EP2459927A1 - Dispositif d'éclairage et procédé pour monter un dispositif d'éclairage - Google Patents

Dispositif d'éclairage et procédé pour monter un dispositif d'éclairage

Info

Publication number
EP2459927A1
EP2459927A1 EP10743060A EP10743060A EP2459927A1 EP 2459927 A1 EP2459927 A1 EP 2459927A1 EP 10743060 A EP10743060 A EP 10743060A EP 10743060 A EP10743060 A EP 10743060A EP 2459927 A1 EP2459927 A1 EP 2459927A1
Authority
EP
European Patent Office
Prior art keywords
lighting device
carrier
pressing element
latching
pressing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10743060A
Other languages
German (de)
English (en)
Inventor
Thomas Preuschl
Peter Sachsenweger
Günter HÖTZL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2459927A1 publication Critical patent/EP2459927A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49863—Assembling or joining with prestressing of part

Definitions

  • the invention relates to lighting devices, in particular LED retrofit lamps.
  • the invention further relates to a method for producing one of the lighting devices.
  • LED retrofit lamps or their light sources are typically operated with a safety extra low voltage (SELV).
  • the LED retrofit lamp has a driver for operating the LED (s), which comprises a voltage regulator for converting a mains voltage, for example 230 V, to a voltage of approximately 10 V to 25 V, typically a transformer.
  • the efficiency of a SELV driver is typically between 70% and 80%.
  • insulation distances between a primary side and a secondary side with respect to the voltage regulator of at least 5 mm must be maintained in order to avoid electric shock caused by leakage currents.
  • LED retrofit lamps may be constructed so that the LED (s) are mounted on a carrier which is bolted to the heat sink and is electrically isolated therefrom.
  • a necessary length of the creepage distance or insulation between electrically conductive or electrically conductive surface areas (contact fields, conduction traces, etc., eg on copper and / or conductive paste with, for example, silver) and the heat sink is achieved in that, firstly, the potential-carrying surface areas maintain a distance of at least 5 mm from an edge of the support and secondly, an electrically insulating area of at least 5 mm around the screw joints is maintained.
  • the object of the present invention to provide a particularly easy to install and inexpensive and compact lighting device, in particular LED retrofit lamp.
  • a lighting device which has at least:
  • a light source carrier which is pressed by means of at least one pressing element on the support surface, wherein the pressing element is locked to the lighting device.
  • the type of locking is not limited and can be used, for example, as a snap connection (ring snap, Kugelschnapp-, Biegeschnapp- and / or Torsionsschnappharm etc.) or be designed as a ratchet-like locking.
  • the locking can be performed by any suitable means, e.g. B. by means of latching hooks, latching projections, teeth, etc.
  • the body may in particular be a heat sink.
  • the heat sink can advantageously consist of a highly thermally conductive material with ⁇ > 10 W / (m-K), particularly preferably ⁇ > 100 W / (m-K), in particular of a metal such as aluminum, copper or an alloy thereof.
  • the heat sink may also consist completely or partially of a plastic; Particularly advantageous for the electrical insulation and extension of the creepage distances is a good heat-conducting and electrically insulating plastic, but it is also the use of a highly thermally conductive and electrically conductive plastic possible.
  • the heat sink may be formed substantially symmetrical, in particular substantially rotationally symmetric, z. B. about a longitudinal axis.
  • the heat sink may have furnishedableitmaschine, z. B. cooling fins or cooling pins.
  • the light source carrier may have one or more light sources.
  • the type of light sources is initially not limited. However, it is preferred for operation with low power dissipation and a particularly compact design when the light source is a semiconductor light source, eg a laser diode or a light emitting diode (LED).
  • the semiconductor light source may include one or more emitters.
  • the semiconductor emitter or semiconductors may be mounted on the carrier on which other electronic components such as resistors, capacitors, logic devices, etc. may be mounted.
  • the semiconductor emitters may, for example, be applied to the carrier by means of conventional soldering methods.
  • the semiconductor emitters can also be characterized by chip-level connection types, such as bonding (wire bonding, Flip-chip bonding), etc., to a substrate ("submount"), e.g. B. by equipping a substrate made of AlN with LED chips. Also, one or more submounts may be mounted on a circuit board. If there are several waveguide emitters, they can emit the same color, eg. For example, you know what enables easy scalability of brightness. However, the semiconductor emitters can at least partially also have a different jet color, z. B. red (R), green (G), blue (B), amber (A), mint (M) and / or white (W), etc.
  • R red
  • G green
  • B blue
  • A amber
  • M mint
  • W white
  • This may possibly be a beam color of the light source to be tuned, and it can any color point can be adjusted. In particular, it may be preferred if semiconductor emitters of different jet color can produce a white mixed light.
  • semiconductor emitters of different jet color can produce a white mixed light.
  • organic LEDs OLEDs
  • the carrier may be embodied as a printed circuit board or other substrate, for. B. as a compact ceramic body.
  • the carrier may have one or more wiring layers.
  • the support For evenly distributing a plurality of light sources, in particular LEDs, while at the same time simply designing the creepage distances while maintaining predetermined isolation distances, it may be advantageous for the support to be circumferential and concentric or coaxial with an upstanding cable feed element, e.g. Cable duct, is arranged. Also, a small lateral extent of the carrier is achieved relative to a longitudinal axis of the heat sink. It may be advantageous for compliance with predetermined insulation distances, if the light sources are arranged substantially uniformly in the circumferential direction.
  • the carrier may be secured to the heat sink by means of an electrically insulating transition layer.
  • the electrically insulating transition layer can advantageously be adhesive on both sides for reliable connection between the carrier and the heat sink.
  • the transition layer can be eg a thermal interface material (TIM, "Thermal Interface Material") such as a thermal grease (eg silicone oil with additions of aluminum oxide, zinc oxide, boron nitride or silver powder), a film or a plastic or a mat.
  • a thermal grease eg silicone oil with additions of aluminum oxide, zinc oxide, boron nitride or silver powder
  • a film or a plastic or a mat Alternatively, for example, a silicone layer or similar usable.
  • the transitional layer may also have the advantages of high dielectric strength and elongation of the creepage path.
  • the carrier may generally have at least one electrically insulating insulating layer.
  • an insulating layer may consist of a material or composite material which is thermally well and electrically poorly conductive, at least in the thickness direction.
  • an insulating layer of ceramic such. B. with Al2O3, AlN, BN or SiC.
  • the insulating layer may be configured as a multilayer ceramic carrier, z. In LTCC technology. In this case, for example, layers with different materials can be used, for. B. with different ceramics. These may, for example, be alternately highly dielectric and low dielectric.
  • the at least one insulating layer can also consist of a typical printed circuit board base material, such as FR4, which is less thermally advantageous but very cost-effective.
  • the carrier may advantageously have a dielectric strength of at least 4 KV, so that overvoltage pulses of at least this magnitude do not strike through the carrier.
  • a thickness of the carrier can advantageously be in the range between 0.16 mm and 1 mm.
  • the pressure element is latched by means of at least one latching hook on the lighting device. Latch hooks are easy to produce and typically engage in a present on the lighting device latching counter element, z. B. a locking receptacle, a.
  • the pressure element is annular.
  • the annular design is advantageous in particular for use with a plurality of latching hooks, since the plurality of latching hooks can be arranged at a distance from the ring and thus enable a particularly stable and spatially distributed attachment to the lighting device. Consequently, a uniform pressing force exerted by the pressing member on the light source carrier is provided.
  • the lighting device has at least one locking receptacle for receiving at least one latching hook, z. B. a corresponding groove, wherein the locking receptacle is bevelled widening the opening of the locking receptacle on a contact surface with the latching hook.
  • This allows the locking hook to slide to a limited extent in the locking receptacle and experience a difference in height.
  • a tolerance compensation with respect to the carrier can be achieved, as a result of which the pressure force on the carrier or the pressure force of the carrier on its base, in particular the body, can be kept within a predetermined range of values.
  • an angle of inclination of the contact surface which also represents a loosening or joining angle, is between 5 ° and 15 °. It has been found that in this angular range, a firm seat of the pressure element is achieved with simultaneously high protection of the components lying in the force flow from mechanical damage caused by the pressure.
  • the body has a recess and a passage opening from the recess to the support surface. So electrical connections, etc. can be performed directly from the recess to the circuit board.
  • a cable feed element such as a cable channel, be used. The cable feed element can protrude from the support surface and be latched there with the pressure element.
  • Thessenzu Operationss- element has for this purpose at least on its outstanding on the support surface outside a locking means.
  • the pressure element is latched by means of at least one toothed locking ring on the lighting device.
  • the locking ring can be plugged onto the cable feed element.
  • a lock can be used, for example, in be achieved by means of a toothing of the locking ring, the cable feed element or both elements.
  • the cable feedthrough element in a variant on its outer side a toothing or a
  • a latching can be designed, for example, analogously to a latching of a cable tie.
  • a contact pressure on the carrier can be set at least roughly by means of a corresponding relative positioning of the pressing element and of the cable feedthrough element.
  • the recess may in particular be designed and / or provided as a driver cavity for receiving a driver for the light sources.
  • the recess advantageously has an insertion opening for insertion of the driver, for. B. a driver board on.
  • the insertion opening of the recess may advantageously be located on a rear side of the heat sink.
  • the insertion opening and the cable feed element are advantageously located on opposite sides of the recess.
  • the recess may, for example, be designed in the shape of a cylinder.
  • the recess may advantageously be electrically insulated from the heat sink to avoid direct creepage distances, z. B. by means of an electrically insulating lining (also housing the driver cavity, GTK, called), z. B. in the form of an inserted through the insertion opening into the recess plastic pipe.
  • the liner may include one or more fasteners for attachment of the driver.
  • the cable feed element serves to supply or carry out at least one electrical line between the driver located in the recess and the at least one semiconductor light source or the carrier equipped therewith.
  • the cable feed element and the liner may be integrally formed as a single element. With the insertion of the lining into the recess, the cable feed element is then simultaneously pushed through a passage opening of the heat sink.
  • the at least one electrical lead which may be configured, for example, as a wire, cable or connector of any type, may be contacted by any suitable method, e.g. By soldering, resistance welding, laser welding, etc.
  • the driver may be a general drive circuit for driving the at least one semiconductor light source.
  • the driver is designed as a non-SELV driver, in particular as a transformerless non-SELV driver.
  • a non-SELV driver has over a SELV driver higher efficiency of typically more than 90% and can also be built more cost-effectively.
  • There are no safety distances in the driver from the primary side to Secondary side is required, as it is prescribed for a SELV driver using a transformer.
  • a separation between the primary side and the secondary side rather takes place primarily between the carrier and the heat sink.
  • the transformer may advantageously be replaced by a coil or buck configuration / stepdown converter.
  • the pressing element can be present as a separately produced element that can be placed on the lighting device.
  • the pressing element corresponds to the carrier.
  • the pressure element is integrated into the carrier or the carrier has the function of the pressure element.
  • the carrier itself is thus fastened by means of the latching on the body and thereby expresses itself against the support surface.
  • the light source carrier e.g. the circuit board, as such have a latching means.
  • Such a light source carrier is applicable to the embodiments already described above.
  • the pressing element which is present for example in the form of a latching pin, is latched into the passage opening, directly to the passage opening, ie the body, latched or with an insert located in the passage opening, for example a Plastic ring or a plastic sleeve.
  • the passage opening can be formed as a detent hole, and the pressing element can be shaped like a pin with a laterally projecting head and possibly provided with a longitudinal bore.
  • the pressure element can be pressed from the outside into the passage opening and latched and thereby press the carrier to the support surface by the latching.
  • cable channel for example, cables, wires, etc. can be guided out of the recess to the light source carrier.
  • the Through opening to be provided with an insert which has a detent hole for locking the pressure element.
  • the carrier has a substantially concentric with the passage opening arranged carrier opening.
  • the pressure element is formed like a spring disc and is used with at least one peripheral edge region in at least one locking receptacle of the lighting device under tension.
  • no gears or the like need to be provided, which simplifies manufacture.
  • the pressure element additionally with a ratchet-like structure, for. B. a toothing equip.
  • a contact pressure on the carrier can be further increased.
  • the pressure element consists of an electrically non-conductive material.
  • the non-conductive material may be plastic, for example.
  • the pressure element is made entirely of plastic. This allows a simple and inexpensive production.
  • the pressing element has a metallic core, which is surrounded by a plastic jacket. As a result, a higher strength and a higher modulus of elasticity of the pressure element is achieved.
  • latching pressing elements for example a central latching pressing element and a laterally outside latching pressing element.
  • the lighting device is not limited to use at least one latching pressing element ("latching pressure element"), but in addition other types of pressure elements may be used, for.
  • latching pressure element a rotary pressing element, which is fixed by means of a rotary movement of the lighting device.
  • a rotary pressing element can be screwed to the lighting device or attached by means of a bayonet connection.
  • a rotary pressure element can be a contact pressure set with relatively high accuracy.
  • At least one pressing element has a carrier for a, in particular translucent, cover.
  • the cover element has at least one recess for at least one light source or parts thereof. Through the cover, the carrier can be at least partially protected against mechanical or other stress and as a
  • the cover may be translucent or opaque.
  • a translucent cover may also cover the light sources, while an opaque cover has at least one recess in a region of a light cone of the light source. Then, the light source may be at least partially guided by the recess.
  • Such a release of the light source through the cover has the advantage that the cover does not affect a beam guidance of the light source and also does not absorb light.
  • the light source with at least one optically active element, for. As a lens equipped.
  • the cable feed element may also be arranged off-center, for. B. offset laterally from the longitudinal axis of the cooling body or the substrate.
  • the cable feed element can also be outside a lateral extent of the Be arranged carrier. Then, the at least one electrical line can be guided from the outside to the outside of the carrier.
  • a creepage path is at least 1 mm long, particularly preferably at least 6.5 mm.
  • the air gap is preferably at least 4 mm.
  • An at least local thermal conductivity or heat spread of the carrier may advantageously be between 20 (W / m-K) and 400 (W / m-K), e.g. B. about 400 (W / m-K) for a copper layer.
  • the semiconductor light source may advantageously be powered by means of a non-SELV voltage, but use with a safety extra-low voltage (SELV) is also possible.
  • SELV safety extra-low voltage
  • the driver can be a transformerless non-SELV driver.
  • the lighting device can be particularly advantageously designed as a retro-fit lamp, in particular an LED retrofit lamp, or as a module for this purpose.
  • the object is also achieved by means of a method for mounting a lighting device, the method having at least the following steps:
  • a light source carrier in particular LED carrier, which is pressed by means of at least one pressing element on the support surface
  • the pressing element is a hot-caked Kunststoffniet.
  • a tolerance-compensating, permanent pressing against the carrier can be achieved, whereby a vibration safety is achieved by the permanent connection.
  • the hot caulking is easy to carry out.
  • a lighting device having at least
  • a body in particular a heat sink, with an outer contact surface
  • a light source carrier in particular an LED carrier, which is pressed onto the support surface by means of at least one pressing element,
  • the pressure element is a latching spreadable
  • FIG. 1 shows a plan view of an LED retrofit lamp with a populated carrier according to a first embodiment
  • FIG. 2 shows a plan view of the carrier from FIG. 1 in a more detailed illustration
  • FIG. 3 shows the LED retrofit lamp according to the first embodiment as a sectional illustration along the section line A-A from FIG. 1 in a side view;
  • FIG. 4 shows an oblique view of a detail of the sectional view of the LED retrofit lamp according to the first embodiment
  • FIG. 5 shows a representation analogous to FIG
  • FIG. 6 shows a representation analogous to FIG.
  • FIG. 7 shows a representation analogous to FIG.
  • Section of a LED retrofit lamp according to a fourth embodiment shows a sectional view in an oblique view of a mounting device for mounting a pressing element to the LED retrofit lamp according to the fourth embodiment;
  • FIG. 10 shows a representation analogous to FIG.
  • FIG. 11 shows a representation analogous to FIG
  • FIG. 12 shows a sectional view in an oblique view of an enlarged detail of the lighting device according to the sixth embodiment in the region of a latching pressure element
  • FIG. 13 shows a sectional side view of an enlarged detail of the lighting device according to the sixth embodiment in the region of a
  • FIG. 14 shows a top view of a light-emitting diode of one of the LED retrofit lamps
  • Fig. 15 is a plan view showing a cover member for use with the lighting apparatus according to the sixth embodiment
  • Fig. 16 is a plan view showing another cover member for use with the lighting apparatus according to the sixth embodiment
  • Fig.17 shows a sectional view in side view of a
  • FIG.18 shows a sectional view in side view of a
  • FIG. 19 shows a sectional side view of a
  • FIG.20 shows a sectional view in side view of a
  • FIG. 21 shows a sectional side view of a
  • FIG. 22 shows a sectional side view of a lighting device according to an eighth embodiment with a slotted pin in a starting position; 22 shows a sectional side view of a
  • Fig.l shows a plan view of an LED retrofit lamp 1 according to a first embodiment.
  • the LED retrofit lamp 1 is used here for replacing a conventional light bulb with Edison base and therefore has an outer contour, which roughly reproduces the contour of the conventional light bulb at least in its basic form (see also Figure 3).
  • the LED retrofit lamp 1 has an outer shell 2, into which an LED module 3 is inserted.
  • the LED module 3 has an aluminum heat sink 4, on the upper side or front surface 5 shown here, an Al 2 ⁇ 3 support 6 is fixed with an octagonal outer contour.
  • the carrier 6 is equipped with light sources in the form of LEDs 7.
  • the light-emitting diodes 7 shine in the upper half-space, ie in this illustration with a main emission direction out of the image plane.
  • the carrier 6 has a central hole with which the carrier 6 can be plugged tightly over a cable feed element formed here as a cable channel 8.
  • the cable channel 8 serves as an element for the passage of electrical lines (o. Fig.) From a located in the heat sink 4 driver (o. Fig.) To the carrier 6.
  • the carrier 6 and the cable channel 8 are thus coaxial with respect to a perpendicular from the Image axis protruding longitudinal axis L of the lighting device 1 is positioned, wherein the longitudinal axis L extends centrally through the cable channel 8.
  • FIG. 2 shows a plan view of the carrier 6 from Fig.l in a more detailed representation.
  • a front surface 6a of the carrier 6 is equipped with three white light-emitting diodes 7, which are arranged approximately angularly symmetrically about the longitudinal axis L, wherein the longitudinal axis L extends centrally through the hole 9 of the carrier 6.
  • the light-emitting diodes 7 are electrically contactable to their power supply by means of contact surfaces 10 a with the carrier 6.
  • electrical lines (o. Fig.) From the driver through the cable channel to cable connection surfaces 10b out.
  • the electrical conductor tracks used for current conduction are formed by a correspondingly structured (here greatly simplified) outer-side copper layer 11.
  • Both the contact surfaces 10a and the cable connection surfaces 10b and the copper layer 11 represent potential-carrying surface regions, which gen the heatsink 4 are electrically isolated over sufficiently long isolation distances, at least by means of the carrier 6.
  • the copper layer 11 is not executed completely circumferential, but instead is interrupted under the LED and has a radially extending with respect to the longitudinal axis L gap 12 in order to avoid a short circuit.
  • FIG. 3 shows the LED retrofit lamp 1 according to the first embodiment as a sectional view along the section line AA of Fig.l.
  • the LED retrofit lamp 1 does not protrude beyond the outer contour of a conventional incandescent lamp and can be used with its Edison sson 13 as a replacement for a corresponding incandescent lamp.
  • a cylindrical recess in the form of a driver cavity 14 is present, which is coated on its lateral lateral surface 15 and upper end surface 16 with an electrically insulating lining 17 (hereinafter also "housing the driver cavity", GTK, called) made of a plastic.
  • a lower insertion opening 18 is electrically sealed against the heat sink 4 by an attachment 19, which also surrounds the Edison base 13.
  • a driver board 20 is accommodated, which has all or at least some of the required for operating the light emitting diodes 7 elements.
  • the driver board 20 is electrically connected to the Edisonsockel 13 for power supply and outputs the required for operating the light emitting diodes 7 voltage and / or current via electrical cable 21 to the light emitting diodes 7 on.
  • the driver board 20 via the electrical cable 21 with suitable cable connection surfaces 10 connected.
  • the driver implemented on the driver board 20 is here a transformerless non-SELV driver. A separation between the primary side and the secondary side takes place primarily between the carrier 6 and the heat sink 4.
  • the transformerless non-SELV driver may have a coil or buck configuration / step-down converter for voltage conversion.
  • the upper end surface 16 For passing the cables 21 through the upper end surface 16, the upper end surface 16 has a passage opening 22.
  • the liner 17 is configured so that the cable channel 8 connecting the driver cavity 14 and the interior of the liner 17 to the front surface 5 of the heat sink 4 is integrally integrated with the liner 17.
  • the front surface 5 is covered with an opaque or light-scattering piston 27 for its protection and for the homogenization of the light emitted by the lighting device 1.
  • the piston 27 can be clamped to the heat sink 4.
  • FIG. 4 shows an oblique view of a more detailed section from the sectional view of the LED retrofit lamp 1 according to the first embodiment.
  • a pressing element 43 is fitted on the outside, which on its inner side or inner circumferential surface 44 has a toothing 45 matching to the toothing 42 (including possibly a catch). The pressing element 43 leaves the cable channel 8 open.
  • the toothing 42 is provided on a latching-like inner region 46 of the pressure element 43, while webs 47 depart obliquely downwards from the latching-type inner region 46 and rest on the carrier 6.
  • the lining 17 is first inserted into the driver cavity 14 such that the associated cable channel 8 is inserted through the passage opening 22 and thereby protrudes upwards or outwards from or over the support surface 24.
  • the transitional layer 28 which has a central hole, so placed on the support surface 24 that it is arranged with little clearance or distance to the cable channel 8.
  • the cable channel 8 thus serves as a centering aid for supporting the transitional layer 28.
  • the carrier 6, which is already provided with electrical conductors and equipped with light emitting diodes 7, placed on the transition layer 28.
  • the hole 9 of the carrier 6 is attached to the cable channel 8, so that the cable channel 8 also serves as a centering aid for the carrier 6.
  • the pressing element 43 with its ratchet-like inner region 46 is pushed onto the cable channel 8 and then pushed downwards.
  • the pressing element 43 locks on the cable channel 8 and can not be deducted from it.
  • a fixed bearing for the pressure force on the support 6 complementary complementary force is provided.
  • the contact pressure results from the fact that the pressing element elastically bends and expands or remains under tension by pushing down.
  • an annular groove 48 for the use of a lateral end of the webs 47 may be present in the carrier 6, but is not mandatory.
  • a contact pressure of the pressing member 43 can be at least roughly adjusted to the support.
  • FIG. 5 shows parts of a lighting device 50 in a representation analogous to FIG. 4, wherein the pressing element 51 is now present as an annular pressure element 51 with a cross-sectional shape of an inverted "U".
  • the outer leg of the "U” has at its circumference at regular intervals downwardly directed short latching hook 54.
  • the latching hooks are intended to be introduced into a locking receptacle in the form of a circumferential groove 55, wherein the groove 56 of the heat sink 4 is introduced.
  • the edge 56 surrounds the support surface 24 of the heat sink 4 circumferentially at the lateral edge.
  • the top of the groove 55 which contacts the latching hook 54, not designed horizontally, but with an inclination angle or joining and releasing angle of about 10 ° designed so that the inclination angle the groove 55 to widens its opening. Due to the angle of inclination, it is possible for the pressing element 51, depending on an attachment height on the support 6, to track its height at least in a certain range and thus to maintain a contact pressure in a predetermined range.
  • This embodiment has the advantage of a widely distributed and evenly distributed in the circumferential direction over the outer edge 30 of the carrier 6 force introduction, whereby a
  • FIG. 6 shows parts of a lighting device 60 with an annular pressure element 61 similar to the pressure element 51 of Figure 5, wherein now the pressure element 61 has no reverse in cross-section U-shaped cross-sectional shape. Rather, the pressure element 61 is provided with a cross-sectionally full-surface ring portion 62 which rests on the outer edge 30 of the support 6 and which is equipped in the circumferential direction on its outer surface with latching hooks 63, which 4 in a corresponding latching receptacle 64 of the heat sink received are.
  • the locking receptacle 64 is now not present in the edge 65 of the heat sink, but as a vertically downwards leading, angled groove in the heat sink 4 executed.
  • this third embodiment has the advantage that the pressure element 61 can also be produced from high-temperature-stable plastics, which are typically more susceptible to mechanical failure, at least in the case of thin structures.
  • the volume of the pressing body 61 is increased so far that the lighting device 60 still has a compact construction, so that failure of the material of the pressing element 61 is avoided ,
  • FIG. 7 shows parts of a lighting device 70, in which the pressure element 71 has an annular inner region 72, which can be equipped with detent means in analogy to the first embodiment, but not to be
  • the pressing element 71 has webs 73 which extend obliquely downward from the annular inner region 72. In contrast to the first embodiment, however, the webs 73 do not rest exclusively on the carrier 6, but are held up to a latching receptacle 75 in the form of an annular groove formed in an edge 74 of the heat sink. From the webs 73 each downwardly directed projections 76 from which serve as hold-down and press from above on the support 6 to fix it on the transitional layer 28 and the support surface 24.
  • the pressing element 71 can already be so far under tension on the cable channel 8 without a latching of the inner region 72 that it presses the carrier 6 onto the bearing surface 24.
  • the inner region 72 is similar to the inner region 46 of the first embodiment with a Verrastme- equipped with respect to the cable channel 8, so that the contact pressure can be further increased.
  • the mounting device 80 has a tubular cylindrical outer region 81 and a central retaining element 82.
  • the retaining element 82 is configured to engage and retain the annular hole 83 of the annular inner region 72 of the pressure element 71.
  • Lighting device 70 with two positions, namely an upper starting position and a lower end position.
  • the pressing element 71 is held in the mounting device 80 such that the outer region 81 is displaced downwards relative to the retaining element or the retaining element 82 is pulled back upwards into the outer region 81, as indicated by the arrows.
  • the pressing element 71 is also stretched over the retaining element 82 as a tension element and the outer region 81 as a support in the longitudinal direction L, in that the webs 73 are bent downwards relative to the annular inner region 72. Consequently, the lateral extent of the pressing element 71 is reduced.
  • the mounting device 80 is dimensioned so that it can be fitted into the edge 74 of the heat sink 4 of the lighting device 70.
  • the deformation of the pressing member 71 is sized so that it can be inserted into the edge 74.
  • the mounting device 80 is lowered so long down or in the direction of the carrier 6 until peripheral edge portions 77 of the webs 73 are positioned in front of or adjacent to the locking receptacle 75.
  • the pressing element 71 is relaxed by shutting down the retaining element 82, so that the pressing element 71 again laterally expands while immersing the peripheral edge portions 77 in the locking receptacle 75.
  • the retaining member 82 is released from the annular inner portion 72, and the mounting device 80 is lifted from the pressing member 71.
  • the pressing element 71 is still under tension, so that it exerts a sufficient contact pressure on the carrier 6.
  • the annular inner region 72 has been placed on the cable channel 8 for centering.
  • the pressing element 71 can be made entirely of plastic or alternatively have a plastic-coated metal core.
  • the plastic surface which is typically electrically insulating, ensures that creepage distances and clearances are not shortened.
  • FIG. 10 shows a lighting apparatus 100 in a fifth embodiment, which has two pressing elements 101 and 108, namely a rotary pressing element 101 and a snap-action pressing element in the form of a snap ring 108.
  • the rotary pressing member 101 is equipped as a screw-like member with a laterally extending screw head 102 and provided with an external thread 103 pin-shaped portion 104.
  • the rotary pressing member 101 can be screwed through the hole 9 of the support 6 and a corresponding central hole in the transitional layer 28 in the through hole 22, more precisely in a inserted into the through hole 22 insert 105, similar to a screw.
  • the insert 105 is a Part of the lining 17, in which, for example, in contrast to the first embodiment, the upstanding part of the support surface 24 is missing.
  • the insert 105 is equipped with an internal thread 106 into which the pressure element 101 can be screwed with its thread.
  • the cable channel 8 is by means of a longitudinal in the rotary pressing member 101 introduced longitudinal hole 121 formed.
  • the rotary pressing element 101 thus has a force introduction region on the inner edge 29 of the carrier.
  • the lighting device 100 on the snap ring 108 is snapped with a plurality of latching hooks 109 in an inserted into the inside of the peripheral edge 120 of the heat sink 4 circumferential groove 110.
  • the snap ring 108 presses the carrier 6 on its outer edge 30 as a force introduction surface onto the support surface 24.
  • Snap ring 108 has the advantage that a defined contact pressure can be applied to the carrier 6 by the rotary pressing element 101, while a special low-cost and low-weight force introduction to the carrier 6 is provided by the snap ring, resulting in a relatively uniform contact pressure ,
  • FIG. 11 shows an oblique view of a lighting device 100b according to a sixth embodiment, similar to the fifth embodiment.
  • 12 shows enlarged the lighting device 100b in the region of the snap ring 108.
  • FIG. 13 shows the lighting device 100b as a sectional illustration in a side view in the region of the rotary or screw-pressing element 101.
  • the edge-side, annular snap ring 108 is equipped on the upper side with snap-in hooks 111 for fastening a translucent (opaque or transparent) cover disk 112 in comparison to the lighting apparatus 100 of the fifth embodiment.
  • the cover plate 112 extends just above the light emitting diode 7.
  • the cover 112 is shown here as a simple translucent plate, but may also be designed differently, for example, with a different basic shape or with an optical function. Alternatively, the cover 112 may be provided with recesses for the light emitting diode 7 and be arranged deeper than shown in Figure 11 to Fig. 13, so that the light emitting diodes 7 protrude through the cover 112, as explained in more detail below.
  • FIG. 14 shows a plan view of the light-emitting diode 7 of one of the LED retrofit lamps.
  • the light-emitting diode has a housing 140, on the upper side 141 of which there is a light-emitting surface which may be covered by a lens 142 for the beam guidance and alternatively or additionally by another optical element.
  • the LED 7 is powered by its supply terminals 143 with power.
  • FIG. 15 shows in plan view a cover element 150 for use, for example, with the lighting device 100b according to the sixth embodiment.
  • the cover element 150 is then configured integrally as a latching pressure element and manufactured, for example, as an injection molded part.
  • the cover element has three recesses 151, which are introduced into the cover element 150 above the lenses 142 of the light-emitting diodes.
  • the lenses 142 extend at least partially through the respective recess 151, so that the recess does not affect the beam guidance and the light output.
  • the cover element 150 has downwardly directed latching hooks 153, which can engage, for example, in the peripheral groove 110.
  • the cover element 150 also has a circular projection 154 directed in the direction of the carrier, that is to say generally downward, which press-fitted on the carrier 6 and thus acts as a holding-down device.
  • the cover member 150 need not be translucent in this case, which provides the advantage of not being able to see underlying elements.
  • the cover element 150 is preferably designed as a plastic disk in a flammability class UL94-V1 or better.
  • FIG. 16 shows in plan view another cover element 160 for use, for example, with the lighting device 100b according to the seventh embodiment.
  • the recesses 161 are now so large and shaped that the light-emitting diode 7 is essentially completely recessed.
  • the housing 140 can protrude through the recess 161.
  • Such an embodiment can, for example, improve heat dissipation from the light-emitting diode 7.
  • the lining 17, which is arranged in the driver cavity 14 can have a journal 180, which passes through the heat sink 4, the carrier 6 and possibly other parts of the lighting device, for. B. a hold-down 181, or recesses thereof passes and protrudes with a free end 182 upwards.
  • the pin 180 or its protruding end 182 is hot-stalked, as will be explained in more detail below.
  • the free end 182 of the pin 180 is heated by means of a heat source 183 by infrared radiation 184.
  • FIG. 18 shows a simplified illustration of a second method step, in which the heat sink 4, the carrier 6 and possibly further elements such as the hold-down 181 are shown as a single layer for the sake of simplicity.
  • the pin 180 has been heated at its free end 182 so far that it is deformable with only a slight pressure.
  • the heat treatment in the first process step has resulted in that the yield strength of the material of the pin 180 has been reduced.
  • a cooled stamp 185 is pressed onto the free end 182, wherein a die of the punch 185 is configured so that the free end 182 spreads laterally across the corresponding recess of at least the uppermost layer.
  • 21 shows a further pressing element in the form of a slotted, hollow pin 220, which in turn is guided through corresponding recesses in the heat sink 4, in the carrier 6 and a possibly existing further layer 181 and beyond this.
  • a pin or mandrel 222 is inserted into the slotted pin 220.
  • the pin 220 widens so far that it can permanently hold the surrounding layers 4, 6, 181 under pressure.
  • both the mandrel 222 and the pin 220 are equipped with a locking means or a counter-locking means.
  • the mandrel 222 may have a sawtooth-like toothing, while the inside of the pin 220 also has a toothing, so that when pressing the mandrel 222 in the pin 220 results in a latching, permanent connection.
  • a contact pressure for example, be adjusted by the mandrel is pressed only up to a predetermined pressure in the pin 220.
  • Such an embodiment is very easy to assemble.
  • the present invention is not limited to the embodiments shown. In general, it may also be preferred if the length of the creepage paths or creepage distances is at least 1 mm, particularly preferably at least 5 mm.
  • the material of the cooling body except pure aluminum and an aluminum alloy or another metal or its alloy or even have a good heat conducting plastic.
  • the cable channel can also be arranged off-center (offset laterally relative to the longitudinal axis).
  • the cable feed element may generally be formed as a separate component or integrated, for example, in the lining of the recess and / or in the heat sink, e.g.
  • the pressing element and the cable channel or the lining can advantageously be made of a polymer material.
  • electrically non-conductive materials for the fastener (s) will cause no reduction in creepage distances or creepage distances.
  • the transition layer may preferably be made of a heat transfer material (TIM) or of silicone, etc.
  • the support surface may advantageously have a diameter between 20 mm and 30 mm, the support preferably has a diameter between 15 mm and 25 mm.
  • a thickness of the support may be, for example, between 0.16 mm and 1 mm, a thickness of the transition layer preferably between 0.15 mm and 0.3 mm.
  • the locking connections and the rotary joints can be generally secured by a cohesive connection against loosening, for example by using a threadlocking adhesive.
  • the rotary joints can be designed to be self-locking, for example by suitable surface structures or geometric structures.
  • the outer contour of the carrier is not limited and may be, for example, round or square.
  • the lighting device may also generally have optical elements such as reflectors, lenses (made of glass or plastic), etc.
  • the lamp is not limited to a specific base type.
  • an Edison socket eg E14, E27
  • other sockets such as GUlO or Japanese or American standard sockets can be used.

Abstract

L'invention porte sur un dispositif d'éclairage (1, 50, 60, 70, 100, 100b), qui comprend au moins un corps (4), en particulier un corps de refroidissement, avec une surface d'appui extérieure (24), ainsi qu'un support de source de lumière (6), en particulier un support pour LED, qui au moyen d'au moins un élément d'appui (43, 51, 61, 71, 101, 220) est appuyé sur la surface d'appui, l'élément d'appui étant encliqueté au dispositif d'éclairage. L'invention porte également sur un procédé pour le montage d'un dispositif d'éclairage, comportant au moins les étapes suivantes : déformation élastique de l'élément d'appui, de façon à en diminuer l'extension latérale; positionnement de la zone marginale périphérique à côté d'au moins un logement d'encliquetage; et dégagement de l'élément d'appui, de façon que la zone marginale périphérique plonge dans le ou les éléments d'encliquetage.
EP10743060A 2009-07-31 2010-07-13 Dispositif d'éclairage et procédé pour monter un dispositif d'éclairage Withdrawn EP2459927A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009035517A DE102009035517A1 (de) 2009-07-31 2009-07-31 Leuchtvorrichtung und Verfahren zum Montieren einer Leuchtvorrichtung
PCT/EP2010/060059 WO2011012444A1 (fr) 2009-07-31 2010-07-13 Dispositif d'éclairage et procédé pour monter un dispositif d'éclairage

Publications (1)

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EP2459927A1 true EP2459927A1 (fr) 2012-06-06

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US (1) US20120127743A1 (fr)
EP (1) EP2459927A1 (fr)
CN (1) CN102472478A (fr)
CA (1) CA2769397A1 (fr)
DE (1) DE102009035517A1 (fr)
WO (1) WO2011012444A1 (fr)

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US9062875B2 (en) * 2013-04-25 2015-06-23 Andrew T. NEAL LED light source
DE102014101403A1 (de) * 2013-05-15 2014-11-20 Seidel GmbH & Co. KG Leuchtvorrichtung
TWI477715B (zh) * 2013-05-31 2015-03-21 Lite On Technology Corp 照明裝置
CN104696818B (zh) * 2013-12-06 2017-05-17 松下知识产权经营株式会社 Led单元以及使用该led单元的照明器具
DE102014203192B4 (de) * 2014-02-21 2022-03-03 Ledvance Gmbh Halbleiterlampe mit Wärmesenke
DE102014205153A1 (de) * 2014-03-19 2015-09-24 Osram Gmbh Halbleiterlampe
CN105023987B (zh) * 2014-04-23 2018-01-09 光宝光电(常州)有限公司 Led承载座及其制造方法
JP6796268B2 (ja) * 2018-04-27 2020-12-09 東芝ライテック株式会社 ランプ装置および照明装置
EP3805637A1 (fr) * 2019-10-07 2021-04-14 Lumileds Holding B.V. Dispositif électronique et procédé de fabrication d'un dispositif électronique
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Publication number Publication date
CN102472478A (zh) 2012-05-23
US20120127743A1 (en) 2012-05-24
CA2769397A1 (fr) 2011-02-03
DE102009035517A1 (de) 2011-02-03
WO2011012444A1 (fr) 2011-02-03

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