EP2807700A1 - Décalage de protection et amélioration de couplage de cartes à puce métallisées - Google Patents

Décalage de protection et amélioration de couplage de cartes à puce métallisées

Info

Publication number
EP2807700A1
EP2807700A1 EP13704726.2A EP13704726A EP2807700A1 EP 2807700 A1 EP2807700 A1 EP 2807700A1 EP 13704726 A EP13704726 A EP 13704726A EP 2807700 A1 EP2807700 A1 EP 2807700A1
Authority
EP
European Patent Office
Prior art keywords
antenna
module
booster
smart card
ferrite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13704726.2A
Other languages
German (de)
English (en)
Inventor
David Finn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Feinics Amatech Teoranta Ltd
Original Assignee
Feinics Amatech Teoranta Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/600,140 external-priority patent/US8991712B2/en
Priority claimed from US13/730,811 external-priority patent/US9165240B2/en
Application filed by Feinics Amatech Teoranta Ltd filed Critical Feinics Amatech Teoranta Ltd
Publication of EP2807700A1 publication Critical patent/EP2807700A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment

Definitions

  • the invention in some aspects, relates to "secure documents" such as electronic passports, electronic ID cards and smart cards (data carriers) having RFID (radio frequency identification) chips or chip modules (CM) and operating in a contactless mode (ISO 14443) including dual interface (DI, or DIF) cards which can also operate in contact mode (ISO 7816-2), and more particularly to improving coupling between components within the smart card, such as between a module antenna (MA) connected with the RFID chip (CM) and a booster antenna (BA) in the card body (CB) of the smart card and inductively coupled with the module antenna (MA) and consequent improvements in the RFID chip (CM) interacting with external RFID readers.
  • CM contactless mode
  • DI, or DIF dual interface cards which can also operate in contact mode
  • the invention (in some aspects) relates to passive RFID smart cards having a conductive metal or metallized layer which shields the electromagnetic field generated by a reader.
  • dual interface cards which operate on the principle of reactive coupling.
  • an RFID transponder generally comprises a substrate, an RFID chip (or chip module) disposed on or in the substrate, and an antenna disposed on or in the substrate.
  • the transponder may form the basis of a secure document such as an electronic passport, smart card or national ID card.
  • the chip module may operate solely in a contactless mode (such as ISO 14443), or may be a dual interface (DIF) module which can operate also in contact mode (such as ISO 7816-2) and a contactless mode.
  • the chip module may harvest energy from an RF signal supplied by an external RFID reader device with which it communicates.
  • the substrate which may be referred to as an "inlay substrate” (for electronic passport) or "card body” (for smart card) may comprise one or more layers of material such as Polyvinyl Chloride (PVC), Polycarbonate (PC), polyethylene (PE), PET (doped PE), PET-G (derivative of PE), TeslinTM, Paper or Cotton/Noil, and the like.
  • PVC Polyvinyl Chloride
  • PC Polycarbonate
  • PE polyethylene
  • PET doped PE
  • PET-G derivative of PE
  • TeslinTM Paper or Cotton/Noil
  • the chip module may be a leadframe-type chip module or an epoxy-glass type chip module.
  • the epoxy-glass module can be metallized on one side (contact side) or on both sides with through- hole plating to facilitate the interconnection with the antenna.
  • the antenna may be a self-bonding (or self-adhering) wire.
  • a conventional method of mounting an antenna wire to a substrate is to use a sonotrode (ultrasonic) tool which vibrates, feeds the wire out of a capillary, and embeds it into or sticks it onto the surface of the substrate.
  • a typical pattern for an antenna is generally rectangular, in the form of a flat (planar) coil (spiral) having a number of turns.
  • the two ends of the antenna wire may be connected, such as by thermo- compression (TC) bonding, to terminals (or terminal areas, or contact pads) of the chip module. See, for example US 6,698,089 and US 6,233,818, incorporated by reference herein.
  • the overall antenna area is quite small (such as approximately 15mm x 15mm), in contrast with a more conventional antenna which may be formed by embedding several (such as 4 or 5) turns of wire around a periphery of the of the inlay substrate or card body of the secure document, in which case the overall antenna area may be approximately 80mm x 50mm (approximately 20 times larger).
  • the resulting entity may be referred to as an "antenna module”.
  • US 8,261,997 discloses a carrier assembly for receiving an RFID transponder chip has an attachment side for being attached to a consumer device and an operation side for receiving an RF signal in operational use of the RFID transponder chip. ... there is provided an electrically conductive shielding layer at the attachment side.
  • the effect of this layer is that it effectively shields the transponder from the material of the surface on which the transponder is to be provided.
  • the shielding layer has some detuning effect on the resonance frequency, but once this detuning effect has been taken into account in the antenna design, there is hardly any further detuning effect due to the surface on which the RFID transponder is provided, i.e. the RFID transponder comprising the carrier assembly of the invention is suitable for virtually any surface.
  • the magnetic layer comprises a ferrite foil or a ferrite plate.
  • the electrically conductive shielding layer comprises a material selected from a group comprising: copper, aluminum, silver, gold, platinum, conductive paste, and silver ink.
  • EP1854222 A2 discloses A mobile communication device (1, 10) comprises shielding components that provide electromagnetic shielding or attenuation between a first area (A) and a second area (B, Bl, B2) within and/or external of the communication device (1, 10).
  • a first area (A) an antenna (4) and at least one ferrite (6) are arranged, which ferrite (6) is provided to interact with said antenna (4) and to guide a magnetic flux between said first area (A) and said second area (B, Bl, B2).
  • US 20120055013 discloses microstructures such as connection areas, contact pads, antennas, coils, plates for capacitors and the like may be formed using nanostructures such as nanoparticles, nanowires and nanotubes.
  • a laser may be used to assist in the process of microstructure formation, and may also be used to form other features on a substrate such as recesses or channels for receiving the microstructures.
  • a smart mobile phone sticker mounted to a cell phone with a self-sticking shielding element comprising a core layer having ferrite particles.
  • EP 02063489 Al discloses an antenna element and method for manufacturing same There is provided a more easily manufactured antenna device used in a tag composing an RFID (Radio Frequency Identification) system.
  • the antenna device (10) has (A) a laminar magnetic element formed of a magnetic composition containing a magnetic material and a polymer material, and (B) antenna wiring provided on one of the surfaces of the laminar magnetic element.
  • US 2009/0169776 discloses composite cards which include a security layer comprising a hologram or diffraction grating formed at, or in, the center, or core layer, of the card.
  • the hologram may be formed by embossing a designated area of the core layer with a diffraction pattern and depositing a thin layer of metal on the embossed layer. Additional layers may be selectively and symmetrically attached to the top and bottom surfaces of the core layer.
  • a laser may be used to remove selected portions of the metal formed on the embossed layer, at selected stages of forming the card, to impart a selected pattern or information to the holographic region.
  • the cards may be "lasered” when the cards being processed are attached to, and part of, a large sheet of material, whereby the “lasering” of all the cards on the sheet can be done at the same time and relatively inexpensively.
  • each card may be individually “lasered” to produce desired alpha numeric information, bar codes information or a graphic image, after the sheets are die-cut into cards.
  • US 2011/0189620 discloses a method and apparatus for treating a selected region of a metal layer, used to form a metal card, by annealing the selected metal region so the selected region becomes soft and ductile, while the rest of the metal layer remains stiff.
  • the softened, ductile, selected metal region can be embossed with reduced power and with reduced wear and tear on the embossing equipment.
  • the annealed metal layer can undergo additional processing steps to form an assembly which can then be embossed.
  • the method may include the use of a fixture for holding the metal layer, with the fixture having a window region for enabling heat to be applied to soften the region of the metal layer within the window region.
  • the fixture includes apparatus for cooling the portion of the metal layer outside of the window region and for preventing the temperature of the metal layer outside the window region from rising above predetermined limits.
  • US 8,158,018 discloses a ferrite sintered body of the present invention contains main components consisting of 52 to 54 mol % Fe.sub.20.sub.3, 35 to 42 mol % MnO and 6 to 11 mol % ZnO as oxide equivalents and additives including Co, Ti, Si and Ca in specified amounts, and has a temperature at which the power loss is a minimal value (bottom temperature) of higher than 120.degree. C. in a magnetic field with an excitation magnetic flux density of 200 mT and a frequency of 100 kHz, and a power loss of 350 kW/m.sup.3 or less at the bottom temperature.
  • US 7,948,057 discloses a ferrite substrate, a winding-embedded ferrite resin layer, and an IC-embedded ferrite resin layer are laminated, the ferrite substrate has a ferrite first protruding part that protrudes into the ferrite resin layer from the surface thereof, the winding inside the ferrite resin layer is arranged winding around the first protruding part, and the IC overlaps the first protruding part in the resin layer.
  • the IC is arranged at a site where the ferrite first protruding part, the height of which fluctuates little as a result of thermal expansion, overlaps the ferrite resin layer, the thickness of which is thinned by the first protruding part and varies little as a result of thermal expansion, minimizing variations in the gap between the winding and the IC as a result of thermal expansion, and achieving greater stability of electrical characteristics.
  • US 6,817,085 discloses a method of manufacturing a multi-layer ferrite chip inductor array including an element main body composed by laminating a ferrite layer and a conductor layer in such a manner that the laminated face thereof is vertical with an element mounting surface.
  • the method also includes furnishing a plurality of coil shaped internal conductors within the element main body, in which a coiling direction of the coil shaped internal conductor is in parallel with the element mounting surface, forming the ferrite sheets with through-holes and printing the ferrite sheets with a plurality of coil shaped internal conductors and conductor patterns with an electrically conductive material.
  • an antenna structure may be formed by arranging a current- restricting structure upon a conductive surface.
  • the current-restricting structure may be formed from a ferrite material, and may be in forms including a belt, tiles, or a patterned deposited layer.
  • the conductive surface may be associated with a vehicle or structure.
  • the current-restricting structure alters the paths taken by current on or beneath the conductive surface when a voltage is applied between portions of the surface.
  • a dual interface (DI) smart card has contact pads (CP) extending through an opening in the metal layer for interfacing with an external contact (electrical) reader.
  • a dual-interface smart card comprises a booster antenna (BA) with coupler coil (CC) in its card body (CB), and a metallized face plate (202, 302) having a window opening (220, 320) for an antenna module (AM) having a module antenna (MA). Attenuation caused by the metallized face plate may be reduced (overall performance may be improved) by one or more of making the window opening substantially larger than the antenna module (AM),
  • the booster antenna as a quasi-dipole
  • a ferrite element in the antenna module (AM) between the module antenna (MA) and the contact pads (CP).
  • a smart card having a metallized face plate with a window opening for accepting an antenna module, and a card body with a booster antenna including a coupler coil, wherein the window opening has a baseline size approximately equal to a size of the antenna module, may be characterized in that the window opening is substantially larger than the antenna module.
  • the window opening may be at least 10% larger than the antenna module, resulting in a gap between inner edges of the window opening and the antenna module.
  • a ferrite layer may be disposed between the face plate and the booster antenna.
  • a plurality of perforations may be formed in the face plate extending around at least one of the window opening and the periphery of the face plate.
  • a compensation loop may be disposed behind the booster antenna.
  • the compensation loop may have a gap, and two free ends, may comprise a conductive material such as copper, and may comprise ferrite.
  • One or more of the following features may be included in the smart card:
  • the booster antenna may be configured as a quasi-dipole, with or without a coupler coil; the booster antenna may be provided with an extension;
  • the booster antenna may comprise two overlapping booster antennas
  • the booster antenna may be provided primarily in an upper portion of the smart card
  • the module antenna may be offset from the coupler coil.
  • the smart card may further comprise at least one of the following features:
  • a ferrite element may be disposed between the module antenna and contact pads of the antenna module;
  • capacitive stubs may be added to the module antenna
  • the module antenna may comprise two separate coils
  • the module antenna may comprise two windings connected in a quasi-dipole configuration; perforations in the contact pads of the antenna module.
  • a method of minimizing attenuation of coupling by the face plate of a metallized smart card having a booster antenna with a coupler coil in its card body may comprising one or more of:
  • the antenna module may be offset with respect to the coupler coil.
  • the booster antenna may be arranged as a quasi-dipole; the module antenna may be provided with capacitive stubs; ferrite may be provided in the antenna module between the module antenna and the contact pads.
  • the contact pads may be trimmed or perforated.
  • FIGs The figures are generally in the form of diagrams. Some elements in the figures may be exaggerated, others may be omitted, for illustrative clarity. Some figures may be in the form of diagrams. Although the invention is generally described in the context of various exemplary embodiments, it should be understood that it is not intended to limit the invention to these particular embodiments, and individual features of various embodiments may be combined with one another. Any text (legends, notes, reference numerals and the like) appearing on the drawings are incorporated by reference herein.
  • FIG. 1 is a cross-sectional view of a dual interface (DI) smart card, and readers.
  • DI dual interface
  • FIG. 1A is a diagrammatic top view of a booster antenna (BA) with coupler coil (CC).
  • BA booster antenna
  • CC coupler coil
  • FIG. 2 is a diagrammatic cross-sectional view of a smart card with metallization.
  • FIG. 2A is a partial diagrammatic perspective view of a smart card with metallization.
  • FIGs. 3A,B,C are diagrammatic top views of embodiments of a face plate (ML) for a smart card.
  • FIG. 4A is diagram of a layer with a compensating loop having a gap.
  • FIG. 4B is diagram of a layer with a compensating loop, without a gap.
  • FIG. 5 is a plan view of a typical arrangement of contact pads (CP) on a module tape (MT).
  • FIG. 5A is a diagram showing an exemplary contact pad layout and assignments.
  • FIG. 6A is a plan view illustrating extending outer edges of contact pads (CP).
  • FIG. 6B is a plan view illustrating trimming outer edges of contact pads (CP).
  • FIG. 6C is a plan view illustrating increasing the gap between contact pads (CP).
  • FIG. 6D is a plan view illustrating modifying the gap between contact pads (CP).
  • FIG. 7A is a plan view illustrating perforating the contact pads (CP).
  • FIG. 7B is a cross-sectional view illustrating thinning the contact pads (CP).
  • FIG. 8A is a plan view illustrating the underside of a module tape (MT).
  • FIG. 8B is a plan view illustrating perforating the contact pads (CP).
  • FIG. 9A is a plan view illustrating perforating the contact pads (CP).
  • FIG. 9B is a plan view illustrating perforating the contact pads (CP).
  • FIG. 10A is plan view of the underside of a module tape (MT) for an antenna module (AM), showing an antenna structure (AS) having two antenna segments (MAI, MA2).
  • MT module tape
  • AS antenna structure
  • MAI antenna segment
  • FIG. 10B is a diagrammatic view of an antenna structure (AS).
  • transponders in the form of secure documents which may be smart cards or national ID cards may be discussed as exemplary of various features and embodiments of the invention(s) disclosed herein. As will be evident, many features and embodiments may be applicable to (readily incorporated in) other forms of secure documents, such as electronic passports.
  • any one of the terms "transponder”, “smart card”, “data carrier”, and the like may be interpreted to refer to any other of the devices similar thereto which operate under ISO 14443 or similar RFID standard.
  • a typical data carrier described herein may comprise (i) an antenna module (AM) having an RFID chip or chip module (CM) and a module antenna (MA), (ii) a card body (CB) and (iii) a booster antenna (BA) disposed on the card body (CB) to enhance coupling between the module antenna (MA) and the antenna of an external RFID "reader".
  • CM RFID chip or chip module
  • MA module antenna
  • BA booster antenna
  • the module antenna (MA) may comprise a coil of wire, conductive traces etched or printed on a module tape (MT) substrate for the antenna module (AM), or may be incorporated directly on the chip itself.
  • the booster antenna may be formed by embedding wire in an inlay substrate or card body (CB).
  • the antenna may be formed using a processes other than by embedding wire in a substrate, such as additive or subtractive processes such as printed antenna structures, coil winding techniques (such as disclosed in US 6,295,720), antenna structures formed on a separate antenna substrate and transferred to the inlay substrate (or layer thereof), antenna structures etched (including laser etching) from a conductive layer on the substrate, conductive material deposited on the substrate or in channels formed in the substrate, or the like.
  • inlay substrate is referred to herein, it should be taken to include “card body”, and vice versa, as well as any other substrate for a secure document, unless explicitly otherwise stated.
  • a booster antenna is similar to a card antenna (CA).
  • CA card antenna
  • the booster antenna (BA) is inductively coupled with the module antenna (MA) in the antenna module (AM) which may be connected with the RFID chip (CM).
  • CM RFID chip
  • the booster antenna (BA) may be referred to as a card antenna (CA).
  • the booster antenna (BA) may have a coupler coil (CC) associated therewith which is arranged to be in close proximity and closely coupled with the module antenna (MA).
  • CC coupler coil
  • coupling refers to inductive, magnetic, capacitive or reactive coupling (including combinations thereof, any of which may be referred to as “inductive coupling") between two elements relying on the generation of an electromagnetic field by a given element and the reaction to (interaction with) the field(s) by another element.
  • the term “connecting” (and variants thereof) refers to two elements being electrically connected with one another wherein the interaction between the two elements results from the flow of electrons between the two elements.
  • two elements which are inductively coupled with one another are not electrically connected with one another.
  • Elements which are coils of wire such as a module antenna MA and a coupler coil CC disposed near each other are generally inductively coupled with one another, without any electrical connection between the two elements.
  • the module antenna MA is generally electrically connected with the RFID chip (CM) element.
  • the windings and coils of the booster antenna BA such as outer winding OW, inner winding IW and coupler coil CC elements, are generally electrically connected with one another, but may also exhibit inductive coupling with one another.
  • the module antenna MA and coupler coil CC are not electrically connected with one another, but are inductively coupled (or “transformer coupled") with one another.
  • the booster antenna BA (and other features) disclosed herein may increase the effective operative ("reading") distance between the antenna module AM and an external contactless reader with capacitive and inductive coupling. With reading distances typically on the order of only a few centimeters, an increase of 1cm can represent a significant improvement.
  • transponders in the form of secure documents which may be smart cards or national ID cards may be discussed as exemplary of various features and embodiments of the invention(s) disclosed herein. As will be evident, many features and embodiments may be applicable to (readily incorporated in) other forms of secure documents, such as electronic passports.
  • any one of the terms "transponder”, “smart card”, “data carrier”, and the like may be interpreted to refer to any other of the devices similar thereto which operate under ISO 14443 or similar RFID standard.
  • a typical data carrier described herein may comprise (i) an antenna module (AM) having an RFID chip or chip module (CM) and a module antenna (MA), (ii) a card body (CB) and (iii) a booster antenna (BA) disposed on the card body (CB) to enhance coupling between the module antenna (MA) and the antenna of an external RFID "reader".
  • CM RFID chip or chip module
  • MA module antenna
  • BA booster antenna
  • the module antenna (MA) may comprise a coil of wire, conductive traces etched or printed on a module tape (MT) substrate for the antenna module (AM), or may be incorporated directly on the chip itself.
  • the booster antenna may be formed by embedding wire in an inlay substrate or card body (CB).
  • the antenna may be formed using a processes other than by embedding wire in a substrate, such as additive or subtractive processes such as printed antenna structures, coil winding techniques (such as disclosed in US 6,295,720), antenna structures formed on a separate antenna substrate and transferred to the inlay substrate (or layer thereof), antenna structures etched (including laser etching) from a conductive layer on the substrate, conductive material deposited on the substrate or in channels formed in the substrate, or the like.
  • inlay substrate is referred to herein, it should be taken to include “card body”, and vice versa, as well as any other substrate for a secure document, unless explicitly otherwise stated.
  • a booster antenna is similar to a card antenna (CA).
  • CA card antenna
  • the booster antenna (BA) is inductively coupled with the module antenna (MA) which may be connected with the RFID chip (CM).
  • CM RFID chip
  • the term “coupling” refers to inductive, magnetic, capacitive or reactive coupling (including combinations thereof, any of which may be referred to as “inductive coupling”) between two elements relying on the generation of an electromagnetic field by a given element and the reaction to (interaction with) the field(s) by another element.
  • the term “connecting” refers to two elements being electrically connected with one another wherein the interaction between the two elements results from the flow of electrons between the two elements. Typically, two elements which are inductively coupled with one another are not electrically connected with one another.
  • Elements which are coils of wire such as a module antenna MA and a coupler coil CC disposed near each other are generally inductively coupled with one another, without any electrical connection between the two elements.
  • the module antenna MA is generally electrically connected with the RFID chip (CM) element.
  • the windings and coils of the booster antenna BA such as outer winding OW, inner winding IW and coupler coil CC elements, are generally electrically connected with one another, but may also exhibit inductive coupling with one another.
  • the module antenna MA and coupler coil CC are not electrically connected with one another, but are inductively coupled (or “transformer coupled") with one another.
  • the booster antenna BA (and other features) disclosed herein may increase the effective operative ("reading") distance between the antenna module AM and an external contactless reader with capacitive and inductive coupling. With reading distances typically on the order of only a few centimeters, an increase of 1cm can represent a significant improvement.
  • FIG. 1 is a cross-sectional view of a portion of an exemplary smart card having an antenna module AM disposed in a recess in a card body CB.
  • the antenna module AM has a chip module CM.
  • the antenna module AM has contact pads CP for a contact interface with an external Contact Reader (ISO 7816).
  • the antenna module AM has a module antenna MA for a contactless interface with an external contactless reader (ISO 14443).
  • a booster antenna BA is disposed around the periphery of the card body CB, and has a coupler coil CC is disposed around the recess in the card body CB. With the antenna module AM disposed in the recess, the module antenna MA is closely coupled with the coupler coil CC of the booster antenna BA.
  • the coupler coil CC may be arranged to be under the module antenna MA rather than surrounding it.
  • the booster antenna BA (or card antenna CA) may comprise an outer winding OW (or D) and an inner winding IW (or E), connected in reverse phase with one another as a quasi dipole. No coupler coil (CC) is shown.
  • a quasi-dipole booster antenna BA may additionally comprise an inner coupler coil CC.
  • the coupler coil CC is shown without detail, represented by a few dashed lines. (Some details of the coupler coil CC construction, and how it may be arranged in various orientations (clockwise, counterclockwise) and connected with the outer winding OW and inner winding IW are set forth in FIGs. 3A-3D.)
  • FIG. 1A is a diagrammatic top view of a smart card body CB with a booster antenna BA and antenna module AM.
  • the booster antenna BA has a coupler coil CC incorporated therewith. The following abbreviations may appear in the figure.
  • the Inner End (IE, a) of the Outer Winding (OW) is "free end"
  • the Outer End (OE, b) of the OW is connected to one end of CC
  • the Inner End (IE, e) of the IW is connected to another end of CC
  • the outer winding OW may be laid clockwise (CW) from IE (a) to OE (b)
  • the inner winding IW may be laid clockwise (CW) from IE (e) to OE (f)
  • the booster antenna BA comprises an outer winding OW and an inner winding IW, both extending substantially around the periphery of the card body CB.
  • Each of the inner and outer windings has an inner end IE and an outer end OE.
  • the outer end OE (b) of the outer winding OW is connected with the inner end IE (e) of the inner winding IW, via a coupler coil CC.
  • the inner end IE (a) of the outer winding OW and the outer end OE (f) of the inner winding IW may be left unconnected, as "free ends".
  • the overall booster antenna BA comprising outer winding OW, coupler coil CC and inner winding IE is an open circuit, and may be referred to as a "quasi- dipole" - the outer winding OW constituting one pole of the dipole, the inner winding IW constituting the other pole of the dipole - center fed by the coupler coil CC.
  • the booster antenna BA may be formed using insulated, discrete copper wire disposed (such as ultrasonically bonded) around (inside of) the perimeter (periphery) of a card body CB (or inlay substrate, or data carrier substrate, such as formed of thermoplastic).
  • the booster antenna BA comprises an outer winding OW (or coil, D) and an inner winding IW (or coil, E), and further comprises a coupler coil CC, all of which, although "ends" of these various coil elements are described, may be formed from one continuous length of wire (such as 80 ⁇ self-bonding wire) which may be laid upon or embedded in the card body CB. More particularly,
  • the outer winding OW may be formed as a spiral having a number (such as 2-3) of turns and having an inner end IE at point "a" and an outer end OE at point "b".
  • the outer winding OW is near (substantially at) the periphery (perimeter) of the card body CB.
  • the inner end IE ("a") of the outer winding OW is a free end.
  • the coupler coil CC may be formed as a spiral having a number (such as approximately 10) of turns and having two ends “c" and "d".
  • the end “c” may be an outer end OE or an inner end IE
  • the end “d” may be an inner end IE or an outer end OE.
  • the inner winding IE may be formed as a spiral having a number (such as 2-3) of turns and having an inner end IE "e” and an outer end OE “f".
  • the inner winding IW is near (substantially at) the periphery of the card body CB, inward of the outer winding OW.
  • the outer end OE ("f") of the inner winding IW is a free end.
  • the inner winding IW is shown in dashed lines, for illustrative clarity.
  • the inner end IE of the outer winding OW is a "free end” in that it is left unconnected.
  • the outer end OE of the inner winding IW is a "free end” left unconnected.
  • the outer winding OW, coupler coil CC and inner winding IW may be formed as one continuous structure, using conventional wire embedding techniques. It should be understood that references to the coupler coil CC being connected to ends of the outer winding (OW) and inner winding (IW) should not be construed to imply that coupler coil CC is a separate entity having ends. Rather, in the context of forming one continuous structure of outer winding OW, coupler coil CC and inner winding IW, "ends" may be interpreted to mean positions corresponding to what otherwise would be actual ends - the term "connected to" being interpreted as "contiguous with” in this context.
  • the dimensions of the card body CB may be approximately 54mm x 86mm.
  • the outer dimension of the outer winding OW of the booster antenna BA may be approximately 80 x 50mm.
  • the wire for forming the booster antenna BA may having a diameter (d) of approximately 100 ⁇ (including, but not limited to 80 ⁇ , 112 ⁇ , 125 ⁇ .
  • the inner winding IW may be disposed within the outer winding OW, as illustrated, on a given surface of the card body CB (or layer of a multi-layer inlay substrate).
  • these two windings of the booster antenna BA may be disposed on opposite surfaces of the card body CB, substantially aligned with one another (in which case they would be "top” and “bottom” windings rather than “outer” and “inner” windings).
  • the two windings of the booster antenna BA may be coupled in close proximity so that voltages induced in them may have opposite phase from one another.
  • the coupler coil CC may be on the same surface of the card body CB as the outer and inner windings.
  • the turns of the outer winding OW and inner winding IW of the booster antenna BA may be at a pitch of 0.2mm (200 ⁇ ), resulting in a space of approximately one wire diameter between adjacent turns of the outer winding OW or inner winding IW.
  • the pitch of the turns of the coupler coil CC may be substantially the same as or less than (stated otherwise, not greater than) the pitch of turns of at least one of the outer winding OW and inner winding IW - for example 0.15mm (150 ⁇ ), resulting in space smaller than one wire diameter between adjacent turns of the coupler coil (CC).
  • Self-bonding copper wire may be used for the booster antenna BA.
  • the pitch of both the outer/inner windings OW/IW and the coupler coil CC may both be approximately 2x (twice) the diameter of the wire (or width of the conductive traces or tracks), resulting in a spacing between adjacent turns of the spiral(s) on the order of 1 wire diameter (or trace width).
  • the pitches of the outer winding OW and the inner winding IW may be substantially the same as one another, or they may be different than each other.
  • More turns of wire for the coupler coil CC can be accommodated in a given area - for example, by laying two "courses" of wire, one atop the other (with an insulating film therebetween, if necessary), in a laser-ablated trench defining the area for the turns of the coupler coil CC.
  • a substrate or card body CB with the booster antenna BA formed thereon may be prepared by a first manufacturer and constitute an interim product (which, without the antenna module AM, may be referred to as a "data carrier component").
  • a second manufacturer may mill (or otherwise form) a recess in the card body CB, at the interior of the coupler coil CC (see FIG. 1) and install the antenna module AM (with its module antenna MA) in the recess.
  • the data carrier component can be provided by the first manufacturer, with the recess already formed.
  • FIG. 1A Card Antenna CA in card body CB, contact and contactless readers
  • FIG. IB Card Antenna CA in card body CB, ferrite in card body CB
  • FIGs. 3A, 4A Quasi-Dipole Booster Antenna BA, without coupler coil CC
  • FIG. 4I,J ferrite in card body CB
  • FIG. 6A mobile phone sticker MPS with ferrite
  • FIG. 6B ferrite shielding element 670, adhesive both sides
  • FIG. 8 13/730,811 card antenna CA primarily at top half of card body CB
  • FIGs 3A-3D various configurations for the coupler coil CC
  • FIGs. 5I-K two booster antennas
  • FIGs. 6A-C BA disposed at top half of card body CB
  • Some smart cards including dual interface (DI) smart cards, have a metal (or metallized) top layer, or "face plate", substantially the size of the card body. Having a metal layer is technically disingenuous in that a it may significantly reduce coupling between the card and an external contactless reader. Nevertheless, the feature may be important for vanity purposes.
  • DI dual interface
  • FIG. 2 is a very generalized, simplified, diagrammatic cross-sectional view illustrating some exemplary layers of an exemplary "metal" (or metallized) smart card.
  • the layers are numbered for reference purposes only, not to indicate a particular sequence.
  • the layers may be rearranged. Some layers may be omitted. Some layers may be applicable to either non-metal smart cards or metallized smart cards. Some of the layers may comprise more than one layer. Some layers may be combined with other layers.
  • a chip module (CM) is shown disposed in a window "W" (opening) extending into the smart card, from the front (top, as viewed) surface thereof through the metallized foil (Layer 2) and into the card body (Layer 4).
  • the chip module (CM) has contact pads (CP) on its front surface for interfacing with an external contact reader.
  • the chip module may be a dual interface (DI) antenna module (AM) having a module antenna (MA) for interfacing, via the booster antenna (BA) with coupler coil (CC), with an external contactless reader.
  • the antenna module (AM) may fit within the inner area of the coupler coil (CC). Compare FIG. 1.
  • FIG. 2A shows an exemplary stackup (sequence of layers) for a metallized smart card 200, having the following layers, structures and components. Exemplary dimensions may be presented. All dimensions are approximate. Thickness refers to vertical dimension in the figure.
  • a top layer 202 may be a metal (or metallized) layer 202, such as 250 ⁇ thick stainless steel, and may be referred to as a "face plate”. Compare "Layer 1". This top layer 202 may be as large as the overall smart card, such as approximately 50mm x 80mm.
  • a layer 203 of adhesive such as 40 ⁇ thick of polyurethane
  • a layer 204 of ferrite material such as 60 ⁇ thick sheet of soft (flexible) ferrite
  • a layer 205 of adhesive such as 40 ⁇ thick of polyurethane
  • a layer 208 of plastic material such as 50-100 ⁇ thick PVC, which may function as a spacer (separating layers and components below from those above)
  • a layer 210 of plastic material such as 150-200 ⁇ thick PVC, which may function as the card body (CB). Compare "Layer 4".
  • Wire 212 such as 112 ⁇ diameter wire, forming the booster antenna (BA) with coupler coil (CC) Compare FIG. 1 Only one wire cross-section is shown, for illustrative clarity.
  • a layer 216 of plastic material such as 50 ⁇ thick PVC, which may serve as an overlay -
  • the overall thickness of the smart card 200 (layers 202, 203, 204, 208, 210, 214, 216) may be approximately 810 ⁇ (0.81 mm).
  • a window opening 220 (“W”) may extend into the smart card from the face plate 202, through intervening layers, into the card body layer 210.
  • a dual interface (DI) antenna module (AM), with module antenna (MA) may be disposed in the window opening 220. Compare FIG. 1 The window opening 220 may extend completely through the layer 210, in which case the antenna module (AM) would be supported by the underlying layer 214.
  • the coupler coil (CC) of the booster antenna (BA) may surround the window opening 220 so as to be closely coupled with the module antenna (MA) of the antenna module (AM). Compare FIG. 1 Alternatively, the coupler coil (CC) may be disposed in the card body (CB) so as to be underneath the module antenna (MA) of the antenna module (AM).
  • the antenna module (AM) may measure approximately 12 x 13mm (and approximately 0.6mm thick).
  • the window opening 220 ("W") in the face plate 202 may be approximately the same size as the antenna module (AM) - i.e., approximately 12 x 13mm.
  • the chip activation distance may be approximately 15mm. (Chip activation distance is similar to read distance, and represents the maximum distance at which the chip module may be activated (for reading) by an external reader. As a general proposition, more is better, 15mm is not very good, 20mm or 25mm would be better.
  • the chip activation distance in a metallized smart card is handicapped by attenuation of the electromagnetic field associated with the booster antenna attributable to the metallic face plate 202 (Layer 1).
  • the window opening 220 in the face plate 202 is made to be significantly larger than the antenna module (AM) so as to offset shielding and enhance coupling, thereby increasing the activation distance.
  • the antenna module (AM) measuring approximately 12 x 13mm
  • the window opening 220 can be enlarged approximately 1mm all around, so that there is a 1mm gap (GAP) all around the antenna module (AM).
  • GAP 1mm gap
  • AM antenna module
  • the gap (1mm) is approximately 10% of the cross-dimension of the un-enlarged (12 x 13mm) window opening.
  • the resulting chip activation distance may be approximately 20mm (a 33% increase over baseline 15mm).
  • the window opening 220 can be enlarged approximately 2mm all around, so that there is a 1mm gap (GAP) all around the antenna module (AM).
  • GAP 1mm gap
  • the gap (2mm) is approximately 20% of the cross dimension of the un- enlarged (12 x 13mm) window opening.
  • the resulting chip activation distance may be approximately 22mm (a 50% increase over baseline 15mm).
  • the window opening 220 may be increased in size (in contast with its nominal size approximately equal to that of the antenna module AM) by at least 10%, up to at least 100%, including the values of approximately 30% and 75% in the examples above.
  • the gap (GAP) between the antenna module (AM) and the inner edges of the window opening 220 may allow significantly better coupling between the coupler coil (CC) of the booster antenna (BA) and the module antenna (MA) of the antenna module (AM). Activation distance improvements of up to 50% are presented. Gap sizes of 1mm and 2mm have been discussed, which represent enlarging the window opening by 10% and 20%, respectively. More generally, the gap may be at least 0.5mm, including up to at least 3mm.
  • the ferrite layer 204 may also improve coupling by reducing attenuation of coupling by the face plate 202, helping to concentrate the electromagnetic field between the booster antenna BA and the module antenna MA of the antenna module AM. It may be desirable that the ferrite layer 204 be as close as possible to the underside of the face plate 202. Rather than having a separate ferrite layer 204 (and adhesive layer 203), ferrite particles or powder may be mixed with an adhesive and sprayed or coated onto the underside of the face plate 202, thereby eliminating the intervening adhesive layer 203.
  • the ferrite material may be particles (including nanoparticles) of ferrite embedded in an underlying layer, such as the spacer layer 208 or the card body layer 210 (in some configurations, the spacer layer 208 may be omitted).
  • the spacer layer 208 may also improve coupling by reducing attenuation of coupling by the face plate 202, simply by keeping the face plate 202 as far away as practical (within the confines of the form factor for smart cards) from the booster antenna 212.
  • various additional features for improving coupling may be incorporated into the layers of the smart card and/or the antenna module, such as, but not limited to: for metallic cards
  • the booster antenna (BA), or card antenna (CA) as a quasi-dipole without a coupler coil (CC), and positioning the antenna module AM so that the module antenna MA overlaps only an inner winding IW of the booster antenna, such as disclosed in FIG. 2C of US 20120038445 and in FIGs. 3A, 4A of US 20120074233 , and in FIG. 2A of 13/600,140 configuring the booster antenna (BA) as a quasi-dipole with a coupler coil (CC), such as disclosed in FIGs. 3, 3A-D, 4 of 13/600,140. Compare FIGs. 1, 1A (above)
  • booster antenna with an “extension”, such as disclosed in FIG. 5H of 13/600,140
  • BAs overlapping booster antennas
  • booster antennas primarily in an upper portion of the smart card, leaving a lower “embossing" portion free, such as disclosed in FIGs. 6A,B,C of 13/600,140, FIG. 8 of 13/730,811, and FIG. 6D of 61/697,825
  • module antenna (MA) as two separate coils, such as disclosed in FIG. 6A of 61/693,262
  • a baseline activation distance of 15mm may be increased to approximately 28mm, or more, an improvement of approximately 100%, and corresponding improvements to the reliability of communication between the chip module (CM) and an external contactless reader. It is within the scope of the invention that these features, listed above, may be incorporated into a non-metallized (no metallic face plate) smart card to significantly improve activation and read distances.
  • An interim product may comprise the ferrite 204, adhered with adhesive 205 to the underlying spacer layer 208, and the card body layer 210 with the booster antenna 212 inlaid therein.
  • This interim product may be referred to as a pre-laminated stack, or "prelaminate”, and may have a thickness of approximately 450 ⁇ .
  • the prelaminate may be delivered to a second manufacturer who will apply the faceplate 202, the bottom PVC sheet 214 and the bottom overlay 216.
  • the faceplate 202 may be pre-punched (or otherwise machined) with the opening 220.
  • the resulting stackup may have a pre-laminated thickness pf approximately 940 ⁇ (0.94mm), and after lamination (heat and pressure) have a final thickness of approximately 890 ⁇ (0.89mm).
  • a plug of material may first be inserted into the window opening 220 to prevent the underlying material (ferrite 204, spacer PVC 208, card body PVC 210, etc.) from expanding upwards into the window opening 220 (and causing a resulting indent on the bottom surface of the smart card).
  • the material for the plug may be PVC, or the metal "slug" which was removed from the faceplate to make the opening, or the like.
  • the plug (if metal) is removed. If the plug was PVC, it may be left in place. The recess for the antenna module may then be machined into the layers (ferrite 204, spacer PVC 208, card body PVC 210) of the smart card, being careful (of course) not to damage the coupler coil (CC).
  • the faceplate (202) which may be referred to as a "metallized layer” (“ML”), may be perforated to improve coupling, and this would ordinarily be done prior to adding the faceplate to the stack for lamination, such as in conjunction with forming the window (220).
  • the metallized layer can be perforated, removing material in locations such as around the window (220) which is approximately directly over the coupling coil (CC) and/or around the periphery of the metallized layer ML which is approximately directly over the outer winding OW and inner winding IW of the booster antenna BA.
  • Perforating the metallized layer ML may allow the electromagnetic field to operate better, such as by facilitating the radiation of magnetic flux lines.
  • the design of the perforations may add to the aesthetics of the smart card, and may provide an optical (visible) security feature.
  • FIG. 3A shows that a pattern of perforations (or openings) in the form of elongated slits 322 may be formed, such as by laser etching, around the periphery of the face plate 302 (compare 202).
  • the slits 322 may be aligned over (or under) the booster antenna BA (FIG. 1), to enhance coupling between the booster antenna BA and the antenna of an external contactless reader (FIG. 1).
  • FIG. 3A shows that a pattern of perforations (or openings) in the form of holes 324 may be formed, such as by laser etching, around the periphery of the opening 320 (compare 220) in the face plate 302 (compare 202, also "Layer 2"). These perforations may be aligned over (or under) the coupler coil CC (FIG. 1), to enhance coupling between the coupler coil CC (212) and the module antenna MA of an antenna module AM.
  • FIG. 3B shows an alternate pattern of perforations (or openings) 322 and 324 in a metallized layer (faceplate) 302.
  • the perforations 322 around the periphery of the faceplate A are in the form of holes
  • the perforations 324 around the window opening 320 are in the form of slits.
  • FIG. 3C shows an alternate pattern of perforations (or openings) 324 in a metallized layer (faceplate) 302.
  • the openings 324 are several arc segments of increasing radii, distributed (centered) around the window opening 320.
  • the perforations (or openings) 322 and 324 may be arranged in an aesthetically pleasing pattern, and may also serve as a security (anti- counterfeiting) measure.
  • the perforations (or openings) 322 and 324 in the face plate 302 may be filled with a visually contrasting material, preferable non-metallic, such as artificial (plastic) mother of pearl.
  • the dimensions of the card body CB may be (approximately 50mm x 80mm),
  • the face plate 302 (or metallized layer ML) may measure approximately 86mm x 54mm.
  • the opening 320 (or "W") in the face plate 302 may measure approximately 8mm x 10mm.
  • the peripheral area of the card body CB (or metallized layer ML) may extend 5- 10mm in from the edge(s) of the card body CB (or metallized layer) - in other words, not entirely to the periphery of the overall card body.
  • openings 322 there may be a plurality of (such as 20-60, or more) openings 322 disposed around the peripheral area of the face plate 302.
  • the openings 322 may reduce the amount of metal material in the peripheral area by approximately 25% - 50%, thereby permitting better coupling between the booster antenna BA and an external contactless reader.
  • openings 324 there may be a plurality of (such as 10-30, or more) openings 324 disposed around the window opening 320 in the face plate 302.
  • the openings B may reduce the amount of metal material in this area by approximately 25% - 50%, thereby permitting better coupling between the coupler coil CC and the module antenna MA of the antenna module AM. Additional and Alternative Modifications to the Layers of the Card Body
  • FIG. 4A shows that a conductive "compensation loop" CL may be disposed (such as in Layer 5, FIG. 2) behind the booster antenna BA (Layer 3), extending around the periphery of the card body CB.
  • the compensation loop CL may be an open loop having two free ends, and a gap ("gap") therebetween.
  • the compensation loop CL may be made of copper cladding, can be printed on a support layer, etc
  • FIG. 4B shows that the compensation loop CL may comprise ferrite material, in which case since ferrite is not an electrical conductor (in contrast with copper) the loop may be closed, having no gap and no free ends.
  • the compensation loop may be referred to as a "frame".
  • the compensation frame on the reverse side of the booster antenna BA may help with the stabilization of the resonance frequency.
  • the compensation loop CL may be used in addition to the booster antenna BA.
  • the booster antenna BA may be embedded into one side of an inlay substrate while the compensation frame may be inkjet printed or adhesively attached to the opposite side of the inlay substrate.
  • the compensation loop CL can be mounted using a subtractive (etching away of material) or additive (depositing material) process.
  • Ferrite layers may be laminated together, and in combination with a copper compensating loop CL on the reverse side of a booster antenna BA may stabilize the resonance frequency of the booster antenna BA.
  • the track may be broken (have a gap) at some position.
  • Lamination and temperature may be used to sinter ferrite particles together to be a continuous path.
  • the inlay may consist of several layers of ferrite. The applied temperature and pressure may cause the particles to sinter and form an insulating layer of ferrite.
  • Ferrite nanoparticles or powder can be applied to a substrate layer by means of wet or dry spraying.
  • wet spraying the ferrite is suspended in a liquid phase dispersion which is prepared through sonication of the particles in a solvent or aqueous/surfactant liquid.
  • the particles may also have a steric wrap to support the suspension of the particles in the liquid.
  • the mean crystal particle size of the ferrite spheres can be determined by filtering and by the degree of sonication over time. (Sonication is the act of applying sound, usually ultrasound energy to agitate particles in a sample.)
  • the sintering of the nano-sized ferrite particles occurs during hot lamination of the synthetic layers which make up the inlay.
  • the lamination process includes heating and cooling under high pressure.
  • Several layers of ferrite coated substrates or foils can be used to enhance the ferromagnetic properties.
  • nanoparticles Unlike bulk ferrite granules, nanoparticles have a much lower sintering temperature, matching the glass transition temperature of the synthetic substrate. Additional heat treatment after lamination may be required.
  • various additional features may be incorporated in various combinations into a body of a smart card (whether metallic or of non-metallic (typical) variety) to enhance electromagnetic coupling of the module antenna, via the booster antenna, with an external contactless reader, thereby increasing activation and read distances to an "acceptable" level.
  • These enhancements may served largely to offset negative effects created by other components of the smart card, such as the metal face plate (202, 302), discussed at length above, or the metal contact pads (CP) on the antenna module (AM), which may also be modified to enhance coupling as discussed in some detail hereinbelow.
  • Some of the card-related features may include
  • CB card body
  • the number of turns forming the antenna is limited to the space surrounding the central position of the silicon die which is attached and bonded to the module substrate.
  • This substrate is generally made of epoxy glass with a contact metallization layer on the face-up side and a bonding metallization layer on the face-down side of the module.
  • the chemically etched antenna is usually formed on the face-down side.
  • pitch may refer to the spacing between adjacent conductive tracks, rather than its conventional meaning the center-to-center dimension between track centerlines or the number of tracks per unit length.
  • An antenna structure such as a module antenna may be formed by laser etching a copper cladded laminate forming an integral part of an RFID smart card chip module.
  • the use of laser etching may resolve the limiting pitch factor which can be achieved using conventional chemical etching, with the result that the number of turns which form the antenna can be greatly increased, with resulting performance benefits.
  • Using laser versus chemical etching may also result in a significant reduction in the foot-print of the laser-etched antenna having substantially the same electrical characteristics as a chemically-etched antenna requiring a larger area, and allowing for easy placement and adhesion of the antenna chip module in a recess provided in a card body, using standard adhesive tapes.
  • the material being laser etched may comprise, a standard pre-preg laminate (110 ⁇ ) made of epoxy glass and cured halogen free epoxy resin with both sides cladded with copper foil (17 ⁇ + 17 ⁇ ) may be used to produce contactless and dual interface smart card modules in rows and columns on super 35 mm chip carrier tape.
  • the carrier tape may be provided with sprockets and index holes for transport and punching of holes for vertical interconnects to electrically connect the top and bottom metallization layers can be implemented before laser processing.
  • the antenna structure at each module site is laser etched (isolation technique) into the copper cladded "seed" layer (face-down side of the pre-preg) having a thickness of 17 ⁇ , using a UV or Green nanosecond or picosecond laser with a distance between tracks dimensionally equal to the width of the laser beam, approximately 25 ⁇ .
  • the contact areas can also be laser etched in preparation for electroless-plating of copper and electro-plating of nickel and gold.
  • the tape with antenna sites on the facedown side is further processed: sand blasting to remove residual laser ablated particles and to prepare for plating adhesion; depositing carbon to support the through-hole plating of the vertical interconnects; dry film application and photo-masking process; electroless deposition copper (Cu ⁇ 6 ⁇ ) to increase the thickness of the tracks on both sides of the tape, electro-plating of nickel and nickel phosphorous (Ni/NiP ⁇ 9 ⁇ ) or nickel (Ni ⁇ 9 ⁇ ) and palladium/gold or gold(Pd/Au or Au -0.1 ⁇ /0.03 ⁇ or 0.2 ⁇ ) to prevent oxidization.
  • the aforementioned 61/693,262 filed 8/25/2012 discloses various ways (refer to FIGs. 2A-D, 3A-B, 4A-B, 5A-B therein) modifying the contact pads (CP) of a dual interface (DI) antenna module (AM) to offset attenuation of electromagnetic coupling which may be caused by the metallic contact pads (CP).
  • DI dual interface
  • AM antenna module
  • FIG. 3A at lest some of the contact pads (CP) may be perforated, such as with holes or slots to reduce what is referred to as "coverage" of the coupling coil CC, to achieve a positive effect on (increase) read distance.
  • the perforations in the contact pads (CP) serve a similar purpose as the openings 324 in the face plate 302. Both features (perforated contact pads, perforated face plate) may be implemented.
  • cover area refers to how much the contact pads (CP), which are on the opposite side of the module tape from the module antenna (MA), overlap the module antenna (MA). Coverage area may be between 0% (no overlap, such as when the MA is situated entirely outside of the perimeter of the CP), and nearly 100% (substantially total overlap, such as when the module MA is situated entirely within the perimeter of the contact pads (CP), but gaps between the pads reduces the number to slightly below 100%).
  • coil exposure refers to how much of the module antenna (A) which is situated within the area of the contact pads (CP) is exposed, such as through gaps between the contact pads.
  • FIG. 5 (comparable to FIG. 1A of 61/693,262) illustrates a typical layout for contact pads (CP) on the face-up side of a module tape (MT).
  • the contact pads (CP) may comprise a layer of conductive material such as copper (typically with other conductive layers for protection) which is etched, either chemically or with a laser (ablation) to exhibit the desired pattern of pads.
  • the overall dimensions of the antenna module (AM) may be approximately 15mm x 15mm.
  • the overall dimensions of the card body (CB) may be approximately 50mm x 80mm.
  • the overall dimensions and pattern of the contact pads (CP) may be specified by ISO 7816.
  • the pattern contact pads (CP) may occupy an area measuring approximately 10mm x 13mm on the face-up side of the module tape (MT), and may have a thickness of approximately 30 ⁇ .
  • FIG. 5 shows seven contact pads (CP), exposed through an opening in the module tape MT.
  • the module antenna (MA) disposed on an opposite side of the module tape MT from the contact pads (CP) is shown in dashed lines.
  • the coverage area is substantially 100% (the module antenna MA is entirely covered by contact pads (CP), except for the small gaps between adjacent pads), and the coil exposure is substantially 0% (there is only minimal coil exposure in the small gaps between adjacent pads). Therefore, the contact pads CP may shield (attenuate) signals between the booster antenna BA (or card antenna CA) and the module antenna (MA) in the antenna module (AM).
  • US 8,100,337 discloses an electronic module (11) with double communication interface, in particular for a chip card, the said module comprising firstly a substrate (27) provided with an electrical contact terminal block (17) allowing functioning by contact with the contacts of a reader, and secondly comprising an antenna comprising at least one turn (13) and whose terminals are connected to the terminals of a microelectronic chip situated on one face of the module (11).
  • This module (11) is characterized in that the antenna turns (13) are situated substantially outside the area covered by the electrical contacts (17), so that the electrical contacts of the terminal block do not constitute electromagnetic shielding for the signals intended for the antenna. This applies in particular to the production of chip cards with double communication interface with contact and without contact.
  • Claim 1 An electronic module with double communication interface, for a chip card, said module comprising:
  • a substrate including an electrical contact terminal block allowing functioning by contact with the contacts of a reader
  • an antenna including at least one turn upon a surface of the electronic module and whose terminals are connected to the terminals of a microelectronic chip situated on one face of the module,
  • the at least one turn of the antenna is situated upon a first area of the surface of the electronic module substantially outside a second area covered by the electrical contacts, said module having a plurality of protuberances situated outside the area of electrical contacts of the terminal block, on a face of the substrate opposite to that which carries the antenna turns.
  • the contact pads (CP) may cause "shielding" (or attenuation) of the signal, thereby limiting the read distance.
  • shielding may limit the read distance to an uncomfortably small amount, such as 3cm. More advantageously, a read distance of 5cm may be desirable, providing adequate security and improved communication between the external reader and the antenna module (AM), including with a smart card (SC) which incorporates the antenna module (AM).
  • the invention provides, in an even more advantageous variant, a plurality of protuberances 33 situated on the same side as the electrical contacts 17 but in the area which overhangs the antenna turns 13. (column 5, lines 7-18)
  • FIG. 6A (comparable to FIG. 2A of 61/693,262) illustrates a set of contact pads CP wherein the outer edges of at least some of the contact pads CP are extended beyond their original perimeter (outer edges, shown in dashed lines).
  • the coil coverage in this example may be characterized as having been increased, such as from an initial 100% to more than 100%, such as 110%.
  • the coil exposure in this example remains substantially 0%. It is believed that extending the edges may have an adverse effect on (reduce) read distance.
  • Extending the edges to increase the area of individual pad may be useful when using the pads as interconnects for elements such as the module antenna MA on the underside of the module tape MT, capacitive elements and the like.
  • elements such as the module antenna MA on the underside of the module tape MT, capacitive elements and the like.
  • FIG. 5A the following contact pad layout / assignments shown in FIG. 5A. Note that contacts C4 and C8 may be connected with the two ends (LA, LB) of the module antenna MA.
  • FIG. 6B (comparable to FIG. 2B of 61/693,262) illustrates a set of contact pads CP wherein the outer edges of at least some of the contact pads CP are trimmed to be within their original perimeter (outer edges, shown in dashed lines).
  • the coil coverage in this example is decreased, such as from an initial 100% to 90%.
  • the coil exposure in this example is increased, such as from initially substantially 0% to 5% It is believed that trimming the edges may have a slight positive effect on (increase) read distance.
  • FIG. 6C (comparable to FIG. 2C of 61/693,262) illustrates a set of contact pads CP wherein the inner edges of at least some adjacent ones of the contact pads CP are trimmed , so as to have the effect of increasing the gap between the selected ones of the contact pads,
  • the coil coverage in this example is decreased, such as from an initial 100% to 90%.
  • the coil exposure in this example is increased, such as from initially substantially 0% to 5% It is believed that increasing the gap may have a slight positive effect on (increase) read distance.
  • FIG. 6D (comparable to FIG. 2D of 61/693,262) illustrates an alternative to FIG. 6C, wherein rather than increasing the entire gap between adjacent contact pads, their inner edges are modified in an irregular manner.
  • the coil coverage in this example is decreased, such as from an initial 100% to 95%.
  • the coil exposure in this example is increased, such as from initially substantially 0% to 3% It is believed that increasing the gap may have a slight positive effect on (increase) read distance.
  • FIG. 7A (comparable to FIG. 3 A of 61/693,262) shows an example of perforating, such as with holes or slots, at least some of the contact pads.
  • the coil coverage in this example is decreased, such as from an initial 100% to 90%.
  • the coil exposure in this example is increased, such as from initially substantially 0% to 5% It is believed that perforating the contact pads may have a positive effect on (increase) read distance.
  • FIG. 7A a regular array of a plurality of circular perforations (or holes) arranged in an array of rows and columns is shown in one of the contact pads.
  • the perforations may be arranged irregularly, staggered, interleaved, quasi-randomly, and the like.
  • the circular perforations may have an exemplary diameter of 35 ⁇ , and be arranged at an exemplary pitch ⁇ or 140 ⁇ , or 40 ⁇ (offset rows of 35 ⁇ holes).
  • Some of the perforations may be slots, or elongated holes, as shown in another of the contact pads. Holes having other shapes such as rectangular, irregular, elongated, etc, may be formed in some of the contact pads.
  • FIG. 7B (comparable to FIG. 3B of 61/693,262) shows an example of thinning selected areas of at least some of the contact pads.
  • the coil coverage in this example is "effectively” decreased, such as from an initial 100% to 95%.
  • the coil exposure in this example is “effectively” increased, such as from initially substantially 0% to 2% It is believed that thinning the contact pads may have a positive effect on (increase) read distance.
  • the module antenna MA is shown as being an etched, having conductive lines (tracks), rather than the coiled wire module antenna MA shown in FIG. 1.
  • FIG. 8A (comparable to FIG. 4A of 61/693,262) shows a module antenna MA and chip CM disposed on the underside of a module tape MT.
  • the module antenna MA is a wound coil of wire, having two ends a, b bonded to respective bond pads BP.
  • FIG. 8B (comparable to FIG. 4B of 61/693,262) shows the face-up side of the module tape MT shown in FIG. 8A.
  • a pattern of holes or perforations is formed in the contact pads CP (compare FIG. 3A).
  • the pattern of perforations is arranged in concentric circles. This pattern will be visible to the user (of the smart card SC).
  • the coil coverage in this example is "effectively” decreased, such as from an initial 100% to 95%.
  • the coil exposure in this example is “effectively” increased, such as from initially substantially 0% to 2% It is believed that perforating the contact pads in this manner may have a positive effect on (increase) read distance.
  • FIG. 9A (comparable to FIG. 5A of 61/693,262) shows another example of perforating the contact pads CP.
  • the perforations are visible, and are arranged in the pattern of a logo, such as the logo for Chase Bank.
  • FIG. 9B (comparable to FIG. 5B of 61/693,262) shows another example of perforating the contact pads CP.
  • the perforations are visible, and are arranged in the pattern of a logo, such as the logo for Irish Bank.
  • the patterns of perforations in the contact pads may be visible to the user, and in metallized cards can be formed to mimic or complement (such as being smaller versions of, or contuations of, of the like) the perfoations 324 surroundig the window opening 320 in the face plate 302.
  • the contact pads CP of an antenna module AM have been modified with the goal of increasing read distance (by reducing attenuation in coupling between the module antenna MA and the booster antenna BA which may be attributable to the contact pads CP).
  • the coil coverage or effective coil coverage
  • the coil exposure or effective coil exposure
  • the contact pads including inner and outer edges thereof, maintain their original position.
  • the central design of the contact pads is maintained. Larger gaps between contact pads and perforations in the contact pads CP resulting in more coil exposure may improves read distance.
  • FIG. 10A (comparable to FIG. 6A of 61/693,262) illustrates the underside of a module tape MT for an antenna module AM.
  • An antenna structure AS for a module antenna MA is shown, comprising two module antenna segments MAI and MA2.
  • Two module antenna segments MAI and MA2 are shown. These two module antenna segments MAI, MA2 may be arranged concentric with one another, as inner and outer antenna structures. Both module antenna segments MAI, MA2 may be wound coils, or patterned tracks, or one may be a wound coil and the other a pattern of tracks.
  • the two module antenna segments MAI, MA2 may be interconnected with one another in any suitable manner to achieve an effective result. For example, the two module antenna segments MAI, MA2 may be connected in any suitable manner with one another.
  • FIG. 10B (comparable to FIG. 5A of 61/693,262) illustrates an exemplary antenna structure AS which may be used in an antenna module AM, having two segments (compare MAI, MA2) which are interconnected with one another, the antenna structure comprising
  • an inner segment IS having an outer end 9 and an inner end 10
  • the outer end 7 of the outer segment OS is connected with the inner end 10 of the inner segment IS
  • the contact pads CP and antenna structures AS described herein may be formed using laser etching (isolation technique) of copper cladded "seed" layers on a module tape MT using a UV nanosecond or picosecond laser.
  • a seed layer may have a thickness of approximately 17 ⁇ .
  • the space between tracks may be dimensionally equal to the width of the laser beam, approximately 30 ⁇ . the tracks themselves may have a width of 30-50 ⁇ .
  • Perforations, such as those described above, may be formed by laser percussion drilling.
  • the module tape MT may be further processed as follows:
  • Ni/NiP ⁇ 9 ⁇ nickel and nickel phosphorous
  • Ni ⁇ 9 ⁇ nickel
  • palladium/gold or gold(Pd/Au or Au -0.1 ⁇ /0.03 ⁇ or 0.2 ⁇ ) to prevent oxidization.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)

Abstract

L'invention concerne une carte à puce à interface double ayant une antenne d'amplification (BA) à bobine de couplage (CC) dans son corps de carte (CB), et une plaque de face métallisée (202, 302) ayant une ouverture en fenêtre (220, 320) pour le module d'antenne (AM). La performance peut être améliorée par au moins la fabrication de l'ouverture en fenêtre sensiblement plus grande que le module d'antenne, la disposition de perforations à travers la plaque de face, la disposition de matériau ferrite entre la plaque de face et l'antenne d'amplification. De plus, par au moins la modification de plots de contact (CP) sur le module d'antenne (AM), la disposition d'une boucle de compensation (CL) sous l'antenne d'amplification, le décalage du module d'antenne par rapport à la bobine de couplage, l'agencement de l'antenne d'amplification en tant que quasi-dipôle, la disposition de l'antenne de module (MA) avec des bras de réactance capacitifs, et la disposition d'un élément en ferrite (FE) dans le module d'antenne, entre l'antenne de module et les plots de contact.
EP13704726.2A 2012-01-23 2013-01-23 Décalage de protection et amélioration de couplage de cartes à puce métallisées Withdrawn EP2807700A1 (fr)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US201261589434P 2012-01-23 2012-01-23
US201261619951P 2012-04-04 2012-04-04
US201261624384P 2012-04-15 2012-04-15
US201261693262P 2012-08-25 2012-08-25
US13/600,140 US8991712B2 (en) 2010-08-12 2012-08-30 Coupling in and to RFID smart cards
US201261697825P 2012-09-07 2012-09-07
US201261732414P 2012-12-03 2012-12-03
US201261737746P 2012-12-15 2012-12-15
US13/730,811 US9165240B2 (en) 2009-10-15 2012-12-28 Coupling in and to RFID smart cards
PCT/EP2013/051175 WO2013110625A1 (fr) 2012-01-23 2013-01-23 Décalage de protection et amélioration de couplage de cartes à puce métallisées

Publications (1)

Publication Number Publication Date
EP2807700A1 true EP2807700A1 (fr) 2014-12-03

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EP13704726.2A Withdrawn EP2807700A1 (fr) 2012-01-23 2013-01-23 Décalage de protection et amélioration de couplage de cartes à puce métallisées

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EP (1) EP2807700A1 (fr)
JP (1) JP2015513712A (fr)
KR (1) KR20140117614A (fr)
CN (1) CN104471791A (fr)
AU (1) AU2013211649A1 (fr)
BR (1) BR112014018042A8 (fr)
CA (1) CA2860909C (fr)
MX (1) MX2014008936A (fr)
WO (1) WO2013110625A1 (fr)

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Also Published As

Publication number Publication date
KR20140117614A (ko) 2014-10-07
CA2860909C (fr) 2021-11-16
WO2013110625A1 (fr) 2013-08-01
CA2860909A1 (fr) 2013-08-01
MX2014008936A (es) 2015-06-02
BR112014018042A8 (pt) 2017-07-11
BR112014018042A2 (fr) 2017-06-20
JP2015513712A (ja) 2015-05-14
CN104471791A (zh) 2015-03-25
AU2013211649A1 (en) 2014-07-31

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