CN105980116B - Punching press transfer device and method for running punching press transfer device - Google Patents
Punching press transfer device and method for running punching press transfer device Download PDFInfo
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- CN105980116B CN105980116B CN201480050676.XA CN201480050676A CN105980116B CN 105980116 B CN105980116 B CN 105980116B CN 201480050676 A CN201480050676 A CN 201480050676A CN 105980116 B CN105980116 B CN 105980116B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/018—Holding the work by suction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
- B26D3/085—On sheet material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/384—Cutting-out; Stamping-out using rotating drums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
- B26F2001/4436—Materials or surface treatments therefore
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
- B26F2001/4472—Cutting edge section features
Abstract
The present invention relates to a kind of methods for running punching press transfer device (1), method in particular for manufacturing RFID antenna, wherein, the punching press transfer device (1) has the stamping tool (2) with vacuum interface (3), wherein, the vacuum interface (3) and porous elastomers (9) collective effect, so that desired profile can be punched out from layered composite by means of the stamping tool (2) and be held, and the expectation profile can be exported then by changing the shape of the porous elastomers (9) and/or by changing vacuum.
Description
Technical field
The present invention relates to a kind of punching press transfer device and a kind of methods for running such punching press transfer device.
Background technique
Device and method for manufacturing RFID inlay are known.Such inlay includes that carrier (such as is made of PET
Carrier film), the antenna made of stamped or etched aluminium that is arranged on carrier and the core with antenna effect connection
Piece.
In general, such inlay is configured in label, fabric pendant or paper-bill as exclusive layer, it is, most
Finished product (also referred to as intelligent trade mark, intelligent label or smart tickets) is made of three layers, such as especially by being printed or not printed
It the covering material of brush, inlay and is constituted through printing or unprinted carrier material.
2009/118455 A1 of WO describes a kind of method for manufacturing embedded antenna directly on paper, mode are as follows:
Metal film is adhered to previously profile accurately on glued carrying belt by entire surface, and is then punched out a day line wheel with laser
Exterior feature, without damaging carrying belt.Do not pass through the waste material of glued profile and the unwanted antenna profile of carrying band connection and is not so good as
With constituting lattice structure that is continuous, can stripping like that in label punching press grid, but constituting must take out and clearly with expending
The each separately section removed.
Summary of the invention
Therefore the present invention is based on purpose be to propose a kind of punching press transfer device and a kind of for running such punching press
The method of equipment avoids starting the shortcomings that proposing by it.The mode of antenna manufacture should especially be simplified, simplify antenna to target
The removing of installation and the simplified unwanted metal film portion to antenna on component (such as paper tape through printing).
About the punching press transfer device for manufacturing RFID inlay, it is proposed, according to the invention, that the punching press transfer device has
Stamping tool with vacuum interface, wherein vacuum interface and porous elastomers collective effect.It can be incited somebody to action by means of stamping tool
Layered composite is punched into desired profile, wherein the expectation profile being punched out is by means of being punched out component for generating to be applied to
On vacuum vacuum interface fixing.It is possible that the expectation profile being punched out can be transmitted after blanking process progress
To target member.In simplest form, the target member is, for example, the paper tape of product such as back up, packaging etc., punching
The profile determined is sent in the paper tape or packaging.Alternative is in this it is also contemplated that the profile being punched out is applied to
For example the profile being punched out is applied to one by one on the carrier on other carrier and at this, to be thus arranged
Multiple composite layers setting gradually, being punched into desired profile.
It will be at least by carrier layer, adhesive layer and together multilayer that the metal layer that acts on is constituted is answered by means of stamping tool
It closes object and is punched into desired profile.It is important in this that the layered composite being not all of is punched into expectation profile, but at least
Only metal layer and the adhesive layer for functioning connection are punched into expectation profile.Because after punching, at least metal layer and apply
The adhesive layer being added in thereon should stay in stamping tool.In order to realize this, it is on the one hand equipped with vacuum interface, which will be more
Layer compound is maintained in stamping tool.It must ensure that the cutting edge of stamping tool for gold (especially with full accuracy) simultaneously
Belong to layer and apply adhesive layer on it and assign expectation profile, mode are as follows: is punched the metal layer and applies on it viscous
Layer is connect, but punching press is not carried out to carrier layer.This is necessary, because the carrier layer should be removed after punching press, and passes through
The metal layer of punching-adhesive layer compound should be provided for following process or is further processed.In order to be connect by means of vacuum
Furthermore there are porous elastomers in generated vacuum action to layered composite in mouth.On the one hand the porous elastomers have
Have the advantage that: vacuum can plane earth be applied on layered composite, the vacuum generates negative pressure to consolidate layered composite
It holds in stamping tool.Furthermore the corresponding adjustment to porous elastomers is realized, especially with respect to its thickness and its material property side
Face adjusts accordingly, so that when with generated vacuum collective effect, layered composite accurately and especially position
Move in stamping tool with limiting or stamping tool can the effect in punching press so that at least metal layer and disposed thereon
Adhesive layer is stamped, but the tool of being stamped does not touch carrier layer.Therefore in deformable porous elastomers and generated vacuum
Ensure when collective effect: being at least punched in stamping tool by the layered composite that metal layer, adhesive layer and carrier layer are constituted
And fixing, so that at least metal layer and its adhesive layer stays in stamping tool after punching course, and carrier layer and multilayer
The unwanted layer (i.e. processing waste material, especially stampings) of compound can be removed.Expose after removing carrier layer
The adhesive layer of metal layer (such as antenna or antenna structure), enable thus metal layer be conveyed to further via its adhesive layer
Processing.Therefore antenna for RFID inlay can be made in a very simplified manner, wherein this more particularly to batch type into
Row.This is proposed in improvement project of the invention, multiple stamping tools are distributed in the mode on its circumference in punch roll
Setting.Therefore the stamping tool that can be arranged in punch roll by means of these rotatably and is in turn punched layered composite,
And the profile being punched out is conveyed to and is further processed.
It is proposed in improvement project of the invention, stamping tool has≤45 °, the range especially between 30 ° and 35 °
In cutting angle.Thus realization is accurate contoured in an advantageous manner, so that being for example subsequently formed the antenna of RFID inlay
Metal layer be not only punched with highest precision, but also can be retained in stamping tool.This facilitates by means of true
Empty power is kept.The punching press side of stamping tool can be oriented in a manner of symmetrically bending about pressing direction.
In improvement project of the invention, the punching press side of stamping tool is parallel to pressing direction orientation (asymmetricly).
Thus the cutting edge of metal layer is caused to be parallel to pressing direction orientation.This have an advantage that thus in addition to porous elastomers and
Other than the collective effect for causing porous elastomers to shrink in this state of vacuum power, through being punched at least by adhesive layer and metal
The layered composite that layer is constituted is maintained in stamping tool in a limiting fashion.After terminating punching course, load can be removed
Body layer, so that thus exposing adhesive layer first, and the adhesive layer is arranged in the axially-extending portion of punching press side or is arranged
In stamping tool.In this state it is infeasible or extensively it is infeasible be, for further processing by adhesive layer.Vacuum power
It can be removed or at least reduce or remain unchanged relative to the vacuum power being previously applied, so that being shunk during punching course
Porous elastomers can in a limiting fashion merely due to its elastic (unrelated with vacuum power) and expand so that thus adhesive layer institute
Plane removed from the plane where the end regions of punching press side.Therefore adhesive layer be for further processing can be free
Close.
Up to now, layered composite is the compound being made of metal layer, adhesive layer and carrier layer.Such multilayer is multiple
Closing object is, for example, paper-aluminium compound (also referred to as PAL compound).Feed should be conveyed in what manner according to the metal layer being punched out
The mode of one step processing is not enough to only assign the phase by means of punching course as described above for metal layer and the adhesive layer of adherency
Hope profile.Therefore it is contemplated that the layered composite is applied in another carrier layer via another adhesive layer.Therefore, lead to
The corresponding shaping (especially thickness) and material property for crossing the vacuum power that porous elastomer-bonded applies via vacuum interface are (especially
It is elasticity), layered composite (such as PAL compound) and additional adhesive layer can be punched by means of stamping tool, wherein attached
The carrier layer being affixed by is not encountered by stamping tool.Even if in this case, after reducing or cancelling vacuum power, poroelasticity
Body can also be squeezed out the layered composite being thus previously held in stamping tool from stamping tool with expected degree, so that
Expose additional adhesive layer after removing other carrier layer, and the layered composite is capable of providing to further place
Reason.
Usually only pay attention to following the description about vacuum power: vacuum power is essentially available for layered composite being maintained at presser
In tool.The vacuum power (if present) is although also cause the extremely small contraction of porous elastomers.But porous bullet
Property body substantially or only shunk by the power acted in punching press and main after punching course or completely and vacuum
Power is independently expanded.
For reducing for manufacturing the cost per unit of the product and uniformly selecting raw material about environment compatibility,
It is necessary and it is important to the present invention that, antenna is built directly on top cover band or carrying belt, and then realizes in an advantageous manner
Unified raw material select and are reduced to 2 layers.
Detailed description of the invention
It elaborates and describes in conjunction with attached drawing below according to this in conjunction with stamping tool according to the present invention as used herein
The method for running punching press transfer device to manufacture RFID inlay (the more precisely antenna of RFID inlay) of invention.
Fig. 1 and Fig. 2 shows the punching press transfer device 1 (Fig. 1) in punching course and before being conveyed to and being further processed
Punching press transfer device (Fig. 2) at the time of transferring the profile being punched out.
Specific embodiment
Punching press transfer device 1 includes stamping tool 2, wherein such stamping tool 2 as individual tool such as
Also repeatedly there is ground to be arranged in punch roll.Stamping tool 2 has vacuum interface 3, wherein can via the vacuum interface 3
Generate the vacuum power being applied on the Internal periphery of stamping tool 2.The vacuum power can change in a controlled manner.
By means of stamping tool 2 expectation profile should be assigned by being stamped into layered composite.
According to processing step in fig 1 and 2 shown in embodiment be related to first vector layer 4, be present in this first
The layered composite of the first adhesive layer 5 in carrier layer, wherein the first adhesive layer 5 is connect with Second support layer 6.Second support
Layer 6 includes the second adhesive layer 7 in large area again, and 8 plane earth of metal layer is arranged on second adhesive layer.4, first vector layer
Silicone resin film in this way, Second support layer 6 are for example made of paper, and metal layer 8 is made of aluminium.Before layer 6,7 and 8 is formed
When PAL compound through describing, can be extremely simple and it be achieved at low cost the layered composite.The layered composite can be by
The roller uses at low cost.
The layered composite 4 to 8 described before is fed to stamping tool 2.Stamping tool 2 is from metal layer 8 towards first
The direction movement of carrier layer 4, more specifically axially movable, until the lowest part profile of stamping tool 2 is transported when observe Fig. 1
It moves in the upper plane of first vector layer 4 or protruding into the plane where the first adhesive layer 5.For this purpose, 4 energy of first vector layer
It is enough supported on cooperation support (its such as plane earth constitutes or is configured to cooperate pressure roll).In order to make to be made of layer 5 to 8
Profile to be punched is guided and keeps in stamping tool, stamping tool 2 have a punching press side 10, the punching press side 10 with
Advantageous mode is about parallel (asymmetric) extension of pressing direction 11.Another punching press side of stamping tool 2 with preferably≤45 °,
The angle [alpha] in range further preferably between 30 ° and 35 ° is arranged.It is obtained by the design scheme of punching press side 10
Surface relative to layered composite punching press profile approximately at right angles.Two sides of stamping tool also can symmetrically about
Pressing direction 11 orients.
In order to which the profile to be punched of the layered composite is guided relative to pressing direction 11 and is also maintained at punching press
In tool 2, vacuum power can be applied in large area metal layer by porous elastomers via vacuum interface 3 in this case
On 8.Especially first vector layer 4 due to limiting is supported, but also the vacuum power of restriction is applied on layered composite, institute
It is axially shunk in a limiting fashion about pressing direction 11 in extension with porous elastomers 9.Thus in an advantageous manner
Cause: layered composite 5 to 8 being punched by means of the punching press side 10 of stamping tool 2 and holds it in presser
In tool 2.By porous elastomers 9 material property and the vacuum power that is applied and ensure: the end regions of punching press side 10 are not
It protrudes into first vector layer 4.Therefore, it is punched out desired profile from layered composite by means of stamping tool 2 and is consolidated
It holds, and this can be exported then by changing the shape (especially its thickness) of porous elastomers 9 and/or by changing vacuum
It is expected that profile.
Output to following process carries out as follows: first vector layer, such as silicone resin film are removed after the blanking process.
Also the remainder layer 5 to 8 except the profile for being located at stamping tool 2 is removed together herein.It is important in this that adhesive layer 7 is viscous
Attached power is more significantly larger than the adhesion strength of adhesive layer 5, so as to the layer for preventing the removing with first vector layer 4 that will also be disposed thereon
6, it 8 is peeled off together.Therefore punching course can not only be carried out by means of stamping tool 2, and be able to carry out for through rushing
The transfer process that the layered composite of sanction is further processed.
The first example for showing layered composite in fig. 1 and 2, equally shows same process in figs. 3 and 4
(punching and transfer), wherein another carrier layer 6 and metal layer 8 are exchanged with each other relative to adhesive layer 7 herein.This is for through being punched
Layered composite carry out subsequent processing for can be meaningful.
Fig. 2 or Fig. 4 also describes actual transfer process.After according to Fig. 1 and Fig. 3 punching layered composite 5 to 8,
In the next steps, first vector layer 4 and the layer being present in around the contour area through being punched are removed.In order to make that there is expectation
The metal layer 8 of profile stays in stamping tool 2, and the metal layer is connect via adhesive layer 7 with another carrier layer 6.It herein relates to
The PAL compound having been mentioned.However this is not limitation, because being also able to use other materials.
When observing Fig. 1 or Fig. 3, the adhesive layer 5 is during punching course for example positioned at the outer rib by punching press side 10
In the plane that side (being downwardly directed cutting seamed edge when observing Fig. 1 or Fig. 3) is formed.Therefore it (is being punched at the time point
Period and after punching), adhesive layer 5 is also non-accessible for being further processed.It is porous after punching course
Elastomer 9 can expand with limiting (wherein the moulding based on stamping tool 2 during punching course and in advance in a limiting fashion
Compress porous elastomers 9).During punching course, vacuum power is applied on the layered composite in stamping tool 2, with
Just the layered composite is maintained at this.Maintenance, reduction or cancellation apply via vacuum interface 3 after punching course
Vacuum power.It is advantageous to the vacuum powers to remain unchanged, to be located at the multilayer of punching press at present in stamping tool 2
Compound is maintained at this.But when layered composite is directly when being transferred to target member after punching course, can also subtract
The small or cancellation vacuum power.It is important that under any circumstance, the bonding force of adhesive layer 5 is than the retentivity in stamping tool
Greatly, so that the layered composite through being punched is taken out from punching course by means of the bonding force and is conveyed to target member simultaneously
And it can be bonded at this.
Therefore, porous elastomers 9 can expansion (cooperates branch because taking out in a limiting fashion again after punching course
Seat) so that it squeezes out the layered composite through being punched with desired degree along outbound course 12 from stamping tool 2.It squeezes out
Degree be selected as so that it is preferred that entire adhesive layer 5 and when necessary also a part of Second support layer 6 are from by punching press side 10
Lower seamed edge limit plane in remove.It is shown in Fig. 2 and Fig. 4 and is reducing or cancelling vacuum power and the expansion of porous elastomers 9
The time point after (i.e. axially-extending portion becomes larger along outbound course 12).After above content completion, the multilayer through being punched
Compound 5 to 8 can be exported to being further processed (transfer).
Until the time point, the layered composite in stamping tool 2 are made of layer 5 to 8 extensively.But because especially
Metal layer 8 may be needed to be similarly to manufacture the antenna of RFID inlay and assign expectation profile, so in improvement of the invention
In scheme it is contemplated that: before the blanking process of the metal layer 8 described before, pass through the processed of other especially front and continued
Journey especially equally assigns desired profile by punching course.The expectation profile for example can be the recess portion 14 in metal layer,
But it also can be complicated geometry.The process of the other especially front and continued needs not be punching course, but
It can be carried out such as passing through the process by means of realization laser.It is illustrated in the top view of Fig. 5 and assigns metal layer 8
It is expected that overall profile, wherein being punched at this to the layer 5 to 8 as layered composite and outputting it (transfer) to target
Component 13 (such as paper tape).It, also will be more or less after punching course depending on this according to existing more or less layer
Layer (such as only metal layer and its adhesive layer) is transferred on target member 13.Therefore, in embodiment situation, in MULTILAYER COMPOSITE
Object 4 to 8 is fed to before stamping tool 2, and metal layer 8 can at least be made to have intended shape, especially recess portion 14.Thus with
Advantageous mode makes metal layer 8 have desired profile (such as antenna structure needed for RFID inlay) and can be subjected to another
Outer punching press and transfer process.Especially with respect to layered composite 4 to 8 and subsequent punching press and process is transferred, with particularly advantageous
Sum the important mode of the present invention is realized: antenna structure is made in order to manufacture the antenna for RFID inlay, so that only also
Antenna structure must be applied on target member by its adhesive layer.
Herein relate to punching press transfer device according to the present invention and the method to implement by the punching press transfer device
Conclusive and significant advantage.
In addition, it is proposed, according to the invention, that before punching course by Second support layer 6 from first vector layer 4 separate and
The two layers 4,6 are recombined later.Thus it reduces via so-called between 5 interconnected two layers 4,6 of adhesive layer
Release value.It means that in order to which two carrier layers 4,6 are separated from each other it may first have to apply specific power, connect to overcome
Connect the bonding force of the adhesive layer 5 of two layers 4,6.If the two present carrier layers 4,6 are recombined and are separated from each other again,
It is smaller to the power (release) needed for this.Using the situation so that layered composite is conveyed to punching course, so that executing punching
Press through journey needs smaller power to remove first vector layer 4 from the layered composite through being punched later.Why this is advantageous
Be because thus also only need reduced power that the layered composite 5 to 8 through being punched only is passed through punching press in stamping tool 2
The molding (when necessary also in the case where saving vacuum power) of side 10 is kept.If there is vacuum power, the vacuum power can
With smaller, because the release value of the connection between two carrier layers 4,6 is subtracted by the separation that is previously-completed and recombine and
It is small.This is especially advantageously acted in punching press and the large batch of layered composite of transfer.
It is complemented at this, according to the present invention, the cohesive process of two carrier layers 4,6 is overlapped ground or carries out with offseting one from another.Such as
The cohesive process of two carrier layers of fruit 4,6 is overlapped ground and carries out, then release value as previously described reduces in an advantageous manner.If two
The combination of a carrier layer 4,6 carries out with offseting one from another, then this have an advantage that it is being thus punched or right in other ways
The processing that metal layer 8 carries out no longer is to be overlapped after the coupling, and the metal layer may be towards the direction of first vector layer 4
Extend.Thus, it is possible to ensure in an advantageous manner: obtain metal layer 8, particularly delicate example when passing through other process
It, can easily, especially can not be with damaging from first vector layer 4 when being further processed after transfer when such as antenna structure
It removes.
Finally propose, the layered composite through being punched being made of carrier layer 6, adhesive layer 5,7 and metal layer 8 by means of
Adhesive layer 5 is output in other carrier layer.Thus, it is possible to metal layer 8 it is expected profile, especially delicate day knot with it
Structure is output in other carrier layer after processing and transfer.If finally carrier layer 4 removed later, MULTILAYER COMPOSITE
The profile that object 5 to 8 can be endowed with it is conveyed to target member.Layered composite outside the punching press profile of stamping tool
It is unwanted to be partially left on first vector layer 4 and removed together with the first vector layer, such as do not forming interference waste material
In the case where be wound on roller.
Therefore the present invention provides conclusive advantage: by means of punching press transfer device be only punched layered composite for into
One step handles required part and delivers this to and is further processed.The rest part (residue) of layered composite can be with
Simplest mode is removed and need not be as received and removing each layer in the prior art up to now.
Layered composite can be made of layer 4 to 8 as described.It can be only by carrying but multiple layers can also be envisioned for
The layered composite of body layer or adhesive layer and another layer, especially metal layer (these layers are connected with each other via adhesive layer) composition.Extremely
The metal layer 8 that the present refers to is in an advantageous manner for manufacturing antenna or antenna structure and therefore by conductive material (such as aluminium film)
It constitutes.According to the use purpose of the layered composite through being punched, the metal layer described up to now also can be by non-conducting material
(such as by fabric, paper, plastic foil etc.) is constituted.
Reference signs list
1 punching press transfer device
2 stamping tools
3 vacuum interfaces
4 first vector layers
5 first adhesive layers
6 Second support layers
7 second adhesive layers
8 metal layers
9 porous elastomers
10 punching press sides
11 pressing directions
12 outbound courses
13 target members
14 recess portions
Claims (19)
1. a kind of for manufacturing the punching press transfer device (1) of RFID antenna, which is characterized in that the punching press transfer device (1) has
The porous elastomers (9) of stamping tool (2) and setting in stamping tool (2) with vacuum interface (3), wherein by
Desired profile, and the vacuum interface (3) and porous elastomers (9) are punched out from layered composite in stamping tool (2)
Connect and with porous elastomers (9) collective effect so that vacuum power to be applied to the profile being punched out by porous elastomers (9)
It is upper and the profile being punched out is held by stamping tool (2), and then by change the porous elastomers (9) shape and
The profile being punched out can be exported by reducing vacuum power.
2. punching press transfer device (1) according to claim 1, which is characterized in that the stamping tool (2) has about punching
The cutting angle (α) that pressure direction (11) symmetrically or non-symmetrically orients, the cutting angle are less than or equal to 45 degree.
3. punching press transfer device (1) according to claim 2, which is characterized in that the cutting angle 30 degree and 35 degree it
Between range in.
4. according to claim 1 to punching press transfer device (1) described in one of 3, which is characterized in that the stamping tool (2)
Punching press side (10) is parallel to pressing direction (11) orientation.
5. according to claim 1 to punching press transfer device (1) described in one of 3, which is characterized in that multiple stamping tools (2) exist
It is arranged in punch roll in the mode being distributed on its circumference.
6. method of the one kind for running punching press transfer device (1), which is characterized in that the punching press transfer device (1) has band
There is the stamping tool (2) of vacuum interface (3), wherein the vacuum interface (3) and porous elastomers (9) collective effect, so that borrowing
Desired profile can be punched out and be held from layered composite by helping the stamping tool (2), and then be passed through
Change the shape of the porous elastomers (9) and/or the expectation profile can be exported by changing vacuum.
7. according to the method described in claim 6, it is characterized in that, the layered composite includes first vector layer (4) and extremely
A few Second support layer (6), the first vector layer and at least one described Second support layer are by means of separable first
Adhesive layer (5) is connected with each other, and at least one described Second support layer (6) connects via the second adhesive layer (7) and metal layer (8)
It connects, wherein be punched out expectation from all layers other than the first vector layer (4) by means of the stamping tool (2)
Profile.
8. method according to claim 6 or 7, which is characterized in that before being punched to the layered composite, lead to
It crosses other process and assigns expectation profile.
9. according to the method described in claim 8, it is characterized in that, the other process is the process of front and continued.
10. according to the method described in claim 8, it is characterized in that, the other process is punching course.
11. according to the method described in claim 8, it is characterized in that, the expectation profile is recess portion (14).
12. the method according to the description of claim 7 is characterized in that passing through before being punched to the layered composite
Punching course assigns expectation profile；And before the punching course, by the Second support layer (6) from the first vector
Layer (4) separates and later recombines them.
13. according to the method for claim 12, which is characterized in that the cohesive process of two carrier layers (4,6) be overlapped ground or
It carries out with offseting one from another.
14. the method according to the description of claim 7 is characterized in that by the carrier layer (6), the adhesive layer (5,7) and
The layered composite through being punched that the metal layer (8) is constituted is output in other carrier layer by means of the adhesive layer (5).
15. method according to claim 6 or 7, which is characterized in that remove useless around the layered composite through being punched
Material.
16. according to the method for claim 15, which is characterized in that the waste material to be wrapped on roller.
17. the method according to the description of claim 7 is characterized in that remove waste material around the layered composite through being punched,
And the waste material around the layered composite through being punched stays in the first vector layer (4) by first adhesive layer (5)
Above and therewith removed.
18. according to the method for claim 17, which is characterized in that the waste material around the layered composite through being punched passes through
First adhesive layer (5) stays on the first vector layer (4) and is therewith wrapped on roller.
19. according to the method described in claim 6, it is characterized in that, this method is the method for manufacturing RFID antenna.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013215706.1 | 2013-08-08 | ||
| DE102013215706.1A DE102013215706A1 (en) | 2013-08-08 | 2013-08-08 | Transfer presses |
| PCT/EP2014/064615 WO2015018587A1 (en) | 2013-08-08 | 2014-07-08 | Transfer/punching process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105980116A CN105980116A (en) | 2016-09-28 |
| CN105980116B true CN105980116B (en) | 2019-07-23 |
Family
ID=51211196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480050676.XA Active CN105980116B (en) | 2013-08-08 | 2014-07-08 | Punching press transfer device and method for running punching press transfer device |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9981398B2 (en) |
| EP (1) | EP3030388B1 (en) |
| JP (1) | JP6415558B2 (en) |
| CN (1) | CN105980116B (en) |
| DE (1) | DE102013215706A1 (en) |
| ES (1) | ES2833290T3 (en) |
| HK (1) | HK1226026A1 (en) |
| MY (1) | MY183430A (en) |
| WO (1) | WO2015018587A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3007681B1 (en) * | 2013-07-01 | 2015-07-17 | Oberthur Technologies | MANUFACTURE OF A PLATE OF LARGE THICKNESS COMPRISING A DETACHABLE CARD OF SMALL THICKNESS |
| CH711043A1 (en) * | 2015-05-06 | 2016-11-15 | Berhalter Ag | Device for the punching of thin-walled materials. |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101663678A (en) * | 2007-09-04 | 2010-03-03 | 必诺·罗伊泽有限及两合公司 | Chip module for an rfid system |
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| JPS5240078B2 (en) * | 1972-04-05 | 1977-10-08 | ||
| GB1436544A (en) * | 1972-05-25 | 1976-05-19 | Smiths Industries Ltd | Methods of and apparatus for working sheet material |
| JPS49117586U (en) * | 1973-02-01 | 1974-10-08 | ||
| US5382404A (en) | 1989-05-04 | 1995-01-17 | Murata Manufacturing Co., Ltd. | Method of cutting out a portion of a weak sheet |
| JPH068199A (en) * | 1992-06-30 | 1994-01-18 | Diafoil Co Ltd | Perforating method for tape |
| JPH077900U (en) * | 1993-07-12 | 1995-02-03 | 栄一 上石 | Punching device for sheet material |
| CH690844A5 (en) * | 1995-08-04 | 2001-02-15 | Bobst Sa | blank separating equipment within a machine for cutting plate-like workpieces. |
| US5788999A (en) * | 1996-07-04 | 1998-08-04 | Fuji Photo Film Co., Ltd. | Disk producing apparatus for a photo film cassette |
| US6173632B1 (en) * | 1998-11-23 | 2001-01-16 | Semiconductor Technologies & Instruments, Inc. | Single station cutting apparatus for separating semiconductor packages |
| TW558727B (en) * | 2001-09-19 | 2003-10-21 | Matsushita Electric Ind Co Ltd | Manufacturing method of ceramic electronic components and its manufacturing equipment |
| JP4169565B2 (en) * | 2002-10-11 | 2008-10-22 | 三星ダイヤモンド工業株式会社 | Brittle material substrate break method, apparatus and processing apparatus therefor |
| JP2007000338A (en) * | 2005-06-23 | 2007-01-11 | Nichiban Co Ltd | Medical adhesive composition |
| JP4545681B2 (en) * | 2005-12-01 | 2010-09-15 | 日本メクトロン株式会社 | Adsorption conveyance device and conveyance method for plate workpiece |
| CN200956712Y (en) * | 2006-08-25 | 2007-10-03 | 鸿富锦精密工业（深圳）有限公司 | Punching-cutting assembling device |
| JP2009166487A (en) * | 2007-12-18 | 2009-07-30 | Nichigo Morton Co Ltd | Flat pressing machine, laminating apparatus and laminating method using them |
| FI121592B (en) | 2008-03-26 | 2011-01-31 | Tecnomar Oy | Process for making PCB laminates, especially RFID antenna laminates and PCB laminates |
| ES2386614T3 (en) * | 2010-02-06 | 2012-08-23 | Textilma Ag | Mounting device for applying an RFID chip module on a substrate, especially a label |
| CN202498586U (en) * | 2011-12-05 | 2012-10-24 | 苏州源德福科技有限公司 | Die cutting device |
| DE202012011193U1 (en) * | 2012-09-25 | 2013-02-27 | Jürgen Teufel | counter-tool |
| WO2016086095A1 (en) * | 2014-11-25 | 2016-06-02 | Biodelivery Sciences International, Inc. | Patches, methods for forming and testing pharmaceutical agent delivery patches |
-
2013
- 2013-08-08 DE DE102013215706.1A patent/DE102013215706A1/en not_active Withdrawn
-
2014
- 2014-07-08 JP JP2016532281A patent/JP6415558B2/en active Active
- 2014-07-08 ES ES14741235T patent/ES2833290T3/en active Active
- 2014-07-08 CN CN201480050676.XA patent/CN105980116B/en active Active
- 2014-07-08 EP EP14741235.7A patent/EP3030388B1/en active Active
- 2014-07-08 WO PCT/EP2014/064615 patent/WO2015018587A1/en active Application Filing
- 2014-07-08 US US14/903,823 patent/US9981398B2/en active Active
- 2014-07-08 MY MYPI2016700411A patent/MY183430A/en unknown
-
2016
- 2016-12-08 HK HK16114010A patent/HK1226026A1/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101663678A (en) * | 2007-09-04 | 2010-03-03 | 必诺·罗伊泽有限及两合公司 | Chip module for an rfid system |
Also Published As
| Publication number | Publication date |
|---|---|
| US20160151928A1 (en) | 2016-06-02 |
| JP2016533909A (en) | 2016-11-04 |
| DE102013215706A1 (en) | 2015-02-12 |
| EP3030388A1 (en) | 2016-06-15 |
| WO2015018587A1 (en) | 2015-02-12 |
| CN105980116A (en) | 2016-09-28 |
| US9981398B2 (en) | 2018-05-29 |
| JP6415558B2 (en) | 2018-10-31 |
| ES2833290T3 (en) | 2021-06-14 |
| HK1226026A1 (en) | 2017-09-22 |
| EP3030388B1 (en) | 2020-08-26 |
| MY183430A (en) | 2021-02-18 |
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