Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
  • H01L33/50—Wavelength conversion elements
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/005—Processes
  • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
  • H01L2933/0008—Processes
  • H01L2933/0033—Processes relating to semiconductor body packages
  • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
  • H01L33/50—Wavelength conversion elements
  • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil

Definitions

• the invention relates to a method for producing a plurality of semiconductor components, which comprise a semiconductor chip and a converter plate.
• the semiconductor chip emits during operation a primary radiation, wherein the converter plate at least a portion of the primary radiation in a
• the converter wafer is usually applied directly to the semiconductor chip by means of a screen printing process.
• this can adversely affect a fluctuation of the color locus of the device
• the method comprises producing a plurality of radiation-emitting elements
• Semiconductor chip and a converter plate comprising the following method steps: a) providing a plurality of semiconductor chips in
• Wafer composite each of which is suitable for emitting a primary radiation
• a converter plate can be mounted in each case on exactly one semiconductor chip. Alternatively, a plurality of semiconductor chips, a common converter plate
• the converter plates are thus manufactured separately
• a separately manufactured wafer is to be understood in particular as a wafer which is produced separately from the other components of the component.
• the wafer may be fabricated before, in parallel, or after the fabrication of the remainder of the device.
• the term “platelets” also apply here
• foil-like flexible layers which can be manufactured separately and arranged on the chip.
• the conversion wafer is in particular a wafer in which a part of the emitted from the semiconductor chip
• the converter plate can
• Matrix material determines the mechanical properties of the converter plate. As matrix material comes,
• the matrix material is for example a thermoplastic or thermosetting plastic, for example silicone, or a ceramic.
• the refractive index of the matrix material is chosen such that after the application of the converter wafer on the
• the semiconductor chips each have an active layer, which preferably has a pn junction, a
• Double heterostructure a single quantum well structure (SQW, Single quantum well) or a Mehrfachquantentopftechnik (MQW, multi quantum well) for generating radiation contains.
• the term quantum well structure unfolds no significance with regard to the dimensionality of the quantization. It includes, among other things, quantum wells, quantum wires and quantum dots and any combination of these structures.
• the layers of the semiconductor chips each preferably have a III / V semiconductor.
• the semiconductor chips are produced in the wafer composite.
• a wafer composite is any assembly that has a variety of unhoused ones
• the wafer composite may be a carrier on which a plurality of unhoused, but already isolated semiconductor chips is applied in order to allow further processing thereof.
• the converter plates can be applied individually or together in one piece, with the wafer composite is then separated. In this case, the semiconductor chips and possibly the converter plates can be separated together.
• Converter wafer and the semiconductor chips in particular, a manufacturing method can be achieved, in which the
• Color locus control of the radiation of the final product can be controlled better.
• wear of defective components is reduced, such as converter plates or semiconductor chips, since before a combination of
• a component produced in this way has the advantage, in particular, of conversion close to the chip, whereby it is possible to achieve components which are narrower in the white spectral range
• the converter platelets can be planar or have a three-dimensional structuring.
• Converter plate can thus as a flat plate
• Platelet is designed flat.
• the exit surface of the platelet may be for a desired
• Light extraction a three-dimensional structure For example, a lenticular structure, a curved structure or a roughened structure have.
• the converter plates may contain, for example, ceramic or silicone.
• a plurality of converter plates are produced simultaneously.
• a further development is to mount the
• Converter chips on the semiconductor chips used a conventional pick-and-place method, the principle of which is well known in the semiconductor device mounting technology, in particular in the chip mounting technique, and therefore will not be discussed further here.
• Converter tile b2 Sort the converter tiles according to
• Such a method is characterized in particular by the fact that the color control of the radiation of the end products can be better controlled.
• a converter wafer group in which all the wafers have the same degree of conversion within the same degree of conversion range, to a semiconductor chip group in which all
• Semiconductor chips have the same primary radiation or a primary radiation within the same emission range, groups of semiconductor devices are generated in a comparatively simple manner, which have a very low color space scattering within the group.
• the radiation of each combination of platelet groups with semiconductor groups lies within a common color locus range, in particular in white
• the converter plates are each by means of a clear silicone layer on the respective
• the silicone layer is
• the silicone layer is preferably applied to the semiconductor chips before mounting the converter plates.
• the converter plates may each be applied by means of a layer of a material having the same or similar thermal, optical and adhesive properties as silicone.
• the silicone layer is formed and applied as a drop on each semiconductor chip.
• Each drop is preferably formed as including 5 nl to 20 nl drops inclusive. The size and extent of the drops is thereby automated
• the silicone layer is applied periodically to the semiconductor chips. In particular, exactly one drop of silicone is applied to each semiconductor chip.
• the silicone layer or layer of material having at least similar properties as silicone may be deposited on each semiconductor die by a jet process, a stamping process, or a printing process.
• Converter plates are applied directly to the semiconductor chips. In a further training before mounting the
• Converter wafer on the semiconductor chips determines whether the silicon layer is deposited on each semiconductor chip. If it is determined that no silicone layer is applied to a chip, is in the subsequent
• Semiconductor chip is applied, which has no silicone.
• the converter plates are each released by means of a vacuum process from the common carrier to be subsequently mounted on the semiconductor chips can.
• a needleless recording technique of converter plates can be achieved, which is particularly relevant for converter plates, which are formed as flexible silicone layers.
• possible damage due to the conventionally used needles can be avoided.
• an adhesive layer is used, which is arranged between common carrier and converter platelets, wherein the
• Peel off the converter wafer adhering properties of the adhesive layer can be reduced or canceled by means of a heating process.
• a so-called hot stamp is used for heating. This is passed under the common carrier, so that the adhesive layer inflates and loses its adhesive properties. Subsequently, by means of the vacuum process, the converter plates can be easily detached from the common carrier.
• Converter wafer on the semiconductor chips positions and orientations of the semiconductor chips in the wafer composite determined.
• the determined positions are in a so-called
• the determination of the positions takes place for example on the basis of markings in the composite,
• This position is recorded in the substrate card so that there is no further processing on it
• Converter chips on the semiconductor chips positions and orientations of the converter platelets on the common carrier determined. This determination takes place, for example, by means of markings or due to recesses in the
• the converter plates are each so on the
• Converter wafer is disposed above the corner contact of the semiconductor chip.
• the orientation of the converter plates is determined, for example, by means of a so-called Uplooking Camera (ULC), which is well known to the person skilled in the art and will therefore not be discussed further here.
• ULC Uplooking Camera
• Converter wafer on the semiconductor chips is in particular a rotation of the converter plates or semiconductor chips note that the converter plates are applied to the semiconductor chips in a similar way.
• the wafer composite can be separated into individual components with chips arranged thereon,
• each a component comprises a semiconductor chip with converter plates arranged thereon.
• the desired Gebiruse stresses can be selected.
• the housing body can then after mounting the semiconductor devices
• Figure 1 is a schematic view of a
• FIGS. 2A to 2G each show a view of one
• FIG. 3 shows a schematic flowchart in connection with a production method according to the invention.
• Size ratios among each other are basically not to be considered as true to scale. Rather, individual can
• Components such as layers, structures,
• Figure 1 is a schematic view of a
• Semiconductor device comprising a semiconductor chip and a converter plate shown.
• a plurality of converter plates 2 are provided on a common carrier 2a as shown in the left part of FIG.
• the converter plates 2 are arranged periodically, for example in the form of a matrix, on the common carrier 2a.
• the converter plates 2 have a distance from one another so that the converter plates 2 are not directly adjacent to one another.
• a plurality of semiconductor chips is provided in the wafer composite, as shown in detail in the right part of FIG.
• the semiconductor chips 1 are arranged, for example, in a housing 5, the housing having a recess in which the semiconductor chip 1 is arranged.
• Recess of the housing body 5 contains, for example, air.
• the semiconductor chip is suitable for emitting a primary radiation.
• the semiconductor chip 1 emits blue radiation.
• the converter plates 2 are suitable for converting the primary radiation of the semiconductor chip (s) 1 into secondary radiation.
• the converter plates 2 are suitable for converting blue radiation into yellow radiation.
• a converter plate 2 is by means of a
• the converter plate 2 is arranged directly vertically on the semiconductor chip 1, so that emitted by the semiconductor chip 1 radiation at least partially passes through the converter plate 2.
• the component 10 thus produced thus emits mixed radiation
• the Mixed radiation is preferably in the white Farbort Scheme.
• the semiconductor chips may alternatively be in a wafer composite as a plurality of unhoused, but already isolated
• Semiconductor chips may be formed.
• the converter plates each directly to the semiconductor chips subordinate by the converter tiles on a
• FIG. 2A shows the detachment process of the converter plate 2 from the common carrier 2a.
• the converter plate 2 is mounted directly on the common carrier 2a. In order to release the converter plate 2 from the carrier 2a is
• a vacuum device 4 application for example, a trained by vacuum suction device.
• the vacuum device 4 is guided directly over the converter plate 2, in particular in direct contact with the
• Converter plate 2 placed on the opposite side of the common carrier 2a.
• the converter plate 2 is sucked to the vacuum device by means of a vacuum process, so that it adheres, bringing the
• the converter plate 2 can then be arranged downstream of the semiconductor chip, as shown for example in Figure 1 by the arrow.
• the common carrier 2a is designed so that the converter plate 2 is fixedly connected to the common carrier 2a, wherein this fixed connection can be reduced or canceled by means of a heating process.
• a thus formed common carrier 2a is
• an adhesive layer 2 b is arranged between the common carrier 2 a and the converter wafer 2.
• Such an adhesive layer is among others also known by the term "thermal release
• Adhesive layer 2b has adhesive
• properties of the adhesive layer can be reduced or eliminated by means of a heating process, as shown in FIG. 2C.
• a heater 2c for example a heating stamp, is arranged on the side of the common carrier 2a facing away from the converter plate 2, so that this heater 2c heats the common carrier 2a and the adhesive layer 2b. Due to this heating process, the adhesive properties of the adhesive layer 2 b, in which the adhesive layer 2 b is foamed or inflated, advantageously decrease. Because of this foaming, that one
• the converter plate 2 can easily be lifted by a vacuum device, as shown for example in Figure 2A, from the common carrier 2a and then further processed. Due to this vacuum lift can
• FIG. 2D shows a plan view of a semiconductor chip 1 on which a silicon layer, in particular a silicone drop 3, has been applied.
• the silicone drop 3 is provided for fixing the converter wafer on the semiconductor chip.
• a drop of silicone having a volume in a range of between 15 nl and 20 nl including drops.
• Silicone drop 3 is then placed the converter plate 2, wherein the silicone is cured, so that a firm connection between the semiconductor chip 1 and
• Wafer composite provided, as shown for example in Figure 2E.
• a silicone droplet is applied to a semiconductor chip.
• Silicon drop is using a camera optics and
• the camera optics can detect a reflection of the substrate in the silicone drop. If no reflection is detected, this becomes
• no converter wafer is applied to the marked semiconductor chips in the subsequent process.
• the checking and marking of the semiconductor chips is used in the automated process.
• FIG. 2E shows, in particular, a plan view of a wafer composite 10a with unpackaged optoelectronic semiconductor chips 1
• Semiconductor chips 1 epitaxially grown on the wafer 10a.
• the layers of the semiconductor chips 1 have an active layer.
• the active layer has, for example, a Radiation-generating pn junction or a
• the semiconductor chips 1 are arranged on the wafer 10 a like a matrix. Here, the semiconductor chips 1 are arranged adjacent to each other. Of the
• Wafer composite 10a has a chip grid with a
• Semiconductor chips are each applied contact surfaces, which serve for electrical contacting of the semiconductor chips.
• the position and orientation of the semiconductor chips 1 in the wafer assembly are determined by means of markings.
• Semiconductor chips 1 are detected, which are detected in the substrate card. If, for example, it is determined at a position of the wafer composite 10a that this position does not exist
• FIG. 2F shows a plan view of a semiconductor chip 1 in a composite. On the surface of the semiconductor chip 1 is a contact surface la and
• Semiconductor chips 1 are each scanned by means of a camera optics, wherein the contact surface la as a mark A5 is determined.
• the side surfaces by means of
• Markings A3, A4 determined.
• Orientation of the semiconductor chip 1 in the wafer composite determined and recorded in a so-called module card.
• the alignment of the semiconductor chips is necessary, in particular, to place the converter plates in a subsequent
• the converter plates have a corner recess, in which the contact surface of the semiconductor chip is to be arranged. This recess is directly above the contact surface of the semiconductor chip in a later process step
• FIG. 2G shows a plan view of a finished component 10.
• the component 10 has a carrier 9, on which the semiconductor chip 1 is arranged.
• the carrier 9 has a first printed circuit la and a second
• Conductor lb which are arranged on the side of the carrier 9, on which the chip is arranged.
• the semiconductor chip 1 is in particular with an electrical pad on the conductor la of the carrier 9 directly electrically and
• the semiconductor chip 1 is connected to the
• the printed conductors la, lb of the carrier are arranged insulated from each other electrically, for example by means of a distance.
• the converter plate is arranged.
• the converter plate is aligned such that the recess of the converter plate 2 in the region of
• Converter plate 2 centrally on the semiconductor chip. 1
• a device produced in this way can after the
• the component 10, as shown in FIG. 2G, is still in the wafer composite, wherein after the manufacturing process the wafer composite can be singulated into individual components, for example by means of a sawing process.
• FIG. 3 shows a method sequence of a
• Color locus Semiconductor devices whose radiation or color a common color or
• Color locus are here as a
• step Vlb a plurality of separately manufactured converter plates are provided. These platelets are arranged in particular on a common carrier.
• step V2b the degree of radiation conversion of each plate is measured.
• the degree of radiation conversion of each plate is measured. For example, the
• Platelets are measured individually by means of a measuring apparatus in which a semiconductor chip with known
• Wavelength distribution is arranged.
• all converter wafers are sorted into wafers according to the measured degree of conversion, so that all wafers in a wafers group have one
• the platelets are preferably sorted into platelet groups, each characterized by a very narrow degree of conversion range. If the allowable tolerance in the color locus control is higher in the finished semiconductor devices, the
• Conversion grade range can be chosen wider.
• method step Via analogous applies to the sorting of the semiconductor chips in semiconductor chip groups.
• a plurality of semiconductor chips in the wafer composite is provided whose emission wavelength of the primary radiation is determined in method step V2a.
• the semiconductor chips are arranged in groups, wherein the group classification is noted in the module card.
• Converter wafer groups each associated with a semiconductor chip group, so that of each combination of
• Converter wafer and semiconductor chips radiation is generated, which is within a predetermined Farbort Schemes, preferably within a common
• Color locus more preferably within a white color locus. Because of this sorting can be a
• the assembly takes place for example by means of the silicone droplet, as explained in Figure 2D.
• the detachment of the converter platelets from the common carrier takes place, for example, by means of the method, as explained in FIGS. 2A to 2C.
• Each of the chips / semiconductor chip group belongs to a semiconductor device group Gl, G2 or G3. If the allowable color gamut tolerance is
• the invention is not limited by the description based on the embodiments of these, but includes each new feature and any combination of features, which in particular any combination of features in the

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Power Engineering (AREA)
• Led Device Packages (AREA)
• Testing Or Measuring Of Semiconductors Or The Like (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Applications Claiming Priority (3)

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• 2011
  • 2011-03-09 DE DE102011013369A patent/DE102011013369A1/de not_active Withdrawn
  • 2011-12-15 WO PCT/EP2011/072944 patent/WO2012089531A1/de active Application Filing
  • 2011-12-15 KR KR1020137019890A patent/KR20130110212A/ko not_active Application Discontinuation
  • 2011-12-15 US US13/977,407 patent/US20130337593A1/en not_active Abandoned
  • 2011-12-15 JP JP2013546657A patent/JP2014501454A/ja not_active Withdrawn
  • 2011-12-15 CN CN2011800637777A patent/CN103283040A/zh active Pending
  • 2011-12-15 EP EP11804996.4A patent/EP2659522A1/de not_active Withdrawn
  • 2011-12-28 TW TW100149161A patent/TWI470840B/zh not_active IP Right Cessation

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