EP2820348A1 - Dispositif d'éclairage - Google Patents

Dispositif d'éclairage

Info

Publication number
EP2820348A1
EP2820348A1 EP13704110.9A EP13704110A EP2820348A1 EP 2820348 A1 EP2820348 A1 EP 2820348A1 EP 13704110 A EP13704110 A EP 13704110A EP 2820348 A1 EP2820348 A1 EP 2820348A1
Authority
EP
European Patent Office
Prior art keywords
light source
semiconductor light
source module
carrier
lighting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13704110.9A
Other languages
German (de)
English (en)
Other versions
EP2820348B1 (fr
Inventor
Gerhard Behr
Stephan Schwaiger
Philipp Helbig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2820348A1 publication Critical patent/EP2820348A1/fr
Application granted granted Critical
Publication of EP2820348B1 publication Critical patent/EP2820348B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/39—Attachment thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/02—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with provision for adjustment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/04—Fastening of light sources or lamp holders with provision for changing light source, e.g. turret
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/06—Optical design with parabolic curvature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/30—Semiconductor lasers

Definitions

  • the invention relates to a lighting device according to the preamble of claim 1.
  • Such a lighting device is disclosed, for example, in WO 2006/066530 Al. Loading this writing writes a lighting device with a semiconductor light source module and an optical system mounted on the front ⁇ side of a common support. Insbeson ⁇ particular, the optics on a plurality of ball pins which extend through bores in accurately fitting Halbleiterlicht provokenmo- dul and in the carrier.
  • the illumination device has a semiconductor light source module and an optical system as well as a common carrier for the semiconductor light source module and the optical system, wherein the optical system is mounted on a front side of the carrier by means of at least one dowel pin which extends into a fitting of the semiconductor light source module.
  • the semiconductor ⁇ light source module on one of the front hindered ⁇ constricting back of the carrier, and the at least one alignment pin protrudes through an opening in the carrier and extends into the accurately fitting bore of the semiconductor light source module, wherein the at least one dowel pin forms a heel, which abuts against a resting on the back of the support surface of the semiconductor light source module.
  • passge ⁇ right hole means that the diameter of the bore at least one dowel pin is suitable meet voted from ⁇ on the diameter of the plug in the bore of the portion. That is, the diameter of the passgerech- th hole in the semiconductor light source module corresponds to the diameter of the arranged in the mating bore portion of the at least one dowel pin.
  • the opening in the carrier and the fitting hole in the semiconductor light source module and the arrangement of optics and Halblichtquel ⁇ Lenmodul on different sides of the carrier can be replaced in the illumination device according to the invention, the semiconductor light source module in a simple manner without first having the optics or other parts of the Lighting device according to the invention must be dismantled for this purpose.
  • the at least one dowel pin in cooperation with the pass ⁇ just bore in the semiconductor light source module allows exact alignment or adjustment of the optics with respect to the semiconductor light source module.
  • the dowel pin determines the height of the optics on the support surface of the semiconductor light source module and defined by the fitting bore in the semiconductor light source module, the orientation and position of the optics with respect to the semiconductor light source module in a plane parallel to the support surface.
  • the at least one dowel pin is integrally formed with the optic. This allows the min- be used least one dowel pin not only for adjustment, but as a means for fixing the optics on Halbleiterlichtquel ⁇ lenmodul. Further characterized the Ferti ⁇ supply is simplified, as can be manufactured simultaneously with the optics in the same manufacturing step dowel.
  • the at least one dowel pin is hollow and has a screw thread for receiving a screw. As a result, the at least one dowel pin can additionally be used to attach the optics to the semiconductor light source module.
  • the at least one dowel pin protrudes from the bore in the semiconductor light source module from a side facing away from the Auflageflä ⁇ che side of the semiconductor light source module out and protruding from the hole in the semiconductor light source module portion of the dowel pin is provided with ei ⁇ nem screw thread for a nut.
  • the inventive BL LEVEL ⁇ processing device in first fixing means provided for fixing the bearing surface of Halbleiterlichtettesnmo- duls at the back of the wearer.
  • Example ⁇ example can be designed as a screw ⁇ connection between the semiconductor light source module and optics, or as a clamping device which presses the semi-conductor light source module ⁇ with its contact surface to the backside of the support the first securing means.
  • the screw connection has over the clamping device the advantage that with their help, a comparatively high contact pressure between the semiconductor light source module and the carrier can be achieved and thus a good thermal coupling between the semiconductor light source module and carrier is made possible.
  • second fastening means are provided which serve to fix the optics on the carrier.
  • These second fastening means allow the optics to be fixed to the carrier independently of the at least one dowel pin and to ensure that the connection between the optics and the carrier remains in the case of a dismantled semiconductor light source module.
  • the second fastening means as Be ⁇ snap or detent connection are be- see optics and carrier be formed. The snap or locking connection allows a fixation of the optics on the carrier in an already roughly aligned alignment.
  • the support of the illumination device according to the invention advantageously has a recess for receiving a section of the semiconductor light source module provided with semiconductor light sources. This makes it possible ⁇ light that equipped with the semiconductor light sources portion of the semiconductor light source module extends to the front of the carrier, so that the light emitted from the semiconductor light sources light impinges on the arranged on the front of the carrier optics.
  • the carrier of the illumination device according to the invention is designed as a heat sink. This can ensures an effective cooling of the Halbleiterlichtánnmo ⁇ duls, since the heat generated by the semiconductor light source module ⁇ is discharged to the environment by means of the heat sink.
  • the semiconductor light source module of the illumination unit according to the invention Be ⁇ preferably has a heat sink on which the semiconductor light sources are arranged.
  • the bearing surface of the Halbleiterlichtquel ⁇ lenmoduls is formed as part of the heat sink.
  • the above offer screw connections described between the semiconductor light source module and the carrier by means of at least one dowel the ability to generate a high contact pressure between the support surface of the semiconductor light source module and the back of the carrier and thereby ei ⁇ ne good thermal coupling between Halbleitlichtquel ⁇ Lenmodul and carrier to achieve.
  • the heat sink is preferably made of metal, wherein ⁇ game as copper or aluminum, or of ceramic, aluminum nitride game as examples in order to ensure a good Thermal conductivity ⁇ ness.
  • the designed as a heat sink carrier is preferably made of metal, such as aluminum, to ensure good thermal conductivity ⁇ afford and is preferably provided with cooling fins to achieve a large surface area, which is in contact with the ambient air for the purpose of cooling.
  • the semiconductor light source module of the illumination device has electrical components of an operating device for the semiconductor light sources.
  • the semiconductor light source module can be connected directly to the mains voltage, for example the vehicle electrical system voltage of a motor vehicle.
  • the electrical components of the operating device are arranged on the heat sink of the semiconductor light source module in order to be able to dissipate the heat generated by the electrical components of the operating device also via the heat sink to the carrier designed as a heat sink.
  • Figure 1 shows a longitudinal section through the illumination device according to the preferred embodiment of the invention in a schematic representation with sectional plane in the range of two dowel pins
  • FIG. 2 shows a cross section through the illumination device depicted in FIG. 1 in a schematic representation with a sectional plane in the region of a dowel pin
  • Figure 3 shows a detail of Figure 1 with an enlarged view of a dowel pin
  • FIG. 4 shows a longitudinal section through the optics of FIG
  • FIG. 5 shows a cross section through the selectbil ⁇ Deten in Figure 1 lighting device in a schematic view with sectional plane in the region of the fastening of the semiconductor light source module and carrier
  • FIG. 6 shows a longitudinal section through the substitutebil in Figure 1 ⁇ finished illumination device in a schematic view with sectional plane in the region of the fastening of optical and carrier 7 is a rear view of the lighting device depicted in Figure 1 in a perspective view
  • FIG. 8 shows a front view of the illumination device depicted in FIG. 1 in perspective view
  • the lighting device illustrated in FIGS. 1 to 8 is a lighting device which is provided for use in the headlight of a motor vehicle.
  • This lighting device has as essential components a semiconductor light source module 1, an optic 2 and a common carrier 3 for the semiconductor light source module 1 and the optics 2.
  • the carrier 3 is formed by a rectangular aluminum plate, which has a flat front side 31 and a remindsei ⁇ te 32 and at the rear 32 cooling fins 30 are arranged.
  • the carrier 3 has on a longitudinal edge a recess 33 for receiving the Halbleiterlichtquel ⁇ lenmoduls 1.
  • the carrier 3 serves as a heat sink for the semiconductor light source module 1 and is therefore sometimes referred to below as the heat sink 3.
  • In the carrier three openings 34 are mounted for each a dowel pin 23 of the optics 2.
  • the three openings 34 in Trä ⁇ gers 3 are arranged in the manner of a triangle on the front side 31 of the support 3. That is, the three through ⁇ holes 34 formed on the front side 31 of the carrier 3, the corner points of a notional triangle.
  • the optical system 2 is configured as a reflector to the light emitted from the semiconductor light source module 1 to the light reflectors ⁇ animals.
  • the optic 2 is cup-shaped, shaped with a substantially parabolic curvature. She has a light reflective surface 21, which faces the semiconductor light ⁇ sources of the semiconductor light source module 1.
  • the light-reflecting surface 21 is arranged on the inside ⁇ side of the shell-like optics 2.
  • the third dowel pin 23 shown only very schematically in FIG.
  • the optic 2 is arranged on the front side 31 of the support 3 and its three dowel pins 23 each protrude through an opening 34 in FIG Carrier 3 through.
  • the three dowel pins 23 each have two portions 231, 232 with differentgeber barnmes ⁇ ser.
  • the first portion 231 is formed on the outer side 22 of the lens 2 and the second portion 232 immediately adjoins the first portion 231 and forms the free end of the respective dowel pin 23.
  • each dowel 23 On transition from the first portion 231 to the second portion 232 forms each dowel 23 a shoulder 230, which is caused depending ⁇ wells by the different outside diameters of the two portions 231, 232nd
  • the outer ⁇ diameter of the second paragraph 232 is smaller at each dowel 23 than the outer diameter of its first portion 231.
  • the first portion 231 of dowel pins 23 in each case projects through the corresponding aperture 34 in the carrier 3 passes, so that the second portion 232 of the dowel pins 23 respectively at the back 32 of the carrier 3 stands out.
  • the optic 2 To fix the optic 2 to the support 3, the optic 2 is provided with two spring-trained Schnappha ⁇ ken 24, which are integrally formed on the outside 22 of the optic 2 and each behind in a recess 35 of the support 3 on its back 32.
  • the buildin ⁇ account the optical system 2 by means of the snap-hook 24 is shown schematically in Figures 5 and 6.
  • the semiconductor light source module 1 has a heat sink 10 made of aluminum with a first wedge-like section 11, on the surface 110 of which a mounting plate 4 with five light-emitting diode chips 40 arranged in a row is mounted.
  • the LED chips 40 emit ⁇ animals white light during operation.
  • the mounting plate 4 is formed ⁇ excluded, for example, as a metal core circuit board.
  • electrical components 10 mounted a loading ⁇ driving device for the light emitting diode chips 40 on a surface of the heat sink.
  • the first section 11 of the semiconductor light source module 10 is arranged in the recess 33 of the carrier 3 and projects beyond the front side 31 of the carrier 3, so that the light-emitting diode chips 40 are arranged substantially at the focal point of the parabolic optic 2 and the light emitted by the light-emitting diode chips 40 on the Light re ⁇ inflecting inside 21 of the optic 2 meets.
  • the heat sink 10 further has a second, plate-like ⁇ formed portion 12 which is angled perpendicular to the first portion 11.
  • the second, plate-like Ab ⁇ section 12 of the heat sink 10 forms a bearing surface 120, which rests against the back 32 of the support 3.
  • the second, plate-like section 12 of the heat Ke 10 are three mating holes 121 arranged for each one of the three dowel pins 23 of the optics 2.
  • the diameter of the holes 121 is in each case matched to the outer diameter of the second portion 232 of the corresponding dowel pin 23, so that the second portion 232 of the dowel pins 23 respectively fits exactly into the corresponding bore 121.
  • the diameter of the holes 121 is thus smaller than the outer diameter of the first portion 231 of the dowel pins 23.
  • the second portion 232 of the three dowel pins 23 extending respectively into the corresponding bore 121 in the second, plattenarti ⁇ gen portion 12 of the heat sink 10, so that the shoulder 230 of the respective rests against the support surface 120 of the second, plate-like portion 12 of the heat sink 10.
  • this fact is shown schematically. Therefore, the paragraph 230 of dowel pins 23 determines the height of the optical system 2 to the bearing surface 120 of the two ⁇ th, plate-like portion 12 of the heat sink 10 and thus the height position of the optical system 2 with respect to the light-emitting diodes denchips 40.
  • the spatial position and orientation of the optical system 2 with respect to the light-emitting diode chips 40 in directions paral ⁇ lel to the bearing surface 120 is determined by the position of the three holes 121. Since the outer diameter of the second portion 232 of the three dowel pins 23 is matched in each case to the diameter of the corresponding bore 121, the dowel pins 23 are each arranged free of play in the ent ⁇ speaking bore 121st To fix the optical system 2 to the semiconductor light source module 1 from the back side 32 of the carrier 3 or by a ge Chemistry of the Aufla- 120 facing away from rear side 122 of the second Ab ⁇ section 12 of the heat sink 10 each having a screw 5 is in each of the three holes 121 is inserted and bolted to the screw thread in the corresponding hollow dowel pin 23.
  • the shoulder 230 of the corresponding dowel pin 23 is pressed against the support surface 120 of the second portion 12 of the heat sink 10.
  • two further screws 6 are provided, which are inserted into screw holes on the back 122 of the second, plate-like portion 12 of the heat sink 10 and are screwed with corresponding screw holes in the carrier 3.
  • a bushing 7 is also arranged, which contains the electrical Kontak ⁇ te for powering the semiconductor light source module 1 and is provided for receiving a plug.
  • the semiconductor light source module 1 is supplied with the vehicle electrical system voltage of the motor vehicle.
  • three fastening devices 8 projecting beyond the side edges of the carrier 3 are furthermore arranged, which serve for mounting the illumination device in a motor vehicle.
  • the screws 5 and 6 are released on the rear side 122 of the second, plate-like section 12 of the heat sink 10 of the semiconductor light source module 1.
  • the half ⁇ conductor light source module 1 can be detached from the back 32 of the Trä ⁇ gers 3, by being subtracted from the extending into the bores 121 second portions 232 of the locating pins 23rd
  • the optics 2 is after removing the screws 5 and the semiconductor light source Module 1 by means of the snap hooks 24 and the plug-in pins 34 in the passages 23 on the carrier 3 still sufficiently fixed so that they can not be detached from the carrier 3.
  • the assembly of the new semiconductor light source module 1 is done in the reverse order as the De ⁇ assembly.
  • the semiconductor light source module 1 may have a primary optics additionally disposed immediately above the light emitting diode chips 40 and 40 emit ⁇ benefited from the light emitting diode chip to the light reflecting inner side 21 of the optical system 2 guides.
  • This primary optics may be, for example, an optical lens or an optical concentrator.
  • the semiconductor light sources of Halbleiterlichtánnmo ⁇ duls 1 may also have to ⁇ broader light sources such as Superlumineszenzdio ⁇ or laser diodes instead of the LED chip 40th
  • the optics 2 may have other shapes than the shell-like according to the preferred embodiment.
  • the light-reflecting surface 21 of the optics may be partially or completely coated with phosphor.
  • the dowel pins 23 of the optics 2 do not necessarily have to be hollow.
  • the second portions 232 of the dowel pins 23 may be easilybil ⁇ det that they protrude through the corresponding bore 121 in the second portion 12 of the heat sink 10 of the semiconductor light source ⁇ module 1 and protruding on the back 122 of the heat sink 10 part of the second th Section 232 of the dowel pins has a screw thread points, on which a nut can be screwed to screw the semiconductor light source module 1 with the optics 2.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

L'invention concerne un dispositif d'éclairage comprenant un module source de lumière à semi-conducteur (1) et une optique (2), ainsi qu'un support commun (3) pour le module source de lumière à semi-conducteur (1) et l'optique (2), l'optique (2) étant montée sur une face avant (31) du support (3), et présentant au moins une goupille d'assemblage (23), qui s'étend dans un alésage approprié (121) ménagé dans le module source de lumière à semi-conducteur (1), - le module source de lumière à semi-conducteur (1) prenant appui contre une face arrière (32) du support (3), opposée à la face avant (31), - la au moins goupille d'assemblage (23) étant en saillie à travers une ouverture (34) dans le support (3), et s'étendant dans l'alésage approprié (121) du module source de lumière à semi-conducteur (1), et - la au moins goupille d'assemblage (23) formant un épaulement (230) qui est en appui contre une surface d'appui (120) du module source de lumière à semi-conducteur (1), adjacente à la face arrière (32) du support (3).
EP13704110.9A 2012-02-27 2013-02-13 Dispositif d'illumination Active EP2820348B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012202933A DE102012202933A1 (de) 2012-02-27 2012-02-27 Beleuchtungseinrichtung
PCT/EP2013/052878 WO2013127632A1 (fr) 2012-02-27 2013-02-13 Dispositif d'éclairage

Publications (2)

Publication Number Publication Date
EP2820348A1 true EP2820348A1 (fr) 2015-01-07
EP2820348B1 EP2820348B1 (fr) 2016-04-13

Family

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Family Applications (1)

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EP13704110.9A Active EP2820348B1 (fr) 2012-02-27 2013-02-13 Dispositif d'illumination

Country Status (7)

Country Link
US (1) US9297522B2 (fr)
EP (1) EP2820348B1 (fr)
CN (1) CN104136835B (fr)
DE (1) DE102012202933A1 (fr)
ES (1) ES2582503T3 (fr)
HU (1) HUE029602T2 (fr)
WO (1) WO2013127632A1 (fr)

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DE102018105004A1 (de) 2018-03-05 2019-09-05 Vossloh-Schwabe Deutschland Gmbh Leuchte

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CN108692268A (zh) * 2017-04-04 2018-10-23 汽车照明罗伊特林根有限公司 用于将激光二极管安装在冷却体上的方法、根据该方法安装的光射出单元和机动车前照灯
DE102018105004A1 (de) 2018-03-05 2019-09-05 Vossloh-Schwabe Deutschland Gmbh Leuchte

Also Published As

Publication number Publication date
US9297522B2 (en) 2016-03-29
DE102012202933A1 (de) 2013-08-29
WO2013127632A1 (fr) 2013-09-06
CN104136835B (zh) 2016-07-06
CN104136835A (zh) 2014-11-05
US20140376232A1 (en) 2014-12-25
HUE029602T2 (en) 2017-02-28
EP2820348B1 (fr) 2016-04-13
ES2582503T3 (es) 2016-09-13

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