EP3030388B1 - Transfer/punching process - Google Patents

Description

Transfer punching

The invention relates to a punch transfer device and a method for operating such a punch transfer device according to the respective preamble of the two independent claims.

Devices and methods for producing RFID inlays are known. Such inlays consist of a carrier, for example a carrier film made of PET, an antenna arranged on the carrier made of stamped or etched aluminum and a chip that is operatively connected to the antenna.

Normally, such an inlay is built into a label, a textile tag or a paper ticket as a separate layer, i.e. the end product, also known as a smart label, smart tag or smart ticket, consists of 3 layers, in particular the printed or unprinted cover material, the inlay and the printed or unprinted carrier material.

The WO 2009/118455 A1 describes a method for producing an inlay antenna directly on paper by gluing a metal foil over the entire surface of a carrier web that has been glued to the exact contour and then punching out the antenna contour with a laser without damaging the carrier web. The waste of the unnecessary antenna contour, which is not connected to the carrier web by the glue contour, does not represent a continuous, removable grid structure, as is the case with a stamped label grid, but individual separate sections that have to be removed and disposed of in a laborious manner.

A punch transfer device of the same generic type and a method for operating the same are known from the patent DE 10 2007 041752 A1 . The invention is therefore based on the object of specifying a punching transfer device and a method for operating such a punching device with which the disadvantages described above are avoided. In particular, the way in which the antenna is produced and the application of the antenna to a target component, such as a printed paper web, and the disposal of the metal foil parts of the antenna that are not required are to be facilitated.

This object is achieved by the features of the two independent claims.

With regard to the punch transfer device for producing RFID inlays, it is provided according to the invention that the punch transfer device has a punching tool with a vacuum connection, the vacuum connection interacting with a porous elastomer. A multi-layer composite can be punched out in a desired contour by means of the punching tool, the desired punched out contour being retained by means of the vacuum connection for generating a vacuum acting on the punched-out part. After this punching process has taken place, it is possible that the punched out desired contour can be transferred to a target component. In its simplest form, this target component is, for example, a product such as, for example, a paper web printed on the back, packaging or the like onto which the punched-out contour is delivered. Alternatively, it is also conceivable that the punched-out contour is applied to a further carrier and there, for example, one punched-out contour after the other is applied to this carrier, in order to arrange a plurality of composite layers arranged one behind the other and punched out in the desired contour.

By means of the punching tool, a multi-layer composite, which consists of at least a carrier layer, an adhesive layer and a metal layer interacting therewith, is punched out in the desired contour. It is important here that the entire multilayer composite is not punched out in the desired contour, but at least only the metal layer and the adhesive layer that is operatively connected to it. Because after punching out, at least the metal layer and the adhesive layer applied to it remain in the punching tool. In order to achieve this, the vacuum connection is provided on the one hand, which holds the multilayer composite in the punching tool. At the same time, it must be ensured (above all with the highest precision) that the cutting edge of the punching tool gives the metal layer and the adhesive layer applied to it the desired contour by being punched out, but the carrier layer is not punched. This is necessary because it is to be removed after punching and the metal layer-adhesive layer composite that was punched out is to be made available for subsequent processing or further processing. In order to allow the vacuum generated by the vacuum connection to act on the multilayer composite, a porous elastomer is also present. This porous elastomer has the advantage, on the one hand, that the vacuum, which generates a negative pressure to hold the multilayer composite in place in the punching tool, can act on the multilayer composite over a large area. In addition, appropriate coordination of the porous elastomer, in particular with regard to its thickness and its material properties, ensures that, in interaction with the vacuum generated, the multi-layer composite is moved precisely and, above all, position-defined so far into the punching tool or the punching tool can act as far during punching, that at least the metal layer and the adhesive layer located thereon are punched, but the carrier layer is not touched by the punching tool. This ensures in the interaction between the deformable porous elastomer and the vacuum generated that the multilayer composite, consisting of at least a metal layer, adhesive layer and carrier layer, is punched out and held in the punching tool in such a way that after the punching process at least the metal layer with its adhesive layer is in the punching tool remains and the carrier layer can be removed together with the layers of the multilayer composite that are not required (that is, the processing waste, in particular the punching waste). After removing the carrier layer, the adhesive layer of the metal layer (for example an antenna or antenna structure), so that the metal layer can be released for further processing via its adhesive layer. In this way, an antenna for an RFID inlay can be produced in a very simple manner, and this can be done in particular on a large scale. For this purpose, it is provided in a further development of the invention that several punching tools are arranged on a punching roller distributed over its circumference. Thus, by means of these punching tools arranged on the punching roller, the multilayer composite can be punched out rotationally and one behind the other and the punched out contours can be fed to further processing.

In a further development of the invention it is provided that the punching tool has a cutting angle ≤ 45 °, preferably in the range between 30 ° and 35 °. This advantageously enables precise contouring, so that the metal layer, which later forms the antenna of the RFID inlay, for example, can not only be punched out with the highest precision, but can also be held in the punching tool. This contributes to the holding by the vacuum force. The punching flanks of the punching tool can be aligned symmetrically at an angle to the punching direction.

In a further development of the invention, a punching flank of the punching tool is aligned parallel to a punching direction (asymmetrically). This has the effect that the cut edge of the metal layer is aligned parallel to the punching direction. This has the advantage that the punched-out multilayer composite, consisting of at least an adhesive layer and a metal layer, is held in a defined manner in the punching tool, in addition to the interaction of the porous elastomer and the vacuum force, which in this state causes the porous elastomer to contract. After the punching process has ended, the carrier layer can be removed, so that the adhesive layer is initially exposed and is arranged within the axial extension of the punching flanks or within the punching tool. In this state it is not possible or not possible over a large area to use the adhesive layer for further processing. The vacuum force can removed or at least reduced or maintained compared to the previously applied vacuum force, so that the porous elastomer, which was compressed during the punching process, can only relax in a defined manner due to its elasticity (independent of the vacuum force), so that the plane in which the The adhesive layer is moved out of the plane in which the end area of the punching flanks lies. This means that the adhesive layer is freely accessible for further processing.

So far, the multilayer composite has been such a composite, which consists of a metal layer, an adhesive layer and a carrier layer. Such a multilayer composite is, for example, a paper-aluminum composite (also referred to as a PAL composite). Depending on the way in which the punched metal layer is to be fed to further processing, it is not sufficient just to give the metal layer with the adhering adhesive layer the desired contour by means of a punching process, as described above. It is therefore conceivable that this multilayer composite can be applied to a further carrier layer via a further adhesive layer. By appropriate shaping (in particular thickness) and material properties (in particular elasticity) of the porous elastomer in connection with the vacuum force applied via the vacuum connection, the multilayer composite (for example the PAL composite) and the additional adhesive layer can be punched out by means of the punching tool, with the additionally applied carrier layer is not reached by the punching tool. In this case, too, after reducing or removing the vacuum force, the porous elastomer can press the multilayer composite, which was thereby previously held in the punching tool, out of the punching tool to the desired extent, so that the additional adhesive layer is exposed after peeling off the further carrier layer, and this multilayer composite can be made available for further processing.

With regard to the vacuum force, the following is generally pointed out: the vacuum force essentially serves to hold the multilayer composite within the punching tool. It will also cause the porous elastomer to contract very slightly, if at all. However, the porous elastomer is essentially or only compressed by the forces acting during the punching process and, after the punching process, relaxes largely or completely independently of the vacuum force.

It is necessary and essential to the invention to reduce the unit costs for the manufacture of these products and to ensure a uniform selection of materials with regard to environmental compatibility; to build the antenna directly on the cover or carrier web and thus advantageously enable a uniform material selection and a reduction to 2 layers.

The method according to the invention for operating a punch transfer device for producing RFID inlays, more precisely antennas for RFID inlays, is explained and described in more detail below in connection with the figures in connection with the punch tool according to the invention used therein.

The Figures 1 and 2 show a punch transfer device 1 at the moment of the punching process ( Figure 1 ) and at the time of transfer of the punched contour ( Figure 2 ) before submission to further processing.

The punching transfer device 1 comprises a punching tool 2, such a punching tool 2 being arranged as a stand-alone tool or, for example, also present several times on a punching roller. The punching tool 2 has a vacuum connection 3, a vacuum force acting on the inner contour of the punching tool 2 being able to be generated via this vacuum connection 3. This vacuum force can be changed in a controlled manner.

By means of the punching tool 2, a desired contour is to be given to a multilayer composite by punching.

In the embodiment according to the processing steps shown in FIG Figures 1 and 2 are shown, it is a multi-layer composite with a first carrier layer 4, a first adhesive layer 5 present thereon, the first adhesive layer 5 being connected to a second carrier layer 6. The second carrier layer 6 in turn comprises a large area of a second adhesive layer 7 on which a metal layer 8 is arranged over a large area. The first carrier layer 4 is, for example, a silicone film, the second carrier layer 6 consists, for example, of paper and the metal layer 8 consists of aluminum. This multilayer composite can be implemented particularly simply and inexpensively if the layers 6, 7 and 8 form the PAL composite described above. This can be used inexpensively from the roll.

The multi-layer composite 4 to 8 described above is fed to the punching tool 2. The punching tool 2 is moved starting from the metal layer 8 in the direction of the first carrier layer 4, namely moved axially until the when the Figure 1 Lowermost contour of the punching tool 2 protrudes as far as the upper level of the first carrier layer 4 or into the level in which the first adhesive layer 5 is located. For this purpose, the first carrier layer 4 can be supported on a counter-support (for example, flat or designed as a counter-pressure roller). So that the contour to be punched out, consisting of layers 5 to 8, is guided and held in the punching tool, punching tool 2 has a punching flank 10, this punching flank 10 advantageously running parallel (asymmetrically) to a punching direction 11. The other punching flank of the punching tool 2 is provided at an angle α, preferably 45 °, more preferably in the range between 30 ° and 35 °. This configuration of the punching flank 10 results in an almost right-angled punching contour with respect to the surface of the multilayer composite. Both flanks of the punching tool can also be aligned symmetrically with respect to the punching direction 11.

In order to guide the contour of this multilayer composite to be punched out in terms of punching direction 11 and also to hold it in punching tool 2, a vacuum force is applied over a large area to metal layer 8 via vacuum connection 3 via a porous elastomer. Because the first carrier layer 4 in particular is supported in a defined manner, but a defined vacuum force also acts on the multilayer composite, the porous elastomer 9 is contracted in a defined manner in its axial extension with respect to the punching direction 11. This advantageously has the effect that the multi-layer composite 5 to 8 is punched out by means of the punching flank 10 of the punching tool 2 and held in the punching tool 2. Due to the material properties of the porous elastomer 9 and the vacuum force applied, it is ensured that the end region of the punched flank 10 does not extend into the first carrier layer 4. Thus, by means of the punching tool 2, a desired contour is punched out of a multilayer composite and held, and then released by changing the shape of the porous elastomer 9, in particular its thickness, and / or by changing the vacuum.

This transfer to the subsequent processing takes place in that, after this punching-out process, the first carrier layer, for example the silicone film, is peeled off. The remaining layers 5 to 8, which lie outside the contour of the punching tool 2, are also removed. It is important here that the adhesive forces of the adhesive layer 7 are significantly greater than those of the adhesive layer 5 in order to prevent the layers 6, 8 arranged thereon from also being pulled off when the first carrier layer 4 is peeled off. Thus, by means of the punching tool 2, not only the punching process but also the transfer process for the further processing of the punched-out multilayer composite can take place.

While in the Figures 1 and 2 a first example of the multilayer composite is shown, the same process (punching and transfer) is in the Figures 3 and 4 also shown, the further carrier layer 6 and the metal layer 8 here with respect to the adhesive layer 7 are interchanged. This can be important for the subsequent processing of the punched-out multilayer composite.

Referring to the Figures 2 or 4 the actual transfer process is described. After according to the Figures 1 and 3 the multilayer composite 5 to 8 has been punched out, the first carrier layer 4 with the layers present around the punched out contour area is removed in a subsequent step. The metal layer 8 which has been brought into the desired contour and which is connected to the further carrier layer 6 via the adhesive layer 7 thus remains within the punching tool 2. This is the already mentioned PAL network. However, this is not a limitation, since other materials can also be used.

When looking at the Figures 1 or 3, this adhesive layer 5 lies during the punching process approximately in the plane that is defined by the outer edges (when looking at the Figures 1 or 3 the downwardly pointing cutting edges) of the punching flanks 10 is formed. At this point in time (that is, during and directly after the punching out) the adhesive layer 5 was not yet accessible in a defined manner for further processing. After the punching process, the porous elastomer 9 can relax in a defined manner (the porous elastomer 9 having previously been compressed in a defined manner during the punching process due to the design of the punching tool 2). During the punching process, the vacuum force acts on the multilayer composite located inside the punching tool 2 in order to hold it there. After the punching process, the vacuum force applied via the vacuum connection 3 is maintained, reduced or canceled. It is advantageously retained in order to hold the multi-layer composite now punched inside the punching tool 2 there. However, it can also be reduced or canceled if the multilayer composite is transferred to the target component directly after the punching process. In any case, it is important that the adhesive forces of the adhesive layer 5 are greater than the holding forces within of the punching tool, so that by means of these adhesive forces the punched-out multilayer composite can be removed from the punching process and fed to the target component and glued there.

Thus, the porous elastomer 9 can relax again in a defined manner after the punching process (because the counter support has been removed), so that it presses the punched-out multilayer composite to a desired extent in the direction of a delivery direction 12 from the punching tool 2. This amount of pushing out is selected such that preferably the entire adhesive layer 5 and possibly also part of the second carrier layer 6 is moved out of the plane which is delimited by the lower edges of the punching flanks 10. This point in time after the reduction or removal of the vacuum force and relaxation of the porous elastomer 9 (that is, an increase in the axial extent in the direction of the delivery direction 12) is in the Figures 2 and 4 shown. After this has taken place, this punched-out multilayer composite 5 to 8 can be passed on to further processing (transfer).

Up to this point in time, the multi-layer composite within the punching tool 2 consisted of layers 5 to 8 over a large area. However, since it may be necessary to give the metal layer 8 a desired contour, in particular for producing an antenna of an RFID inlay, a further development According to the invention, before the previously described process of punching out the metal layer 8, a desired contour is given by a further, in particular preceding, machining process, in particular also a punching process. The desired contour can be, for example, a recess 14 in the metal layer, but also a more complex geometry. The further, in particular upstream, machining process does not have to be a punching process, but can also be carried out, for example, by a process using a laser or the like. The desired overall contour to be given to the metal layer 8 is exemplified in the plan view in FIG Figure 5 shown, with the layers 5 to 8 punched out here as a multilayer composite and placed on a Target component 13 (for example a paper web) have been delivered (transferred). Depending on the presence of more or fewer layers, depending on this, more or fewer layers (for example only the metal layer with its adhesive layer) are transferred to the target component 13 after the punching process. Thus, in one embodiment, at least the metal layer 8 can be brought into a desired shape, in particular a recess 14, before the multilayer composite 4 to 8 is fed to the punching tool 2. As a result, the metal layer 8 is advantageously brought into the desired contour (for example the antenna structure required for an RFID inlay) and can be subjected to the further stamping and transfer process. In particular with regard to the multilayer composite 4 to 8 and the subsequent punching and transfer process, it is achieved in a particularly advantageous and inventive way that an antenna structure is produced for the production of antennas for RFID inlays, so that only the antenna structure with its adhesive layer must be applied to the target component.

This is a very decisive and essential advantage of the punch transfer device according to the invention and the method to be carried out with it.

Furthermore, it is provided according to the invention that the second carrier layer 6 is detached from the first carrier layer 4 before the punching process and then these two layers 4, 6 are brought together again. As a result, the so-called release value between the two layers 4, 6, which are connected to one another via the adhesive layer 5, is reduced. This means that in order to separate the two carrier layers 4, 6 from one another, a certain force must first be applied in order to overcome the adhesive forces of the adhesive layer 5 connecting the two layers 4, 6. If these two carrier layers 4, 6 are now brought together again and again detached from one another, the force (release) required for this is lower. This fact is used to feed the multi-layer composite to the punching process so that it can be Execution of the punching process requires less force in order to remove the first carrier layer 4 from the punched-out multilayer composite. This has an advantageous effect because it also means that only reduced forces are required to hold the multi-layer punched composite 5 to 8 in the punching tool 2 either only by shaping the punching flank 10 (possibly also by omitting the vacuum force). If the vacuum force is present, it can turn out to be smaller, since the release value of the connection between the two carrier layers 4, 6 was reduced by the previous loosening and bringing them back together. This has an advantageous effect, above all, when punching and transferring the multilayer composite in large numbers.

In addition to this, according to the invention, the process of bringing the two carrier layers 4, 6 together can be carried out congruently or offset from one another. If the process of bringing the two carrier layers 4, 6 together is carried out congruently, the release value is advantageously reduced, as already described. If the two carrier layers 4, 6 are brought together offset from one another, this has the advantage that the punched or otherwise processed machining of the metal layer 8, which may have reached in the direction of the first carrier layer 4, is no longer congruent after the joining . This makes it possible to advantageously ensure that when the metal layer 8 has received a filigree structure, for example an antenna structure, as a result of the further processing operation, it is easily removed from the first carrier layer 4 after the transfer, above all without damage during further processing can.

Finally, it is provided that the punched-out multilayer composite, consisting of the carrier layer 6, the adhesive layers 5, 7 and the metal layer 8, is transferred to a further carrier layer by means of the adhesive layer 5. As a result, the metal layers 8 can be traced onto the further carrier layer in their desired contour, in particular the filigree antenna structure submit for processing and transfer. If the carrier layer 4 is then finally removed, the multilayer composite 5 to 8 can be fed to the target component in its given contour. The part of the multilayer composite that is not required outside the punching contour of the punching tool remains on the first carrier layer 4 and is disposed of together with it, for example wound up on a roll without the formation of disruptive waste.

The invention thus offers the very decisive advantage that, by means of the punch transfer device, only that part of the multilayer composite is punched out and fed to further processing that is also required for further processing. The remaining part (remainder) of the multi-layer composite can be disposed of in the simplest possible way and individual layers do not have to be picked up and disposed of, as was previously the case in the prior art.

The multilayer composite can consist of layers 4 to 8 as described. However, more layers than this are also conceivable, just as a multi-layer composite can only consist of a carrier layer or adhesive layer and a further layer, in particular a metal layer, which are connected to one another via an adhesive layer. The previously mentioned metal layer 8 is advantageously used to produce an antenna or antenna structure and therefore consists of an electrically conductive material (for example aluminum foil). Depending on the intended use of the punched-out multilayer composite, the metal layer described so far can also consist of an electrically non-conductive material (such as, for example, textile, paper, plastic film or the like).

List of reference symbols

1.

Punch transfer device

2.

Punching tool

3.

Vacuum connection

4th

First carrier layer

5.

First adhesive layer

6th

Second carrier layer

7th

Second adhesive layer

8th.

Metal layer

9.

Porous elastomer

10.

Punch edge

11.

Punching direction

12.

Delivery direction

13.

Target component

14th

Recess

Claims (12)

1. Punching transfer apparatus (1) for manufacturing an RFID antenna, characterized in that the punching transfer apparatus (1) comprises a punching tool (2) with a vacuum connection (3), wherein the vacuum connection (3) interacts with a porous elastomer (9).
2. Punching transfer apparatus (1) according to claim 1, characterized in that the punching tool (2) comprises a cutting angle (α) which is symmetrically or asymmetrically aligned with respect to a punching direction (11) and is smaller than or equal to 45 degrees, in particular in the range between 30 degrees and 35 degrees.
3. Punching transfer apparatus (1) according to claim 1 or 2, characterized in that a punching flank (10) of the punching tool (2) is aligned parallel to a punching direction (11).
4. Punching transfer apparatus (1) according to claim 1, 2 or 3, characterized in that several punching tools (2) are arranged on a punching roller distributed around its circumference.
5. Method for operating a punching transfer apparatus (1), in particular for manufacturing RFID antennas, characterized in that the punching transfer apparatus (1) comprises a punching tool (2) with a vacuum connection (3), wherein the vacuum connection (3) interacts with a porous elastomer (9) in such a way that by means of the punching tool (2) a desired contour is punched out of a multi-layer composite, held in place and afterwards released by changing the shape of the porous elastomer (9) and/or by changing the vacuum.
6. Method according to claim 5, characterized in that the multi-layer composite consists of a first carrier layer (4) and at least one second carrier layer (6), which are connected to one another by means of a removable first adhesive layer (5), and the at least second carrier layer (6) is connected to a metal layer (8) via a second adhesive layer (7), wherein the desired contour is punched out of all layers (5 to 8) with the exception of the first carrier layer (4) by means of the punching tool (2).
7. Method according to claim 5 or 6, characterized in that before punching, the multi-layer composite, in particular comprising the layers 5 to 8, is given a desired contour, in particular a recess (14), by a further, in particular preceding processing operation, in particular a punching operation.
8. Method according to claim 5, 6 or 7, characterized in that before the punching process the second carrier layer (6) is detached from the first carrier layer (4) and then brought together again.
9. Method according to claim 8, characterized in that the process of bringing together the two carrier layers (4, 6) is carried out congruently or offset to each other.
10. Method according to one of claims 5 to 9, characterized in that the punched-out multi-layer composite, consisting of the carrier layer (6), the adhesive layers (5, 7) and the metal layer (8), is transferred to a further carrier layer by means of the adhesive layer (5).
11. Method according to one of claims 5 to 10, characterized in that the waste is disposed of around the punched multi-layer composite, in particular wound up on a roll.
12. Method according to claim 11, characterized in that the waste around the punched multi-layer composite remains on the first carrier layer (4) through the first adhesive layer (5) and is disposed of with it, in particular is wound up on a roll.

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