EP2188566A1 - Lampe à del - Google Patents

Lampe à del

Info

Publication number
EP2188566A1
EP2188566A1 EP08785464A EP08785464A EP2188566A1 EP 2188566 A1 EP2188566 A1 EP 2188566A1 EP 08785464 A EP08785464 A EP 08785464A EP 08785464 A EP08785464 A EP 08785464A EP 2188566 A1 EP2188566 A1 EP 2188566A1
Authority
EP
European Patent Office
Prior art keywords
led lamp
led
carrier
lamp
lamp according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP08785464A
Other languages
German (de)
English (en)
Other versions
EP2188566B1 (fr
Inventor
Robert Kraus
Bakuri Lanchava
Wolfgang Pabst
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ledvance GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2188566A1 publication Critical patent/EP2188566A1/fr
Application granted granted Critical
Publication of EP2188566B1 publication Critical patent/EP2188566B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a light-emitting diode (LED) lamp and a method for producing an LED lamp.
  • LED light-emitting diode
  • LED-based light sources can not yet replace traditional light sources in all areas of application. Not least, this is due to the thermal behavior of the light-emitting diodes: when exceeding the maximum permissible temperature, the so-called junction temperature, typically in the range of 120 - is 160 0 C, the LEDs are destroyed. The lifetime of the LEDs also depends heavily on the operating temperature. Therefore, additional measures are needed to get the thermal behavior of the LED systems under control. In addition, LEDs usually can not be easily operated on the grid, but require special drivers or current regulator, since LEDs are per se current-driven element. Further, known LED radiators deviate greatly from the shape of a conventional light bulb, which is disadvantageous for customer acceptance. For example, an LED lamp with E27 socket is known
  • the LED lamp has at least one carrier equipped with at least one LED, as well as a lamp socket or socket for the power connection, and furthermore at least one circuit component interposed between the lamp cap and the at least one LED for operating the at least one LED. Furthermore, the LED lamp has a lamp body made of translucent, d. h., transparent or translucent, material for receiving at least the part of the carrier which carries the LED, -, - wherein the lamp body for cooling the LED lamp by heat convection has a surface structuring.
  • the surface of the LED lamp or lamp body is increased (depending on the shape and type of structuring by more than 100 times compared to a standard light bulb comparable brightness), so that a cooling by increasing the heat transfer between the Lamp surface and the environment is favored by free convection.
  • the LED lamp can operate in a wide power range without using external passive
  • Heatsink or active coolant can be operated, which makes the use of such lamps with sufficient illumination with existing sockets (eg Edison sockets according to DIN 40400 such as E26 / E27, E14 or bayonet sockets like B22d, and so on) only possible .
  • the surface enlargement through the surface structuring can be determined, for example, by so-called 3D scanning with subsequent digitization of the surface of the object.
  • LEDs are not limited. Thus, one or more single color (including white) LEDs may be used, or different colored LEDs, e.g. At least two LEDs of different colors, preferably the RGB basic colors, z. B. according to the patterns RGB, RGGB, RRGB and so on. It is also possible to use series-connected LEDs or LED clusters, so-called LED chains, or parallel-connected LEDs.
  • a carrier As a carrier, a common board, a metal core board for improved heat dissipation or other suitable documents can be used.
  • the metal core board preferably has a patterned copper layer on a dielectric, e.g. polyimide or epoxy resin, and a substrate, e.g. made of aluminum, copper or another metal. In this case, the heat generated on the board is discharged particularly effectively over the cross-sectional area.
  • the carrier is preferably optimized so that the heat generated during operation is well distributed in the interior of the lamp body.
  • the circuit component for operating the LED (s) preferably comprises a driver circuit for switching anti-parallel connected LEDs, comprising a simple rectifier with an LED or a LED chain in a respective branch of the rectifier, and also a current limiter (eg a resistor and / or a current regulator), as well as a switching power supply, preferably in the form of a flyback converter.
  • a driver circuit for switching anti-parallel connected LEDs comprising a simple rectifier with an LED or a LED chain in a respective branch of the rectifier, and also a current limiter (eg a resistor and / or a current regulator), as well as a switching power supply, preferably in the form of a flyback converter.
  • An LED lamp is preferred in which the outline of the lamp body fits into an outline of a conventional light bulb.
  • the LED lamp essentially retains the familiar contours and dimensions of the conventional bulb (eg, Edison Bulb), which can play an important role in customer acceptance.
  • the lamp body also fits into other geometric shapes except the Edison bulb in the context of other standardized outlines or contours (so-called Outlines), z. Of the type A19.
  • An LED lamp is preferred in which the surface structure has a multiplicity of elevations or depressions.
  • the elevations are each formed in the form of islands.
  • Each island preferably has a round or quadrangular basic shape which is round in plan view, with the quadrangular basic shape being designed in particular with rounded corners for simplified cleaning.
  • the elevations may preferably each have an elongated basic shape.
  • the elevations or depressions preferably run along curved trajectories and in particular contain S-shaped sections.
  • the elevations may each have an annular basic shape. It may be preferred if the elevations each with respect to an axis of symmetry, in particular the longitudinal axis, z. B. optical axis, the LED lamp are inclined, in particular in a range of up to 45 °, especially at 45 °.
  • the elevations are in the form of lamellae.
  • the lamellae are aligned substantially parallel to one another. Alternatively, it may be preferred if the lamellae are aligned in a substantially star-shaped manner.
  • An LED lamp may be preferred in which the carrier is formed flat and a plurality of LEDs are mounted distributed on it.
  • An LED lamp may be preferred in which the LEDs are mounted on a flat surface of the LED carrier, the LED carrier extending away from the lamp cap.
  • an LED lamp may be preferred in which the carrier has a cylindrical basic shape
  • the carrier has a flat, round basic shape from which extends a good heat-conducting core along the longitudinal axis of the LED lamp away.
  • the core comprises carbon, aluminum and / or copper.
  • the core preferably has a light-reflecting surface, in particular with barium sulfate.
  • the reflective surface preferably has a phosphor.
  • An LED lamp may be preferred in which the LED carrier is designed as a framework with a plurality of ramifications.
  • the ramifications are arranged parallel to one another.
  • branches are arranged in a star shape relative to one another in plan view.
  • the Lampenkorper has as material preferably thermoplastic, polycarbonate, Teflon and / or epoxy resin, but is not limited thereto.
  • the lamp body is preferably designed as a diffusely scattering optical medium in the visible spectrum.
  • the lamp body preferably has scattering centers (eg balls and / or bubbles). The scattering centers can be provided both in the lamp body and on its surface.
  • the lamp body preferably has a phosphor.
  • the phosphor preferably comprises transparent organic phosphors and / or rare earth complexes with organic phosphorus, and so forth.
  • an LED lamp having a heat exchanger for heat exchange between the carrier and the lamp body.
  • the heat exchanger preferably has metal, a metal compound, graphite and / or nanotubes for good heat conduction.
  • the heat exchanger can extend at least to the surface of the lamp body, so it can at least partially protrude from the lamp body.
  • standardized maximum permissible lamp outlmes should preferably be maintained (eg A19).
  • the fluid may be in direct contact with the at least one LED (housed or unhoused).
  • the cooling medium used is preferably water, ethanol or an ethanol-water mixture, but is not limited thereto.
  • Alcohol is non-toxic, low viscosity, transparent, has a relatively high heat capacity and a low freezing point.
  • Glycol, ethylene glycol and / or glycine supplements may also be used to advantage.
  • the cooling medium is diffusely light-scattering and / or milky white and / or partially transparent.
  • the cooling medium contains a phosphor additive, in particular a phosphorus compound, and so on.
  • the Kuhlmedium low viscosity to promote the heat exchange between the Lampenkorper and the LED module by convection. It preferably has a high
  • the LED module or LED carrier may preferably be designed such that, depending on the orientation of the LED lamp, the heat source (s) occupy a favorable position for the convection of the fluid. This can be ensured by the fact that the LED carrier has sufficient flexibility, so that it gives way to gravity when the orientation of the LED lamp changes, and in this way the possibly spatially distributed heat source (s), typically the LEDs and, if necessary, Circuit components, offset downwards.
  • the LED lamp additionally or alternatively as a surface structuring at least one air passage between the recess for receiving the LED module and the outside of the lamp body allows; the Lampenkorper is thus permeable to air.
  • cooling ribs are arranged in the recess, which are thermally well coupled at least to the LEDs, preferably also to electronic components.
  • the coupling is preferably done using good heat conducting materials and / or heat pipes ("heat pipes"), but there are also other coupling types possible.
  • the cooling ribs are preferably arranged so that they or each ge of them in any burning position of the lamp are sufficiently effective.
  • the surface structuring preferably has at least one opening through the lamp body.
  • Preferred may be an LED lamp having a wire mesh whose spaces are at least partially open.
  • the at least one circuit component is set up so that the LED lamp is dimmable by means of phase gating and / or phase section dimmers.
  • the LED lamp may have a controller that allows dimming and / or color temperature control.
  • this can be done by special buttons or switches on or in the LED lamp, the z. B. can be activated by rocking the lamp body with respect to the base.
  • the LED lamp can be remotely controlled via sound, ultrasound, radio waves and / or infrared radiation.
  • the at least one circuit component is preferably set up such that a color temperature can be controlled via it.
  • an LED lamp is preferred for simple manufacture and for simple assembly, in which the carrier and the lamp base form an LED module.
  • an LED lamp in which the carrier is equipped both with at least one LED and with at least one circuit component.
  • the circuit components z. B. also be mounted on a separate lashing.
  • an LED lamp is preferred in which the surface of the lamp body is enlarged by the surface structuring by up to more than 100 times in comparison to a non-surface-structured lamp body corresponding contour, in particular up to 20-fold, especially two to tenfold.
  • the object is also achieved by means of a method for producing LED lighting modules or LED lamps, in particular LED lamps as described herein, comprising the following steps: watching a carrier with at least one LED; Immersion of the carrier at least partially in a bath with a Umhullmasse and aushventides the ümhullmas- se.
  • the Umhullmasse is translucent, at least in the cured state.
  • the method comprises a step of forming the carrier.
  • the method comprises a step of placing a pedestal on the carrier.
  • the carrier is bestuckt with LEDs of different colors.
  • the carrier is preferably equipped with at least one circuit component (driver and / or control component) for operating the at least one LED.
  • the Umhullmasse on a thermoplastic and / or an epoxy material.
  • the wrap-around compound may preferably be diffusely light-scattering, milky white and / or provided with scattering centers (eg balls / bubbles) and / or phosphors (eg green phosphorus and / or yellow phosphorus).
  • scattering centers eg balls / bubbles
  • phosphors eg green phosphorus and / or yellow phosphorus
  • Preferred is a thermal, chemical or caused by UV curing of Umhullmasse.
  • the base can be placed both before and after curing.
  • the method provides, inter alia, the following advantages:
  • the optical properties of the lamp body can be easily modified by adding appropriate additives to the circulating mass in the liquid state.
  • the desired shape of the LED lamp with increased surface area can also be achieved by adjusting the viscosity of the wettability of Umhullmasse with respect to the bestuckten with the LED scaffold.
  • Heat sources can be placed close to the surface of the lamp body, which promotes heat exchange with the environment.
  • FIG 1-2 show in side view, respectively, another embodiment of a erfmdungsgedorfen LED lamp.
  • FIG. 3 shows, in an oblique view, yet another embodiment of an inventive LED lamp
  • FIG 4 shows in side view yet another embodiment of an LED lamp according to the invention
  • FIG. 5 shows an oblique view of yet another embodiment of an LED lamp according to the invention.
  • FIG. 6 shows a plan view of the LED lamp from FIG. 5;
  • FIG. 7 shows a perspective view of yet another embodiment of an LED lamp according to the invention.
  • FIG. 8 shows a front view of a cross section through the LED lamp of FIG. 7;
  • FIGS. 9-11 each show different embodiments of an LED module
  • FIGS. 12-13 each show a further embodiment of an LED lamp according to the invention as a sectional representation in front view.
  • FIG. 1 shows an LED lamp 1 with an LED module with a carrier (not shown) and a lamp holder or lamp base 2 connected to the carrier in the form of an Edison socket, having an outer contact 3 and a foot contact 4.
  • the carrier is equipped with at least one LED and at least one circuit component interposed between the lamp cap and the at least one LED for operating the LED (not shown).
  • the LED lamp 1 also has a lamp body 5 with a recess for receiving at least the part of the carrier which carries the at least one LED (not shown).
  • the lamp body 5 has a surface structuring for cooling the LED lamp 1 by thermal convection.
  • the surface structuring comprises a multiplicity of elevations 6 or depressions 7 which are round in plan view. These are largely distributed evenly over the surface.
  • the shape of the lamp or lamp body 5 or LED lamp essentially corresponds to the shape of a conventional light bulb.
  • the outline 8 is shown, which essentially reproduces the shape of a conventional light bulb.
  • the surface of the Lampenkorpers 5 can be increased by a multiple.
  • the luminaire 5 is easy to clean. Due to the structuring 6 or 7 shown, depending on the number and height of the elevations 6 or depressions 7, the surface can be enlarged two to ten times without further ado. With a stronger structuring even a surface magnification of more than twenty times can be achieved.
  • the quadrangular structures 11 may be rounded at the corners
  • FIG. 3 shows a further LED lamp 13 with a Lampenkorper 14, the elongated elevations 15 and elongated recesses 16 has on its surface.
  • the elongated protrusions 15 and depression 16 extend along curved trajectories, so that they have S-shaped sections. This arrangement is particularly well suited to allow sufficient heat exchange with the environment regardless of the orientation of the LED lamp 13.
  • FIG. 4 shows a further LED lamp 17 with a lamp body 18, which identifies annular structures.
  • the annular elevations 19 or depressions 20 are related to the Langsach- se of the LED lamp 17 inclined by about 45 °. This has the advantage that the cooling by the convection in horizontal or vertical arrangement of the LED lamp 17 works equally well.
  • FIG. 5 shows a further LED lamp 21 with a lamp body 22, in which the structuring of the surface results in a lamellar structure for particularly good cooling.
  • the fins 23 are arranged parallel to each other.
  • FIG. 6 shows the LED lamp 21 from FIG. 5 in top view.
  • the through holes 24 in the lamp body 22 can be seen in this illustration.
  • FIG. 7 and FIG. 8 show a further LED lamp 25 with a lamp body 26, in which the structuring of the surface also results in a lamellar structure.
  • FIG. 8 schematically shows a cross section through the lamp body approximately in the middle height. In this embodiment, however, the slats 27 are arranged in a star shape. As can be seen from FIG. 7, the outline corresponds to the side view of a conventional light bulb.
  • FIGS. 9 to 11 show examples of LED modules which can be used in the above lamp body.
  • the LED modules are equipped with a light-emitting diode Bestuckten carrier.
  • a carrier a ub-Liehe circuit board, a metal core plates, or any other suitable surface can be used.
  • a metal core plate preferably has a structured copper layer on a dielectric, for example made of polyimide or epoxy resin, and a substrate, for example of aluminum, copper or another metal. In this case, the heat generated on the board over the cross-sectional area is delivered particularly effective.
  • FIG. 9 shows an LED module 28 with a flat LED carrier 29, which extends away from the threaded socket or lamp base 2. LEDs 30 are mounted on both sides of the carrier 29.
  • FIG. 10 shows an LED module 31 with a cylindrical carrier 32, on the circumference of which LEDs 30 are regularly attached.
  • FIG. 11 shows an LED module 33 with a flat, round (disk-shaped) carrier 34, on which LEDs 30 are mounted in a ring, and with a highly heat-conductive, cylindrical core 35.
  • the core 35 extends along the longitudinal axis of the LED lamp.
  • the core 35 may comprise, for example, carbon, aluminum and / or copper.
  • the core 35 is provided with a light-reflecting surface (eg, sheet without a reference mark) to improve the light output.
  • This reflective layer may include barium sulfate, phosphors or other suitable ingredient.
  • the core 35 is dimensioned such that it can be inserted into a lamp body in the recess provided for this purpose.
  • LED carriers may have ramifications. This can be advantageous both for the heat distribution and for the distribution of the light emitted by the LEDs within the lamp body.
  • FIG. 12 shows a schematic cross section through such an LED lamp 36.
  • the carrier is in the form of a framework 37, which essentially has the contours of the LED lamp 36, but strictly complies with the standardized outlines.
  • the framework has a vertical, with LEDs 30 bestuckten section from the side branching off 38 here.
  • the frame 37 is provided with LEDs 30 and, if necessary, with the necessary driver and control electronics (not shown).
  • the framework 37 is embedded in the lamp body 39 of the LED lamp 36.
  • the lamp body 39 forms in the region of the ramifications 38 lamellar len, which extend in the plane perpendicular to the sheet direction.
  • FIG. 13 shows a further exemplary embodiment of an LED lamp 40 with a lamp body 41 with a carrier in the form of a star-shaped framework or star-shaped outgoing branches 42.
  • the lamp body 40 also forms slats in the region of the ramifications 42 which are perpendicular to the plane extend to the sheet direction.
  • the LED lamps according to FIG. 12 and FIG. 13 can be manufactured in such a way that first the carrier is fitted with at least the LEDs, after which the carrier is immersed at least partially for a certain time in a bath with a Umhullmasse forming the lamp body and then the Umhullmasse is cured.
  • the lamp base is put on the be Published the Tragers.
  • the Umhullmasse is made of thermoplastic and / or a Epoxymate ⁇ al.
  • the Umhullmasse diffuses light diffusely by specifically scattering centers are introduced.
  • the Umhullmasse is also milky white. The curing takes place thermally, chemically and / or using UV light.
  • the LED module can be used, for example, precisely fitting in a corresponding recess in Lampenkorper.
  • the LED module may be connected to the lamp body by means of a thread.
  • LEDs can be arranged on a flexible support (eg a so-called flex circuit board).
  • the carriers have a good light-reflecting surface.
  • the surface of the carrier can generally have BaSO 4 , phosphors, metallization and much more.
  • the LEDs can be arranged flat.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

La lampe à DEL selon l'invention comporte un module à DEL avec un support (29) et une prise de lampe (2) connectée au support, tel que le support est implanté d'au moins une DEL (30) et d'au moins un composant de circuit inséré entre la ou les prise(s) de lampe et la ou les DEL pour activer la DEL, ainsi qu'un corps de lampe (5) avec une cavité servant à recevoir au moins la partie du support qui porte la ou les DEL, tel que le corps de lampe comporte une structure de surface pour le refroidissement de la lampe à DEL par convection thermique.
EP08785464.2A 2007-08-10 2008-08-08 Lampe à del Not-in-force EP2188566B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007037820A DE102007037820A1 (de) 2007-08-10 2007-08-10 LED-Lampe
PCT/EP2008/006571 WO2009021695A1 (fr) 2007-08-10 2008-08-08 Lampe à del

Publications (2)

Publication Number Publication Date
EP2188566A1 true EP2188566A1 (fr) 2010-05-26
EP2188566B1 EP2188566B1 (fr) 2017-07-12

Family

ID=39765022

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08785464.2A Not-in-force EP2188566B1 (fr) 2007-08-10 2008-08-08 Lampe à del

Country Status (5)

Country Link
US (1) US8662712B2 (fr)
EP (1) EP2188566B1 (fr)
CN (2) CN101815894B (fr)
DE (1) DE102007037820A1 (fr)
WO (1) WO2009021695A1 (fr)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
US10334735B2 (en) 2008-02-14 2019-06-25 Metrospec Technology, L.L.C. LED lighting systems and methods
US8851356B1 (en) 2008-02-14 2014-10-07 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US8143631B2 (en) 2008-03-06 2012-03-27 Metrospec Technology Llc Layered structure for use with high power light emitting diode systems
US8007286B1 (en) 2008-03-18 2011-08-30 Metrospec Technology, Llc Circuit boards interconnected by overlapping plated through holes portions
US8410720B2 (en) 2008-04-07 2013-04-02 Metrospec Technology, LLC. Solid state lighting circuit and controls
DE102008047933A1 (de) * 2008-09-19 2010-04-15 Osram Gesellschaft mit beschränkter Haftung Beleuchtungsvorrichtung mit einer Leuchtdiode
DE102009008096B4 (de) 2009-02-09 2016-10-27 Osram Gmbh Kühlkörper für eine Leuchtvorrichtung
DE102009009520A1 (de) * 2009-02-18 2010-08-19 Osram Opto Semiconductors Gmbh Steckmodul für ein modular aufgebautes Leuchtmittel, Leuchtmodul für das Leuchtmittel sowie modular aufgebautes Leuchtmittel
DE102009019227A1 (de) * 2009-04-28 2011-01-13 Ledon Lighting Jennersdorf Gmbh LED lamp
US9360203B2 (en) * 2009-05-28 2016-06-07 Koninklijke Philips N.V. Illumination device and method for assembly of an illumination device
WO2010136920A1 (fr) * 2009-05-28 2010-12-02 Koninklijke Philips Electronics N.V. Dispositif d'éclairage avec enveloppe renfermant une source de lumière
TW201109579A (en) * 2009-09-15 2011-03-16 Advanced Connectek Inc Structure of LED lamp
US8593040B2 (en) * 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
US8414151B2 (en) 2009-10-02 2013-04-09 GE Lighting Solutions, LLC Light emitting diode (LED) based lamp
US9103507B2 (en) 2009-10-02 2015-08-11 GE Lighting Solutions, LLC LED lamp with uniform omnidirectional light intensity output
DE102009051763A1 (de) * 2009-11-03 2011-05-05 Osram Gesellschaft mit beschränkter Haftung Beleuchtungsvorrichtung mit einem Kolben
EP2534419A4 (fr) * 2010-02-08 2013-08-07 Nilssen Ole K Lampe refroidie par évaporation
GB2477994A (en) * 2010-02-23 2011-08-24 Ecolumens Ltd Liquid cooled semiconductor light
CN106838657A (zh) 2010-03-03 2017-06-13 皇家飞利浦电子股份有限公司 具有用于转移来自光源的热量的反射器的电灯
DE102010013538A1 (de) * 2010-03-31 2011-10-06 Ledo Led Technologie Gmbh LED-Leuchte als Glühbirnensubstitut
WO2011146677A2 (fr) * 2010-05-20 2011-11-24 Light Prescriptions Innovators, Llc Ampoule à del ayant un diffuseur sphérique translucide et luminophore distant sur celle-ci
US10400959B2 (en) * 2010-11-09 2019-09-03 Lumination Llc LED lamp
RU2447543C1 (ru) * 2011-01-11 2012-04-10 Юлия Алексеевна Щепочкина Лампа светодиодная
RU2447542C1 (ru) * 2011-01-11 2012-04-10 Юлия Алексеевна Щепочкина Лампа светодиодная
US9127816B2 (en) 2011-01-19 2015-09-08 GE Lighting Solutions, LLC LED light engine/heat sink assembly
CN104254904A (zh) * 2011-10-31 2014-12-31 登森·西尔 Led光源
DE102011085646A1 (de) * 2011-11-03 2013-05-08 Osram Gmbh Halbleiterlampe mit Kolben
US8668366B2 (en) 2011-12-07 2014-03-11 Tsmc Solid State Lighting Ltd. Energy star compliant LED lamp
RU2504714C2 (ru) * 2012-02-15 2014-01-20 Общество с ограниченной ответственностью "Тегас Электрик" Способ сборки светодиодной лампы и лампа светодиодная
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
CN102777791B (zh) * 2012-07-12 2015-09-09 深圳和而泰照明科技有限公司 灯具及其全光角led灯泡
DE202012009071U1 (de) 2012-09-21 2012-11-08 Carsten Schmidt LED-Leuchte mit verbessertem Rückstrahlverhalten
DE102012217292A1 (de) * 2012-09-25 2014-03-27 Zumtobel Lighting Gmbh LED-Leuchte
AU2014204827A1 (en) * 2013-01-10 2015-07-30 Franco MIRABELLI Outdoor public lighting lamp having light-emitting diodes and street lamp or lamp-post provided with such a lamp
US20140203939A1 (en) * 2013-01-21 2014-07-24 Rtc Inc. Control and monitoring of light-emitting-diode (led) bulbs
US10565835B2 (en) 2013-01-21 2020-02-18 Rtc Inc. Control and monitoring of light-emitting-diode (LED) bulbs
EP3074691B1 (fr) 2013-11-25 2019-07-03 Signify Holding B.V. Procédé pour fabriquer un dispositif d'éclairage
CN105874265B (zh) * 2013-12-17 2019-06-18 亮锐控股有限公司 低和高光束led灯
USD748840S1 (en) * 2014-05-27 2016-02-02 Lumens Co., Ltd Ceiling light fixture
TW201600790A (zh) * 2014-06-27 2016-01-01 Formosa Optronics Co Ltd 全周光球泡型燈具
CA2961001C (fr) * 2014-09-15 2019-07-16 Nicholas Michael D'onofrio Carte de circuit imprime a noyau metallique refroidi par liquide
US9401468B2 (en) * 2014-12-24 2016-07-26 GE Lighting Solutions, LLC Lamp with LED chips cooled by a phase transformation loop
USD774474S1 (en) * 2015-02-04 2016-12-20 Xiaofeng Li Light emitting diodes on a printed circuit board
CN205079067U (zh) * 2015-07-21 2016-03-09 上海本星电子科技有限公司 遥控灯泡及其光束遥控器
CN106468408A (zh) * 2015-08-17 2017-03-01 上海本星电子科技有限公司 设有遮光部件的遥控灯及其锥形光束遥控器
EP3179153A1 (fr) * 2015-12-11 2017-06-14 Epistar Corporation Appareil d'éclairage
US10578510B2 (en) * 2016-11-28 2020-03-03 Applied Materials, Inc. Device for desorbing molecules from chamber walls
US10849200B2 (en) 2018-09-28 2020-11-24 Metrospec Technology, L.L.C. Solid state lighting circuit with current bias and method of controlling thereof

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5890794A (en) * 1996-04-03 1999-04-06 Abtahi; Homayoon Lighting units
US6793374B2 (en) * 1998-09-17 2004-09-21 Simon H. A. Begemann LED lamp
ES2289822T3 (es) * 1998-09-17 2008-02-01 Koninklijke Philips Electronics N.V. Lampara de led.
DE20018435U1 (de) * 2000-10-27 2001-02-22 Shining Blick Entpr Co Glühbirne mit darin enthaltenen biegbaren Lampenbirnchen
GB2379790A (en) * 2001-08-21 2003-03-19 Green Logic Associates Ltd An illuminated light globe containing two immiscible liquids
CN100493274C (zh) * 2002-01-10 2009-05-27 电灯专利信托有限公司 灯
JP2004296245A (ja) * 2003-03-26 2004-10-21 Matsushita Electric Works Ltd Ｌｅｄランプ
US6880956B2 (en) * 2003-07-31 2005-04-19 A L Lightech, Inc. Light source with heat transfer arrangement
JP4397946B2 (ja) * 2004-03-03 2010-01-13 エス．シー． ジョンソン アンド サン、インコーポレイテッド 活性成分を放出するｌｅｄ電球
DE102005013208A1 (de) * 2004-03-21 2005-10-27 Späth, Christian, Dipl.-Designer LED-Leuchtdioden Leuchte
US7524091B2 (en) * 2004-08-09 2009-04-28 Valeo Sylvania Llc Led bulb refractive relector
US20060034077A1 (en) * 2004-08-10 2006-02-16 Tsu-Kang Chang White light bulb assembly using LED as a light source
CA2478001A1 (fr) * 2004-08-18 2006-02-18 Remco Ampoule electrique a del
DE202005008411U1 (de) * 2005-05-30 2005-07-28 Huang, Hsien-Jung, Yung-Ho Kühlkörper für ein LED-Leuchtelement
JP4410721B2 (ja) * 2005-05-02 2010-02-03 シチズン電子株式会社 バルブ型ｌｅｄ光源
CN2864338Y (zh) * 2006-01-10 2007-01-31 孙文明 Led棒状节能灯泡
WO2007089581A2 (fr) * 2006-01-26 2007-08-09 Great American Technologies, Inc. Ampoule électrique télécommandée par diode électroluminescente
DE202007003679U1 (de) * 2007-03-09 2007-05-16 Hong Kuan Technology Co., Ltd., Sinjhuang City Leuchtdiodenlampe
DE102007017900A1 (de) * 2007-04-13 2008-10-16 Noctron Holding S.A. Leuchtmittel

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WO2009021695A1 (fr) 2009-02-19
CN102620154A (zh) 2012-08-01
CN102620154B (zh) 2015-04-01
DE102007037820A1 (de) 2009-02-12
CN101815894B (zh) 2012-03-21
EP2188566B1 (fr) 2017-07-12
US20120188771A1 (en) 2012-07-26
US8662712B2 (en) 2014-03-04
CN101815894A (zh) 2010-08-25

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