EP2781628A1 - Procédé de production pour moule à transfert, moule à transfert produit à l'aide de celui-ci et composant produit à l'aide dudit moule à transfert - Google Patents

Procédé de production pour moule à transfert, moule à transfert produit à l'aide de celui-ci et composant produit à l'aide dudit moule à transfert Download PDF

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Publication number
EP2781628A1
EP2781628A1 EP11875931.5A EP11875931A EP2781628A1 EP 2781628 A1 EP2781628 A1 EP 2781628A1 EP 11875931 A EP11875931 A EP 11875931A EP 2781628 A1 EP2781628 A1 EP 2781628A1
Authority
EP
European Patent Office
Prior art keywords
component
mold
transfer mold
resist pattern
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11875931.5A
Other languages
German (de)
English (en)
Other versions
EP2781628A4 (fr
Inventor
Takashi Sano
Tokinori TERADA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leap Co Ltd
Original Assignee
Leap Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leap Co Ltd filed Critical Leap Co Ltd
Publication of EP2781628A1 publication Critical patent/EP2781628A1/fr
Publication of EP2781628A4 publication Critical patent/EP2781628A4/fr
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds

Definitions

  • the present invention relates to a transfer mold manufacturing method, a transfer mold manufactured thereby, and a component produced by the transfer mold. More specifically, the present invention relates to a method for manufacturing a transfer mold for production of a component by electroplating, a transfer mold manufactured thereby, and a component produced thereby, wherein the transfer mold has superior durability and high aspect ratio.
  • Electroplating allows formation of a thick film conductor with less restriction in terms of dimension. It is therefore widely used in production of display components such as a dial and hands of a watch, machine components such as a small gear, a spring, a pipe and a diaphragm (pressure sensor) and electronic components such as a wiring of a semiconductor device and a coil.
  • display components such as a dial and hands of a watch
  • machine components such as a small gear, a spring, a pipe and a diaphragm (pressure sensor)
  • electronic components such as a wiring of a semiconductor device and a coil.
  • Patent Document 1 discloses manufacturing a cavity insert by: first creating a machined master mold on which a fine pattern has been formed in advance; subsequently creating a transfer master mold by hot press from the machined master mold; and then creating the cavity insert by electroplating from the transfer master mold.
  • Patent Document 2 discloses manufacturing a watch dial by the steps of: forming a mask pattern having openings on a surface of a silicon wafer; performing an anisotropic etching; forming a common electrode film; forming an electroplated film which grows on the common electrode film; etching the silicon wafer; and forming a resin watch dial having protruding portions by using the electroplated film as a transfer mask.
  • Fig. 6 shows structural drawings of a component formed by using a conventional transfer mold.
  • a photoresist 30 is patterned on a metal substrate 90 to a shape of the component by partially removing the same.
  • the metal substrate 90, on which the resist pattern has thus been formed, is used as a transfer mold for electroplating (hereinafter referred to as "EP") a predetermined metal (Ag, Cu, Ni, etc.) to form the component 95.
  • EP electroplating
  • the component 95 molded by EP is transferred onto an adhesive bond 85 and then adhered to a component substrate 97.
  • the component having a given shape depending on its intended use is produced by EP and transferred onto the component substrate 97 for use.
  • angles ⁇ formed at sidewalls of the photoresist 30 are each set to be a blunt angle of less than 45°.
  • an electronic component such as a wiring, a coil, etc.
  • the thickness which the photoresist 30 is generally required to have is approximately 10 ⁇ m.
  • the component 95 is formed by EP in such a manner that it fills up along the sidewalls of the photoresist 30 having the thickness of approximately 10 ⁇ m.
  • a wiring pattern, a conductive coil or the like is formed as a long component, it contacts the sidewalls in large area, resulting in increased release resistance in the release and transfer of the component. That is, when using a transfer mold made with patterned photoresist, the transfer of the component onto the component substrate 97 requires an application of a release force that is comparable to the increased release resistance. This causes the edge of the pattern of the photoresist 30, which is appressed to the metal substrate 90, to be easily stripped. In fact, the resist is stripped after a few times of use, and as a result, a problem arises that the transfer mold can then no longer be in use.
  • the present invention has been made in order to solve the above problem, and its purpose is to provide a transfer mold having superior durability and high aspect ratio for production of a component by EP as well as to provide a component produced by the transfer mold.
  • transfer molds there are four types of transfer molds which are: a master mold, a mother mold, a son mold, and a transfer mold.
  • the master mold is a mold which serves as a prototype for component production. Usually, it is not directly used for component production.
  • the mother mold is a mold which is created by using the master mold so as to have an inverse contour of the master mold.
  • the mother mold as well is not directly used for the component production.
  • the son mold is a mold which is created by using the mother mold so as to have an inverse contour of the mother mold.
  • the son mold has a shape that is identical with the master mold.
  • the transfer mold is generally formed by subjecting the son mold to an insulation layer formation process, a releasing layer formation process, etc. The component production is then carried out with use of this transfer mold, and when it is worn off, a new transfer mold is created again from the master mold by way of the mother mold and the son mold.
  • a transfer mold manufacturing method of the present invention includes steps of: forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate, a sidewall of the resist pattern forming a desired angle ⁇ ; creating a transfer mold by filling up the resist pattern having the shape of the component by electroplating to a predetermined thickness; and providing a master mold by separating the transfer mold from the metal substrate leaving the metal substrate and the resist pattern.
  • a transfer mold manufacturing method of the present invention includes steps of: forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate, a sidewall of the resist pattern forming a desired angle ⁇ ; creating a transfer mold by filling up the resist pattern having the shape of the component by electroplating to a predetermined thickness; providing a master mold by separating the transfer mold from the metal substrate leaving the metal substrate and the resist pattern; creating a son mold by transferring by way of the master mold and a mother mold; and providing a transfer mold by performing, on the son mold, a releasing layer formation process for facilitating a release of the component to be formed by electroplating and an insulation layer formation process for forming an insulation layer in that portion which is other than a portion in which the component is to be formed.
  • the transfer mold manufacturing method of the present invention includes a step of forming a roughening layer on a surface of the metal substrate as a first step.
  • a transfer mold manufacturing method of the present invention includes steps of: forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate, a sidewall of the resist pattern forming an angle of approximately 90°; creating a transfer mold by filling up the resist pattern having the shape of the component by electroplating to a predetermined thickness; separating the transfer mold from the metal substrate; removing a photoresist partially to leave a resist pattern layer in that portion of the separated transfer mold which is other than a portion corresponding to the component to be transferred; and providing a master mold by treating the sidewall of the shape of the component with beam irradiation using the resist pattern layer as a protective layer, the beam irradiation being modulated such that the angle at the sidewall is tailored to form approximately 90° or a given angle less than 90°
  • a transfer mold manufacturing method of the invention of the instant application includes steps of: forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate, a sidewall of the resist pattern forming an angle of approximately 90°; creating a transfer mold by filling up the resist pattern having the shape of the component by electroplating to a predetermined thickness; separating the transfer mold from the metal substrate; removing a photoresist partially to leave a resist pattern layer in that portion of the separated transfer mold which is other than a portion corresponding to the component to be transferred; providing a master mold by treating the sidewall of the shape of the component with beam irradiation using the resist pattern layer as a protective layer, the beam irradiation being modulated such that the angle at the sidewall is tailored to form approximately 90° or a given angle less than 90°; creating a son mold by transferring by way of the master mold and a mother mold; and providing a transfer mold by performing, on the son mold, a releasing layer formation process for facilitating a release
  • the method of the present invention includes a step of forming a roughening layer on a surface of the metal substrate as a first step.
  • a master mold of the present invention is manufactured by the above-described method and has a cross-sectional surface with a desired aspect ratio, a sidewall of the cross-sectional surface forming an angle between 45° and 88°.
  • a transfer mold of the present invention is provided by subjecting the son mold created by using the above-described master mold to only an insulation layer formation process or to the insulation layer formation process and a releasing layer formation process.
  • a component produced by electroplating in the present invention is molded by the electroplating using the above-described transfer mold and transferred.
  • the present invention makes it possible to provide a component having superior durability and high aspect ratio formed by EP in manufacturing display components, machine components and electronic components by EP.
  • Fig. 1 is a process drawing showing the steps for manufacturing a master mold by electroplating according to the present invention.
  • a top surface of a metal substrate 10 is provided with a roughening layer 15 for roughening a contact surface of a master mold to be formed by EP.
  • the roughening layer 15 may be formed by roughening the surface of the metal substrate 10 directly by hydrochloric acid treatment or the like.
  • a stripe-like photo resist pattern layer, a lattice-like photo resist pattern layer or the like, which is suitable for roughening may be formed as the roughening layer 15 by partially removing the photoresist.
  • the roughening layer 15 may be omitted as long as there is no problem of adhesion strength therebetween.
  • a photoresist 30 for forming a pattern of a shape of a component to be produced is applied onto the roughening layer 15 on the metal substrate 10 to a predetermined thickness. This is for the purpose of obtaining a component having such a shape that has a desired aspect ratio and desired angles ⁇ at sidewalls thereof. For example, in a case where a wiring of a semiconductor electronic component or a coil with a line width of 5 ⁇ m is to be produced, the photoresist 30 is applied to a thickness of 10 ⁇ m so that the electronic component or the coil has the thickness of 10 ⁇ m.
  • the photoresist 30 is then subjected to an exposure effected from the direction of the arrows with an intervening photomask 40 having a pattern of a desired component.
  • Fig. 1c shows the pattern of the component formed by subjecting the resist pattern to the exposure as shown in Fig. 1b and a development.
  • the angles ⁇ formed at the respective sidewalls of the resist pattern of the component can optionally be determined depending on the material and film thickness of the applied photoresist 30 as well as the exposure condition to the irradiation performed with the intervening photomask 40 as shown in Fig. 1b .
  • a 3D lens may be employed to vary the irradiation intensity on the both sidewalls of the resist pattern.
  • the irradiation intensity on the both sidewalls may also be varied by means of a gray mask.
  • a desired metal e.g., Ni
  • a desired metal e.g., Ni
  • the master mold 20 created by EP in Fig. 1d is separated from the metal substrate 10.
  • the rough surface profile of the roughening layer 15 has been transferred to a roughened surface layer 17 of the master mold.
  • the angles ⁇ at the both sidewalls remain to be the angles ⁇ in Fig. 1d .
  • the roughened surface layer 17 of the master mold is transferred to the son mold 60, which is eventually used as the transfer mold and illustrated in Fig. 3 , for the sake of increased adhesion strength to an insulation layer to be formed thereon. As such, it is not necessarily required.
  • making the angles ⁇ as acute as 45° to 88° allows the pattern density of an intended device to be improved.
  • the 10 ⁇ m thickness of the photoresist 30 in Fig. 1c is maintained in the inverted master mold 20 by being transferred.
  • Fig. 2 is a process drawing showing the steps for manufacturing a master mold by beam treatment according to the present invention.
  • Fig. 2a shows the master mold 20 created by the method illustrated in Fig. 1 .
  • the angles ⁇ are each approximately 90°.
  • the photoresist 30 for forming a reverse pattern of the shape of the component is applied to a predetermined thickness.
  • the photoresist 30 is then subjected to an exposure effected from the direction of the arrows with an intervening photomask 40 having the reverse pattern of the component.
  • that portion of the resist which corresponds to the component is developed and removed, thereby leaving the photoresist 30 only on the flat roughened surface layer 17 of the master mold.
  • the resist pattern formed in Fig. 2b is used as a protective film in treating the sidewalls of the pattern of the component with beam irradiation.
  • the irradiation beam is modulated in such a manner that the angles ⁇ are tailored to form predetermined degrees.
  • the arrows show the direction of the beam.
  • the treated master mold 20 shown in Fig. 2d has not only the same shape but also the same function and characteristics as the master mold 20 shown in Fig. 1d .
  • the irradiation beam may be an electron beam, an ion beam, or a FIB (Focused Ion Beam) whose irradiation strength is variable by focusing the beam with a lens.
  • Fig. 3 is a process drawing showing the steps for manufacturing a son mold according to the present invention.
  • a desired metal e.g., Ni
  • a mother mold 50 created thereby is then separated.
  • a desired metal e.g., Ni
  • a son mold 60 is created in the same manner.
  • the son mold 60 thus created by EP is separated from the mother mold 50.
  • the son mold 60 is created by transferring the mother mold 50 created by transferring the master mold 20. As such, it takes over the same function and characteristics as those of the master mold 20. Furthermore, the son mold 60 is integrally formed of one metal material. This, with the releasing layer formation process and the insulation layer formation process performed on a roughened surface layer 19 of the son mold as will be explained next, makes it possible to obtain a transfer mold which has a desired aspect ratio and angles ⁇ , does not break even after repetitive use, and is highly suitable for quantity production.
  • Fig. 4 is a process drawing showing the steps for manufacturing a transfer mold according to the present invention.
  • Fig. 4a shows the son mold 60 created in Fig. 3c .
  • the son mold 60 is subjected to heat treatment under prescribed conditions for ease of release and transfer of the component to be produced. This is followed by the releasing layer formation process for forming a NiOx film 70 having a predetermined thickness on the surface of the son mold 60. Since the NiOx film 70 is conductive, it does not hinder EP. Moreover, the low adhesive property thereof to the electroplated component allows an easy release.
  • an insulation layer is formed in order to prevent EP in that portion of the surface which is other than the portion in which the component is to be formed.
  • This is accomplished by the insulation layer formation process for forming a SiO 2 film 80 chemically by CVD (Chemical Vapor Deposition) or physically by sputtering on said portion of the surface.
  • the SiO 2 film 80 is formed by applying polysilazane and treating it with heat.
  • the photoresist 30 to be patterned to a predetermined shape is applied on the SiO 2 film 80.
  • the photoresist is partially removed by subjecting the same to an exposure effected from the direction of the arrows with an intervening photomask 40 having the reverse pattern of the component.
  • the SiO 2 film 80 is removed physically by beam irradiation from the direction of the arrows or chemically by hydrofluoric acid treatment or the like.
  • the transfer mold is completed either by removing the SiO 2 film 80 only in the bottom portion so that it is left on the sidewalls as shown in Fig. 4e or by removing the SiO 2 film 80 both on the sidewalls and in the bottom portion as shown in Fig. 4f .
  • polysilazane similar steps as in screen printing are carried out. That is, following the formation of the NiOx film 70 in Fig. 4b , polysilazane is printed in that portion of the surface of the NiOx film 70 which is other than the pattern of the component for forming the component. It is then treated with heat. In this manner, the same shape as shown in Fig. 4f can be obtained.
  • the releasing layer formation process is performed by, as shown in Fig. 4b , depositing metal oxides (AlOx, TiOx, etc.), nitrides or organic substances (resist) on the son mold 60 to such a thickness of 1 to 1000 ⁇ that allows the conductivity thereof to be maintained.
  • metal oxides AlOx, TiOx, etc.
  • nitrides or organic substances resist
  • an insulator such as resist may be used instead of SiO 2 . Note that the releasing layer formation process and the insulation layer formation process may be performed in reverse order.
  • Fig. 5 is a process drawing showing the steps for manufacturing a component using the transfer mold according to the present invention.
  • a desired metal (Ag, Cu, Ni, etc.) is electroplated on the transfer mold 60 to form the component 95.
  • the component 95 molded by EP is, as in the case shown in Fig. 6b , transferred onto the adhesive bond 85 and then adhered to the component substrate 97. Alternatively, the component 95 is adhered to a green sheet 98 which is then treated with heat for curing.
  • the use of the adhesive bond 85 is eliminated by such softness of the green sheet 98 before curing that the component 95 is buried therein.
  • the component 95 of an optional shape having a desired aspect ratio and angles ⁇ is provided by EP. It can be repetitively molded and transferred onto the device substrate 97 or green sheet 98 for diverse intended use.
  • the present invention is able to provide a component having superior durability and high aspect ratio in production, by EP, of display components such as a dial and hands of a watch, machine components such as a small gear, a spring, a pipe and a diaphragm (pressure sensor), and electronic components such as a wiring of a semiconductor device and a coil.
  • display components such as a dial and hands of a watch
  • machine components such as a small gear, a spring, a pipe and a diaphragm (pressure sensor)
  • electronic components such as a wiring of a semiconductor device and a coil.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Optical Record Carriers (AREA)
EP20110875931 2011-11-15 2011-11-15 Procédé de production pour moule à transfert, moule à transfert produit à l'aide de celui-ci et composant produit à l'aide dudit moule à transfert Withdrawn EP2781628A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/006355 WO2013072953A1 (fr) 2011-11-15 2011-11-15 Procédé de production pour moule à transfert, moule à transfert produit à l'aide de celui-ci et composant produit à l'aide dudit moule à transfert

Publications (2)

Publication Number Publication Date
EP2781628A1 true EP2781628A1 (fr) 2014-09-24
EP2781628A4 EP2781628A4 (fr) 2015-03-04

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EP20110875931 Withdrawn EP2781628A4 (fr) 2011-11-15 2011-11-15 Procédé de production pour moule à transfert, moule à transfert produit à l'aide de celui-ci et composant produit à l'aide dudit moule à transfert

Country Status (7)

Country Link
US (1) US20140291157A1 (fr)
EP (1) EP2781628A4 (fr)
JP (1) JP5073878B1 (fr)
KR (1) KR20140092915A (fr)
CN (1) CN104024487A (fr)
TW (1) TW201319323A (fr)
WO (1) WO2013072953A1 (fr)

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Publication number Priority date Publication date Assignee Title
WO2015004698A1 (fr) * 2013-07-11 2015-01-15 株式会社Ｌｅａｐ Procédé de fabrication de connecteur
CN103913789B (zh) * 2014-04-03 2015-12-30 大连理工大学 金属基底上制备高深宽比金属微光栅的方法
CN112776495B (zh) * 2020-12-16 2022-03-18 维达力实业（赤壁）有限公司 Uv转印模具的修复方法及uv转印模具

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Publication number Publication date
TW201319323A (zh) 2013-05-16
JPWO2013072953A1 (ja) 2015-04-02
EP2781628A4 (fr) 2015-03-04
US20140291157A1 (en) 2014-10-02
KR20140092915A (ko) 2014-07-24
WO2013072953A1 (fr) 2013-05-23
JP5073878B1 (ja) 2012-11-14
CN104024487A (zh) 2014-09-03

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