CN202838390U

CN202838390U - Ic tag

Info

Publication number: CN202838390U
Application number: CN2011900002914U
Authority: CN
Inventors: 中野登茂子; 宫嵨庆一; 前田义明
Original assignee: Nok Corp
Current assignee: Nok Corp
Priority date: 2010-07-09
Filing date: 2011-06-17
Publication date: 2013-03-27
Anticipated expiration: 2021-06-17
Also published as: KR20120004862U; JP2012018629A; DE212011100117U1; WO2012005101A1

Abstract

The utility model provides an IC tag which can realize lightweight and miniaturization, improve the flexibility and prevent a coverage part from cracking even though the coverage part swells, and a method of manufacturing the IC tag with a high production rate. The IC tag (10) is characterized by comprising a substrate (11) having the flexibility, an antenna part (12) formed on the substrate (11), an IC chip (13) electrically connected with the antenna part (12), and the coverage part (14) which is formed by at least any one material of resin and rubber and used for covering the IC chip (13); and the coverage part (14) is only arranged on the surface side, which is provided with the IC chip (13), of the substrate (11).

Description

IC tag

Technical field

The present invention relates to have IC tag and the manufacture method thereof of the covering section that is consisted of by resin material or elastomeric material.

Background technology

In the past, be widely used the RFID technology in order to carry out the management of product.Here, when the fibres such as coverlet that use are installed IC tag, provide a kind of IC tag in to uniform or hotel, it can be cleaned with fibre.Therefore, the IC tag that is installed on these goods needs to bear external force and the solution that uses when cleaning has patience.Therefore as the known IC tag that is installed on fibre, it is provided with the covering section that is consisted of and covered the IC tag main body by resin material or elastomeric material.

In conjunction with Figure 11 and Figure 12 IC tag in conventional example is described.Figure 11 is the planimetric map of the IC tag in the existing example.Figure 12 is the constructed profile of the IC tag in the existing example.In addition, Figure 12 is equivalent to the CC section among Figure 11.

IC tag 100 in the existing example possesses: the substrate 110 of resin molding etc., the IC chip 130 of being located at the antenna part 120 on the substrate 110 and being electrically connected with antenna part 120.And, utilize the covering section 140 that is consisted of by resin material or elastomeric material to cover the IC tag body that is consisted of by substrate 110, antenna part 120 and IC chip 130.

In this IC tag 100, owing to IC tag main body coating cap 140 covers, so can protect IC chip 130 not to be subjected to the impact of external force or cleansing solution.In addition, covering section 140 is made of resin material or elastomeric material, so IC tag 100 integral body have pliability and flexibility, thereby can be applicable to preferably the fibres such as uniform, coverlet.

But, as mentioned above, because IC tag 100 also is used to the clothes such as uniform, so require further lightweight, miniaturization and improve pliability.

In addition, in the IC tag 100 of existing example, exist under the effect of cleansing solution, because of moderate finite deformation, so that covering section 140 produces be full of cracks near IC chip 130.In conjunction with Figure 13 this point is described.Figure 13 is the key diagram for the problem of the IC tag of the existing example of explanation.

The IC tag 100 that consists of as mentioned above, with the IC tag main body as built in items by carrying out insert-molding, and form covering section 140.Covering section 140 has the characteristic of meeting cleansing solution and expanding, and is expanded to about 3 times of original volumes because of expansion.

Here, for substrate 110, if covering section 140 equate in a side that is provided with IC chip 130 with at the thickness of an opposite side, even then the covering section 140 of both sides to expand because of expansion also be that amount with identical is expanded, so substrate 110 and indeformable.But, when the thickness of both sides not simultaneously, amount of expansion is different, so substrate 110 flexural deformations.

When substrate 110 crooked and so that when being provided with a side of IC chip 130 and protruding, then no problem.With respect to this, so that when not being provided with a side of IC chip 130 and protruding, then concentrate at the end (position among Fig. 3 shown in the X) of IC chip 130 stress, covering section 140 produces be full of cracks when deforming.This be full of cracks arrives the surface of covering section 140, then can't protect IC chip 130.

The prior art document

Patent documentation

Patent documentation 1: TOHKEMY 2005-56362 communique

Summary of the invention

The problem that invention will solve

The object of the present invention is to provide and a kind ofly realize lightweight, miniaturization and can improve pliability, even and the expand manufacture method of the high productivity in the time of also can suppressing covering section and the IC tag of be full of cracks occurs and generate this IC tag of covering section.

Be used for solving the means of problem

The present invention has adopted following means in order to solve above-mentioned problem.

That is, IC tag of the present invention is characterized in that, possesses: have flexual substrate; Be formed at the antenna part of this substrate; The IC chip that is electrically connected with this antenna part; And covering section, it covers described IC chip, is made by at least any one material that forms in resin and the rubber, and described covering section only is arranged on surface one side that possesses described IC chip on the described substrate.

According to the present invention, because covering section only is arranged at surface one side that possesses the IC chip on the substrate, so compare with the structure that covers the integral body of IC tag main body with covering section, just can realizes lightweight, miniaturization and can improve pliability.Owing to reduced the amount of the material that is used for covering section, so but cutting down cost also.And, even covering section, makes IC tag when distortion because of expansions such as expansions, because that substrate is provided with the direction that a side of IC chip protrudes in the substrate is crooked, so near the covering section the IC chip, can not produce be full of cracks.

Preferred described covering section covers the zone that possesses described IC chip partly.

According to said structure, compare with the situation that is provided with the whole surface of IC chip one side in the covering section covering substrate, just can further realize lightweight, miniaturization and can improve pliability.In addition, can further suppress the substrate deformation that the expansion because of covering section causes.

In addition, in the manufacture method of IC tag of the present invention, this IC tag possesses: have flexual substrate; Be formed at the antenna part of this substrate; The IC chip that is electrically connected with this antenna part; And covering section, it covers described IC chip, made by at least any one material that forms in resin and the rubber, described covering section only is arranged on the surface of a side that possesses described IC chip on the described substrate, the manufacture method of described IC tag is characterised in that, comprises following operation: have a plurality of antenna parts of flexual substrate material formation; Each antenna part that is formed at described substrate material is installed respectively the IC chip; Substrate material that a plurality of IC chips are installed as built in items, is used by at least any one material that forms in resin and the rubber and carried out insert-molding, form covering section in the surface of a plurality of IC chips of possessing of described substrate material one side; And by insert-molded article being carried out stamping-out processing, form a plurality of IC tag.

According to the present invention, by the manufacturing process of one-period, just can obtain a plurality of IC tag that are formed with covering section in surface one side that possesses the IC chip.In addition, the built in items in the present embodiment is the substrate material that a plurality of IC chips are installed, therefore, can be for the production quantity of IC tag of expectation, reduce the number of times that loads the positioning operation of built in items in the mould.That is, if order is m with the production number of IC tag, the number (number of antenna part is also identical) of IC chip that order is installed on substrate material is during for n, and then the number of times of the positioning operation of location built in items is (m/n) in the mould.

In the operation of the described covering of formation section, a plurality of IC chips on described substrate material cover the described covering of formation section in the lump, and so that forming in the zone of IC tag by the processing of described stamping-out, described covering section covers the zone that possesses described IC chip partly.

Thus, it is few to be used for the quantity of material of covering section.In addition, compare with the situation that each IC chip is individually formed respectively covering section, can reduce the entry number of mould, therefore can simplify the structure of mould and can suppress the quantity of waste material (residuing in the material of entry).

The material that is used for described insert-molding is, need not applying adhesive on the substrate material that described IC chip is installed and can make covering section be bonded in the adhesive rubber of this substrate material.

Thus, do not need for making substrate material and covering section bonding, and before the insert-molding on substrate material the operation of applying adhesive, can further improve throughput rate.

In addition, but above-mentioned each structure appropriate combination use.

The invention effect

As described above, according to IC tag of the present invention, just can realize lightweight, miniaturization and can improve pliability, in addition, according to the manufacture method of IC tag of the present invention, can boost productivity.

Description of drawings

Fig. 1 is the planimetric map of the IC tag of embodiments of the invention 1.

Fig. 2 is the constructed profile (among Fig. 1, AA sectional view) of the IC tag of embodiments of the invention 1.

Fig. 3 is the planimetric map that is illustrated in the intermediate product in the manufacture process of manufacture method of IC chip of the embodiment of the invention 1.

Fig. 4 is the planimetric map of the intermediate product in the manufacture process of manufacture method of IC chip of expression embodiments of the invention 1.

Fig. 5 is the planimetric map of the intermediate product in the manufacture process of manufacture method of IC chip of expression embodiments of the invention 1.

Fig. 6 is the figure of the state after the final operation of manufacturing process of manufacture method of the IC chip of expression embodiments of the invention 1 finishes.

Fig. 7 is the planimetric map of the IC tag of embodiments of the invention 2.

Fig. 8 is the constructed profile (among Fig. 7, BB sectional view) of the IC tag of embodiments of the invention 2.

Fig. 9 is the planimetric map of intermediate product of manufacture process of manufacture method of the IC chip of expression embodiments of the invention 2.

Figure 10 is the figure of the state after the final operation of manufacturing process of manufacture method of the IC chip of expression embodiments of the invention 2 finishes.

Figure 11 is the planimetric map of the IC tag in the existing example.

Figure 12 is the constructed profile (among Figure 11, CC sectional view) of the IC tag in the existing example.

Figure 13 is the key diagram of the problem points of the IC tag in the existing example of explanation.

Symbol description

10,20 labels

11,21 substrates

11a, 21 a substrate materials

12,22 antenna parts

13,23 IC chips

14,14a, 24,24a covering section

Embodiment

Below in conjunction with accompanying drawing, describe in detail for implementing embodiments of the present invention with example according to embodiment.But, unless have specific record, then be recorded in the component parts in the present embodiment size, material, shape, its relatively configuration etc. not delimit the scope of the invention.

(embodiment 1)

IC tag and the manufacture method thereof of embodiments of the invention 1 are described in conjunction with Fig. 1～Fig. 6.In addition, the IC tag of present embodiment is used for RFID, is particularly useful for being installed in the IC tag on the fibre.

＜IC tag 〉

The IC tag of embodiments of the invention 1 is described in conjunction with Fig. 1 and Fig. 2.The IC tag 10 of present embodiment possesses: the substrate 11 with pliability (flexibility); Be formed at the antenna part 12 of substrate 11; The IC chip 13 that is electrically connected with antenna part 12.

And, be provided with in the IC tag 10 of present embodiment for the covering section 14 that covers IC chip 13.This covering section 14 is made by at least any one the material in resin and the rubber.In addition, this covering section 14 only is located at the surface that possesses IC chip 13 one side of substrate 11.In addition, in the present embodiment, covering section 14 covers the zone that possesses IC chip 13 partly.That is, the major part of cover antenna section 12 is not regional.

The manufacture method of＜IC tag 〉

The manufacture method of the IC tag of embodiments of the invention 1 particularly, is described in conjunction with Fig. 3～Fig. 6.

＜＜operation 1〉〉

Substrate material 11a in the pliability (flexibility) with resin molding etc. forms a plurality of antenna parts 12.As the example of the employed material of substrate material 11a, tygon, PEN, polyimide can have been listed.In addition, in this operation, can use common FPC(flexible printed circuit) manufacturing technology.Because this technology is known technology, so description is omitted, and about the formation of antenna part 12, for example, can carries out serigraphy by etching Copper Foil on resin molding or at resin molding, and form antenna part 12.

Fig. 3 represents the planimetric map of the intermediate product that obtain by this operation.This intermediate product structure is: clip antenna part 12, be respectively equipped with basement membrane and epiphragma as substrate material in the two sides side.The thickness of these intermediate product for example is about 0.2mm.

＜＜operation 2〉〉

For the intermediate product that in operation 1, obtain, each antenna part 12 that is formed at substrate material 11a is installed respectively IC chip 13.Fig. 4 represents the planimetric map of the intermediate product that obtain by this operation.

＜＜operation 3〉〉

Take the intermediate product of operation 2 gained as built in items, carry out insert-molding.As moulding material, can use the composite material of resin, rubber or resin and rubber.As concrete example, can list: silicon rubber, fluororubber, nitrile rubber, butyl rubber, EPDM (ethylene-propylene-diene rubber) etc.When using these materials, the surface of the intermediate product of operation 2 gained and the back side respectively after the applying adhesive, are being disposed at it in mould.In the IC tag 10 of making by the manufacture method of present embodiment, the layer that is made of bonding agent also exposes, so use the material of wash resistant liquid as the material of this bonding agent.For example, when using fluororubber as moulding material, can use fluorine-containing bonding agent.

On the other hand, when using adhesive rubber (for example, cohesive silicon rubber (the chemicals X-34-1277A/B(of SHIN-ETSU HANTOTAI trade name) etc.)) during as moulding material, the intermediate product of operation 2 gained directly can be disposed in the mould.In this case, can omit the operation of applying adhesive.

By above operation, one side of the surface with a plurality of IC chips 13 on substrate material 11a forms the covering 14a of section.Fig. 5 represents the planimetric map of the intermediate product that obtain by this operation.In addition, when the thickness of IC chip 13 was the 0.5mm left and right sides, the maximum ga(u)ge of the 14a of covering section (being provided with the thickness at the position of IC chip 13) can be about 1mm.

Here, in the present embodiment, a plurality of IC chips 13 on the covering substrate material 11a and form the covering 14a of section in the lump, and so that be processed to form in the zone of IC tag 10 at the stamping-out by subsequent processing, the 14a of covering section covers the zone that possesses IC chip 13 partly.

＜＜operation 4〉〉

To the intermediate product of operation 3 gained, use Thomson cutter (Thomson blade) etc. carries out stamping-out processing.Thick line L among Fig. 6 represents the stamping-out line.As shown in the figure, surround respectively a plurality of antenna parts 12 that IC chip 13 respectively is installed around and carry out stamping-out.

Obtain a plurality of (being 12 in the present embodiment) IC tag 10 by this stamping-out processing.In Fig. 6, also represented to process by stamping-out the planimetric map of the IC tag 10 that obtains.

The boundary member of substrate 11 and covering section 14 is exposed in the side of the IC tag 10 that obtains in the manufacture method by present embodiment.Therefore, as mentioned above, to by the intermediate product applying adhesive of operation 2 gained the time, use cleaning with the material of the indefatigable material of solution as bonding agent.

The IC tag of＜present embodiment and the advantage of manufacture method thereof 〉

In the IC tag 10 of present embodiment, because substrate 11 and covering section 14 are the states that are adjacent to, so can not occuring, cleansing solution etc. do not infiltrate situation in the IC tag 10.Therefore, can protect IC chip 13 and IC chip 13 and the connecting portion (the normally connecting portion of welding formation) of antenna part 12 not to be subjected to the impact of external force or cleansing solution.

In addition, in the IC tag 10 of present embodiment, its major part is made of thin substrate 11, and covering section 14 only is set near the zone that is provided with IC chip 13.And this covering section 14 can be made of films such as rubber or resins.Therefore, IC chip 10 is pliability (flexibility) excellence on the whole, can be applicable to the fibres such as dress ornament.But the IC tag 10 of present embodiment is not limited to be applicable to fibre, can also be used for various products.According to environment for use and/or condition, select the material of covering section 14 and on the intermediate product of operation 2 gained the material of this bonding agent during applying adhesive, can protect well IC chip 13 etc.

In addition, covering section 14 only is located at a side surface that possesses IC chip 13 on the substrate 11, therefore, is compared by the structure that covering section covers the integral body of IC tag like that with prior art, just can realize that lightweight, miniaturization also can improve pliability.In addition, owing to reduced the amount of covering section 14 employed materials, can reduce cost.

And, even because covering section 14 expands because of expansion, and make IC tag 10 distortion, because substrate 11 is towards so that substrate 11 is provided with the Direction distortion that a side of IC chip 13 is protruded, so near IC chip 13, can not make covering section 14 produce be full of cracks.

Especially in the present embodiment, covering section 14 is set to cover partly the zone that possesses IC chip 13, so can reduce as much as possible the amount of covering section 14 employed materials.Therefore, can effectively realize lightweight, miniaturization and improve pliability.Also can effectively suppress the distortion that substrate 11 produces because of the expansion of covering section 14.

In addition, in the present embodiment, most zones of antenna part 12 not coating cap 14 cover, and therefore, can suppress the impact that the specific inductive capacity of covering section 14 brings antenna part 12.Therefore, can suppress the variation of thickness of the covering section 14 that produces because of moulding to the impact of reading precision of antenna part 12.

In addition, according to the manufacture method of present embodiment, by the manufacturing process of one-period, just can obtain the IC tag 10 that a plurality of side surfaces possessing IC chip 13 are formed with covering section 14.Built in items in the present embodiment is the substrate material 11a that a plurality of IC chips 13 are installed, therefore, can be for the production quantity of IC tag 10 of expectation, reduce the number of times that loads the positioning operation of built in items in the mould.That is, be m if make the production number of IC tag 10, the number (number of antenna part 12 is also identical) that is installed on the IC chip 13 of substrate material 11a is n, the number of times that then loads the positioning operation of built in items in the mould is (m/n).

In addition, in the operation that forms covering section 14, when forming covering section 14, be a plurality of IC chips 13 on the covering substrate material 11a in the lump, and so that be processed to form by stamping-out in the zone of IC tag 10, cover partly the regional substrate material that possesses IC chip 13.Therefore, compare with the situation that forms separately respectively covering section for each IC chip, can cross entry (gate) number that reduces mould, therefore can simplify the structure of mould and can suppress the amount of waste material (residuing in the material of entry).

(embodiment 2)

Fig. 7～Figure 10 represents embodiments of the invention 2.Be that covering section is set to cover partly the zone that possesses the IC chip in above-described embodiment 1, but in the present embodiment, covering section is set to possess on the covering substrate the whole surface of a side surface of IC chip.

＜IC tag 〉

The IC tag of embodiments of the invention 2 is described in conjunction with Fig. 7 and Fig. 8.The IC tag 20 of present embodiment similarly possesses with the IC tag 10 of above-described embodiment 1: the substrate 21 with pliability (flexibility); Be formed at the antenna part 22 of substrate 21; And the IC chip 23 that is electrically connected with antenna part 22.

And, on the IC tag 20 of present embodiment, also be provided with the covering section 24 that covers IC chip 23.This covering section 24 is made of at least any one material in resin and the rubber.This covering section 24 only is located at a side surface that possesses IC chip 23 of substrate 21.And in the present embodiment, covering section 24 is set to possess on the covering substrate 21 the whole surface of a side surface of IC chip 23.

The manufacture method of＜IC tag 〉

The manufacture method of the IC tag of the embodiment of the invention 2 is described in conjunction with Fig. 9 and Figure 10.

For until operation before the IC chip 23 is installed, namely the operation 1 in above-described embodiment 1 and operation 2 are identical with above-described embodiment 1, and therefore the description thereof will be omitted.The below begins to describe from the operation (operation 3) of carrying out insert-molding.

＜operation 3 〉

The intermediate product of operation 2 gained as built in items, are carried out insert-molding.Having or not of moulding material, bonding agent and bonding agent, identical with the situation of explanation in above-described embodiment 1, therefore the description thereof will be omitted.

By this insert-molding, the face side that possesses a plurality of IC chips 23 on substrate material 21a forms the covering 24a of section.Fig. 9 represents the planimetric map by the intermediate product of this operation gained.When the thickness of IC chip 23 was 0.5mm, the thickness of the 24a of covering section can be about 1mm.

At this, in the present embodiment, the whole surface of the face (surface of IC chip 23 1 sides is installed) of covering substrate material 21a forms the covering 24a of section.

＜＜operation 4〉〉

To the intermediate product of operation 3 gained, use Thomson cutter etc. carries out stamping-out processing.Thick line L among Figure 10 represents the stamping-out line.As shown in the figure, surround respectively a plurality of antenna parts 22 that IC chip 13 respectively is installed around and carry out stamping-out.

Obtain a plurality of (being 12 in the present embodiment) IC tag 20 by this stamping-out processing.In Figure 10, also represented to process by stamping-out the planimetric map of the IC tag 20 that obtains.

The boundary member of substrate 21 and covering section 24 is exposed in the side of the IC tag 20 that obtains in the manufacture method by present embodiment.Therefore, identical with the situation of embodiment 1, to by the intermediate product applying adhesive of operation 2 gained the time, use cleaning with the indefatigable material of solution as bonding agent.

As mentioned above, according to IC tag 20 and the manufacture method thereof of present embodiment, also can obtain the effect identical with the situation of above-described embodiment 1.But under the situation of present embodiment, because covering section 24 covering substrates, 21 one-sided whole surfaces, so compare with the situation of embodiment 1, relatively poor on lightweight, miniaturization and pliability.In addition, when expanding because expansion waits in covering section 24, the deflection of IC tag 20 is also large than embodiment 1.And then when the uneven thickness in covering section 24, the specific inductive capacity of covering section 24 can impact antenna part 22.But under the situation of present embodiment, owing to utilize the one-sided whole surface of covering section 24 covering substrates 21, so compare with the situation of embodiment 1, can simplify the structure for the mould of insert-molding.

Claims

1. IC tag is characterized in that possessing:

Has flexual substrate;

Be formed at the antenna part of this substrate;

The IC chip that is electrically connected with this antenna part; And

Covering section, it covers described IC chip, is made by elastomeric material,

Described covering section only is arranged on surface one side that possesses described IC chip on the described substrate.

2. IC tag according to claim 1 is characterized in that,

Described covering section covers the zone that possesses described IC chip partly.