JP2009166487A - Flat pressing machine, laminating apparatus and laminating method using them - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flat pressing machine, by which a laminated body can be smoothened, irrespective of unevenness of a base material, cost of a strip-like film for transfer is reduced, a laminated resin is adhered to the strip-like film and does not scatter at the time of peeling the laminated body, and furthermore, a rough surface of the strip-like film is not transferred to the laminated body, and to provide a laminating apparatus, and a laminating method using them. <P>SOLUTION: The flat pressing machine (3) presses a laminated body, in which a resin layer (8d) is formed on an uneven surface of a base material (8a), by using facing pressing means, and smoothens a surface of the laminated body. The flat pressing machine includes: a pair of strip-like films; a transfer means for transferring the both strip-like films in the longitudinal direction of the film, in a state where the laminated body is sandwiched between the both strip-like films; a hermetically sealed space forming means (30) which forms a hermetically sealed space section (34) for pressing the laminated body by both pressing means (12, 13) in a depressurized state; and a pressure control means for controlling inside the hermetically sealed space section (34) in the depressurized state. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a flat press apparatus and a laminating apparatus used in the production of a printed circuit board and the like, and a laminating method using the same, and more specifically, on a substrate having irregularities such as a printed circuit board. The present invention relates to a flat press apparatus and a laminating apparatus useful for a build-up method and a laminating method using them, in which a resin layer is smoothed.

  In recent years, with increasing miniaturization and performance of electronic devices, various printed circuit base materials have become denser and multilayered, and build-up methods have been adopted even for circuit boards that previously did not employ build-up methods. The number of products being increased. In such multilayering of printed circuit boards, a thermosetting resin composition or a photosensitive resin composition is used as an electrical insulating layer, and the above thermosetting resin composition is formed on a previously formed inner layer or outer layer circuit. Alternatively, the photosensitive resin composition is applied or sprayed and then dried, or a film-like resin layer made of the thermosetting resin composition or the photosensitive resin composition is laminated. In addition, a copper foil or a support film is usually laminated on one side of the film-like resin layer. In the case of a copper foil, half-etching or whole-surface etching is performed after the lamination, and in the case of a support film, The method of forming a circuit by patterning with light again using a photoresist film after making a hole by exposure development with laser or ultraviolet light, then copper plating, and using the so-called build-up method effectively It has been.

  Conventionally, the build-up method has been mainly used for special applications that require high-density and multi-layer wiring such as a package substrate for a microprocessor unit (hereinafter referred to as “MPU”). However, recently, the performance of various package substrates such as package substrates for chipsets that function in conjunction with MPUs on personal computers and workstations, and package substrates for video chips related to screen display of personal computers such as graphic accelerators. There has been a growing demand for crystallization. In addition, there is an increasing demand for increasing the storage capacity of a memory card, which is a card-type storage device that uses a flash memory or the like as a data storage medium. As a result, the build-up method employed in the MPU package substrate has come to be used in order to achieve market requirements for various package substrates and memory card type storage devices other than these MPUs.

In such a situation, the latest MPU is desired to further improve the data processing capability. Arithmetic processing performance is improved by increasing the operating frequency of the MPU. However, the power consumed by the MPU increases in proportion to the operating frequency. In general, in order to increase the operating frequency of the MPU, the circuit scale of the MPU increases.
As the operating frequency of the MPU is increased, the power consumption increases. As a countermeasure, multiple processor cores with low power consumption by suppressing the circuit scale and operating frequency are installed in the MPU, and the processing is distributed among the processor cores, thereby improving the processing performance of the MPU and reducing the power consumption. A method is proposed. Such a system is sometimes referred to as a multi-core system, and there is an increasing demand for a dual-core MPU in which two processor cores are integrated in one package and a multi-core MPU in which a plurality of cores are integrated.
With the multi-core method, the power consumption of the processor core alone is reduced. However, even when the multi-core method is applied, data exchange between the processor core and the processor core is newly required, and power consumption in these data buses increases. For this reason, the power consumption reduction of the processor core alone does not directly reduce the power consumption, and the power consumption of the MPU tends to increase.

As described above, as the power consumption of the MPU increases, the wiring pattern for supplying power to the MPU chip of the package substrate also requires a cross-sectional area corresponding to the power consumption. For this reason, a power supply wiring pattern having a pattern height higher than that of the conventional power supply wiring pattern may be adopted, and accordingly, the volume of the electrically insulating resin layer filling the space between the wiring patterns of the MPU package substrate increases. There is.
On the other hand, the build-up method is increasingly used for a package substrate for a chip set other than the MPU, a video chip package substrate, or a card-type storage device. In applications other than these MPUs, there is a case in which there is no circuit pattern over a wide range, although a copper pattern is not required to be as high as the wiring pattern of the MPU. In such a case as well, as in the case of the MPU, the volume of the electrically insulating resin layer that fills the pattern increases.
In the build-up method described above, a technique for flatly laminating an insulating resin layer on an uneven substrate is important. As such a technique, as shown in FIG. 17, a film-like resin laminating apparatus has been proposed in which a package substrate for MPU has been developed as a main application.

  This film-like resin laminating apparatus includes an upper plate 82 with a flexible sheet 82a on the lower surface, a lower plate 83 with a flexible sheet 83a on the upper surface, and both upper and lower plates when the upper plate 82 and the lower plate 83 are sealed. A space 84 formed between the flexible sheets 82a and 83a, a vacuum laminating apparatus 81 having pressure adjusting means (not shown) for adjusting the pressure of the space 84, and an upper press fixed to the column 86 A flat press device 85 having a block 87 and a lower press block 88 that can move up and down with the support column 86 as a guide. Then, a film-like resin layer 89b in which a resin layer is applied and dried on a support film cut to a size substantially smaller than the substrate 89a on both surfaces of the substrate 89a having an uneven surface, is wound around a roll before cutting. The temporary laminated body 89, which is temporarily fastened), is sandwiched between the upper and lower conveying films 90 and conveyed to the vacuum laminating apparatus 81, and the pressure is reduced by the upper and lower flexible sheets 82a and 83a of the vacuum laminating apparatus 81. The film-like resin layer 89b is laminated on the substrate 89a by heating and pressurizing, and the laminated body 89 (the surface of the laminated body 89 has unevenness due to the unevenness of the substrate 89a) is flattened. The air pressure is reduced to atmospheric pressure by a flexible metal plate 92 which is transported to 85 and fixed to the upper press block 87 and the lower press block 88 of the flat press device 85 via a heating block 91 or the like. Applying heat and pressure, and so as to smooth the surface of the laminate 89. In FIG. 17, 93 is a transport film unwinding roll, and 94 is a transport film winding roll.

Further, in the above laminating apparatus, since heating and pressurization by the flat press apparatus 85 is performed under atmospheric pressure, when a film whose surface is not roughened is used as the transport film 90, When the laminate 89 and the transport film 90 and the transport film 90 and the flexible metal plate 92 are in close contact with each other during pressurization, the laminate 89 and the transport film 90 and / or the transport film 90 and the flexible metal plate 92 are contacted. Bubbles remain between them, and a concave portion is formed on the surface of the laminate 89 facing the portion where the bubbles remain, so that the surface of the laminate 89 cannot be smoothed. Therefore, a roughened film having a rough surface such as a mat film whose surface is roughened by mat processing is used as the transport film 90, and the gap between the laminate 89 and the transport film 90 is used. And / or leaking the bubble between the film 90 for conveyance and the flexible metal plate 92 is performed (for example, refer patent document 1).
JP 2004-122553 A

However, as described above, even when a roughened film having a rough surface is used as the transport film 90, heating and pressurization with the flat press device 85 is performed under atmospheric pressure. Of the irregularities on the surface of the substrate 89a, when a pattern having a height higher than the pattern of the conventional MPU package substrate is adopted, such as a recent MPU package substrate, the inner side surrounded by the high pattern There is a possibility that bubbles remain in the recesses. If air bubbles remain in the recesses in this way, it takes time for the air bubbles to leak from between the roughened surface of the transfer film 90 and the substrate 89a, and the recesses of the substrate 89a can be prevented from leaking. It is confined in the space between the transport films 90. Therefore, although the film-like resin layer 89b flows into the concave portion, the surface of the laminate 89 needs to be heated and pressurized for a long time with the flat press device 85. May become an obstacle and the surface of the laminate 89 cannot be smoothed. Similarly, in chip set and video chip package substrates and card-type storage devices that have recently adopted the build-up method, bubbles remain in areas where there is no circuit pattern over a wide range. Since the remaining bubbles exist, it is necessary to heat and pressurize the surface of the laminate 89 with the flat press device 85 for a long time, and the trapped air becomes an obstacle even if heated and pressurized for a long time. There was a problem that the surface of 89 could not be smoothed. Further, when using a resin layer that requires a high temperature such that the heating temperature exceeds 120 ° C., before the remaining bubbles leak from between the roughened surface of the transport film 90 and the substrate 89a, The roughened surface of the transport film 90 is flattened. For this reason, the path | route where a bubble leaks is lost, a bubble is confined, resin cannot flow into a recessed part, and the problem that the surface of a resin layer cannot be smoothed generate | occur | produced.
Further, since a film having a rough surface such as a mat film is used as the transport film 90, the resin that has oozed out from the peripheral edge of the film-like resin layer 89b when the laminate 89 is smoothed. If it adheres to the film 90 for conveyance, there is a possibility that the exuded resin may bite into the roughened surface. The encroached resin cools and hardens and becomes brittle. Therefore, when the transport film 90 is peeled off from the laminated body 89 when the laminated body 89 is discharged from the laminating apparatus, the resin that bites into the roughened surface becomes fine debris around the periphery. Scattered and easily adsorbed to the surface of the laminate 89 by static electricity. Further, when the support film of the film-like resin layer 89b is peeled off by an auto peeler in the subsequent step, the scattered resin having a thickness of several tens of microns adheres to the smoothed laminate 89 in a heated state. If it is cured and fixed, the quality of the product may be reduced, resulting in a product defect. On the other hand, in some cases, the surface of a laminate (not shown) obtained by applying and drying a liquid resist on an uneven substrate 89a may be flattened using a flat press device 85. When the transport film 90 having a roughened surface is transported to a flat press device 85 and heated / pressurized, the rough surface of the roughened film comes into direct contact with the surface of the laminate. There is a risk that the unevenness of the film is transferred to the surface of the laminate.

  The present invention has been made in view of such circumstances, and when the unevenness of the uneven surface of the substrate is deep, the unevenness of the laminate due to the deep unevenness can be smoothed, If there is a recess that is not deep but has no wiring pattern, the recess without the wiring pattern can also be smoothed, and more than a film whose surface is roughened, such as a matte film on a belt-like film for transportation. It is possible to use a smooth belt-like film for transportation that is not roughened on the surface at a low cost, reducing the running cost of the belt-like film, and at the same time, the laminated resin is a belt-like film for transportation. Press and laminating apparatus that does not scatter when peeled off and peel off the laminated body, and further does not transfer the rough surface of the belt-like film for transportation to the laminated body, and a laminating method using them To the provision of its purpose.

  In order to achieve the above object, the present invention is provided with press means facing each other, and by these both press means, a resin layer is formed on the concavo-convex surface of the substrate having concavo-convexities on at least one of the front and back surfaces. A flat press device for smoothing the surface of the laminate by pressing the laminate, and a pair of strip films inserted between the pressing means in a mutually opposing manner, and the laminate between the strip films. Transporting means for transporting the two belt-like films in the longitudinal direction in a sandwiched state, a sealed space forming means for forming a sealed space portion for pressing the laminate by the both pressing means under reduced pressure, and the above A flat press device provided with a pressure control means for controlling the inside of a sealed space to a reduced pressure state is a first gist, and the flat press device has a pair of band-like films whose surfaces are not roughened. The second gist is a flat press device using a slab, and press means opposite to each other are installed, and by these both press means, a film-like resin material is temporarily attached to the concavo-convex surface of the substrate having concavo-convexities on at least one of the front and back surfaces. A third aspect of the present invention is a lamination apparatus comprising a vacuum laminating apparatus that presses the temporary laminated body to form a laminated body and the flat pressing apparatus, and the flat pressing apparatus is used to form irregularities on at least one of the front and back surfaces. A lamination method of pressing a laminate formed by laminating a resin layer on the concavo-convex surface of a substrate having the smoothing of the concavo-convexity of the laminate is a fourth gist, and using the vacuum laminating apparatus, On the other hand, the laminate obtained by pressing the temporary laminate obtained by temporarily attaching the film-like resin material to the irregular surface of the substrate having irregularities is further pressed using the flat pressing device to smooth the irregularities of the laminate. The lamination method of the fifth aspect.

  In the flat press apparatus of the present invention, a pair of strip-shaped films that sandwich and convey the laminated body are used, and pressing by both pressing means is performed in a reduced pressure state. For this reason, even when the uneven surface of the base material is deep or when there is a recess that is not deep but has no wiring pattern, it is between the laminate and both belt films and / or both press films and press Since bubbles do not remain between the press surface of the means, the resin layer can be flowed into the recess, and the surface of the laminate can be smoothed.

  Further, since the pressing is performed in a reduced pressure state, the band-shaped film that sandwiches and conveys the laminated body is pressed between the laminated body and the two band-shaped films and / or the pressing of both the band-shaped film and the two pressing means. It is not necessary to use a belt-shaped film for transportation whose surface is roughened in order to leak bubbles remaining between the surfaces. As described above, when the surfaces of the pair of strip films are not roughened, the cost of manufacturing can be reduced because the strip films are inexpensive. Further, since the surfaces of the two band-like films are not roughened, the laminated resin layer is scattered when the two band-like films are peeled off from the laminate as in the conventional example, or the mat is formed during heating / pressing. There is no risk of the rough surface of the film being transferred to the surface of the laminate. On the other hand, in the laminating apparatus and the laminating method of the present invention, the above flat press apparatus is used, and the above-described excellent effects are exhibited.

  Further, in the flat pressing apparatus of the present invention, the pressing means facing each other advance and retract the at least one pressing means with respect to the other pressing means by advancing and retracting a cylinder rod connected to at least one of the both pressing means. A hydraulic cylinder, air cylinder, or servo motor and a pair of frames disposed opposite to each other between the press means are provided, and one end of one frame is fixed to one press means in an airtight manner. Then, one end opening of the other frame is fixed to the other press means in an airtight manner, and the other end openings of the both frames are brought into airtight contact with the advancement of the at least one press means and sealed. In the case where the space portion is formed, the hydraulic cylinder, the air cylinder or the servo motor is operated to advance the at least one pressing means. By, it is possible to form a closed space between the two press blocks.

  Further, in the flat press device of the present invention, when a blocking means for preventing the advance of one press means that advances and retreats with respect to the other press means when the pressure control means depressurizes the inside of the sealed space is provided. In the state in which the inside of the sealed space is not sufficiently depressurized during the depressurization, the one pressing means does not advance and press the laminated body by the suction force generated by the depressurization. .

  Further, in the flat press device of the present invention, the belt-like film adhered to at least one of the pressing surfaces of the both pressing means during the pressing is moved away from each other by relatively moving the both pressing means after pressing. In the case where a peeling means for peeling from at least one of the press surfaces is provided, both strip films can be easily peeled from both pressing means by the peeling means after the pressing by the both pressing means. Thereby, when the strip | belt-shaped film stuck on the said press surface winds up a strip | belt-shaped film in order to convey a laminated body, it does not become trouble.

  Further, in the flat press device of the present invention, when the resin layer formed on the uneven surface of the substrate having unevenness on at least one of the front and back surfaces is made of a film-like resin layer, the uneven surface of the substrate is The resin layer can be formed by stacking the film-like resin material and pressing it under reduced pressure.

  Furthermore, in the flat press apparatus of the present invention, when the resin layer formed on the uneven surface of the substrate having unevenness on at least one of the front and back surfaces is made of a liquid resist, after applying or spraying the liquid resist, etc. The resin layer can be formed by drying.

  Further, in the laminating apparatus of the present invention, pressing means opposite to each other are installed, and by these both pressing means, temporary lamination in which a film-like resin material is temporarily attached to the uneven surface of the substrate having unevenness on at least one of the front and back surfaces. When a vacuum laminating apparatus for pressing a body to form a laminated body and the flat pressing apparatus are provided, the smoothing of the surface of the laminated body is further improved.

  In the present invention, the vacuum laminating apparatus has a pair of pressing means, and the pair of pressing means is relatively aligned along a pair of opposing plates and the opposing surfaces of these plates facing each other. A pair of flexible sheets disposed in a direction and a sealed space forming a sealed space portion between the pair of plates for pressing the temporary laminate with the pair of flexible sheets under reduced pressure. Means, a first pressure adjusting means capable of adjusting the pressure in the sealed space, and at least one of the two flexible sheets and a plate on which the at least one flexible sheet is disposed. And a second pressure adjusting means capable of adjusting the pressure in the gap, and at least one of the plates is connected to a cylinder rod of a hydraulic cylinder or an air cylinder. , That the diaphragm-type vacuum laminator. The vacuum laminating apparatus has a pair of pressing means, and the pair of pressing means is arranged in a mutually opposing manner along a pair of opposing plates and opposing surfaces of the two plates facing each other. A pair of elastic sheets, a sealed space forming means for forming a sealed space portion between the pair of plates for pressing the temporary laminate with the pair of elastic sheets under reduced pressure, and A vacuum laminating apparatus provided with pressure adjusting means capable of adjusting pressure and having at least one of the two plates connected to a cylinder rod of a hydraulic cylinder or an air cylinder is called a rubber press type vacuum laminating apparatus.

  Next, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to this embodiment.

  FIG. 1 shows an embodiment of the laminating apparatus of the present invention. In this embodiment, the laminating apparatus is composed of a strip-shaped film (conveying film) unwinding section 1, a rubber press type vacuum laminating apparatus 2, a flat press apparatus 3, and a strip-shaped film (conveying film) winding section 4. The substrate 8a (see FIG. 3, FIG. 10 and FIG. 11) in this order from the upstream (the strip-shaped film unwinding portion 1) to the downstream (the strip-shaped film winding portion 4) in the flow direction (see the arrow in FIG. 1). It is arranged.

  First, the flat pressing device 3 (see FIG. 2), which is a characteristic part of the laminating device, will be described. This flat pressing device 3 heats and pressurizes the laminated body 8 (see FIG. 11) conveyed from the vacuum laminating device 2 by both upper and lower belt-like films (conveying films) 5 and 6 for transportation described later, The unevenness on both the front and back surfaces of the laminate 8 is smoothed (see FIG. 3). In FIG. 3, 8d is a resin layer of the laminate 9 heated and pressed by the flat press device 3, and the surface is smoothed.

  As shown in FIG. 2, the flat pressing device 3 includes a plurality of columns 11a (only two are shown in FIG. 2) erected on the press table 11, and bolts, nuts, and the like on the columns 11a. An upper press block (pressing means) 12 fixed by the fixing means 11b, a lower press block (pressing means) 13 attached to the respective pillars 11a so as to be vertically movable, and the like. The lower press block 13 is connected to a hydraulic cylinder or an air cylinder 15 via a joint 14, or the joint 14 is connected to a servo motor (not shown) and a gear head. The hydraulic cylinder or air cylinder 15 or the servo motor By operation, the piston rod 15a is moved up and down (according to ascending (advancing) and descending (retreating)).

  With respect to the upper and lower press blocks 12, 13, in this embodiment, the upper press block 12 includes a flat upper heat insulating material 17, an upper hot platen 18, a flat upper shock absorber 19 and an upper flexible member on the upper base layer 16. The metal plate 20 is composed of the upper plate fixed in this order from the upper side, and the lower press block 13 has a flat lower heat insulating material 22, a lower heat plate 23, and a flat lower buffer on the lower base layer 21. The material 24 and the lower flexible metal plate 25 are fixed in this order from the lower side.

  Moreover, the said plane press apparatus 3 is provided with the movable vacuum frame (sealed space formation means) 30 for forming the sealed space part 34, as shown in FIG. This movable vacuum frame 30 is shown in FIG. 5 (in this FIG. 5, both upper and lower heat insulating materials 17 and 22, upper and lower heating plates 18 and 23, upper and lower cushioning materials 19 and 24, strip films 5 and 6, and both upper and lower flexible metal plates. As shown in FIGS. 6 and 7, the upper fixed frame portion (one frame portion) 31 having a substantially rectangular frame shape is hermetically fixed to the lower surface of the upper base layer 16 as shown in FIG. And a movable frame 32 fixed in an airtight manner on the upper surface of the lower base layer 21. In the upper fixed frame portion 31, a vacuuming nozzle 33 is fixed in a through hole 31a drilled in a peripheral side wall thereof, and this vacuuming nozzle 33 is a pressure control means (both (Not shown). Then, when the upper and lower base layers 16 and 21 are sealed, the vacuum pump of the pressure control means is operated, and the sealed space portion 34 (formed between the upper fixed frame portion 31 and the movable frame 32 by the vacuuming nozzle 33 ( The inside is evacuated, and the pressure of the sealed space 34 can be adjusted (that is, a vacuum state of a predetermined pressure) can be achieved. The pressure of the sealed space 34 is usually 500 Pa or less, preferably 400 Pa or less, more preferably 300 Pa or less. If the pressure is too high, air remains between the laminate 8 and the strip films 5, 6 or between the strip films 5, 6 and the flexible metal plates 20, 25, and the laminate 9 after smoothing (see FIG. 3), the surface remains uneven, and the product tends to be defective.

  The movable frame 32 includes a lower fixed frame portion 35 (the other frame portion) 35 that is fixed in an airtight manner on the upper surface of the lower base layer 21, a movable frame portion 36, and the movable frame portion 36. And a spring 37 which is supported so as to push up in the direction. The upper part of the lower fixing frame part 35 is formed so as to protrude outward on the entire periphery, and an annular seal member 38 is fitted and fixed in a groove 35a formed on the entire periphery of the outer peripheral surface of the protrusion forming part. Has been. The shape of the seal member 38 is preferably lip packing.

  The movable frame portion 36 is externally fitted to the protrusion forming portion of the lower fixed frame portion 35 so as to be slidable in the vertical direction, and is supported by the lower fixed frame portion 35 by a spring 37 in this state. That is, the upper part of the spring 37 is inserted into a plurality of (only two are shown in FIGS. 5 to 7) recesses 36 a formed on the lower surface of the movable frame part 36. It is placed on the lower end protrusion 35 b of the lower fixed frame portion 35. Accordingly, the movable frame portion 36 is supported on the lower fixed frame portion 35 via the spring 37 so as to be movable up and down. Further, the inner peripheral surface of the movable frame portion 36 is in airtight and slidable contact with the seal member 38 of the lower fixed frame portion 35.

  Further, a concave groove 36b is formed on the entire circumference of the upper surface of the movable frame portion 36, and a substantially square annular seal member 39 is fitted and fixed to the concave groove 36b. The sealing member 39 functions to hold the inside of the sealed space 34 in an airtight manner when the upper and lower base layers 16 and 21 are sealed. The seal members 38 and 39 are preferably lip packing. 5 to 7, reference numerals 40a and 40b denote seal members.

  Such a movable vacuum frame 30 raises the lower base layer 21 by the operation of a hydraulic cylinder or air cylinder 15 (see FIG. 2) or a servo motor, so that the lower surface of the upper fixed frame portion 31 and the upper surface of the movable frame portion 36 are moved. Can be used as a sealed space (that is, the upper and lower press blocks 12, 13 can be sealed together). Further, the lower base layer 21 can be raised while the springs 37 are bent, and the lower plate 21 is moved until the lower surface of the movable frame portion 36 comes into contact with the upper surface of the lower end protruding portion 35b of the lower fixed frame portion 35. The laminated body 9 can be pressed between pressing means that are raised and face each other (see FIGS. 4 and 7). The pressurizing condition at this time is set within a range of 0.1 to 2 MPa, and preferably 0.4 to 1.5 MPa.

  The upper heat insulating material 17 is fixed to the lower surface of the upper base layer 16 by fixing means (not shown) such as bolts and nuts. The upper heat plate 18 is fixed to the upper heat insulating material 17 by fixing means (not shown) such as bolts and nuts, and the upper flexible metal plate 20 is attached to the upper heat plate 18 via the upper buffer material 19 such as bolts and collars. It is fixed by fixing means (not shown). The lower heat insulating material 22 is fixed to the upper surface of the lower base layer 21 by fixing means (not shown) such as bolts and nuts. The lower heat plate 23 is fixed to the lower heat insulating material 22 with fixing means (not shown) such as bolts and nuts, and the lower flexible metal plate 25 is attached to the lower heat plate 23 via the lower buffer material 24. It is fixed by fixing means (not shown) such as bolts and collars. Further, when the upper (lower) base layer 16 (21) and the upper (lower) heating plate 18 (23) are directly fixed by fixing means such as bolts and nuts, the upper (lower) side is connected via the bolts and nuts. The heat of the hot platen 18 (23) is easily conducted to the upper (lower) base layer 16 (21), which is not preferable. In the figure, reference numerals 18a and 23a denote sheath-like heaters arranged in parallel inside the upper and lower heating plates 18 and 23, respectively. As for the temperature setting of the upper and lower heating plates 18 and 23, the temperature of the upper heating plate 18 and the lower heating plate 23 is preferably 30 to 200 ° C, more preferably 70 to 140 ° C. When the said temperature is too low, there exists a tendency which cannot make the surface of the laminated body 8 smooth. On the other hand, if the temperature is too high, the resin layer 8c of the laminate 8 tends to undergo thermal decomposition or thermosetting.

  Next, the band-shaped film unwinding section 1 (see FIG. 8) includes an upper band-shaped film unwinding roll (means for applying tension to the upper band-shaped film 5) 41 and a lower-side band-shaped film. A lower belt-shaped film unwinding roll (means for applying tension to the lower belt-shaped film 6) 42 wound around the upper belt-shaped film unwinding roll 41 and an upper and lower belt-shaped film unwinding roll 41. , 42 and a carry-in conveyor 43 disposed between the two. Then, the upper belt-like film 5 unwound from the upper belt-like film unwinding roll 41 has both upper and lower plates 50 and 51 of the vacuum laminating device 2 and upper and lower press blocks 12 and 13 of the flat pressing device 3 (FIG. 1). (See FIG. 9), the belt is wound around the upper winding roll 44 through the upper nip roll 44a (intermittent conveying means) of the belt-shaped film winding unit 4 (see FIG. 9), and the lower belt-shaped film winding roll. Similarly, the lower belt-like film 6 unwound from 42 passes between the upper and lower plates 50 and 51 of the opposing vacuum laminating apparatus 2 and the upper and lower press blocks 12 and 13 of the flat press apparatus 3 and then lowers. It passes between the side nip rolls (intermittent conveying means) 45a and is taken up by the lower take-up roll 45 of the belt-like film take-up section 4. In FIG. 8, 43a is a temporary laminated body stopper which contacts the temporary laminated body 7 and stops it, and can be moved up and down by an air cylinder 43b.

  As the upper and lower belt-like films 5 and 6, it is possible to use a film having a roughened surface such as a mat film, but it is preferable to use a film whose front and back surfaces are not roughened. The reason is that the belt-like films 5 and 6 whose front and back surfaces are not roughened are inexpensive because they do not require roughening in the production. This is because it is possible to reduce this. Further, as will be described later, the resin that has oozed out of any one of the film-like resin material 8b and the resin layers 8c and 8d does not bite into the surfaces of the upper and lower belt-like films 5 and 6, and as a result, is laminated from the flat press device 3. This is because even if the strip films 5 and 6 are peeled from the laminated body 9 when the body 9 is discharged, the encroached resin can be prevented from being scattered as fine fragments. This is also a characteristic part of the laminating apparatus. The non-roughened transparency index on both the front and back surfaces of the upper and lower belt-like films 5 and 6 is a gloss (measured according to JIS K7105-1981. The same applies hereinafter) 150% or more, haze (cloudy) Degree) (Measured according to JIS K7105-1981. The same shall apply hereinafter) 15% or less, Parallel light transmittance (measured according to JIS K7105-1981. The same shall apply hereinafter) 70% or more of the above three indicators Is set within a range satisfying any one of the above. Moreover, as such upper and lower belt-like films 5 and 6, the surface is not roughened polyethylene terephthalate (PET) film, polyethylene film, polypropylene film, nylon film, polyimide film, polystyrene film, fluorinated olefin film, A polycarbonate film is used, and the film thickness is preferably 10 to 100 μm, more preferably 20 to 50 μm. Specifically, “Emblet S-38, Emblet S-50” manufactured by Unitika Co., Ltd. and “Diafoil S100, Diamond Foil T100” manufactured by Mitsubishi Chemical Polyester Film Co., Ltd. are used.

  The width of the upper and lower belt-like films 5 and 6 is such that any one of the heat-pressed film-like resin material 8b and the resin layers 8c and 8d bleeds out of the upper and lower belt-like films 5 and 6 described later. For the purpose of preventing adhesion to the vacuum laminating apparatus 2 and the flat press apparatus 3, the width is usually set to about 5 to 40 mm, preferably about 10 to 30 mm wider than the width of the temporary laminated body 7 and the laminated bodies 8 and 9. When any of the oozed film-like resin material 8b and the resin layers 8c and 8d (hereinafter referred to as oozed resins 8b to 8d) is attached to the vacuum laminating apparatus 2 and the flat press apparatus 3, the attached film-like resin The material 8b and the resin layers 8c and 8d (hereinafter referred to as the adhered resins 8b to 8d) are reattached to the subsequent upper and lower belt-like films 5 and 6. The thickness of the film-like resin material 8d where the exuded resins 8b to 8d adhere is formed to be thinner by the thickness of the adhered resins 8b to 8d, resulting in a defective product. In addition, by always applying a rotational torque in the direction opposite to the unwinding direction to the upper and lower belt-shaped film unwinding rolls 41 and 42, the temporary laminated body 7 and the laminated bodies 8 and 9 are placed on the upper and lower belt-shaped films 5 and 6. Even when the weight is applied, it is possible to apply a tension that can be held substantially horizontally. Such tension is usually set in the range of 0.5 to 150 kN, preferably 20 to 80 kN, and the upper and lower belt-like films 5 and 6 are caused to travel in a state where this tension is applied. Moreover, the conveyance speed of the upper and lower belt-like films 5 and 6 is normally set within a range of 1 to 20 m / min, preferably 5 to 15 m / min, and is driven by nip rolls 44a and 45a.

  The carry-in conveyor 43 acts to receive the temporary laminate 7 and supply the temporary laminate 7 between the upper and lower belt-like films 5 and 6. The temporary laminate 7 includes a substrate 8a having irregularities (hereinafter abbreviated as a substrate 8a), and a film-like resin material 8b (after vacuum lamination) that is overlaid on the irregular surface of the substrate 8a. It becomes the resin layer 8c and becomes the resin layer 8d after the plane pressing) (see FIGS. 3, 10 and 11). As the base material 8a, for example, a printed circuit board provided with a pattern such as copper or solder is used, and a multilayer board used for a build-up method or the like may be used. The thickness and vertical and horizontal sizes of the substrate 8a are not particularly limited, but the thickness is usually 0.1 to 10 mm, preferably 0.1 to 5 mm, and the vertical and horizontal sizes are usually 150 to 800 mm. The preferred range is 250 to 650 mm. As the film-like resin material 8b, for example, a resin composition having a tackiness, adhesiveness, hot-melt property, or a resin composition mainly composed of a resin that softens at a glass transition temperature or higher is used. Those with are useful. Examples of such a resin composition include an epoxy resin, a thermosetting resin composition comprising an epoxy resin, a photosensitive resin composition comprising an ethylenically unsaturated compound and a photopolymerization initiator, and a support film such as a PET film. A material generally applied as a dry film is used. In this embodiment, the temporary laminate 7 has a base material 8a having irregularities on both front and back surfaces, and a predetermined surface that is approximately smaller than the base material 8a in advance by an auto sheet cut laminator or the like on the concave and convex surfaces on both front and back surfaces of the base material 8a. It consists of a pair of upper and lower film-like resin materials 8b cut into sizes and temporarily fixed, but when it has irregularities only on one of the front and back surfaces of the substrate 8a, the film-like resin only on the irregular surfaces The material 8b may be temporarily fixed.

  Furthermore, the present invention also provides a laminating apparatus including a vacuum laminating apparatus such as a rubber press type vacuum laminating apparatus 2 and a diaphragm type vacuum laminating apparatus 10 and a flat press apparatus 3. In this embodiment, a rubber press type vacuum laminator 2 is used as the vacuum laminator.

  In the following, a rubber press type [in this embodiment, a pair of upper and lower elastic sheets (elastic press plates) 54 and 57, which will be described later] is used, which is provided in a pre-process of the flat press device 3 which is a feature of the present invention. The laminating apparatus 2 will be described. This vacuum laminating apparatus 2 heats and presses the temporary laminated body 7 conveyed by the upper and lower belt-like films 5 and 6 in a vacuum state, and a laminated body 8 in which a resin layer 8c is laminated on a base material 8a (see FIG. 11). As shown in FIG. 12, a plurality of columns 47a (only two are shown in FIG. 4) erected on the press table 47, and bolts, nuts, etc. The upper plate 50 fixed by the fixing means 47b, the lower plate 51 attached to the respective columns 47a so as to be movable up and down, and the like. The lower plate 51 is connected to a hydraulic cylinder or an air cylinder 49 through a joint 48, and is moved up and down by the operation of the hydraulic cylinder or the air cylinder 49 (according to the advance / retreat of the piston rod 49a). .

  The upper plate 50 has a flat upper heat insulating material 52, an upper heat plate 53, and an upper elastic material that contacts and pressurizes the upper film resin material 8b (see FIG. 10) of the temporary laminate 7 during vacuum lamination. The press plate 54 is fixed in this order from the upper side, and the lower plate 51 is provided with a flat plate-like lower heat insulating material 55, a lower heat plate 56, and a lower film-like resin material 8b ( A lower elastic press plate 57 that contacts and presses the surface of FIG. 10) is fixed in this order from the lower side. As the constituent material of the upper and lower elastic press plates 54 and 57, rubber materials such as heat-resistant silicone rubber and heat-resistant fluoro rubber, and various resin materials having elasticity are used, and a fiber layer is provided inside. Those are preferably used. By providing this fiber layer, it is possible to improve the durability of the upper and lower elastic press plates 54 and 57, and to suppress the expansion and deformation of the upper and lower elastic press plates 54 and 57 even when pressure is repeatedly applied at a high temperature. The film-like resin material 8b and the resin layer 8c with respect to the base material 8a exhibit excellent effects in followability and adhesion. In FIG. 12, the upper and lower elastic press plates 54 and 57 are directly fixed to the heating plates 53 and 56. However, the present invention is not limited to this. If the metal plate is fixed to the heat plate 53, 56 with a fixing means such as a bolt via a plate-like cushioning material if necessary, the upper and lower elastic press plates 54, 57 can be easily replaced. It becomes.

  The upper heat insulating material 52 is fixed to the lower surface of the upper plate 50 by fixing means (not shown) such as bolts and nuts. The upper heat platen 53 is fixed to the upper heat insulating material 52 by fixing means (not shown) such as bolts and nuts, and the upper elastic press plate 54 is directly bonded and fixed to the lower surface of the upper heat platen 53. The lower heat insulating material 55 is fixed to the upper surface of the lower plate 51 by fixing means (not shown) such as bolts and nuts. The lower heat plate 56 is fixed to the lower heat insulating material 55 by fixing means (not shown) such as bolts and nuts, and the lower elastic press plate 57 is directly fixed to the upper surface of the lower heat plate 56 by bonding. Has been. When the upper (lower) plate 50 (51) and the upper (lower) heating plate 53 (56) are directly fixed by fixing means such as bolts and nuts, the upper (lower) heating plate is connected via the bolts and nuts. The heat of 53 (56) is easily conducted to the upper (lower) plate 50 (51), which is not preferable.

  The upper and lower heating plates 53 and 56 are appropriately provided with heating means capable of controlling the temperature for heating both elastic press plates 54 and 57. Also in this embodiment, a plurality of sheath-like heaters 53a and 56a are arranged in parallel inside the upper and lower heating plates 53 and 56 as the heating means, similarly to the upper and lower heating plates 18 and 23.

  Further, as shown in FIG. 13, the vacuum laminating apparatus 2 includes a movable vacuum frame (sealed space forming means) 30, which is the same as the movable vacuum frame 30 of the flat press device 3. The description thereof will be omitted. In FIG. 13, 59 is a sealed space portion, which corresponds to the sealed space portion 34 of the flat press device 3.

  Below, the strip | belt-shaped film winding part 4 provided in the post process of the plane press apparatus 3 which is the characteristics of this invention is demonstrated. As shown in FIG. 9, the belt-shaped film take-up section 4 is arranged below the upper winding roll 44 on which the upper belt-like film 5 is wound and on the lower side of the upper winding roll 44 on which the lower belt-like film 6 is wound. A lower winding roll 45 is provided, and a discharge conveyor (not shown) disposed between the upper and lower winding rolls 44, 45. In addition, this discharge conveyor does not need to be arrange | positioned. Moreover, it is also preferable to provide a cooling means such as a cooling fan 46 in the belt-shaped film take-up unit 4. By this cooling means, the laminated body 9 whose front and back surfaces are smoothed is cooled, and the surface of the laminated body 9 is softened. The resin layer 8d is cured to make it difficult to deform the surface of the laminate 9, and the exuded resins 8b to 8d and the strip films 5 and 6 can be easily peeled off. In FIG. 9, reference numeral 44 a denotes the upper and lower plates of the vacuum laminator 2 after the pressurization / heating process of the laminating process is finished and the decompression of the sealed spaces 34 and 59 is released and returned to atmospheric pressure. 50 and 51 and upper and lower press blocks 12 and 13 of the flat press device 3 are upper nip rolls (intermittent conveyance means) that are intermittently driven when they are separated from each other, and 45a denotes the lower winding roll 45 and the upper winding roll. 44 is a lower nip roll (intermittent conveyance means) that is intermittently wound and driven synchronously. In addition, the length of the upper and lower belt-like films 5 and 6 that are intermittently wound is usually the approximate distance between the center position of the vacuum laminating apparatus 2 and the center position of the flat press apparatus 3 when viewed from the direction perpendicular to the transport direction. It is wound up.

  In the present invention, the laminate 9 is produced as follows using the above-described laminating apparatus. That is, first, the temporary laminated body 7 formed by temporarily fixing the film-like resin material 8b to the uneven surface of the base material 8a is prepared in advance by an automatic device such as an auto sheet cut laminator or an auto sheet cut tacking machine or manually. Next, the temporary laminate 7 is fed to the carry-in conveyor 43 and fed from the carry-in conveyor 43 between the upper and lower belt-like films 5 and 6. The supplied temporary laminate 7 is sandwiched between the upper and lower belt-like films 5 and 6 and carried into the vacuum laminator 2.

  In this vacuum lamination apparatus 2, the vacuum lamination process is performed as follows. First, the temporary laminated body 7 is conveyed into the vacuum laminating apparatus 2 by the upper and lower belt-like films 5 and 6 and positioned at a predetermined position (pressing position) (see FIG. 1). The adjustment of the positioning position can be adjusted by controlling the timing at which the temporary laminate 7 is transferred from the carry-in conveyor 43 between the upper and lower belt-like films 5 and 6 at the timing at which the temporary laminate stopper 43a is moved up and down. it can. Next, the hydraulic cylinder or air cylinder 49 is operated to raise the lower plate 51, and the lower surface of the upper fixed frame portion 31 of the upper plate 50 and the upper surface of the movable frame portion 36 of the lower plate 51 are brought into close contact with each other. 51 (see FIG. 6).

  After this sealing engagement, the sealed space 59 is brought into a reduced pressure state. Specifically, the sealed space 59 is depressurized by a vacuum pump (not shown) by the vacuuming nozzle 33 (see FIG. 6). The pressure of the sealed space 59 is set to a vacuum state of usually 200 Pa or less, preferably 100 Pa or less, more preferably 50 Pa. If the pressure is too high, microvoids remain between the substrate 8a and the film-like resin material 8b, and when the resin layer 8c after lamination is thermoset in a subsequent process, the surface of the portion where the microvoids remain is The remaining air expands and the surface of the resin layer 8c swells, or the expanded air breaks through the surface of the resin layer 8c and the trace is depressed, resulting in a non-smooth product. Tend.

  Next, the hydraulic cylinder or air cylinder 49 is further operated to raise the lower plate 51 and heat and pressurize the temporary laminate 7 with both upper and lower elastic press plates 54 and 57 (see FIG. 13). In FIG. 13, the upper and lower belt-like films 5 and 6 are not shown), and the laminated resin 8 is produced by bonding the film-like resin material 8b to both the front and back surfaces of the substrate 8a. Specifically, the pressure may be adjusted by adjusting the pressure applied from the hydraulic cylinder or air cylinder 49 while the sealed space 59 is decompressed, and the upper and lower elastic press plates 54 and 57 are used to adjust the temporary laminate 7. Both the upper and lower film-like resin materials 8b are pressed to clamp the base material 8a and the film-like resin material 8b. In this way, the temporary laminate 7 is vacuum laminated to form a laminate 8. Although the resin layer 8c closely follows the unevenness of the base material 8a, the surface of the laminate 8 is not smooth due to the unevenness of the base material 8a.

  When heating and pressurizing, the temperature of the upper hot platen 53 and the lower hot platen 56 is usually preferably 30 to 185 ° C, more preferably 70 to 140 ° C. If the temperature is too low, the base material 8a cannot be filled with the resin layer 8c, and the followability is poor and microvoids tend to remain. On the other hand, if the temperature is too high, the film-like resin material 8b tends to undergo thermal decomposition or thermosetting, and the followability by the decomposed gas tends to decrease, and microvoids tend to be generated. The temperature control method is not particularly limited, but is adjusted by sheathed heaters 53a and 56a incorporated in the upper and lower heating plates 53 and 56.

  In the heating and pressurization described above, the pressurizing condition is usually set within the range of 0.1 to 2 MPa, and preferably 0.4 to 1.5 MPa.

  After the heating / pressurizing process is completed, the vacuum state of the sealed space 59 is released by the vacuuming nozzle 33 to return to normal pressure, the hydraulic cylinder or the air cylinder 49 is operated, and the lower plate 51 is lowered. Let After that, the laminated body 8 is carried into the flat pressing device 3 in the next process while being sandwiched between the upper and lower belt-like films 5 and 6.

  In this flat press apparatus 3, a flat press process is performed as follows. First, the laminated body 8 is conveyed into the flat press device 3 by the upper and lower belt-like films 5 and 6 and positioned at a predetermined position (press position) (see FIG. 1). Subsequently, the hydraulic cylinder or air cylinder 15 or a servo motor (not shown) is operated to raise the lower base layer 21, and the lower surface of the upper fixed frame portion 31 of the upper base layer 16 and the upper surface of the movable frame portion 36 of the lower base layer 21. Are in close contact with each other to seal the upper and lower base layers 16, 21 (see FIG. 6).

  After this sealing engagement, the sealed space 34 is decompressed by a vacuum pump (not shown) by the vacuuming nozzle 33 (see FIG. 6), as in the vacuum lamination process in the vacuum lamination apparatus 2. The pressure of the sealed space 34 is usually 500 Pa or less, preferably 400 Pa or less, more preferably 300 Pa or less. If the pressure is too high, air bubbles remain between the resin layer 8c and the upper and lower belt-like films 5 and 6 and / or between the upper and lower belt-like films 5 and 6 and the upper and lower flexible metal plates 20 and 25. There is a tendency that the resin layer 8c of the portion is depressed during pressing and the product becomes defective.

  Next, the hydraulic cylinder or air cylinder 15 or a servo motor (not shown) is further operated to raise the lower base layer 21 and heat and pressurize the laminated body 8 with both the upper and lower flexible metal plates 20 and 25 ( See Fig. 4. In Fig. 4, the upper and lower belt-like films 5 and 6 are not shown), and the surface of the resin layer 8c of the laminate 8 is smoothed. Specifically, the pressure may be adjusted by adjusting the pressure applied from the hydraulic cylinder or air cylinder 15 or a servo motor (not shown) while the sealed space 34 is decompressed. The upper and lower resin layers 8c of the laminate 8 are pressed to smooth the both resin layers 8c. In this way, the surface of the laminate 8 is smoothed.

  When heating and pressurizing, the temperature of the upper heating platen 18 and the lower heating platen 23 is preferably preferably 30 to 185 ° C, more preferably 70 to 140 ° C. If the temperature is too low, it tends to be difficult to smooth the resin layer 8c. On the other hand, if the temperature is too high, the resin layer 8c undergoes thermal decomposition or thermosetting, causing the resin layer 8c to flow. It tends to be difficult to make the surface smooth due to a decrease in properties. The temperature control method is not particularly limited, but the temperature of the hot platen is detected by a thermocouple (not shown) or the like, and is controlled by the sheath heaters 18a, 23a and the like built in the upper and lower hot plates 18, 23.

  Next, after the heating / pressurizing process of the flat pressing device 3 is completed, the vacuum state of the sealed space 34 is released by the vacuuming nozzle 33 and returned to normal pressure, and then the hydraulic cylinder or air cylinder 15 or A servo motor (not shown) is operated to lower the lower base layer 21. After that, the laminated body 9 having a smooth surface is discharged from the flat press device 3 by the upper and lower belt-like films 5 and 6, and after being cooled by the air cooling fan 46 in the belt-like film winding unit 4, It peels from the films 5 and 6 and is discharged by a discharge conveyor.

  In the plane pressing step, the heating temperature is usually set to 30 to 200 ° C., preferably 70 to 140 ° C., and the pressing condition is usually 0.1 to 2 MPa, preferably 0.4 to 1.5 MPa. Set to Further, in the heating / pressurizing step of the vacuum laminating apparatus 2, the pressure is usually reduced to 200 Pa or less, preferably 100 Pa or less, more preferably 50 Pa or less, and in the plane pressing step, usually 500 Pa or less, preferably 400 Pa or less, More preferably, the pressure is reduced to 300 Pa or less. Further, the product of the two [that is, the degree of pressure reduction in the vacuum laminating apparatus 2 (Pa) × the degree of pressure reducing in the flat pressing process (Pa)] is a pressure reducing degree in the vacuum laminating apparatus 2 of 200 Pa or less. Under the condition that the degree of vacuum is 500 Pa or less, it is usually 100000 [the degree of vacuum in the vacuum laminating apparatus 2 (Pa) × the degree of vacuum in the flat pressing step (Pa)] or less, preferably 50000 [the degree of vacuum in the vacuum laminating apparatus 2 (Pa) × Decompression degree in flat pressing step (Pa)] or less, more preferably 20000 [Decompression degree in vacuum laminating apparatus 2 (Pa) × Decompression degree in flat pressing step (Pa)].

  As described above, in this embodiment, the pressing by the flat pressing device 3 is performed in a reduced pressure state. For this reason, even when the unevenness of the uneven surface of the substrate 8a is deep or when the unevenness is not deep but there is a recess without a wiring pattern, between the resin layer 8c and the upper and lower belt-like films 5 and 6 and / or both upper and lower No bubbles remain between the belt-like films 5, 6 and the upper and lower flexible metal plates 20, 25, and the resin layer 8c of the laminate 8 and the upper and lower belt-like films 5, 6 and Both the upper and lower belt-like films 5 and 6 and the upper and lower flexible metal plates 20 and 25 can be brought into close contact with each other, and the surface of the resin layer 8c can be smoothed. Moreover, by using a pair of belt-like films whose surfaces are not roughened as the upper and lower belt-like films 5 and 6, the belt-like films 5 and 6 are more rough than the belt-like films whose surfaces are roughened. Since it is inexpensive, the manufacturing cost is low. Furthermore, since the surfaces of the upper and lower belt-like films 5 and 6 are not roughened, the resins 8b to 8d that have oozed out during heating and pressurization can bite even if they adhere to the surface of the belt-like films 5 and 6. It is in a state where it is easy to peel off. Therefore, when exfoliating the strip films 5 and 6 from the laminate 9 discharged from the laminating apparatus, the exuded resins 8b to 8d are separated from the strip films 5 and 6 as a lump and become fine fragments. Will not scatter.

  In the above embodiment, when the sealed space 34 or 59 is depressurized, the pressure of the spring 37 and the weight of the lower press block 13 or the lower plate 51 are resisted by this depressurization (that is, by suction by a vacuum pump). When the lower plate 51 is raised, the temporary laminated body 7 or the laminated body is laminated with the upper and lower elastic press plates 54 and 57 or the upper and lower flexible metal plates 20 and 25 until the inside of the sealed space 34 or 59 is in a predetermined reduced pressure state. There is a risk of pinching the body 8. For this reason, the piston rods 15a, 49a are advanced during the above-mentioned pressure reduction by providing a closing means such as a stop valve for closing the oil or air piping to the hydraulic cylinders or the air cylinders 15, 49, or locking the servo motor. It is preferable to prevent.

  Moreover, in the said embodiment, the peeling roll 44b for peeling the laminated body 9 and the upper and lower both strip | belt-shaped films 5 and 6 after the heating and pressurizing process in the plane press apparatus 3 in the exit of the strip | belt-shaped film winding-up part 4; A peeling device (see FIG. 9, peeling means) such as 45b, for example, a splash prevention device (not shown) can be installed. In addition, as countermeasures against static electricity, static elimination means such as static elimination bars can be installed at the film lines of the upper and lower belt-like films 5 and 6 and at various places. Moreover, after the strip | belt-shaped film winding-up part 4, you may arrange | position the stocker etc. for storing the laminated body 9 suitably.

  Moreover, in the said embodiment, a chuck conveyance apparatus is used as an intermittent conveyance means, and this is used between the strip | belt-shaped film unwinding part 1 and the vacuum laminating apparatus 2, and between the vacuum laminating apparatus 2 and the plane press apparatus 3, and a plane. It can arrange | position in at least one place between the press apparatus 3 and the strip | belt-shaped film winding part 4. FIG. As the above-mentioned chuck conveying device, for example, a pair of upper and lower gripping members disposed opposite to each other on the upper and lower belt-like films 5 and 6 are provided, and the upper and lower belt-like films 5 and 6 are gripped by both the upper and lower gripping members and transported. There is something to do.

  Moreover, in the said embodiment, when the uneven surface of the said base material 8a (when both front and back surfaces are uneven surfaces, both the front and back surfaces, when one of the front and back surfaces is an uneven surface, only the uneven surface or A laminate 8 that is obtained by applying a liquid resist (not shown) on both the front and back surfaces and drying it may be used. In this case, the laminated body 8 is carried in by the carry-in conveyor 43 and supplied between the upper and lower belt-like films 5 and 6, and is directly carried into the flat press device 3 by the upper and lower belt-like films 5 and 6. The unevenness of the laminate 8 can be smoothed by heating and pressing. As described above, when the liquid resist is used, the vacuum laminating apparatus 2 can be omitted from the laminating apparatus. However, when the thickness of the laminated body 8 is large, the vacuum laminating apparatus 2 is used for heating and heating. When the laminated body 8 is preheated by pressing, the laminated body 8 can be smoothed by the flat press device 3 at a more uniform temperature, and smoothing by the flat press device 3 can be facilitated.

  Further, in this embodiment, the upper and lower belt-like films 5 and 6 are not taken up by the upper and lower wind-up rolls 14 and 15 of the belt-like film take-up portion 4 and are kept in close contact with the resin layer made of a liquid resist. it can. For example, the upper and lower belt-like films 5 and 6 that have undergone the above-described plane pressing process are placed on the side of the belt-shaped film winding direction from the plane pressing device 3 or on the plane pressing device 3 itself before and after the laminate 9 (that is, from the laminate 9). A cutting means (not shown) for cutting in the short direction (in a direction perpendicular to the longitudinal direction) is provided adjacent to the cutting means at a position separated by a predetermined distance in the longitudinal direction of the upper and lower belt-like films 5 and 6. Then, a stocker (not shown) is arranged, and the cut pieces (the cut upper and lower belt-like films 5 and 6 are laminated on the front and back surfaces of the laminated body 9) cut by the cutting means are placed on the rack of the stocker. After storing, it may be transferred to the next process such as an exposure process.

  In addition, after cutting the upper and lower belt-like films 5 and 6 carried out from the flat press device 3 by the cutting means, they may be put on a rack (not shown), or may be folded without being cut by the cutting means, An exposure machine may be arranged in-line to perform continuous processing. In this embodiment, a chuck conveyance device can be suitably used as the intermittent conveyance means.

  FIG. 14 shows a modification of the flat press device 3 used in the above embodiment. In this example, the sealed space forming means is different from the above embodiment. That is, in this example, the movable vacuum frame 30 is not provided in the flat pressing device 3, and the upper fixed frame portion 61 having a substantially rectangular frame shape is fixed in an airtight manner to the lower surface of the upper base layer 16, and the lower base layer 21. The lower fixed frame portion 62 having a substantially rectangular frame shape is fixed in an airtight manner. In this example, the evacuation nozzle 33 is not fixed to the upper fixed frame portion 61, and the evacuation through hole 63 is provided in the lower base layer 21 along the lower fixed frame portion 62. The air in the sealed space 34 is evacuated through the through-hole 63 for use.

  Further, in this example, a hydraulic cylinder or air cylinder 64 that supports the lower base layer 21 so as to be movable up and down, and a support plate 65 fixed to the lower heat plate 23 via the lower heat insulating material 22 can be moved up and down. A supporting hydraulic cylinder or air cylinder 66 is provided, the lower base layer 21 is moved up and down by the hydraulic cylinder or air cylinder 64, and the supporting plate 65 is moved up and down by the hydraulic cylinder or air cylinder 66. In the figure, 67 is an annular seal member fixed to the upper surface of the lower fixed frame portion 62, and acts to hold the inside of the sealed space 34 in an airtight state during vacuum lamination. Other parts are the same as those of the flat press device 3 used in the above embodiment, and the same reference numerals are given to the same parts. Even when the flat press device 3 of this example is used, the same operations and effects as the laminating device of the above-described embodiment are exhibited. Note that such an upper fixed frame portion 61, a lower fixed frame portion 62, and the like can be applied to the vacuum laminating apparatus 2.

  FIG. 15 shows a modification of the vacuum laminating apparatus (rubber press type vacuum laminating apparatus 2) used in the above embodiment. In this example, a diaphragm type vacuum lamination apparatus 10 is used as the vacuum lamination apparatus. This vacuum laminating apparatus 10 includes a plurality of columns 47a (only two are shown in FIG. 15) erected on a press stand 47, and a plurality of columns (FIG. 15) erected on the upper ends of these columns 47a. Then, only one horizontal bar 70, an upper plate 71 fixed to each horizontal bar 70 by fixing means (not shown) such as bolts and nuts, a lower plate 72 movable up and down, etc. It has.

  An upper flexible sheet (diaphragm) 73 is disposed on the lower surface of the upper plate 71, and the outer peripheral portion thereof is fixed in an airtight manner by a presser fitting 74a. A gap 75 is formed between the upper plate 71 and the upper flexible sheet 73 in the inner peripheral side portion of the presser fitting 74a. In FIG. 15, reference numeral 74 b denotes a screw that fixes the upper flexible sheet 73 and the presser fitting 74 a to the lower surface of the upper plate 71.

  Further, a plurality of portions (only two are shown in FIG. 15) are provided on the lower surface of the upper plate 71 in a portion that conducts to a gap 75 formed between the upper plate 71 and the upper flexible sheet 73. The upper opening groove 76 is opened, and the inside of the gap 75 is decompressed through pressure adjusting means (not shown) such as a vacuum pump, an air communication pipe, a high-pressure air introduction pipe or the like through the upper opening groove 76. From the state where the upper flexible sheet 73 is brought into close contact with the lower surface of the upper plate 71 by introducing air or compressed air into the gap portion 75, the temporary laminate 7 is swelled like a balloon to The sheet 73 (diaphragm) and a lower flexible sheet 77 described later are pressed together. The pressure in the gap 75 can be adjusted as appropriate by depressurization from the second pressure adjusting means, introduction of air and compressed air, and derivation.

  On the other hand, the lower plate 72 is connected and fixed to a cylinder rod 49a of a hydraulic cylinder or air cylinder 49, and is moved up and down by the operation of the hydraulic cylinder or air cylinder 49 (according to the advance / retreat of the cylinder rod 49a). I have to.

  In addition, the lower flexible sheet facing the lower plate 72 in a slightly wider area than the portion of the upper flexible sheet 73 that is open from the inner peripheral part of the pressing metal fitting 74a on the upper surface of the lower plate 72. 77 is arranged. Such upper and lower plates 71 and 72 incorporate heating means such as a rubber heater.

  In addition, a plurality of (only two are shown in FIG. 15) lower opening grooves 78 are opened on the upper surface of the lower plate 72, and the upper and lower plates 71 and 72 are sealed to seal the vacuum chamber. When formed, the air in the space 79 formed between the upper and lower flexible sheets 73 and 77 is depressurized by a first pressure adjusting means (not shown) such as a vacuum pump, and the lower openings 78. The space 79 can be in a vacuum state. The pressure in the space 79 can be adjusted as appropriate by the pressure reducing means. In FIG. 15, 72 a is a seal member fixed to the upper surface of the outer peripheral portion of the lower plate 72, and acts to increase the airtightness of the space 79 in the vacuum state. The arrangement location of the seal member 72a is not limited to the upper surface of the outer peripheral portion of the lower plate 72, but may be the lower surface of the outer peripheral portion of the presser fitting 74a. In this example, the upper and lower plates 71 and 72, the seal member 72a, the hydraulic cylinder or the air cylinder 49, etc. constitute a sealed space forming means.

  As the upper and lower flexible sheets 73, 77, a material whose material is heat-resistant Viton rubber or silicon rubber is preferably used. Further, the surfaces of the upper and lower flexible sheets 73 and 77 (the lower surface of the upper flexible sheet 73 and the upper surface of the lower flexible sheet 77) are roughened by embossing or matte processing. It is preferable that the releasability of the surfaces of the upper and lower flexible sheets 73 and 77 is improved.

  The upper and lower flexible sheets 73 and 77 have a fiber layer (not shown) made of a woven fabric of chemical fibers such as polyester and polyamide or glass fibers. The durability of the upper and lower flexible sheets 73 and 77 can be improved, and the expansion and deformation of the upper and lower flexible sheets 73 and 77 can be suppressed even when pressure lamination is repeated at high temperatures. The followability and adhesion of the film-like resin material 8b with respect to the substrate 8a are excellent.

  In this diaphragm type vacuum laminating apparatus 10, the vacuum laminating process is performed as follows. First, the temporary laminated body 7 is conveyed into the vacuum laminating apparatus 10 by the upper and lower belt-like films 5 and 6 and positioned at a predetermined position (clamping position). Next, the hydraulic cylinder or air cylinder 49 is actuated to raise the lower plate 72, and the lower plate 74a of the upper plate 71 and the upper surface of the lower plate 72 are brought into close contact with each other to seal the upper and lower plates 71, 72 together. Sign in.

  After this sealing engagement, the gap 75 and the space 79 are brought into a reduced pressure state. Specifically, the gap 75 is depressurized through the upper opening groove 76 by the second pressure adjusting means, and the space 79 is depressurized through the lower opening 78 by the first pressure adjusting means. The pressure of the space 79 is preferably a vacuum state of 200 Pa or less within 20 seconds, more preferably a vacuum state of 100 Pa or less within 20 seconds, and particularly a vacuum state of 50 Pa or less within 20 seconds. More preferably. When the pressure of the space 79 cannot be within the above range within 20 seconds from the start of evacuation, microvoids remain between the uneven substrate 8a and the film-like resin layer 8b, and after lamination The resin layer 8c may not be able to closely follow the substrate 8a.

  It should be noted that the space 75 is reduced to 200 Pa or less after the gap 75 has been decompressed in advance and the temporary laminate 7 is carried onto the lower flexible sheet 77 to form a vacuum chamber. The pressure may be reduced.

  Moreover, when evacuating, it is preferable that the temperature of the upper and lower flexible sheets 73 and 77 is usually 30 ° C. to 185 ° C., and more preferably 70 to 140 ° C. When the temperature is too low, the base material 8a cannot be filled with the resin layer 8c, the followability is poor, and microvoids tend to remain. On the other hand, if it is too high, the resin layer 8c undergoes thermal decomposition or thermosetting, the followability by the decomposition gas tends to be reduced, and microvoids tend to be generated. The temperature control method is not particularly limited, but is adjusted by a rubber heater or the like built in the upper and lower plates 73 and 77.

  Next, a laminate slap down process is performed in which the upper flexible sheet 73 is expanded downward by the pressure difference between the gap 75 and the space 79 to bond the temporary laminate 7 made of the base material 8a and the film-like resin material 8b. . Specifically, the adjustment of the pressure difference may be performed by returning the pressure in the gap 75 to the normal pressure while reducing the space 79, and the upper flexible sheet 73 swells toward the space 79 due to the pressure difference. The temporary laminate 7 is pressed from above, and the base material 8a and the film-like resin material 8b are pressed.

  Subsequently, a laminate pressure increasing process for increasing the pressure in the gap 75 is performed. In this step, compressed air is introduced into the gap portion 75 to increase the pressure in the gap portion 75 to further inflate the upper flexible sheet 73, thereby strongly pressing the base material 8a and the film-like resin material 8b. . Then, the base material 8a and the film-like resin material 8b are brought into close contact with each other by the laminate slap down process, and the adhesiveness between the base material 8a and the resin layer 8c is further ensured by the laminate pressure increasing process.

  After the lamination pressure increasing step is completed, the upper opening groove 76 and the lower opening 78 release the vacuum state of the space 79 and the pressurized state of the gap 75 to return to normal pressure, and the lower plate 72 is moved downward. Let The temporary laminate 7 is vacuum laminated to form a laminate 8. The surface of the laminate 8 is not smooth because the unevenness of the base material 8a reflects the unevenness of the base material 8a although the resin layer 8c closely follows the unevenness of the base material 8a. After that, the laminate 8 is sandwiched between the upper and lower belt-like films 5 and 6 and is carried into the flat press device 3 in the next process.

  In the above heating and pressurization, the pressurizing condition is usually set in the range of 0.1 to 1 MPa, and preferably in the range of 0.2 to 0.5 MPa.

  FIG. 16 shows another modification of the diaphragm type vacuum laminating apparatus 10. In this example, the upper flexible sheet 73 is fixed to the lower surface of the upper plate 71 by adhesion or the like. In addition, a lower flexible sheet 77 (diaphragm) is airtightly fixed to the upper surface of the lower plate 72 by a presser fitting 74a. The inner peripheral side portion of the presser fitting 74a has a lower plate 72 and a lower plate. A gap 75 is formed between the side flexible sheet 77. Then, by introducing air or compressed air into the gap 75, the lower flexible sheet 77 swells like a balloon toward the upper plate 71, and the temporary laminate 7 becomes the upper and lower flexible sheets 73. , 77 is compressed.

  In FIG. 16, 76a is an upper opening groove, which is used when the air in the space 79 is decompressed by the first pressure adjusting means, and 78a is a lower opening groove, and the gap 75 is formed by the second pressure adjusting means. It is used when decompressing, introducing or deriving air or compressed air. Other parts are the same as those of the diaphragm type vacuum laminating apparatus 10 shown in FIG. 15, and the same parts are denoted by the same reference numerals. The sealed space forming means is also composed of upper and lower plates 71 and 72, a seal member 72a, a hydraulic cylinder or an air cylinder 49, and the like, similar to the diaphragm type vacuum laminating apparatus 10 shown in FIG. Further, even when the diaphragm type vacuum laminating apparatus 10 of this example is used, the same operation and effect as the diaphragm type vacuum laminating apparatus 10 shown in FIG. 15 are obtained.

  In FIG. 1, the continuous laminating apparatus is provided with the vacuum laminating apparatus 2 and the flat pressing apparatus 3, but the present invention is not limited to this, and the vacuum laminating apparatus 2 and the flat pressing apparatus 3 are used independently. May be. Further, in this embodiment, the upper and lower belt-like films 5 and 6 are used for transporting the temporary laminate 7 and the laminates 8 and 9, and the film-like resin material 8b and the resin layers 8c and 8d are spread from the end of the support film. The upper and lower belt-like films 5 and 6 cover the portion to be taken out. In order to control and adjust the tension and the conveying speed of the upper and lower belt-like films 5 and 6, the belt-shaped film unwinding unit 1 is a vacuum laminator 2. In the vicinity of the carry-in entrance of the temporary laminate 7, the belt-like film winding unit 4 is arranged near the carry-out exit of the laminate 9 of the flat press device 3.

  Further, in the vacuum laminating apparatus 2 and the flat press apparatus 3, an apparatus in which the upper plate 50 and the upper press block 12 are movable up and down and the lower plate 51 and the lower press block 13 are fixed may be used. 50, the configuration shown in FIG. 1 is preferable from the viewpoint of foreign dust generated by the lifting mechanism of the upper press block 12.

  FIG. 1 shows the case where both the upper and lower belt-like films 5 and 6 are used when the processing is performed by the vacuum laminating apparatus 2 and the flat press apparatus 3. You may use only when processing by 3. Further, the upper and lower belt-like films 5 and 6 may be separately installed in the vacuum laminating apparatus 2 and the flat pressing apparatus 3.

  Prior to carrying out the laminating method of the present invention using the above laminating apparatus, a cleaner apparatus such as a slightly adhesive roll or a vacuum cleaner is arranged, and the surface of the substrate 8a and the upper and lower belt-like films 5 and 6 are thereby cleaned. May be.

  In addition, a carry-in conveyor 43 and a discharge conveyor (not shown) are arranged in front of the vacuum laminator 2 and after the flat press device 3, and the temporary laminate 7 is supplied to the upper and lower belt-like films 5 and 6 by the carry-in conveyor 43. However, a rotating roll group or an endless belt may be used in place of these two conveyors. Moreover, the material of both conveyors should be dirty and do not generate dust. Further, the size of the two conveyors is usually in the range of 0.3 to 3 m in length, preferably 0.5 to 1.5 m, and the conveying speed is usually in the range of 1 to 25 m / min. Of these, 5 to 15 m / min is preferable.

  The resin layer 8d on the surface of the laminated body 9 discharged from the flat press device 3 is softened by being heated, and when it comes into contact, the resin layer 8d may be easily deformed to have a stamp mark (dent mark) and become defective. In order to prevent this, it is preferable to cool and solidify to about room temperature immediately after discharging from the flat press device 3. Such a cooling method may be any method, for example, by natural heat dissipation. Alternatively, a cooling device may be provided immediately after the flat press device 3. Industrially, this cooling device is not only a normal cooling fan, but also a refrigerator, a cooling fan using cold air obtained by adiabatic expansion of air, a cold air knife, a cooling roll through which cold water is passed, a cooling plane press Etc. are used.

  In this cooling, it is more preferable to cool the laminate 9 while being sandwiched between the upper and lower belt-like films 5 and 6, and the laminate 9 conveyed from the flat press device 3 is sandwiched between the upper and lower belt-like films 5 and 6. It is preferable to cool as it is and discharge it to the discharge conveyor on the rear side after cooling.

  The present invention can be used for applications other than printed circuit boards, for example, when a polarizing plate with an adhesive or a phase difference plate with an adhesive is bonded on an LCD substrate, various substrates are bonded to a tab tape, and dicing is performed on various electronic substrates. It is also an effective apparatus and method when laminating a tape or a film to which a hot melt resin is attached, such as an IC card or a solar cell.

  EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to the following examples unless it exceeds the gist.

[Examples 1-8 and Comparative Examples 1-8]
A laminate was prepared under the conditions shown in Tables 1 and 2 below. That is, in Examples 1-8 and Comparative Examples 1-8, the pattern on the substrate 8a is such that L (line) / S (space) = 50/50 μm parallel lines and L (line) / S on both surfaces of the substrate 8a. The (space) = 50/50000 μm (= 5 cm) parallel lines are orthogonal. Further, three types of pattern heights (35, 50, and 70 μm) were prepared for the height of the pattern (the uneven depth of the uneven surface of the substrate 8a).

[Examples 9 to 16 and Comparative Examples 9 to 16]
A laminate was prepared under the conditions shown in Tables 3 and 4 below. That is, in Examples 9 to 16 and Comparative Examples 9 to 16, four types of patterns on the substrate 8a as shown in the following (1) to (4) were prepared. In all cases, the height of the pattern was set to 35 μm.
(1) On both surfaces of the substrate 8a, the parallel lines of L / S = 50/50 μm and the parallel lines of L / S = 50/50000 μm are orthogonal.
(2) On both surfaces of the substrate 8a, the parallel line of L / S = 50/500 μm and the parallel line of L / S = 50/50000 μm are orthogonal to each other.
(3) On both surfaces of the substrate 8a, the parallel lines of L / S = 50/3000 μm and the parallel lines of L / S = 50/50000 μm are orthogonal.
(4) On both surfaces of the substrate 8a, the parallel lines of L / S = 50/30000 μm and the parallel lines of L / S = 50/50000 μm are orthogonal to each other.

  Further, in Examples 1 to 4 and 9 to 12 and Comparative Examples 1, 3, 5, 7 and 9, 11, 13, and 15, a transparent film (manufactured by Unitika Ltd., model number Emblet S) is used as the strip films 5 and 6. -38, thickness 38 μm, gloss 185%, haze 3.6%, parallel light transmittance 86%), Examples 5-8 and 13-16 and Comparative Examples 2, 4, 6, 8 and 10, 12 14 and 16, matte films (manufactured by Unitika Ltd., model number Emblet PTH38, thickness 38 μm, gloss 38%, haze 31.0%, parallel light transmittance 58%) were used as the strip films 5 and 6.

  In Examples 1, 2, 5, 6 and 9, 10, 13, 14 and Comparative Examples 1 to 4 and 9 to 12, as the stacking device, the stacking device shown in FIG. In the examples 3, 7 and 11, 15 and the comparative examples 5, 6 and 13, 14, the lamination shown in FIG. 1 is used. A device obtained by replacing the vacuum laminating apparatus 2 with a diaphragm type vacuum laminating apparatus 10 shown in FIG. 15 was used. Further, in Examples 4, 8 and 12, 16 and Comparative Examples 7, 8, 15 and 16, as the laminating apparatus, the laminating apparatus shown in FIG. 1 (the vacuum laminating apparatus is a rubber press type vacuum laminating apparatus 2 shown in FIG. 2). ) Was used.

  In Examples 1, 5, and 9, 13 and Comparative Examples 1, 2, 9, and 10, in order to form the resin layer 8d on both surfaces of the substrate 8a, a film-like resin material 8b (build-up wiring board manufactured by Ajinomoto Fine Techno Co., Ltd.) Interlayer insulation material for halogen-free type ABF-GX13, resin thickness 70 μm) was used [resin layer 8d is covered with a PET film (support film)].

  In Examples 2, 6 and 10, 14 and Comparative Examples 3, 4 and 11, 12, a liquid resist (manufactured by Taiyo Ink Manufacturing Co., Ltd., photoresist type two-component alkali development resist ink PSR4000) is used as the resin layer 8d. Then, it was applied to the surface of the substrate 8a and dried to form a resin layer 8d having a thickness of 70 μm. In this case, only a liquid resist is applied and dried, and there is no cover film such as a PET film (support film) on the resin layer 8d.

  In Examples 3, 4, 7, 8, and 12, 16 and Comparative Examples 5-8, 15, and 16, the film-like resin material 8b (Ajinomoto Fine Techno) was formed on both surfaces of the substrate 8a to form the resin layer 8d. An interlayer insulation material for build-up wiring boards (halogen-free type ABF-GX13, resin thickness 70 μm) temporarily attached was used [resin layer 8d is covered with a PET film (support film)]. The temporarily attached film-like resin material 8b is formed on the resin layer 8d by a vacuum laminating apparatus.

  The comparative example is different from the example in that no pressure reduction was performed in the flat pressing process.

  About the laminated body 9 created using said each lamination apparatus, the surface specularity was evaluated in the following ways. In addition, the press conditions of the vacuum lamination apparatuses of Examples 1 to 8 and Comparative Examples 1 to 8 are a heating temperature of 100 ° C., a heating time of 20 seconds, and a pressing force of 1.0 MPa. The pressing conditions of the flat press apparatus are the heating temperature. The temperature is 100 ° C., the heating time is 30 seconds, and the pressure is 1.0 MPa. The pressing conditions of the vacuum laminating apparatuses of Examples 9 to 16 and Comparative Examples 9 to 16 are a heating temperature of 110 ° C., a heating time of 40 seconds, and a pressing force of 1.0 MPa. The pressing conditions of the flat pressing apparatus are heating temperature of 120 ° C. The heating time is 40 seconds and the applied pressure is 1.0 MPa.

(Surface specularity)
The reflected light of the fluorescent lamp that hit the surface of the resin layer 8d of the laminate 9 at an oblique angle of 45 ° was visually observed and evaluated as follows.
○ …… Specular surface.
Δ: Close to a mirror surface.
× …… It is not in a mirror state.

  The evaluation results of Examples 1 to 8 and 9 to 16 and Comparative Examples 1 to 8 and 9 to 16 are shown in Tables 1 to 4 below.

[Examples 17 to 20 and Comparative Examples 17 to 20]
A laminate was prepared under the conditions shown in Table 5 below. That is, Examples 17-20 produced the laminated body 9 on the same conditions as Examples 1-4. In Comparative Examples 17 to 20, the laminated body 9 was created under the same conditions as in Examples 5 to 8, except that no pressure reduction was performed at the flat press portion.

  And about the laminated body 9 of the said Examples 17-20 and Comparative Examples 17-20, the chip | tip of the resin layer peripheral part and adhesion of the resin layer to a strip | belt-shaped film were evaluated in the following ways.

[Cut at the periphery of the resin layer]
The peripheral part of the resin layer 8d laminated and smoothed on the substrate 8a was visually observed, and it was evaluated as follows whether the peripheral part of the resin layer 8d was missing.
A: There is a resin defect around the resin layer 8d.
X: There is no resin defect around the resin layer 8d.

[Adhesion of resin layer to strip film]
It was visually observed whether or not each of the resins 8b to 8d was attached to the surface of the belt-like films 5 and 6 that were in contact with the smoothed substrate 8a, and evaluated as follows.
◯: There is no adhesion of the resins 8b to 8d to the surfaces of the strip films 5 and 6.
X: Each resin 8b to 8d adheres to the surface of the belt-like films 5 and 6.

  The evaluation results of Examples 17 to 20 and Comparative Examples 17 to 20 are also shown in Table 5 below.

  From Table 1 to Table 5 above, it can be seen that the example is superior to the comparative example in terms of surface specularity, chipping at the periphery of the resin layer, and adhesion of the resin layer to the belt-like film.

  The flat press apparatus and laminating apparatus of the present invention and the laminating method using them are effective for smoothing the resin layer on the substrate having irregularities of the printed circuit board. Also, for applications other than printed circuit boards, such as when laminating a polarizing plate with an adhesive or a retardation plate with an adhesive on an LCD substrate, when laminating various substrates on a tab tape, dicing tape, etc. It is also an effective apparatus and method for attaching a film (for example, an IC card, a solar battery, etc.) to which a hot melt resin is adhered, or for laminating a solar battery cell with a sealing material.

It is a block diagram which shows one Embodiment of the lamination apparatus of this invention. It is a block diagram which shows a plane press apparatus. It is sectional drawing of the laminated body smooth | blunted. It is a block diagram which shows the principal part of the said plane press apparatus. It is sectional drawing which shows the effect | action of the movable vacuum frame of the said plane press apparatus. It is sectional drawing which shows the effect | action of the said movable vacuum frame. It is sectional drawing which shows the effect | action of the said movable vacuum frame. It is a block diagram which shows a strip | belt-shaped film unwinding part. It is a block diagram which shows a strip | belt-shaped film winding-up part. It is sectional drawing of a temporary laminated body. It is sectional drawing of a laminated body. It is a block diagram which shows a vacuum lamination apparatus. It is a block diagram which shows the principal part of the said vacuum lamination apparatus. It is a block diagram which shows the modification of the said plane press apparatus. It is a block diagram which shows the modification of the said vacuum lamination apparatus. It is a block diagram which shows the other modification of the said vacuum lamination apparatus. It is a block diagram which shows a prior art example.

Explanation of symbols

3 Flat press device 8a Base material 8c Resin layer 9 Laminate 34 Sealed space

Claims (12)

  Pressing means opposite to each other are installed, and by these both pressing means, a laminate formed by forming a resin layer on the concavo-convex surface of the substrate having concavo-convexity on at least one of the front and back surfaces is pressed to smooth the surface of the laminate. A flat pressing device, wherein a pair of strip films inserted between the two pressing means are opposed to each other, and the both strip films are longitudinally sandwiched between the strip films. Conveying means for conveying in the direction, sealed space forming means for forming a sealed space part for pressing the laminated body by the both pressing means under reduced pressure, and pressure control means for controlling the inside of the sealed space part to a reduced pressure state. A flat press device provided.   The flat press apparatus according to claim 1, wherein the surfaces of the pair of strip films are not roughened.   The pressing means opposed to each other are disposed in opposition to each other between a hydraulic cylinder, an air cylinder, or a servo motor that advances or retracts at least one of the pressing means with respect to the other pressing means. A pair of frame bodies, one end of one frame is fixed to one press means in an airtight manner, and the other end of the other frame is fixed to the other press means in an airtight manner, 3. The flat press device according to claim 1, wherein the at least one pressing means is advanced so that the other end openings of the both frame bodies are brought into airtight contact with each other to form a sealed space portion.   The blocking means for preventing advancement of one press means that advances and retreats with respect to the other press means when the inside of the sealed space is decompressed by the pressure control means. Flat press machine.   For stripping the strip-shaped film attached to at least one of the pressing surfaces of the two pressing means during the pressing from the at least one pressing surface in a state where the two pressing means are moved relative to each other after the pressing. The flat press apparatus as described in any one of Claims 1-4 which provided the peeling means.   The flat press apparatus as described in any one of Claims 1-5 in which the resin layer formed in the said uneven surface of the base material which has an unevenness | corrugation in at least one of front and back both surfaces consists of a film-form resin layer.   The flat press apparatus as described in any one of Claims 1-5 in which the resin layer formed in the said uneven surface of the base material which has an unevenness | corrugation in at least one of front and back both surfaces consists of a liquid resist.   Pressing means opposite to each other are installed, and by using both of these pressing means, a temporary laminated body in which a film-like resin material is temporarily attached to the uneven surface of the substrate having unevenness on at least one of the front and back surfaces is pressed to form a laminated body A laminating apparatus comprising: a vacuum laminating apparatus that performs the above-described and a flat press apparatus according to any one of claims 1 to 7.   The vacuum laminating apparatus has a pair of pressing means, and the pair of pressing means are disposed in a mutually opposing manner along a pair of opposing plates and opposing surfaces of the plates facing each other. A pair of flexible sheets, a sealed space forming means for forming a sealed space portion between the pair of plates for pressing the temporary laminate with the pair of flexible sheets under reduced pressure, and the sealed space A first pressure adjusting means capable of adjusting the pressure of the part, a gap formed between at least one of the flexible sheets and the plate on which the at least one flexible sheet is disposed, The laminating apparatus according to claim 8, further comprising a second pressure adjusting unit capable of adjusting a pressure in the gap portion, wherein at least one of the two plates is connected to a cylinder rod of a hydraulic cylinder or an air cylinder.   The vacuum laminating apparatus has a pair of pressing means, and the pair of pressing means are disposed in a mutually opposing manner along a pair of opposing plates and opposing surfaces of the plates facing each other. A pair of elastic sheets, a sealed space forming means for forming a sealed space portion between the pair of plates for pressing the temporary laminate with the pair of elastic sheets under reduced pressure, and a pressure of the sealed space portion. The laminating apparatus according to claim 8, further comprising a hydraulic pressure cylinder, an air cylinder, or a servomotor that includes an adjustable pressure adjusting means and moves the at least one of the two plates forward and backward with respect to the other plate.   Using the flat press device according to any one of claims 1 to 7, a laminate formed by laminating a resin layer on the concavo-convex surface of a base material having concavo-convex portions on at least one of the front and back surfaces is pressed to form the laminate. A lamination method characterized by smoothing unevenness of a body.   Lamination which pressed the temporary laminated body which temporarily attached the film-form resin material to the said uneven surface of the base material which has an unevenness | corrugation in at least one of front and back both surfaces using the vacuum lamination apparatus as described in any one of Claims 8-10. A method of laminating, wherein the surface is further pressed using the flat press device according to any one of claims 1 to 7 to smooth the unevenness of the laminate.

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