EP2329932B1 - Procédé de fabrication de panneaux, notamment des panneaux de sol - Google Patents

Procédé de fabrication de panneaux, notamment des panneaux de sol Download PDF

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Publication number
EP2329932B1
EP2329932B1 EP10175749.0A EP10175749A EP2329932B1 EP 2329932 B1 EP2329932 B1 EP 2329932B1 EP 10175749 A EP10175749 A EP 10175749A EP 2329932 B1 EP2329932 B1 EP 2329932B1
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EP
European Patent Office
Prior art keywords
machining
multilayer plate
top layer
layer
panels
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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EP10175749.0A
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German (de)
English (en)
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EP2329932A2 (fr
EP2329932A3 (fr
Inventor
Ralf Niederer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fritz Egger GmbH and Co OG
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Fritz Egger GmbH and Co OG
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Priority to PL10175749T priority Critical patent/PL2329932T3/pl
Publication of EP2329932A2 publication Critical patent/EP2329932A2/fr
Publication of EP2329932A3 publication Critical patent/EP2329932A3/fr
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Publication of EP2329932B1 publication Critical patent/EP2329932B1/fr
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27M—WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
    • B27M3/00—Manufacture or reconditioning of specific semi-finished or finished articles
    • B27M3/04—Manufacture or reconditioning of specific semi-finished or finished articles of flooring elements, e.g. parqueting blocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27M—WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
    • B27M1/00—Working of wood not provided for in subclasses B27B - B27L, e.g. by stretching

Definitions

  • the invention relates to a method for producing panels, in particular floor panels, according to the preamble of claim 1. Such a method is known from WO 97/13626 A known.
  • a panel is a multi-layer board with a wooden material carrier layer as a lignocellulose-containing material, for example a chipboard, OSB board or fiberboard (MDF, HDF board, for example), the carrier layer at least on its upper side, optionally also on its underside, with a cover layer which is a layer with a directly applied decorative printing with a seal or a directly applied lacquer, resin, laminate, laminate or veneer, wherein at least the top side cover layer usually forms a decorative layer.
  • a panel also has a profile in the edge region, which corresponds with a corresponding one Profile of a neighboring plate interacting with a laying composite. Corresponding tongue and groove profiles are produced on the multilayer plate by means of a special milling head of a processing machine.
  • the topsheet of a panel as made in accordance with the present invention may be formed in various ways. For example, this may be applied as a direct print on the carrier layer and then sealed by a transparent lacquer or a synthetic resin layer or it is in the cover layer to a resin impregnated with decorative paper which is pressed directly to the carrier layer.
  • the cover layer can also be made of a laminate, that is to say a structure composed of several resin-impregnated paper layers which are joined together under high pressure, the upper layer being a decorative layer and optionally a transparent overlay paper, or a veneer, ie a relatively thin wood sheet become.
  • the laminate layer provided with hard particles should be intentionally destroyed by the stripping, where in a subsequent processing step a separating cut takes place or a milling tool removes material.
  • the tools used for this purpose must currently be of very high quality in order to achieve acceptable tool life. Therefore, only expensive tool cutting tools made of polycrystalline diamond (PKB tools) are currently used.
  • PPB tools polycrystalline diamond
  • the surfaces of wood-based panels by so-called Thermo flattening means pretreat heat-treated rolls in such a way that the surfaces can be optimally coated without intermediate sanding and puttying.
  • the thermal quenching means an additional step and does not prevent the emergence of eruptions in the area of the surface to be machined in the dividing, abrading or machining a wood-based panel in a satisfactory manner.
  • the previously derived and indicated object is according to the present invention in a Method for producing panels, in particular floor panels, according to claim 1.
  • a plurality of such machining tools may also be provided.
  • a plurality of processing tools in particular independently of each other, perform a shaping processing, under the action of a translatory oscillating movement in the ultrasonic range, to the respective processing tool. It is therefore conceivable that in the manufacture of panels, in particular floor panels, a processing station with a plurality of processing tools of the type described above and / or several successive processing stations are provided with at least one such processing tool.
  • a further dividing processing this can be done for example by means of a blade, it can be provided that the dividing processing cuts through the multilayer plate over its entire thickness. However, it can also be provided that only the cover layer, for example the laminate, is severed by the dividing processing.
  • the step of severing the multilayer plate over its entire thickness is then when individual plates are to be produced from the multilayer plate, which correspond in dimensions, for example, already the dimensions of the finished panels.
  • the severing of only the cover layer by a dividing processing makes sense if in the edge region of the multilayer plate, a subsequent machining is to be done by means of a milling head through which a tongue and / or tongue profile is generated.
  • the severing of only the top layer can be done instead of a zer toode processing by a removing machining.
  • the abrading processing which in principle can be done by means of a grinding head, the multilayer plate are at least partially stripped, wherein in the area to be stripped of the multilayer plate preferably the cover layer is removed over its entire thickness.
  • Even such an abrasive machining leads to a more precise edge shape in the region of the cover layer in comparison to the case that the edge would be produced directly by the machining tool, for example the milling head.
  • the shaping processing of the cover layer in the production of an edge profile waiving a preceding dividing and / or abtragende processing as by the support of the cutting machining tool, for example, the milling head, by the ultrasonic oscillating movement and the machining tool with lower forces and moments and thus can be performed with greater precision, which increases the dimensional accuracy.
  • the abrasive machining to increase the precision of the dividing processing, in particular the severing of only the top layer precedes.
  • a dividing machining tool such as a blade to sever the top layer with particularly great precision
  • an abrasive machining for example by means of a grinding head, which may be less accurate than the dividing machining tool but more precise than a machining tool is to perform and finally perform a machining, for example by means of a milling head, which may be the least accurate of all three types of tools, the production of a profile.
  • the cutting machining tool for example the milling head, can then be moved into the transition area, without the risk that the milling head unintentionally comes into contact with the already cleanly shaped edge of the cover layer.
  • leg machining as already indicated, by this on the support layer of the edge of the multilayer plate, a tongue and / or groove profile, are produced.
  • the cutting machining is preceded by the dividing processing, in particular the severing of only the cover layer, and / or the abrading processing, in particular the removal of the cover layer over its entire thickness in a subregion of the multilayer plate.
  • the machining for example, for profile production, and the preceded by dividing processing in the form of severing the multilayer board over its entire thickness.
  • the machining or all of the above-described shaping machining methods can be assisted in the production of panels, in particular floor panels, by the described translatory oscillation movement in the ultrasound region, which acts on the machining tool.
  • the translatory oscillatory motion is performed at a frequency which is in a range of 15 to 70 kHz, preferably 20 to 40 kHz, more preferably 20 to 35 kHz. These frequency ranges have proven to be particularly suitable in the processing of multilayer plates having a carrier layer of a lignocellulosic material.
  • an AC voltage generated by a drive, in particular a high-frequency generator, in a sound transducer, also called a converter, is connected to a ceramic or quartz crystal plate.
  • the plate thereby performs vibrations in a certain frequency, which are particularly strong at resonance.
  • the amplitude of the oscillations can be enhanced by a sonotrode arranged between the sound transducer and the machining tool, also called transformation piece or reinforcing trunk, if necessary.
  • a plurality of processing tools are provided, which are configured for shaping a multilayer plate with a carrier layer of a wood material, and with a top layer connected to the carrier layer cover layer, in particular a laminate, laminate or veneer, and in particular independently operable.
  • Such a device has the advantage that for the first time in the manufacture of panels, in particular floor panels, in which a multi-layer plate is provided with at least one layer of a lignocellulosic material, a very high precision and thus dimensional accuracy in the processing of the edges is achieved and in this way no additional pretreatment steps such as thermal quenching or post-treatment steps such as grinding or trowelling are necessary.
  • the panel obtained by the method according to the invention can thus be produced in a particularly effective manner and in a high-quality state.
  • the drive for the respective sound transducer on a high-frequency generator wherein the high-frequency generator is configured such that the translatory oscillatory motion is carried out at a frequency in a range of 15 to 70 kHz, preferably from 20 to 40 kHz, particularly preferably from 20 to 35 kHz.
  • the high-frequency generator is configured such that the translatory oscillatory motion is carried out at a frequency in a range of 15 to 70 kHz, preferably from 20 to 40 kHz, particularly preferably from 20 to 35 kHz.
  • the high-frequency generator is configured such that the amplitude of the oscillatory movement is in a range from 2 to 100 ⁇ m, preferably from 4 to 50 ⁇ m, particularly preferably from 6 to 25 ⁇ m. Especially these frequencies and / or amplitudes lead in panels to a particularly low risk of material eruptions in the edge region.
  • the sonotrode is according to another embodiment, a moving, in particular rotating, or a fixed sonotrode.
  • a rotating sonotrode is useful if this vibrated with the sonotrode Machining tool is also a rotating tool, such as a grinding head or milling head.
  • a fixed sonotrode can be used when the machining tool is also a stationary tool, which, for example, after being brought into contact with the surface of the panel, is moved substantially in the direction of the plane of the plate, such as a blade for cutting the plate material.
  • the at least one machining tool is a machining tool, in particular a milling head.
  • Further shaping machining tools are a dividing machining tool, in particular a blade, and / or a removing machining tool, in particular a grinding head.
  • Machining tools executable machining operations are very precise, since they have an immediate impact on the final shape of the panel in the edge area. Precision and dimensional accuracy are particularly important in the edge area, since noise and damage can occur, especially in the case of floor panels, due to the stress caused by inaccurately worked edges. With the help of the ultrasonic oscillating movement, which acts on the machining tool, however, precisely these machining steps can be carried out particularly precisely.
  • FIGS. 1 to 3 all schematically illustrate a device 5 for the production of floor panels during a special processing step.
  • Fig. 1b is a side view of the embodiment in Fig. 1a ).
  • the Views in the Figures 2 and 3 correspond in turn to the view in Fig. 1a ).
  • a multilayer plate 2 initially provided with a carrier layer 2a of a wood material, here a high-density fiberboard (HDF plate), and with a top layer 2b connected to the carrier layer 2a from a layer with a sealed decorative print with a processing tool 3 and 3 'and 3 ", respectively, wherein the machining tool moves relative to the multi-layered plate 2 in such a way that a shaping operation, namely a dividing machining (FIG. Fig. 1 ), an ablation ( Fig. 2 ) and a machining ( Fig. 3 ), the multilayer plate 2 takes place.
  • a shaping operation namely a dividing machining (FIG. Fig. 1 ), an ablation ( Fig. 2 ) and a machining ( Fig. 3 .
  • the oscillatory movement X is carried out at a frequency of 20 to 40 kHz, ie in the ultrasonic range, and an amplitude in the range of 6 to 25 microns, wherein the oscillating movement is perpendicular to the plate plane and perpendicular to the actual movement of the machining tool.
  • the latter movement is at the in Fig. 1 a cutting movement parallel to the plane of the plate shown in FIG Fig. 2 shown eroding processing and also in the Fig. 3 shown machining a rotation in a plane parallel to the plane of the plate.
  • the device 5 has a processing tool 3 or 3 'or 3 ", which is specially configured for shaping a multilayer plate 2 with a carrier layer of a lignocellulosic material and having a top side Cover layer connected to the carrier layer, which here consists of a layer with decorative printing.
  • the device 5 has a sound transducer 8 and a sonotrode 6, which is connected to the machining tool 3 or 3 'or 3 "in such a way that, as explained above, a translatory oscillatory movement in the ultrasonic range is transmitted to the machining tool and coincides superimposed on the actual movement of the machining tool required for shaping machining.
  • the sound transducer 8 has as a drive 7 to a high-frequency generator 7a, which is connected by means of a transmission line 7b to the transducer 8.
  • the high-frequency generator 7a is configured so that it causes in the machining tool 3 or 3 'or 3 ", an ultrasonic oscillatory movement at least in the range of 20 to 40 kHz with an amplitude in the range of 6 to 25 microns.
  • FIGS. 1 to 3 differ in the respective editing tool.
  • the processing tool 3 is a dividing one Machining tool 3 in the form of a blade.
  • the sonotrode 6 is in this case a fixed sonotrode 6.
  • the dividing machining tool 3 performs a dividing machining, such that the multilayer plate 2 is cut through its entire thickness and two individual panels 1a and 1b are formed.
  • the machining tool 3 ' is an abrasive machining tool 3' in the form of a rotating grinding head.
  • the sonotrode 6 is a moving, in this case a rotating, sonotrode 6.
  • the removing machining tool 3 ' carries out a removing machining, wherein the multilayer plate 2 is stripped so that the cover layer 2b is over in the area to be stripped their entire thickness is removed.
  • the sonotrode 6 is a rotating sonotrode 6.
  • the cutting tool 3 "performs a machining operation on the edge 2c of the multilayer plate 2, thereby forming a part of a Groove and / or spring profiles 4 is made, namely, more precisely, the upper contact surface and a part of the end face of the profile. 4
  • the in the FIGS. 1 to 3 Devices 5 shown can also be individual processing stations of a higher-level apparatus for producing panels 1, 1a, 1b, wherein the dividing processing tool 3 according to FIG Fig. 1 the abrasive machining tool 3 'according to Fig. 2 can be upstream and the latter in turn the machining tool 3 "according to Fig. 3 can be upstream.

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Floor Finish (AREA)

Claims (7)

  1. Procédé destiné à fabriquer des lambris (1, 1a, 1b), notamment des lambris de sol, lors duquel on réalise les étapes suivantes :
    - mise à disposition d'une plaque (2) multicouches avec une couche porteuse (2a) en un matériau dérivé du bois en tant qu'une matière contenant de la lignocellulose et avec une couche de recouvrement (2b) assemblée sur la face supérieure avec la couche porteuse (2a),
    - mise en contact de la plaque (2) multicouches avec au moins un outil d'usinage (3, 3', 3") et
    - mouvement de l'au moins un outil d'usinage (3, 3', 3") par rapport à la plaque (2) multicouches, de telle sorte qu'il s'effectue un usinage de façonnage de la plaque (2) multicouches,
    l'usinage de façonnage s'effectuant sous l'effet d'un mouvement oscillant (X) en translation sur l'outil d'usinage (3, 3', 3"),
    le mouvement oscillant (X) en translation s'effectuant dans le spectre des ultrasons, la couche de recouvrement (2b) étant une couche avec une impression décorative directement appliquée avec une vitrification ou un vernis, une résine époxy, un laminé, un stratifié ou un placage directement appliqué,
    caractérisé en ce qu'on réalise le mouvement oscillant (X) en translation avec une amplitude qui se situe dans un ordre de 2 à 100 µm, et l'usinage de façonnage étant un usinage par enlèvement de copeaux de la couche porteuse (2a), par lequel on créé sur l'arête (2c) de la plaque (2) multicouches un profil à rainure et/ou à languette (4).
  2. Procédé selon la revendication 1, caractérisé en ce que plusieurs outils d'usinage (3, 3', 3") réalisent, notamment indépendamment les uns des autres, un usinage de façonnage sous l'effet un mouvement oscillant (X) en translation dans le spectre des ultrasons sur l'outil d'usinage (3, 3', 3") concerné.
  3. Procédé selon la revendication 2, caractérisé en ce qu'un autre usinage de façonnage est un usinage de sectionnement, par lequel on sectionne notamment la plaque (2) multicouches sur toute son épaisseur ou seule la couche de recouvrement (2b).
  4. Procédé selon la revendication 2 ou 3, caractérisé en ce qu'un autre usinage de façonnage est un usinage par enlèvement, par lequel on retire une couche de préférence au moins en partie de la plaque (2)multicouches, dans la zone de la plaque multicouches (2) où la couche doit être retirée, de manière particulièrement préférée, la couche de recouvrement (2b) étant retirée sur toute son épaisseur, notamment l'usinage de sectionnement, de préférence le sectionnement seulement de la couche de recouvrement (2b) précédant notamment l'usinage par enlèvement.
  5. Procédé selon la revendication 3 ou 4, caractérisé en ce que l'usinage par sectionnement, de préférence le sectionnement seulement de la couche de recouvrement ou le sectionnement de la plaque (2) multicouches sur toute son épaisseur, précède l'usinage par enlèvement de copeaux.
  6. Procédé selon la revendication 4 ou 5 si dépendante de la revendication 4, caractérisé en ce que l'usinage par enlèvement, notamment le retrait de la couche de recouvrement (2b) sur toute son épaisseur dans une zone partielle de la plaque (2), multicouches précède l'usinage par enlèvement de copeaux.
  7. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce qu'on réalise le mouvement oscillant (X) en translation à une fréquence qui se situe dans un ordre de 15 à 70 kHz, de préférence de 20 à 40 kHz, de manière particulièrement préférée de 20 à 35 kHz, et/ou on le réalise avec une amplitude qui se situe dans un ordre de 4 à 50 µm, de préférence de 6 à 25 µm.
EP10175749.0A 2009-12-02 2010-09-08 Procédé de fabrication de panneaux, notamment des panneaux de sol Active EP2329932B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL10175749T PL2329932T3 (pl) 2009-12-02 2010-09-08 Sposób wytwarzania paneli, w szczególności paneli podłogowych

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200910056441 DE102009056441B4 (de) 2009-12-02 2009-12-02 Verfahren zum Herstellen von Paneelen, insbesondere Fußbodenpaneelen

Publications (3)

Publication Number Publication Date
EP2329932A2 EP2329932A2 (fr) 2011-06-08
EP2329932A3 EP2329932A3 (fr) 2012-03-14
EP2329932B1 true EP2329932B1 (fr) 2016-12-21

Family

ID=43667694

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EP10175749.0A Active EP2329932B1 (fr) 2009-12-02 2010-09-08 Procédé de fabrication de panneaux, notamment des panneaux de sol

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EP (1) EP2329932B1 (fr)
DE (1) DE102009056441B4 (fr)
ES (1) ES2615494T3 (fr)
PL (1) PL2329932T3 (fr)
PT (1) PT2329932T (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4119294A1 (fr) * 2021-07-16 2023-01-18 Volkswagen Ag Procédé et dispositif de coupe permettant de couper des feuilles d'électrode

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4119294A1 (fr) * 2021-07-16 2023-01-18 Volkswagen Ag Procédé et dispositif de coupe permettant de couper des feuilles d'électrode

Also Published As

Publication number Publication date
PL2329932T3 (pl) 2017-07-31
ES2615494T3 (es) 2017-06-07
EP2329932A2 (fr) 2011-06-08
DE102009056441A1 (de) 2011-06-09
DE102009056441B4 (de) 2014-04-30
EP2329932A3 (fr) 2012-03-14
PT2329932T (pt) 2017-02-20

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