EP2593283A1 - Träger für einen siliziumblock, trägeranordnung mit einem solchen träger und verfahren zur herstellung einer solchen trägeranordnung - Google Patents
Träger für einen siliziumblock, trägeranordnung mit einem solchen träger und verfahren zur herstellung einer solchen trägeranordnungInfo
- Publication number
- EP2593283A1 EP2593283A1 EP11730315.6A EP11730315A EP2593283A1 EP 2593283 A1 EP2593283 A1 EP 2593283A1 EP 11730315 A EP11730315 A EP 11730315A EP 2593283 A1 EP2593283 A1 EP 2593283A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- carrier
- channels
- silicon block
- grooves
- depressions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
Definitions
- the invention relates to a support for a silicon block, a carrier assembly and a method for producing such a carrier assembly.
- the invention has for its object to provide a support mentioned above, a corresponding carrier assembly and a method for producing such a carrier assembly with which probable
- the prior art can be achieved and, in particular, an advantageous, inexpensive and process-reliable method can be created for producing and using such a carrier.
- the carrier is designed to be fixedly connected as part of a carrier arrangement with a silicon block, which is usually quite heavy and weighs a few kg.
- the carrier does not even have to be firmly connected directly to the silicon block or it is envisaged that it will not be connected directly to the silicon block.
- a later explained in more detail carrier base is advantageously provided, which is attached to the bottom of the carrier, and on this support base in turn, the silicon block is fixed, in particular glued in a known manner.
- the carrier assembly is therefore divided into two parts in the sense that the one-piece carrier in the aforementioned prior art now consists of two parts, namely the carrier and the carrier base.
- the carrier as part of the carrier assembly may be connected to the carrier base and this unit in turn may be connected to the heavy silicon block.
- the carrier itself can be designed to be attached to movement devices, with which it is retracted into a saw or a cleaning device, advantageously by fastening means such as screwing or the like.
- the carrier At its pointing to the silicon block underside, the carrier has a plurality of wells, Channels or cuts on. These are open at the bottom at the bottom. They are then later closed or covered by the carrier base and, so to speak, are transformed from open channels that are easy to produce to integrated inner longitudinal channels, which in turn are much more difficult to produce on their own.
- the carrier lower part with the silicon block in turn is intended to be sawn during sawing down to the recesses mentioned and in any case until complete separation of the individual wafers.
- the carrier with a carrier lower part together forms a carrier arrangement, as is known in one-piece form from the aforementioned prior art.
- a plurality of parallel open channels are provided in the manner of grooves in the underside of the carrier. Particularly advantageous they run along the longitudinal direction of the carrier and may preferably have regular distances from one another. Thus, for example, it may be 4 to 10 depressions or channels, which advantageously extend at the same distance from one another along the longitudinal direction of the carrier.
- the underside of the carrier is flat or flat except for the recesses, channels or cuts mentioned. It can be provided that the carrier has a substantially constant thickness and in particular is a kind of plate. It is advantageous as in the known carrier arrangements - - oblong and rectangular, as otherwise usually the silicon blocks.
- the carrier fastening means On the upper side of the carrier fastening means may be provided in an embodiment of the invention, with which the carrier can be attached to an aforementioned movement device or a handling device. The composite of carrier assembly and silicon block can then be gripped and moved on the attachment means.
- the fastening means are designed as fastening projections with threaded holes. In this case, they can particularly preferably point upwards for a screwing-in direction perpendicular to the carrier.
- various other fastening means are conceivable and known to the person skilled in the art.
- the carrier may be made of metal. It is particularly advantageous from steel or stainless steel. Its dimensions may correspond to conventional carrier arrangements in terms of length and width and, above all, depend on the silicon blocks with which it is to be connected.
- the thickness of the support may vary between 1 cm and 3 cm, for example about 2 cm. This allows the heavy silicon blocks to be well held and transported. Its length can be between 20 cm and 50 cm, under some circumstances even more.
- the carrier or at least one rectangular carrier plate, which essentially forms it, is in one piece and in one piece. The aforementioned fastening means can then be subsequently attached to the support plate or already worked in one piece or molded.
- a cross-section of the recesses, channels or cuts can basically be arbitrary.
- they are rectangular or round, in particular semicircular. They can be made by milling. - -
- the wells, channels or incisions may be closed down, but liquid-permeable closed.
- a closure can be done by a type of perforated grid or perforated plates.
- This liquid-permeable closure serves essentially as a kind of diffuser or distributor.
- the depressions in the carrier and thus the integrated longitudinal channels are accessible from above or from its upper side.
- supply channels may be provided in the carrier.
- inlet channels connect several recesses, channels or cuts with each other. This means that they are formed, for example, transversely to the direction of the depressions and are also incorporated at the bottom. They can be accessible through holes through the top.
- projections may be provided on the upper side, which have such an inlet channel and for connecting a water supply or the like. can serve.
- An advantageous possibility here is a bonding of the carrier with the carrier base.
- the carrier base is a wear part used only once, since it is also sawed when sawing the silicon block itself. To remove it from the carrier, the bonding can be solved in a conventional manner, for example chemically or thermally. Then the carrier can be cleaned on its underside of adhesive residues and then glued back to a new carrier base. With this new carrier assembly, a new silicon block can be connected, in particular also be glued to it, for subsequent processing steps such as sawing or cleaning.
- the carrier is metallic and on its underside a carrier base is attached to which in turn a heavy silicon block can be attached, for example, durable and stable by sticking.
- the carrier base is made of non-metallic material and has recesses, channels or grooves on its upper side connected to the carrier. These may correspond to the form or from the training forth the depressions, channels or notches or grooves, as they have been previously described for an advantageous embodiment of the carrier. In this case, the carrier itself need not necessarily be provided on its underside with such wells.
- said depressions, channels or cuts may have a depth of a few millimeters, for example 3 mm to 12 mm. Their width can also be a few millimeters, advantageously 3 mm to 15 mm.
- Such a carrier base is used particularly advantageously in a carrier arrangement according to the invention with a carrier mentioned at the outset, which has recesses of corresponding design on its underside. This means that they run exactly one above the other and in particular also have exactly the same width. Furthermore, it is possible that they have exactly the same shape. - -
- the carrier base should occupy the same area as the carrier itself, so be about the same size.
- they also have similar thickness, for example, the few centimeters mentioned above.
- FIG. 1 is a sectional view through a carrier assembly a carrier and not yet arranged on the underside carrier base,
- FIG. 2 shows a representation of the underside of the carrier of FIG. 1 with individual outlet holes
- FIG. 3 is a plan view of the carrier base with matching to the outlet holes of FIG. 2 longitudinal channels
- FIG. 4 is a sectional view similar to FIG. 1 with carrier and lower carrier part joined together as a carrier arrangement and silicon block on the carrier lower part, FIG. - -
- FIG. 5 is an illustration of the underside of a modification of the carrier similar to FIG. 2 with continuous longitudinal channels, which are covered with a perforated grid and
- Fig. 6 is a section similar to Fig. 1 in high magnification showing a perforated grid over an outlet channel.
- a carrier assembly 1 1 is shown as it is being assembled or manufactured.
- the carrier assembly 1 1 has a carrier 13 in the form of an elongated rectangular plate, wherein the carrier 13 is cut along its width, for example, is halved in length. It has a carrier upper side 14 and a carrier lower side 15, the latter being essentially planar.
- the stable support 13 is advantageously made of steel or tool steel or stainless steel and may generally be between 20cm and 50cm long, sometimes longer.
- outlet holes 17 are provided, which are recognizable from the representation in Fig. 2 as round holes. So they break through the carrier base 15 so that it is flat or flat except for the outlet holes 17.
- the outlet holes 17 are connected to each other by means of feed lines 18 in the carrier 13, which are shown in dashed lines in FIGS. 1 and 2.
- the connection pattern may be as shown here, but may also deviate therefrom, in particular towards the center region, significantly more outlet holes 17 for a particularly improved cleaning there.
- To produce the leads 18 can for example be drilled from the side into the carrier 13 and these openings are then closed outside again.
- the leads 18 go up into two ports 19 left and right over.
- the connections 19 are - - in the fastening projections 21 and can be connected in a manner not shown with water or makes remedykeitszuleitun- gene.
- the fastening projections 21 each have a central thread 22 on which the carrier assembly 1 1 can be fixed in a known manner.
- the carrier 13 has four such fastening projections 21 on its upper side 14 of the carrier.
- four terminals 19 may be provided to the leads 18, but it may also be more or less.
- the outlet holes 17 may have a diameter of a few millimeters, for example 1 mm to 6 mm, advantageously about 3 mm to 5 mm.
- the carrier base 25 shown in Fig. 1 is advantageous in terms of length and width similar to the size of the carrier 13, wherein a top 26 and a bottom 27 are basically flat. However, while the bottom 27 is advantageously designed completely flat and without interruptions or recesses or projections, the top 26 has a plurality of open channels 29. These extend with advantageously straight extension over the entire upper side 26 from the front to the rear end of the carrier base 25 and extend parallel to each other, although at different distances. This can be seen from the top view of the carrier lower part 25 according to FIG. 3.
- the carrier lower part 25 advantageously made of a glass or ceramic material, particularly advantageously made of glass, alternatively of plastic.
- the channels 29 are arranged exactly so that they correspond to the rows of the outlet holes 17 in the longitudinal direction of the carrier 13 or, in the assembled state, are located exactly below the channels 29. This can be seen below from FIG. 4.
- the width of the channels 29 may also be approximately in the range of the diameter of the outlet holes 17, alternatively, some of it may differ.
- the channels 29 are each the same and advantageously have a rounded cross-section, for example semicircular or semi-oval.
- they are even a little deeper than wide.
- Fig. 4 the composite or assembled carrier assembly 1 1 is shown in a simplified representation.
- the carrier base 25 is attached or glued with its upper side 26 to the carrier base 15 of the carrier 13.
- the outlet holes 17 in the carrier 13 are located exactly above the channels 29 of the carrier base 25.
- a heavy silicon block 31 is fixed, and in turn glued. Also, this sticking is done, as known in the art and has the advantage of secure support of the heavy silicon block and the possibility of subsequent detachment.
- the carrier base 25 is then no longer usable, only the carrier 13th
- the carrier assembly 11 of FIG. 4 thus substantially corresponds to a carrier arrangement known from the prior art mentioned at the beginning, namely with internal and quasi-integrated longitudinal channels. These are essentially generated by the channels 29. They may be closed at the ends or openings at the end to the outside, for example by plugging or the like, to the water only - - but not through the crevices between the wafers for improved cleaning.
- channels 29 can now be supplied or flooded with water or cleaning liquid by means of the connections 19, supply lines 18 and outlet holes 17 above them.
- a feed can be made much more uniformly by the distributed outlet holes 17, whereas in the aforementioned prior art it was only possible via the two ends or openings of the channels 29.
- a better cleaning effect is possible.
- the beginning and end openings of the channels 29 to be recognized in FIG. 4 are closed, so that water or cleaning liquid can only actually escape through the sawn wafer of the silicon block 31.
- a carrier base 25 may be formed as a wear part because it is sawn, ie in turn made of glass, ceramic or a similar material or even plastic.
- the channels 29 are advantageously introduced even during the preparation of the carrier base 25. This can be - - Without any additional step in a continuous casting or the like. respectively.
- the carrier 13 itself is not a wearing part and can be reused frequently. After removing the sawed-out wafers, it is only necessary to remove the used or sawed-off carrier lower part 25 by releasing the adhesive bond. Then the carrier base 15 can be cleaned and glued to a new carrier base 25.
- the production of the water supply is easier, so the attachment of the outlet holes 17 and the leads 18 together with terminals 19 in the support 13 made of steel. They can each be drilled in a known manner. Since the carrier 13 can be reused frequently, it is also worthwhile to provide the relatively complicated system of outlet holes 17 together with feed lines 18 and connections 19.
- FIG. 5 an alternative embodiment of a support 1 13 is shown similar to FIG. 3, namely as a view of a carrier base 1 15 of the carrier 1 13.
- a plurality of long outlet channels 1 17 provided along the
- these outlet channels 1 17 correspond to the channels 29 in the carrier lower part 25 corresponding to FIGS. 1 and 3.
- These outlet channels 1 17 are even easier to manufacture than the plurality of outlet holes 17 according to FIGS. 1 and 2, for example appropriate milling or cutting.
- outlet channels 1 17 are simply open and water, which is introduced by supply lines, not shown here, exits arbitrarily in the outlet channels 1 17 and from there into the directly adjacent channels 29 in the top of the carrier base 25th , - -
- Fig. 6 shows in an enlarged sectional view shows that a perforated grid 120 is used, so to speak, in the outlet channels 1 17.
- This may be a press fit, alternatively gluing or screwing.
- the perforated grids 120 thus cover, as it were, all the outlet channels 17, ie are located between them and the channels 29 in the upper side of a suitable carrier lower part 25.
- the perforated grids 120 have a multiplicity of holes with advantageously quite a small distance.
- the holes may have a diameter of about 1 mm and a distance of 1 mm to 3 mm, but in some cases also slightly more or less.
- a carrier above no holes or channels or the like. on its underside is a closed or massive steel plate with a flat and closed bottom without recesses.
- This is a carrier base according to FIG. 4 attached by gluing. Because the carrier base has longitudinal channels on its upper side, as described above, integrated longitudinal channels as described in the aforementioned prior art can also be produced. Their production is considerably simpler, however, since it is only the lower part of the support that needs to have the channels on its upper side and thus on the outer side, which simplifies production. The introduction of water or cleaning liquid then takes place at the ends of the channels via their local openings, as also described in the prior art.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010031364A DE102010031364A1 (de) | 2010-07-15 | 2010-07-15 | Träger für einen Siliziumblock, Trägeranordnung mit einem solchen Träger und Verfahren zur Herstellung einer solchen Trägeranordnung |
PCT/EP2011/061606 WO2012007381A1 (de) | 2010-07-15 | 2011-07-08 | Träger für einen siliziumblock, trägeranordnung mit einem solchen träger und verfahren zur herstellung einer solchen trägeranordnung |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2593283A1 true EP2593283A1 (de) | 2013-05-22 |
Family
ID=44628170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11730315.6A Withdrawn EP2593283A1 (de) | 2010-07-15 | 2011-07-08 | Träger für einen siliziumblock, trägeranordnung mit einem solchen träger und verfahren zur herstellung einer solchen trägeranordnung |
Country Status (9)
Country | Link |
---|---|
US (1) | US20130112185A1 (zh) |
EP (1) | EP2593283A1 (zh) |
JP (1) | JP5869566B2 (zh) |
KR (1) | KR20130127973A (zh) |
CN (1) | CN103140336B (zh) |
DE (1) | DE102010031364A1 (zh) |
MY (1) | MY162295A (zh) |
TW (1) | TWI538775B (zh) |
WO (1) | WO2012007381A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2711151A1 (en) | 2012-09-24 | 2014-03-26 | Meyer Burger AG | Method of making wafers |
FR3068276B1 (fr) * | 2017-07-03 | 2019-08-30 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Support a la decoupe par fil a abrasifs lies comportant un assemblage de materiaux differents |
CN113334244B (zh) * | 2021-05-18 | 2023-04-28 | 长江存储科技有限责任公司 | 一种承载装置以及研磨设备 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4227348A (en) * | 1978-12-26 | 1980-10-14 | Rca Corporation | Method of slicing a wafer |
US4819387A (en) * | 1987-12-16 | 1989-04-11 | Motorola, Inc. | Method of slicing semiconductor crystal |
DE4132311A1 (de) * | 1991-09-27 | 1993-04-01 | Siemens Ag | Verfahren und vorrichtung zum trennsaegen von scheibenfoermigen bauteilen |
JPH09207126A (ja) * | 1996-01-31 | 1997-08-12 | Nippei Toyama Corp | ワイヤソーのためのワーク支持装置、清浄方法及びワイヤソー |
DE10009656B4 (de) * | 2000-02-24 | 2005-12-08 | Siltronic Ag | Verfahren zur Herstellung einer Halbleiterscheibe |
JP2004106360A (ja) * | 2002-09-19 | 2004-04-08 | Komatsu Electronic Metals Co Ltd | スリット入りウェーハ支持部材およびウェーハ洗浄装置 |
CH696807A5 (fr) * | 2003-01-13 | 2007-12-14 | Hct Shaping Systems S A | Dispositif de sciage par fil. |
AT6926U1 (de) * | 2003-03-13 | 2004-05-25 | Ventec Ges Fuer Venturekapital | Mobile transportable elektrostatische substrathalter |
WO2005095076A1 (en) * | 2004-03-30 | 2005-10-13 | Solaicx, Inc. | Method and apparatus for cutting ultra thin silicon wafers |
DE102004058194A1 (de) * | 2004-12-02 | 2005-08-11 | Siltronic Ag | Sägeleiste und Verfahren zum Abtrennen von Halbleiterscheiben von einem Kristallstück |
DE102005028112A1 (de) * | 2005-06-13 | 2006-12-21 | Schmid Technology Systems Gmbh | Verfahren zur Positionierung und Lageerhaltung von Substraten, insbesondere von dünnen Siliziumwafern nach dem Drahtsägen zu deren Vereinzelung |
JP2007118354A (ja) * | 2005-10-27 | 2007-05-17 | Kyocera Corp | インゴット支持用治具 |
JP5363746B2 (ja) * | 2008-02-29 | 2013-12-11 | Towa株式会社 | 切断装置及び切断方法 |
ATE500940T1 (de) * | 2008-04-23 | 2011-03-15 | Applied Materials Switzerland Sa | Montierscheibe für eine drahtsägevorrichtung, drahtsägevorrichtung damit, und drahtsägeverfahren, das mit der vorrichtung durchgeführt wird |
DE102008037652A1 (de) * | 2008-08-14 | 2010-04-29 | Wacker Schott Solar Gmbh | Träger, Verfahren und Vorrichtung zum Herstellen von Wafern sowie Verwendung der hergestellten Wafer |
DE102009023121A1 (de) | 2009-05-22 | 2010-11-25 | Gebr. Schmid Gmbh & Co. | Träger für einen Siliziumblock |
DE102009023122A1 (de) * | 2009-05-22 | 2010-11-25 | Gebr. Schmid Gmbh & Co. | Träger für einen Siliziumblock sowie Herstellungsverfahren eines solchen Trägers |
DE102010022289A1 (de) * | 2009-09-17 | 2011-05-26 | Gebrüder Decker GmbH & Co. KG | Vorrichtung und Verfahren zum Reinigen von Wafern II |
DE102010050897B4 (de) * | 2010-07-09 | 2014-05-22 | Interpane Entwicklungs-Und Beratungsgesellschaft Mbh | Trägervorrichtung und Verfahren zum Schneiden eines an der Trägervorrichtung befestigten Materialblocks |
-
2010
- 2010-07-15 DE DE102010031364A patent/DE102010031364A1/de not_active Withdrawn
-
2011
- 2011-07-08 JP JP2013519048A patent/JP5869566B2/ja not_active Expired - Fee Related
- 2011-07-08 US US13/810,132 patent/US20130112185A1/en not_active Abandoned
- 2011-07-08 MY MYPI2013000013A patent/MY162295A/en unknown
- 2011-07-08 KR KR1020137003768A patent/KR20130127973A/ko not_active Application Discontinuation
- 2011-07-08 CN CN201180034643.2A patent/CN103140336B/zh not_active Expired - Fee Related
- 2011-07-08 WO PCT/EP2011/061606 patent/WO2012007381A1/de active Application Filing
- 2011-07-08 EP EP11730315.6A patent/EP2593283A1/de not_active Withdrawn
- 2011-07-15 TW TW100125194A patent/TWI538775B/zh not_active IP Right Cessation
Non-Patent Citations (1)
Title |
---|
See references of WO2012007381A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP2013531388A (ja) | 2013-08-01 |
TWI538775B (zh) | 2016-06-21 |
CN103140336B (zh) | 2015-11-25 |
KR20130127973A (ko) | 2013-11-25 |
US20130112185A1 (en) | 2013-05-09 |
MY162295A (en) | 2017-05-31 |
DE102010031364A1 (de) | 2012-01-19 |
TW201208808A (en) | 2012-03-01 |
CN103140336A (zh) | 2013-06-05 |
JP5869566B2 (ja) | 2016-02-24 |
WO2012007381A1 (de) | 2012-01-19 |
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