The invention relates to a security element transfer material having a
Security element layer composite comprising a variety of layers
and a temporary carrier associated with the
Security element layer composite is detachably connected, for transmission
of security elements on a valuable asset, such as a security paper,
a value document or a branded article, for authenticity assurance
of the object of value. The invention also relates to methods
for making the security element transfer material, method
for transmitting a security element from the security element transfer material
a valuable asset, and valuables that are being used
of the security element transfer material against counterfeiting
Valuables, such as branded goods or documents of value, in particular banknotes, are often provided with security elements which allow verification of the authenticity of the object of value and at the same time serve as protection against unauthorized reproduction. Frequently, the security elements used for this purpose are not provided individually, but in the form of transfer belts with a plurality of security elements designed as transfer elements. Characteristic of transfer belts is that the security elements are prepared on a carrier layer, wherein the order of the layers of the transfer elements must be reversed, as it should be present later on the object to be protected. The carrier layer is typically removed from the layer structure of the security elements during transfer. On the opposite side of the carrier layer, the transfer tapes have an adhesive layer, usually of a heat-sealing adhesive, which melts during the transfer of the security elements and glued the security elements with the object to be secured. The transfer tape is placed on the object with the heat-sealable adhesive layer and pressed by means of a heated transfer punch or a transfer roller and transferred to the object in the contour of the heated transfer punch. Transfer elements, transfer ribbons and the transfer of transfer elements to target substrates are for example in EP 0 420 261 B1
and WO 2005/108108 A2
the shaping of the transfer elements by the transfer punch during the transfer process
The individual transfer elements can already be up
prefabricated to the transfer ribbon in the desired outline shape
available. The prefabrication of separate individual security elements is
especially useful if the security elements have a layer structure
have an exact cut through the entire layer construction during
makes the transfer process difficult. This is usually then
the case when the layer structure of the security element to be transmitted
a carrier substrate, for example a plastic film,
contains. Carrier substrates within the layer structure
Security items are required when the security items
need to be made very stable, for example, if
they have to be self-supporting because they are closing
a through opening in the object to be secured
should be used. Depending on the item and size
the opening to be closed can
high demands on the stability of the security elements
be put. For example, banknotes are during
are exposed to high loads during their orbit, are tapped,
Kinked and possibly exposed to wet. The security elements
must be able to withstand these stresses as well
like the banknote paper itself, otherwise there would be a risk
that after a certain orbital period the through opening
is exposed in the banknote.
Security elements whose layer construction comprises a stable carrier substrate, typically a plastic film, must be present on a transfer material as prefabricated individual elements, which means that the outline shapes of the security elements in the security element material must be precut beforehand. The pre-cutting can be carried out for example by means of a laser. This results in the problem that the cutting depth must be controlled very precisely, on the one hand to cut through the entire layer structure of the security element, on the other hand, the carrier material that is separated during the transfer, not to hurt. As support materials usually plastic films are used. Although plastic films have a high tear resistance, but a low tear resistance. When they are cut, it is almost unavoidable that the security element transfer material in the form of continuous material tears on valuables in some places during the transfer process of the security elements. It must also be taken into account that the layer structures to be cut or the carrier sheets which are not to be cut are materials with thicknesses in the micrometer range. The security element laminates typically have thicknesses in the range of about 20 μm to 30 μm, and the carrier foils typically have thicknesses in the range of 10 μm to 20 μm. With the precision required here, it is almost impossible to carry out a cutting process in such a way that, although the security element layer composite is completely severed, the cutting process is stopped in such a timely manner that the carrier foil is not cut anywhere becomes. Due to the partially cut support film, however, the security element transfer material loses stability, may even rupture, which is why accurate and smooth application of the security elements from the endless material to the products to be protected is no longer guaranteed.
It is therefore the object of the present invention to overcome the disadvantages of the prior art
avoid the technique and a security element transfer material in
Provide shape of a continuous material in the security elements
pre-cut in the desired outline shapes, and the
precut elements then without risk of tearing
of the carrier material to be secured to products
In particular, it is the object of the present invention to provide such a security element transfer material
in the form of a continuous material, wherein the security element layer composite
a carrier substrate comprising the security elements
gives sufficient stability to them as covering over
through openings in valuables suitable too
Task is solved by the security element transfer material
according to the main claim. Other items
of the invention are methods of making the security element transfer material,
Method for transmitting a security element
the security element transfer material on a valuable object, and
a valuable item made using the security element transfer material
secured with a security element, as in the sibling
Claims are given. Special embodiments
The invention are defined in the respective dependent claims
Security element transfer material according to the invention
is typically a continuous material, usually a band with several
a hundred meters in length and a width of a few
Millimeters / centimeters up to several meters. The security element transfer material
has a security element layer composite, i. H. the real thing
Security element material, and a temporary carrier,
d. H. the material on which the security elements are "stored",
The security element laminate has a plurality of layers, including a permanent support substrate, typically a plastic film, a feature layer, and a peek layer. The term "one (one, one, one)" in the present invention is to be understood as "at least one". If necessary, the security element layer composite can therefore also contain a plurality of permanent carrier substrates and / or a plurality of feature layers. The security element layer network usually contains several feature layers. A feature layer (or functional layer) is a layer that has visually detectable or machine detectable features. Examples which may be mentioned are metal layers, layers of metallic effect paints, layers with color pigments or fluorescent pigments, liquid crystal layers, coatings with a color shift effect, layers with matt structures, as described, for example, in US Pat WO 2007/107235 A1
Colored printed motif layers, layer combinations such as a color-shaded layer with a color shift effect, layers with magnetic pigments, etc. are not disclosed. The materials, layer sequences and types of application are not limited in any way and basically all materials and methods are applicable a person skilled in the field of security elements are known. The term "permanent" carrier substrate expresses that this carrier substrate is not removed during the transfer of the security element on an object to be secured, but rather is part of the security element layer composite and is transferred to the object to be secured. Since the security elements are to be used preferably for covering continuous openings, wherein the presence of an opening should remain recognizable, it is preferred to use transparent or translucent permanent carrier substrates. For example, films of polyester, such as polyethylene terephthalate, of polyethylene or polypropylene are suitable. Under the Blickschicht is to be understood the layer, which faces after the transmission of a security element on a valuable object to a viewer. The viewing layer may be identical to a feature layer or the permanent carrier substrate.
suitable layer structure for the security element layer composite
is merely exemplary and in no way limiting,
that of the so-called L-LEAD (Longlasting Economical Anticopy
Device) security elements of Giesecke & Devrient GmbH. Such security elements
have a layer structure with numerous functional layers
(Feature layers), including with a z. Holographic
Security feature, pressure-receiving, protective and laminating layers, layers of paint,
fluorescent imprints, etc. The L-LEAD security elements
also have a permanent carrier substrate.
The security element laminate is connected to a temporary support either directly or by means of a release layer. The release layer is conventional and he facilitates the detachment of the security elements from the temporary carrier during the transfer process to a valuable item. The temporary support is located on the side of the security element layer composite facing an observer after the transmission of the security elements.
the security element transfer material according to the invention
the temporary carrier consists of a carrier layer composite.
The carrier layer composite consists of at least two temporary carrier substrates,
which are firmly connected by means of an adhesive layer. The term "temporary" carrier substrates
expresses that these carrier substrates in contrast
not to the "permanent" carrier substrate
Part of the security elements are. Suitable materials
for the temporary carrier substrates,
as with the permanent carrier substrate, also plastic films,
where it is of course immaterial, whether the slides
are transparent or not. The slides should be as possible
be thin, d. H. Thicknesses in the range up to approx. 20 μm
have, but stable and preferably stretchy, what a precise transmission
the security elements in the machine transfer process
facilitated. Regarding the thickness of the temporary
Carrier substrates is still to be noted that these in individual cases
also be thicker than about 20 microns, namely
z. B. when the temporary carrier substrate
is formed by connecting two films or film structures.
temporary carrier substrates of the carrier layer composite
are insoluble with each other by means of an adhesive layer
bonded. Insoluble in this context means that
the bonding during the transfer process of the security elements
or in any processing or treatment processes of the
Security element transfer material can not be solved
can. The transfer to valuables usually takes place
by a process of heat sealing, which is why thermoplastic
Adhesives are less suitable unless they have
very high softening temperatures. Accordingly, z. B.
Solvent-based 2-component PU adhesives whose temperature stability
usually big enough. These adhesives are
generally cross-linked but not radiation-curable. Conceivable
but are also radiation-curing adhesives, in particular
Adhesives caused by UV radiation or by electron radiation
are curable. Details of the appropriate laminating adhesives
are known in the art.
According to one
preferred embodiments are "self-healing" adhesives
used. Self-healing adhesives are adhesives,
which harden only slowly, leaving a while
the curing process damaged adhesive layer
still reactive enough to damage in the course of
to reverse the curing process
do. Suitable adhesives tend to be in the class of
cationic curing adhesives, found since the cationic
Radiation curing a relatively
slow process is still one after irradiation
keeps running for some time.
inventive design of the temporary
Carrier as a carrier layer composite avoids that
when cutting the outline of the security elements stability
of the temporary carrier by cutting the temporary
Carrier is impaired. A comparable one
The result can not be achieved simply by having a single one
Temporary carrier film designed accordingly thicker
is because, as already mentioned, have plastic films
a low tear resistance, d. H. if a slide
even if it is slightly cut, rips
They easily continue and possibly completely
by. Different with the layer composite according to the invention:
Even if one of the temporary carrier substrates
is completely severed, remains the other temporary
Carrier substrate (or possibly the other temporary carrier substrates)
usually undamaged and therefore stable.
The adhesive also forms an additional "buffer zone" between the
temporary carrier substrates.
a self-healing adhesive is used and the cutting of the
Outlines of security elements performed at a time
to which the adhesive has not yet fully cured
is, cuts can be regressed in the adhesive layer
become. The still plastic glue can even be cut into
penetrate the temporary carrier substrate and
fill them in whole or in part or at least as far
stick that stability to the trimmed temporary
Carrier substrates does not appreciably suffers.
The cutting of the outline shapes of the security elements is preferably carried out by means of a laser, as this allows the best precision to be achieved. However, the term "cutting" generally means all methods known to a person skilled in the art for delimiting the individual security elements from the endless material, for example punching. If a laser is used for cutting, additional measures are preferably taken which are suitable for preventing a deep cutting of the laser. Such measures are, for example, the provision of a laser protection layer between the first temporary carrier substrate and the adhesive layer and / or between the second temporary carrier substrate and the adhesive layer. For example, the temporary carrier substrates can be vapor-deposited with a laser-absorbing or a laser-reflecting material become. For steaming, or in general, to equip it with a laser protective layer, are at least the locations at which laser cuts are to be carried out later. An only partial coating may be useful to indemnify control lines for the control of the transfer process. For the cutting with a CO 2 laser, vapor deposition of at least one of the temporary carrier substrates with copper has proven to be most effective.
or in addition, the adhesive between the temporary
Carrier substrates with laser-absorbing or laser-reflecting
Substances, for example, with metal pigments, be equipped,
whereby the underlying temporary carrier substrate
temporary carrier typically consists of one
Carrier layer composite with two temporary carrier substrates,
which are connected by means of an adhesive layer. The carrier layer composite can
but also more than two temporary carrier substrates
each comprising two temporary carrier substrates
are connected by means of an adhesive layer. It is essential that
the adhesive joints ensure that the temporary
Carrier always as a composite layer holds together and
also when transferring the security elements to valuables
as a complete layer composite of the security elements
can be separated. The more layers of the temporary
Carrier has, the more complex is natural
his production. At the same time, however, there is the possibility
to provide a greater number of laser protective layers.
Generally, however, there are two temporary carrier substrates
Laminate structure of the temporary support, optionally
with a self-healing adhesive and / or laser protection layer (s)
and / or laser-absorbing or laser-reflecting substances in
the adhesive layer, allows the temporary
Overall, the wearer comparatively thin, therefore flexible and
nevertheless extremely stable form. The layer thicknesses
for the temporary carrier, d. H. the
Carrier layer composite, are preferably in the range of 20 microns
up to 40 μm.
Production of the Security Element Transfer Material According to the Invention
can be done in different ways. According to one
Variant are the security element layer composite and the carrier layer composite
each prepared separately and then glued together, wherein
the production of the security element layer composite in conventional
Way done. The temporary carrier is made
by gluing the temporary carrier substrates
by means of an adhesive layer. It is essential that the adhesives
for bonding the temporary carrier substrates and
for connecting the security element laminate to the temporary support
be chosen so that the adhesive bond between the
temporary carrier substrates under security element transmission conditions
(typically heat sealing) can not be solved
can, while the connection between security element layer network
and temporary carrier is easily solved.
According to one
Another variant is first the security element layer composite
manufactured in a conventional manner and on the security element layer composite
the temporary carrier built. This will be first
on the viewing layer of the security element layer composite (the
Layer, which later faces a viewer)
first adhesive applied and a temporary carrier substrate
glued to it. On the temporary carrier substrate
another adhesive is applied and with this another
glued temporary carrier substrate. Possibly
may be other temporary carrier substrates
glued on. It is essential that the adhesives are chosen that way
be sure that the security element layer composite of the
Carrier layer composite can be detached while
the carrier layer composite always and in particular under security element transmission conditions
remains firmly glued, as described in the previous variant.
The first adhesive thus forms a so-called "release layer".
According to a further preferred embodiment, firstly the temporary carrier is produced and then the security element layer composite is constructed thereon, layer by layer. As already described for the preceding embodiments, the temporary carrier is produced by non-detachably bonding at least two, and preferably two temporary, carrier substrates to form a carrier layer composite. Then, the security element layer composite is constructed in a conventional manner, wherein first on one of the temporary carrier substrates, a release layer can be applied and then the first security element layer (the later facing the viewer viewing layer) is then applied. The release layer may also be omitted in this type of fabrication if the type of gaze layer in the security element transfer process permits easy separation from the temporary support. This is especially the case when the viewing layer is a lacquer layer with low adhesion to plastic films, as they are used for the temporary carrier substrates. Suitable lacquers are, for example, the embossing lacquers used for embossing diffraction structures. If necessary, the temporary carrier substrate to be coated can also be pre-treated to reduce adhesion. In general, it should be noted that the above embodiment against is preferred over the other production variants, in particular if the security element layer composite without a release layer is arranged on the temporary carrier substrate. As will be explained below, it is possible to dispense with a release layer between security element layer composite and temporary carrier, in particular when using one or more UV embossing lacquer layers as a sight layer; wherein the multilayer embossing lacquer details the EP 1 879 154 A2
can be taken (see also below).
It should be noted
is still that in a preferred variant of the latter
Process the second temporary carrier substrate
and the first temporary carrier substrate first with each other
be glued after the peek and other layers of the
Security element subelement on the first temporary
Carrier were arranged, making the second temporary
Carrier substrate against thermal or radiation stresses,
protected in particular in connection with the embossing of the embossing lacquer layer
is. Furthermore, it is conceivable according to a further variant, the second
temporary carrier substrate and the other layers
of the security element subelement z. B. a permanent carrier substrate,
According to a particularly preferred embodiment of the present invention, as the first security element layer on the temporary carrier, an embossing lacquer layer according to the method described in US Pat EP 1 879 154 A2
applied method described. In the method, the embossing lacquer layer is applied wet-to-wet in several steps, ie a first embossing lacquer layer is first applied to the temporary support, the first layer optionally partially, but not completely, cured, then a second embossing lacquer layer and optionally further embossing lacquer layers applied, then at least the top layer of the coating is embossed with a microstructure, and then cured the entire coating. Subsequently, the microstructure can be equipped with a suitable coating, for example metallized. With regard to the production of the embossing lacquer layer, the disclosure content of EP 1 879 154 A2
in this respect included in the present description.
Formation of the embossing lacquer layer directly on the temporary
Carrier without the interposition of a heat-activated
Releasing layer avoids the problem that under certain circumstances
an undefined cleavage of the release layer takes place. release layers
can also cause problems when the sight layer
after the transfer of the security element to one
Valuable object further treated, for example, printed, should be.
Overprinting of release layers or layers,
have the residues of release layers, often leads to
unclean print images.
On the layer of the security element layer composite disposed opposite to the viewing layer, a heat-seal adhesive layer is preferably applied for bonding to a valuable article. Suitable heat seal adhesives are known to a person skilled in the art. Preference is given to using heat-sealable adhesives which after physical drying or, in the case of hotmelt adhesives, after cooling, form substantially tack-free coatings at room temperature. Such heat seal adhesives are preferred because the security element transfer material is not usually used immediately after production, but is stored, which requires winding of the continuous material. A tack free hot-melt adhesive layer would result in blocking of the wound security-element transfer-material webs. Tack free is when security element transfer material pieces of about 100 cm 2 , stacked and weighted at 10 kg and stored for 72 hours at 40 ° C, are then easily separable without damage. With regard to the heat-seal adhesive layer, it is generally to be noted that this is advantageously applied only after the necessary steps have been performed for connecting the security element sub-element layers or the layers of the temporary carrier substrate. Since the joining of said layers usually takes place at elevated temperature and / or pressure, it makes sense to apply the heat- and / or pressure-sensitive hot-seal adhesive layer only after joining these layers.
The security element transfer material can now be stored temporarily or processed immediately. Next, in the security element layer composite, the later security elements are cut out, ie the outline shapes of the later security elements are cut into the security element layer composite, wherein the cuts preferably completely sever the entire security element layer composite. "Cutting" in this context includes any form of cutting, so for example, punching. The most precise and therefore most preferred type of cutting is cutting with a laser. Even when laser cutting, however, it can not be avoided that the temporary carrier is cut. However, if the temporary carrier is designed according to the invention as a layer composite, cutting the layer composite does not have the effects of impairing the stability of the composite layer as a whole. The cutting process can be controlled so precisely that at least that of the security element layer ver The farthest temporary carrier substrate remains intact and stably holds the temporary carrier. In addition, additional measures can be taken to stabilize the temporary carrier or to prevent deep cutting, such as the use of self-healing adhesives and the application of laser protective layers already described above. It is understood that when using a self-healing adhesive, the cutting of the security element outline should be done at a time when the adhesive has not yet fully cured.
cutting the security feature outline shapes, and optionally
after curing of the self-curing adhesive,
which glued the temporary carrier substrates, is
the excess security element laminate,
d. H. the layered composite outside the outline shapes
of the security elements, leaving only the security elements
even on the temporary carrier, the
Security elements on the temporary carrier
So be spaced apart. The security element transfer material
consists now of the temporary carrier with the
designed as transfer elements security elements, d. H. the
Layer order of the security elements is the reverse of the layer order,
after the transfer of the security elements on the
protected object. Removing the excess
Security element laminar material is also referred to as "scarfing",
since the excess security element layer composite material
a coherent grid (with recesses in the form of
security elements remaining on the temporary carrier)
forms, which analogous to a separation winding of the temporary
Carrier can be removed / removed.
the security elements of the security element transfer material
on valuables, in particular a security paper
or a document of value, preferably by heat sealing.
Both the security element transfer material are preferred
as well as the valuable object used as a band material. The band materials
are merged in the appropriate position, for example
in a nip, the security elements with the valuables
stick together. The bonding preferably takes place by means of heat-seal adhesive,
so at elevated temperature. After gluing the
Security items with the valuables become the temporary
Carrier as a complete carrier layer composite
separated from the transmitted security elements, for example
by separating winding. The security elements can be any
Shapes and in themselves have any sizes.
Preferred embodiments are labels, Folienpatche or others
planar security elements.
Dimensions will be significantly different from the protected item
influenced. The security elements preferably have a thickness
from 1 .mu.m to 100 .mu.m, more preferably a thickness
from 2 μm to 50 μm. It refers to
in the provision of value documents and security papers
with security elements preferred because easy to handle thicknesses
the security elements. By area,
are usually formats of a few square millimeters to a few square centimeters
or greater sense.
Security element transfer material according to the invention
is basically arbitrary for product security of goods
Art suitable, in particular for the authenticity of
Security papers and value documents. The term "security paper" is used
an ineligible precursor to a value document
understood, in addition to the security element more authenticity features
can have. Security paper is usually as
Endless material before and will be at a later date
further processed. Value documents are in particular banknotes, certificates, checks,
Identity documents, identity cards, credit cards and the like.
The security element transfer material according to the invention is of particular advantage,
has the security elements that are due to their permanent
Carrier substrate have a special stability,
used to make through openings in value documents
to close. If the permanent carrier substrate
the security elements is transparent, the functional layers (feature layers)
be designed so that a viewer, at least in some areas
can see through the security element.
An opening in a security paper or document of value may already be generated during the production of the security paper or document of value and then has a fibrous, irregular edge. Such an edge is characteristic of the openings already made during sheet formation and can not be subsequently produced. Details of the preparation of such irregular edges of the document WO 03/054297 A2
are removed, the disclosure of which is included in the present description. In other embodiments, the opening is produced only after papermaking by punching or cutting, for example by laser beam cutting.
The present invention will be further illustrated by means of figures. It should be noted that the figures did not measure are bar and not proportional. Furthermore, certain features disclosed in a figure are not only applicable in combination with the other features disclosed in the corresponding figure. On the contrary, features described in connection with a specific embodiment can each be combined independently with features from other embodiments or, more generally, can be used in the security element transfer material according to the invention.
1 a cross section through a security element transfer material of the prior art,
2 a view of a security element transfer material, as in 1 . 4a to 4d and 5 it is shown
3 a plan view of a security document with a security element of a security element transfer material according to the invention,
4a to 4d Process stages in the production of a security element transfer material according to the invention, each shown in cross section along the line AA 'of 2 , and
5 a special embodiment of a security element transfer material according to the invention, shown in cross section along the line AA 'of 2 ,
the same reference numerals designate the same or the same
1 shows a security element transfer material of the prior art, shown in cross section along the line AA 'of 2 , The security element transfer material has a temporary carrier 16 on, as well as a security element layer composite 15 consisting of the feature layers 4 . 5 and 2 , the permanent carrier substrate 3 , an adhesive layer 6 , a primer layer 7 and a heat seal adhesive layer 8th , The feature layer 4 is the visual layer, ie after the transfer of security elements to valuables, it faces the viewers. The layer 4 Here is a partially applied liquid crystal layer, wherein the areas 4 ' the liquid crystal regions are. Another feature layer is a metallized hologram consisting of the embossing lacquer layer 5 and the on evaporated metal layer 2 , The metal layer 2 has recesses 2 ' which form a negative font. The metallization 2 is essentially only in the areas of the security element transfer material, which forms the later security elements provided. The security element layer composite 15 and the temporary carrier 16 are by means of a release layer 9 connected, which, as already mentioned, in a particularly advantageous embodiment can also be dispensed with.
The lines 20 and 20 ' indicate how the security element layer composite is cut to pre-cut the security elements in their outline shapes. As you can see, the cuts penetrate 20 and 20 ' in the plastic film, which is the temporary carrier 16 forms, a. The plastic film is destabilized by the cuts and can easily tear at the points of incisions with slight strains, as they are practically unavoidable in the course of the transfer process of the security elements.
2 In plan view, a security element transfer material in which the security elements are pre-cut is not seen 1 shown as a cross section of a portion along the line AA ', or to a security element transfer material according to the invention 1 as in the 4a to 4d and 5 , each represented as a cross section of a portion along the line AA ', is.
3 is a top view of a value document that is a security element 10 from a security element transfer material according to the invention 1 having. The 2 and 3 will be explained later in more detail.
4a shows a cross section through a portion of a security element transfer material according to the invention 1 along the line AA 'of 2 , The illustration corresponds to the representation of the security element transfer material of the prior art of 1 , The structure of the security element layer composite 15 is the same as the one in 1 illustrated security element transfer material of the prior art. Also in the case of the security element transfer material according to the invention 1 is the security element layer composite 15 by means of a release layer 9 with a temporary carrier 16 connected, taking on the release layer 9 as already mentioned, can also be dispensed with in a particularly advantageous embodiment. However, in contrast to the security element transfer material of the prior art, this is not a single film, but rather a carrier layer composite composed of a first temporary carrier substrate 17 and a second temporary carrier substrate 18 by means of an adhesive layer 19 are permanently connected. The two temporary carrier substrates are plastic films, for example Foils made of PET, and the adhesive layer 19 consists of a cationic radiation-curable adhesive, for example UVCS0002 from XSYS. In addition, 2K PU systems are particularly suitable as adhesives. The security element layer composite 15 has a total thickness of about 25 microns, the PET films 17 and 18 each have a thickness of about 12 microns, and the adhesive layer 19 has a thickness of about 3 microns when dry.
The 4b to 4d each show the same view as 4a but in further processing states of the security element transfer material according to the invention 1 ,
4b shows the security element transfer material, after using a CO 2 laser (wavelength 10,600 nm) the outline shapes 21 (please refer 2 ) of the later security elements 10 in the security element layer composite 15 were cut. The cuts are as lines 20 . 20 ' shown. The cut 20 not only cuts through the security element layer composite 15 , but also the first temporary carrier substrate 17 , and in the place 20 ' the cut penetrates far into the adhesive layer 19 in front.
When in the security element transfer material according to the invention 1 the outline shapes 21 were cut at a time to which the adhesive of the layer 19 was not completely cured, one reaches after a certain time in 4c illustrated state. How out 4c The incision is obvious 20 ' in the adhesive layer 19 completely cured. The cuts 20 and 20 ' in the temporary carrier substrate 17 are still clearly visible, but if the cutting of the outline shapes occurs early enough, the adhesive is the layer 19 still sufficiently fluid and reactive that it at least a little way into the cuts of the temporary carrier substrate 17 penetrates and glued the cuts.
Subsequently, the excess material of the security element layer composite 15 , in cross-sectional representations, the material between the cuts 20 and 20 ' , which removes, thereby, in the security element layer composite 15 Gaps 22 arise. This condition is in 4d shown. Both sides of the gap 22 there are security elements 10 , In the supervision representation of the 2 it is recognizable that the security elements 10 , in 2 represented as their outlines 21 , now "islands" on the temporary carrier 16 represent. The islands are surrounded by areas 22 in which there is no longer a security element layer composite material. 2 shows the security element transfer material according to the invention 1 as an endless belt, in which there is only one security element in the direction of the width. In practice, the endless belts may be wider and include a plurality of juxtaposed security elements.
5 shows a specific embodiment of the security element transfer material according to the invention 1 , wherein a state is shown, which corresponds to the in 4b shown state corresponds. At the in 5 shown security element transfer material is the temporary carrier 16 from three temporary carrier substrates 17 ' . 17 ''' and 18 by means of adhesive layers 17 '' and 19 permanently connected to a carrier layer composite. The layers 17 ' . 17 '' and 17 ''' are each very thin, and the adhesive layer 17 '' contains copper in pigment form, which reflects laser beams to limit the depth of cut. As can be seen, at least the cut penetrates 20 ' not deep in the temporary carrier 16 one. The temporary carrier 16 remains sufficiently stable with three temporary carrier substrates as long as the outermost carrier substrate 18 not being cut.
Immediately on the temporary carrier 16
is an embossing lacquer layer 5
after the in EP 1 879 154 A2
described method by application of two embossing lacquer coats that were coined and cured, produced. As already related to 1
mentioned, the is in 5
illustrated immediate arrangement of the security element layer composite 15
on the temporary carrier 16
ie without a release layer, particularly preferred and also for the in 1
shown embodiments very advantageous. On the embossing lacquer layer 5
became the metallization 2
vapor deposited by physical vapor deposition. In the metallization 2
were washed by a washing method (such as disclosed in U.S. Pat WO 99/13157
and WO 97/23357
) the recesses 2 '
generated. Then a layer of laminating adhesive 6
applied and a PET film as a permanent carrier substrate 3
glued to it. On the permanen carrier substrate 3
However, further layers have been built, the exact nature of which is irrelevant to the present invention, and the total reference numeral 11
are designated. Will after cutting the outline shapes 21
the security elements 10
the excess security element layered composite removed, again results in a supervision, as in 2
3 shows a banknote 30 which has a continuous opening 31 having. The continuous opening 31 is with a foil patch 10 which has a larger area than the through opening 31 , locked. The foil patch 10 is a security element made of a security element transfer material according to the invention 1 as it is in the 4a to 4d is shown. In addition, points the banknote 30 another security element, the security thread 40 , on. For applying the security element 10 on the banknote 30 become tracks with banknotes 30 (uncut) and security element transfer material webs with the security elements 10 , as in 4d represented, so merged, that in each case a security element 10 with a through opening 31 is congruent. This requires the security elements 10 in the security element transfer material 1 be prefabricated in the appropriate sizes and distances. Under elevated temperature and elevated pressure in each case a security element 10 on a banknote 30 glued. The hatched area 4 ' represents the scope of the security element 10 in which liquid crystal material is located. The areas 2 ' are the recesses in the metallization 2 by which a viewer is essentially guided by the security element 10 can look through.
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Cited patent literature
- - EP 0420261 B1 
- WO 2005/108108 A2 
- - WO 2007/107235 A1 
- - EP 1879154 A2 [0023, 0025, 0025, 0053]
- WO 03/054297 A2 
- WO 99/13157 
- WO 97/23357