EP2345062A4 - METHODS OF FORMING MULTIDOPED JUNCTIONS ON A SUBSTRATE - Google Patents
METHODS OF FORMING MULTIDOPED JUNCTIONS ON A SUBSTRATEInfo
- Publication number
- EP2345062A4 EP2345062A4 EP08877854A EP08877854A EP2345062A4 EP 2345062 A4 EP2345062 A4 EP 2345062A4 EP 08877854 A EP08877854 A EP 08877854A EP 08877854 A EP08877854 A EP 08877854A EP 2345062 A4 EP2345062 A4 EP 2345062A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- methods
- forming multi
- doped junctions
- junctions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2008/081558 WO2010050936A1 (en) | 2008-10-29 | 2008-10-29 | Methods of forming multi-doped junctions on a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2345062A1 EP2345062A1 (en) | 2011-07-20 |
EP2345062A4 true EP2345062A4 (en) | 2012-06-13 |
Family
ID=42129093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08877854A Withdrawn EP2345062A4 (en) | 2008-10-29 | 2008-10-29 | METHODS OF FORMING MULTIDOPED JUNCTIONS ON A SUBSTRATE |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2345062A4 (ko) |
JP (1) | JP2012507855A (ko) |
KR (1) | KR20110089291A (ko) |
CN (1) | CN102246275B (ko) |
WO (1) | WO2010050936A1 (ko) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5687837B2 (ja) | 2007-02-16 | 2015-03-25 | ナノグラム・コーポレイションNanoGram Corporation | 太陽電池構造体、光起電モジュール及びこれらに対応する方法 |
US8658454B2 (en) * | 2010-09-20 | 2014-02-25 | Sunpower Corporation | Method of fabricating a solar cell |
JP2012234994A (ja) * | 2011-05-02 | 2012-11-29 | Teijin Ltd | 半導体シリコン膜及び半導体デバイス、並びにそれらの製造方法 |
KR101411726B1 (ko) | 2010-12-10 | 2014-06-26 | 데이진 가부시키가이샤 | 반도체 적층체, 반도체 디바이스, 및 그들의 제조 방법 |
JP5921088B2 (ja) * | 2011-05-27 | 2016-05-24 | 帝人株式会社 | 未焼結シリコン粒子膜及び半導体シリコン膜、並びにそれらの製造方法 |
JP5253561B2 (ja) * | 2011-02-04 | 2013-07-31 | 帝人株式会社 | 半導体デバイスの製造方法、半導体デバイス、並びに分散体 |
US8858843B2 (en) * | 2010-12-14 | 2014-10-14 | Innovalight, Inc. | High fidelity doping paste and methods thereof |
US8912083B2 (en) | 2011-01-31 | 2014-12-16 | Nanogram Corporation | Silicon substrates with doped surface contacts formed from doped silicon inks and corresponding processes |
JPWO2012132758A1 (ja) * | 2011-03-28 | 2014-07-28 | 三洋電機株式会社 | 光電変換装置及び光電変換装置の製造方法 |
KR101890286B1 (ko) * | 2012-07-13 | 2018-08-22 | 엘지전자 주식회사 | 양면형 태양 전지의 제조 방법 |
CN106409923A (zh) * | 2012-08-09 | 2017-02-15 | 三菱电机株式会社 | 太阳能电池的制造方法 |
US9685581B2 (en) | 2013-04-24 | 2017-06-20 | Mitsubishi Electric Corporation | Manufacturing method of solar cell |
JP6379461B2 (ja) * | 2013-09-02 | 2018-08-29 | 日立化成株式会社 | p型拡散層を有するシリコン基板の製造方法、太陽電池素子の製造方法及び太陽電池素子 |
JP6144778B2 (ja) * | 2013-12-13 | 2017-06-07 | 信越化学工業株式会社 | 太陽電池の製造方法 |
JP6125114B2 (ja) * | 2015-02-10 | 2017-05-10 | 三菱電機株式会社 | 太陽電池の製造方法 |
US9589802B1 (en) * | 2015-12-22 | 2017-03-07 | Varian Semuconductor Equipment Associates, Inc. | Damage free enhancement of dopant diffusion into a substrate |
CN114373808B (zh) * | 2021-11-26 | 2023-11-10 | 江苏科来材料科技有限公司 | 一种高效晶硅电池 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003168807A (ja) * | 2001-09-19 | 2003-06-13 | Sharp Corp | 太陽電池およびその製造方法およびその製造装置 |
US20060094189A1 (en) * | 2003-01-08 | 2006-05-04 | Thomas B. Haverstock, Haverstock & Owens Llp | Nanoparticles and method for making the same |
US7192873B1 (en) * | 2004-11-25 | 2007-03-20 | Samsung Electronics Co., Ltd. | Method of manufacturing nano scale semiconductor device using nano particles |
WO2008039757A2 (en) * | 2006-09-28 | 2008-04-03 | Innovalight, Inc. | Semiconductor devices and methods from group iv nanoparticle materials |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1797584A4 (en) * | 2004-06-08 | 2014-08-13 | Sandisk Corp | METHODS AND DEVICES FOR FORMING NANOSTRUCTURE MONOLAYERS AND DEVICES COMPRISING SUCH SINGLES |
TW201341440A (zh) * | 2004-06-08 | 2013-10-16 | Sandisk Corp | 奈米結構之沉積後包封:併入該包封體之組成物、裝置及系統 |
US7419887B1 (en) * | 2004-07-26 | 2008-09-02 | Quick Nathaniel R | Laser assisted nano deposition |
US7355238B2 (en) * | 2004-12-06 | 2008-04-08 | Asahi Glass Company, Limited | Nonvolatile semiconductor memory device having nanoparticles for charge retention |
JP4481869B2 (ja) * | 2005-04-26 | 2010-06-16 | 信越半導体株式会社 | 太陽電池の製造方法及び太陽電池並びに半導体装置の製造方法 |
US7521340B2 (en) * | 2006-12-07 | 2009-04-21 | Innovalight, Inc. | Methods for creating a densified group IV semiconductor nanoparticle thin film |
-
2008
- 2008-10-29 JP JP2011534467A patent/JP2012507855A/ja active Pending
- 2008-10-29 WO PCT/US2008/081558 patent/WO2010050936A1/en active Application Filing
- 2008-10-29 KR KR1020117011822A patent/KR20110089291A/ko not_active Application Discontinuation
- 2008-10-29 CN CN200880132247.1A patent/CN102246275B/zh not_active Expired - Fee Related
- 2008-10-29 EP EP08877854A patent/EP2345062A4/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003168807A (ja) * | 2001-09-19 | 2003-06-13 | Sharp Corp | 太陽電池およびその製造方法およびその製造装置 |
US20060094189A1 (en) * | 2003-01-08 | 2006-05-04 | Thomas B. Haverstock, Haverstock & Owens Llp | Nanoparticles and method for making the same |
US7192873B1 (en) * | 2004-11-25 | 2007-03-20 | Samsung Electronics Co., Ltd. | Method of manufacturing nano scale semiconductor device using nano particles |
WO2008039757A2 (en) * | 2006-09-28 | 2008-04-03 | Innovalight, Inc. | Semiconductor devices and methods from group iv nanoparticle materials |
Non-Patent Citations (1)
Title |
---|
See also references of WO2010050936A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN102246275B (zh) | 2014-04-30 |
CN102246275A (zh) | 2011-11-16 |
WO2010050936A1 (en) | 2010-05-06 |
EP2345062A1 (en) | 2011-07-20 |
JP2012507855A (ja) | 2012-03-29 |
KR20110089291A (ko) | 2011-08-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20110502 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA MK RS |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20120515 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 31/18 20060101ALI20120509BHEP Ipc: H01L 31/04 20060101ALI20120509BHEP Ipc: H01L 21/225 20060101AFI20120509BHEP |
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GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
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INTG | Intention to grant announced |
Effective date: 20140212 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20140624 |