EP2348248A1 - Built-in LED light with supporting plate - Google Patents

Built-in LED light with supporting plate Download PDF

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Publication number
EP2348248A1
EP2348248A1 EP10014725A EP10014725A EP2348248A1 EP 2348248 A1 EP2348248 A1 EP 2348248A1 EP 10014725 A EP10014725 A EP 10014725A EP 10014725 A EP10014725 A EP 10014725A EP 2348248 A1 EP2348248 A1 EP 2348248A1
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EP
European Patent Office
Prior art keywords
led
flush
support plate
led light
led module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10014725A
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German (de)
French (fr)
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EP2348248B1 (en
Inventor
Volker Gerrath
Sven Dipl.-Ing. Diehl
Robert Dipl.-Ing. Zapp
Manfred Dipl.-Ing. Lange
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ABB AG Germany
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ABB AG Germany
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Publication of EP2348248A1 publication Critical patent/EP2348248A1/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02—Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F21V21/04—Recessed bases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a flush-mounted LED light with support plate (support ring) for installation in a standard flush-mounted device box (especially according to DIN 49073).
  • From the DE 203 13 428 U1 is known from a mounting plate, a light-emitting diodes and possibly other electronic components printed circuit board with power supply lines, a light distribution panel and a frame with a light exit opening existing light known.
  • the power supply lines are led to a connection box arranged essentially behind the luminaire, in which a transformer which can be connected to the power network is arranged.
  • the connection cables of several luminaires behind a wall covering can be routed to a central connection point where a low-voltage source (transformer) is installed.
  • an installation switch or button with device base, rocker and lighting wherein a light guide is arranged on the back of the rocker and wherein in the device base a lamp holder is arranged with a lamp whose light radiates into a light entry surface of the light guide.
  • the rocker has a mounted on its installation switch or button, preferably in the direction of floor side edge on a light exit opening, which receives a light exit surface of the light guide, so that the mounted below the Installation switch or button located floor is lit.
  • the lamp is turned on only in the off position of the rocker, while the lamp remains switched off in the on position of the rocker.
  • the installation switch or pushbutton can also be mounted rotated by 180 °, so that the light exit opening radiates towards the ceiling, which leads to a very bright, preferably white ceiling for the reflection of the radiated light. whereby the desired floor lighting is realized.
  • the invention has for its object to provide a flush-mounted LED light with support plate, which is optimized in terms of cooling of the LED bulb.
  • any heating of the LED light source is forwarded immediately to the formed of a metal good thermal conductivity and a relatively large surface having support plate.
  • the support plate at least partially touches the front edge of the UP device box and in particular the wall in which the device box is installed.
  • the heat emitted by the LED lamp to the support plate heat can be widely distributed to the wall, resulting in a continuous heat transfer. Accordingly, it is reliably prevented that an undesirably high temperature can set itself on the LED lighting means.
  • the flush-mounted LED light is of course completed with a cover for the LED bulb as a "central disc” and a cover, so that a beautiful integration / integration in an installation equipment program respectively switch and socket program and a combination with other devices, such Switches / buttons / dimmers / sockets of this switch and socket program is possible.
  • Fig. 1 is a perspective view of the front side of a flush-mounted LED light in the form of an "Exp) sion drawing" shown. It can be seen a support plate 5 (support ring) and an LED module 8 of the flush-mounted LED light 1, wherein the support plate 5 over a large area over the entire front surface of a device base 3, not shown (see Fig. 2 ) and only has a recess 7 for the passage of electrical connections between the device base 3 and LED module 8.
  • the support plate 5 is provided in its central portion with a dimensioned according to the dimensions of the LED module 8 bead 6 for flush with respect to the front mounting of the LED module 8.
  • the LED module 8 has a printed circuit board 10, on which an LED lighting means 9 and optionally further components are installed. To realize a connection device of the LED module 8, the soldering points 11 of a connector are sketched on the circuit board 10, which engages through the recess 7 so as to contact a corresponding thereto plug-in device of the device base.
  • Fig. 2 is a side section represented by a flush-mounted LED light. It is a installed in a wall 19 commercially available flush-mounted box 20 can be seen, which receives the device base 3 of the flush-mounted LED light 1.
  • a converter 4 power supply, LED driver
  • the open-circuit and short-circuit proof converter 4 supplies a constant direct current, z. B. 350 mA.
  • the electrical connection between the LED module 8 and the device base 3 via a connector is outlined - see the solder points 11. It is easy to see how the LED module 8 "immersed" in the bead 6 of the support plate 5, only the bulb 9 protrudes slightly over the front of the flush-mounted LED light 1.
  • the essential criterion here is that the support plate 5 is used as a heat sink for the at least one LED light source 9, to which a direct contact or contact via a thermally well-conductive intermediate carrier between LED light source 9 and support plate 5 is realized.
  • FIGS. 3, 4, 5 different embodiments are given for this purpose.
  • Fig. 3 is a thermal contact between LED bulb and support plate shown by a bead. It is easy to see that a bead 14 is introduced into the support plate 5, wherein the at least one LED light source 9 directly thermally contacts this bead through a recess 12 in a printed circuit board 10 of the LED module 8 carrying the LED light source.
  • Fig. 4 is a thermal contact between LED bulb and support plate represented by solder capillaries.
  • the printed circuit board 10 of the LED module 8 carrying the at least one LED illuminant 9 has solder capillaries 16 filled with solder for thermal contact with the support plate 5 directly at the location of the LED illuminant.
  • solder capillaries a multiplicity of fine holes are made in the printed circuit board, which are suitable for sucking liquid solder.
  • Fig. 5 is a thermal contact between the LED bulb and support plate on a (e) solder pad / thermal foil or a continuously laminated aluminum core printed circuit board shown. It is good to realize that this is the least one LED bulb 9 carrying the printed circuit board 10 of the LED module 8 directly at the location of the LED bulb (e) solder pad / heat film 15 for the thermal contact of the LED bulb 9 with the support plate 5 has.
  • Fig. 6 is an alternative embodiment of the embodiment according to Fig. 1 shown in which the support plate 5 of the flush-mounted LED light 1 in the four corners of the bead 6 with recesses 23 for the passage of electrical connections - see pins 25 in Fig. 7 - Is provided between the device base 3 and LED module 8.
  • solder pads 22 are sketched in the circuit board 10.
  • Fig. 7 is an example of the electrical contact between the LED module and device base shown, in which the electrical connections between the device base 3 and LED module 8 of the flush-mounted LED lamp 1 in the form of pins 25 of the converter 4 are formed, which in on the circuit board 10 of the LED module 8 soldered connection sleeves 24 engage.
  • solder points 22 the electrical connection of the connection sleeves 24 is sketched on the circuit board 10.
  • the electrical contact can also be made by direct soldering between the pins 25 and the circuit board.

Abstract

The LED-light (1) has an appliance base holding a carrier plate (5) and including a converter with an attachment unit for a 230V power cable and a connecting device for connecting an LED module (8) and an LED lamp (9). The carrier plate extends a large surface over an entire front surface of the appliance base, and includes an opening for an electrical connector between the appliance base and the LED module. The carrier plate is utilized as a cooling body for the LED lamp, and an intermediate carrier is thermally connected between the LED lamp and the carrier plate.

Description

Die Erfindung betrifft eine Unterputz-LED-Leuchte mit Tragplatte (Tragring) für den Einbau in eine handelsübliche UP-Gerätedose (insbesondere nach DIN 49073).The invention relates to a flush-mounted LED light with support plate (support ring) for installation in a standard flush-mounted device box (especially according to DIN 49073).

Aus der DE 203 13 428 U1 ist eine aus einer Montageplatte, einer mit Leuchtdioden und gegebenenfalls weiteren elektronischen Bauteilen bestückten Leiterplatte mit Stromzuführungsleitungen, einer Lichtverteilungsscheibe und einem Blendrahmen mit einer Lichtaustrittsöffnung bestehende Leuchte bekannt. Die Stromzuführungsleitungen sind zu einer im Wesentlichen hinter der Leuchte angeordneten Anschlussdose geführt, in der ein an das Stromnetz anschließbarer Transformator angeordnet ist. Es können die Anschlussleitungen mehrerer Leuchten hinter einem Wandbelag (Fliesen, Fliesenspiegel) zu einer zentralen Anschlussstelle geführt sein, an der eine Niederspannungsquelle (Trafo) installiert ist.From the DE 203 13 428 U1 is known from a mounting plate, a light-emitting diodes and possibly other electronic components printed circuit board with power supply lines, a light distribution panel and a frame with a light exit opening existing light known. The power supply lines are led to a connection box arranged essentially behind the luminaire, in which a transformer which can be connected to the power network is arranged. The connection cables of several luminaires behind a wall covering (tiles, tile mirrors) can be routed to a central connection point where a low-voltage source (transformer) is installed.

Aus der DE 10 2007 001 850 B3 ist ein Installationsschalter oder -taster mit Gerätesockel, Wippe und Beleuchtung bekannt, wobei ein Lichtleiter an der Rückseite der Wippe angeordnet ist und wobei im Gerätesockel ein Lampenhalter mit einer Lampe angeordnet ist, deren Licht in eine Lichteintrittsfläche des Lichtleiters strahlt. Die Wippe weist an ihrer bei montiertem Installationsschalter oder -taster vorzugsweise in Richtung Fußboden weisenden Seitenkante eine Lichtaustrittsöffnung auf, welche eine Lichtaustrittsfläche des Lichtleiters aufnimmt, so dass der unterhalb des montierten Installationsschalters oder -tasters befindliche Fußboden erhellt wird. Bei Ausführung als Installationsschalter mit zwei unterschiedlichen Stellungen der Wippe wird die Lampe lediglich in der Ausschalt-Stellung der Wippe eingeschaltet, während die Lampe in der Einschalt-Stellung der Wippe ausgeschaltet bleibt. Zwar strahlt die Lichtaustrittsöffnung vorzugsweise in Richtung Fußboden, alternativ kann der Installationsschalter oder -taster jedoch auch um 180° gedreht montiert werden, so dass die Lichtaustrittsöffnung in Richtung Decke strahlt, was bei einer sehr hellen, vorzugsweise weißen Decke zur Reflexion des abgestrahlten Lichts führt, wodurch die gewünschte Fußbodenbeleuchtung realisiert wird.From the DE 10 2007 001 850 B3 an installation switch or button with device base, rocker and lighting is known, wherein a light guide is arranged on the back of the rocker and wherein in the device base a lamp holder is arranged with a lamp whose light radiates into a light entry surface of the light guide. The rocker has a mounted on its installation switch or button, preferably in the direction of floor side edge on a light exit opening, which receives a light exit surface of the light guide, so that the mounted below the Installation switch or button located floor is lit. When designed as an installation switch with two different positions of the rocker, the lamp is turned on only in the off position of the rocker, while the lamp remains switched off in the on position of the rocker. Although the light exit opening radiates preferably in the direction of the floor, alternatively, the installation switch or pushbutton can also be mounted rotated by 180 °, so that the light exit opening radiates towards the ceiling, which leads to a very bright, preferably white ceiling for the reflection of the radiated light. whereby the desired floor lighting is realized.

Allgemein besteht bei in handelsüblichen UP-Gerätedosen montierbaren Installationsgeräten die Problematik der Abfuhr von durch das Leuchtmittel und zugeordnete elektronische Baukomponenten erzeugter Wärme an die Außenatmosphäre. Bei Verwendung eines LED-Leuchtmittels ist es bezüglich der Lebensdauer des LED-Leuchtmittels vorteilhaft, wenn das LED-Leuchtmittel bei relativ niedrigen Temperaturen betrieben werden kann.In general, there is the problem of the removal of generated by the light source and associated electronic components heat to the outside atmosphere when installed in standard flush mounted device boxes installation equipment. When using an LED bulb, it is advantageous in terms of the life of the LED bulb when the LED bulb can be operated at relatively low temperatures.

Der Erfindung liegt die Aufgabe zugrunde, eine Unterputz-LED-Leuchte mit Tragplatte anzugeben, welche hinsichtlich der Kühlung des LED-Leuchtmittels optimiert ist.The invention has for its object to provide a flush-mounted LED light with support plate, which is optimized in terms of cooling of the LED bulb.

Diese Aufgabe wird erfindungsgemäß gelöst durch eine Unterputz-LED-Leuchte für den elektrischen und mechanischen Anschluss in einer handelsüblichen UP-Gerätedose,

  • mit einem eine Tragplatte besitzenden Gerätesockel, welcher einen Konverter inklusive Anschlusseinheit für 230V-Netzleitungen und eine Anschlussvorrichtung zum Anschluss eines LED-Moduls mit mindestens einem LED-Leuchtmittel aufweist,
  • wobei sich die Tragplatte großflächig über die gesamte Frontfläche des Gerätesockels erstreckt und lediglich mindestens eine Ausnehmung zum Durchgriff elektrischer Verbindungen zwischen Gerätesockel und LED-Modul aufweist
  • und wobei die Tragplatte als Kühlkörper für das mindestens eine LED-Leuchtmittel herangezogen wird, wozu ein unmittelbarer Kontakt oder ein Kontakt über einen thermisch gut leitenden Zwischenträger zwischen LED-Leuchtmittel und Tragplatte realisiert ist.
This object is achieved by a flush-mounted LED light for electrical and mechanical connection in a standard flush-mounted device box,
  • with a device base having a support plate, which has a converter including a connection unit for 230V power lines and a connection device for connecting an LED module with at least one LED illuminant,
  • wherein the support plate extends over a large area over the entire front surface of the device base and only has at least one recess for the passage of electrical connections between the device base and LED module
  • and wherein the support plate is used as a heat sink for the at least one LED light source, for which a direct contact or contact via a thermally highly conductive intermediate carrier between the LED light source and support plate is realized.

Die mit der Erfindung erzielbaren Vorteile bestehen insbesondere darin, dass jedwede Aufheizung des LED-Leuchtmittels unverzüglich an die aus einem Metall guter Wärmeleitfähigkeit gebildeten und eine relativ große Oberfläche aufweisende Tragplatte weitergeleitet wird. Damit wird ein Aufheizen des LED-Leuchtmittels auf eine unerwünscht hohe, die Lebensdauer des LED-Leuchtmittels verkürzende Temperatur unterbunden. Üblicherweise berührt die Tragplatte zumindest teilweise den stirnseitigen Rand der UP-Gerätedose und insbesondere die Wand, in welche die Gerätedose eingebaut ist. So kann die vom LED-Leuchtmittel an die Tragplatte abgegebene Wärme großflächig an die Wand weitergegeben werden, was zu einem kontinuierlichem Wärmeübergang führt. Dementsprechend wird zuverlässig verhindert, dass sich eine unerwünscht hohe Temperatur am LED-Leuchtmittel selbst einstellen kann.The achievable with the invention advantages are in particular that any heating of the LED light source is forwarded immediately to the formed of a metal good thermal conductivity and a relatively large surface having support plate. This prevents heating of the LED illuminant to an undesirably high temperature which shortens the life of the LED illuminant. Usually, the support plate at least partially touches the front edge of the UP device box and in particular the wall in which the device box is installed. Thus, the heat emitted by the LED lamp to the support plate heat can be widely distributed to the wall, resulting in a continuous heat transfer. Accordingly, it is reliably prevented that an undesirably high temperature can set itself on the LED lighting means.

Die Unterputz-LED-Leuchte wird selbstredend komplettiert mit einer Abdeckung für das LED-Leuchtmittel als "Zentralscheibe" und einem Abdeckrahmen, so dass eine formschöne Einbindung / Integration in ein Installationsgeräte -Programm respektive Schalter- und Steckdosenprogramm sowie eine Kombination mit weiteren Geräten, beispielsweise Schaltern / Tastern / Dimmern / Steckdosen dieses Schalter- und Steckdosenprogramms möglich ist.The flush-mounted LED light is of course completed with a cover for the LED bulb as a "central disc" and a cover, so that a beautiful integration / integration in an installation equipment program respectively switch and socket program and a combination with other devices, such Switches / buttons / dimmers / sockets of this switch and socket program is possible.

Vorteilhafte Ausgestaltungen der Erfindung sind in den Unteransprüchen gekennzeichnet.Advantageous embodiments of the invention are characterized in the subclaims.

Die Erfindung wird nachstehend an Hand der in der Zeichnung dargestellten Ausführungsbeispiele erläutert. Es zeigen:

Fig. 1
eine perspektivische Sicht auf die Fronseite einer Unterputz-LED-Leuchte in Form einer "Explosionszeichnung",
Fig. 2
einen seitlichen Schnitt durch eine Unterputz-LED-Leuchte,
Fig. 3
eine thermische Kontaktierung zwischen LED-Leuchtmittel und Tragplatte über eine Sicke,
Fig. 4
eine thermische Kontaktierung zwischen LED-Leuchtmittel und Tragplatte über Löt-Kapillaren,
Fig. 5
eine thermische Kontaktierung zwischen LED-Leuchtmittel und Tragplatte über ein(e) LötpadlWärmefolie oder eine durchgehend kaschierte Aluminium-Kern Leiterplatte,
Fig. 6
eine alternative Ausbildung zum Ausführungsbeispiel gemäß Fig. 1,
Fig. 7
ein Beispiel zur elektrischen Kontaktierung zwischen LED-Modul und Gerätesockel.
The invention will be explained below with reference to the embodiments illustrated in the drawings. Show it:
Fig. 1
a perspective view of the front side of a flush-mounted LED light in the form of an "exploded view",
Fig. 2
a side cut through a flush-mounted LED light,
Fig. 3
a thermal contact between LED lamp and support plate via a bead,
Fig. 4
a thermal contact between LED illuminant and support plate via solder capillaries,
Fig. 5
a thermal contact between the LED lamp and the support plate via a solder pad heat foil or a continuously laminated aluminum core circuit board,
Fig. 6
an alternative embodiment of the embodiment according to Fig. 1 .
Fig. 7
an example of electrical contact between LED module and device base.

In Fig. 1 ist eine perspektivische Sicht auf die Fronseite einer Unterputz-LED-Leuchte in Form einer "Exp)osionszeichnung" dargestellt. Es sind eine Tragplatte 5 (Tragring) und ein LED-Modul 8 der Unterputz-LED-Leuchte 1 zu erkennen, wobei sich die Tragplatte 5 großflächig über die gesamte Frontfläche eines nicht dargestellten Gerätesockels 3 (siehe Fig. 2) erstreckt und lediglich eine Ausnehmung 7 zum Durchgriff elektrischer Verbindungen zwischen Gerätesockel 3 und LED-Modul 8 aufweist. Die Tragplatte 5 ist in ihrem zentralen Abschnitt mit einer entsprechend den Abmessungen des LED-Moduls 8 dimensionierten Sicke 6 für den bezüglich der Frontseite bündigen Einbau des LED-Moduls 8 versehen. Das LED-Modul 8 weist eine Leiterplatte 10 auf, auf welcher ein LED-Leuchtmittel 9 und gegebenenfalls weitere Baukomponenten installiert sind. Zur Realisierung einer Anschlussvorrichtung des LED-Moduls 8 sind auf der Leiterplatte 10 die Lötpunkte 11 eines Steckverbinders skizziert, welcher durch die Ausnehmung 7 greift, um derart eine hierzu korrespondierende Steckvorrichtung des Gerätesockels zu kontaktieren.In Fig. 1 is a perspective view of the front side of a flush-mounted LED light in the form of an "Exp) sion drawing" shown. It can be seen a support plate 5 (support ring) and an LED module 8 of the flush-mounted LED light 1, wherein the support plate 5 over a large area over the entire front surface of a device base 3, not shown (see Fig. 2 ) and only has a recess 7 for the passage of electrical connections between the device base 3 and LED module 8. The support plate 5 is provided in its central portion with a dimensioned according to the dimensions of the LED module 8 bead 6 for flush with respect to the front mounting of the LED module 8. The LED module 8 has a printed circuit board 10, on which an LED lighting means 9 and optionally further components are installed. To realize a connection device of the LED module 8, the soldering points 11 of a connector are sketched on the circuit board 10, which engages through the recess 7 so as to contact a corresponding thereto plug-in device of the device base.

In Fig. 2 ist ein seitlicher Schnitt durch eine Unterputz-LED-Leuchte dargestellt. Es ist eine in einer Wand 19 installierte handelsübliche UP-Gerätedose 20 zu erkennen, welche den Gerätesockel 3 der Unterputz-LED-Leuchte 1 aufnimmt. Im Gerätesockel 3 ist unter Anderem ein Konverter 4 (Netzteil, LED-Treiber) inklusive Steuer-/Regeleinrichtung und Anschlusseinheit für 230V-Netzleitungen für die Versorgung des LED-Leuchtmittels eingebaut. Der leerlauf- und kurzschlussfeste Konverter 4 liefert einen Konstant-Gleichstrom, z. B. 350 mA. Die elektrische Anschlussmöglichkeit zwischen dem LED-Modul 8 und dem Gerätesockel 3 über einen Steckverbinder ist skizziert - siehe die Lötpunkte 11. Es ist gut zu erkennen, wie das LED-Modul 8 in die Sicke 6 der Tragplatte 5 "eintaucht", lediglich das Leuchtmittel 9 ragt geringfügig über die Frontseite der Unterputz-LED-Leuchte 1.In Fig. 2 is a side section represented by a flush-mounted LED light. It is a installed in a wall 19 commercially available flush-mounted box 20 can be seen, which receives the device base 3 of the flush-mounted LED light 1. In the device socket 3 is, inter alia, a converter 4 (power supply, LED driver) including control / regulating device and connection unit for 230V power lines for the supply of the LED bulb installed. The open-circuit and short-circuit proof converter 4 supplies a constant direct current, z. B. 350 mA. The electrical connection between the LED module 8 and the device base 3 via a connector is outlined - see the solder points 11. It is easy to see how the LED module 8 "immersed" in the bead 6 of the support plate 5, only the bulb 9 protrudes slightly over the front of the flush-mounted LED light 1.

Wesentliches Kriterium ist es dabei, dass die Tragplatte 5 als Kühlkörper für das mindestens eine LED-Leuchtmittel 9 herangezogen wird, wozu ein unmittelbarer Kontakt oder ein Kontakt über einen thermisch gut leitenden Zwischenträger zwischen LED-Leuchtmittel 9 und Tragplatte 5 realisiert ist. In den nachfolgenden Figuren 3, 4, 5 sind unterschiedliche Ausführungsbeispiele hierzu angegeben.The essential criterion here is that the support plate 5 is used as a heat sink for the at least one LED light source 9, to which a direct contact or contact via a thermally well-conductive intermediate carrier between LED light source 9 and support plate 5 is realized. In the following FIGS. 3, 4, 5 different embodiments are given for this purpose.

In Fig. 3 ist eine thermische Kontaktierung zwischen LED-Leuchtmittel und Tragplatte über eine Sicke dargestellt. Es ist gut zu erkennen, dass eine Sicke 14 in der Tragplatte 5 eingebracht ist, wobei das mindestens eine LED-Leuchtmittel 9 diese Sicke durch eine Ausnehmung 12 in einer das LED-Leuchtmittel tragenden Leiterplatte 10 des LED-Moduls 8 unmittelbar thermisch kontaktiert. Die elektrische Verbindung des LED-Leuchtmittels 9 erfolgt über seine auf der Leiterplatte 10 verlöteten Leuchtmittel-Anschlussbeine 13.In Fig. 3 is a thermal contact between LED bulb and support plate shown by a bead. It is easy to see that a bead 14 is introduced into the support plate 5, wherein the at least one LED light source 9 directly thermally contacts this bead through a recess 12 in a printed circuit board 10 of the LED module 8 carrying the LED light source. The electrical connection of the LED illuminant 9 via its soldered on the circuit board 10 bulb connection legs 13th

In Fig. 4 ist eine thermische Kontaktierung zwischen LED-Leuchtmittel und Tragplatte über Löt-Kapillaren dargestellt. Es ist gut zu erkennen, dass die das mindestens eine LED-Leuchtmittel 9 tragende Leiterplatte 10 des LED-Moduls 8 unmittelbar am Ort des LED-Leuchtmittels mit Lötzinn gefüllte Löt-Kapillaren 16 für den thermischen Kontakt mit der Tragplatte 5 aufweist. Zur Realisierung dieser Löt-Kapillaren ist eine Vielzahl feiner Bohrungen in der Leiterplatte eingebracht, welche zum Ansaugen flüssigen Lötmittels geeignet sind.In Fig. 4 is a thermal contact between LED bulb and support plate represented by solder capillaries. It can easily be seen that the printed circuit board 10 of the LED module 8 carrying the at least one LED illuminant 9 has solder capillaries 16 filled with solder for thermal contact with the support plate 5 directly at the location of the LED illuminant. For the realization of these solder capillaries, a multiplicity of fine holes are made in the printed circuit board, which are suitable for sucking liquid solder.

In Fig. 5 ist eine thermische Kontaktierung zwischen LED-Leuchtmittel und Tragplatte über ein(e) Lötpad/Wärmefolie oder eine durchgehend kaschierte Aluminium-Kern Leiterplatte dargestellt. Es ist gut zu erkennen, dass die das mindestens eine LED-Leuchtmittel 9 tragende Leiterplatte 10 des LED-Moduls 8 unmittelbar am Ort des LED-Leuchtmittels ein(e) Lötpad/Wärmefolie 15 für den thermischen Kontakt des LED-Leuchtmittels 9 mit der Tragplatte 5 aufweist.In Fig. 5 is a thermal contact between the LED bulb and support plate on a (e) solder pad / thermal foil or a continuously laminated aluminum core printed circuit board shown. It is good to realize that this is the least one LED bulb 9 carrying the printed circuit board 10 of the LED module 8 directly at the location of the LED bulb (e) solder pad / heat film 15 for the thermal contact of the LED bulb 9 with the support plate 5 has.

In Fig. 6 ist eine alternative Ausbildung zum Ausführungsbeispiel gemäß Fig. 1 dargestellt, bei welcher die Tragplatte 5 der Unterputz-LED-Leuchte 1 in den vier Eckbereichen der Sicke 6 mit Ausnehmungen 23 zum Durchgriff elektrischer Verbindungen - siehe Anschlussstifte 25 in Fig. 7 - zwischen Gerätesockel 3 und LED-Modul 8 versehen ist. Für die elektrische Verbindung / Kontaktierung der Anschlussstifte 25 sind entsprechende Lötpunkte 22 in der Leiterplatte 10 skizziert. Bei dieser alternativen Ausbildung ist es von Vorteil, dass der zentral in der Sicke 6 erfolgende Wärmeübergang vom LED-Leuchtmittel 9 zu der Tragplatte 5 in gleichmäßiger Art und Weise und insbesondere nicht behindert durch größere Einschnitte / Ausnehmungen in der Tragplatte 5 in alle Richtungen in Richtung zum Rand der Tragplatte und damit in Richtung Wand erfolgen kann. Dies ist durch entsprechende gestrichelte Pfeile gekennzeichnet.In Fig. 6 is an alternative embodiment of the embodiment according to Fig. 1 shown in which the support plate 5 of the flush-mounted LED light 1 in the four corners of the bead 6 with recesses 23 for the passage of electrical connections - see pins 25 in Fig. 7 - Is provided between the device base 3 and LED module 8. For the electrical connection / contacting of the pins 25 corresponding solder pads 22 are sketched in the circuit board 10. In this alternative embodiment, it is advantageous that the heat transfer occurring centrally in the bead 6 from the LED illuminant 9 to the support plate 5 in a uniform manner and in particular not hindered by larger cuts / recesses in the support plate 5 in all directions in the direction can be done to the edge of the support plate and thus towards the wall. This is indicated by corresponding dashed arrows.

In Fig. 7 ist ein Beispiel zur elektrischen Kontaktierung zwischen LED-Modul und Gerätesockel dargestellt, bei welchem die elektrischer Verbindungen zwischen Gerätesockel 3 und LED-Modul 8 der Unterputz-LED-Leuchte 1 in Form von Anschlussstiften 25 des Konverters 4 ausgebildet sind, welche in an der Leiterplatte 10 des LED-Moduls 8 verlötete Anschlusshülsen 24 eingreifen. Durch entsprechende Lötpunkte 22 ist die elektrische Verbindung der Anschlusshülsen 24 an der Leiterplatte 10 skizziert. Bei einer nicht auswechselbaren Leiterplatte 10 kann die elektrische Kontaktierung auch durch direkte Verlötung zwischen den Anschlussstiften 25 und der Leiterplatte erfolgen.In Fig. 7 is an example of the electrical contact between the LED module and device base shown, in which the electrical connections between the device base 3 and LED module 8 of the flush-mounted LED lamp 1 in the form of pins 25 of the converter 4 are formed, which in on the circuit board 10 of the LED module 8 soldered connection sleeves 24 engage. By appropriate solder points 22, the electrical connection of the connection sleeves 24 is sketched on the circuit board 10. In a non-replaceable printed circuit board 10, the electrical contact can also be made by direct soldering between the pins 25 and the circuit board.

BezugszeichenlisteLIST OF REFERENCE NUMBERS

11
Unterputz-LED-LeuchteConcealed LED light
22
--
33
Gerätesockeldevice base
44
Konverter (Netzteil, LED-Treiber) inklusive Steuer-/Regeleinrichtung und Anschlusseinheit für 230V-NetzleitungenConverter (power supply, LED driver) including control unit and connection unit for 230V power lines
55
Tragplatte (Tragring)Support plate (support ring)
66
SickeBeading
77
Ausnehmung zum Durchgriff des SteckverbindersRecess for the passage of the connector
88th
LED-ModulLED module
99
LED-LeuchtmittelLED bulbs
1010
Leiterplattecircuit board
1111
Lötpunkte eines SteckverbindersSolder points of a connector
1212
Ausnehmung in der LeiterplatteRecess in the circuit board
1313
Leuchtmittel-AnschlussbeineLamp connection legs
1414
Sicke zur direkten Kühlung der LEDBead for direct cooling of the LED
1515
Lötpad/Wärmefolie in der Leiterplatte zur WärmeübertragungSolder pad / thermal foil in the PCB for heat transfer
1616
Lötzinn in Löt-Kapillare in der Leiterplatte zur WärmeübertragungSolder in solder capillary in the circuit board for heat transfer
1717
--
1818
--
1919
Wandwall
2020
UP-GerätedoseUP device socket
2121
230V-Netzleitungen230V power lines
2222
Lötpunkte von Anschlussstiften oder AnschlusshülsenSolder points of connection pins or connection sleeves
2323
Ausnehmungen für AnschlussstifteRecesses for pins
2424
Anschlusshülsenconnecting sleeves
2525
Anschlussstifte des KonvertersConnection pins of the converter

Claims (10)

Unterputz-LED-Leuchte (1) für den elektrischen und mechanischen Anschluss in einer handelsüblichen UP-Gerätedose (20), - mit einem eine Tragplatte (5) besitzenden Gerätesockel (3), welcher einen Konverter (4) inklusive Anschlusseinheit für 230V-Netzleitungen und eine Anschlussvorrichtung zum Anschluss eines LED-Moduls (8) mit mindestens einem LED-Leuchtmittel (9) aufweist, - wobei sich die Tragplatte (5) großflächig über die gesamte Frontfläche des Gerätesockels (3) erstreckt und lediglich mindestens eine Ausnehmung (7, 23) zum Durchgriff elektrischer Verbindungen (25) zwischen Gerätesockel (3) und LED-Modul (8) aufweist - und wobei die Tragplatte (5) als Kühlkörper für das mindestens eine LED-Leuchtmittel (9) herangezogen wird, wozu ein unmittelbarer Kontakt oder ein Kontakt über einen thermisch gut leitenden Zwischenträger zwischen LED-Leuchtmittel (9) und Tragplatte (5) realisiert ist. Flush-mounted LED light (1) for the electrical and mechanical connection in a standard flush-mounted box (20), - having a a support plate (5) possessing device base (3), which has a converter (4) including connection unit for 230V power lines and a connection device for connecting an LED module (8) with at least one LED lighting means (9), - Wherein the support plate (5) over a large area over the entire front surface of the device base (3) and only at least one recess (7, 23) for the passage of electrical connections (25) between the device base (3) and LED module (8) - And wherein the support plate (5) is used as a heat sink for the at least one LED light source (9), including a direct contact or contact via a thermally well-conducting intermediate carrier between the LED light source (9) and support plate (5) is realized , Unterputz-LED-Leuchte (1) nach Anspruch 1, dadurch gekennzeichnet, dass eine Sicke (14) in der Tragplatte (5) eingebracht ist und das mindestens eine LED-Leuchtmittel (9) durch eine Ausnehmung (12) in einer das LED-Leuchtmittel tragenden Leiterplatte (10) des LED-Moduls (8) unmittelbar thermisch kontaktiert.Flush-mounted LED light (1) according to claim 1, characterized in that a bead (14) in the support plate (5) is introduced and the at least one LED lighting means (9) through a recess (12) in one of the LED Bulb-carrying printed circuit board (10) of the LED module (8) contacted directly thermally. Unterputz-LED-Leuchte (1) nach Anspruch 1, dadurch gekennzeichnet, dass eine das mindestens eine LED-Leuchtmittel (9) tragende Leiterplatte (10) des LED-Moduls (8) unmittelbar am Ort des LED-Leuchtmittels ein(e) Lötpad/Wärmefolie (15) für den thermischen Kontakt mit der Tragplatte (5) aufweist.Flush-mounted LED light (1) according to claim 1, characterized in that one of the at least one LED lighting means (9) carrying the printed circuit board (10) of the LED module (8) directly at the location of the LED illuminant a (e) solder pad / Thermal foil (15) for the thermal contact with the support plate (5). Unterputz-LED-Leuchte (1) nach Anspruch 1, dadurch gekennzeichnet, dass eine das mindestens eine LED-Leuchtmittel (9) tragende Leiterplatte (10) des LED-Moduls (8) unmittelbar am Ort des LED-Leuchtmittels eine durchgehend kaschierte Aluminium-Kern Leiterplatte für den thermischen Kontakt mit der Tragplatte (5) aufweist.Flush-mounted LED light (1) according to claim 1, characterized in that a the at least one LED lighting means (9) carrying the printed circuit board (10) of the LED module (8) directly at the location of the LED illuminant, a continuously laminated aluminum Core PCB for thermal contact with the support plate (5). Unterputz-LED-Leuchte (1) nach Anspruch 1, dadurch gekennzeichnet, dass eine das mindestens eine LED-Leuchtmittel (9) tragende Leiterplatte (10) des LED-Moduls (8) unmittelbar am Ort des LED-Leuchtmittels mit Lötzinn gefüllte Löt-Kapillaren (16) für den thermischen Kontakt mit der Tragplatte (5) aufweist.Flush-mounted LED light (1) according to claim 1, characterized in that the at least one LED lighting means (9) carrying the printed circuit board (10) of the LED module (8) directly at the location of the LED light source solder-filled soldering Capillaries (16) for the thermal contact with the support plate (5). Unterputz-LED-Leuchte (1) nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass die Tragplatte (5) in ihrem zentralen Abschnitt mit einer entsprechend den Abmessungen eines LED-Moduls (8) dimensionierten Sicke (6) für den bezüglich der Frontseite bündigen Einbau des LED-Moduls (8) versehen ist.Flush-mounted LED light (1) according to any one of the preceding claims, characterized in that the support plate (5) in its central portion with a corresponding dimensions of an LED module (8) sized bead (6) flush with respect to the front side Installation of the LED module (8) is provided. Unterputz-LED-Leuchte (1) nach Anspruch 6, dadurch gekennzeichnet, dass die Tragplatte (5) in den Bereichen der Sicke (6) mit Ausnehmungen (23) zum Durchgriff elektrischer Verbindungen (25) zwischen Gerätesockel (3) und LED-Modul (8) versehen ist.Flush-mounted LED light (1) according to claim 6, characterized in that the support plate (5) in the regions of the bead (6) with recesses (23) for the passage of electrical connections (25) between the device base (3) and LED module (8) is provided. Unterputz-LED-Leuchte (1) nach Anspruch 7, dadurch gekennzeichnet, dass die Ausnehmungen (23) für den lagerichtigen Durchgriff der Verbindungen (25) versetzt sind.Flush-mounted LED light (1) according to claim 7, characterized in that the recesses (23) for the correct passage of the connections (25) are offset. Unterputz-LED-Leuchte (1) nach Anspruch 7 oder 8, dadurch gekennzeichnet, dass die elektrischen Verbindungen (25) zwischen Gerätesockel (3) und LED-Modul (8) in Form von Anschlussstiften (25) des Konverters (4) ausgebildet sind, welche in an der Leiterplatte (10) LED-Moduls (8) verlötete Anschlusshülsen (24) eingreifen.Flush-mounted LED light (1) according to claim 7 or 8, characterized in that the electrical connections (25) between the device base (3) and LED module (8) in the form of connection pins (25) of the converter (4) are formed which engage in on the printed circuit board (10) LED module (8) soldered connection sleeves (24). Unterputz-LED-Leuchte (1) nach Anspruch 7 oder 8, dadurch gekennzeichnet, dass die elektrischen Verbindungen (25) zwischen Gerätesockel (3) und LED-Modul (8) in Form von Anschlussstiften (25) des Konverters (4) ausgebildet sind, welche an der Leiterplatte (10) LED-Moduls (8) verlötetet sind.Flush-mounted LED light (1) according to claim 7 or 8, characterized in that the electrical connections (25) between the device base (3) and LED module (8) in the form of connection pins (25) of the converter (4) are formed, which are soldered to the circuit board (10) LED module (8).
EP10014725.5A 2010-01-23 2010-11-18 Built-in LED light with supporting plate Active EP2348248B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102010005505.0A DE102010005505B4 (en) 2010-01-23 2010-01-23 Flush-mounted LED light with support plate

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EP2348248A1 true EP2348248A1 (en) 2011-07-27
EP2348248B1 EP2348248B1 (en) 2016-02-10

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EP (1) EP2348248B1 (en)
CN (1) CN102155700B (en)
DE (1) DE102010005505B4 (en)
ES (1) ES2563644T3 (en)
HK (1) HK1156998A1 (en)

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Also Published As

Publication number Publication date
EP2348248B1 (en) 2016-02-10
DE102010005505B4 (en) 2015-01-22
CN102155700B (en) 2015-04-15
CN102155700A (en) 2011-08-17
HK1156998A1 (en) 2012-06-22
ES2563644T3 (en) 2016-03-15
DE102010005505A1 (en) 2011-07-28

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