JP4562296B2 - Aluminum alloy material for heat sinks with excellent thermal conductivity - Google Patents
Aluminum alloy material for heat sinks with excellent thermal conductivity Download PDFInfo
- Publication number
- JP4562296B2 JP4562296B2 JP2001024827A JP2001024827A JP4562296B2 JP 4562296 B2 JP4562296 B2 JP 4562296B2 JP 2001024827 A JP2001024827 A JP 2001024827A JP 2001024827 A JP2001024827 A JP 2001024827A JP 4562296 B2 JP4562296 B2 JP 4562296B2
- Authority
- JP
- Japan
- Prior art keywords
- thermal conductivity
- aluminum alloy
- alloy material
- alloy
- conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、熱伝導性および強度に優れたアルミニウム合金材に関するものであり、詳しくは半導体等電子デバイスの放熱部品であるヒートシンクの材料として利用するのに有用なアルミニウム合金材に関するものである。
【0002】
【従来の技術】
アルミニウム合金は、軽量であると同時に電気伝導性及び熱伝導性に優れているので、その特性に基づき種々の分野で使用されている。近年、電子機器の高性能化は進み、半導体等電子デバイスの放熱部品であるヒートシンクには高い放熱効率が求められている。
ヒートシンクは主にダイカストによって製造され、合金種としては、ダイカスト用JIS合金のADC1あるいはADC12等が一般に使用されている。しかし、これらの合金は、熱伝導性が悪く、特に高い放熱効率が求められるヒートシンク用の材料としては不十分である。
一方、添加金属量を減じた純Alに近い組成の合金の場合、熱伝導性については満足できるが、強度が弱く、変形の問題が生じる。特に、近年のヒートシンクは、高性能小型化し、フィン部も薄肉化しているため適用できない。
【0003】
【発明が解決しようとする課題】
本発明の目的は、特に高い放熱性が求められるヒートシンクにおいて、その熱伝導性を維持しつつ、且つ強度も優れたヒートシンク用アルミニウム合金材を提供することにある。
ここで、特に高い熱伝導性とは、熱伝導率で200W/m・℃以上を意味し、これは導電率では54IACS%以上に相当する。
【0004】
【課題を解決するための手段】
本発明者らは、特に高い放熱性が求められるヒートシンク用の合金材において、熱伝導性を損なわずに強度を高めることを目的としてアルミニウム合金に添加される元素について種々検討した結果、所定量のFe、Ni、Bを添加した合金が有用であることを見出し本発明に達した。
即ち、本発明の要旨は、Fe 0.65〜1.25wt%、Ni 0.30〜0.65wt%、B 0.002〜0.08wt%を含有し、且つFe及びNiの総量が1.00〜1.85wt%であり、残部アルミニウムおよび不可避不純物からなるアルミニウム合金材であって、導電率が54IACS%以上およびブリネル硬度値が30以上であることを特徴とするヒートシンク用アルミニウム合金材及び該ヒートシンク用アルミニウム合金材を用いて製造されるヒートシンクに存する。
【0005】
【発明の実施の形態】
本発明のアルミニウム合金材は、ダイカストによって製造されるヒートシンクの中で、特に高い放熱特性を要求されるヒートシンクの製造を目的としたものである。即ち、この合金材は、熱伝導性として、導電率で54IACS%以上(熱伝導率で200W/m・℃以上に相当)、好ましくは54〜58IACS%であること、および変形に対する強度としてブリネル硬度で30以上、好ましくは30〜35であることの確保を目的としたものである。
尚、熱伝導率と導電率は比例関係にあり、一般に熱伝導性の評価法として、導電率がその指標として用いられるので、以下本発明においても導電率の測定値を熱伝導性の指標として用い説明する。
【0006】
本発明のアルミニウム合金材に添加されるFe及びNiは、両元素を同時に所定量加えることにより、導電率を大きく低下させること無く合金の強度を高めることができるのである。
Feの添加量は、0.65〜1.25wt%、好ましくは0.75〜1.15wt%の範囲で適宜選定する。また、Ni添加量は、0.30〜0.65wt%、好ましくは0.35〜0.60wt%の範囲で適宜選定する。更に、FeとNiを合わせた総添加量を1.00〜1.85wt%、好ましくは1.10〜1.75wt%の範囲で適宜選定する。これら添加量の下限未満ではブリネル硬度値30を下回り、他方上限を超えると導電率が54IACS%を下回り、いずれも好ましくない。
【0007】
また、Feの添加はダイカストの際、金型と合金材の焼付きを防止する効果があり、Fe/Ni(元素比)の添加量バランスをとるのが望ましい。その添加量比率は、Fe/Ni 1.2〜3.0、好ましくは1.5〜2.5とするのが望ましい。
【0008】
本発明の合金材に添加されるBは、その添加によりAl−Fe−Ni系合金の導電率を向上させる効果がある。その添加量は0.002〜0.08wt%、好ましくは0.005〜0.03wt%の範囲で適宜選定される。添加量が0.002wt%未満では熱伝導性向上効果は十分達成されず、他方0.08wt%を超えるとBが過剰となり、逆に熱伝導性向上の効果を減じる。
【0009】
本発明のアルミニウム合金は、上記合金成分の他、不可避的不純物を含有するが、必要に応じ他の特性改善、例えば、耐蝕性改善等のために添加される成分を、本発明合金が必須とする上記の導電率及びブリネル硬度の特性を損なわない範囲で含んでいても良い。そのような成分としては、例えば、Si、Cu、Mg、Zn、Co、Mn、Zr、Cr、Ti、Sn、In、Ca、Sr、Na等が挙げられるが、これらの成分は過剰に添加すると熱伝導性を低下させるおそれがあるので、Coについては0.30wt%以下、Co以外の元素については0.1wt%以下とすることが必要である。
【0010】
本発明のアルミニウム合金は、従来のダイカスト用JIS合金よりも遙かに高い熱伝導性を有しており、且つ強度も良好であるため、特に高い放熱特性を要求されるヒートシンクの材料として使用することができる。
【0011】
【実施例】
以下に、本発明を実施例により更に詳細に説明するが、本発明はその要旨を超えない限り以下の実施例により制限されるものではない。
尚、以下の実施例において熱伝導性の評価は、熱伝導性が導電率に比例する関係にあることから、合金の導電率(IACS%)を測定し評価した。
【0012】
実施例及び比較例
下記表1に示した各組成の合金をダイカストによって鋳造し、鋳塊の導電率及びブリネル硬度を測定し評価した。その結果を表1に併記する。なお、合金調製用のアルミニウムとしては純度99.8wt%のものを用いた。
表1に示す通り、本発明例の合金は、Fe及びNi添加量範囲において、導電率54IACS%以上、且つブリネル硬度値30以上が達成されている。また、Al−Fe−Ni系合金において、本発明に規定する導電率及びブリネル硬度値を有する合金(No.11)であっても、所定範囲のBを添加することにより、同一組成の合金の導電率を無添加の場合に比べ、より高めることが出来ることを示している。
又、従来のダイカスト用合金(ADC1:合金No.15)及び(ADC12:合金No.16)では、本発明例に比較して導電率が著しく低い。更に、純Alでは足りない強度を上げるために、例えばSi添加量を調節しても、導電率と硬度を同時に発明例の合金が達する程度にすることはできない。
【0013】
【表1】
【0014】
【発明の効果】
本発明のアルミニウム合金を利用することで、熱伝導性が極めて高く、且つ強度の良好なヒートシンクを提供することができるので、工業的価値は極めて大きい。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an aluminum alloy material excellent in thermal conductivity and strength, and more particularly to an aluminum alloy material useful for use as a heat sink material which is a heat dissipation component of an electronic device such as a semiconductor.
[0002]
[Prior art]
Aluminum alloys are lightweight and have excellent electrical and thermal conductivity, and are used in various fields based on their properties. In recent years, the performance of electronic devices has been improved, and high heat dissipation efficiency is required for heat sinks that are heat dissipation components of electronic devices such as semiconductors.
The heat sink is mainly manufactured by die casting, and as the alloy type, ADC1 or ADC12 of JIS alloy for die casting is generally used. However, these alloys have poor thermal conductivity, and are insufficient as materials for heat sinks that require particularly high heat dissipation efficiency.
On the other hand, in the case of an alloy having a composition close to pure Al with a reduced amount of added metal, the thermal conductivity is satisfactory, but the strength is weak and a problem of deformation occurs. In particular, recent heat sinks cannot be applied because they have a high performance and a small size and a thin fin portion.
[0003]
[Problems to be solved by the invention]
An object of the present invention is to provide an aluminum alloy material for a heat sink that is excellent in strength while maintaining its thermal conductivity in a heat sink that requires particularly high heat dissipation.
Here, particularly high thermal conductivity means 200 W / m · ° C. or more in terms of thermal conductivity, which corresponds to 54 IACS% or more in terms of conductivity.
[0004]
[Means for Solving the Problems]
The inventors of the present invention have studied various elements added to an aluminum alloy for the purpose of increasing the strength without impairing the thermal conductivity in an alloy material for a heat sink that requires particularly high heat dissipation. The inventors have found that an alloy to which Fe, Ni, and B are added is useful and reached the present invention.
That is, the gist of the present invention includes Fe 0.65 to 1.25 wt%, Ni 0.30 to 0.65 wt%, B 0.002 to 0.08 wt%, and the total amount of Fe and Ni is 1. Aluminum alloy material for heat sink, characterized in that it is 00 to 1.85 wt%, and is an aluminum alloy material comprising the balance aluminum and inevitable impurities, having an electrical conductivity of 54 IACS% or more and a Brinell hardness value of 30 or more, It exists in the heat sink manufactured using the aluminum alloy material for heat sinks.
[0005]
DETAILED DESCRIPTION OF THE INVENTION
The aluminum alloy material of the present invention is intended to manufacture a heat sink that requires particularly high heat dissipation characteristics among heat sinks manufactured by die casting. That is, this alloy material has a thermal conductivity of 54 IACS% or more (corresponding to a thermal conductivity of 200 W / m · ° C. or more), preferably 54 to 58 IACS%, and Brinell hardness as a strength against deformation. It is intended to ensure that it is 30 or more, preferably 30 to 35.
Note that thermal conductivity and electrical conductivity are in a proportional relationship, and generally, as an evaluation method for thermal conductivity, electrical conductivity is used as an index thereof. Therefore, in the present invention, the measured value of electrical conductivity is also used as an index of thermal conductivity. Use and explain.
[0006]
Fe and Ni added to the aluminum alloy material of the present invention can increase the strength of the alloy without greatly reducing the conductivity by adding both elements simultaneously in a predetermined amount.
The addition amount of Fe is appropriately selected in the range of 0.65 to 1.25 wt%, preferably 0.75 to 1.15 wt%. Further, the amount of Ni added is appropriately selected in the range of 0.30 to 0.65 wt%, preferably 0.35 to 0.60 wt%. Further, the total addition amount of Fe and Ni is appropriately selected in the range of 1.00 to 1.85 wt%, preferably 1.10 to 1.75 wt%. If the amount is less than the lower limit of the addition amount, the Brinell hardness value is less than 30, and if the other upper limit is exceeded, the conductivity is less than 54 IACS%, which is not preferable.
[0007]
Further, the addition of Fe has an effect of preventing seizure of the mold and the alloy material during die casting, and it is desirable to balance the addition amount of Fe / Ni (element ratio). The addition amount ratio is Fe / Ni 1.2 to 3.0, preferably 1.5 to 2.5.
[0008]
B added to the alloy material of the present invention has an effect of improving the electrical conductivity of the Al—Fe—Ni-based alloy. The addition amount is appropriately selected in the range of 0.002 to 0.08 wt%, preferably 0.005 to 0.03 wt%. If the addition amount is less than 0.002 wt%, the effect of improving the thermal conductivity is not sufficiently achieved. On the other hand, if it exceeds 0.08 wt%, B becomes excessive, and conversely the effect of improving the thermal conductivity is reduced.
[0009]
The aluminum alloy of the present invention contains unavoidable impurities in addition to the above alloy components, but the present alloy is indispensable as a component added for other characteristics improvement, for example, corrosion resistance improvement as necessary. The above-described conductivity and Brinell hardness characteristics may be included within a range that does not deteriorate. Examples of such components include Si, Cu, Mg, Zn, Co, Mn, Zr, Cr, Ti, Sn, In, Ca, Sr, and Na. If these components are added in excess, Since there is a possibility that the thermal conductivity is lowered, it is necessary to set the Co content to 0.30 wt% or less and the elements other than Co to 0.1 wt% or less.
[0010]
The aluminum alloy of the present invention has a thermal conductivity far higher than that of a conventional JIS alloy for die casting, and has a good strength. Therefore, the aluminum alloy is used as a heat sink material that requires particularly high heat dissipation characteristics. be able to.
[0011]
【Example】
EXAMPLES The present invention will be described in more detail with reference to the following examples. However, the present invention is not limited to the following examples unless it exceeds the gist.
In the following examples, the thermal conductivity was evaluated by measuring the electrical conductivity (IACS%) of the alloy because the thermal conductivity is proportional to the electrical conductivity.
[0012]
Examples and Comparative Examples Alloys having the respective compositions shown in Table 1 below were cast by die casting, and the conductivity and Brinell hardness of the ingot were measured and evaluated. The results are also shown in Table 1. The aluminum used for preparing the alloy was 99.8 wt% in purity.
As shown in Table 1, the alloy of the present invention has an electrical conductivity of 54 IACS% or more and a Brinell hardness value of 30 or more in the Fe and Ni addition amount range. Moreover, even if it is an alloy (No. 11) which has the electrical conductivity and Brinell hardness value which prescribe | regulate in this invention in an Al-Fe-Ni type-alloy, by adding B of a predetermined range, It shows that the conductivity can be further increased as compared with the case of no addition.
Further, conventional alloys for die casting (ADC1: alloy No. 15) and (ADC12: alloy No. 16) have remarkably low electrical conductivity compared to the examples of the present invention. Furthermore, in order to increase the strength that is not sufficient with pure Al, even if, for example, the amount of Si added is adjusted, the conductivity and hardness cannot be made to the extent that the alloy of the invention can reach at the same time.
[0013]
[Table 1]
[0014]
【The invention's effect】
By utilizing the aluminum alloy of the present invention, it is possible to provide a heat sink with extremely high thermal conductivity and good strength, and therefore the industrial value is extremely large.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001024827A JP4562296B2 (en) | 2001-01-31 | 2001-01-31 | Aluminum alloy material for heat sinks with excellent thermal conductivity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001024827A JP4562296B2 (en) | 2001-01-31 | 2001-01-31 | Aluminum alloy material for heat sinks with excellent thermal conductivity |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002226931A JP2002226931A (en) | 2002-08-14 |
JP4562296B2 true JP4562296B2 (en) | 2010-10-13 |
Family
ID=18889917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001024827A Expired - Fee Related JP4562296B2 (en) | 2001-01-31 | 2001-01-31 | Aluminum alloy material for heat sinks with excellent thermal conductivity |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4562296B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101924319B1 (en) * | 2012-08-31 | 2018-12-03 | 가부시키가이샤 다이키 알루미늄 코교쇼 | Highly heat conductive aluminum alloy for die casting, aluminum alloy die cast product using same, and heatsink using same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06228693A (en) * | 1992-08-05 | 1994-08-16 | Furukawa Alum Co Ltd | High heat conductive aluminum alloy fin material |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6462432A (en) * | 1987-09-02 | 1989-03-08 | Furukawa Aluminium | Aluminum alloy for heat exchanger member |
-
2001
- 2001-01-31 JP JP2001024827A patent/JP4562296B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06228693A (en) * | 1992-08-05 | 1994-08-16 | Furukawa Alum Co Ltd | High heat conductive aluminum alloy fin material |
Also Published As
Publication number | Publication date |
---|---|
JP2002226931A (en) | 2002-08-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5853057B2 (en) | Highly conductive copper-based alloy | |
JP4413106B2 (en) | Aluminum alloy material for heat sink and manufacturing method thereof | |
WO2017135463A1 (en) | Aluminum alloy for casting, aluminum alloy member and method for producing aluminum alloy member | |
JP4328927B2 (en) | Aluminum alloy material with excellent electrical and thermal conductivity | |
JP2002105571A (en) | Aluminum alloy material for heat sink, having excellent thermal conductivity | |
JP5301750B1 (en) | High heat conductive aluminum alloy for die casting, aluminum alloy die casting using the same, and heat sink using the alloy | |
JP4191370B2 (en) | High heat conduction pressure casting alloy and alloy casting | |
JP4210020B2 (en) | Aluminum alloy material for heat sinks with excellent thermal conductivity | |
KR101502340B1 (en) | Aluminum alloy for casting having high thermal conductivity | |
KR101468957B1 (en) | Aluminum alloy for casting | |
JPS6365039A (en) | Copper alloy for electronic and electrical equipment | |
JP4562296B2 (en) | Aluminum alloy material for heat sinks with excellent thermal conductivity | |
JP4487615B2 (en) | Method for producing cast aluminum alloy material with excellent thermal conductivity | |
JP2002226932A (en) | Aluminum alloy for heat sink having excellent strength and thermal conductivity and production method therefor | |
JP3772718B2 (en) | Cast aluminum alloy with excellent thermal conductivity | |
JP2023527566A (en) | aluminum-silicon-iron casting alloy | |
JPS60152646A (en) | Material for lead frame for semiconductor | |
JP2002348626A (en) | Aluminum alloy material for die casting | |
JP3636027B2 (en) | Aluminum alloy casting with excellent thermal conductivity | |
JPH07216485A (en) | Aluminum alloy fin material | |
KR101502341B1 (en) | Aluminum alloy for permanent mould casting having high thermal conductivity | |
JPH10298679A (en) | High strength and high conductivity copper alloy | |
JP3779830B2 (en) | Copper alloy for semiconductor lead frames | |
JP3636731B2 (en) | Cu-Ni-Si alloy | |
JP2003119536A (en) | Aluminum alloy for casting superior in thermal conductivity |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080123 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20080123 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20090528 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100713 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100727 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100727 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130806 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4562296 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |