EP2871250A4 - Highly heat conductive aluminum alloy for die casting, aluminum alloy die cast product using same, and heatsink using same - Google Patents
Highly heat conductive aluminum alloy for die casting, aluminum alloy die cast product using same, and heatsink using sameInfo
- Publication number
- EP2871250A4 EP2871250A4 EP12883779.6A EP12883779A EP2871250A4 EP 2871250 A4 EP2871250 A4 EP 2871250A4 EP 12883779 A EP12883779 A EP 12883779A EP 2871250 A4 EP2871250 A4 EP 2871250A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- same
- aluminum alloy
- heatsink
- heat conductive
- cast product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000838 Al alloy Inorganic materials 0.000 title 2
- 238000004512 die casting Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/12—Alloys based on aluminium with copper as the next major constituent
- C22C21/14—Alloys based on aluminium with copper as the next major constituent with silicon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/02—Alloys based on aluminium with silicon as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/12—Alloys based on aluminium with copper as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL12883779T PL2871250T3 (en) | 2012-08-31 | 2012-08-31 | Highly heat conductive aluminum alloy for die casting, aluminum alloy die cast product using same, and heatsink using same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/005531 WO2014033791A1 (en) | 2012-08-31 | 2012-08-31 | Highly heat conductive aluminum alloy for die casting, aluminum alloy die cast product using same, and heatsink using same |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2871250A1 EP2871250A1 (en) | 2015-05-13 |
EP2871250A4 true EP2871250A4 (en) | 2015-10-14 |
EP2871250B1 EP2871250B1 (en) | 2016-07-20 |
Family
ID=49396876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12883779.6A Active EP2871250B1 (en) | 2012-08-31 | 2012-08-31 | Highly heat conductive aluminum alloy for die casting, aluminum alloy die cast product using same, and heatsink using same |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP2871250B1 (en) |
JP (1) | JP5301750B1 (en) |
KR (1) | KR101924319B1 (en) |
CN (1) | CN104619871B (en) |
PH (1) | PH12015500207A1 (en) |
PL (1) | PL2871250T3 (en) |
WO (1) | WO2014033791A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101910015B1 (en) | 2017-02-06 | 2018-10-19 | (주)엠티에이 | Iron-copper alloy having high thermal conductivity and method for manufacturing the same |
CN109234552B (en) * | 2018-09-05 | 2021-06-18 | 上海工程技术大学 | Method for preparing high-Cu-content Al-Cu alloy through solidification under pressure |
KR20180113487A (en) | 2018-10-08 | 2018-10-16 | (주)엠티에이 | Iron-copper alloy having high thermal conductivity and method for manufacturing the same |
CN110016594B (en) * | 2019-05-07 | 2020-09-22 | 广西国瑞稀钪新材料科技有限公司 | Die-casting rare earth aluminum alloy material with high thermal conductivity and preparation method thereof |
KR102273220B1 (en) * | 2019-12-10 | 2021-07-05 | 김준수 | Aluminum alloy for enamel coating and method for manufacturing die casted aluminum alloy frying pan |
RU2752489C1 (en) | 2020-12-26 | 2021-07-28 | Общество с ограниченной ответственностью "Институт легких материалов и технологий" | Powder material with high thermal conductivity |
KR102578486B1 (en) | 2021-11-09 | 2023-09-14 | (주)엠티에이 | Iron-copper alloy having network structure and method for manufacturing the same |
CN118460889A (en) * | 2024-07-09 | 2024-08-09 | 广州致远新材料科技有限公司 | Preparation method of aluminum-iron-copper high-heat-conductivity die-casting aluminum alloy material |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03100145A (en) * | 1989-09-14 | 1991-04-25 | Sky Alum Co Ltd | Production of aluminum alloy plate having white color tone after anodic oxidation treatment |
JP2005163077A (en) * | 2003-12-01 | 2005-06-23 | Mitsubishi Alum Co Ltd | High formability aluminum foil for packaging material, and production method therefor |
WO2012036181A1 (en) * | 2010-09-16 | 2012-03-22 | 古河スカイ株式会社 | Material for molded packages |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5853702B2 (en) * | 1980-05-26 | 1983-11-30 | 株式会社 日本軽金属総合研究所 | Aluminum alloy for tough die casting |
JPS572857A (en) * | 1980-06-09 | 1982-01-08 | Ryobi Ltd | Aluminum alloy for die casting |
JP4562296B2 (en) * | 2001-01-31 | 2010-10-13 | 三菱樹脂株式会社 | Aluminum alloy material for heat sinks with excellent thermal conductivity |
JP5233607B2 (en) * | 2008-11-19 | 2013-07-10 | 日本軽金属株式会社 | Aluminum alloy plate excellent in formability and method for producing the same |
CN102011036A (en) * | 2010-11-24 | 2011-04-13 | 肇庆莱尔达光电科技有限公司 | Die casting aluminum alloy |
-
2012
- 2012-08-31 JP JP2013514266A patent/JP5301750B1/en active Active
- 2012-08-31 CN CN201280075573.XA patent/CN104619871B/en active Active
- 2012-08-31 PL PL12883779T patent/PL2871250T3/en unknown
- 2012-08-31 WO PCT/JP2012/005531 patent/WO2014033791A1/en active Application Filing
- 2012-08-31 EP EP12883779.6A patent/EP2871250B1/en active Active
- 2012-08-31 KR KR1020157002646A patent/KR101924319B1/en active IP Right Grant
-
2015
- 2015-01-30 PH PH12015500207A patent/PH12015500207A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03100145A (en) * | 1989-09-14 | 1991-04-25 | Sky Alum Co Ltd | Production of aluminum alloy plate having white color tone after anodic oxidation treatment |
JP2005163077A (en) * | 2003-12-01 | 2005-06-23 | Mitsubishi Alum Co Ltd | High formability aluminum foil for packaging material, and production method therefor |
WO2012036181A1 (en) * | 2010-09-16 | 2012-03-22 | 古河スカイ株式会社 | Material for molded packages |
Non-Patent Citations (1)
Title |
---|
See also references of WO2014033791A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP2871250B1 (en) | 2016-07-20 |
PH12015500207B1 (en) | 2015-03-16 |
CN104619871B (en) | 2016-12-14 |
PL2871250T3 (en) | 2017-01-31 |
JP5301750B1 (en) | 2013-09-25 |
KR20150046014A (en) | 2015-04-29 |
KR101924319B1 (en) | 2018-12-03 |
CN104619871A (en) | 2015-05-13 |
JPWO2014033791A1 (en) | 2016-08-08 |
EP2871250A1 (en) | 2015-05-13 |
PH12015500207A1 (en) | 2015-03-16 |
WO2014033791A1 (en) | 2014-03-06 |
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