EP2283715A1 - Agencement de carte à circuits imprimés pour composants électroniques sollicités thermiquement, en particulier dans des appareils de commande de véhicules automobiles - Google Patents

Agencement de carte à circuits imprimés pour composants électroniques sollicités thermiquement, en particulier dans des appareils de commande de véhicules automobiles

Info

Publication number
EP2283715A1
EP2283715A1 EP09753870A EP09753870A EP2283715A1 EP 2283715 A1 EP2283715 A1 EP 2283715A1 EP 09753870 A EP09753870 A EP 09753870A EP 09753870 A EP09753870 A EP 09753870A EP 2283715 A1 EP2283715 A1 EP 2283715A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
cooling
inlay
printed circuit
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09753870A
Other languages
German (de)
English (en)
Inventor
Andreas Heise
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Teves AG and Co OHG
Original Assignee
Continental Teves AG and Co OHG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Teves AG and Co OHG filed Critical Continental Teves AG and Co OHG
Publication of EP2283715A1 publication Critical patent/EP2283715A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Definitions

  • the invention relates to a printed circuit board assembly according to the preamble of claim 1, their use and a method for their preparation.
  • Circuit board arrangements with heat sinks are already known.
  • printed circuit board assemblies which are simultaneously suitable for the assembly of electronic components for switching or regulating high power, as well as for the assembly of components having only a small power loss.
  • a multilayer printed circuit board according to the preamble of claim 1 is known, which comprises cooling inlays for cooling of power devices in SMD technology.
  • This known printed circuit board assembly is specially designed for applications in the high-frequency technology and comprises for cooling inlays, which are three times as large as the electronic component to be cooled.
  • an insulating, thin intermediate layer is applied between the cooling inlay and the component.
  • hybrid technology In the field of automotive technology and power electronics, a hybrid technology has hitherto often been used in which two separate printed circuit boards with different technologies are used for the power electronics and for the remaining microelectronic circuit. A connection of the separate circuit boards is usually done by Bonding.
  • stamped grid technology As an alternative to hybrid technology, the so-called stamped grid technology is also used, in which the electronic components are welded or riveted to a stamped grid. The stamped grid itself are often then connected again by bonding with the other circuit components.
  • there is still the requirement optimally to cool the power components which often happens by consuming Klebetechnik or paste orders such as the hybrid boards.
  • the invention is concerned with the task of specifying a printed circuit board and contacting technology which better fulfills the requirements for thermal conductivity and current carrying capacity described above and manages without an intermediate layer between the cooling inlay and the electrical power component to be cooled. This object is achieved by the printed circuit board assembly according to claim 1.
  • the printed circuit board arrangement is multi-layered and comprises at least one low-current conductor track and at least one high-current conducting element, which is formed at least partially by a cooling inlay. Therefore, at least one cooling inlay is directly or indirectly electrically connected to an electronic power component to be cooled.
  • the line cross-section or the current carrying capacity of the high-current conducting element is substantially higher than the line cross-section or the current-carrying capacity of the low-current conductor track.
  • the printed circuit board arrangement preferably additionally comprises at least one low-current component.
  • At least one cooling inlay is introduced into a printed circuit board.
  • the cooling inlay preferably assumes at least about 90% of the printed circuit board thickness relative to the thickness.
  • the cooling inlay has a thickness which corresponds almost to the thickness of the printed circuit board, so that the cooling inlay mt the surface of the circuit board is almost flush.
  • the cooling inlay takes the largest possible volume for the purpose of high current and thermal conductivity. Therefore, expediently, the extent of a cooling inlay in the direction of the printed circuit board plane is at least greater than half its height.
  • the expansion of the cooling inlay in the printed circuit board plane is particularly preferably at least equal to or greater than its thickness.
  • a plurality of electrically insulated cooling inlays are preferably introduced into the circuit board, so that the high-current paths can be used not only for cooling but also for transporting the power for power components.
  • the cooling inlay can be solid or hollow.
  • the cooling inlay is preferably flowed through or filled with a liquid.
  • a flow through the liquid is advantageous for the purpose of heat exchange promoting convection.
  • the composition of the liquid or another suitable solid filling material is chosen such that a change in temperature of the physical state of the liquid or the filling material takes place in which absorbed by the liquid or the filler heat or is delivered.
  • the cooling inlay is preferably, however, mostly or entirely made of metal and may be solid or coated. Depending on the application, identical or different materials are used here.
  • a metallic material for the cooling inlay or the coating is particularly suitable Cu, Al, Ag or Au, wherein in the case of massive construction of a cooling inlay Cu or Al are preferred.
  • the surface of the cooling inlay is preferably designed almost flush with the circuit board surface on the component side.
  • the cooling inlay if it penetrates the entire diameter, also designed on the opposite circuit board surface flush with the surface of the circuit board.
  • the arrangement for contacting preferably also includes a high-current electrical connection technique of the first kind into the cooling inlays, for example by means of press-fit pins.
  • the high-current line element is preferably connected electrically conductively and with low resistance to at least one further electronic power component or a high current contact.
  • the printed circuit board is advantageously suitable for use in a conventional SMD mounting process in which a common assembly of electrical and low-power electrical components takes place.
  • the printed circuit board arrangement is preferably provided for the use of pressed-in contact elements and / or screwed contact elements and / or inserted contact elements, in which corresponding recesses or couplings are introduced into the cooling inlays and / or the printed circuit board. Particularly advantageous these coupling points are designed so that a high heat dissipation can be ensured.
  • contacting holes are provided in a pattern or hole pattern suitable for plug pins, so that a plug can be used. can be electrically connected to the circuit board or with the / s arranged therein cooling inlay (s). As a result, the contact area of the connector plug can be cooled particularly effectively or hardly any heat losses occur at the transition points.
  • the cooling inlays are preferably made of a metal, in particular of copper. It is particularly useful to tin, silver or gild thedeinlays for better solderability before insertion into the circuit board. In particular, this coating can also be performed during the printed circuit board manufacturing process. In this case, it is particularly expedient for a solder-inhibiting coating (for example solder mask) to be applied to the cooling inlay in defined areas in order to simplify the assembly of the electronic components.
  • a solder-inhibiting coating for example solder mask
  • electrical connection techniques are direct connections by pressure contact, soldering, welding, caulking or similar techniques into consideration.
  • the SMD soldering is preferably used predominantly or exclusively together with the press-fit technique.
  • high current bridges or busbars are applied to the circuit board for electrically connecting the cooling inlays arranged on the printed circuit board in insulated areas, wherein attachment of the high current bridges is expediently carried out using the aforementioned connection techniques.
  • the high-current conducting element in particular a cooling inlay, has the form of a complex conductor track, so that it is multiply branched and / or curved several times and / or provided with multiple connecting points for the electrical components.
  • the high-current conducting element expediently has one or more joining points, with which form-fitting connections with the conductor track or parts thereof can be formed, wherein the joining points represent dovetail connections or similar connections. Due to the shape of the joining point can be produced in a particularly simple and thus advantageous manner without a cohesive or non-positive connection only by the positive connection.
  • circuit board arrangement described above allows the transport of electrical currents in the range of preferably more than 10 A, in particular more than 30 A, via the high-current conductor tracks.
  • the invention also relates to a method for producing the printed circuit board assembly described above, in which at least one cooling inlay is pressed with a machine in a printed circuit board assembly, with at least one low-current conductor before, in a further step, the printed circuit board assembly equipped with electrical components according to the SMD method becomes.
  • solder-hiding coating in defined areas before or after the pressing of the cooling inlay on the surface thereof.
  • the circuit board assembly according to the invention is preferably part of a control unit housing and in this particular fully or partially inserted by means of press-fitting.
  • press-fit contacts can be used, with the larger press-in contacts then being at least partially inserted directly into recesses of cooling inlays. It is expedient, for example, to use a larger and a smaller standard type for press-fit contacts.
  • the printed circuit board arrangement and the control unit housing are preferably used in electronics of motor vehicles.
  • FIGS. 3-6 different possibilities for mounting the printed circuit board with electronic components
  • FIGS. 7, 8 each show a printed circuit board in cross section
  • 11 is a circuit board with a screw
  • 12 shows a printed circuit board with a complex shaped cooling lin
  • Fig. 13 is a printed circuit board with additional cooling
  • Fig. 14 is a printed circuit board with a socket contact.
  • FIG. 1a shows a printed circuit board 16 with a plurality of cooling inlays 21, 22, 22 'and 22 "made of solid copper embedded in the printed circuit board.
  • Two cooling inlays 21, 22 '' have contact holes 15 and 15 '' for contacting with the press-fit or plug-in technique described below.
  • a power supply of a consumer such as that of an electric motor, are connected to the circuit board.
  • FIG. 1b) shows the same printed circuit board 16 with SMD components 17, 17 'and 18 equipped with SMD technology.
  • the electrical components 17, 17' and 18 are placed or soldered onto the cooling inlays for cooling with their cooling surface. At least some of the connection legs of the power SMD components are connected to a cooling lin- ing.
  • the current-carrying terminals of the power semiconductor components 17 are thereby brought with a busbar heat sink inlay 22 '' up to a first contact hole area (holes 15 ''), which is integrated in cooling inlay 22 ''.
  • the insulating space between the cooling inlay 21 and the further cooling inlay 22 is bridged by a resistance component (shunt 18) applied by SMD soldering.
  • Cooling inlay 22 conducts the current flowing from the semiconductor elements via the resistor to the further contact hole area on cooling inlay 22.
  • the shape of cooling inlay 21 is configured such that a plurality of electronic components 17 are arranged.
  • Cooling inlay 21 is preferably provided for this purpose with recesses for the connecting legs of the components 17 to be insulated. 22 'shows three floating cooling inlays, which are each provided with a contact hole for contacting, for example, an electric motor.
  • the high current leading terminal legs of the power semiconductor 17 ' are electrically connected to the surface of the cooling inlays 21 and 22' (eg soldered).
  • the cooling vanes of the power semiconductor 17 ' are also connected by soldering each with cooling inlays.
  • the circuit arrangement shown in FIG. 1b) represents a circuit example for a power stage of a B6 bridge, wherein this is shown for the sake of simplicity without possibly additionally required interference suppression components.
  • the illustrated bridge circuit can be used, for example, for the clocked control of brushless motors.
  • Fig. 2a shows a circuit board 16 with round cooling inlays 21, 22 wherein the contact holes 22 are provided with contact holes.
  • the cooling inlays from FIG. 2 a) are additionally equipped with busbars 20 and a semiconductor component 17. In both cases the assembly is done automatically by means of SMD technology.
  • one of the bus bars 20 conducts high currents, but on the other hand also indirectly serves via an inlay as a heat sink for the heat-generating component 17.
  • the illustrated in cross-section, populated printed circuit board 16 in Fig. 3 comprises two cooling inlays 21 and a soldered Power semiconductor component 17.
  • the assembled printed circuit board 16 in FIG. 4 comprises two cooling inlays 21 as in FIG. 3, but with an SMD shunt resistor 18 electrically contacted to the cooling inlays; In the case of FIG. 5, a coil 19 is also soldered in SMD technology.
  • the cooling surface of SMD semiconductor device 17 is placed on one of the cooling inlays 21.
  • the cooling inlays 21 are connected to each other via an SMD busbar 20 electrically and thermally conductive.
  • a circuit board 16 is shown with a cooling inlay 21 made of Cu, wherein a compound ofdeinlays with an outer layer of the circuit board can be seen, which is made by copper plating of the circuit board or by tinning.
  • Circuit board 16 in Fig. 8 comprises a cooling inlay 22 with a bore 15, which serves as a contact point.
  • a press-in pin or a part of a socket can be inserted.
  • the further bore shown to the right of bore 15 is a conventional through-connection in the printed circuit board, which in the example illustrated connects a conductor track of the uppermost and lowermost layers.
  • FIG. 9 a bore 16 of a cooling inlay, which is shown in FIG. borrowed with the cooling inlay in Fig. 8, a press-in contact 12 is inserted.
  • FIG. 10 shows a variant of a printed circuit board 16 with a drilled cooling inlay and a further printed circuit board bore 29.
  • a multispinned press-in contact connector 13 is inserted into the existing holes, whereby an electrical connection between the cooling inlay and one or more printed conductors is obtained. In this way, it is also advantageous to contact inner conductor tracks of the multilayer printed circuit board 16.
  • Press-fit contact connector 13 provides for a secure electrical connection to the circuit board, on the other hand, for improved mechanical connection of the cooling inlays to the circuit board or for a connection of both contacts to a housing which (not shown here) carries the press-in connector. That is, a very large cooling inlay hanging preferably on a plurality of press-fit contact connectors 13 can be securely held in this way.
  • a screw 14 forms the contact element to cooling inlay 22, as a result of which, for example, a current-carrying line can be electrically and mechanically connected to the cooling inlay.
  • a complex shaped cooling inlay 21 is shown, which has form-fitting, rounded joint points like a dovetail joint similar puzzle pieces, with the help of individual parts of the circuit board 16 are connected.
  • This solves the problem of mechanical instability that occurs when a very long inlay is inserted into the circuit board.
  • the special shape of the cooling inlay significantly increases the mechanical stability of the printed circuit board.
  • printed circuit board 16 also comprises a copper inlay 21, wherein a cooling attachment 26 is applied to the copper lining, which provides additional outward cooling, and which is particularly simple by means of a thermal paste 25, a heat conducting foil or a heat conducting adhesive with the cooling inlay 21 lets connect.
  • Cooling top 26 is expediently a simple heat sink. If the connection does not need to be insulated, a solder or weld joint is also suitable. In the case of soldering or welding, in addition to the cooling effect, the contact can also be used as a low-resistance high-current connection.
  • the printed circuit board 16 shown in Figure 14 includes a drilled copper inlay 22 into which a conventional socket contact 28 (e.g., tuft plug) is plugged. In this way, a particularly simple electrical connection can be made from the outside with the circuit board.
  • a conventional socket contact 28 e.g., tuft plug

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un agencement de carte à circuits imprimés, en particulier un agencement de carte à circuits imprimés à couches multiples (16), qui comporte au moins une piste conductrice pour courants faibles, l'agencement de carte à circuits imprimés convenant pour le montage d'au moins un composant électronique de puissance qui doit être refroidi. La carte de circuits imprimés, faite dans un matériau non conducteur, comprend au moins un insert de refroidissement (22, 21, 22') encastré dans la carte à circuits imprimés pour le refroidissement du composant de puissance. L'insert de refroidissement constitue au moins partiellement un élément conducteur pour courants forts pour ledit ou lesdits composants électroniques de puissance. La section ou l'intensité maximale admissible de l'élément conducteur pour courants forts est nettement supérieure à la section ou à l'intensité maximale admissible de la piste conductrice pour courants faibles, et l'élément conducteur pour courants forts est utilisé et/ou co-utilisé pour le raccordement électrique du composant de puissance.
EP09753870A 2008-05-26 2009-05-26 Agencement de carte à circuits imprimés pour composants électroniques sollicités thermiquement, en particulier dans des appareils de commande de véhicules automobiles Withdrawn EP2283715A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008025078 2008-05-26
DE102009022110A DE102009022110A1 (de) 2008-05-26 2009-05-20 Leiterplattenanordnung für thermisch belastete elektronische Bauelemente, insbesondere in Kraftfahrzeugsteuergeräten
PCT/EP2009/056359 WO2009144215A1 (fr) 2008-05-26 2009-05-26 Agencement de carte à circuits imprimés pour composants électroniques sollicités thermiquement, en particulier dans des appareils de commande de véhicules automobiles

Publications (1)

Publication Number Publication Date
EP2283715A1 true EP2283715A1 (fr) 2011-02-16

Family

ID=40888130

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09753870A Withdrawn EP2283715A1 (fr) 2008-05-26 2009-05-26 Agencement de carte à circuits imprimés pour composants électroniques sollicités thermiquement, en particulier dans des appareils de commande de véhicules automobiles

Country Status (4)

Country Link
US (1) US20110096495A1 (fr)
EP (1) EP2283715A1 (fr)
DE (1) DE102009022110A1 (fr)
WO (1) WO2009144215A1 (fr)

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Also Published As

Publication number Publication date
WO2009144215A1 (fr) 2009-12-03
US20110096495A1 (en) 2011-04-28
DE102009022110A1 (de) 2010-02-04

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