TWI819316B - laminated device - Google Patents

Abstract

An object of the present invention is to provide a laminate capable of producing a higher-level surface planarization. The present invention is a lamination device, which includes a vacuum lamination device 1 that forms a first temporary laminate 101 having an uneven surface that follows the uneven surface of a base material 104, and presses the first temporary laminate 101 to form the first temporary laminate 101. 2. The first plane pressing device 2 of the temporary laminated body 102, and the second plane pressing device 3 that presses the second temporary laminated body 102 under different conditions from the first plane pressing device 2; the first plane pressing device 2 The pressing device 2 has a pair of opposing pressing blocks, at least one of which has a hot plate 20, a plate-shaped body (elastic pressing plate 21), and a buffer material arranged between them; The second plane pressurizing device has a pair of opposing pressurizing blocks and a servo motor. At least one of the pair of pressurizing blocks has a hot plate and a plate-shaped body. There is no buffer material or a buffering effect between them. The buffer material that is smaller than the buffer material of the first plane pressurizing device controls the operation of the servo motor so that the speed at which the pair of pressurizing blocks approach each other is 0.005~0.5 mm/second.

Description

laminated device

The present invention relates to a laminating device that can accurately laminate a base material and a resin film. Specifically, it relates to a resin that can be laminated on a base material (such as a printed circuit board or a wafer). The film surface is flattened and laminated to a tighter level.

In the past, as electronic devices have become smaller and more powerful, multi-layered, high-density printed circuit boards (so-called "build-up boards") have been commonly used as electronic circuit boards mounted on these devices. This build-up substrate is produced by a multi-stage laminate in which a base material having irregularities formed by wiring or the like on its surface and a resin film serving as an insulating layer are alternately laminated (laminated). A laminating device is used for its production.

In the production of the above-mentioned build-up substrate, it is important to laminate the resin film flatly on the base material having concavities and convexities. The reason is that when there are uneven parts, the unnecessary space increases when the layer is stacked into multiple stages, and the volume of the build-up substrate increases, which violates the requirement of compact electronic equipment. An example of a laminating device for laminating a resin film flatly on a base material having irregularities is the device of Patent Document 1. Since this device includes a vacuum pressurizing device and a planar pressurizing device, the formed laminate (build-up substrate, etc.) can be made flatter.

In recent years, the miniaturization and performance of electronic devices have been further developed, and the electronic circuit boards mounted on these devices have been required to be further miniaturized. Accordingly, the flatness of the surface of the laminate (build-up substrate, etc.) is increasingly required, and further improvements in the lamination technology of the lamination device are expected. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Gazette No. 4926840

[Problem to be solved by the invention]

The present invention was made in view of such circumstances, and an object thereof is to provide a lamination device that can produce a laminate with a higher level of surface planarization. [Means to solve the problem]

In order to achieve the above object, the present invention takes the following [1] to [3] as its gist. [1] A laminating device that laminates a film on the concave and convex surface of a substrate having concavities and convexes, and includes a vacuum laminating device, a first plane pressurizing device, and a second plane pressurizing device, and the vacuum laminating device is The film is made to closely follow the base material under reduced pressure to form a first temporary laminate having an uneven surface that follows the uneven surface of the base material; the first plane pressing device presses the first temporary laminate to The concave and convex surfaces of the first temporary laminate are approximately flattened to form a second temporary laminate having approximately flattened concave and convex surfaces; the second plane pressurizing device operates under different conditions from the first plane pressurizing device. The second temporary laminate is pressed to further flatten the roughly flattened uneven surface of the second temporary laminate to form a laminate; the first plane pressing device has a pair of opposing pressing blocks. , at least one of the pair of pressurizing blocks is set to be able to advance and retreat relative to the other, and at least one of the pair of pressurizing blocks has a hot plate, a plate-shaped body, and a buffer material arranged between them; The second plane pressurizing device has a pair of opposing pressurizing blocks, a servo motor connected to at least one of the pair of pressurizing blocks, and is set so that by the actuation of the servo motor, the pair of pressurizing blocks At least one of them can move forward and backward relative to the other. At least one of the pair of pressurizing blocks has a hot plate and a plate-shaped body. There is no buffer material between them or the buffering effect is smaller than that of the first planar pressurizing device. The buffer material of the buffer material controls the operation of the servo motor so that the speed at which the pair of pressurizing blocks approach each other is 0.005~0.5 mm/second. [2] The stacked device of [1], wherein the speed at which the pair of pressurizing blocks of the first planar pressurizing device approaches each other is V1, and the speed at which the pair of pressurizing blocks of the second planar pressurizing device approaches each other is V1. When the approaching speed is V2, V1 and V2 satisfy the following equation (1). 0.0008≦V2/V1≦0.02 …(1) [3] The laminated device of [1] or [2], wherein at least one of the pair of pressurizing blocks of the first plane pressurizing device is connected to a hydraulic cylinder or a pneumatic cylinder, whereby the hydraulic cylinder or When the cylinder is actuated, at least one of the pair of pressurizing blocks can move forward and backward relative to the other.

That is, the inventors of the present invention have conducted repeated research in order to solve the aforementioned problems. As a result, they found that the surface can be flattened to an extremely high level that has not been achieved in the past by using the following laminating device, which is a temporary laminating device that makes the film closely follow the base material under reduced pressure. The layer body is subjected to at least two plane pressurizations by changing conditions, and in the second plane pressurization, the speed at which the object is pressed is set to a predetermined range that is slower than before. [Effects of the invention]

According to the lamination device of the present invention, when laminating films on the uneven surfaces of a base material having uneven surfaces, it is possible to produce a laminate in which the surface is flattened to an extremely high level.

[Form used to implement the invention]

Next, the form for implementing the present invention will be described in detail. However, the present invention is not limited to this embodiment.

FIG. 1 shows a lamination device according to an embodiment of the present invention. This lamination device is a device for laminating the lamination film 106 on the base material 104 for the build-up substrate provided with unevenness formed by wiring (copper pattern 105, etc.), and includes conveying films 5, 5 'Conveying devices 4, 4 which unwind from one side and wind up on the other side to sequentially convey the workpieces 100'. In addition, from the upstream (vacuum laminating device 1) to the downstream (second plane pressurizing device 3) in the flow direction of the arrows of the conveying films 5 and 5', the vacuum laminating device 1 and the first plane are arranged in this order. Pressure device 2, second plane pressure device 3. The above-mentioned vacuum lamination device 1 forms the surface of the base material 104 into an uneven surface by the arrangement of the copper pattern 105, and the workpiece 100 on which the film 106 is placed on the uneven surface is made to make the film 106 follow the surface of the base material 104 under reduced pressure. The concave and convex surfaces closely follow each other, thereby forming the first temporary laminate 101 having a concave and convex surface that follows the concave and convex surfaces of the base material 104 . The first plane pressing device 2 presses the first temporary laminated body 101 formed by the vacuum laminating device 1 to roughly flatten the uneven surface of the first temporary laminated body 101, thereby forming roughly flattened uneven surfaces. The second temporary laminate 102 on the surface. The second plane pressing device 3 presses the second temporary laminated body 102 under conditions different from those of the first plane pressing device 2. As shown in FIG. 4, a servo motor 53 is used for this pressing, and The speed at which the metal plate (plate-shaped body) 51 of the pressurizing block 47 of the second plane pressurizing device 3 abuts the second temporary laminated body 102 is set to a predetermined speed slower than conventionally, so that the above-mentioned second temporary laminate 102 is 2. The roughly flattened uneven surface of the temporary laminated body 102 is further flattened to form the laminated body 103.

In addition, the workpiece 100, the first temporary laminated body 101, the second temporary laminated body 102, and the laminated body 103 are all sandwiched between the conveying films 5 and 5' by the above-mentioned conveying devices 4 and 4'. Furthermore, the transport device 4 has a transport conveyor 7 for transporting the workpiece 100 into the process. Furthermore, the conveying device 4' has fans 6, 6' for cooling the laminated body 103 flattened by the second plane pressing device 3. Furthermore, in the conveying device 4', the completed laminated body 103 is taken out from the conveying line between the rolled conveying films 5 and 5'. Each of the devices 1 to 3 will be described in detail below.

[Vacuum laminating device 1] The above-described vacuum laminating apparatus 1 positions the workpiece 100 with the film 106 placed on the uneven surface of the base material 104, which is carried in by the loading conveyor 7 and transported by the transport films 5 and 5', on the upper plate 11 and the lower plate 12 During this time, heating and pressure are applied in the space 26 in a depressurized state, so that the film 106 closely follows the unevenness of the base material 104, thereby forming the first temporary laminated body 101. As shown in Figure 2, this vacuum stacking device 1 has a plurality of pillars 9 (only two are shown in Figure 2) that are erected on a pressurizing table 8, and are fixed to these pillars with fixing devices 10 such as bolts and nuts. The upper plate 11 of 9 is mounted on the lower plate 12 of each of the above-mentioned pillars 9 so as to be movable up and down. The lower plate 12 is connected to the hydraulic cylinder 14 through the joint 13, and moves up and down due to the actuation of the hydraulic cylinder 14 (as the piston rod 14a rises and falls). In addition, in this embodiment, the hydraulic cylinder 14 is connected to the lower plate 12, but other lifting mechanisms such as a pneumatic cylinder may be used instead of the hydraulic cylinder 14. However, when the hydraulic cylinder 14 is used, it is advantageous in that it is small and can obtain high pressure.

A flat plate-shaped upper heat insulating material 15, an upper hot plate 16, an upper buffer material, and an upper elastic pressure plate 17 are fixed to the upper plate 11 in this order from above, and a flat lower partition is fixed to the lower plate 12 in this order from the bottom. Thermal material 19, lower hot plate 20, lower buffer material, and lower elastic pressure plate 21. In addition, illustration of the upper side cushioning material and the lower side cushioning material is omitted.

The upper and lower hot plates 16 and 20 are provided with temperature-controllable heating devices for heating the elastic pressure plates 17 and 21 in a suitable configuration. In this embodiment, a plurality of sheath heaters are respectively arranged inside the upper and lower hot plates 16 and 20 as the above-mentioned heating devices. In addition, in this embodiment, sheath heaters are disposed inside the hot plates 16 and 20, but other heat sources may be used instead of the sheath heaters.

Furthermore, the above-mentioned vacuum stacking device 1 has a movable vacuum frame 23 . This movable vacuum frame 23 has an approximately quadrangular frame-shaped upper fixed frame portion 24 fixed airtightly on the lower surface of the upper plate 11 , and a movable frame 25 fixed airtightly on the upper surface of the lower plate 12 . A vacuum nozzle (not shown in the figure) is connected to the upper fixed frame part 24. When the upper and lower plates 11 and 12 are sealed and engaged, the vacuum nozzle can be formed on the upper fixed frame part 24 and the movable frame 25. The sealed space 26 (see FIG. 1 ) between them is evacuated, and the pressure of the space 26 is adjusted (that is, the pressure is reduced to a predetermined pressure). In addition, the vacuum nozzle may not be connected to the upper fixed frame part 24 but may be connected to the upper plate 11. Furthermore, when it is provided at multiple places, the pressure of the space part 26 can be adjusted efficiently.

[First plane pressurizing device] The first plane pressurizing device 2 (returning to FIG. 1 ) positions the first temporary laminate 101 conveyed from the vacuum laminating device 1 with the conveying films 5 and 5' to the upper pressure block 27 and the lower side. Between the pressure blocks 28 (see FIG. 3 ), the upper pressure block 27 and the lower pressure block 28 are heated and pressed to roughly flatten the surface of the first temporary laminated body 101 . In this embodiment, as shown in FIG. 3 , it includes a plurality of pillars 30 (only two are shown in FIG. 3 ) that are erected on the pressure platform 29 and are fixed thereto with fixing devices 31 such as bolts and nuts. The upper pressure block 27 of each pillar 30 is attached to the lower pressure block 28 and the like of each pillar 30 so as to be movable up and down. The lower pressure block 28 is connected to the hydraulic cylinder 33 through the joint 32, and moves up and down by the actuation of the hydraulic cylinder 33 (as the piston rod 33a rises and falls). That is, the lower pressure block 28 moves forward at the predetermined speed V1 while facing the upper pressure block 27, and clamps the first temporary laminated body 101 and heats and presses it, thereby making the unevenness of the first temporary laminated body 101 The surface is roughly flattened.

The speed V1 at which the above-mentioned lower pressure block 28 advances toward the upper pressure block 27 is preferably 5 to 12 mm/second, preferably 5.8 to 10.7 mm/second, and even more preferably 6.8 to 8.3 mm/second. That is, when the speed V1 exceeds the upper limit of the range, an impact load is exerted on the first temporary laminated body 101 when the pressing blocks come into contact, and the uneven surface cannot be sufficiently flattened. When the above speed V1 is lower than the lower limit of the above range, the cycle time will become too long and the productivity will tend to deteriorate. In addition, the above-mentioned V1 indicates the speed when the lower side flexible metal plate (plate-shaped body) 43 of the above-mentioned lower side pressure block 28 comes into contact with the first temporary laminated body 101.

The upper pressure block 27 has a structure in which a flat upper heat insulating material 35, an upper hot plate 36, a flat upper buffer material 37 and an upper flexible metal plate (plate-shaped body) are fixed to the upper base layer 34 in this order from above. 38. The structure of the above-mentioned lower pressure block 28 is that the flat-shaped lower heat insulating material 40, the lower hot plate 41, the flat-shaped lower buffer material 42 and the lower flexible are sequentially fixed to the lower base layer 39 from below. Metal plate (plate-shaped body) 43.

The above-mentioned upper heat insulating material 35 is fixed to the lower surface of the upper base layer 34 with bolts, nuts, etc. (not shown in the figure). The upper hot plate 36 is fixed to the upper base layer 34 , and the upper flexible metal plate (plate-shaped body) 38 is fixed to the upper hot plate 36 with bolts, rings, etc. (not shown) via the upper buffer material 37 . In addition, the lower heat insulating material 40 is fixed to the upper surface of the lower base layer 39 with bolts, nuts, etc. (not shown in the figure). The lower hot plate 41 is fixed to the lower base layer 39 with joint locking, and the lower flexible metal plate (plate-shaped body) 43 is fixed to the lower side via the lower buffer material 42 with bolts, rings, etc. (not shown in the figure). Hot plate 41. In the figure, 36a and 41a are sheath-shaped heaters arranged side by side inside the upper and lower hot plates 36 and 41. In addition, in this embodiment, the sheath heaters 36a and 41a are disposed inside the hot plates 36 and 41, but other heat sources may be used instead of the sheath heaters 36a and 41a.

The surface Shore A hardness (Durometer hardness) of the above-mentioned cushioning materials 37 and 42 is preferably 60 degrees or more, and preferably 65 to 75 degrees. The reason is that when the surface Shore A hardness is within the above range, the film thickness of the film 106 after pressing is more uniform. In addition, in the present invention, Shore A hardness is measured using an A-type rubber durometer in accordance with JIS K6253. Shore A hardness can also be measured by making a sample made of rubber or synthetic resin that constitutes the cushioning material.

In addition, the thickness of the above-mentioned buffer materials 37 and 42 is usually 0.2~20mm, preferably 0.2~10mm, and preferably 0.5~3mm. When the thickness of the cushioning materials 37 and 42 is within the above range, the cushioning effect can be fully exerted, and the first temporary laminate 101 can be pressed while following the unevenness on the surface. Therefore, the overall unevenness of the surface of the first temporary laminate 101 can be made smooth. In addition, the thicknesses of the buffer materials 37 and 42 may be different from each other or may be the same.

The buffer materials 37 and 42 can generally be made of paper, rubber, synthetic resin, fiber, etc. Among them, rubber is preferred, especially fluorine-based rubber. Examples of fluorine-based rubber include vinylidene fluoride-based rubber, fluorosilicone rubber, tetrafluoroethylene-based rubber, fluorine-containing vinyl ether-based rubber, fluorophosphazene-based rubber, fluoroacrylate-based rubber, and fluorine-containing nitrosomethane-based rubber. Rubber, fluorine-containing polyester rubber, triazine fluororubber, etc. are examples. In addition, the above-mentioned buffer materials 37 and 42 may be those containing heat-resistant resin, glass fiber sheets, metal foils, etc. inside, or may be a combination of different materials such as rubber and fiber. In addition, the buffer materials 37 and 42 may be made of different materials or may be the same.

The thickness of the above-mentioned flexible metal plates (plate-shaped bodies) 38 and 43 is usually 0.1~10mm, preferably 1~2mm. When the thickness of the flexible metal plates (plate-shaped bodies) 38 and 43 is within the above range, mechanical strength can be ensured and flexibility can be exerted, and the cushioning materials 37 and 42 can fully follow the first temporary laminated body 101 The actual deformation of the above-mentioned buffer materials 37 and 42.

The flexible metal plates (plate-shaped bodies) 38 and 43 are usually made of stainless steel, iron, aluminum, aluminum alloy, etc. Among them, stainless steel is preferably used because of its excellent rust resistance. In addition, when the surfaces of the flexible metal plates (plate-shaped bodies) 38 and 43 are mirror-polished by polishing or the like, the surface of the second temporary laminated body 102 can be formed into a more mirror-like surface, which is preferable. .

In addition, in this embodiment, the hydraulic cylinder 33 is connected to the lower pressure block 28, but other lifting mechanisms such as a pneumatic cylinder may be used instead of the hydraulic cylinder 33, or a servo motor may be used. However, when the hydraulic cylinder 33 is used, it is advantageous in that it is small and can obtain high pressure.

[Second plane pressurizing device] The above-mentioned second planar pressurizing device 3 (returning to FIG. 1 ) positions the second temporary laminated body 102 conveyed from the first planar pressurizing device 2 with the conveying films 5 and 5 ′ to the upper pressing block 46 and the lower part. Between the side pressure blocks 47 (see FIG. 4 ), the upper side pressure block 46 and the lower side pressure block 47 are heated and pressed to further flatten the roughly flattened uneven surface of the second temporary laminate 102 . In this embodiment, as shown in FIG. 4 , the basic structure is the same as that of the first plane pressurizing device 2 (refer to FIG. 3 ), and includes a plurality of pillars 45 (at the four corners of FIG. 4 ) installed upright on the pressurizing table 44 . Only two of the four are shown) are fixed to the upper side pressure blocks 46 of each of the pillars 45 with fixing devices such as bolts and nuts, and are mounted on the lower side of the pressure blocks 47 of the above-mentioned pillars 45 in a manner that can be lifted and lowered freely. That is, the lower pressure block 47 moves forward at the predetermined speed V2 while facing the upper pressure block 46, and clamps the second temporary laminated body 102, and heats and pressurizes the second temporary laminated body 102. The flattened uneven surface is flatter.

A lifting mechanism composed of a ball screw 52 composed of a screw shaft 52 a and a nut (ball nut) 52 b and a servo motor 53 connected to the screw shaft 52 a is formed in the space below the lower pressure block 47 . In addition, the rotation speed of the above-mentioned servo motor 53 is controlled by a servo amplifier (not shown) based on the command signal from the programmable logic controller (PLC) and the feedback distance information between the pressure blocks 46 and 47 . That is, the lower pressure block 47 is joined to the nut 52b of the ball screw 52 through a joint (not shown) or the like. Therefore, by controlling the rotation of the servo motor 53 connected to the screw shaft 52a with the above structure, the lower pressure block 47 can be more strictly controlled by being able to move freely up and down.

Furthermore, a linear scale 54 for measuring the distance between the lower pressure block 47 and the upper pressure block 46 is disposed in the space below the lower pressure block 47 . This linear scale 54 has a scale 54a fixed on the upper pressure block 46, and an encoder reading head 54b installed on the lower pressure block 47 and sliding up and down in synchronization with the lower pressure block 47, thereby indirectly measuring the following. The distance (clearance) between the lower pressure block 47 and the upper pressure block 46 that rises and falls in response to the rotation of the servo motor 53. In the present invention, a servo motor refers to a motor with a servo mechanism, and its use is not limited.

For example, any type of linear scale (linear encoder), such as a magnetic type having a magnetic head or an optical type having a light-emitting or light-receiving element, can be used as the linear scale 54 . Furthermore, the linear scale 54 can also be replaced by other types of distance meters that directly or indirectly measure the gap between the two pressure blocks 46 and 47 in a contact or non-contact manner.

In addition, the linear scale 54 can also be configured to directly measure the gap between the lower pressure block 47 and the upper pressure block 46 . However, when the linear scale 54 is disposed between the upper pressure block 46 and the lower pressure block 47, there is a risk of being affected by heat from the hot plates 48 and 49. If there is no consideration for heat, then It may be difficult to measure the correct gap. Therefore, the linear scale 54 can be disposed at a position far away from the hot plates 48 and 49, for example, disposed below the lower pressure block 47 to indirectly measure the lower pressure block 47 and the upper side. The gap between the pressing blocks 46 is better.

In addition, the above-mentioned second plane pressure device 3 has a servo amplifier (illustration omitted) that controls the rotation of the servo motor 53 based on the command signal from the PLC and the feedback of the distance information between the upper pressure block 46 and the lower pressure block 47. Show). Furthermore, the gap between the upper pressure block 46 and the lower pressure block 47 is not only based on the command signal incorporated into the PLC (pressure gap control program), but is set by considering the distance signal obtained from the linear scale 54 Gap control device control. That is, the rotation of the servo motor 53 operated by a command signal from the PLC is controlled by feedback of the distance information between the upper pressure block 46 and the lower pressure block 47 sent from the linear scale 54 . In this example, the servo motor 53 is rotated by the command signal from the PLC to raise the lower pressure block 47. When the gap between the upper pressure block 46 and the lower pressure block 47 (the upper pressure block is sent from the linear scale) When the distance information between the pressure block 46 and the lower pressure block 47 reaches a preset value, the information that the set value has been reached is fed back to the command signal incorporated into the PLC, and the rotation of the servo motor 53 slows down or stops. Thereby, the stop position of the lower pressure block 47 can be set more accurately, and the gap between the upper pressure block 46 and the lower pressure block 47 can be set more accurately.

In addition, in the above-mentioned second plane pressurizing device 3, the speed V2 at which the lower pressure block 47 advances toward the upper pressure block 46 needs to be 0.005~0.5mm/second, preferably 0.008~0.2mm/second, and 0.01 ~0.1mm/second is better. This speed is very slow from a common sense perspective. When it is so slow, the flow of the resin of the film 106 can be controlled, so that the roughly flattened uneven surface can be flattened at a high level. That is, when the above-mentioned speed V2 exceeds the upper limit of the above-mentioned range, the resin of the film 106 is unable to spread throughout the recessed portion of the second temporary laminate 102, and a slight recessed portion tends to remain. Furthermore, there is a risk that the resin may overflow from the ends of the film 106 and the thickness of the ends of the resulting laminate 103 may become thinner. On the other hand, when the above-mentioned speed V2 is lower than the lower limit of the above-mentioned range, the above-mentioned film 106 does not reach the pressure required to press the resin of the film 106 melted by heating into the upper pressure block 46 and the lower pressure block 47. The resin 106 may flow and the resulting laminate 103 may have uneven thickness. In addition, the said speed V2 shows the speed when the metal plate (plate-shaped body) 51 of the said lower pressure block 47 contacts the 2nd temporary laminated body 102.

In addition, the ratio (V2/W) of the above-mentioned speed V2 to the unevenness W (see FIG. 5) of the surface of the second temporary laminate 102 is preferably 0.035~3, more preferably 0.075~1.9, and 0.11~1.2. Better. As shown in FIG. 5 , the above-described unevenness level W represents the unevenness difference of the approximately flattened uneven surface of the second temporary laminate 102 . The above-mentioned degree of unevenness W is based on the above-mentioned roughly flattened uneven surface. When the thickness of the place Q1 where the copper density T is high calculated by the following equation (2) is H1, and the thickness of the place Q2 where the copper density T is low is H2, H1-H2 is displayed, and its value can be calculated by the following equation (3). Here, as shown in FIG. 10 , the copper density T is calculated based on the following equation (2) when the width of the copper wire 108 is L and the spacing between adjacent copper wires 108 is S. Copper density T=L/(L+S)…(2) The degree of concavity and convexity W=h2×(T1-T2)…(3) Moreover, the thickness H1 and H2 mentioned above were calculated by the following equation. H1=(T1×h2)+h1 H2=(T2×h2)+h1 (Wherein, T1 is the copper density at place Q1, T2 is the copper density at place Q2, h1 is the thickness of the film 106 before lamination, and h2 is the thickness of the copper wire 108.)

The above-mentioned concavity and convexity degree W is usually in the range of 0.002~0.04mm, preferably in the range of 0.0036~0.0298mm. In addition, the degree of unevenness W on the surface of the second temporary laminated body 102 may be the same (uniform) over the entire surface, or may be partially different. In addition, when the unevenness W on the surface of the second temporary laminate 102 is partially different, the one with the higher unevenness W (larger value) is used to calculate the ratio of V2 to the unevenness W (V2/W). Furthermore, when the degree of unevenness W of the second temporary laminated body 102 is different from one surface to the other, the ratio of the above-mentioned V2 to the degree of unevenness W (V2/W) is the one with the higher degree of unevenness W (larger value). Calculator.

Furthermore, the ratio of the speed V2 at which the lower pressure block 47 advances toward the upper pressure block 46 to the speed V1 at which the lower pressure block 28 of the first plane pressure device 2 advances toward the upper pressure block 27 ( V2/V1) is preferably in the range of 0.0008~0.02, preferably in the range of 0.0009~0.017, and even more preferably in the range of 0.0012~0.014. That is, when the ratio of V2 to V1 (V2/V1) is within the above range, the surface of the minute unevenness can be flattened, and the laminated body 103 with a mirrored surface can be obtained.

Hot plates 48 and 49 with built-in heaters are respectively installed on the inner sides (pressurizing side) of the upper pressure block 46 and the lower pressure block 47 through heat insulating materials. Furthermore, on the inner side (pressurizing side) Metal plates (plate-shaped bodies) 50 and 51 are provided. However, no cushioning material is provided on the inner side (pressurizing side) of the hot plates 48 and 49 of the upper pressure block 46 and the lower pressure block 47 . Therefore, the flatness of the inner side (pressure side) of the hot plates 48 and 49 can be more reliably transmitted to the second temporary laminated body 102, and the laminated body 103 whose surface is formed into a more mirror-like flat surface can be obtained. . However, depending on the types of the base material 104 and the film 106, a buffer material may be provided between the hot plates 48 and 49 and the metal plates (plate-shaped bodies) 50 and 51. In this case, a buffer material with a small buffering effect is preferred. . The size of the cushioning effect is usually determined by the material and thickness of the cushioning material. In the present invention, in addition to this, followability is also used as one of the indicators of the cushioning effect. That is, a cushioning material with high tracking properties can be considered to have a large cushioning effect.

In addition, when a buffer material is provided in the above-mentioned second plane pressurizing device 3, the Shore A hardness of the surface of the buffer material is preferably 60 degrees or more, and preferably 65 to 75 degrees. The reason is that when the surface Shore A hardness of the cushioning material is within the above range, the film thickness of the pressed film (laminate) becomes more uniform.

In addition, when the above-mentioned buffer material is used, its thickness is usually 0.2 to 20 mm, preferably 0.2 to 3 mm, and preferably 0.2 to 1 mm. Furthermore, when the buffering effect of the buffering material is smaller than that of the buffering materials 37 and 42 of the first plane pressurizing device 2, the flatness of the inner sides (pressurizing sides) of the hot plates 48 and 49 can be transmitted more reliably, and the The laminated body 103 whose surface was formed into a flatter surface was obtained. In addition, the material of the buffer material can be the same as that of the first plane pressurizing device 2, preferably synthetic resin or a combination of synthetic resin and other materials.

The thickness of the metal plates (plate-shaped bodies) 50 and 51 installed on the inner side (pressurizing side) of the upper pressure block 46 and the lower pressure block 47 is usually 0.1~10mm, preferably 0.5~7mm, and 1 ~5mm is better, 2~5mm is better. When the thickness of the metal plates (plate-shaped bodies) 50 and 51 is within the above range, since the mechanical strength is excellent, the thickness of the second temporary laminated body 102 can be made more uniform, and the surface can be formed to be flatter. The laminate 103. Furthermore, it is preferable that the surfaces of the metal plates (plate-shaped bodies) 50 and 51 are mirror-polished by polishing or the like because the surface of the laminated body 103 can be formed into a uniform mirror surface.

The material of the metal plates (plate-shaped bodies) 50 and 51 is usually stainless steel, iron, aluminum, aluminum alloy, etc., and stainless steel is preferred because of its excellent rust resistance. In addition, the above-mentioned metal plates (plate-shaped bodies) 50 and 51 may or may not have flexibility. However, when using a cushioning material, in order not to exert its cushioning effect excessively, it is better to use one with less flexibility.

[Conveying device] The conveying devices 4 and 4' (return to FIG. 1) include film dispensing machines 55 and 55' for vertical conveying located at the starting point of the process, an import conveyor 7 for conveying the workpiece 100 into the process, and a conveyor 7 disposed at the end of the process. The conveying film winders 56 and 56', a plurality of guide rollers and the like supporting the conveying films 5 and 5' for conveying the workpiece 100 etc. are provided at various points in the process.

Furthermore, the sheet-like workpiece 100 supplied to the process from the loading conveyor 7 at predetermined intervals is intermittently sandwiched with the vertical conveyance film 5 discharged from each of the conveyance film discharge machines 55 and 55' at predetermined intervals. , 5', in synchronization with the flow (traveling) of the conveying films 5, 5', while being guided by the above-mentioned guide rollers, passing between the upper and lower plates 11, 12 of the vacuum laminating device 1 , between the upper pressure block 27 and the lower pressure block 28 of the first plane pressure device 2 and between the upper pressure block 46 and the lower pressure block 47 of the second plane pressure device 3, for cooling Between the fans 6 and 6' of the obtained laminated body 103. After the laminated body 103 is cooled, the vertical conveyance films 5 and 5' are separated, and the laminated body 103 is taken out from the conveyance line.

After taking out the laminated body 103, the upper and lower conveyance films 5 and 5' are respectively wound by the conveyance film winding machines 56 and 56'. The rolled transport films 5 and 5' are usually discarded, but can be reused as needed.

According to this structure, since it includes the vacuum stacking device 1, the first plane laminating device including the hydraulic cylinder 33, thick buffer materials (large buffering effect) 37 and 42, and thin flexible metal plates (plate-shaped bodies) 38 and 43, The pressing device 2 has a servo motor 53 and relatively thick metal plates (plate-shaped bodies) 50 and 51 but does not have a second plane pressing device 3 with a buffer material. Therefore, as shown in Figure 6, first, if The workpiece 100 passes through the vacuum lamination apparatus 1, and the first temporary laminate 101 is obtained in which the film 106 closely follows the unevenness (copper pattern 105) of the base material 104. The above-mentioned first temporary laminate 101 directly exhibits the unevenness (copper pattern 105) of the base material 104 on the surface. Next, since the first temporary laminated body 101 is passed through the first plane pressing device 2, the first temporary laminated body 101 is pressed in a state of following the unevenness of the surface, so that the unevenness of the surface is roughly flattened. The second temporary laminated body 102. Furthermore, since the second temporary laminated body 102 whose surface unevenness has been gently and roughly flattened is further pressed by the second plane pressing device 3 that does not have a buffer material but has a servo motor, it is possible to obtain a flattened surface. Laminated body 103. In addition, FIG. 6 is a diagram schematically showing the process and equipment, and the description of parts that do not require explanation is omitted.

At this time, in the above-mentioned second plane pressurizing device 3, when the pair of pressurizing blocks 46 and 47 approach each other at the same speed as before, although the surface is generally flattened, it depends on the degree of unevenness of the surface, as shown in Figure 7(a) As shown in the figure, it can be seen that the flow of the resin in the film 106 does not fully reach the recessed portion, and the recessed portion of the obtained laminate 103 tends to be unable to be processed into a flat shape. Furthermore, it can be seen that the resin oozes out from the ends of the film 106 due to the pressurization, and the thickness of the ends of the laminated body 103 tends to be reduced by the amount of the resin that oozes out. On the other hand, in the lamination device of the present invention, since the second plane pressing device 3 controls the speed at which the pair of pressing blocks 46 and 47 approach each other within a predetermined range to press, as shown in Figure 7 As shown in (b), the fluidity of the resin of the film 106 is improved, and even if slight irregularities remain on the roughly flattened uneven surface, the recessed portions can be fully reached, and the entire surface can be flattened. Furthermore, the resin does not ooze out from the ends of the film 106 due to pressure, and the laminated body 103 having a uniform thickness to the ends can be obtained. In addition, the pair of pressure blocks 46 and 47 approaching each other means that the pressure blocks 46 and 47 are relatively close to each other.

That is, the present invention breaks the technical common sense that it is better to speed up the pressurization speed as much as possible in order to reduce the time spent on pressurization in terms of productivity, especially in the above-mentioned second plane pressurizing device 3, and deliberately makes the pressurization speed slower than usual. pressurize at a predetermined speed.

Among them, when the speed V1 at which the pair of pressurizing blocks of the first plane pressurizing device 2 approaches each other and the speed V2 at which the pair of pressurizing blocks of the second plane pressurizing device 3 approach each other are set to satisfy the following equation (1) , since first, in the first plane pressing device 2, the degree of unevenness of the roughly flattened uneven surface of the second temporary laminated body 102 can be within a predetermined range, and in the second plane pressing device 3, it is possible to pressurize the second temporary laminate 102 with The second temporary laminate 102 of the approximately flattened uneven surface, the degree of which is controlled within a predetermined range, is pressurized, so that the resin can be appropriately moved into the recessed portion of the approximately flattened uneven surface, so the resulting laminate The surface of the layer body 103 is further flattened, and the overall thickness variation can be reduced. 0.0008≦V2/V1≦0.02 …(1)

Therefore, in the past, when the unevenness of each part of the uneven surface of the base material was different, it was more difficult to flatten the surface and reduce the overall thickness deviation than when the unevenness of the surface was uniform across the entire surface. According to the The laminate device of the present invention can flatten the surface at a high level even if the unevenness of the base material is mixed with unevenness of different degrees, thereby obtaining the laminated body 103 with less thickness variation.

Next, other embodiments of the present invention will be described. This device is the lamination device shown in Figure 1 and includes a second planar pressurizing device 57 instead of the second planar pressurizing device 3. The other structures are the same as the lamination device shown in Figure 1.

The above-mentioned second plane pressure device 57 has the same basic structure as the second plane pressure device 3 shown in Figure 4 (the pressure block is raised and lowered by the servo motor 53). As shown in Figure 8, on the hot plate The difference is that the upper buffer material 58 is provided between the hot plate 48 and the metal plate (plate-shaped body) 50, and the lower buffer material 59 is provided between the hot plate 49 and the metal plate (plate-shaped body) 51.

In addition, the buffering effect of the upper side buffer material 58 and the lower side buffer material 59 of the second plane pressure device 57 is smaller than that of the first plane pressure device 2 . The materials of the buffer material 58 and the lower buffer material 59 can be the same as the buffer materials 37 and 42 of the first plane pressurizing device 2. Among them, synthetic resin or a combination of synthetic resin and other materials is used. good.

The device formed with this structure also exhibits the same effect as the stacked device shown in FIG. 1 . Furthermore, since the second planar pressurizing device 57 has cushioning materials (upper cushioning material 58 and lower cushioning material 59 ) with a small cushioning effect, the resin of the film 106 can be smoothly moved to the recessed portion of the second temporary laminate 102 , the unevenness of the entire surface can be flattened, and the laminate 103 without uneven thickness can be obtained. That is, since the resin in the convex part of the second temporary laminate 102 is moved to the concave part, force can be directly transmitted like the second plane pressing device 3 without a buffer material, and the surface can be more reliably flat. change. However, at this time, depending on the degree of unevenness of the second temporary laminated body 102, there is a risk that areas that cannot be flattened may occur, and a clear difference from areas that can be flattened tends to be seen. On the other hand, when the cushioning materials 58 and 59 are provided like the second plane pressing device 57, a uniform force can be applied to the entire surface, so that the unevenness of the entire surface tends to be flattened.

In the embodiment of the present invention described above, the temperature, pressure, etc. during pressing of the first plane pressing device 2 and the second plane pressing device 3 (or 57) can be appropriately selected according to the materials of the base material 104 and the film 106. . Among them, in order to achieve excellent completion (flatness, mirror surface) of the laminated body 103, the pressing conditions of the first plane pressing device 2 are set to be higher and higher than the pressing conditions of the second plane pressing device 3 (or 57). Low pressure is better. In addition, it is preferable that the pressing time of the second plane pressing device 3 (or 57) is longer than the pressing time of the first plane pressing device 2.

In addition, in the above-mentioned embodiments, only the lower pressure block of the pair of opposing pressure blocks of the first plane pressure device 2 and the second plane pressure device 3 (or 57) is set to move forward and backward, and the upper side pressure block is set to be able to advance and retreat. The pressurized block is set so that it cannot move forward or backward. However, the upper pressure block may be set to move forward and backward similarly to the lower pressure block. When both of a pair of pressurizing blocks are set to advance and retreat, the pressurizing time can be shortened. At this time, the above-mentioned V1 and V2 are the speeds at which the mutual pressure blocks (the lower pressure block and the upper pressure block) approach each other. However, when either one of the pair of pressurizing blocks is fixed, the speed of the pressurizing block can be controlled with better accuracy, so that the level of planarization of the obtained laminate 103 can be further improved. [Example]

Hereinafter, the present invention will be described in detail with reference to Examples. However, the present invention is not limited to these Examples as long as the gist of the invention is not exceeded.

First, as shown in FIG. 10 , a 40 mm×40 mm sample 107 having copper patterns 105 with different copper densities formed thereon was prepared. Next, as shown in FIG. 9 , the above-described test pieces 107 were randomly arranged on the surface of the base material 104 of 500 mm×500 mm to produce a base material with an uneven surface. In addition, the number attached to each test piece 107 in Figure 9 is "Piece No." and corresponds to the "Piece No." in Table 2 and Figure 11 described later. In addition, the copper density (%) of the above-mentioned copper pattern 105 is the above-mentioned copper density T shown in %. As shown in Figure 10, when the width of the copper wire 108 is L and the spacing between adjacent copper wires 108 is S, according to Calculate it using the following formula. Copper density (%))=L/(L+S)×100 Next, an epoxy resin film 106 with a thickness (h1) of 22.5 μm was placed on the uneven surface of the prepared base material 104 having an uneven surface, and a workpiece 100 that was a pressurized object was produced. In addition, the thickness (h2) of the copper wire 108 is 18 μm.

[Example 1] For the above-mentioned workpiece 100, using the lamination apparatus shown in FIG. 1, the laminated body 103 was produced as follows. First, use the upper hot plate 16 and the lower hot plate 20 of the vacuum stacking device 1 to adjust the space part 26 to 110°C in advance, so that the pressure of the space part 26 30 seconds after the start of extraction is 100 Pa or less. The elastic pressure plate 17 and the lower elastic pressure plate 21 pressurize the workpiece 100 with a pressure of 1 MPa for 20 seconds, and the first temporary laminated body 101 is produced. Next, in the first plane pressurizing device 2, stainless steel plate-shaped bodies (SUS630H, 2 mm) were used as the upper flexible metal plate (plate-shaped body) 38 and the lower flexible metal plate (plate-shaped body) 43, with a thickness of 2.5 mm vinylidene fluoride rubber as the upper buffer material 37 and the lower buffer material 42. Furthermore, the upper hot plate 36 and the lower hot plate 41 are adjusted to 120°C, the lower pressure block 28 is raised with the hydraulic cylinder 33, and the lower flexible metal plate (plate-shaped body) 43 is set to 7.5 The first temporary laminated body 101 is contacted at a speed of mm/second. Furthermore, the first temporary laminated body 101 is heated and pressed with a pressure of 0.8 MPa for 30 seconds using the upper flexible metal plate (plate-shaped body) 38 and the lower flexible metal plate (plate-shaped body) 43 to produce The second temporary laminate 102 is obtained. Then, in the second plane pressurizing device 3, the hot plates 48 and 49 are adjusted to 100° C. and set to the distance between the metal plate (plate-shaped body) 50 with a thickness of 2 mm and the metal plate (plate-shaped body) 51 with a thickness of 2 mm. The distance is 20 μm smaller than the thickness of the second temporary laminate 102 . Next, the lower pressure block 47 is raised with the servo motor 53, and the operation of the servo motor 53 is controlled so that the metal plate (plate-shaped body) 51 contacts the second temporary laminated body 102 at a speed of 0.01 mm/second. The second temporary laminated body 102 was pressed for 60 seconds, and the laminated body 103 was produced.

[Example 2] In the lamination device shown in Fig. 1, a lamination device using a second plane pressure device 57 (see Fig. 8) is used instead of the second plane pressure device 3. In this second plane pressure device 57, the servo The laminate 103 was produced in the same manner as in Example 1 except that the operation of the motor 53 was controlled so that the metal plate (plate-shaped body) 51 came into contact with the second temporary laminate 102 at a speed of 0.1 mm/second. . The above-mentioned second plane pressing device 57 uses a thickness of 0.5 between the metal plate (plate-shaped body) 50 and the hot plate 48 of the second plane pressing device 3, and between the metal plate (plate-shaped body) 51 and the hot plate 49. mm vinylidene fluoride rubber as buffer material 58, 59.

[Example 3] In the second plane pressurizing device 3, the operation of the servo motor 53 is controlled so that the metal plate (plate-shaped body) 51 contacts the second temporary laminated body 102 at a speed of 0.1 mm/second. In the same manner as Example 1, a laminated body 103 was produced.

[Comparative example 1] In the second plane pressurizing device 3, the operation of the servo motor 53 is controlled so that the metal plate (plate-shaped body) 51 comes into contact with the second temporary laminated body 102 at a speed of 1 mm/second. Except for this, it is the same as in the embodiment. 1Similarly, the laminated body 103 was produced.

[Comparative example 2] In the second plane pressing device 3, the operation of the servo motor 53 is controlled so that the metal plate (plate-shaped body) 51 contacts the second temporary laminated body 102 at a speed of 0.003 mm/second. In the same manner as Example 1, a laminated body 103 was produced.

[Comparative example 3] In the lamination device shown in Fig. 1, a lamination device using a first plane pressure device 2' (see Fig. 3) instead of the second plane pressure device 3 is used. In Comparative Example 3, vinylidene fluoride rubber with a thickness of 0.5 mm was used as the first plane pressurizing device 2', which has an upper cushioning material 37 and a lower cushioning material 42. That is, the first plane pressurizing device 2' has a cushioning material whose buffering effect is smaller than that of the first plane pressurizing device 2. Next, in the first plane pressurizing device 2', the upper hot plate 36 and the lower hot plate 41 are adjusted to 120°C, and the lower pressure block 28 is raised with the hydraulic cylinder 33 to set the lower flexibility. The metal plate (plate-shaped body) 43 contacts the second temporary laminated body 102 at a speed of 7.5 mm/second. Then, the above-mentioned second temporary laminate 102 is heated and pressed at a pressure of 0.8 MPa for 30 seconds with the upper flexible metal plate (plate-shaped body) 38 and the lower flexible metal plate (plate-shaped body) 43 . Except for this, the laminate 103 was produced in the same manner as in Example 1.

Regarding the laminated body 103 obtained in Examples 1 to 3 and Comparative Examples 1 to 3, the thickness of each test piece 107 (each “Piece No.” shown in FIG. 9 ) was measured. The above-mentioned measurement was performed at the center (center of gravity) of the above-mentioned test piece 107. Then, the maximum thickness, minimum thickness, average thickness, and total thickness (minus the minimum thickness from the maximum thickness) were calculated from the measurement results, and are shown in Table 1 below. In addition, regarding Example 1 and Comparative Example 3, the change in the measured thickness of each test piece 107 is shown in FIG. 11 . In addition, regarding Example 1, the thickness of each measured location is also shown in Table 2 described below. From Table 2, it can be seen that the specimen 107 showing the minimum thickness is Piece No. 17, 60, 61, and 64, and the specimen 107 showing the maximum thickness is Piece No. 35, 37.

Next, in order to investigate the amount of resin seepage from the end of the film 106 in the obtained laminate 103, as shown in FIG. 12(a) , measurements were made from the end of the film 106 (distance from the reference point) to the center of the figure. The distance (mm) of resin seepage in the direction indicated by the white arrow is also recorded in Table 1 below.

In addition, for each of the laminates 103 of Example 1 and Comparative Example 3, the resin value of the film 106 was measured at any point at a predetermined distance from the end (distance from the reference point) in the direction indicated by the black arrow in the figure. thickness. The results are shown in Figure 12(b). It can be seen from the results of FIG. 12(b) that in Example 1 where there is almost no resin bleed out of the film 106, the resin thickness of the film 106 is approximately uniform to the vicinity of the end. In contrast, the amount of resin bleed out of the film 106 is much greater. In Comparative Example 3, the resin thickness of the film 106 decreases as it approaches the end, and the resin thickness of the film 106 has a maximum difference of 22 μm.

[Table 1] Example 1 Example 2 Example 3 Comparative example 1 Comparative example 2 Comparative example 3 Pressure speed of the first plane V1 (mm/second) 7.5 7.5 7.5 7.5 7.5 7.5 Second plane pressurization speed V2 (mm/second) 0.01 0.1 0.1 1 0.003 7.5 V2/V1 0.0013 0.0133 0.0133 0.1333 0.0004 1 Maximum thickness(mm) 0.561 0.562 0.560 0.563 0.567 0.568 Minimum thickness(mm) 0.549 0.548 0.549 0.546 0.550 0.543 Average thickness (mm) 0.554 0.556 0.555 0.557 0.554 0.555 Full distance(mm) 0.012 0.014 0.011 0.017 0.017 0.025 Distance of exuded resin (mm) 2.0 2.0 2.0 3.0 2.0 5.0

[Table 2] Piece No. Copper density (%) Thickness(mm) Piece No. Copper density (%) Thickness(mm) Piece No. Copper density (%) Thickness(mm) Piece No. Copper density(%) Thickness(mm) 1 50 0.551 17 50 0.549 33 50 0.556 49 60 0.553 2 33 0.553 18 38 0.554 34 33 0.557 50 43 0.557 3 33 0.556 19 27 0.551 35 71 0.561 51 60 0.557 4 43 0.553 20 29 0.556 36 43 0.559 52 33 0.557 5 67 0.553 twenty one 67 0.559 37 67 0.561 53 83 0.554 6 75 0.552 twenty two 77 0.556 38 75 0.559 54 50 0.556 7 83 0.551 twenty three 57 0.558 39 50 0.56 55 67 0.555 8 71 0.552 twenty four 44 0.552 40 33 0.559 56 50 0.549 9 43 0.55 25 57 0.55 41 50 0.555 57 50 0.553 10 27 0.554 26 55 0.554 42 33 0.558 58 38 0.553 11 29 0.555 27 44 0.554 43 43 0.559 59 55 0.552 12 38 0.557 28 27 0.554 44 60 0.554 60 27 0.549 13 57 0.556 29 77 0.556 45 50 0.559 61 77 0.549 14 67 0.552 30 40 0.557 46 67 0.557 62 40 0.554 15 77 0.553 31 50 0.553 47 83 0.555 63 57 0.551 16 67 0.552 32 38 0.553 48 71 0.55 64 44 0.549

From these results, in Examples 1 to 3, since the metal plate (plate-shaped body) 51 of the second plane pressing device 3 contacts the second temporary laminated body 102 at a slower speed (0.01 mm/second) than usual, even if The degree of unevenness of the base material (the copper density of the copper pattern 105) varies from place to place. No matter where, the resin of the film 106 flows smoothly, allowing the resin on the convex parts to move to the concave parts appropriately and reliably, even in subtle ways. The unevenness is also eliminated, and as a result, the laminated body 103 whose surface is flattened to a higher level can be obtained. Especially in Embodiment 1 and 3, since a thing without a buffer material between the metal plate and the hot plate is used as the second plane pressing device 3, even if the workpiece 100 has a thickness difference caused by the density of copper, it can be Fully flatten the whole thing. In addition, since the contact between the metal plate (plate-shaped body) 51 of the second plane pressing device 3 and the second temporary laminated body 102 is performed at a slower speed than usual, the occurrence of the above-mentioned second temporary laminated body 102 can be prevented. The disadvantage is that the resin inside overflows from its end. In contrast, the speed at which the metal plate (plate-shaped body) 51 (or the flexible metal plate 43) of the second planar pressurizing device 3 (or the first planar pressurizing device 2') contacts the second temporary laminated body 102 The thickness deviations of Comparative Examples 1 to 3, which are outside the range specified by the present invention, are all worse than those of Examples 1 to 3. That is, even if the servo motor 53 is used as the driving device of the second plane pressurizing device 3, when the contact speed exceeds the upper limit of the range specified by the present invention, the resin of the film 106 cannot fully flow (Comparative Example 1). ), if the contact speed is less than the lower limit of the range specified by the present invention, uneven flow of resin in the film 106 occurs (Comparative Example 2), so the obtained laminate 103 cannot be sufficiently flattened. Particularly in Comparative Example 2, the degree of thickness unevenness is large, and the degree of thickness unevenness can be determined visually. Furthermore, in Comparative Examples 1 to 3, it can be seen that the distance of the resin that oozes out is also long because the resin with a concentrated thickness that does not follow the unevenness bleeds out to the outside. The thickness of the part is different.

In order to solve the uneven thickness of the laminated body 103 and fill the recessed portion in the base material, it is advantageous to have a thick film (resin) 106 . For example, compared with laminating a 40-μm-thick film (resin) on a substrate with a convex portion having a thickness of 18 μm, it is difficult to flatten the film (resin) that is 22.5 μm thick. In addition, the ratio of the thickness of the film (resin) to the thickness of the convex portion was 2.22 for the former and 1.25 for the latter. That is, assuming that the workpiece 100 is pressed ideally (a state in which the film directly contacts the recessed portion of the base material without resistance), the former places a film (resin) with a thickness of 22 μm (40 μm-18 μm) on the convex portion of the base material. In contrast, in the latter, a film (resin) with a thickness of 4.5 μm (22.5 μm-18 μm) is placed on the convex part of the base material. Therefore, the amount of resin that can be filled in the concave parts of the base material is 4 times different simply by calculation. The difficulty of flattening also varies. According to the present invention, even if the thickness of the film (resin) 106 is thinner than before (for example, 30 μm or less), the laminate 103 can be flattened to a high level.

The above-mentioned embodiments show specific aspects of the present invention, and the above-mentioned embodiments are only illustrative and are not to be interpreted in a limiting manner. Various modifications intended to be clearly understood by those skilled in the art are within the scope of the present invention. [Industrial availability]

The present invention can be used as a laminating device that can accurately laminate a base material and a resin film.

1: Vacuum laminating device 2: First plane pressurizing device 2’: 1st plane pressurizing device 3: Second plane pressurizing device 4:Conveying device 4’:Conveying device 5:Transportation film 5’:Transportation film 6:Fan 6’:Fan 7: Conveyor for moving in 8: Pressure table 9:Pillar 10: Fixtures 11:Upper plate 12:Lower board 13: Connector 14:Hydraulic cylinder 14a:piston rod 15:Upper side insulation material 16:Hot plate on the upper side 17: Upper elastic pressure plate 19: Lower side insulation material 20: Lower side hot plate 21: Lower elastic pressure plate 23: Movable vacuum frame 24: Upper fixed frame part 25: Movable frame 26:Space Department 27: Upper side pressure block 28: Lower side pressure block 29: Pressure table 30:Pillar 31:Fixed appliances 32:Connector 33:Hydraulic cylinder 33a:piston rod 35:Upper side insulation material 36:Hot plate on the upper side 36a: Sheath heater 37: Upper side buffer material 38: Upper side flexible metal plate 39: Lower basal layer 40: Lower side insulation material 41: Lower side hot plate 41a: Sheath heater 42: Lower side buffer material 43: Lower side flexible metal plate 44: Pressure table 45:Pillar 46: Upper side pressure block 47: Lower side pressure block 48:Hot plate 49:Hot plate 50: Metal plate (plate-shaped body) 51: Metal plate (plate-shaped body) 52: Ball screw 52a:Screw shaft 52b: Nut 53:Servo motor 54: Linear scale 54a: ruler 54b: Encoder reading head 55: Film dispensing machine for transportation 55’: Film dispensing machine for transportation 56: Film winding machine for transportation 56’: Film winding machine for transportation 57: 2nd plane pressurizing device 58:Upper side buffer material 59: Lower side buffer material 100:Artifact 101: 1st temporary laminate 102: The second temporary laminate 103:Laminated body 104:Substrate 105: Copper graphics 106:Film 107:Test piece H1:Thickness H2:Thickness h2: Thickness of copper wire L: Width of copper wire S: The spacing between adjacent copper wires Q1: Place Q2:Place W: concave and convex degree

FIG. 1 is a schematic structural diagram illustrating a lamination device according to an embodiment of the present invention. FIG. 2 is an explanatory diagram of a vacuum laminating device of the above-mentioned laminating device. FIG. 3 is an explanatory diagram of the first plane pressurizing device of the above-described lamination device. FIG. 4 is an explanatory diagram of the second plane pressing device of the above-mentioned lamination device. FIG. 5 is a diagram illustrating the degree of unevenness of the second temporary laminated body obtained by each device of the above-mentioned laminating device. FIG. 6 is an explanatory diagram of a first temporary laminated body, a second temporary laminated body, and a laminated body obtained by using each of the above-mentioned laminating devices. FIG. 7(a) is a diagram illustrating a conventional laminated body, and FIG. 7(b) is a diagram illustrating a laminated body of the present invention. FIG. 8 is a diagram illustrating a modification of the above-mentioned second plane pressurizing device. Figure 9 is a diagram illustrating a substrate used in an embodiment of the present invention. FIG. 10 is a diagram illustrating a method of calculating the copper density according to the embodiment of the present invention. FIG. 11 is a graph showing changes in thickness of the embodiment of the present invention. FIG. 12(a) is a diagram illustrating the distance from the reference point of the laminate according to the embodiment of the present invention, and FIG. 12(b) is a graph showing changes in the resin thickness according to the embodiment of the present invention.

1: Vacuum laminating device

2: First plane pressurizing device

3: Second plane pressurizing device

4:Conveying device

4’:Conveying device

5:Transportation film

5’:Transportation film

6:Fan

6’:Fan

7: Conveyor for moving in

11:Upper plate

12:Lower board

26:Space Department

27: Upper side pressure block

28: Lower side pressure block

46: Upper side pressure block

47: Lower side pressure block

55: Film dispensing machine for transportation

55’: Film dispensing machine for transportation

56: Film winding machine for transportation

56’: Film winding machine for transportation

100:Artifact

101: 1st temporary laminate

102: The second temporary laminate

103:Laminated body

104:Substrate

105: Copper graphics

106:Film

Claims (3)

A lamination device that laminated films on the concave and convex surfaces of a substrate with concavities and includes: A vacuum laminating device that makes the film closely follow the base material under reduced pressure to form a first temporary laminate having an uneven surface that follows the uneven surface of the base material; a first plane pressing device that presses the first temporary laminated body to substantially flatten the uneven surface of the first temporary laminated body, thereby forming a second temporary laminated body having an approximately flattened uneven surface; and The second plane pressing device presses the second temporary laminated body under different conditions from the first plane pressing device to further flatten the roughly flattened uneven surface of the second temporary laminated body. laminated body; The first planar pressurizing device has a pair of opposing pressurizing blocks, at least one of the pair of pressurizing blocks is set to move forward and backward relative to the other, and at least one of the pair of pressurizing blocks has a hot plate. , plate-shaped bodies, and buffer materials arranged between them; The second plane pressurizing device has a pair of opposing pressurizing blocks and a servo motor connected to at least one of the pair of pressurizing blocks, and is set so that the pair of pressurizing blocks can be driven by the actuation of the servo motor. At least one of the pressurizing blocks advances and retreats relative to the other. At least one of the pair of pressurizing blocks has a hot plate and a plate-shaped body. There is no buffer material between them or the buffering effect is smaller than that of the first plane pressurizing block. The buffer material of the buffer material of the pressing device controls the operation of the servo motor so that the speed at which the pair of pressing blocks approach each other is 0.005~0.5 mm/second. The stacked device of claim 1, wherein: If the speed at which a pair of pressurizing blocks of the first plane pressurizing device approaches each other is V1, and the speed at which a pair of pressurizing blocks of the second plane pressurizing device approaches each other is V2, then V1 and V2 satisfy the following Expression (1): 0.0008≦V2/V1≦0.02 …(1). The laminated device of Claim 1 or Claim 2, wherein, At least one of the pair of pressurizing blocks of the first plane pressurizing device is connected to a hydraulic cylinder or a pneumatic cylinder. By the actuation of the hydraulic cylinder or pneumatic cylinder, at least one of the pair of pressurizing blocks can be moved relative to the other. One advances or retreats.

Images