EP2864133B2 - Method for transferring a decorative section of an embossing foil - Google Patents

Description

The invention relates to a method for transferring a decorative section of an embossing film to a substrate.

When applying embossing foils which have strongly crosslinking lacquer systems in the lacquer package, for example UV-crosslinking lacquer systems and / or lacquer systems with a high layer thickness, i. H. If the transfer layer contains a thickness greater than 5 µm without a carrier film, it is not possible to produce a clean separating edge during the embossing. In these cases, the separation of the film composite does not take place at the edge of the application tool, but in an undefined position. The strong cross-linking leads to the formation of comparatively long or very long polymer chains in the paints, which influences the physical properties of the paints accordingly. Depending on the hardness of a strongly cross-linked lacquer, for example, a comparatively hard and brittle lacquer can break undefined during embossing, whereby lacquer flakes of different sizes can arise as undesirable impurities. A comparatively soft and elastic lacquer, for example, cannot or only incompletely break or tear in an undefined manner during embossing, so that in the worst case there is no separating edge at all. Normally, with embossing of this type, stray residues of the transfer layer designed as a lacquer package, the aforementioned so-called flakes, form, which in the further processing of the embossed substrate lead to the contamination of the machines and thus to increased cleaning effort. In extreme cases, these flakes can significantly increase production rejects.

the CH 678835 A5 describes a layer composite with diffraction structures, from which marks can be removed that can be applied to security documents. The marks are punched out of the layer composite without damaging the carrier layer of the layer composite. The parts of the layer composite that are not required are peeled off before the marks are applied to the security document. The mechanical stability of the layer composite is thus only determined by the carrier layer. The carrier layer formed with the punched out marks is rolled onto a supply roll before further processing.

the DE 198 13 314 A1 describes an embossing foil in which decorative sections, so-called patches, which are completely separate from one another are arranged on a carrier film and which can be transferred to a substrate in accordance with the procedure customary in the processing of embossing foils. The formation of the free spaces between the patches is provided by laser radiation, which removes the decorative layer of the embossing foil around the embossing area.

the DE 10 2007 005 416 A1 describes an embossing film and a security sticker formed therewith, a diffractive first relief structure being formed by molding (embossing or replicating) in a replication layer. In this molding of the diffractive first relief structure, a second relief structure is simultaneously molded, outside the area that is to be embossed later, the second relief structure being provided in the form of a line-shaped notch or a series of such notches that essentially correspond to an outline of the security sticker follows and has a notch depth which is more than half the layer thickness of the plastic and / or lacquer layer into which the molding or replication takes place.

The disadvantage here is that extremely deep structures produced during replication harbor the risk that the carrier around the lacquer package is already weakened during production.

The object of the present invention is to provide an improved method which combines the advantages of a stable embossing film with the clean separation of the decorative sections from the carrier film.

According to the invention, this object is achieved with the subject matter of claim 1.

The object is also achieved with the subject matter of claim 2.

The methods according to the invention have the advantage that it is possible, with little outlay on equipment, to provide at least one predetermined breaking point in the transfer layer of the embossing film for detaching the decorative section from the transfer layer. This enables the hot embossing of embossing foils with strongly crosslinking lacquer systems and / or with lacquer layers of high layer thickness with the clean separation of the decorative sections from the carrier foil. The remaining embossing foil is peeled off, that is, the carrier foil with the parts of the transfer layer that do not belong to the decorative section and were not embossed on the substrate, i.e. H. the parts of the transfer layer that are still adhering to the carrier film are detached.

Furthermore, embossing foils in which an adhesive layer is applied either to the substrate or to the outside of a transfer layer to be transferred to the substrate, in particular partially in the form of a desired decoration or decoration section, and by means of suitable drying or curing, e.g. by means of UV curing, for transferring the Transfer layer from the carrier film to the substrate are advantageously processed, with a clean separation of the decorative sections given by the adhesive and the residual embossing film.

The proposed punching of linear notches can be used well in a roll-to-roll manufacturing process. The transfer layer is neither thermally nor chemically stressed by the punching. The environment is not polluted by pollutant emissions that can occur, for example, during laser cutting. In particular, these can be combustion products of the transfer layer, e.g. B. gases like CO ₂ , HCl, NO _X.

The line-shaped notches reduce the thickness of the transfer layer in a locally limited manner and act as breaking notches or predetermined breaking points that create high mechanical stresses in the material of the transfer layer, so that the transfer layer breaks easily in the notch area.

It can be advantageous to design the predetermined breaking point as a linear, pointed notch. The flank angle can be in the range from 20 ° to 90 °. A flank angle of approximately 60 ° is preferred.

Further advantageous designs are specified in the subclaims.

It is possible that in method step b) open notches are punched into the transfer layer, which notches extend between opposite edges of the embossing foil and enclose the decorative section. Open notches are understood here to mean notches which are not self-contained, i.e. H. have one or more starting and / or end points. Alternatively, it can be provided that in method step b) more than one notch is punched in, the more than one notch forming a punching area. The formation of several notches primarily increases the manufacturing reliability, so that the incorrect formation of a notch does not jeopardize the result of the separation.

It has been proven that 2 to 40 notches are made within the punching area.

In preferred embodiments it can be provided that 3 to 4 notches are made within the punching area.

It can further be provided that adjacent notches have a constant spacing. Alternatively, it can also be provided that adjacent notches have a varying spacing. For example, the distance between two adjacent notches can increase outwards starting from a central notch, i. H. the notches directly adjacent to the middle notch are at a certain distance from this and further, subsequent notches are at a greater distance from these notches.

Alternatively, it can be provided that the distance between two adjacent notches is reduced towards the outside starting from a central notch, i. H. the notches directly adjacent to the middle notch are at a certain distance from this and further, subsequent notches are at a smaller distance from these notches.

Alternatively, it can also be provided that the distance between adjacent notches has any desired values, that is, no symmetry is sufficient, as described above.

The punching area can have a width of 0.5 to 2.5 mm, preferably a width of 2 mm. With a register accuracy of ± 1 mm, it is ensured that the decorative section is punched in with accurate register.

It can further be provided that the notches completely cut through the transfer layer, but end before the surface of the carrier film facing the transfer layer.

However, it can also be provided that the notches cut through the transfer layer between 20% and 100%. This ensures that the carrier film is not damaged, so that the carrier film has its full strength even after punching. It has been shown that the intended residue-free separation occurs when the notches cut through the transfer layer by at least 20% in depth.

It can be provided that, after method step c) or after method step e), the punched transfer layer is broken at the moment of detachment or shortly after or before.

Fig. 1

ein erstes Ausführungsbeispiel der Prägefolie in schematischer Schnittdarstellung;

Fig. 2

ein zweites Ausführungsbeispiel der Prägefolie in schematischer Schnittdarstellung;

Fig. 3

Ausführungsbeispiele von geschlossenen Stanzformen;

Fig. 4a

eine Ausführungsbeispiel einer vorgestanzten Prägefolie mit einer Stanzform aus Fig. 3 in der Draufsicht;

Fig. 4b

eine Schnittdarstellung der Prägefolie längs der Schnittlinie IVb-IVb in Fig. 4a;

Fig. 5a

Ausführungsbeispiele von offenen Stanzformen;

Fig. 5b

eine Ausführungsbeispiel einer vorgestanzten Prägefolie mit linienförmiger Stanzform aus Fig. 5a in der Draufsicht

Fig. 6

eine erstes Ausführungsbeispiel einer Stanz- und Prägeeinrichtung zur Durchführung des erfindungsgemäßen Verfahrens;

Fig. 7

ein zweites Ausführungsbeispiel einer Stanz- und Prägeeinrichtung zur Durchführung des erfindungsgemäßen Verfahrens.

Fig. 8

ein zweites Ausführungsbeispiel der Prägefolie in schematischer Schnittdarstellung;

Fig.9

eine zweites Ausführungsbeispiel einer Stanz- und Prägeeinrichtung zur Durchführung des erfindungsgemäßen Verfahrens.

The invention will now be explained in more detail on the basis of exemplary embodiments. Show it

Fig. 1

a first embodiment of the embossing foil in a schematic sectional view;

Fig. 2

a second embodiment of the embossing foil in a schematic sectional view;

Fig. 3

Embodiments of closed cutting dies;

Figure 4a

an embodiment of a pre-cut stamping foil with a cutting die Fig. 3 in plan view;

Figure 4b

a sectional view of the embossing foil along the section line IVb-IVb in Figure 4a ;

Figure 5a

Embodiments of open cutting dies;

Figure 5b

an embodiment of a pre-cut stamping foil with a line-shaped cutting form Figure 5a in top view

Fig. 6

a first embodiment of a punching and embossing device for performing the method according to the invention;

Fig. 7

a second embodiment of a punching and embossing device for carrying out the method according to the invention.

Fig. 8

a second embodiment of the embossing foil in a schematic sectional view;

Fig. 9

a second embodiment of a punching and embossing device for performing the method according to the invention.

Fig. 1 shows a section of an embossing foil 1 which can be used in the roll-to-roll process, with a carrier foil 11 and a transfer layer 13, between which a release layer 12 is arranged. An adhesive layer 14 is arranged on the transfer layer 13, which can be, for example, a hot-melt adhesive layer that can be thermally activated or a cold adhesive layer that can be activated by means of high-energy radiation.

The transfer layer 13 is a lacquer package made of one or more highly crosslinked lacquers, for example from a UV-crosslinked lacquer and optionally from further layers, such as further lacquer layers and / or metallic layers and / or a transfer layer with high Layer thickness, ie with a layer thickness greater than 5 µm, in particular greater than 10 µm. Hard and brittle transfer layers can form unclean and / or imprecise separating edges during embossing. With embossings of this type, stray remnants of the transfer layer are often formed, so-called flakes, which in the further processing of the embossed substrate lead to contamination of the machines and thus to increased cleaning effort. To avoid unclean and / or imprecise separating edges, linear, pointed notches 15 with a V-shaped cross-section are made in the embossing film 1 from the side of the adhesive layer 14 by means of punching, the depth of which is selected so that the notches 15 on the surface facing the transfer layer 13 the carrier film 11 ends. The flank angle in the in Fig. 1 illustrated embodiment about 60 °. The carrier film 11 is therefore not damaged by the punching process and has its full strength in all areas. These notches act as predetermined breaking points for the transfer layer because high stresses are formed in the notched material in the notch area.

In the in Fig. 1 The illustrated embodiment, two line-shaped notches 15 are arranged side by side, which form a punching area 15s. The punching area 15s can preferably have a width of 0.5 to 2.5 mm. The punching area 15s delimits a decorative section 16 formed in the transfer layer 13 and in the adhesive layer 14 Bank note, credit card or the like is applied. In Fig. 1 a border line 16s delimiting the decor section 16 is drawn in, the punching area 15s lying outside of the decor section 16. The boundary line 16s can be found in the in Fig. 1 The embodiment shown may be an outer edge of a decoration, for example an OVD, as for example also below in FIG Figure 4a shown. The boundary line 16s delimits the decorative section 16 from the rest of the transfer layer 13, this remaining transfer layer 13 adjacent to the decorative section 16 being able to be transparent or translucent, for example. However, if the embossing foil 1 has an alternative and, for example, below in FIG Figure 5b shown, an endless design without a defined outer edge or outer border of a decoration or decoration section 16, then a border line 16s is not or only partially present. In the case of such an endless decoration, the punching area 15s can lie within the decor sections 16, which were not exactly delimited before the punching, and / or the decor sections 16 within the endless design are only defined by making the notches 15 in a punching area 15s.

Fig. 2 shows the embossing foil 1 from Fig. 1 with a modified formation of the notches 15. In the in Fig. 2 In the illustrated embodiment, six linear notches 15 are provided, which protrude only about 20% into the transfer layer 13. The linear notches 15 form as in the above in Fig. 1 described embodiment the punching area 15s. In the in Fig. 2 The embodiment shown, the two outer notches 15a are exemplarily spaced from one another, the four inner notches 15b are formed without a spacing between adjacent notches. The two outer notches and the four inner notches each form a group with the same arrangement. In addition to the arrangement of the notches 15, the number of notches 15 in the punching area 15s can also be varied. Preferably between 2 and 40 adjacent notches 15 are provided, the width of the punching area 15s preferably being approximately 2 mm. Despite the compared to Fig. 1 If the notches 15 are shortened or less deep, they act as predetermined breaking points, so that due to the high stresses occurring in the notched material of the transfer layer, the transfer layer breaks completely under bending loads.

It is also possible to vary the depth and / or the flank angle of the notches arranged in the punching area 15s.

Fig. 3 shows exemplary embodiments of closed stamping forms, ie of stamping forms which form closed, linear notches 15. As the examples show, very different shapes can be formed, so that the design of the decorative sections 16 to be transferred is almost not subject to any restrictions.

the Figures 4a and 4b show, using the example of a star-shaped decorative section 16, the formation of the line-shaped notches 15 and the punching area 15s.

The punching area 15s surrounds the decorative section 16 at a constant distance. There are three evenly spaced linear notches 15 around the decorative section 16 with a circumference growing from the inside to the outside. Around a common center that coincides with the center of the star-shaped decorative section 16, three punchings with increasing circumference are provided, the distances between the punchings as in FIG Figures 4a and 4b shown can be constant or also vary. The punchings are in Register, ie precisely positioned to the decor section 16. With a register fluctuation of ± 1 mm and a punching area 15s with a width of 2 mm, the transfer layer 13 is punched three times, so that the decor section 16 is completely and dimensionally accurate from the transfer layer 13 and from the Adhesive layer 14 is separated. Figure 4a shows an example of the application of a decorative section 16 of a transfer layer 13 and an adhesive layer 14 in the form of a so-called patch or label on a substrate.

the Figure 5a shows exemplary embodiments of open punching forms, the decorative section being delimited in each case by at least two spaced apart linear notches or punching areas. Assuming that the decorative section to be embossed takes up the entire width of the embossing foil, two linear notches or punched areas are necessary in order to emboss the decorative section. Each of the punching areas can include, for example, 2 to 40 linear notches.

Figure 5b shows, using the example of a strip-shaped, endless embossing film 1 for processing from roll to roll, the formation of the linear notches 15 and the punching area 15s. A transfer layer 13 extends on the embossing foil 1 and is intended to be embossed on different, individual substrates 23 in sections, ie divided into separate decorative areas 16. The punched areas 15s are arranged between the individual decorative areas 16, in each of which 3 linear notches 15 are provided in this exemplary embodiment shown. The punched areas 15s are each arranged in register, that is, they are positioned precisely in relation to a decorative area 16 formed by the transfer layer 13 and the adhesive layer 14.

1. a) Bereitstellen der Prägefolie;
2. b) Einstanzen mindestens einer vom Rand des Dekorabschnitts beabstandeten linienförmigen Kerbe in die Übertragungslage und die Kleberschicht;
3. c) Prägen des Dekorabschnitts auf das Substrat;
4. d) Ablösen der Restprägefolie von dem mit dem Dekorabschnitt beprägten Substrat.

the Fig. 6 shows a first embodiment of a punching and embossing device 2 for carrying out the method according to the invention, which comprises the following steps:

1. a) providing the embossing foil;
2. b) punching at least one linear notch spaced from the edge of the decorative section into the transfer layer and the adhesive layer;
3. c) embossing the decorative section on the substrate;
4. d) Detachment of the remaining embossing film from the substrate embossed with the decorative section.

The embossing foil 1 is provided on an unwinding roll 21 and is then fed into a punching station formed from a round punch 22 and an impression cylinder 22 '. In the punching station, the line-shaped notches 15 described above are punched into the transfer layer 13 and the adhesive layer 14 of the stamping foil 1 in such a way that the decorative sections 16 formed in the stamping foil 1 are surrounded by the line-shaped notches 15 in register. The stamping foil 1 is now guided over a first deflection roller 27, which is operated at the same time as a pressure roller and presses the stamping foil 1 onto a substrate 23 to be stamped. The embossing foil 1 brought together with the substrate 23 is now guided through an embossing station which comprises a heated embossing cylinder 24 and two second deflection rollers 27, which at the same time ensure the necessary pressure of the substrate 23 on the embossing cylinder 24. The embossing foil 1 arranged on the substrate 23 faces the surface of the embossing cylinder 24. The second deflection rollers 27 are arranged in such a way that the embossing cylinder 24 is approximately half wrapped around by the embossing foil 1 and the substrate 23. In the embossing station, the prepunched decorative sections 16 are registered by, i.e. H. Position-controlled action of the embossing area of the embossing cylinder 24 is transferred to the substrate 23 with the aid of pressure and heat. The embossing cylinder 24 can be completely or only partially heated on its circumference and / or have embossing zones, not shown in detail, with which the decorative sections 16 are transferred to the substrate 23 by means of pressure and heat. The embossing zones can roughly match the decor sections 16 in terms of size and / or contour. A substrate 25 with applied decorative sections 16 is thus formed, the decorative sections 16, as described above, being surrounded by punched areas in which the transfer layer 13 and / or the adhesive layer 14 breaks easily. The breaking of the punched transfer layer can take place at the moment of detachment or shortly after or before.

Immediately behind the embossing station, a residual embossing film 1r is peeled off the substrate 25 with the applied decorative sections and wound onto a take-up roll 26. The remaining embossing film 1r has at least the carrier film 11 and the areas of the transfer layer 13 with the adhesive layer 14 that were not transferred to the substrate 23.

The accurate register punching of the notches 15 is facilitated by the fact that the round punch 22 and the embossing cylinder 24 are synchronized in their sequence by means of gear technology coupling, possibly with additional fine control.

In an exemplary embodiment not shown in detail, the round punch 22 is replaced by a movable knife or by a lifting punch. The knife or the lifting punch are controlled by a sensor that detects a register mark on the embossing foil and is preferably arranged immediately after the unwinding roller 21 and in front of the knife or the lifting punch, so that the knife or the lifting punch is punched in accordance with this register mark on the foil in accordance with accurate register can produce a decor or existing decor sections on the stamping foil. The sensor that detects the register mark on the film can also control the embossing cylinder 24 with precise register in order to also control the embossing cylinder 24 with precise register, that is to say with precise or position-controlled relation to the decor sections on the embossing film and thus the punchings.

Fig. 7 shows a second embodiment of a Punching and embossing device 2 for carrying out the method according to the invention, the embossing device like that in Fig. 6 The punching and embossing device shown is constructed, with the difference that a linearly movable embossing die 24 'is provided so that the substrate 23 is not deflected in the punching and embossing device 2. In the Fig. 7 The punching and embossing device 2 shown is therefore particularly suitable for embossing relatively rigid substrates, for example for embossing credit or identity cards.

As an alternative to the one in the Figures 6 and 7 In the inline variant shown, in which the punching device and embossing device are arranged directly one after the other in a continuous roll-to-roll process, it is also possible to decouple the embossing device and the punching device procedurally and operate them offline. For example, it is possible that a separate punching device, spatially separated from the embossing device, introduces punching areas 15s into the embossing foil by means of the round punch, lifting punch or knife described above and then this pre-cut embossing foil 1 in a separate operation of an embossing device for embossing the decorative sections 16 is fed onto a substrate 23. Between the two operations, the stamping foil can be rolled up, assembled, ie cut to length and / or width and transported, since the register accuracy between the stamping foil and the substrate can be adjusted again during the stamping process using the register marks provided on the stamping foil.

1. a) Bereitstellen der Prägefolie;
2. b) Einstanzen mindestens einer vom Rand des Dekorabschnitts beabstandeten linienförmigen Kerbe in die Übertragungslage;
3. c) Aufbringen eines Klebers auf das Substrat oder Aufbringen des Klebers auf die Prägefolie,
4. d) Zusammenführen von Prägefolie und Substrat,
5. e) Aushärten oder Trocknen des Klebers,
6. f) Ablösen der Restprägefolie von dem mit dem Dekorabschnitt beprägten Substrat.

Fig. 9 shows a punching and embossing device 3 for carrying out a cold embossing process, which comprises the following steps:

1. a) providing the embossing foil;
2. b) punching at least one linear notch spaced from the edge of the decorative section into the transfer layer;
3. c) applying an adhesive to the substrate or applying the adhesive to the embossing foil,
4. d) bringing together the stamping foil and substrate,
5. e) curing or drying of the adhesive,
6. f) Detachment of the remaining embossing film from the substrate embossed with the decorative section.

The embossing foil 1 is provided on an unwinding roll 21 and is then fed into a punching station formed from a round punch 22 and an impression cylinder 22 '. In the punching station, the above-described linear notches 15 are punched into the transfer layer 13 of the transfer film 1 in such a way that the decorative sections 16 formed in the embossing film 1 are surrounded by the linear notches 15 in precise register. In an adhesive applicator 31, an adhesive, in particular partially in the form of decorative sections, is applied, for example, printed or sprayed, to a substrate 23. As an alternative and not shown, the adhesive can also be applied to the outside of the transfer layer of the embossing foil 1 facing the substrate. The transfer film 1 is now guided over a first deflection roller 27, which is operated at the same time as a pressure roller and presses the transfer film 1 onto the substrate 23 to be embossed. The embossing foil 1 brought together with the substrate 23 and resting on the adhesive is now passed through a drying station 32. Partial or complete drying and / or curing of the adhesive is provided there, for example by means of heat and / or UV exposure. A substrate 25 is thus formed with decorative sections applied and firmly adhering to substrate 23 by means of the cured adhesive, the decorative sections, as described above, being surrounded by punched areas in which the transfer layer breaks easily. The breaking of the punched transfer layer can take place at the moment of detachment or shortly after or before.

Immediately after the drying station 32, a residual embossing film 1r is peeled off the substrate 25 with the applied decorative sections and wound up on a take-up roll 26. The remaining embossing foil 1r has at least the carrier foil 11 and the areas of the transfer layer 13 that were not transferred to the substrate 23.

The accurate register punching of the notches 15 is facilitated by the fact that the round punch 22 and the adhesive applicator 31 are synchronized in their sequence by means of gear technology and / or electronic coupling, possibly with additional fine control.

In an exemplary embodiment not shown, the round punch 22 is replaced by a movable knife or by a lifting punch. The knife or the lift punch are controlled by a sensor that detects a register mark on the transfer film, which is preferably arranged immediately after the unwinding roll 21 and in front of the knife or the lift punch, so that the knife or the lift punch can produce precisely registered punchings on the film according to this register mark . The sensor that detects the register mark on the film can also control the adhesive applicator 31 with accurate register.

List of reference symbols

1

Embossing foil

1r

Remaining stamping foil

2

Punching and embossing device (hot embossing)

3

Punching and embossing device (cold embossing)

11th

Carrier film

12th

Release layer

13th

Transfer situation

14th

Adhesive layer

15th

linear notch

15a

Notches spaced apart

15 b

Notches without spacing from each other

15s

Punching area

16

Decor section

16s

Border line of the decor section

21

Unwinding roll

22nd

Round punch

22 '

Impression cylinder

23

Substrate

24

Embossing cylinder

24 '

Embossing stamp

25th

Substrate with applied decor section

26th

Take-up roll

27

Pulley

31

Glue applicator

32

Drying station

1. 1. LEONHARD KURZ Foundation & Co. KG, Schwabacher Str. 482, 90763 Fürth, Germany
2. 2. OVD Kinegram AG, Meterweg 12, 6301 Zug, Switzerland
3. 3. KBA-NotaSys SA, Avenue du Gray 55, 1018 Lausanne 22, Switzerland

Claims (10)

1. Method for transferring a decorative portion (16) of an embossing film (1) onto a substrate (23) by means of an embossing roller (24) or an embossing stamp (24'), wherein the embossing film (1) comprises a carrier film (11) and a transfer sheet (13) arranged on the carrier film (11),
   wherein the method comprises the following steps:

   a) providing the embossing film (1);

   b) stamping at least one notch (15) into the transfer sheet (13), said notch being spaced apart from the edge of the decorative portion (16) by no more than 2mm and formed as a linear notch;

   c) embossing the decorative portion (16) onto the substrate (23);

   d) detaching the remaining embossing film (1r) from the substrate (25) embossed with the decorative portion (16), wherein
   in method step b), open notches (15) are stamped into the transfer sheet (13) which are extended between opposite edges of the embossing film (1) and enclose the decorative portion (16), and wherein the notches (15) have an average width of 0.05mm to 0.5mm, or wherein, in method step b), more than one notch (15) is stamped, wherein the more than one notch (15) form a stamping region (15s), and wherein the notches (15) have an average width of 0.05mm to 0.5mm.
2. Method for transferring a decorative portion (16) of an embossing film (1) onto a substrate (23), wherein the embossing film (1) has a carrier film (11) and a transfer sheet (13) arranged on the carrier film (11),
   wherein the method comprises the following steps:

   a) providing the embossing film (1);

   b) stamping at least one notch (15) into the transfer sheet (13), said notch being spaced apart from the edge of the decorative portion (16) by no more than 2mm and formed as a linear notch;

   c) applying an adhesive to the substrate (23) or applying the adhesive to the embossing film (1),

   d) bringing together embossing film and substrate,

   e) curing or drying the adhesive,

   f) detaching the remaining embossing film from the substrate (25) embossed with the decorative portion (16), wherein, in method step b), open notches (15) are stamped into the transfer layer (13) which are extended between opposite edges of the embossing film (1) and enclose the decorative portion (16), and wherein the notches (15) have an average width of 0.05mm to 0.5mm, or wherein, in method step b), more than one notch (15) is stamped, wherein the more than one notch (15) form a stamping region (15s), and wherein the notches (15) have an average width of 0.05mm to 0.5mm.
3. Method according to claim 1 or 2,
   characterised in that
   2 to 40 notches (15) are introduced within the stamping region (15s).
4. Method according to claim 3,
   characterised in that
   3 to 4 notches (15) are introduced within the stamping region (15s).
5. Method according to claim 3 or 4,
   characterised in that
   adjacent notches (15) have a constant distance.
6. Method according to one of the preceding claims,
   characterised in that
   the stamping region (15s) has a width of 0.5 to 2.5mm.
7. Method according to one of the preceding claims,
   characterised in that
   the notches (15) cut through the transfer sheet (13) between 20% and 100%.
8. Method according to one of the preceding claims,
   characterised in that
   the notches (15) cut through the transfer sheet (13) fully, but end before the surface of the carrier film (11), said surface facing the transfer sheet (13).
9. Method according to claim 1,
   characterised in that
   after method step c), the breaking of the punched transfer sheet is provided at the moment of detachment or shortly afterwards or shortly before.
10. Method according to claim 2,
    characterised in that
    after method step e), the breaking of the punched transfer sheet is provided at the moment of detachment or shortly afterwards or shortly before.

Images