EP2759759A1 - Source de lumière d'éclairage et appareil d'éclairage - Google Patents

Source de lumière d'éclairage et appareil d'éclairage Download PDF

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Publication number
EP2759759A1
EP2759759A1 EP14152292.0A EP14152292A EP2759759A1 EP 2759759 A1 EP2759759 A1 EP 2759759A1 EP 14152292 A EP14152292 A EP 14152292A EP 2759759 A1 EP2759759 A1 EP 2759759A1
Authority
EP
European Patent Office
Prior art keywords
light
support
mounting
heat dissipation
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP14152292.0A
Other languages
German (de)
English (en)
Other versions
EP2759759B1 (fr
Inventor
Koji Omura
Naoki Tagami
Kazuo Gouda
Kousuke SUGAHARA
Tsugihiro Matsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of EP2759759A1 publication Critical patent/EP2759759A1/fr
Application granted granted Critical
Publication of EP2759759B1 publication Critical patent/EP2759759B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F21V3/0615—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass the material diffusing light, e.g. translucent glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F21V23/009—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being inside the housing of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to illumination light sources and lighting apparatuses, and particularly relates to a light bulb-shaped lamp which includes a light-emitting module having a light-emitting diode (LED) and others, and a lighting apparatus in which the light bulb-shaped lamp is used.
  • a light bulb-shaped lamp which includes a light-emitting module having a light-emitting diode (LED) and others, and a lighting apparatus in which the light bulb-shaped lamp is used.
  • LED light-emitting diode
  • LEDs Semiconductor light-emitting elements such as LEDs are highly efficient, long-life elements having a small size, and thus are expected to be used as light sources for various products.
  • LED bulbs light bulb-shaped LED lamps
  • PTL Patent Literature 1, for example.
  • a light bulb-shaped LED lamp includes, for example, an LED module serving as a light source, a globe which covers the LED module, a support component which holds the LED module, a drive circuit which supplies power to the LED module, an outer case formed so as to surround the drive circuit, and a base which receives power.
  • An LED module includes a board and plural LEDs (light-emitting elements) mounted on the board.
  • a light bulb-shaped LED lamp which is formed using a globe (clear bulb) made of clear glass used for an incandescent light bulb, and holds an LED module at the center position in a space inside the globe.
  • a support extending from the opening of the globe toward the center of the globe is used, and an LED module is fixed at a top end of this support.
  • An LED mounted on the LED module generates heat by emitting light, which increases the temperature of the LED and decreases optical power.
  • the heat generated by an LED itself decreases the light-emission efficiency of the LED.
  • the present invention has been conceived in light of the above conventional problems, and an object thereof is to provide an illumination light source and a lighting apparatus which can increase the efficiency of dissipating heat generated by a light-emitting module.
  • an illumination light source includes: a light-transmissive globe; a light-emitting module; a drive circuit for causing the light-emitting module to emit light; and a pedestal which includes: a support for fixing the light-emitting module at a predetermined position inside the globe; a mounting for holding the support; and a heat dissipation portion, wherein the heat dissipation portion is between the drive circuit and an area for disposing the support on a main surface of the mounting which is on a side where the light-emitting module is provided, and has a surface which forms an angle with a back surface of the mounting which is on a side opposite the main surface.
  • the heat dissipation portion may be a protrusion sticking out from the back surface of the mounting.
  • the mounting may have a through-hole for fixing the support in a state where an end portion of the support is passing through the through-hole, and the protrusion may be formed by the end portion of the support that is sticking out of the through-hole from the back surface of the mounting.
  • the illumination light source according to an aspect of the present invention may further include an insulating component between the heat dissipation portion and the drive circuit, wherein the insulating component may have a heat-receiving portion having a recessed shape conforming to a shape of the heat dissipation portion.
  • the heat dissipation portion may be a recess depressed relative to the back surface of the mounting.
  • the mounting may have a through-hole for fixing the support in a state where an end portion of the support is inserted in the through-hole, and the recess may be formed by an inner surface of the through-hole and an end surface of the end portion.
  • the illumination light source according to an aspect of the present invention may further include an insulating component between the heat dissipation portion and the drive circuit, wherein the insulating component may have a heat-receiving portion having a protruding shape conforming to a shape of the heat dissipation portion.
  • a lighting apparatus includes the illumination light source according to one of the above aspects.
  • heat generated by a light-emitting module can be efficiently dissipated.
  • LED bulb light bulb-shaped LED lamp
  • FIG. 1 is an external perspective view of a light bulb-shaped lamp according to an embodiment.
  • FIG. 2 is an exploded perspective view of the light bulb-shaped lamp according to the embodiment. It should be noted that lead wires 53a to 53d are not illustrated in FIG. 2 .
  • the light bulb-shaped lamp 1 is a light bulb-shaped lamp that is a substitute for a light bulb-shaped fluorescent light or an incandescent light bulb.
  • the light bulb-shaped lamp 1 includes a globe 10, an LED module 20 which is an example of a light-emitting module, and a pedestal 45 which includes a support 30 and a mounting 40.
  • the light bulb-shaped lamp 1 further includes a drive circuit 50, a circuit case 60, a heat sink 70, an outer case 80, and a base 90.
  • the light bulb-shaped lamp 1 has an envelope composed of the globe 10, the outer case 80, and the base 90.
  • FIG. 3 is a cross-sectional view of the light bulb-shaped lamp 1 according to the embodiment.
  • the dashed dotted line drawn in the vertical direction of FIG. 3 indicates a lamp axis J of the light bulb-shaped lamp (central axis), the lamp axis J is the same as the axis of the globe 10 (globe axis) in the present embodiment. Further, the lamp axis J indicates the center of rotation when the light bulb-shaped lamp 1 is attached to the socket of a lighting apparatus (not illustrated in FIG. 3 ), and is the same as the rotation axis of the base 90. Further, FIG. 3 shows a side view of the drive circuit 50, not a cross-sectional view.
  • the globe 10 is a substantially hemispherical, light-transmissive cover for allowing the light emitted by the LED module 20 to be sent out of the lamp.
  • the globe 10 according to the present embodiment is a glass bulb (clear bulb) made of silica glass transparent to visible light.
  • the LED module 20 housed in the globe 10 can be visually recognized from the outside of the globe 10.
  • the LED module 20 is covered by the globe 10. Consequently, light from the LED module 20 that is incident onto the inner surface of the globe 10 passes through the globe 10 to be sent out of the globe 10.
  • the globe 10 is formed so as to house the LED module 20.
  • the globe 10 is shaped so as to have a spherically closed end and an opening 11 at the other end. Specifically, the globe 10 is shaped such that a portion of a hollow sphere extends to be narrow in a direction away from the center of the sphere, and the opening 11 is formed at the position distant from the center of the sphere.
  • a glass bulb having a shape similar to those of general light bulb-shaped fluorescent lights and general incandescent light bulbs can be used.
  • a glass bulb such as a type-A, type-G, or type-E bulb can be used as the globe 10.
  • the opening 11 of the globe 10 is placed on the surface of the pedestal 40, for example, and an adhesive such as a silicone resin is applied between the pedestal 40 and the outer case 80 in this state, thereby fixing the globe 10.
  • the globe 10 does not necessarily need to be transparent to visible light, and may have a light diffusion function.
  • a resin or white pigment that contains light diffusion material such as silica or calcium carbonate, or the like is applied onto the entire inner or external surface of the globe 10, thereby forming a milky light diffusion film thereon.
  • the light diffusing function given to the globe 10 allows light incident from the LED module 20 onto the globe 10 to be diffused, thus increasing a light distribution angle of the light bulb-shaped lamp 1.
  • the shape of the globe 10 is not limited to type-A, and may be a spheroid or oblate spheroid.
  • the material of the globe 10 is not limited to glass, and a resin such as acrylic (polymethyl methacrylate (PMMA)) or polycarbonate (PC) may be used therefor.
  • the LED module 20 is a light-emitting module which includes a light-emitting element, and emits light of a predetermined color (wavelength) such as white.
  • the LED module 20 is placed inside the globe 10, and is preferably placed at the center position of the spherical shape formed by the globe 10 (for example, inside of a large diameter portion of the globe 10 where the inside diameter is large).
  • the LED module 20 is held in the space of the globe 10 by the support 30, and emits light using power supplied from the drive circuit 50 via the lead wires 53a and 53b.
  • a board 21 of the LED module 20 is held by the support 30.
  • FIG. 4 shows a simplified structure of the LED module 20 in the light bulb-shaped lamp 1 according to the embodiment.
  • FIG. 4 is a plan view of the LED module 20 of the light bulb-shaped lamp 1 according to the embodiment.
  • Part (b) of FIG. 4 is a cross-sectional view of the LED module 20 taken along the line A-A' in (a).
  • Part (c) of FIG. 4 is a cross-sectional view of the LED module 20 taken along the line B-B' in (a) of FIG. 4 .
  • the LED module 20 includes the board 21, LEDs 22, sealing components 23, metal lines 24, wires 25, and terminals 26a and 26b.
  • the LED module 20 has a chip on board (COB) structure in which a bare chip is directly mounted on the board 21.
  • COB chip on board
  • the board 21 is a mounting board on which the LEDs 22 are mounted, and has a first main surface on which the LEDs 22 are mounted (front surface), and a second main surface opposite the first main surface (back surface).
  • the board 21 has, for example, a rectangular plate shape in plane view (when viewed from the top of the globe 10).
  • the board 21 is connected to an end of the support 30. Specifically, the board 21 and the support 30 are connected such that the second main surface of the board 21 and the end surface of the support 30 are in contact.
  • a board having a low transmittance of light emitted from the LEDs 22 can be used as the board 21.
  • Examples of such a board include a white substrate such as a white alumina board whose total transmittance is 10% or less, a resin-coated metal board (metal base board), and the like.
  • the use of a board having a low light transmittance helps in preventing light from passing through the board 21 and being emitted from the second main surface, thereby avoiding the occurrence of color unevenness.
  • an inexpensive white substrate can be used, which achieves cost reduction.
  • a light-transmissive board having a high light transmittance can also be used as the board 21.
  • the use of a light-transmissive board allows light from the LEDs 22 to pass through the board 21, and to be emitted also from a surface (back surface) on which the LEDs 22 are not mounted.
  • the LEDs 22 are mounted only on the first main surface (front surface) of the board 21, light is also emitted from the second main surface (back surface), and thus light distribution characteristics equivalent to those of an incandescent light bulb can be obtained.
  • light can be omnidirectionally emitted from the LED module 20, and thus it is possible to achieve omnidirectional light distribution characteristics.
  • Examples that can be used as a light-transmissive board include a board whose total transmittance to visible light is 80% or more, and a board transparent to visible light (in other words, a board whose transmittance is extremely high, which allows the view on the other side to be seen through the board).
  • a light-transmissive board a light-transmissive ceramics board made of polycrystalline alumina or aluminum nitride, a clear glass board made of glass, a crystal substrate made of crystal, a sapphire substrate made of sapphire, a transparent resin board made of a transparent resin material, or the like can be used.
  • a white polycrystalline-ceramics board made of sintered alumina is used as the board 21.
  • a white alumina board having a thickness of 1 mm, whose light reflectance is 94% or a white alumina board having a thickness of 0.635 mm, whose light reflectance is 88% can be used as the board 21.
  • a resin board, a flexible board, or a metal base board can also be used as the board 21.
  • the shape of the board 21 is not limited to a rectangle, and another shape such as a square or a circle can also be used.
  • the board 21 has two insertion holes 27a and 27b for electrical connection with the two lead wires 53a and 53b. Tip portions of the lead wires 53a and 53b pass through the insertion holes 27a and 27b and soldered onto the terminals 26a and 26b formed in the board 21, respectively.
  • the LED 22 is an example of a light-emitting element, and is a semiconductor light-emitting element which emits light by using predetermined power. All the LEDs 22 on the board 21 are of the same type, and selected so as all to have the same VF characteristics.
  • the LEDs 22 are bare chips which emit single-color visible light.
  • blue LED chips which emit blue light by being electrically connected are used.
  • a blue LED chip for example, a gallium nitride-based semiconductor light-emitting element can be used which is formed using InGaN based material and the center wavelength of which is at least 440 nm and at most 470 nm.
  • the LEDs 22 are mounted only on the first main surface (front surface) of the board 21, in plural lines along a long side of the board 21.
  • 48 LEDs 22 are disposed on the board 21 in order to achieve brightness of about 60 watts.
  • 48 LEDs 22 are disposed on the first main surface (front surface) of the board 21 so as to be in four parallel lines each including 12 LEDs 22.
  • one of adjacent LEDs 22 has a cathode electrode connected to an anode electrode of the other of the adjacent LEDs 22 via the metal line 24 by wire-bonding using the wires 25.
  • adjacent LEDs 22 may be directly connected using the wires 25.
  • adjacent LEDs 22 may be connected by chip-to-chip wire-bonding.
  • the metal line 24 disposed between the adjacent LEDs 22 is unnecessary.
  • the plural LEDs 22 are mounted on the board 21 in the present embodiment, the number of the mounted LEDs 22 may be changed as appropriate according to the usage of the light bulb-shaped lamp 1.
  • the LED module 20 may have one LED 22.
  • the number of LEDs 22 to be mounted in one line may further be increased.
  • the number of lines of the LEDs 22 is not limited to four, and may be one, two, or three, or even five or more.
  • the sealing components 23 are made of, for example, resin and formed so as to cover the LEDs 22.
  • the sealing components 23 are each formed so as to seal all the plural LEDs 22 in one line.
  • four lines of the LEDs 22 are provided, and thus four sealing components 23 are formed.
  • the four sealing components 23 are each provided linearly on the first main surface of the board 21, along the aligned lines of the plural LEDs 22 (in the line direction).
  • the sealing components 23 mainly include light-transmissive material, and wavelength conversion material is mixed into the light-transmissive material when a wavelength of light from the LEDs 22 needs to be converted into a predetermined wavelength.
  • the sealing components 23 include a fluorescent substance as a wavelength conversion material.
  • the sealing components 23 are wavelength conversion components which convert the wavelength (color) of light emitted by the LEDs 22.
  • Such sealing components 23 can be formed using, for example, insulating resin material which contains fluorescent particles (fluorescent substance containing resin). Fluorescent particles are excited by the light emitted by the LEDs 22, and emit light having a desired color (wavelength).
  • a resin material used to form the sealing components 23 is a silicone resin.
  • Light diffusion material may be dispersed in the sealing components 23.
  • the sealing components 23 do not necessarily need to be formed using a resin material, and may be formed using an inorganic material such as low-melting glass and sol-gel glass, other than an organic material such as fluororesin.
  • YAG yttrium aluminum garnet
  • blue light emitted by the LED22 is partially converted into light having a yellow light wavelength by yellow fluorescent particles contained in the sealing components 23. Then, blue light not absorbed by the yellow fluorescent particles and fellow light whose wavelength has been changed by yellow fluorescent particles are diffused and mixed in the sealing components 23 so as to be emitted as white light from the sealing components 23.
  • Silica particles for instance, are used as light diffusion material.
  • the sealing components 23 according to the present embodiment are formed using a fluorescent substance containing resin obtained by dispersing predetermined fluorescent particles into a silicone resin.
  • a fluorescent substance containing resin is applied onto the first main surface of the board 21 by a dispenser and cured, thereby forming the sealing components 23.
  • the shape of the sealing components 23 in a cross section perpendicular to the long side thereof is substantially semicircular.
  • a fluorescent film such as a sintered film which includes fluorescent particles and an inorganic bonding material (binder) such as glass, or a fluorescent substance containing resin which is the same as that applied on the surface of the board 21 may further be applied as the second wavelength conversion component, between the board 21 and the LEDs 22 or on the second main surface (back surface) of the board 21.
  • the metal lines 24 are conductive lines through which a current for causing the LEDs 22 to emit light flows, and formed on the surface of the board 21 by patterning so as to have a predetermined shape. As shown in (a) of FIG. 4 , the metal lines 24 are formed on the first main surface of the board 21.
  • the metal lines 24 supply, to the LEDs 22, power supplied from the lead wires 53a and 53b to the LED module 20.
  • the metal lines 24 can be formed by patterning or printing on a metal film made of a metal material, for example.
  • Examples to be used as the material of the metal lines 24 include silver (Ag), tungsten (W), copper (Cu), gold (Au), and the like.
  • the metal lines 24 exposed from the sealing components 23 are preferably covered with a glass film (glass coated film) which includes a glass material or a resin film (resin coated film) which includes a resin material. This achieves improvement in insulating properties of the LED module 20 and a reflectance of the surface of the board 21, for example.
  • the wires 25 are electric wires such as gold wires, for example. As shown in (b) of FIG. 4 , the wires 25 connect the LEDs 22 and the metal lines 24.
  • wire bonding portions on the top surface of each LED 22 and the metal lines 24 formed on both sides of the LED 22 and adjacent to the LED 22 are wire-bonded using the wires 25.
  • the wires 25 are entirely embedded in the sealing components 23 so as not to be exposed therefrom. This prevents light from being absorbed and reflected by the exposed wires 25, for instance.
  • the terminals 26a and 26b are external connection terminals which receive, from the outside of the LED module 20, direct-current power for causing the LEDs 22 to emit light.
  • the terminals 26a and 26b are soldered onto the lead wires 53a and 53b, respectively.
  • the terminals 26a and 26b are formed in a predetermined shape on the first main surface of the board 21 so as to surround the insertion holes 27a and 27b, respectively.
  • the terminals 26a and 26b are integrally formed with the metal lines 24, and electrically connected to the metal lines 24. It should be noted that the terminals 26a and 26b are formed by patterning simultaneously with the metal lines 24, using the same metal material as the metal lines 24.
  • terminals 26a and 26b serve as power supply portions for the LED module 20, and supply, via the metal lines 24 and the wires 25, the LEDs 22 with direct-current power received from the lead wires 53a and 53b.
  • the pedestal 45 according to the present embodiment has the support 30 and the mounting 40, as described above.
  • the pedestal 45 includes a heat dissipation portion 46 as a distinguishing structure.
  • the heat dissipation portion 46 is between the drive circuit 50 and an area 44 for disposing the support 30 on a main surface 40a of the mounting 40 which is on a side where the LED module 20 is provided.
  • the pedestal 45 includes a protrusion 47 as the heat dissipation portion 46, as shown in FIG. 3 .
  • the support 30 is a long component extending from a portion near the opening 11 of the globe 10 toward the inside of the globe 10.
  • the axis of the support 30 extends along the lamp-axis J. In other words, the axis of the support 30 and the lamp-axis J are parallel.
  • the support 30 functions as a support component which holds the LED module 20, and the LED module 20 is connected to an end of the support 30.
  • the LED module 20 is fixed at a predetermined position inside the globe 10 by the support 30.
  • attaching the LED module 20 to the support 30 extending toward the inside of the globe 10 achieves wide light distribution characteristics similar to that of an incandescent light bulb.
  • the mounting 40 is connected to the other end of the support 30.
  • the support 30 also functions as a heat dissipation component (heat sink) for dissipating heat generated by the LED module 20 (the LEDs 22).
  • the support 30 is preferably formed using a metal material mainly containing aluminum (Al), copper (Cu), iron (Fe) or the like, or a resin material having high thermal conductivity.
  • the support 30 preferably has higher thermal conductivity than the board 21.
  • the material of the support 30 is aluminum.
  • An end of the support 30 on the top side of the globe 10 is connected to the central portion of the board 21 of the LED module 20, whereas the other end of the support 30 on the base 90 side is connected to the central portion of the mounting 40.
  • the support 30 is fixed to the mounting 40, passing through a through-hole 43 in the mounting 40.
  • the board 21 of the LED module 20 and an end surface of the support 30 are firmly attached using an adhesive such as a silicone resin, for example. Consequently, an adhesive may be present between the board 21 and the end surface of the support 30.
  • the thickness of the silicone resin is preferably is 20 micrometers or less, in consideration of the thermal conductivity of the board 21 and the support 30.
  • the board 21 and the support 30 may be fixed using, for example, a screw, rather than an adhesive.
  • the surfaces of the board 21 and the support 30 may have minute unevenness, depending on a material or a processing technique, and thus a minute space may be present between the second main surface of the board 2 and the end surface of the support 30. Even if there is such a minute space, the board 21 and the support 30 can be considered to be substantially in contact if the space has a size of about 20 micrometers at most.
  • a solid-structured cylindrical shape which has a constant cross-sectional area (an area in a cross section obtained when the support 30 is cut through along a plane normal to the axis thereof).
  • the support 30 does not need to have a shape whose cross-sectional area is constant, and may have a shape whose cross-sectional area changes at one or more points, such as a shape obtained by combining a column and a square pillar.
  • the mounting 40 is a support pad for holding the support 30. As shown in FIG. 3 , the mounting 40 is formed so as to close the opening 11 of the globe 10.
  • the mounting 40 is connected to the heat sink 70.
  • the mounting 40 is fitted in an opening 70a of the heat sink 70 such that the outer circumference of the mounting 40 is in contact with the inner surface of the heat sink 70.
  • the mounting 40 also functions as a heat dissipation component (heat sink) for dissipating heat generated by the LED module 20 (the LEDs 22).
  • the mounting 40 is preferably formed using a metal material which mainly contains aluminum (Al), copper (Cu), or iron (Fe), or a resin material having high thermal conductivity. This allows heat to be efficiently conducted from the support 30 to the heat sink 70.
  • the material of the mounting 40 is aluminum.
  • the mounting 40 is a disc-shaped component having a step portion, and includes a small diameter portion 41 having a smaller diameter and a large diameter portion 42 having a larger diameter.
  • the small diameter portion 41 and the large diameter portion 42 form the step portion.
  • the small diameter portion 41 has a thickness of about 3 mm and a diameter of about 18 mm
  • the large diameter portion 42 has a thickness of about 3 mm and a diameter of about 42 mm.
  • the step portion has a height of about 4 mm, for example.
  • the small diameter portion 41 has the through-hole 43 for fixing the support 30 in a state where the end portion thereof is passing through the through-hole 43.
  • a circular area formed by the edge of the through-hole 43 on the main surface 40a side corresponds to the area 44 for disposing the support 30.
  • a description will be given below of a process of connecting the support 30 and the mounting 40, using FIG. 5 .
  • the small diameter portion 41 has two insertion holes for inserting the lead wires 53a and 53b.
  • the large diameter portion 42 forms connection with the heat sink 70, and is fitted in the heat sink 70.
  • the mounting 40 is fitted in the opening 70a of the heat sink 70 such that the outer circumferential surface of the large diameter portion 42 is in contact with the inner circumference surface of the heat sink 70. This allows heat to be efficiently conducted from the mounting 40 to the heat sink 70.
  • the top surface of the large diameter portion 42 is in contact with the opening 11 of the globe 10 so as to close the opening 11 of the globe 10. It should be noted that the mounting 40 and the heat sink 70 may be fixed using an adhesive such as a silicone resin, rather than by caulking.
  • the drive circuit (circuit unit) 50 is a light circuit (power supply circuit) for causing the LED module 20 (the LEDs 22) to emit light (be turned on), and supplies predetermined power to the LED module 20.
  • the drive circuit 50 converts alternating current power supplied from the base 90 via the pair of lead wires 53c and 53d into direct current power, and supplies the direct current power to the LED module 20 via the pair of lead wires 53a and 53b.
  • the drive circuit 50 includes a circuit board 51 and plural circuit elements (electronic components) 52 mounted on the circuit board 51.
  • the circuit board 51 is a printed circuit board on which metal lines are formed by patterning, and electrically connects the plural circuit elements 52 mounted on the circuit board 51.
  • the circuit board 51 is disposed in an orientation in which the main surface thereof crosses the lamp-axis J at right angles.
  • Examples of the circuit elements 52 include a capacitative element such as an electrolytic condenser or a ceramic condenser, a resistance element, a rectifier circuit element, a coil element, a choke coil (choke transformer), a noise fitter, a semiconductor element such as a diode or an integrated circuit element, and the like. Most of the circuit elements 52 are mounted on the main surface of the circuit board 51 on the base 90 side.
  • the drive circuit 50 formed in this way is housed in the circuit case 60.
  • the circuit board 51 is placed on projections (board holding portions) on the inner surface of a case body portion 61, and the main surface of the circuit board 51 is in contact with projections on a cap part 62. In this manner, the circuit board 51 is held in the circuit case 60.
  • a light control circuit, a booster circuit, and the like may be suitably selected and combined as the drive circuit 50.
  • the drive circuit 50 and the LED module 20 are electrically connected by the pair of lead wires 53a and 53b. Furthermore, the drive circuit 50 and the base 90 are electrically connected by the pair of lead wires 53c and 53d.
  • the four lead wires 53a to 53d are, for example, alloy copper lead wires, and each include a core wire made of alloy copper and an insulating resin coating which covers the core wire.
  • the lead wire 53a is a conducting wire (plus output terminal wire) for supplying a positive voltage from the drive circuit 50 to the LED module 20
  • the lead wire 53b (minus output terminal wire) is a conducting wire for supplying a negative voltage from the drive circuit 50 to the LED module 20.
  • the lead wires 53a and 53b pass through the insertion holes in the mounting 40, and are pulled out on the LED module 20 side (inside the globe 10).
  • the ends (core wires) of the lead wires 53a and 53b pass through the insertion holes 27a and 27b in the board 21 of the LED module 20, respectively and soldered onto the terminals 26a and 26b, respectively.
  • the other ends (core wires) of the lead wires 53a and 53b are soldered onto the metal lines of the circuit board 51.
  • the lead wires 53c and 53d are electric wires for supplying power for turning on the LED module 20, from the base 90 to the drive circuit 50.
  • the lead wires 53c and 53d each have an end (core wire) electrically connected to the base 90 (a shell part 91 or an eyelet part 93), and another end (core wire) electrically connected to a power-input portion (metal line) of the circuit board 51 by soldering, for instance.
  • the circuit case 60 is an insulating case for housing the drive circuit 50, and formed so as to surround the drive circuit 50.
  • the circuit case 60 is housed in the heat sink 70 and the base 90.
  • the circuit case 60 includes the case body portion 61 and the cap part 62.
  • the case body portion 61 is an insulating case (housing) having openings on both sides. Projections (board holding portions) are provided for placing the circuit board 51, at two or more positions (for example, three positions) on the inner surface of the case body portion 61.
  • An example of the material of the case body portion 61 is insulating resin material such as poly butylene terephthalate (PBT), or the like.
  • the case body portion 61 includes a first case portion 61a having a large-diameter cylindrical shape that is substantially the same as the shape of the heat sink 70, and a second case portion 61b connected to the first case portion 61a, and having a small-diameter cylindrical shape that is substantially the same as the shape of the base 90.
  • the first case portion 61a positioned on the globe 10 side is housed in the heat sink 70. Most of the drive circuit 50 is covered with the first case portion 61a.
  • the second case portion 61b positioned on the base 90 side is housed in the base 90, and the base 90 is fitted onto the second case portion 61b. This closes the opening of the circuit case 60 (the case body portion 61) on the base 90 side.
  • a screwing portion for screwing into the base 90 is formed on the outer circumferential surface of the second case portion 61b, and the base 90 is fixed onto the circuit case 60 (the case body portion 61) by screwing onto the second case portion 61b.
  • the cap part 62 is an example of an insulating component between the heat dissipation portion 46 and the drive circuit 50.
  • the cap part 62 is a cap-shaped substantially cylindrical component having a closed end and insulating properties.
  • An example of the material of the cap part 62 is also an insulating resin material such as PBT, as with the case body portion 61.
  • the cap part 62 has a heat receiving portion 64a having a shape conforming to the shape of the heat dissipation portion 46 included in the pedestal 45.
  • the heat receiving portion 64a is in contact with the heat dissipation portion 46, which allows the heat from the heat dissipation portion 46 to be efficiently led to the circuit case 60.
  • a detailed description of the heat receiving portion 64a is given below using FIG. 6 , for instance.
  • circuit case 60 includes the cap part 62
  • circuit case 60 may include only the case body portion 61, without including the cap part 62.
  • the heat sink 70 is a heat dissipation component, and is connected to the mounting 40. This allows heat generated by the LED module 20 to be conducted to the heat sink 70 via the support 30 and the mounting 40. Consequently, heat generated by the LED module 20 can be dissipated.
  • the heat sink 70 is formed so as to surround the drive circuit 50.
  • the drive circuit 50 is disposed inside the heat sink 70.
  • the drive circuit 50 is surrounded by the circuit case 60, and thus the heat sink 70 is formed so as to surround the circuit case 60. This allows the heat sink 70 to also dissipate heat generated by the drive circuit 50.
  • the heat sink 70 extends even up to the boundary portion between the first case portion 61a and the second case portion 61b of the circuit case 60.
  • the heat sink 70 is preferably formed using a material having high thermal conductivity, and can be formed using a metal component, for example.
  • the heat sink 70 according to the present embodiment is molded using aluminum. It should be noted that the heat sink 70 may be formed using non-metal material such as resin, rather than metal. In this case, it is preferable to use a nonmetal material having high thermal conductivity for the heat sink 70.
  • the heat sink 70 is formed so as to be fitted onto the mounting 40, and the inner circumferential surface of the heat sink 70 and the outer circumferential surface of the mounting 40 are in contact with each other in the entire circumferential direction.
  • the outer case 80 is formed so as to circumferentially surround the heat sink 70.
  • the external surface of the outer case 80 is exposed outside the lamp (in the air).
  • the outer case 80 is an insulating cover having insulating properties, formed using insulating material.
  • the insulating properties of the light bulb-shaped lamp 1 can be improved by covering the metal heat sink 70 with the insulating outer case 80.
  • An example of the material of the outer case 80 is an insulating resin material such as PBT.
  • the outer case 80 is a substantially cylindrical component having a constant thickness and gradually changing inside and outside diameters, and can be formed in a flared shape such that the inner and external surfaces are truncated cone shaped, for example.
  • the outer case 80 is formed such that the inside diameter and the outside diameter gradually decrease toward the base 90.
  • the base 90 is a receiving part which receives power for causing the LED module 20 (the LEDs 22) to emit light, from outside the lamp.
  • the base 90 is attached to a socket of an illuminator, for example. In this manner, the base 90 can receive power from a socket of the illuminator when the light bulb-shaped lamp 1 turns on.
  • Alternating current power is supplied to the base 90 from the AC 100 V commercial power source, for example.
  • the base 90 according to the present embodiment receives alternating current power at two contacts, and the power received by the base 90 is input to the power-input portion of the drive circuit 50 via the pair of lead wires 53c and 53b.
  • the base 90 is a metal cylinder having a closed end, and includes the shell part 91 having an outer circumferential surface forming a male screw and the eyelet part 93 attached to the shell part 91 via an insulating part 92.
  • the external circumferential surface of the base 90 has a screwing portion for screwing into the socket of the illuminator.
  • the inner circumferential surface of the base 90 has a screwing portion for screwing onto the screwing portion of the case body portion 61 of the circuit case 60 (the second case portion 61b).
  • the type of the base 90 is not particularly limited, an Edison (E) screw base is used in the present embodiment.
  • Examples of the base 90 include E26, E17, and E16 bases, for instance.
  • the following describes a distinguishing structure of the light bulb-shaped lamp 1 according to the present embodiment, and different variations, using FIGS. 5 to 13 .
  • FIG. 5 shows an example of a way of connecting the support 30 and the mounting 40 according to the embodiment.
  • the end portion of the support 30 is caulked so that the support 30 and the mounting 40 are connected.
  • the end portion of the support 30 that is sticking out of the through-hole 43 on the back surface 40b side of the mounting 40 forms the protrusion 47 serving as the heat dissipation portion 46.
  • the protrusion 47 is between the drive circuit 50 and the area 44 for disposing the support 30 (see FIG. 3 ).
  • the pedestal 45 includes the heat dissipation portion 46.
  • the heat dissipation portion 46 is between the drive circuit 50 and the area 44 for disposing the support 30, and has a surface which forms an angle with the back surface 40b of the mounting 40 on the drive circuit 50 side.
  • the pedestal 45 includes the heat dissipation portion 46, whereby the surface area of the pedestal 45 can be increased compared to the case where the heat dissipation portion 46 is not included in the pedestal 45.
  • An increase in the surface area does not lead to an increase in the size of the pedestal 45.
  • An increase in the surface area of the pedestal 45 in the above manner achieves improvement in heat dissipation efficiency of the pedestal 45 that is in contact with the LED module 20.
  • the cap part 62 of the circuit case 60 disposed between the heat dissipation portion 46 and the drive circuit 50 includes the heat receiving portion 64a having a shape according to the shape of the heat dissipation portion 46 (the protrusion 47), as described above.
  • FIG. 6 is an external perspective view of the cap part 62 according to the embodiment.
  • the cap part 62 has insertion holes 65a and 65b into which the lead wires 53a and 53b extending from the circuit board 51 are inserted, respectively.
  • the cap part 62 further includes the heat receiving portion 64a having a recessed shape for forming enough space where the protrusion 47 can be inserted.
  • the efficiency of thermal conduction from the pedestal 45 to the cap part 62 improves.
  • the efficiency of heat dissipation by the pedestal 45 further improves.
  • the end surface and the circumferential surface of the heat dissipation portion 46 do not need to be in contact with the heat receiving portion 64a. At least part of the heat dissipation portion 46 is in contact with the heat receiving portion 64a, thereby allowing heat to be efficiently conducted from the pedestal 45 to the cap part 62.
  • the light bulb-shaped lamp 1 includes the LED module 20 as a light source, and has light distribution characteristics similar to a conventional incandescent light bulb in which a filament coil is used.
  • the pedestal 45 which supports the LED module 20 includes the heat dissipation portion 46 (the protrusion 47) which has a surface that forms an angle with the back surface 40b of the mounting 40. This improves the efficiency of dissipating heat generated by the LED module 20.
  • the cap part 62 which is an insulating component disposed near the pedestal 45 includes the heat receiving portion 64a having a shape conforming to the shape of the heat dissipation portion 46 (the protrusion 47). This further improves the efficiency of dissipating heat generated by the LED module 20.
  • the structure of the light bulb-shaped lamp 1 according to the embodiment may be different from those shown in FIGS. 1 to 6 .
  • a description is given of different variations of the structure of the light bulb-shaped lamp 1, using FIGS. 7 to 13 .
  • FIG. 7 is a cross-sectional view of a simplified structure of the cap part 62 according to Variation 1 of the embodiment.
  • the shape of the protrusion 47 has a two-stepped cylindrical shape.
  • the cap part 62 may include a heat receiving portion 64b having a two-stepped recessed shape conforming to the two-stepped cylindrical shape of the protrusion 47.
  • FIG. 8 is a cross-sectional view of a simplified structure of a protrusion 47a according to Variation 2 of the embodiment.
  • the shape of the protrusion 47a has a flat cylindrical shape having no level difference, rather than a two-stepped cylindrical shape like the protrusion 47 according to the embodiment.
  • the end portion of the cylindrical support 30 having the outside diameter substantially the same as the inside diameter of the through-hole 43 is inserted into the through-hole 43 of the mounting 40, and the through-hole 43 and the support 30 are connected using an adhesive or by welding, thereby forming the protrusion 47a shown in FIG. 8 .
  • the heat dissipation portion 46 may be formed in various shapes. In any of the cases, the surface area of the pedestal 45 can be increased.
  • the pedestal 45 includes the protrusion 47a, whereby an area where the pedestal 45 and the cap part 62 which includes the heat receiving portion 64a having a recessed shape with no level difference can be increased.
  • FIG. 9 is a cross-sectional view of a simplified structure of a pedestal 45a according to Variation 3 of the embodiment.
  • the pedestal 45a shown in FIG. 9 has a structure in which the support 30 and the mounting 40 are integrally molded, unlike the pedestal 45 having a structure in which the support 30 and the mounting 40 are connected.
  • the pedestal 45a has a flat cylindrical protrusion 47b having no level difference and sticking out from the back surface 40b of the mounting 40, like the protrusion 47a according to Variation 2 described above. It should be noted that in the pedestal 45a, a circular area of the mounting 40 at the bottom of the support 30 corresponds to the area 44 for disposing the support 30.
  • the pedestal 45a having such a shape can be fabricated by cutting and bending a metal block such as an aluminum block, casting, or resin injection molding, for example.
  • the support 30 and the mounting 40 integrally molded more efficiently allow heat conduction to the mounting 40 from the support 30 in direct contact with the LED module 20. As a result, the efficiency of dissipating heat generated by the LED module 20 further improves.
  • FIG. 10 shows cross-sectional shapes of protrusions 47c and 47d according to Variation 4 of the embodiment.
  • the heat dissipation portion 46 may be achieved as the protrusion 47c having a convex shape sticking out from the back surface 40b of the mounting 40.
  • the heat dissipation portion 46 may be achieved as the protrusion 47d having plural fins on the back surface 40b of the mounting 40.
  • the cap part 62 includes a heat receiving portion having a shape conforming to the shape of the protrusion 47c or 47d, which achieves an increase in an area where the pedestal 45a and the cap part 62 are in contact.
  • the protrusions 47c and 47d are each included in the pedestal 45a having a structure in which the support 30 and the mounting 40 are integrally formed.
  • the protrusions 47c and 47d may be each included in the pedestal 45 having a structure in which the support 30 and the mounting 40 that are separate components are connected.
  • the surface area of the pedestal 45 (45a) can be increased, without increasing the overall size of the pedestal 45 (45a). As a result, the efficiency of dissipating heat by the pedestal 45 (45a) can be improved.
  • FIG. 11 is a cross-sectional view of a simplified structure of the heat dissipation portion 46 according to Variation 5 of the embodiment.
  • the heat dissipation portion 46 shown in FIG. 11 is achieved as a recess 48 depressed relative to the back surface 40b of the mounting 40.
  • the recess 48 is an example of the heat dissipation portion 46 between the drive circuit 50 and the area 44 for disposing the support 30, and having a surface which forms an angle with the back surface 40b of the mounting 40.
  • the surface area of the pedestal 45 can be increased, without increasing the overall size of the pedestal 45.
  • the cap part 62 includes a heat receiving portion 64c having a protruding shape, which achieves an increase in an area where the pedestal 45 and the cap part 62 are in contact, as shown in FIG. 11 .
  • the support 30 is fixed in a state where an end portion thereof is inserted in the through-hole 43, and the recess 48 is formed by the inner surface of the through-hole 43 and the end surface of the end portion of the support 30.
  • the recess 48 may be in the pedestal 45a having a structure in which the support 30 and the mounting 40 are integrally formed.
  • FIG. 12 shows cross-sectional shapes of recesses 48a and 48b according to Variation 6 of the embodiment.
  • the heat dissipation portion 46 may be achieved as the recess 48a having a concave shape depressed relative to the back surface 40b, for example.
  • heat dissipation portion 46 may be achieved as, for example, the recess 48b having plural slots in the back surface 40b of the mounting 40, as shown in (b) of FIG. 12 .
  • the cap part 62 includes a heat receiving portion having a shape conforming to the shape of the recess 48a or 48b, which achieves an increase in an area where the pedestal 45a and the cap part 62 are in contact.
  • the heat dissipation portion 46 is achieved as a recess, at least a portion of the heat dissipation portion 46 is in contact with the heat receiving portion, whereby heat is efficiently conducted from the pedestal 45 to the cap part 62.
  • the recesses 48a and 48b are each included in the pedestal 45a having a structure in which the support 30 and the mounting 40 are integrally formed.
  • the recesses 48a and 48b may be each included in the pedestal 45 having a structure in which the support 30 and the mounting 40 that are separate components are connected.
  • the surface area of the pedestal 45 (45a) can be increased, without increasing the overall size of the pedestal 45 (45a). As a result, the efficiency of dissipating heat by the pedestal 45 (45a) can be improved.
  • the end portion of the support 30 is caulked, thereby connecting the support 30 and the mounting 40 (see FIG. 5 ).
  • FIG. 13 shows a state in which the support 30 and the mounting 40 are connected according to Variation 7 of the embodiment.
  • the support 30 shown in FIG. 13 has a male screw portion 30a at an end, and the through-hole 43 of the mounting 40 has a female screw portion 43a according to the male screw portion 30a formed on the inner surface thereof.
  • the support 30 having such a structure screws into the through-hole 43 of the mounting 40, thereby being connected to the mounting 40, as shown in (a) and (b) of FIG. 13 .
  • connection between the support 30 and the mounting 40 can be strengthened by using an adhesive or by welding, for example.
  • a technique other than caulking processing may be employed if the technique at least allows the support 30 and the mounting 40 to be fixed in contact with each other.
  • the present invention can be achieved not only as the light bulb-shaped lamp 1 described above, but also as a lighting apparatus which includes the light bulb-shaped lamp 1.
  • the following describes a lighting apparatus according to an embodiment of the present invention, using FIG. 14 .
  • FIG. 14 is a simplified cross-sectional view of a lighting apparatus 2 according to an embodiment.
  • the lighting apparatus 2 is, for example, a device to be attached to an indoor ceiling and used.
  • the lighting apparatus 2 includes a light-up device 3 and the light bulb-shaped lamp 1 according to the embodiment described above.
  • the light-up device 3 is for turning on and off the light bulb-shaped lamp 1, and includes a device body 4 to be attached to a ceiling and a light-transmissive lamp cover 5 which covers the light bulb-shaped lamp 1.
  • the device body 4 has a socket 4a.
  • the base 90 of the light bulb-shaped lamp 1 screws into the socket 4a. Power is supplied to the light bulb-shaped lamp 1 via the socket 4a.
  • the cap part 62 is used as an example of an insulating component between the heat dissipation portion 46 and the drive circuit 50.
  • the insulating component may be achieved using a component other than the cap part 62.
  • an insulating component between the heat dissipation portion 46 and the drive circuit 50 may be achieved by using a resin layer obtained by applying a resin onto the back surface 40b of the mounting 40.
  • the present invention is not limit to this.
  • a packaged LED element surface mount (SMD) LED element
  • SMD surface mount
  • the light bulb-shaped lamp 1 may include the SMD LED module 20 which includes plural such LED elements on the board 21 where the metal lines are formed.
  • the back surfaces of two white substrates each having a surface on which the LEDs 22 and the sealing components 23 are formed may be attached to each other, thereby forming one LED module 20.
  • the LED module 20 emits white light by using a blue LED chip and a yellow fluorescent substance in the above embodiment, the present invention is not limited to this.
  • a red fluorescent material and a green fluorescent material may be further mixed, in addition to a yellow fluorescent material.
  • a fluorescent material containing resin which contains a red fluorescent material and a green fluorescent material may be used and combined with a blue LED chip, thereby achieving a structure for emitting white light.
  • an LED chip which emits light having a color other than blue may be used as the above-descried LED chip.
  • a combination of color fluorescent particles which emit light of three primary colors (red, green, and blue) may be used as fluorescent particles.
  • a wavelength conversion material other than fluorescent particles may be used, and for example, as a wavelength conversion material, a material including a substance which absorbs light having a certain wavelength and emits light having a wavelength different from the absorbed light may be used, such as a semiconductor, a metal complex, an organic dye, or a pigment.
  • an LED is used in the above embodiment as an example of a light-emitting element
  • a semiconductor light-emitting element such as a semiconductor laser
  • a solid light-emitting element such as an organic or inorganic electroluminescence (EL) element may be used.
  • EL electroluminescence

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
EP14152292.0A 2013-01-29 2014-01-23 Source de lumière d'éclairage et appareil d'éclairage Not-in-force EP2759759B1 (fr)

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JP2013014560A JP2014146510A (ja) 2013-01-29 2013-01-29 照明用光源および照明装置

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JP2006313717A (ja) 2005-04-08 2006-11-16 Toshiba Lighting & Technology Corp 電球型ランプ
US20100207502A1 (en) * 2009-02-17 2010-08-19 Densen Cao LED Light Bulbs for Space Lighting
US20100264799A1 (en) * 2009-04-20 2010-10-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp
US20120013237A1 (en) * 2010-07-14 2012-01-19 Wen-Jen Lee Heat-dissipating structure of led bulb
WO2012132736A1 (fr) * 2011-03-25 2012-10-04 シャープ株式会社 Dispositif d'éclairage et dispositif de source de lumière
US20120306366A1 (en) * 2011-05-31 2012-12-06 Toshiba Lighting & Technology Corporation Bulb-type lamp and luminaire using bulb-type lamp

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JP5557105B2 (ja) * 2010-09-10 2014-07-23 東芝ライテック株式会社 口金付ランプおよび照明器具
CN103282718A (zh) * 2010-12-24 2013-09-04 松下电器产业株式会社 灯泡形灯及照明装置
WO2012098600A1 (fr) * 2011-01-18 2012-07-26 パナソニック株式会社 Lampe du type ampoule et dispositif d'éclairage
WO2012153442A1 (fr) * 2011-05-12 2012-11-15 パナソニック株式会社 Source de lumière d'éclairage
JP2012248687A (ja) * 2011-05-27 2012-12-13 Toshiba Lighting & Technology Corp 発光モジュール及び照明装置
EP2735786A4 (fr) * 2011-07-22 2015-03-11 Panasonic Corp Lampe
JP5066304B1 (ja) * 2011-07-22 2012-11-07 パナソニック株式会社 ランプ

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Publication number Priority date Publication date Assignee Title
EP1503139A2 (fr) * 2003-07-28 2005-02-02 Osram Sylvania Inc. Dispositif d'éclairage à DEL
JP2006313717A (ja) 2005-04-08 2006-11-16 Toshiba Lighting & Technology Corp 電球型ランプ
US20100207502A1 (en) * 2009-02-17 2010-08-19 Densen Cao LED Light Bulbs for Space Lighting
US20100264799A1 (en) * 2009-04-20 2010-10-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp
US20120013237A1 (en) * 2010-07-14 2012-01-19 Wen-Jen Lee Heat-dissipating structure of led bulb
WO2012132736A1 (fr) * 2011-03-25 2012-10-04 シャープ株式会社 Dispositif d'éclairage et dispositif de source de lumière
EP2690345A1 (fr) * 2011-03-25 2014-01-29 Sharp Kabushiki Kaisha Dispositif d'éclairage et dispositif de source de lumière
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CN203703839U (zh) 2014-07-09
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