EP2404317A4 - Procédé de fabrication d'un substrat à couche mince - Google Patents
Procédé de fabrication d'un substrat à couche minceInfo
- Publication number
- EP2404317A4 EP2404317A4 EP10749454.4A EP10749454A EP2404317A4 EP 2404317 A4 EP2404317 A4 EP 2404317A4 EP 10749454 A EP10749454 A EP 10749454A EP 2404317 A4 EP2404317 A4 EP 2404317A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- releasing
- thin
- film substrate
- substrate
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
- H01L21/30608—Anisotropic liquid etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
- H01L31/03529—Shape of the potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1892—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
- H01L31/1896—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates for thin-film semiconductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15822309P | 2009-03-06 | 2009-03-06 | |
PCT/US2010/026570 WO2010102306A1 (fr) | 2009-03-06 | 2010-03-08 | Procédé de fabrication d'un substrat à couche mince |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2404317A1 EP2404317A1 (fr) | 2012-01-11 |
EP2404317A4 true EP2404317A4 (fr) | 2014-06-11 |
Family
ID=42710039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10749454.4A Withdrawn EP2404317A4 (fr) | 2009-03-06 | 2010-03-08 | Procédé de fabrication d'un substrat à couche mince |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP2404317A4 (fr) |
WO (1) | WO2010102306A1 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8193076B2 (en) | 2006-10-09 | 2012-06-05 | Solexel, Inc. | Method for releasing a thin semiconductor substrate from a reusable template |
AU2013289151A1 (en) * | 2012-04-02 | 2014-11-13 | Solexel, Inc. | High efficiency solar cell structures and manufacturing methods |
CN105682769A (zh) | 2013-10-30 | 2016-06-15 | 惠普发展公司,有限责任合伙企业 | 岛蚀刻的过滤通道 |
JP6171097B2 (ja) | 2013-10-30 | 2017-07-26 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 非平行アイランドエッチング |
CN105489705A (zh) * | 2015-12-30 | 2016-04-13 | 无锡赛晶太阳能有限公司 | 一种制造晶硅太阳能电池的刻蚀清洗工艺 |
CN115001429B (zh) * | 2022-08-03 | 2022-11-25 | 迈感微电子(上海)有限公司 | 一种滤波器的制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6331208B1 (en) * | 1998-05-15 | 2001-12-18 | Canon Kabushiki Kaisha | Process for producing solar cell, process for producing thin-film semiconductor, process for separating thin-film semiconductor, and process for forming semiconductor |
US20080157283A1 (en) * | 2006-10-09 | 2008-07-03 | Mehrdad Moslehi | Template for three-dimensional thin-film solar cell manufacturing and methods of use |
US20080210294A1 (en) * | 2006-10-09 | 2008-09-04 | Mehrdad Moslehi | Solar module structures and assembly methods for pyramidal three-dimensional thin-film solar cells |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6058945A (en) * | 1996-05-28 | 2000-05-09 | Canon Kabushiki Kaisha | Cleaning methods of porous surface and semiconductor surface |
US7244682B2 (en) * | 2004-05-06 | 2007-07-17 | Micron Technology, Inc. | Methods of removing metal-containing materials |
WO2006058034A2 (fr) * | 2004-11-22 | 2006-06-01 | Intermolecular, Inc. | Auto-assemblage moleculaire dans le traitement d'un substrat |
-
2010
- 2010-03-08 EP EP10749454.4A patent/EP2404317A4/fr not_active Withdrawn
- 2010-03-08 WO PCT/US2010/026570 patent/WO2010102306A1/fr active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6331208B1 (en) * | 1998-05-15 | 2001-12-18 | Canon Kabushiki Kaisha | Process for producing solar cell, process for producing thin-film semiconductor, process for separating thin-film semiconductor, and process for forming semiconductor |
US20080157283A1 (en) * | 2006-10-09 | 2008-07-03 | Mehrdad Moslehi | Template for three-dimensional thin-film solar cell manufacturing and methods of use |
US20080210294A1 (en) * | 2006-10-09 | 2008-09-04 | Mehrdad Moslehi | Solar module structures and assembly methods for pyramidal three-dimensional thin-film solar cells |
Non-Patent Citations (1)
Title |
---|
See also references of WO2010102306A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP2404317A1 (fr) | 2012-01-11 |
WO2010102306A1 (fr) | 2010-09-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20111006 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20140514 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 31/18 20060101ALI20140508BHEP Ipc: H01L 21/4763 20060101AFI20140508BHEP Ipc: H01L 27/142 20140101ALI20140508BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20141213 |