EP2462627A1 - Granulés à base de copolymères evm en tant que matériau de garniture pour modules solaires, leurs procédés de fabrication, un film adhésif, ainsi qu'un module solaire, ses procédés de fabrication et un dispositif de fabrication - Google Patents
Granulés à base de copolymères evm en tant que matériau de garniture pour modules solaires, leurs procédés de fabrication, un film adhésif, ainsi qu'un module solaire, ses procédés de fabrication et un dispositif de fabricationInfo
- Publication number
- EP2462627A1 EP2462627A1 EP10737343A EP10737343A EP2462627A1 EP 2462627 A1 EP2462627 A1 EP 2462627A1 EP 10737343 A EP10737343 A EP 10737343A EP 10737343 A EP10737343 A EP 10737343A EP 2462627 A1 EP2462627 A1 EP 2462627A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- phr
- solar
- vinyl acetate
- solar module
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000008187 granular material Substances 0.000 title claims abstract description 31
- 239000000463 material Substances 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 238000000034 method Methods 0.000 title claims description 24
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
- 239000011888 foil Substances 0.000 title 1
- 229920001577 copolymer Polymers 0.000 claims abstract description 30
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000012190 activator Substances 0.000 claims abstract description 19
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000003153 chemical reaction reagent Substances 0.000 claims abstract description 18
- 229910000077 silane Inorganic materials 0.000 claims abstract description 18
- 230000008878 coupling Effects 0.000 claims abstract description 17
- 238000010168 coupling process Methods 0.000 claims abstract description 17
- 238000005859 coupling reaction Methods 0.000 claims abstract description 17
- 239000000654 additive Substances 0.000 claims abstract description 8
- 239000002313 adhesive film Substances 0.000 claims description 32
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 12
- 238000003475 lamination Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 10
- 239000002904 solvent Substances 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 8
- 238000009835 boiling Methods 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- LUJMEECXHPYQOF-UHFFFAOYSA-N 3-hydroxyacetophenone Chemical compound CC(=O)C1=CC=CC(O)=C1 LUJMEECXHPYQOF-UHFFFAOYSA-N 0.000 claims description 4
- TXFPEBPIARQUIG-UHFFFAOYSA-N 4'-hydroxyacetophenone Chemical compound CC(=O)C1=CC=C(O)C=C1 TXFPEBPIARQUIG-UHFFFAOYSA-N 0.000 claims description 4
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 claims description 4
- NPFYZDNDJHZQKY-UHFFFAOYSA-N 4-Hydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 NPFYZDNDJHZQKY-UHFFFAOYSA-N 0.000 claims description 4
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical group C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 4
- 239000012965 benzophenone Substances 0.000 claims description 4
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 238000010626 work up procedure Methods 0.000 claims description 3
- CKGKXGQVRVAKEA-UHFFFAOYSA-N (2-methylphenyl)-phenylmethanone Chemical compound CC1=CC=CC=C1C(=O)C1=CC=CC=C1 CKGKXGQVRVAKEA-UHFFFAOYSA-N 0.000 claims description 2
- JENOLWCGNVWTJN-UHFFFAOYSA-N (3,4-dimethylphenyl)-phenylmethanone Chemical compound C1=C(C)C(C)=CC=C1C(=O)C1=CC=CC=C1 JENOLWCGNVWTJN-UHFFFAOYSA-N 0.000 claims description 2
- URBLVRAVOIVZFJ-UHFFFAOYSA-N (3-methylphenyl)-phenylmethanone Chemical compound CC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1 URBLVRAVOIVZFJ-UHFFFAOYSA-N 0.000 claims description 2
- WXPWZZHELZEVPO-UHFFFAOYSA-N (4-methylphenyl)-phenylmethanone Chemical compound C1=CC(C)=CC=C1C(=O)C1=CC=CC=C1 WXPWZZHELZEVPO-UHFFFAOYSA-N 0.000 claims description 2
- BCWCEHMHCDCJAD-UHFFFAOYSA-N 1,2-bis(4-methylphenyl)ethane-1,2-dione Chemical compound C1=CC(C)=CC=C1C(=O)C(=O)C1=CC=C(C)C=C1 BCWCEHMHCDCJAD-UHFFFAOYSA-N 0.000 claims description 2
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 claims description 2
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 claims description 2
- YJFNFQHMQJCPRG-UHFFFAOYSA-N 1-(4-ethoxyphenyl)ethanone Chemical compound CCOC1=CC=C(C(C)=O)C=C1 YJFNFQHMQJCPRG-UHFFFAOYSA-N 0.000 claims description 2
- DJNIFZYQFLFGDT-UHFFFAOYSA-N 1-(4-phenoxyphenyl)ethanone Chemical compound C1=CC(C(=O)C)=CC=C1OC1=CC=CC=C1 DJNIFZYQFLFGDT-UHFFFAOYSA-N 0.000 claims description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 claims description 2
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 claims description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 claims description 2
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 claims description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 claims description 2
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 claims description 2
- LRRQSCPPOIUNGX-UHFFFAOYSA-N 2-hydroxy-1,2-bis(4-methoxyphenyl)ethanone Chemical compound C1=CC(OC)=CC=C1C(O)C(=O)C1=CC=C(OC)C=C1 LRRQSCPPOIUNGX-UHFFFAOYSA-N 0.000 claims description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 claims description 2
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 claims description 2
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 claims description 2
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 claims description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 2
- BESKSSIEODQWBP-UHFFFAOYSA-N 3-tris(trimethylsilyloxy)silylpropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](O[Si](C)(C)C)(O[Si](C)(C)C)O[Si](C)(C)C BESKSSIEODQWBP-UHFFFAOYSA-N 0.000 claims description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 claims description 2
- 244000028419 Styrax benzoin Species 0.000 claims description 2
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 2
- IDLJKTNBZKSHIY-UHFFFAOYSA-N [4-(diethylamino)phenyl]-phenylmethanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=CC=C1 IDLJKTNBZKSHIY-UHFFFAOYSA-N 0.000 claims description 2
- BEUGBYXJXMVRFO-UHFFFAOYSA-N [4-(dimethylamino)phenyl]-phenylmethanone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=CC=C1 BEUGBYXJXMVRFO-UHFFFAOYSA-N 0.000 claims description 2
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 claims description 2
- GXDZOSLIAABYHM-UHFFFAOYSA-N [diethoxy(methyl)silyl]methyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)COC(=O)C(C)=C GXDZOSLIAABYHM-UHFFFAOYSA-N 0.000 claims description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical class CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 claims description 2
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 claims description 2
- 229960002130 benzoin Drugs 0.000 claims description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 claims description 2
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 claims description 2
- JRZSSQRNBKDVDD-LQIBPGRFSA-N bis[4-[2-[(e)-prop-1-enyl]phenoxy]phenyl]methanone Chemical compound C\C=C\C1=CC=CC=C1OC1=CC=C(C(=O)C=2C=CC(OC=3C(=CC=CC=3)\C=C\C)=CC=2)C=C1 JRZSSQRNBKDVDD-LQIBPGRFSA-N 0.000 claims description 2
- ORHSGYTWJUDWKU-UHFFFAOYSA-N dimethoxymethyl(ethenyl)silane Chemical compound COC(OC)[SiH2]C=C ORHSGYTWJUDWKU-UHFFFAOYSA-N 0.000 claims description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical group CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 2
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 claims description 2
- 235000019382 gum benzoic Nutrition 0.000 claims description 2
- VUNCWTMEJYMOOR-UHFFFAOYSA-N hexachlorocyclopentadiene Chemical compound ClC1=C(Cl)C(Cl)(Cl)C(Cl)=C1Cl VUNCWTMEJYMOOR-UHFFFAOYSA-N 0.000 claims description 2
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 claims description 2
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical group C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 claims description 2
- 150000003462 sulfoxides Chemical class 0.000 claims description 2
- UZIAQVMNAXPCJQ-UHFFFAOYSA-N triethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)COC(=O)C(C)=C UZIAQVMNAXPCJQ-UHFFFAOYSA-N 0.000 claims description 2
- UOKUUKOEIMCYAI-UHFFFAOYSA-N trimethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)COC(=O)C(C)=C UOKUUKOEIMCYAI-UHFFFAOYSA-N 0.000 claims description 2
- DEQUKPCANKRTPZ-UHFFFAOYSA-N (2,3-dihydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1O DEQUKPCANKRTPZ-UHFFFAOYSA-N 0.000 claims 1
- JNHLHPMTMTYLCP-UHFFFAOYSA-N 1-(4-tert-butyl-2,6-dimethylphenyl)ethanone Chemical compound CC(=O)C1=C(C)C=C(C(C)(C)C)C=C1C JNHLHPMTMTYLCP-UHFFFAOYSA-N 0.000 claims 1
- MLOKHANBEXWBKS-UHFFFAOYSA-N 3-triacetyloxysilylpropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](OC(C)=O)(OC(C)=O)OC(C)=O MLOKHANBEXWBKS-UHFFFAOYSA-N 0.000 claims 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims 1
- NZJRVCUHCBWPJT-UHFFFAOYSA-N [ethyl(dimethoxy)silyl]methyl 2-methylprop-2-enoate Chemical compound CC[Si](OC)(OC)COC(=O)C(C)=C NZJRVCUHCBWPJT-UHFFFAOYSA-N 0.000 claims 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 claims 1
- 229940117958 vinyl acetate Drugs 0.000 description 50
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 37
- 239000005038 ethylene vinyl acetate Substances 0.000 description 31
- 239000004711 α-olefin Substances 0.000 description 19
- 239000010408 film Substances 0.000 description 17
- 239000011521 glass Substances 0.000 description 17
- 238000004132 cross linking Methods 0.000 description 13
- 239000000758 substrate Substances 0.000 description 11
- 125000000217 alkyl group Chemical group 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 125000003342 alkenyl group Chemical group 0.000 description 6
- 125000003545 alkoxy group Chemical group 0.000 description 6
- 125000000304 alkynyl group Chemical group 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 5
- 239000004611 light stabiliser Substances 0.000 description 5
- QQONPFPTGQHPMA-UHFFFAOYSA-N Propene Chemical compound CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 4
- 230000006750 UV protection Effects 0.000 description 4
- 125000002877 alkyl aryl group Chemical group 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 3
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 3
- -1 R '= H Chemical group 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000002318 adhesion promoter Substances 0.000 description 3
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000011814 protection agent Substances 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 2
- 229920003346 Levapren® Polymers 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
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- 230000007613 environmental effect Effects 0.000 description 2
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- 230000006870 function Effects 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N methylene hexane Natural products CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 230000009993 protective function Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 230000000475 sunscreen effect Effects 0.000 description 2
- 239000000516 sunscreening agent Substances 0.000 description 2
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical class OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- YAXWOADCWUUUNX-UHFFFAOYSA-N 1,2,2,3-tetramethylpiperidine Chemical group CC1CCCN(C)C1(C)C YAXWOADCWUUUNX-UHFFFAOYSA-N 0.000 description 1
- FIDRAVVQGKNYQK-UHFFFAOYSA-N 1,2,3,4-tetrahydrotriazine Chemical compound C1NNNC=C1 FIDRAVVQGKNYQK-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- YHCGGLXPGFJNCO-UHFFFAOYSA-N 2-(2H-benzotriazol-4-yl)phenol Chemical class OC1=CC=CC=C1C1=CC=CC2=C1N=NN2 YHCGGLXPGFJNCO-UHFFFAOYSA-N 0.000 description 1
- VRROIMIMPLSMFV-UHFFFAOYSA-N 2-(4,6-diphenyltriazin-5-yl)phenol Chemical class Oc1ccccc1-c1c(nnnc1-c1ccccc1)-c1ccccc1 VRROIMIMPLSMFV-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- XHIKSLHIZYVEQI-UHFFFAOYSA-N CC1=C(C(=O)[PH2]=O)C(=CC(=C1)C)C Chemical compound CC1=C(C(=O)[PH2]=O)C(=CC(=C1)C)C XHIKSLHIZYVEQI-UHFFFAOYSA-N 0.000 description 1
- JGLMVXWAHNTPRF-CMDGGOBGSA-N CCN1N=C(C)C=C1C(=O)NC1=NC2=CC(=CC(OC)=C2N1C\C=C\CN1C(NC(=O)C2=CC(C)=NN2CC)=NC2=CC(=CC(OCCCN3CCOCC3)=C12)C(N)=O)C(N)=O Chemical compound CCN1N=C(C)C=C1C(=O)NC1=NC2=CC(=CC(OC)=C2N1C\C=C\CN1C(NC(=O)C2=CC(C)=NN2CC)=NC2=CC(=CC(OCCCN3CCOCC3)=C12)C(N)=O)C(N)=O JGLMVXWAHNTPRF-CMDGGOBGSA-N 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 241001441571 Hiodontidae Species 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 1
- YBUIRAZOPRQNDE-UHFFFAOYSA-N [dimethoxy(methyl)silyl]methyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)COC(=O)C(C)=C YBUIRAZOPRQNDE-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- ZZEMEJKDTZOXOI-UHFFFAOYSA-N digallium;selenium(2-) Chemical compound [Ga+3].[Ga+3].[Se-2].[Se-2].[Se-2] ZZEMEJKDTZOXOI-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 229920006228 ethylene acrylate copolymer Polymers 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical group OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003419 tautomerization reaction Methods 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- MGMXGCZJYUCMGY-UHFFFAOYSA-N tris(4-nonylphenyl) phosphite Chemical compound C1=CC(CCCCCCCCC)=CC=C1OP(OC=1C=CC(CCCCCCCCC)=CC=1)OC1=CC=C(CCCCCCCCC)C=C1 MGMXGCZJYUCMGY-UHFFFAOYSA-N 0.000 description 1
- 229940124543 ultraviolet light absorber Drugs 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L31/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
- C08L31/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C08L31/04—Homopolymers or copolymers of vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10788—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/07—Aldehydes; Ketones
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to granules of ⁇ -olefin-vinyl acetate copolymers having a vinyl acetate content of> 40 wt .-%, based on the total weight of the ⁇ -olefin-vinyl acetate copolymer as an embedding material for solar modules, their production process, an adhesive film and a Solar module and its production method and manufacturing device.
- solar modules which convert the light of the sun directly into electrical energy
- natural resources are used to generate electricity.
- the most important component of solar modules is solar cells.
- Solar modules are often used in outdoor areas, e.g. used on buildings.
- the solar cells present in the solar modules must therefore be protected from environmental influences. Since penetrating moisture can greatly shorten the life of the solar cells and thus of the solar module due to corrosion, the permanent encapsulation (embedding) of the solar cells is of particular importance.
- the material used to encapsulate the solar cells must be transparent to the sunlight and at the same time enable the cost-effective production of the solar modules.
- An often used in the art material for embedding the solar cells are ethylene-vinyl acetate copolymers.
- WO-A-97/22637 relates to a substantially transparent and colorless potting material which is free of ultraviolet light absorber components and composed of a polymer component and a crosslinking reagent.
- the polymer component used is preferably ethylene-vinyl acetate according to WO-A-97/22637.
- Example 1 in WO-A-97/22637 an ethylene-vinyl acetate random copolymer composed of 67% by weight of ethylene and 33% by weight of vinyl acetate is used.
- EP 1 164 167 A1 discloses encapsulating materials comprising an ethylene-vinyl acetate copolymer (EVA), a crosslinker and a polymerization inhibitor. According to EP 1 164 167
- the EVA has a vinyl acetate content of 5 to 50% by weight. At levels above
- EP 1 164 167 A1 50% by weight deteriorates the mechanical properties of the EVA and it becomes difficult to produce EVA films. Concerning the manufacturing process of EP 1
- EVA 164 167 Al used EVA contains no information in EP 1 164 167 A1. According to Examples 1 and 2 in EP 1 164 167 A1, an EVA copolymer with 26% by weight of vinyl acetate is used.
- EP 1 184 912 A1 also relates to an embedding material for solar cells, which is composed of an ethylene-vinyl acetate copolymer (EVA).
- EVA ethylene-vinyl acetate copolymer
- the vinyl acetate content in the EVA copolymer is 10 to 40% by weight. Contents of more than 40% by weight of vinyl acetate are unfavorable according to EP 1 184 912 A1, since EVA copolymers with contents of more than 40% by weight. % Vinyl acetate flow easily and thus complicate the embedding process of the solar cells.
- EVA copolymers having a vinyl acetate content of more than 40% by weight according to EP 1 184 912 A1 are characterized by being tacky, so that the EVA film used for the embedding is difficult to handle.
- the preferred EVA films are crosslinked according to EP 1 184 912 A1.
- JP-A 2003-051605 discloses a film for a solar module composed of an EVA copolymer blended with an organic peroxide, a silane coupling agent and stabilizers.
- the vinyl acetate content in the EVA copolymer according to JP-A 2003-051605 is 27% or more.
- an EVA copolymer with a vinyl acetate content of 28% is used.
- JP-A 2003-049004 relates to a flexible film which is suitable for embedding solar cells without crosslinking.
- the flexible film is preferably composed of an ethylene polymer or an ethylene- ⁇ -olefin copolymer or an ethylene-acrylate copolymer.
- EP-A 1 783 159 A1 describes a resin film of EVA which contains a photoinitiator and a
- Silane coupling reagent contains; no information was provided on the manufacturing process of the EVA.
- EP 2 031 662 describes a solar module consisting of at least one layer of at least one ⁇ -olefin-vinyl acetate copolymer having a vinyl acetate content of> 40% by weight (EVM), the layer containing no aging inhibitors and / or adhesion promoters.
- EVM vinyl acetate content
- the invention is therefore based on the object to provide granules, which can be used as the basis for an embedding material with which the production of solar modules can be performed time-saving and thus cost-effective.
- the resulting solar modules should be characterized by a good life and excellent UV resistance.
- Embedding material and encapsulation material are understood here as synonyms.
- Solar module and photovoltaic module are understood here as synonyms.
- granules of the type mentioned are proposed, which are used as embedding material for solar modules, wherein the granules have as aggregates at least one UV activator and at least one silane coupling reagent.
- Conventional embedding materials consist of ethylene-vinyl acetate copolymers or short EVA with a vinyl acetate content of ⁇ 40 wt .-%, based on the total weight of ⁇ - Olefin-vinyl acetate copolymers.
- organic peroxides are used, which are thermally crosslinked during vacuum lamination. The vacuum largely avoids the formation of air bubbles. Decomposition products of these peroxides penetrate the conventional processes for the production of photovoltaic modules in the vacuum pumps and thereby cause an increased maintenance costs. Dispensing with this maintenance would lead to failure of the pumps.
- the UV activators are preferably benzophenone, 2-methylbenzophenone, 3,4-dimethylbenzophenone, 3-methylbenzophenone, 4,4'-bis (diethylamino) benzophenone, 4,4'-dihydroxybenzophenone, 4,4'-bis [2- (1-propenyl) phenoxy] benzophenone, 4- (diethylamino) benzophenone, 4- (dimethylamino) benzophenone, 4-benzoylbiphenyl, 4-hydroxybenzophenone, 4-methylbenzophenone, benzophenone-3,3 ', 4,4 tetracarboxylic dianhydride, 4,4'-bis (dimethylamino) benzophenone,
- UV activators are particularly well suited since, for example, benzophenone has a relative UV absorption maximum in the range from 320 to 380 nm.
- the content of UV activators should be between 0.1 phr and 10 phr, preferably between 0.1 phr and 3.0 phr, preferably between 0.25 phr and 2.5 phr, particularly preferably between 0.5 phr and 2, 0 phr are lying.
- “Phr” is a technical definition and means "Part per 100 Rubber”.
- Silane coupling reagents act as adhesion promoters, since these attachment sites are to the glass of the solar module.
- the content of silane coupling reagent is between 0.05 phr and 10 phr, preferably 0.1 phr to 3.0 phr, preferably 0.25 phr to 2.5 phr, more preferably 0.5 phr to 2, 0 phr.
- the ⁇ -olefin-vinyl acetate copolymers used are characterized by high vinyl acetate contents of> 40 wt .-%, based on the total weight of the ⁇ -olefin-vinyl acetate copolymer.
- the vinyl acetate content of the ⁇ -olefin-vinyl acetate copolymers used according to the invention is usually from> 40% by weight to 90% by weight, preferably from 40% by weight to 60% by weight, based on the total weight of the ⁇ Olefin-vinyl acetate copolymers.
- the ⁇ -olefin-vinyl acetate copolymer used may have, in addition to the ⁇ -olefin and vinyl acetate-based monomer units, one or more other comonomer units (e.g., terpolymers), e.g. based on vinyl esters and / or (meth) acrylates.
- the other comonomer units are - as far as further comonomer units in the ⁇ -olefin-vinyl acetate-
- Copolymer present in an amount of up to 10 wt .-%, based on the total weight of the ⁇ -olefin-vinyl acetate copolymer, wherein the proportion of the ⁇ -olefin-based monomer units correspondingly reduced.
- ⁇ -Olefm vinyl acetate copolymers which from> 40 wt .-% to 98 wt .-% vinyl acetate, 2 wt .-% to ⁇ 60 wt .-% ⁇ -Olefm and 0 to 10 wt .-% at least of a further comonomer are constructed, wherein the total amount of vinyl acetate, ⁇ -olefin and the other comonomer is 100 wt .-%.
- ⁇ -olefins all known ⁇ -olefins can be used in the ⁇ -olefin-vinyl acetate copolymers used.
- the ⁇ -olefin is preferably selected from ethene, propene, butene, in particular n-butene and i-butene, pentene, hexene, in particular 1-hexene, heptene and octene, in particular 1-octene.
- ⁇ -olefins may further bear substituents, in particular C 1 -C 5 -alkyl radicals.
- the ⁇ -olefins preferably do not carry any further substituents.
- Preferred ⁇ -olefins are ethene and propene, ethene being particularly preferably used as ⁇ -olefin in the ⁇ -olefin-vinyl acetate copolymers.
- the preferred ⁇ -olefin-vinyl acetate copolymer used in the granules of the present invention is an ethylene-vinyl acetate copolymer.
- Particularly preferred ethylene-vinyl acetate copolymers have a vinyl acetate content of> 40 wt .-% to 90 wt .-%. on. Usually, the preferred ethylene-vinyl acetate copolymers are used with high
- EVM copolymers Vinyl acetate contents referred to as EVM copolymers, wherein the "M" in the name indicates the saturated backbone of the methylene backbone of the EVMs.
- the ⁇ -olefin-vinyl acetate copolymers used preferably ethylene-vinyl acetate copolymers, generally have MFI values (g / 10 min), measured according to ISO 1133 at 190 ° C. and a load of 21.1 N, from 1 to 40, preferably 1 to 35 on.
- the Mooney viscosity according to DIN 53 523 ML 1 + 4 at 100 0 C are generally from 3 to 50, preferably 4 to 40 Mooney units.
- the number-average molecular weight (Mw), as determined by GPC, is generally from 5,000 g / mol to 800,000 g / mol, preferably from 100,000 g / mol to 400,000, more preferably from 500,000 g / mol.
- inventive solar module ethylene-vinyl acetate copolymers, which are commercially available, for example under the trade names Levapren® ® or Levamelt® ® Lanxess Germany GmbH.
- additives such as fillers, light stabilizers (especially UV protectants), acid scavengers, coagents or anti-aging agents can be added.
- light stabilizers can be 2-hydroxybenzophenones of the general formula
- R H, aryl, alkyl, alkenyl or alkynyl
- R ' H, aryl, alkylaryl, alkyl, alkenyl, alkynyl, OH or alkoxy
- the light stabilizer is preferably 2-hydroxy-4-methoxybenzophenone.
- HALS reagents sodium EDTA, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite
- R H, alkyl, alkoxy.
- R '; R "and R '" the tetramethylpiperidine units can be bridged to dimers or oligomers.
- Tinuvin 770 is used.
- 0.5 to 2 phr of class 1 are used. Particularly preferred are 0.08 to 1 phr and preferably also 0.09 to 0.6 phr.
- the amount of class 2 is preferably 0.05 to 1 phr, more preferably 0.05 to 2 and most preferably 0.05 to 0.4 phr.
- Classes 1 and 2 can be used either individually or together, with the ratio Class 1 to Class 2 preferably 3: 2.
- UV crosslinking can be ensured despite the presence of UV protectants.
- the UV protectants develop their protective function during UV crosslinking by keto-enol tautomerism. They are however restored to their original form once the UV irradiation is stopped.
- the UV protectants "capture” some of the UV light and release it later, so they can continue to function as UV protectors in finished solar panels, whereas UV activators after UV irradiation are still used It is therefore important, on the one hand, to use UV activators which are almost consumed for UV crosslinking and, on the other hand, to use UV protectants which, after UV crosslinking, again have their UV protective function.
- polycarbodiimides can be used, wherein preferably 0.05 to 5 phr, more preferably 0.05 to 2 phr and very preferably 0.5 to 0.75 phr are used.
- Conventional anti-aging agents e.g. Naugard TNPP can also be used.
- the amount to be used is 0.05 to 5 phr, preferably 0.5 to 2 phr and more preferably 0.5 to 1 phr.
- the coagents are for example
- Trimethylolpropane trimethacrylate having the structural formula
- Particularly preferably used ⁇ -olefin copolymers are the ethylene-vinylacetate copoly- mers Levamelt ® 400, Levamelt 450, Levamelt 452, Levamelt 456 ®, ® Levamelt 500, Levamelt 600,
- MAHg-EVM maleic anhydride
- compounding refers to the admixture of dyes, fillers, lubricants, processing aids, plasticizers, aging, sunscreen, flame retardants, antistatic agents, etc., to the polymer for producing workable plastics / elastomers; It also includes alloying (blending, blending) with other plastics or recyclates.
- the molding compound is heated, mixed, optionally degassed as granules, powder, agglomerate or millbase, and then usually extruded under pressure at elevated temperatures.
- the hot extrudate is withdrawn and calibrated depending on the polymer in the form of, for example, sheets or sheets of different thickness / thickness.
- the extrudate then runs over a cooling section, is then laterally trimmed and rolled up or stacked as plate goods.
- steps 1 and 2 can be combined in the film production and in this way cost and time can be saved. It is conceivable that the granules according to the invention contain compounding additives so that they can then be made available as a finished molding composition for film production. Such adhesive films produced have a high weathering stability. In particular, the embedded solar cells are protected against corrosion by barrier action against water vapor and oxygen.
- the prior art discloses a process for the preparation of the ⁇ -olefin polymers in question.
- Vinyl acetate copolymers having a vinyl acetate content of> 40 wt -.%, Based on the total weight of the ⁇ -olefin-vinyl acetate copolymer known, which by a solution polymerization process at a pressure of 100 to 700 bar, preferably at a pressure of 100 to 400 bar, is carried out at temperatures of 50 to 150 0 C, which radical initiators are generally used.
- Suitable preparation processes are mentioned, for example, in EP-A 0 341 499, EP-A 0 510 478 and DE-A 38 25 450.
- the produced by the solution polymerization process at a pressure of 100 to 700 bar ⁇ -olefin-vinyl acetate copolymers with high vinyl acetate contents are characterized in particular by low degrees of branching and thus low viscosities. Furthermore, they have a statistically uniform distribution of their building blocks ( ⁇ -olefin and vinyl acetate).
- the selection of the appropriate solvent is of particular importance. Usually, the solvent is removed after evaporation by evaporation in vacuo, while the added during production or workup additives, namely the UV activators and silane coupling reagents are not removed. For this reason, it is necessary that the boiling point of the solvent is below the boiling points of the aggregates.
- the solvent must also be selected taking into account the boiling points of these additives, so that they are not removed.
- the solvents used are preferably tert-butanol, methanol, benzene, toluene, methyl acetate or dialkyl sulfoxide. These solvents have the lowest radical transfer tendency and can thus be used in the continuous process of solution polymerization.
- Another invention relates to a solar module comprising at least one adhesive film of the granules according to the invention.
- the solar module according to the invention can be any solar module known to the person skilled in the art. Suitable solar modules are mentioned below.
- the solar module according to the invention is made up of the following layers: i) a glass substrate having a front and a back side, the front side being the side facing the sun in the finished solar module; ii) a transparent adhesive film applied to the back surface of the glass substrate; iii) one or more solar cells applied to the adhesive film; iv) another, applied to the solar cells transparent adhesive film; and v) a protective layer; or again a glass substrate for glass-glass laminates. wherein the solar cells are embedded in the transparent adhesive films, wherein one of the transparent adhesive films is composed at least of the adhesive film according to the invention.
- the solar module according to the invention additionally comprises a junction box and a connection terminal and, if it is a rigid solar module, a frame, preferably an aluminum profile frame.
- a junction box and a connection terminal and, if it is a rigid solar module, a frame, preferably an aluminum profile frame.
- a frame preferably an aluminum profile frame.
- glass substrate glass panes are suitable, whereby preferably a so-called single-pane
- Glass substrate is to be understood as including other transparent substrates, such as polycarbonate, for example.
- Glass substrates may also have a structured surface here Adhesive films are ⁇ -olefin-vinyl acetate copolymers, in particular ethylene
- Vinyl acetate copolymers wherein at least one adhesive film, preferably both adhesive films, from the adhesive films of the invention, which are defined above, are constructed.
- Suitable solar cells are silicon cells, which may be thick-film cells (monocrystalline or polycrystalline cells) or thin-film cells (amorphous silicon or crystalline silicon); III-V semiconductors
- Solar cells (GaAs cells); II-VI-HaIb ladder solar cells (CdTe cells); CIS cells (copper indium diselenide or copper indium disulfide) or CIGS cells (copper indium gallium diselenide); organic solar cells, dye cells (Grätzel cells) or semiconductor electrolyte cells (eg, copper oxide / NaCl solution); wherein silicon cells are preferably used.
- silicon cells are preferably used.
- all known to the expert types of silicon cells can be used, for.
- Mono- crystalline cells, polycrystalline cells, amorphous cells, microcrystalline cells or tandem solar cells, the z. B. are constructed of a combination of polycrystalline and amorphous cells.
- the solar module according to the invention contains a plurality of solar cells, which are electrically interconnected, for example, by so-called solder ribbons.
- the solar cells are embedded in the transparent adhesive films.
- Suitable processes for producing the solar cells are known to the person skilled in the art.
- the solar module according to the invention contains a protective layer which is applied to one of the transparent adhesive films.
- the protective layer is generally a weather-resistant protective layer, which forms the back side (back side covering) of the solar module.
- This is usually a plastic film, in particular a plastic composite film, for example composed of polyvinyl fluoride, e.g. Tedlar from DuPont, or polyester or glass.
- the junction box preferably additionally present in the solar module according to the invention is, for example, a junction box with free-wheeling diode or bypass diode. These freewheeling or bypass diodes are required to protect the solar module when, for example, due to shading or a defect, no power is supplied through the solar module.
- the solar module preferably has a connection terminal, which allows the connection of the solar module to a solar power system.
- the solar module according to the invention is prepared by customary methods known to the person skilled in the art.
- the appropriate, generally cleaned glass Substrate provided, whereupon the transparent adhesive film, which is preferably made of the erfmdungs- according to granules, is applied.
- the transparent adhesive film is cut to size prior to application to the glass substrate.
- the solar cells are positioned on the transparent adhesive film, wherein they are generally previously connected by means of so-called Lötbändchen to individual strands (strings).
- the further transparent adhesive film which is likewise preferably produced from the granules according to the invention, and is generally cut to size before application, is applied.
- the application of the protective layer takes place.
- the solar module according to the invention is laminated.
- the lamination is carried out by methods known in the art, for example at reduced pressure and elevated temperature (for example 100 to 200 ° C.).
- elevated temperature for example 100 to 200 ° C.
- junction box is set and the module framed.
- the known EVA hot melt adhesive is melted under heat and thermally crosslinked by free radical generating peroxides. Due to the relatively slow crosslinking of the EVA hot melt adhesive, cycle times of about 20 to 30 minutes per module occur.
- the cycle time can be significantly reduced, resulting in cost savings. Cycle time reduction is made possible by the elimination of thermally induced peroxidic crosslinking.
- the erfmdungshacke process for producing a solar module is characterized in that the solar module is subjected to UV irradiation. UV irradiation cross-links the embedding material so that the solar cells are protected against environmental influences.
- the UV irradiation is carried out directly after lamination.
- the module is already preheated and the diffusion speed of the UV activator is optimally adapted to the UV
- the duration of the irradiation is preferably between 10 and 600 seconds, preferably between 10 and 180 seconds. This significantly shortens the production of the solar modules, because the relatively long curing time during the lamination of a conventional EVA adhesive film can be dispensed with.
- the temperature during the UV irradiation is preferably 50 ° C. to 200 ° C. This can be achieved by preferably using the modules directly after the lamination or during the UV crosslinking, but this prolongs the irradiation time accordingly.
- the irradiation time depends on the power of the UV radiator, on the distance between the UV radiator and the module and on the irradiation surface.
- UV protection agents are added, it should be noted that the irradiation time is set so that the UV light is sufficient for UV crosslinking, as part of the UV light is "intercepted" by the UV protection agents, such as described above.
- the method according to the invention is therefore suitable for the production of solar modules both with the adhesive films according to the invention and with conventional EVA films as embedding material, these having at least one UV activator and at least one silane coupling reagent.
- the solar modules according to the invention may have a structure according to the above-mentioned examples or else a different construction.
- Other types of solar modules are known in the art. Examples are laminated glass-glass modules, glass-glass modules in cast resin technology, glass-glass modules in laminated safety film technology, thin-film modules behind glass or as a flexible coating, for example on copper tape, concentrator modules, wherein the sunlight with Help of optics is focused on smaller solar cells, as well as fluorescence collectors.
- Another object of the present invention is the device for the production of solar modules, which has a UV lamp.
- UV lamps which are suitable for UV crosslinking of the granules or adhesive films are used here. Particularly advantageous here is the simple and cost-effective upgrade of conventional solar module manufacturing devices. It is conceivable to equip an already existing semi-automatic or fully automatic module production line additionally with a UV emitter. It requires neither a costly conversion of the existing device nor the establishment of a completely new device, which means a significant economic or financial advantage in terms of time and cost factor.
- the UV emitter is placed directly after the lamination device, such as a vacuum laminator.
- the lamination device such as a vacuum laminator.
- the already heated solar modules are fed directly to the UV irradiation.
- the irradiation temperature is thus predetermined by the lamination, which in turn is reflected in time and cost savings.
- the device according to the invention is therefore suitable for the production of solar modules both with the inventive adhesive films and with conventional EVA films as embedding material, these having at least one UV activator and at least one silane coupling reagent. It is conceivable that the solar modules according to the invention are used for stationary and mobile power generation.
- the power is generated in a solar power system having at least one inventive solar module, wherein the light energy of the sun is converted into electrical energy and at least one electrical load.
- a further subject of the present invention is thus a solar power system containing at least one solar module according to the invention.
- Suitable electrical consumers depend on the type of solar power system.
- the consumer may be a DC consumer or an AC consumer.
- an AC load When an AC load is connected, it is necessary to supply the DC power obtained from the solar modules by means of an inverter
- the solar power system can also be a stand-alone system that has no (direct) connection to a power grid.
- the electricity obtained in an island system is buffered in accumulators as energy storage (consumers in the sense of the present application).
- Suitable island systems are known to the person skilled in the art.
- the solar power systems can be grid-connected systems, wherein the solar power system is connected to an independent power grid and the electrical energy is fed into this power grid. In this case, the consumer is thus the power grid.
- Suitable grid-connected systems are also known to the person skilled in the art.
- Table 1 shows the stress-strain behavior of granules according to the invention before and after UV irradiation.
- the exposure setting of the irradiated sample was 3 minutes.
- the sample was 10 min. preheated at 140 0 C, then for a period of 3 min. irradiated with a UV lamp Fe @ 2kW Fa. Hönle, with a distance of 10 cm to the UV lamp.
- Tab. 2 shows an increase in the Mooney viscosity as a function of the irradiation time of the Levapren 400 with the addition of 1.0 phr of UV crosslinking agent, this being determined by means of a UV lamp Fe @ 2kW from Hönle at a distance of 10 cm irradiated to the UV lamp.
- Table 3 shows the change in the tensile-elongation behavior with different amounts of UV crosslinker at 1 min. Irradiation, using a UV lamp Fe @ 2kW Fa. Hönle with a distance of 10 cm to the UV lamp.
- Table 4 shows the change in the tensile-elongation behavior at different exposure times of the composition from Tab. 2, with a UV lamp Fe @ 2kW Fa. Hönle at a distance of 10 cm to the UV lamp.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Photovoltaic Devices (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Adhesive Tapes (AREA)
Abstract
L'invention concerne des granulés formés de copolymères d'α-oléfine-acétate de vinyle ayant une teneur en acétate de vinyle > 40 % en poids par rapport au poids total des copolymères d'α-oléfine-acétate de vinyle, en tant que matériau de garniture pour des modules solaires, les granulés présentant, comme additifs, au moins un activateur d'UV et au moins un réactif de couplage au silane. L'invention concerne en outre l'utilisation de ces granulés pour la production de films pour modules solaires.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009036534A DE102009036534A1 (de) | 2009-08-07 | 2009-08-07 | EVM-Granulat |
PCT/EP2010/061287 WO2011015579A1 (fr) | 2009-08-07 | 2010-08-03 | Granulés à base de copolymères evm en tant que matériau de garniture pour modules solaires, leurs procédés de fabrication, un film adhésif, ainsi qu'un module solaire, ses procédés de fabrication et un dispositif de fabrication |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2462627A1 true EP2462627A1 (fr) | 2012-06-13 |
Family
ID=42731914
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10737343A Withdrawn EP2462627A1 (fr) | 2009-08-07 | 2010-08-03 | Granulés à base de copolymères evm en tant que matériau de garniture pour modules solaires, leurs procédés de fabrication, un film adhésif, ainsi qu'un module solaire, ses procédés de fabrication et un dispositif de fabrication |
Country Status (13)
Country | Link |
---|---|
US (1) | US20120190766A1 (fr) |
EP (1) | EP2462627A1 (fr) |
JP (1) | JP2013500889A (fr) |
KR (1) | KR20120048005A (fr) |
CN (1) | CN102473783A (fr) |
AU (1) | AU2010280819A1 (fr) |
BR (1) | BR112012002750A2 (fr) |
DE (1) | DE102009036534A1 (fr) |
MX (1) | MX2012001606A (fr) |
SG (1) | SG178284A1 (fr) |
TW (1) | TW201109352A (fr) |
WO (1) | WO2011015579A1 (fr) |
ZA (1) | ZA201200877B (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2015056069A1 (fr) * | 2013-10-15 | 2015-04-23 | Meyer Burger Ag | Procédé et système de formation de stratifiés |
CN104031567B (zh) * | 2013-12-27 | 2015-06-17 | 杭州福斯特光伏材料股份有限公司 | 一种双重引发的快速交联eva胶膜 |
CN104795465A (zh) * | 2015-04-10 | 2015-07-22 | 杭州福斯特光伏材料股份有限公司 | 一种太阳能电池组件的封装方法 |
JP7145122B2 (ja) * | 2019-06-06 | 2022-09-30 | 信越化学工業株式会社 | シロキサン及びその製造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0635575B2 (ja) * | 1984-04-24 | 1994-05-11 | 株式会社ブリヂストン | 封止用組成物及び該組成物による封止方法 |
JPS62158509A (ja) * | 1985-12-28 | 1987-07-14 | Ishikawajima Harima Heavy Ind Co Ltd | 圧延機 |
DE3815946A1 (de) | 1988-05-10 | 1989-11-23 | Bayer Ag | Loesungspolymerisation zur herstellung von gelfreien ethylen/vinylacetat-copolymerisaten |
DE3825450C2 (de) | 1988-07-27 | 1997-07-10 | Bayer Ag | Verfahren zur Herstellung von Ethylen/Vinylacetat-Copolymerisaten mit verringerter Klebeneigung |
DE3843563A1 (de) * | 1988-12-23 | 1990-06-28 | Bayer Ag | Verfahren zur herstellung von ethylen/vinylacetat-copolymerisaten mit erhoehter festigkeit, neue ethylen/vinylacetat-copolymerisate und ihre verwendung |
DE4113291A1 (de) | 1991-04-24 | 1992-10-29 | Bayer Ag | Herstellung von ethylen-vinylacetat-copolymeren |
WO1997022637A1 (fr) | 1995-12-19 | 1997-06-26 | Midwest Research Institute | Materiau d'enrobage pour dispositif photovoltaique |
JPH11317475A (ja) * | 1998-02-27 | 1999-11-16 | Canon Inc | 半導体用封止材樹脂および半導体素子 |
AU7960200A (en) | 1999-11-01 | 2001-05-14 | Bridgestone Corporation | Sealing composition and sealing method |
JP2000183386A (ja) * | 2000-01-01 | 2000-06-30 | Bridgestone Corp | 太陽電池封止材 |
WO2001061763A1 (fr) | 2000-02-18 | 2001-08-23 | Bridgestone Corporation | Film d'etancheite pour cellule solaire et procede de fabrication de cellule solaire |
JP2003051605A (ja) | 2001-08-06 | 2003-02-21 | Haishiito Kogyo Kk | 太陽電池封止用シート |
JP2003049004A (ja) | 2001-08-06 | 2003-02-21 | Mitsubishi Plastics Ind Ltd | 軟質樹脂シート、太陽電池用充填材及びそれを用いた太陽電池 |
JP4779074B2 (ja) * | 2003-10-03 | 2011-09-21 | 三井・デュポンポリケミカル株式会社 | 太陽電池封止材用シート |
US20070259998A1 (en) | 2004-06-08 | 2007-11-08 | Bridgestone Corporation | Resin Film |
JP2006198922A (ja) * | 2005-01-21 | 2006-08-03 | Mitsui Chemicals Inc | 太陽電池モジュール用保護シートおよび太陽電池モジュール。 |
WO2007116928A1 (fr) * | 2006-04-05 | 2007-10-18 | Bridgestone Corporation | Film d'etancheite pour pile solaire et pile solaire dotee de celui-ci |
DE102007041055A1 (de) | 2007-08-29 | 2009-03-05 | Lanxess Deutschland Gmbh | EVM in Solarmodulen |
JP4755667B2 (ja) * | 2008-04-09 | 2011-08-24 | 旭化成イーマテリアルズ株式会社 | 樹脂封止シート |
-
2009
- 2009-08-07 DE DE102009036534A patent/DE102009036534A1/de not_active Withdrawn
-
2010
- 2010-08-03 BR BR112012002750A patent/BR112012002750A2/pt not_active IP Right Cessation
- 2010-08-03 KR KR1020127005899A patent/KR20120048005A/ko not_active Application Discontinuation
- 2010-08-03 MX MX2012001606A patent/MX2012001606A/es not_active Application Discontinuation
- 2010-08-03 US US13/389,006 patent/US20120190766A1/en not_active Abandoned
- 2010-08-03 WO PCT/EP2010/061287 patent/WO2011015579A1/fr active Application Filing
- 2010-08-03 JP JP2012523318A patent/JP2013500889A/ja active Pending
- 2010-08-03 AU AU2010280819A patent/AU2010280819A1/en not_active Abandoned
- 2010-08-03 EP EP10737343A patent/EP2462627A1/fr not_active Withdrawn
- 2010-08-03 SG SG2012008264A patent/SG178284A1/en unknown
- 2010-08-03 CN CN2010800350768A patent/CN102473783A/zh active Pending
- 2010-08-06 TW TW099126182A patent/TW201109352A/zh unknown
-
2012
- 2012-02-06 ZA ZA2012/00877A patent/ZA201200877B/en unknown
Non-Patent Citations (1)
Title |
---|
See references of WO2011015579A1 * |
Also Published As
Publication number | Publication date |
---|---|
ZA201200877B (en) | 2013-04-24 |
US20120190766A1 (en) | 2012-07-26 |
DE102009036534A1 (de) | 2011-02-10 |
JP2013500889A (ja) | 2013-01-10 |
SG178284A1 (en) | 2012-03-29 |
TW201109352A (en) | 2011-03-16 |
CN102473783A (zh) | 2012-05-23 |
KR20120048005A (ko) | 2012-05-14 |
MX2012001606A (es) | 2012-03-29 |
WO2011015579A1 (fr) | 2011-02-10 |
BR112012002750A2 (pt) | 2019-09-24 |
AU2010280819A1 (en) | 2012-03-15 |
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