EP2193538A1 - Röntgenanode mit verbesserter wärmeableitung - Google Patents
Röntgenanode mit verbesserter wärmeableitungInfo
- Publication number
- EP2193538A1 EP2193538A1 EP08799932A EP08799932A EP2193538A1 EP 2193538 A1 EP2193538 A1 EP 2193538A1 EP 08799932 A EP08799932 A EP 08799932A EP 08799932 A EP08799932 A EP 08799932A EP 2193538 A1 EP2193538 A1 EP 2193538A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- diamond
- region
- metal
- ray anode
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 title abstract description 8
- 239000010432 diamond Substances 0.000 claims abstract description 69
- 229910052751 metal Inorganic materials 0.000 claims abstract description 68
- 239000002184 metal Substances 0.000 claims abstract description 68
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 67
- 239000002905 metal composite material Substances 0.000 claims abstract description 43
- 239000002131 composite material Substances 0.000 claims abstract description 25
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 18
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 18
- 229910052796 boron Inorganic materials 0.000 claims abstract description 16
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 12
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 11
- 150000002739 metals Chemical class 0.000 claims abstract description 10
- 229910052735 hafnium Inorganic materials 0.000 claims abstract description 8
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 8
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 8
- 229910052720 vanadium Inorganic materials 0.000 claims abstract description 8
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 8
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 5
- 239000000956 alloy Substances 0.000 claims abstract description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 49
- 239000011230 binding agent Substances 0.000 claims description 40
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 239000011159 matrix material Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 6
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 5
- 230000000737 periodic effect Effects 0.000 claims description 5
- 229910052702 rhenium Inorganic materials 0.000 claims description 5
- 230000007423 decrease Effects 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 229910000691 Re alloy Inorganic materials 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910001080 W alloy Inorganic materials 0.000 claims description 2
- 150000001247 metal acetylides Chemical class 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 239000000356 contaminant Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 4
- 239000000843 powder Substances 0.000 description 29
- 239000012071 phase Substances 0.000 description 19
- 239000010949 copper Substances 0.000 description 13
- 239000000203 mixture Substances 0.000 description 11
- 238000009715 pressure infiltration Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000003825 pressing Methods 0.000 description 7
- 238000005245 sintering Methods 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 238000010276 construction Methods 0.000 description 6
- 238000005242 forging Methods 0.000 description 6
- 229910002804 graphite Inorganic materials 0.000 description 6
- 239000010439 graphite Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 238000010290 vacuum plasma spraying Methods 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000001513 hot isostatic pressing Methods 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000004663 powder metallurgy Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 229910000676 Si alloy Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000005338 heat storage Methods 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910000521 B alloy Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910002480 Cu-O Inorganic materials 0.000 description 1
- 229910017315 Mo—Cu Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000002591 computed tomography Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007723 die pressing method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001171 gas-phase infiltration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- DECCZIUVGMLHKQ-UHFFFAOYSA-N rhenium tungsten Chemical compound [W].[Re] DECCZIUVGMLHKQ-UHFFFAOYSA-N 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 238000005050 thermomechanical fatigue Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910000663 tzm Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
- H01J35/08—Anodes; Anti cathodes
- H01J35/10—Rotary anodes; Arrangements for rotating anodes; Cooling rotary anodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/08—Targets (anodes) and X-ray converters
- H01J2235/081—Target material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/08—Targets (anodes) and X-ray converters
- H01J2235/083—Bonding or fixing with the support or substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/08—Targets (anodes) and X-ray converters
- H01J2235/086—Target geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/12—Cooling
- H01J2235/1204—Cooling of the anode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/12—Cooling
- H01J2235/1225—Cooling characterised by method
- H01J2235/1291—Thermal conductivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/12—Cooling
- H01J2235/1225—Cooling characterised by method
- H01J2235/1291—Thermal conductivity
- H01J2235/1295—Contact between conducting bodies
Definitions
- the invention relates to an X-ray anode, which consists of a X-rays by bombardment with focused electrons generating coating, which is connected to a carrier body.
- the carrier body comprises a strength-giving region of a material having a strength at 500 ° C. greater than 100 MPa.
- the overwhelming majority of the radiation sources used today in X-ray computed tomography are X-ray rotary anodes in which the energy of the electron beam introduced in the line focus is distributed to a ring, the so-called focal path, by rotation of the anode at high speed.
- the supplied during recording energy of up to several megajoules is initially largely stored in the X-ray anode and delivered especially in the pause time between shots by radiation in rotary anodes with Gleitrillenlager also by heat conduction into the camp to the surrounding cooling medium.
- Rotary anodes consist of a X-radiation by the bombardment with focused electrons generating coating, for example of a tungsten-rhenium alloy, on a support body, such as a disc of a Molybdenum-based material is applied.
- a molybdenum base material customary for this application is TZM with the composition Mo-0.5 wt.% Ti-0.08 wt.% Zr-0.04 wt.% C.
- TZM molybdenum base material customary for this application
- the composition Mo-0.5 wt.% Ti-0.08 wt.% Zr-0.04 wt.% C can be soldered to increase the heat storage capacity and heat radiation on the back of the metal disc a graphite body.
- the starting temperature of the tube operation (about 40 0 C) are the thermal conductivities of W-10 wt.% Re, TZM and graphite at approximately 85, 125 and 135 W / mK, but fall off significantly with increasing anode temperature.
- the anode In a new generation of X-ray tubes, the so-called rotary tubes, the anode is firmly connected to the floor as a whole with a rotating tube and actively cooled at its rear. The energy balance of the anode is dominated by the heat dissipation into the cooling medium. The heat storage plays a minor role.
- DE 10 2005 039 188 B4 describes an X-ray tube with a cathode and an anode made of a first material, wherein the anode at its side facing away from the cathode at least partially with a heat conducting element made of a second material having a higher thermal conductivity than the first material is provided for dissipating heat, wherein the second material has a thermal conductivity of at least 500 W / mK and the second material is made of titanium-doped graphite.
- DE 10 2004 003 370 A1 describes a high performance anode plate for a directly cooled rotary tube made of a high temperature resistant material, e.g. Tungsten, molybdenum or a composite of the two materials, wherein in the region of the focal spot the bottom of the anode plate is formed and / or in this another highly thermally conductive material or attached, that is an improved heat dissipation and thus a lower temperature gradient within this material range results.
- a material with high thermal conductivity while copper is mentioned.
- the X-ray anode consists of a coating and a carrier body, wherein the carrier body comprises a region of a diamond-metal composite material in addition to a strength-giving region.
- Diamond-metal composite consists of diamond grains surrounded by binder phase (s).
- the binder phase (s) consists / consist of a binder metal preferably based on copper, silver, aluminum and alloys of these materials, and optionally up to 20 vol.% Carbides.
- Diamond-metal composite material wherein the proportion of diamond to the top is highest and decreases in the direction of maximum heat flow. As a result, a minimization of the bond stresses, caused by different thermal expansion coefficients of the materials used, can be achieved. Furthermore, diamond powder having a wide grain size spectrum can be processed. Preferred particle sizes are in the range of 50 to 400 ⁇ m, ideally 100 to 250 ⁇ m. In addition to natural diamonds, cheaper synthetic diamonds can also be processed accordingly.
- the preferred volume fraction of the diamond grains is 40 to 90% by volume, that of the binder phase (s) 10 to 60% by volume.
- a diamond content of 40 to 90 vol.% Ensures that the bond stresses are reliably reduced to an uncritical level for the application. Particularly advantageous diamond and binder phase contents are 50 to 70% by volume and 30 to 50% by volume.
- the binder metal preferably consists of 80 to 100 at.% Of at least one matrix metal selected from the group consisting of Cu, Ag, Al, 0 to 20 at.% Of a metal having a solubility at room temperature in the matrix metal of less than 1 at.% And 0 to 1 at.%. of a metal having a solubility at room temperature in the matrix metal greater than 1 at.%, residual impurities caused by manufacture. Alloying elements with a solubility at room temperature in the matrix metal smaller than 1 at.% Reduce the thermal conductivity to a small extent and can therefore be present up to 20 at.%, While alloying elements with a solubility greater than 1 at.% Due to their negative influence on the thermal conductivity with 1 At% are limited.
- the matrix metal is a carbide-forming element, such as aluminum
- the element forming the carbide phase is also contained in the binder metal.
- the carbide-forming elements which have a solubility of less than 1 at.% In the respective matrix metal. If the solubility is greater, in turn, the thermal conductivity of the binder metal and thus the diamond-metal composite material is reduced.
- Preferred binder metal compositions are 0.005 to 3At% aluminum materials. one or more elements of the group V, Nb, Ta, Ti, Zr Hf, B, Cr, Mo, W and / or with 0.005 to 20 At.% Si.
- these materials with 0.005 to 5 at.% Of one or more elements of the group Zr, Hf and / or 0.005 to 10 at% of one or more elements of the group V, Nb, Ta, Cr, Mo, W and /. or 0.005 to 20 at.% Si.
- Particularly advantageous properties are achieved with Cu-base matrix metals containing from 0.005 to 3 at.% Of one or more elements of the group Ti, Zr, Hf and / or 0.005 to 10 at.% Of one or more elements of the group Mo, W, B, V, Nb, Ta, Cr, and / or 0.005 to 20 At.% B are alloyed.
- binder metals are Ag alloys with 0.1 to 12 At.% Si, and Cu alloys with 0.1 to 14 at.% Boron, balance usual impurities proved.
- a particularly advantageous effect can also be achieved if already coated diamond powders (metallic or carbide coating) are used.
- the support body in addition to the diamond-metal composite material still a strength giving region of a structural material having a strength at 500 ° C of greater than 100 MPa.
- the diamond-metal composite is protected against destructive deformation or crack initiation by centrifugal forces or thermo-mechanical stresses due to the structural rigidity of the structural component. This makes it possible to optimize the diamond-metal composite on the one hand in terms of thermal conductivity, in particular by increasing the proportion of diamond.
- the thermal expansion of the diamond-metal composite material can be adapted to the structural material.
- the functions of the carrier body can be decoupled in terms of structural strength and bursting strength on the one hand and on heat dissipation on the other hand.
- Particularly suitable structural materials are Mo, Mo alloys, W, W alloys, W-Cu composites, Mo-Cu composites, particle-reinforced Cu and particle-reinforced Al alloys.
- Particularly advantageous molybdenum alloys are TZM (Mo-0.5 wt.%, Titanium-0.08 wt.%, Zirconium-0.04 wt. C) and MHC (Mo-1.2 wt.% Hf-O , 08 wt.% C).
- the area of the diamond-metal composite material can connect directly to the covering. This is possible and useful if the temperature on the backing surface can be lowered by the diamond-metal composite so far that no material damage, such as melting of the binder phase (s) of the diamond-metal composite occur. If this is not the case, it is advantageous if the strength-giving region consists of a structural material which is dimensionally stable under conditions of use, preferably molybdenum, tungsten or an alloy thereof Metals, between the
- Diamond-metal composite material and the covering extends.
- the diamond-metal composite material is preferably arranged under that region of the covering in which the heat is generated by the action of the electron beam. For an X-rayed anode this is the annular focal track. This results in preferred embodiments for the area of the
- Diamond-metal composite namely those with axially symmetric geometry, such as a disc or a ring.
- the cross section is preferably approximately rectangular or trapezoidal.
- Attachment of cooling structures can be machined with conventional machining processes.
- highly thermally conductive metals are copper, aluminum, silver and their alloys to mention.
- This heat-dissipating area is again preferably designed as a ring element or as a disk and with the
- Diamond-metal composite material and / or materially bonded to the strength-giving area.
- the x-ray anode preferably has the following structure, at least in the region of the maximum heat load:
- 0.01 mm to 1 mm coating, 0 to 4 mm strength region, 2 to 15 mm diamond metal composite area and 0 to 10 mm heat dissipating area 0.01 mm to 1 mm coating, 0 to 4 mm strength region, 2 to 15 mm diamond metal composite area and 0 to 10 mm heat dissipating area.
- a minimum pad thickness of 0.01 mm may be required for X-ray physical reasons.
- heat dissipation is reduced, since the commonly used W-Re alloys and the available structural materials offer a better performance than the standard Diamond-metal composite material have reduced thermal conductivity. It is particularly advantageous if the thickness of the covering is 0.2 to 0.4 mm or that of the strength-giving area is 0.5 to 4 mm.
- the construction according to the invention of an X-ray anode can be used particularly advantageously in the case of rotating anodes and, in turn, when the rotary anode is used as the actively cooled bottom of a rotary-piston tube.
- the center is formed only from the structural material.
- the region made of the diamond-metal composite material is embedded as a ring-shaped or disc-shaped element in a corresponding recess of the strength-giving region of the carrier body and is thus supported by this with respect to the mechanical loads occurring.
- the structural material on the one hand with the coating, on the other hand materially connected to the diamond-metal composite material.
- Diamond-metal composite material can advantageously already be carried out in situ during its synthesis in suitable recesses of the strength-imparting region of the anode body (for example by pressure infiltration or by hot isostatic pressing).
- the composite material can be synthesized on its own and a filler material can be produced therefrom in a suitable form, which is then adhesively bonded to the structural component, for example by soldering or another known joining process.
- the binder metal is bonded to the diamond either via the melt phase or via the solid phase.
- the processes advantageously proceed by means of pressure infiltration. Typical infiltration temperatures are about 100 0 C above the respective melting point of the binder metal. From the reactions with the diamond grain, the carbide phases which surround the diamond grains may then optionally be formed.
- a particularly suitable production process comprises the following production steps: ⁇ producing a composite body formed from the structural material and the facing material by powder metallurgical composite pressing / sintering / forging or applying the lining material to the structural material by vacuum plasma spraying;
- the diamond powder uncoated or coated (layer thickness 0.05 to 50 microns) preferably with a metal or a
- Carbide of a metal from the group of 4b, 5b, 6b metals of the Periodic Table, B and Si may be present;
- the attachment of the diamond grain to the binder metal is caused by diffusion.
- Suitable methods are, for example, hot pressing or hot isostatic pressing of
- Diamond-metal powder mixtures are advantageously improved or accelerated by suitable coatings of the diamond grains.
- the contents can be determined by suitable pretreatment of the diamond grains and choice of the consolidation conditions
- Supplementary materials are reduced by orders of magnitude or possibly completely omitted, whereby the high thermal conductivity of the pure binder phase can be largely retained.
- Combinations of both reaction paths for example passing through the melt phase under pressure for pore-free backfilling of the diamond bed followed by a solid-pressure diffusion phase at lowered temperatures, may also be advantageous, in particular for realizing high diamond fractions of the composite material.
- a particularly suitable method here comprises the production steps:
- 50 ⁇ m may preferably be present with a metal or a carbide of a metal from the group of 4b, 5b, 6b metals of the Periodic Table, B and Si;
- Another suitable method comprises the production steps:
- Structural material and the lining material is formed by powder metallurgy composite pressing / sintering / forging or application of the lining material to the structural material by vacuum plasma spraying; ⁇ introducing a depression into the structural material on the side facing away from the lining;
- the diamond powder uncoated or coated (layer thickness 0.05 to 50 microns) preferably with a metal or a carbide of a metal from the group of 4b, 5b, 6b metals of the Periodic Table, B and Si may be present, at a pressure preferred from 70 to 700 MPa;
- Hot isostatic pressing of the known assembly at a pressure of 50 to 300 MPa and a temperature T of 0.6 x
- Composites e.g. the gas phase infiltration of the binding metal, in
- Figure 1 shows a sketch of the cross section of the invention
- Figure 2 shows a sketch of the cross section of the X-ray anode according to the invention according to Example 5
- FIG. 3 shows a sketch of the cross section of the X-ray anodes according to the invention according to Examples 6 and 7 example 1
- Cu-diamond composites at 500 0 C was between 290 and 350 W / m. K.
- Diamond-metal composite material each introduced a diamond bed with a mean grain diameter (determined by laser optics) of 150 microns and the ring mold infiltrated via gas pressure infiltration with Ag alloys of the following compositions: Ag-0.5At. % Si, Ag-3At.% Si, Ag-11At.% Si and Ag-18At.% Si.
- diamond powder with a mean grain diameter (determined laser-optically) of 150 .mu.m coated with Nb was introduced into the ring mold and above this pure Ag was positioned in lumpy form. Idente experiments were carried out with Cr, Ti and Mo coated powders. The gas pressure infiltration was carried out under Ar protective gas atmosphere at 1000 0 C with a gas pressure of 2 bar. The volume fraction diamond was about 55% for all samples.
- the thermal conductivity of Ag-diamond composites was between 340 and 440 W / mK at 500 ° C.
- discs were prepared according to Example 1.
- a diamond bed having a mean grain diameter (determined laser-optically) of 150 ⁇ m was introduced and the ring mold was infiltrated via gas pressure infiltration with Al materials of the following compositions: Al, Al-3At.% Si, Al-12At.% Si and Al-15At.% Si.
- diamond powder with a mean grain diameter (determined by laser optics) of 150 .mu.m coated with Nb (layer thickness about 1 .mu.m) was introduced into the ring mold and above this Rein-Al was positioned in lumpy form.
- Idente experiments were carried out with Cr, Ti and Mo coated powders.
- the gas pressure infiltration was carried out in each case under Ar protective gas atmosphere at 700 ° C. with a gas pressure of 2 bar.
- the volume fraction diamond was about 55% for all samples.
- a rotating anode -1- with a construction according to FIG. 1 was produced as follows:
- the strengthening region -4- of the support body -3- was made of TZM by conventional powder metallurgy via powder pressing / sintering / forging and overdriving the precontour (with external diameter 125 mm ) produced.
- the X-ray generating coating -2- from W-5Gew.% Re was applied by means of vacuum plasma spraying. From the strength-giving area -4- of the support body -3- below the covering -2- an annular area of 25 mm width was turned out with a residual thickness of the festtechnikssellden range -4- of 1 mm.
- the area thus prepared -5- from the diamond-metal composite material had a volume fraction of approximately 55% diamond, and an expansion coefficient at RT of 6.5 E "6/0 K.
- the thermal conductivity of the Cu-diamond composite material was 480 W / mK at 22 ° C and 350 W / mK at 500 0 C.
- a rotary anode -1- with a construction according to FIG. 2 was manufactured as follows.
- the strength-giving region -4- of the support body -3- was made of the high-strength Mo alloy MHC (Mo-1, 2Gew.% Hf-0.04 to 0.15 wt.% C), wherein the X-ray generating coating - 2- from W10Gew.% Re was bonded by the usual powder metallurgical method via co-pressing / sintering and composite forging with the strength-giving range -4-.
- the production of the annular groove was carried out as described in Example 4.
- a diamond bed with a mean grain diameter of 150 (determined by laser optics) was introduced into the machined annular groove to produce the region -5- of the diamond-metal composite material.
- an Ag-11 At.% Si alloy was positioned in particulate form.
- the infiltration was carried out under Ar protective gas atmosphere at 1000 0 C with a gas pressure of 2 bar.
- the area -5- was completed on the underside of the rotary anode -1- with an excess of molten metal with a thickness of about 2 mm.
- a thermal conductivity of 590 W / mK at 22 ° C or 420 W / mK at 500 0 C was achieved.
- a rotary anode -1- having a construction according to FIG. 3 was produced as follows.
- the production of the strength-giving area -A- from TZM (thickness 15 mm, diameter 140 mm) and the application of the coating -2- from W-5Gew.% Re was carried out according to Example 4.
- the strength-giving area -A- of the support body -3- was turned in the diamond-metal composite to be backfilled ring area (outer diameter 125 mm, inner diameter 80 mm) to a residual thickness of the TZM of 1 mm.
- Diamond and 50 vol.% Of highly pure copper to form the area -5- was backfilled.
- the diamond grains had a diameter of 150 ⁇ m (measured by laser optics) and were coated with 1 ⁇ m SiC for subsequent attachment of the matrix.
- the high-purity Cu powder likewise had a grain diameter of 150 ⁇ m.
- a cover fill of 3 mm copper powder of the same grain size was used to form the heat-dissipating area -6-. This bed was pre-pressed at room temperature and hot pressed at a temperature of 900 0 C for 1.5 hours at a pressure of 40 MPa and thereby compressed to 99.8% of the theoretical density.
- a rotary anode -1- having a construction according to FIG. 3 was produced as follows. The production of the strength-giving area -A-, application of the lining - 2- and production of the ring area was carried out as described in Example 5. A powder bed of a mixture of 70% by volume of diamond and 30% by volume of silver to form the area -5- was pressed by means of die pressing in the approximate shape of the twisted ring area of the strength-giving area -4- and inserted into the twisted ring area. The diamond grains had a diameter of 300 ⁇ m and were coated with 3 to 5 ⁇ m SiC. The Ag powder had a grain diameter of 150 ⁇ m.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- X-Ray Techniques (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
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AT0058307U AT10598U1 (de) | 2007-09-28 | 2007-09-28 | Ríntgenanode mit verbesserter warmeableitung |
PCT/AT2008/000343 WO2009039545A1 (de) | 2007-09-28 | 2008-09-25 | Röntgenanode mit verbesserter wärmeableitung |
Publications (2)
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EP2193538A1 true EP2193538A1 (de) | 2010-06-09 |
EP2193538B1 EP2193538B1 (de) | 2011-08-31 |
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EP08799932A Active EP2193538B1 (de) | 2007-09-28 | 2008-09-25 | Röntgenanode mit verbesserter wärmeableitung |
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US (1) | US8243884B2 (de) |
EP (1) | EP2193538B1 (de) |
JP (1) | JP5450421B2 (de) |
AT (2) | AT10598U1 (de) |
WO (1) | WO2009039545A1 (de) |
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CN102834894B (zh) | 2009-08-11 | 2016-03-02 | 攀时欧洲公司 | 用于旋转阳极x射线管的旋转阳极以及用于制造旋转阳极的方法 |
DE102011079878A1 (de) * | 2011-07-27 | 2013-01-31 | Siemens Aktiengesellschaft | Röntgenröhre und Verfahren zu deren Herstellung |
US20150117599A1 (en) | 2013-10-31 | 2015-04-30 | Sigray, Inc. | X-ray interferometric imaging system |
CA2881864A1 (en) * | 2012-08-17 | 2014-02-20 | Nuvera Fuel Cells, Inc. | Design of bipolar plates for use in electrochemical cells |
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US10269528B2 (en) | 2013-09-19 | 2019-04-23 | Sigray, Inc. | Diverging X-ray sources using linear accumulation |
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JP6429602B2 (ja) * | 2014-11-12 | 2018-11-28 | キヤノン株式会社 | 陽極及びこれを用いたx線発生管、x線発生装置、x線撮影システム |
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DE102004003370B4 (de) | 2004-01-22 | 2015-04-02 | Siemens Aktiengesellschaft | Hochleistungsanodenteller für eine direkt gekühlte Drehkolbenröhre |
DE102005039188B4 (de) * | 2005-08-18 | 2007-06-21 | Siemens Ag | Röntgenröhre |
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2007
- 2007-09-28 AT AT0058307U patent/AT10598U1/de not_active IP Right Cessation
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2008
- 2008-09-25 JP JP2010526109A patent/JP5450421B2/ja active Active
- 2008-09-25 EP EP08799932A patent/EP2193538B1/de active Active
- 2008-09-25 US US12/680,427 patent/US8243884B2/en active Active
- 2008-09-25 AT AT08799932T patent/ATE522920T1/de active
- 2008-09-25 WO PCT/AT2008/000343 patent/WO2009039545A1/de active Application Filing
Non-Patent Citations (1)
Title |
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Also Published As
Publication number | Publication date |
---|---|
JP2010541134A (ja) | 2010-12-24 |
AT10598U1 (de) | 2009-06-15 |
JP5450421B2 (ja) | 2014-03-26 |
US20100316193A1 (en) | 2010-12-16 |
US8243884B2 (en) | 2012-08-14 |
ATE522920T1 (de) | 2011-09-15 |
WO2009039545A1 (de) | 2009-04-02 |
EP2193538B1 (de) | 2011-08-31 |
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