portion thereof being Al and unavoidable impurities."
- Since the aluminum alloy of the present invention is to be used mainly as a heat dissipation member, it is important to have not only excellent castability and soldering resistance, but also excellent heat conductivity. Since the contain amount of the main components of Cu, Si, and Fe is in the above described range, the three requirements of castability, soldering resistance, and heat conductivity are satisfied.
- Furthermore, a second aspect of the present invention is an aluminum alloy die cast product obtained through die casting the aluminum alloy according to the first aspect.
- The aluminum alloy die cast product obtained through die casting the aluminum alloy of the first aspect has a heat conductivity of not lower than 170 W/(m·K) even without having heat treatment performed thereon.
- Furthermore, a third aspect of the present invention is a heatsink obtained through die casting the aluminum alloy according to the first aspect.
- According to the present invention, since the main components of Cu, Si, and Fe are in required ranges; a highly heat conductive aluminum alloy for die casting satisfying the requirement of heat conductivity with a heat conductivity of not lower than 170 W/(m·K) without compromising castability and soldering resistance at the time of die casting molding, and an aluminum alloy die cast product can be obtained.
-
- [
FIG. 1] FIG. 1 is a graph showing a change in the heat conductivity with respect to the contained amount of Cu in Examples and Comparative Examples of the present invention. - [
FIG. 2] FIG. 2 is a graph showing a change in the heat conductivity with respect to the contained amount of Si in Examples and Comparative Examples of the present invention. - [
FIG. 3] FIG. 3 is a graph showing a change in the heat conductivity with respect to the contained amount of Fe in Examples and Comparative Examples of the present invention. - In the following, embodiments of the present invention will be described in detail by showing specific examples.
- A highly heat conductive aluminum alloy for die casting (hereinafter, also referred to simply as "aluminum alloy" or "alloy") of the present invention mainly contains Cu (copper) by not more than 2.30 wt%, Si (silicon) by not more than 1.50 wt%, and Fe (iron) by 1.20 to 2.60 wt%, and a remaining portion thereof is Al (aluminum) and unavoidable impurities. In the following, characteristics of each of the elements will be described.
- Cu (copper) improves tensile strength, 0.2%-yield strength, and hardness of an aluminum alloy, but slightly reduces the heat conductivity of the alloy. However, when the content ratio of Cu with respect to the whole aluminum alloy is not more than 2.30 wt%, a heat conductivity of not lower than 170 W/(m·K) can be obtained. Thus, in the aluminum alloy of the present invention, Cu is contained by 2.30 wt% at maximum in accordance with the required mechanical characteristics. It should be noted that when strength is not required for the aluminum alloy and heat conductivity is to be prioritized, the content ratio of Cu may be zero.
- Si (silicon) is an element that improves tensile strength, 0.2%-yield strength, and hardness of an aluminum alloy, and improves fluidity when the aluminum alloy is melted and die-casted, but reduces the heat conductivity of the alloy. However, when the content ratio of Si with respect to the whole aluminum alloy is not more than 1.50 wt%, a heat conductivity of not lower than 170 W/(m·K) can be obtained. Thus, in the aluminum alloy of the present invention, Si is contained by 1.50 wt% at maximum in accordance with the required mechanical characteristics. It should be noted that when strength is not required for the aluminum alloy and heat conductivity is to be prioritized, the content ratio of Si may be zero.
- Fe (iron) has an effect of preventing inferior release caused by soldering during die casting and contraction of a casting article in a mold. Thus, in order to die-cast the alloy without any trouble (with fine castability), Fe has to be contained by, with respect to the total weight of the aluminum alloy, not lower than 1.20 wt% and more preferably not lower than 1.40 wt%.
- On the other hand, Fe is an element that reduces the heat conductivity of the alloy. However, when the content ratio of Fe with respect to the whole aluminum alloy is not more than 2.60 wt%, a heat conductivity of not lower than 170 W/(m·K) can be obtained. Thus, in the aluminum alloy of the present invention, Fe is contained in a range of 1.20 to 2.60 wt% in accordance with the required mechanical characteristics, heat conductivity, or castability.
- The aluminum alloy of the present invention contains, other than each of the main elements described above, Al, which forms a matrix, and unavoidable impurities. Among these, although containing a smaller amount of the unavoidable impurities improves heat conductivity, increasing purity by reducing impurities is costly. Thus, it is necessary to accept impurities at a level not compromising the target heat conductivity, and one example of the type and amount of the impurities is Zn by not more than 0.1 wt%, Ti by not more than 0.05 wt%, Pb by not more than 0.06 wt%, Sn by not more than 0.05 wt%, Cr by not more than 0.10 wt%, and Ni by not more than 0.05 wt%.
- When the content ratio of Cu, Si, and Fe is adjusted in accordance with the elemental composition described above, soldering and inferior release between the aluminum alloy and the mold when die casting can be prevented, and an aluminum alloy base metal having excellent heat conductivity can be obtained.
- When producing the aluminum alloy of the present invention, first, a material obtained by blending each of the elemental components of Al, Cu, Si, and Fe in the above described predetermined ratio is prepared. Next, the material is added in a melting furnace such as a melting furnace with a fore hearth and a sealed melting furnace to melt the material. With respect to the melted material, i.e., a molten metal of an aluminum alloy, refinement treatments such as dehydrogenation treatment and inclusion removal treatment are performed if necessary. Then, the refined molten metal is poured in a predetermined mold and solidified to mold the molten metal of the aluminum alloy into an alloy base metal ingot.
- Die casting is mainly used when casting an aluminum alloy casting product (casting article) using the aluminum alloy of the present invention. The casting article can be efficiently mass produced by using die casting.
- With respect to the aluminum alloy casting product (aluminum alloy die cast product) obtained through die casting, solution treatment and aging treatment are performed if necessary. By performing solution treatment and aging treatment on the aluminum alloy casting product, mechanical characteristics of the aluminum alloy casting product can be improved.
- Since the aluminum alloy die cast product using the alloy of the present invention has a heat conductivity of not lower than 170 W/(m·K) even without having heat treatment performed thereon, the aluminum alloy die cast product is particularly suitable in usage as a heat dissipation member such as a heatsink. Here, "heatsink" refers to a component that is attached to a mechanical/electrical component that generates heat and whose purpose is to lower the temperature through dissipation of heat, and may take thousand different sizes and shapes depending on the use application.
- In the following, although the present invention will be described specifically using Examples, the present invention is not limited to the Examples. The mechanical characteristics (tensile strength, stretch, 0.2%-yield strength) in the Examples and the Comparative Examples were each measured using a universal testing machine (AG-IS 100kN) manufactured by Shimadzu Corp. The heat conductivity was measured with a laser flash method using a thermal constant measuring device (TC-7000) manufactured by ULVAC-Riko (Co., Ltd.). Brinell hardness was measured in compliance with JIS Z 2243. Regarding castability, die casting was performed using a common die casting machine (DC250JMT manufactured by Toshiba Machine Co., Ltd.) with a clamping force of 250 ton at an injection speed 2.0 m/s and a casting pressure of 80 MPa, and the castability was visually examined. One that did not present any trouble in castability was represented as "○," and one that did present trouble in castability was represented as "x."
- Table 1 shows the elemental composition, the heat conductivity, physical property measurement results, and castability of aluminum alloys, which are the object of the present invention, in Examples 1 to 11 and Comparative Examples 1 to 3.
[Table 1] Elemental composition (wt%) Heat conductivity W/(m·K) Physical property measurement result Castability Cu Si Fe Tensile strength (MPa) Stretch (%) 0.2%-yield strength (MPa) Brinell hardness (HBW10/500) Example 1 0.22 0.18 1.49 192 142 16.9 72.3 34.7 ○ Example 2 0.21 0.18 1.99 187 157 15.4 81.4 37.8 ○ Example 3 0.02 0.44 2.07 176 161 16.0 84.1 37.2 ○ Example 4 0.02 0.94 2.06 175 165 13.0 89.2 41.3 ○ Example 5 0.02 1.10 2.06 176 172 13.0 91.4 41.0 ○ Example 6 0.02 1.40 2.05 171 176 11.9 94.7 43.3 ○ Example 7 0.01 0.11 2.50 176 159 16.6 89.7 36.7 ○ Example 8 0.78 0.11 2.02 181 173 15.4 83.3 41.3 ○ Example 9 1.12 0.11 2.03 186 181 13.0 82.3 43.3 ○ Example 10 1.50 0.11 2.02 174 192 14.3 85.6 43.9 ○ Example 11 2.25 0.11 2.02 170 210 13.1 91.9 48.9 ○ Comparative Example 1 0.03 0.18 1.07 194 122 20.1 63.3 29.1 × Comparative Example 2 0.23 0.18 1.05 198 131 17.3 67.5 31.1 × Comparative Example 3 0.02 1.96 2.05 158 190 11.9 97.0 46.1 ○ - The aluminum alloy of the present invention is required to have three excellent characteristics of castability, soldering resistance, and heat conductivity as described above. Regarding heat conductivity, as described above, pure aluminum exhibits the best value of approximately 250 W/(m·K), and heat conductivity is reduced as various elements are added thereto (as in the case of each alloy shown in Table 1).
-
FIG. 1 is a graph created based on data in Table 1 and shows the relationship between the heat conductivity and the percentage content of Cu. As shown in this graph, although the heat conductivity of an alloy gradually decreases associated with an increase in the content ratio of Cu with respect to the whole aluminum alloy, a heat conductivity of not lower than 170 W/(m·K) is maintained up to a content ratio of Cu of about 2.30 wt%. Thus, the heat conductivity can be considered satisfactory when the content ratio of Cu is in a range of not more than 2.30 wt%. -
FIG. 2 is a graph created based on the data in Table 1 and shows the relationship between the heat conductivity and the percentage content of Si. As shown in this graph, although the heat conductivity of an alloy decreases associated with an increase in the content ratio of Si with respect to the whole aluminum alloy, a heat conductivity of not lower than 170 W/(m·K) is maintained up to a content ratio of Si of about 1.50 wt%. Thus, the heat conductivity can be considered satisfactory when the content ratio of Si is in a range of not more than 1.50 wt%. -
FIG. 3 is a graph created based on the data in Table 1 and shows the relationship between the heat conductivity and the percentage content of Fe. As shown in this graph, although the heat conductivity of an alloy gradually decreases associated with an increase in the content ratio of Fe with respect to the whole aluminum alloy, a heat conductivity of not lower than 170 W/(m·K) is maintained up to a content ratio of Fe of about 2.60 wt%. Thus, the heat conductivity can be considered satisfactory when the content ratio of Fe is in a range of not more than 2.60 wt%. - However, regarding Fe, as shown in Comparative Examples 1 and 2 in Table 1, when the content ratio of Fe with respect to the whole aluminum alloy was less than 1.20 wt%, a problem related to castability had occurred. Specifically, when opening a mold of the die casting machine, the casted aluminum alloy die cast product was adhered to the mold and could not be removed. Such a phenomenon is speculated to be caused by contraction of the aluminum alloy die cast product due to insufficient Fe.
- Thus, when considering both heat conductivity and castability of an alloy, a range of 1.20 to 2.60 wt% can be considered suitable for the content ratio of Fe with respect to the whole aluminum alloy.
Claims (2)
- An aluminum alloy die cast product obtained through die casting a highly heat conductive aluminum alloy for die casting, the alloy comprising Cu by not more than 2.30 wt%, Si by not more than 1.50 wt%, and Fe by 1.20 to 2.60 wt%, the remaining portion thereof being Al and unavoidable impurities.
- A heatsink obtained through die casting a highly heat conductive aluminum alloy for die casting, the alloy comprising Cu by not more than 2.30 wt%, Si by not more than 1.50 wt%, and Fe by 1.20 to 2.60 wt%, the remaining portion thereof being Al and unavoidable impurities.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL12883779T PL2871250T3 (en) | 2012-08-31 | 2012-08-31 | Highly heat conductive aluminum alloy for die casting, aluminum alloy die cast product using same, and heatsink using same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/005531 WO2014033791A1 (en) | 2012-08-31 | 2012-08-31 | Highly heat conductive aluminum alloy for die casting, aluminum alloy die cast product using same, and heatsink using same |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2871250A1 EP2871250A1 (en) | 2015-05-13 |
EP2871250A4 EP2871250A4 (en) | 2015-10-14 |
EP2871250B1 true EP2871250B1 (en) | 2016-07-20 |
Family
ID=49396876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12883779.6A Active EP2871250B1 (en) | 2012-08-31 | 2012-08-31 | Highly heat conductive aluminum alloy for die casting, aluminum alloy die cast product using same, and heatsink using same |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP2871250B1 (en) |
JP (1) | JP5301750B1 (en) |
KR (1) | KR101924319B1 (en) |
CN (1) | CN104619871B (en) |
PH (1) | PH12015500207B1 (en) |
PL (1) | PL2871250T3 (en) |
WO (1) | WO2014033791A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101910015B1 (en) | 2017-02-06 | 2018-10-19 | (주)엠티에이 | Iron-copper alloy having high thermal conductivity and method for manufacturing the same |
CN109234552B (en) * | 2018-09-05 | 2021-06-18 | 上海工程技术大学 | Method for preparing high-Cu-content Al-Cu alloy through solidification under pressure |
KR20180113487A (en) | 2018-10-08 | 2018-10-16 | (주)엠티에이 | Iron-copper alloy having high thermal conductivity and method for manufacturing the same |
CN110016594B (en) * | 2019-05-07 | 2020-09-22 | 广西国瑞稀钪新材料科技有限公司 | Die-casting rare earth aluminum alloy material with high thermal conductivity and preparation method thereof |
KR102273220B1 (en) * | 2019-12-10 | 2021-07-05 | 김준수 | Aluminum alloy for enamel coating and method for manufacturing die casted aluminum alloy frying pan |
RU2752489C1 (en) | 2020-12-26 | 2021-07-28 | Общество с ограниченной ответственностью "Институт легких материалов и технологий" | Powder material with high thermal conductivity |
KR102578486B1 (en) | 2021-11-09 | 2023-09-14 | (주)엠티에이 | Iron-copper alloy having network structure and method for manufacturing the same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5853702B2 (en) * | 1980-05-26 | 1983-11-30 | 株式会社 日本軽金属総合研究所 | Aluminum alloy for tough die casting |
JPS572857A (en) * | 1980-06-09 | 1982-01-08 | Ryobi Ltd | Aluminum alloy for die casting |
JPH0739622B2 (en) * | 1989-09-14 | 1995-05-01 | スカイアルミニウム株式会社 | Method for producing aluminum alloy plate having white color tone after anodizing treatment |
JP4562296B2 (en) * | 2001-01-31 | 2010-10-13 | 三菱樹脂株式会社 | Aluminum alloy material for heat sinks with excellent thermal conductivity |
JP2005163077A (en) * | 2003-12-01 | 2005-06-23 | Mitsubishi Alum Co Ltd | High formability aluminum foil for packaging material, and production method therefor |
JP5233607B2 (en) * | 2008-11-19 | 2013-07-10 | 日本軽金属株式会社 | Aluminum alloy plate excellent in formability and method for producing the same |
JP5841537B2 (en) * | 2010-09-16 | 2016-01-13 | 株式会社Uacj | Molded packaging material |
CN102011036A (en) * | 2010-11-24 | 2011-04-13 | 肇庆莱尔达光电科技有限公司 | Die casting aluminum alloy |
-
2012
- 2012-08-31 JP JP2013514266A patent/JP5301750B1/en active Active
- 2012-08-31 PL PL12883779T patent/PL2871250T3/en unknown
- 2012-08-31 KR KR1020157002646A patent/KR101924319B1/en active IP Right Grant
- 2012-08-31 WO PCT/JP2012/005531 patent/WO2014033791A1/en active Application Filing
- 2012-08-31 EP EP12883779.6A patent/EP2871250B1/en active Active
- 2012-08-31 CN CN201280075573.XA patent/CN104619871B/en active Active
-
2015
- 2015-01-30 PH PH12015500207A patent/PH12015500207B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR20150046014A (en) | 2015-04-29 |
JP5301750B1 (en) | 2013-09-25 |
WO2014033791A1 (en) | 2014-03-06 |
KR101924319B1 (en) | 2018-12-03 |
JPWO2014033791A1 (en) | 2016-08-08 |
EP2871250A4 (en) | 2015-10-14 |
EP2871250A1 (en) | 2015-05-13 |
CN104619871B (en) | 2016-12-14 |
CN104619871A (en) | 2015-05-13 |
PH12015500207A1 (en) | 2015-03-16 |
PH12015500207B1 (en) | 2015-03-16 |
PL2871250T3 (en) | 2017-01-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2871250B1 (en) | Highly heat conductive aluminum alloy for die casting, aluminum alloy die cast product using same, and heatsink using same | |
EP1803829B1 (en) | Copper alloy plate for electric and electronic parts having bendability | |
EP3392358B1 (en) | Low-cost high-heat-conduction die-casting magnesium alloy and manufacturing method therefor | |
KR101211984B1 (en) | Cu-ni-si-based alloy for electronic material | |
WO2020122230A1 (en) | Pure copper sheet, member for electronic/electric device, and member for heat dissipation | |
US10508329B2 (en) | Aluminum alloy material for use in thermal conduction application | |
CN108885067B (en) | Method for manufacturing steam cavity | |
JP2002180159A (en) | Copper alloy containing silver | |
KR20160042906A (en) | Copper alloy for electronic/electrical devices, copper alloy thin plate for electronic/electrical devices, component for electronic/electrical devices, terminal and bus bar | |
US20140305551A1 (en) | Copper alloy material for electrical and electronic components and method of preparing the same | |
CN104264017A (en) | High-thermal-conductivity die casting aluminum alloy and preparation method thereof | |
WO2016152648A1 (en) | Copper alloy sheet for heat dissipating component and heat dissipating component | |
KR101426708B1 (en) | Al-Fe-Zn-Si ALLOY HAVING HIGH THERMAL CONDUCTIVITY FOR DIE CASTING | |
KR101203437B1 (en) | High-strength high-electroconductivity copper alloy possessing excellent hot workability | |
EP2067869B1 (en) | Precision alloy | |
JP6837542B2 (en) | Copper alloy plate material with excellent heat resistance and heat dissipation | |
KR102599762B1 (en) | Die casting aluminium alloy with high electrical conductivity and manufacturing method for aluminium alloy casting using the same, and aluminium alloy casting manufactured therefrom | |
JP5688744B2 (en) | High strength and high toughness copper alloy forging | |
JP3951921B2 (en) | Manufacturing method of aluminum alloy processed material of 58.1IACS% or more | |
KR20160001634A (en) | Copper alloy material, method for producing copper alloy material, lead frames and connectors | |
JP5068481B2 (en) | Copper alloy and manufacturing method thereof | |
JP2012167347A (en) | High-rigidity copper alloy forged material | |
JP4750602B2 (en) | Copper alloy with excellent hot workability | |
KR19980033710A (en) | Manufacturing method of copper alloy semiconductor lead frame material with high strength high electroconductivity | |
KR20110125928A (en) | Copper alloy with improved strength and electrical conductivity and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20150204 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
RA4 | Supplementary search report drawn up and despatched (corrected) |
Effective date: 20150910 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C22C 21/00 20060101AFI20150904BHEP Ipc: C22C 21/12 20060101ALI20150904BHEP Ipc: C22C 21/14 20060101ALI20150904BHEP |
|
DAX | Request for extension of the european patent (deleted) | ||
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C22C 21/14 20060101ALI20160311BHEP Ipc: C22C 21/00 20060101AFI20160311BHEP Ipc: C22C 21/12 20060101ALI20160311BHEP |
|
INTG | Intention to grant announced |
Effective date: 20160406 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: REF Ref document number: 814170 Country of ref document: AT Kind code of ref document: T Effective date: 20160815 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 602012020887 Country of ref document: DE |
|
REG | Reference to a national code |
Ref country code: LT Ref legal event code: MG4D |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: MP Effective date: 20160720 |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: MK05 Ref document number: 814170 Country of ref document: AT Kind code of ref document: T Effective date: 20160720 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160831 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161020 Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161120 Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161021 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161121 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: BE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 602012020887 Country of ref document: DE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160831 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160831 Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST Effective date: 20170428 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20161020 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: MM4A |
|
26N | No opposition filed |
Effective date: 20170421 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20161020 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160920 Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20161020 Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160831 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160831 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20120831 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160831 Ref country code: MK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160720 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: PL Payment date: 20230831 Year of fee payment: 12 Ref country code: DE Payment date: 20230817 Year of fee payment: 12 |