EP2664685B1 - Cu-co-si-zr-legierungsmaterial und herstellungsverfahren dafür - Google Patents

Cu-co-si-zr-legierungsmaterial und herstellungsverfahren dafür Download PDF

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EP2664685B1
EP2664685B1 EP12734565.0A EP12734565A EP2664685B1 EP 2664685 B1 EP2664685 B1 EP 2664685B1 EP 12734565 A EP12734565 A EP 12734565A EP 2664685 B1 EP2664685 B1 EP 2664685B1
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phase particles
solution treatment
less
treatment
temperature
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EP2664685A4 (de
EP2664685A1 (de
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Yasuhiro Okafuji
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables

Definitions

  • the present invention relates to materials for electronic and electrical equipments having excellent bending workability and being able to show high electrical conductivity, in particular, Cu-Co-Si-Zr copper alloy materials suitable for materials for electronic and electrical equipments such as movable connectors.
  • Materials for electronic and electrical equipments require properties such as electrical conductivity, strength, and bending workability, and a demand for materials that allow high current is increasing in recent years for electric and electronic parts, particularly for movable connectors.
  • movable connectors such as floating type connectors becoming larger
  • Cu-Ni-Si, Cu-Co-Si, Cu-Co-Si-Zr, or Cu-Ni-Co-Si copper alloys are known as precipitation strengthened copper alloys having properties that allow for achieving high strength without deteriorating electrical conductivity.
  • supplemented element(s) are solutionized by solution treatment, followed by cold rolling and aging treatment to precipitate or crystallize Ni 2 Si and Co 2 Si etc. as second phase particles in the matrix.
  • Ni 2 Si is relatively large, it is difficult to achieve an electrical conductivity of 60% IACS or more with a Cu-Ni-Si copper alloy.
  • Cu-Co-Si, Cu-Co-Si-Zr or Cu-Ni-Co-Si alloys containing Co 2 Si with low amount of solubility as the main precipitate and showing high electrical conductivity are being researched.
  • the target strength cannot be achieved with these copper alloys unless they are sufficiently solutionized first and then precipitated to form fine precipitates.
  • solution treatment at a high temperature will cause coarsening of crystal grains resulting in problems such as deteriorated bending workability, various countermeasures have been investigated.
  • Patent Document 1 discloses a precipitation strengthened copper alloy for materials for electric and electronic parts such as a lead frame.
  • Patent Document 2 discloses a precipitation strengthened copper alloy for materials for electric and electronic parts such as a lead frame.
  • second phase particles precipitate during the cooling process in hot working or the temperature elevation process in solution heat treatment, as well as during the aging treatment after grinding ([0025] in Patent Document 1 etc.)
  • Patent Document 3 discloses Cu-Co-Si(-Zr) alloys with certain compositions in which two types of precipitant with different sizes and compositions exist, leading to the suppression of crystal grain growth and the increase in their strength.
  • JP2010059543 discloses a copper alloy material in which the value of the crystal grain diameter of a Cu-Co-Si-based copper alloy is controlled to a prescribed range for satisfying all of high conductivity, high strength and good bending workability.
  • specific target values for preventing the above movable connectors from becoming larger are an electrical conductivity of 60% IACS or more, and a 0.2% yield strength YS of 600 MPa or more, or a tensile strength TS of 630 MPa or more, as well as the threshold of ratio between the bending radius R and the thickness of material t (MBR/t) without generation of cracks, which is considered an indicator of bending workability, is 0.5 or less (0.3 mm thickness of sheet, Bad Way). This bending workability varies depending on the grain size and the size and number etc.
  • Second phase particles and the grain size to obtain an MBR/t of 0.5 or less at 0.3 mm plate thickness is thought to be generally 10 ⁇ m or less for Cu-Co-Si or Cu-Ni-Co-Si alloys. Crystal grains grow by solution treatment, and thus the grain size is determined by the temperature and time of solution treatment, supplemented element(s), and the size or number of second phase particles.
  • Patent Documents 1 and 2 however, Co is not essential and a wide range of second phase particles is targeted.
  • grain size can be controlled but electrical conductivity becomes poor, and high current availability cannot be achieved.
  • Patent Document 2 focuses on second phase particles with diameters of from 50 to 1000 nm as possessing the effect of suppressing the growth of recrystallized grains in solution treatment, but Co second phase particles of this size may sometimes be solutionized and disappear during solution treatment. For this reason, since the temperature and time of solution treatment need to be adjusted so that the precipitates are not solved, only Cu-Co-Si-Zr alloys which are poor in either electrical conductivity or bendability were obtained.
  • the second phase particles precipitate in this size range may possibly precipitate after solution treatment, and thus it does not show direct controlling effect on grain size.
  • density or diameter and volume density of second phase particles on the crystal grain boundary are evaluated by transmission electron microscope (TEM) observation in the above document, when the second phase was precipitated until grain size could be controlled to 10 ⁇ m or less, there was a possibility that accurate values could not be determined due to overlapping of particles and the like.
  • Patent Document 3 focuses on Co second phase particles for the purpose of suppressing crystal grain growth, their grain sizes are 0.005 to 0.05 ⁇ m and 0.05 to 0.5 ⁇ m in their diameters.
  • the Cu-Co-Si-Zr alloys in this document are inferior to in their bending workability.
  • the solution treatment temperature is adjusted, the hot heating temperature before solution treatment is also adjusted to be suitable for the solution treatment temperature, and the cooling rate after hot heating is also adjusted to allow precipitation of a particular amount of second phase particles having a particular grain size in order to prevent coarsening of crystal grains in the manufacturing of a Cu-Co-Si-Zr alloy material having a particular composition.
  • Grain size of 10 ⁇ m or less can be obtained by adjusting the above second phase particles, and therefore bending workability, electrical conductivity that allows high current as well as practicable strength, suitable for movable connectors can be achieved.
  • Figure 1 is a reference drawing describing a diameter of a second phase particle.
  • the alloy material of the present invention contains 1.0 to 2.5 wt% (hereinafter shown as % unless otherwise indicated), preferably 1.5 to 2.2% of Co, and 0.2 to 0.7%, preferably 0.3 to 0.55% of Si.
  • the remainder other than Zr consists of Cu and unavoidable impurities.
  • second phase particles are Co 2 Si
  • the stoichiometric ratio of Co/Si contained is theoretically 4.2, but is 3.5 to 5.0, preferably 3.8 to 4.6 in the present invention. If the ratio is within these ranges, second phase particles Co 2 Si and Co-Si-Zr compound suitable for precipitation strengthening and adjustment of grain size is formed. If Co and/or Si are too low, precipitation strengthening effect will be reduced, and if it is too high, it will not be solutionized and electrical conductivity will also be poor. When second phase particles Co 2 Si precipitate, precipitation strengthening effect appears, and the purity of the matrix will increase after precipitation, thus improving electrical conductivity. Further, if a particular amount of second phase particles having a particular size is present, the growth of crystal grains is prevented and the grain size can be made to be 10 ⁇ m or less.
  • An alloy material according to the present invention may contain 0.001 to 0.5 wt% of Zr, preferably 0.01 to 0.4 wt% of Zr, which improves strength and conductivity. These effects are beyond predictions in view of Cu-Co-Si alloy. If the amount of Zr is less than 0.001 wt%, it cannot achieve a desired improvement of strength and conductivity. If the amount of Zr is more than 0.5 wt%, it generates coarse silicides, which deteriorate strength and bending workability.
  • the grain size of the alloy material of the present invention is 10 ⁇ m or less. Ten micrometers or less allows achievement of good bending workability.
  • the copper alloy material of the present invention may have various shapes, such as for example plates, strips, wires, rods, and foils, and without particular limitation, may be plates or strips for movable connectors.
  • the second phase particles of the present invention refer to particles that generate when other elements are contained in copper to form a phase different from the copper mother phase (matrix).
  • the number of second phase particles having diameters of 50 nm or more is obtained, after mirror finishing by mechanical polishing followed by electrolytic polishing or acid etching, by counting the number of particles having diameters in the corresponding range on a field of a scanning electron microscope photograph obtained by arbitrary five points selection in a cross-section of a copper alloy sheet parallel to rolling direction.
  • the diameter as used herein refers to the average of L1 and L2 as shown in Figure 1 obtained by measuring the minor axis (L1) and the major axis (L2) of the particle.
  • the second phase particles of the present invention are Co 2 Si and Co-Si-Zr compound. Elements that constitute second phase particles can be confirmed for example by using EDX (Energy-Dispersive X-Ray) accompanying FE-SEM (FEI Company Japan, Model XL30SFEG).
  • EDX Energy-Dispersive X-Ray
  • FE-SEM FEI Company Japan, Model XL30SFEG
  • the copper alloy material of the present invention contains 3,000 to 500,000/mm 2 , preferably 10,000 to 200,000/mm 2 , and further preferably 13,000 to 100,000/mm 2 second phase particles having diameters of from 0.20 ⁇ m or more to less than 1.00 ⁇ m.
  • the particles may precipitate mainly after hot rolling and before solution treatment, but may also precipitate by solution treatment.
  • the second phase particles that precipitated before solution treatment suppress the growth of grain size in solution treatment, but there is also risk of solid solution thereof. Accordingly, it is preferred to adjust the solution treatment conditions to reduce variation in number as much as possible.
  • the material preferably comprises 10 to 2,000/mm 2 , further preferably 20 to 1,000/mm 2 , and most preferably 30 to 500/mm 2 second phase particles having diameters of from 1.00 ⁇ m or more to 10.00 ⁇ m or less.
  • the cooling rate after hot rolling (hot heating) may be slowed down for precipitation, and first aging treatment can be applied if necessary in order to adjust grain size for the second phase particles.
  • the above preferred range for diameter of the second phase particles is also linked with the number of second phase particles of from 0.20 ⁇ m or more to less than 1.00 ⁇ m.
  • High temperature solution treatment is possible under the conditions of the above range and the growth of grain size in solution treatment is suppressed, while the sufficiently solutionized Co, Si and Zr are finely precipitated by a later (second) aging treatment, resulting in high strength, high electrical conductivity, and good bending workability to be achieved.
  • the number of second phase particles greater than 2,000/mm 2 is not preferred because bendability will be reduced.
  • the number of second phase particles having the above diameters of from 0.20 ⁇ m or more to less than 1.00 ⁇ m and 1.00 ⁇ m or more to 10.00 ⁇ m or less can be evaluated using a test strip obtained before final rolling or after final working, since the number does not vary considerably before and after solution treatment as well as after second aging treatment.
  • the number of contained particles having diameters greater than 10.00 ⁇ m is preferably 1/mm 2 or less, further preferably only 0.01/mm 2 or less.
  • the second phase particles of from 0.05 ⁇ m or more to less than 0.20 ⁇ m precipitate during hot rolling, the subsequent cooling, and first aging treatment, they are mostly solutionized in solution treatment, and are precipitated by the subsequent cooling and (the second) aging treatment.
  • the second phase particles having diameters of less than 0.05 ⁇ m are solutionized in solution treatment, and a large amount thereof is precipitated by (the second) aging treatment. Accordingly, these second phase particles do not show the effect of adjusting grain size, but contribute to improvement in strength.
  • the electrical conductivity EC of the alloy material of the present invention is 60% IACS or more, preferably 65% IACS or more. Parts that allow high current can be manufactured when EC is within this range.
  • Good bending workability as used in the present invention refers to a minimum bending radius MBR/t of 0.5 or less (Bad Way) at 0.3 mm sheet thickness. If MBR/t is 0.5 or less for at 0.3 mm sheet thickness, properties demanded for manufacture and use of electronic parts, in particular movable connectors are fulfilled. Further, better bending workability is obtained when the alloy material of the present invention is made to be thinner than 0.3 mm thickness.
  • the 0.2% yield strength YS of the alloy material of the present invention is 600 MPa or more, preferably 650 MPa or more, and the tensile strength TS is preferably 630 MPa or more, further preferably 660 MPa or more. Values within the above range are sufficient especially for electronic parts material such as a plate material for movable connectors.
  • the manufacturing process steps of the alloy material of the present invention are the same or similar to those for an ordinary precipitation strengthened copper alloy, i.e., melt casting -> (homogenizing heat treatment) -> hot rolling -> cooling -> (first aging treatment) -> grinding -> cold rolling -> solution treatment -> cooling -> (cold rolling) -> second aging treatment -> final cold rolling -> (stress relief annealing). Steps in parentheses can be omitted, and final cold rolling may be performed before aging heat treatment.
  • homogenizing heat treatment may be the heating in hot rolling (in the present specification, heating performed during homogenizing heat treatment and hot rolling is collectively referred to as "hot heating").
  • the hot heating temperature may be any temperature at which the supplemented elements mostly solutionize, specifically, it may be a temperature that is 40°C or more, preferably 45°C or more higher than the solution treatment temperature selected below.
  • the upper limit of the hot rolling (hot heating) temperature is individually regulated depending on the metal composition and facility, and is ordinarily 1000°C or less.
  • the heating time will depend on plate thickness, and is preferably 30 to 500 minutes, further preferably 60 to 240 minutes. It is preferred that most of the supplemented elements such as Co or Si solve during hot heating.
  • the cooling rate after hot rolling is 100°C/min or less, preferably 5 to 50°C/min. With this cooling rate, second phase particles ultimately having diameters of from 0.20 ⁇ m or more to less than 10.00 ⁇ m will precipitate in the target range. However, only fine second phase particles were conventionally precipitated, since quenching by a water-cooling shower etc. with the aim of suppressing the coarsening of second phase particles.
  • Materials are ground after cooling, and an arbitrary first aging treatment is preferably further performed to allow adjusting of the target size and number of second phase particles.
  • the conditions for this first aging treatment are preferably at 600 to 800°C for 30s to 30h.
  • the temperature of solution treatment performed after the above arbitrary first aging treatment is selected from the range of from (50 x Co wt% + 775)°C or more to (50 x Co wt% + 825)°C or less.
  • the preferred treatment time is 30 to 500s, further preferably 60 to 200s. Within this range, the adjusted second phase particles remain resided to prevent the enlargement of grain size, while finely precipitated Co, Si and Zr are sufficiently solutionized and precipitated as fine second phase particles by the later second aging treatment.
  • the preferred cooling rate after solution treatment is 10°C/s or higher.
  • a cooling rate slower than the above will cause precipitation of second phase particles during cooling, and the amount of solubility will decrease.
  • There is no particularly preferred upper limit for the cooling rate but e.g. approximately 100°C/s is possible for a generally employed facility.
  • the temperature of second aging treatment after solution treatment is preferably at 450°C to 650°C for 1 to 20 hours.
  • the diameters of the second phase particles remaining after solution treatment can be maintained within the range of the present invention, as well as the solutionized supplemented elements will precipitate as fine second phase particles and contribute to strength enhancement.
  • the final rolling reduction ratio is preferably 5 to 40%, further preferably 10 to 20%.
  • a ratio of less than 5% will result in insufficient increase in strength by work hardening, while greater than 40% will result in decrease in bending workability.
  • the second age treatment may be performed at 450°C to 600°C for 1 to 20 hours.
  • the stress release annealing temperature is preferably 250 to 600°C, and the annealing time preferably 10s to 1 hour. Within this range, there is no change in the size and number of second phase particles as well as in grain size.
  • the concentrations of supplemented elements in the copper alloy matrix were analyzed by ICP-mass spectrometry using samples after the grinding step.
  • a cross-section parallel to the rolling direction of the sample before final cold rolling was mirror finished by means of mechanical polishing, followed by electrolytic polishing or acid etching, and determined from five microscope photographs for each magnification using a scanning electron microscope.
  • Observation magnification is (a) 5 x 10 4- power for from 0.05 ⁇ m or more to less than 0.20 ⁇ m, (b) 1 x 10 4- power for from 0.20 ⁇ m or more to less than 1.00 ⁇ m, and (c) 1 x 10 3- power for from 1.00 ⁇ m or more to 10.00 ⁇ m or less (each of them is represented as "50-200nm","200-1000nm” and "1000-10000nm” respectively in Tables).
  • average grain size was measured according to JIS H0501 by section method.
  • MBR/t For the bending workability MBR/t, a 90° W bend test (JIS H3130, Bad Way) of short test strips (width 10 mm x length 30 mm x thickness 0.3 mm) taken in T.D. (Transverse Direction) so that the bending axis is perpendicular to the rolling direction was performed, and the minimum bending radius without generation of cracks (mm) was referred to as the MBR (Minimum Bend Radius) and the ratio thereof to the plate thickness t (mm), MBR/t was evaluated.
  • JIS H3130, Bad Way JIS H3130, Bad Way
  • sample JIS Z2201-13B size out in the direction parallel to the rolling was measured for three times according to JIS Z 2241, and the average was calculated.
  • Tables 1A, 1B, and 1C show the result from changes in an additive amount of Zr with the following factors set within the scope of the present invention: a concentration of Co and Si; Co/Si elemental ratio; the number of the second phase particles having diameters of from 0.20 ⁇ m or more to less than 1.00 ⁇ m; an electrical conductivity EC; and grain size.
  • Tables 1A and 1B show that comparing to Comparative Example 3 (without Zr), Examples 1 and 2 (with 0.01% of Zr and 0.3% of Zr respectively) showed the increased strength and electrical conductivity or the increased electrical conductivity. In addition, they showed that an electrical conductivity increased in proportion to an additive amount of Zr. However, Comparative Example 4 (with 1.0 % of Zr) showed the decreased strength and bending workability (Table 1C is described hereinafter).
  • Tables 2A, 2B and 2C show the result from changes in the compositions and the manufacturing conditions with an amount of Zr set to 0.1 % based on the above results (Table 2C is described hereinafter).
  • Examples 1 to 11 fulfilled the requirements of the present invention, they had excellent properties of an electrical conductivity, strength and bending workability in a thick sheet, which were suitable material for movable connectors allowing high current.
  • Supplementary Example 22 The conditions of Supplementary Example 22 were similar to that of Example 6 but differed in its process as follows: after solution treatment, the material was cooled at the cooling rate according to the table; before aging treatment, the material was finished to a final thickness of 0.3 mm by final cold rolling; the material was subjected to aging treatment at the temperature according to the table for 3 hours; the material was similarly subjected to stress relief annealing. Although the material of Supplementary Example 22 was slightly inferior to Example 6 in its strength, its bending workability was improved.
  • Comparative Example 12 due to high temperature for solution treatment, second phase particles having diameters of from 0.20 ⁇ m or more to less than 1.00 ⁇ m disappeared during the solution heat treatment, the effect of suppressing crystal grain growth could not be achieved. As a result, the material had a large grain size to be inferior in bending workability.
  • the material of Comparative Example 13 had low Co/Si ratio.
  • the material of Comparative Example 14 had high Co/Si ratio. Both of them could not benefit from fine second phase particles having the precipitation strengthened effect and thus had low strength. In addition, an electrical conductivity for both of them was inferior due to high solid solute concentration for Co or Si.
  • Comparative Example 16 cooling rate after hot working was fast.
  • the number of second phase particles having diameters of from 0.20 ⁇ m or more to less than 1.00 ⁇ m was small. Consequently, the material of Comparative Example 16 could not benefit from second phase particles having the effect of suppressing crystal grain growth and thus had bad bending workability.
  • cooling rate after hot working was fast.
  • the number of second phase particles having diameters of from 0.20 ⁇ m or more to less than 1.00 ⁇ m was small.
  • the first aging treatment was performed at high temperature resulting in precipitation of second phase particles having diameters of from 0.20 ⁇ m or more to less than 1.00 ⁇ m.
  • this heat treatment made the grain size large. Consequently, bending workability was bad.
  • Example 18 As for Comparative Example 18, the temperatures for hot heating and solution treatment were higher than those of Example 8. The effect of suppressing grain growth could not be achieved. Thus, the grain size was large and bending workability was bad. An electrical conductivity was also inferior to Example 8.
  • Example 19 the temperature for solution treatment was lower than that of Example 11. Thus, an amount of solid solute for additive elements during solution treatment was small. As a result, the strength was low.
  • Comparative Example 20 As for Comparative Example 20, a concentration of Co was high. The temperature for solution treatment was relatively high and the treatment time was long. Thus, the number of second phase particles having diameters of from 0.20 ⁇ m or more to less than 1.00 ⁇ m was large and workability was bad.
  • Second phase particles having a diameter of 0.05 ⁇ m or more will precipitate during hot rolling and in the cooling stage after the hot rolling where the cooling rate is adjusted.
  • first aging treatment after the hot rolling second phase particles having a diameter of 0.05 ⁇ m or more do not precipitate, while second phase particles having a diameter of less than 0.05 ⁇ m precipitate in large amounts.
  • the precipitated second phase particles having a diameter of less than 0.20 ⁇ m will disappear by solutionization in solution treatment where the temperature is adjusted.
  • the second phase particles having a diameter of from 0.05 ⁇ m or more to less than 0.2 ⁇ m will mainly precipitate in small amounts.
  • second phase particles having a diameter of less than 0.05 ⁇ m will precipitate in large amounts.
  • Tables 1C and 2C show the measurement results about how the second phase particles changed during the manufacturing process which had the following ranges of diameter:(a) from 50 nm or more to less than 200 nm; (b) from 200 nm or more to less than 1000 nm; and (c) from 1000 nm or more to 10000 nm or less.
  • any second phase particles having diameter of more than 10000 nm (10.00 ⁇ m) was not observed in all of the measurements. Since the number of second phase particles becomes smaller logarithmically as diameter becomes large, the indicated digits were changed.
  • a copper alloy according to the present invention may achieve practicable strength as well as bending workability suitable for movable connector and electrical conductivity allowing high current.

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Claims (4)

  1. Ein Cu Co Si Zr-Legierungsmaterial mit guter Biegeverarbeitbarkeit, wobei das Material umfasst: 1,0 bis 2,5 Gew.% Co; 0,2 bis 0,7 Gew.% Si; 0,001 bis 0,5 Gew.% Zr, wobei der Rest aus Cu und unvermeidbaren Verunreinigungen besteht, und wobei das elementare Verhältnis Co/Si 3,5 bis 5,0 ist, und wobei das Material 3.000 bis 500.000 Partikel der zweiten Phase pro mm2 enthält, die Durchmesser von 0,20 µm oder mehr bis weniger als 1,00 µm haben, und das eine elektrische Leitfähigkeit EC von 60 % IACS oder mehr hat, und eine Teilchengröße von 10 µm oder kleiner hat, wobei die 0,2 % Streckgrenze YS 600 MPa oder mehr ist.
  2. Das Kupferlegierungsmaterial gemäß Anspruch 1, enthaltend 10 bis 2.000 Partikel der zweiten Phase pro mm2, die Durchmesser von 1,00 µm oder mehr bis 10.00 µm oder weniger haben.
  3. Ein Verfahren zur Herstellung des Kupferlegierungsmaterials gemäß Anspruch 1 oder 2, wobei das Verfahren umfasst:
    einen Schritt Heißwalzen;
    einen Schritt Kühlen;
    einen Schritt einer Lösungsbehandlung; und
    einen Schritt einer Alterungsbehandlung
    wobei die Temperatur des Heißwalzens, ausgeführt nach dem Gießen und vor der Lösungsbehandlung, eine Temperatur ist, die 45° C oder höher ist als die Lösungsbehandlungstemperatur, die wie unten ausgewählt ist, wobei die Kühlungsrate von der Temperatur bei Beginn des Heißwalzens bis 600 °C 100 °C/min. oder kleiner ist, und wobei die Lösungsbehandlungstemperatur ausgewählt ist aus dem Bereich von (50 x Co Gew.% und + 775) °C oder mehr bis (50 x Co Gew.% + 825) °C oder weniger.
  4. Das Verfahren zur Herstellung des Kupferlegierungsmaterials gemäß Anspruch 2, wobei die Alterungsbehandlung nach der Lösungsbehandlung bei 450 bis 650 °C für 1 bis 20 Stunden durchgeführt wird.
EP12734565.0A 2011-01-13 2012-01-12 Cu-co-si-zr-legierungsmaterial und herstellungsverfahren dafür Active EP2664685B1 (de)

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JP2011005088A JP2012144789A (ja) 2011-01-13 2011-01-13 Ｃｕ−Ｃｏ−Ｓｉ−Ｚｒ合金材
PCT/JP2012/050508 WO2012096351A1 (ja) 2011-01-13 2012-01-12 Ｃｕ－Ｃｏ－Ｓｉ－Ｚｒ合金材及びその製造方法

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EP2664685A4 EP2664685A4 (de) 2014-04-09
EP2664685B1 true EP2664685B1 (de) 2015-10-07

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CN100439530C (zh) * 2004-12-24 2008-12-03 株式会社神户制钢所 具有弯曲性和应力弛豫性能的铜合金
JP4943095B2 (ja) * 2006-08-30 2012-05-30 三菱電機株式会社 銅合金及びその製造方法
JP5085908B2 (ja) * 2006-10-03 2012-11-28 Ｊｘ日鉱日石金属株式会社 電子材料用銅合金及びその製造方法
JP4357536B2 (ja) * 2007-02-16 2009-11-04 株式会社神戸製鋼所 強度と成形性に優れる電気電子部品用銅合金板
JP2008266787A (ja) * 2007-03-28 2008-11-06 Furukawa Electric Co Ltd:The 銅合金材およびその製造方法
CN101978081B (zh) * 2008-03-21 2014-09-10 古河电气工业株式会社 电气电子零件用铜合金材料
JP2009242814A (ja) 2008-03-28 2009-10-22 Furukawa Electric Co Ltd:The 銅合金材およびその製造方法
JP4697267B2 (ja) 2008-07-01 2011-06-08 ソニー株式会社 ハウリング検出装置およびハウリング検出方法
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JP4913902B2 (ja) * 2008-08-05 2012-04-11 古河電気工業株式会社 電気・電子部品用銅合金材料の製造方法
JP5619389B2 (ja) * 2008-08-05 2014-11-05 古河電気工業株式会社 銅合金材料

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US20130284323A1 (en) 2013-10-31
CN103298961B (zh) 2015-06-17
TW201233819A (en) 2012-08-16
EP2664685A1 (de) 2013-11-20
TWI432587B (zh) 2014-04-01
CN103298961A (zh) 2013-09-11
JP2012144789A (ja) 2012-08-02
WO2012096351A1 (ja) 2012-07-19
KR20130122654A (ko) 2013-11-07

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