EP2345062A4 - Procédés de formation de jonctions multidopées sur un substrat - Google Patents

Procédés de formation de jonctions multidopées sur un substrat

Info

Publication number
EP2345062A4
EP2345062A4 EP08877854A EP08877854A EP2345062A4 EP 2345062 A4 EP2345062 A4 EP 2345062A4 EP 08877854 A EP08877854 A EP 08877854A EP 08877854 A EP08877854 A EP 08877854A EP 2345062 A4 EP2345062 A4 EP 2345062A4
Authority
EP
European Patent Office
Prior art keywords
substrate
methods
forming multi
doped junctions
junctions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08877854A
Other languages
German (de)
English (en)
Other versions
EP2345062A1 (fr
Inventor
Sunil Shah
Malcolm Abbott
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Innovalight Inc
Original Assignee
Innovalight Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innovalight Inc filed Critical Innovalight Inc
Publication of EP2345062A1 publication Critical patent/EP2345062A1/fr
Publication of EP2345062A4 publication Critical patent/EP2345062A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
    • H01L21/2251Diffusion into or out of group IV semiconductors
    • H01L21/2254Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Photovoltaic Devices (AREA)
EP08877854A 2008-10-29 2008-10-29 Procédés de formation de jonctions multidopées sur un substrat Withdrawn EP2345062A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2008/081558 WO2010050936A1 (fr) 2008-10-29 2008-10-29 Procédés de formation de jonctions multidopées sur un substrat

Publications (2)

Publication Number Publication Date
EP2345062A1 EP2345062A1 (fr) 2011-07-20
EP2345062A4 true EP2345062A4 (fr) 2012-06-13

Family

ID=42129093

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08877854A Withdrawn EP2345062A4 (fr) 2008-10-29 2008-10-29 Procédés de formation de jonctions multidopées sur un substrat

Country Status (5)

Country Link
EP (1) EP2345062A4 (fr)
JP (1) JP2012507855A (fr)
KR (1) KR20110089291A (fr)
CN (1) CN102246275B (fr)
WO (1) WO2010050936A1 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2654089A3 (fr) 2007-02-16 2015-08-12 Nanogram Corporation Structures de cellules solaires, modules photovoltaïques et procédés correspondants
US8658454B2 (en) * 2010-09-20 2014-02-25 Sunpower Corporation Method of fabricating a solar cell
JP5921088B2 (ja) * 2011-05-27 2016-05-24 帝人株式会社 未焼結シリコン粒子膜及び半導体シリコン膜、並びにそれらの製造方法
JP2012234994A (ja) * 2011-05-02 2012-11-29 Teijin Ltd 半導体シリコン膜及び半導体デバイス、並びにそれらの製造方法
JP5253561B2 (ja) * 2011-02-04 2013-07-31 帝人株式会社 半導体デバイスの製造方法、半導体デバイス、並びに分散体
TWI488321B (zh) 2010-12-10 2015-06-11 Teijin Ltd Semiconductor laminates, semiconductor devices, and the like
US8858843B2 (en) * 2010-12-14 2014-10-14 Innovalight, Inc. High fidelity doping paste and methods thereof
US8912083B2 (en) 2011-01-31 2014-12-16 Nanogram Corporation Silicon substrates with doped surface contacts formed from doped silicon inks and corresponding processes
JPWO2012132758A1 (ja) * 2011-03-28 2014-07-28 三洋電機株式会社 光電変換装置及び光電変換装置の製造方法
KR101890286B1 (ko) * 2012-07-13 2018-08-22 엘지전자 주식회사 양면형 태양 전지의 제조 방법
CN104521002B (zh) * 2012-08-09 2016-11-23 三菱电机株式会社 太阳能电池的制造方法
US9685581B2 (en) 2013-04-24 2017-06-20 Mitsubishi Electric Corporation Manufacturing method of solar cell
JP6379461B2 (ja) * 2013-09-02 2018-08-29 日立化成株式会社 p型拡散層を有するシリコン基板の製造方法、太陽電池素子の製造方法及び太陽電池素子
WO2015087472A1 (fr) * 2013-12-13 2015-06-18 信越化学工業株式会社 Procédé de fabrication de cellules solaires et cellule solaire obtenue par ledit procédé de fabrication
WO2016129372A1 (fr) * 2015-02-10 2016-08-18 三菱電機株式会社 Procédé de fabrication de cellule solaire, et cellule solaire
US9589802B1 (en) * 2015-12-22 2017-03-07 Varian Semuconductor Equipment Associates, Inc. Damage free enhancement of dopant diffusion into a substrate
CN114373808B (zh) * 2021-11-26 2023-11-10 江苏科来材料科技有限公司 一种高效晶硅电池

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003168807A (ja) * 2001-09-19 2003-06-13 Sharp Corp 太陽電池およびその製造方法およびその製造装置
US20060094189A1 (en) * 2003-01-08 2006-05-04 Thomas B. Haverstock, Haverstock & Owens Llp Nanoparticles and method for making the same
US7192873B1 (en) * 2004-11-25 2007-03-20 Samsung Electronics Co., Ltd. Method of manufacturing nano scale semiconductor device using nano particles
WO2008039757A2 (fr) * 2006-09-28 2008-04-03 Innovalight, Inc. Dispositifs à semiconducteurs et procédés à partir de matériaux de nanoparticule du groupe iv

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201341440A (zh) * 2004-06-08 2013-10-16 Sandisk Corp 奈米結構之沉積後包封:併入該包封體之組成物、裝置及系統
AU2005253604B2 (en) * 2004-06-08 2011-09-08 Scandisk Corporation Methods and devices for forming nanostructure monolayers and devices including such monolayers
US7419887B1 (en) * 2004-07-26 2008-09-02 Quick Nathaniel R Laser assisted nano deposition
US7355238B2 (en) * 2004-12-06 2008-04-08 Asahi Glass Company, Limited Nonvolatile semiconductor memory device having nanoparticles for charge retention
JP4481869B2 (ja) * 2005-04-26 2010-06-16 信越半導体株式会社 太陽電池の製造方法及び太陽電池並びに半導体装置の製造方法
WO2008073763A2 (fr) * 2006-12-07 2008-06-19 Innovalight, Inc. Procédés de création d'un film mince de nanoparticules semi-conductrices du groupe iv densifié

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003168807A (ja) * 2001-09-19 2003-06-13 Sharp Corp 太陽電池およびその製造方法およびその製造装置
US20060094189A1 (en) * 2003-01-08 2006-05-04 Thomas B. Haverstock, Haverstock & Owens Llp Nanoparticles and method for making the same
US7192873B1 (en) * 2004-11-25 2007-03-20 Samsung Electronics Co., Ltd. Method of manufacturing nano scale semiconductor device using nano particles
WO2008039757A2 (fr) * 2006-09-28 2008-04-03 Innovalight, Inc. Dispositifs à semiconducteurs et procédés à partir de matériaux de nanoparticule du groupe iv

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010050936A1 *

Also Published As

Publication number Publication date
EP2345062A1 (fr) 2011-07-20
KR20110089291A (ko) 2011-08-05
CN102246275A (zh) 2011-11-16
JP2012507855A (ja) 2012-03-29
WO2010050936A1 (fr) 2010-05-06
CN102246275B (zh) 2014-04-30

Similar Documents

Publication Publication Date Title
EP2345062A4 (fr) Procédés de formation de jonctions multidopées sur un substrat
EP2360719A4 (fr) Substrat épitaxial pour dispositif électronique et son procédé de fabrication
GB2490606B (en) Spalling for a semiconductor substrate field
PL3243631T3 (pl) Sposób wytwarzania wypustek na podłożu
EP2357661A4 (fr) Substrat épitaxial pour dispositif électronique et son procédé de fabrication
EP2394299B8 (fr) Structure semi-conductrice et procédé de fabrication d'une telle structure
EP2176407A4 (fr) Procédé de formation d'un motif sur un substrat
EP2544515A4 (fr) Procédé de fabrication d'un substrat métallisé
EP2432001A4 (fr) Procédé de production de substrat semi-conducteur
EP2458577A4 (fr) Procédé de fabrication d un substrat de transistor à couches minces
EP2595211A4 (fr) Dispositif électronique souple, son procédé de fabrication et substrat souple
EP2244301A4 (fr) Procédé de fabrication d'un dispositif semiconducteur
EP2162237A4 (fr) Procédé de formation d'un motif sur un substrat
EP2247163A4 (fr) Dispositif électroluminescent organique et procédé de production dudit dispositif
EP2472604A4 (fr) Procédé de fabrication d'un substrat semiconducteur et procédé de fabrication d'un dispositif luminescent
EP2613374A4 (fr) Substrat pour un élément électronique organique et procédé de production de celui-ci
EP2474964A4 (fr) Substrat de dispositif
EP2244305A4 (fr) Procédé de fabrication d'un dispositif semiconducteur
EP2352164A4 (fr) Procédé de fabrication d un substrat soi
EP2767524A4 (fr) Substrat de nitrure de silicium et procédé de fabrication d'un substrat de nitrure de silicium
EP2554719A4 (fr) Substrat épitaxial et procédé de fabrication d'un substrat épitaxial
EP2544516A4 (fr) Procédé de fabrication d'un substrat en céramique métallisé
EP2461654A4 (fr) Substrat de câblage et procédé de fabrication du substrat de câblage
GB0920986D0 (en) Substrate patterning
EP2404317A4 (fr) Procédé de fabrication d'un substrat à couche mince

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20110502

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA MK RS

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20120515

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 31/18 20060101ALI20120509BHEP

Ipc: H01L 31/04 20060101ALI20120509BHEP

Ipc: H01L 21/225 20060101AFI20120509BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20140212

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20140624