WO2015028404A1 - Lampe à semi-conducteur équipée d'un corps thermoconducteur entre l'excitateur et le boîtier d'excitateur - Google Patents

Lampe à semi-conducteur équipée d'un corps thermoconducteur entre l'excitateur et le boîtier d'excitateur Download PDF

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Publication number
WO2015028404A1
WO2015028404A1 PCT/EP2014/067911 EP2014067911W WO2015028404A1 WO 2015028404 A1 WO2015028404 A1 WO 2015028404A1 EP 2014067911 W EP2014067911 W EP 2014067911W WO 2015028404 A1 WO2015028404 A1 WO 2015028404A1
Authority
WO
WIPO (PCT)
Prior art keywords
driver
housing
heat
housing part
semiconductor lamp
Prior art date
Application number
PCT/EP2014/067911
Other languages
German (de)
English (en)
Inventor
Marianne Auernhammer
Michael Rosenauer
Thomas Klafta
Original Assignee
Osram Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gmbh filed Critical Osram Gmbh
Publication of WO2015028404A1 publication Critical patent/WO2015028404A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture

Definitions

  • the invention relates to a semiconductor lamp having at least one semiconductor light source, comprising a driver housing with a driver cavity, one in the driver cavity
  • the invention is particularly applicable to retrofit lamps, e.g. on lamps for PAR headlamps, especially PAR 16, or on
  • Type MR halogen retrofit lamps in particular MR 16.
  • the driver of previous LED retrofit lamps has due to an inhomogeneous power distribution of its driver components certain driver components or points that can be particularly hot during operation (so-called “hotspots”)
  • Driver components associated with such hotspots may extend the life of the entire semiconductor lamp
  • the driver is inserted into the driver housing and, when considered necessary from a thermal point of view, in the installed state with potting material (so-called "potting material”) for a better heat transfer from the driver to the driver
  • Driver housing filled As potting material usually a 2-component material is used, which can still be processed liquid after mixing the individual components to fill the driver housing, and cured with time to a solid mass. The curing happens
  • Integrate heating line in a line production It is the object of the present invention to at least partially overcome the disadvantages of the prior art and, in particular, to provide an improved possibility for cooling a driver of a semiconductor lamp, in particular an LED lamp.
  • a semiconductor lamp having at least one semiconductor light source comprising
  • Driver housing with a driver cavity one in the
  • the driver with a portion of the driver housing thermally conductively connects, wherein the local thermally conductive body consists of a planteleitmaterial of form filling in the driver cavity paste-like consistency.
  • the driver cavity is in particular a cavity within the driver housing for receiving the driver.
  • the driver serves to supply a supply voltage of the semiconductor lamp, e.g. an incoming AC voltage to convert into suitable electrical signals for operation of the at least one semiconductor light source, e.g.
  • the driver has at least one driver component for this purpose.
  • the driver may, for example, have a printed circuit board or printed circuit board on which one or more driver components are arranged, which may form at least part of a driver electronics, for example.
  • One Driver component may in particular be an electrical component (eg a capacitor) and / or an electronic component (eg a microcontroller, ASIC or FPGA) of the driver.
  • the driver may also include driver components that are not located on the circuit board.
  • a local or localized heat-conducting body is in particular a body made of the heat-conducting material, which does not fill the driver or does not fill up from the bottom, but is present only locally limited or localized in the driver housing.
  • the local thermally conductive body provides a thermal bridge between any one
  • the local thermally conductive body contacted to these two areas.
  • the local thermally conductive body may like a thermal bridge between any portion of the driver and a driver
  • At least one local thermally conductive body may connect a portion of one side of a printed circuit board of the driver to a portion of the driver housing.
  • Part of the side of the circuit board may be e.g. comprise one or more driver components. This allows a particularly effective heat dissipation of this sub-area.
  • At least one local thermally conductive body may connect a whole (populated or unpopulated) side of a printed circuit board of the driver to a portion of the driver housing. This allows a comparatively uniform heat dissipation of the whole page.
  • the heat-conducting material does not flow away with or after filling, but at least substantially remains locally where it has been introduced.
  • the thermally conductive material having a shape-retaining paste-like consistency may also be referred to as a high-viscosity shape-retaining material.
  • This semiconductor lamp has the advantage that the local heat-conducting body can be mounted in a fundamentally arbitrary position in shape-retaining or shape-retaining manner in the driver housing. It is such a targeted local connection of driver areas or individual driver blocks or
  • the local, thermally conductive body allows a large temperature reduction associated with it
  • Semiconductor light source at least one light emitting diode.
  • a color may be monochrome (e.g., red, green, blue, etc.) or multichrome (e.g., white). This can also be done by the at least one
  • LED emitted light is an infrared light (IR LED) or an ultraviolet light (UV LED).
  • Light emitting diodes can produce a mixed light; e.g. a white mixed light.
  • the at least one light-emitting diode may contain at least one wavelength-converting phosphor
  • the phosphor may alternatively or additionally be arranged away from the light-emitting diode
  • the at least one light emitting diode may be in the form of at least one individually housed light emitting diode or in Form present at least one LED chip. Several LED chips can be mounted on a common substrate (“submount”).
  • the at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, eg at least one Fresnel lens,
  • organic LEDs can generally also be used.
  • the at least one semiconductor light source may be e.g. have at least one diode laser.
  • the at least one diode laser may be followed by a wavelength-converting phosphor, e.g. in a LARP ("Laser Activated Remote Phosphor") arrangement.
  • one or more such local thermally conductive body may be present, in particular
  • Thermal conductivity ⁇ has, which is greater than that
  • Thermal conductivity ⁇ of the heat conducting material may in particular be at least 0.03 W / (m-K), in particular at least 0.05 W / (m-K), in particular at least 0.1 W / (m-K).
  • the heat conduction material is a non-hardening material. This has the advantage that the semiconductor lamp can be further processed immediately after filling the réelleleitmaterials and does not need to be waited for curing.
  • non-hardening heat conducting material that its dynamic viscosity during filling (“initial viscosity" vA) is at least 175 Pascal seconds, Pa.s ..
  • initial viscosity vA
  • final viscosity vE
  • the non-thermosetting material may be, but is not limited to, a one-component material.
  • the non-hardening thermal conductive material may e.g. To be plasticine, glue or silicone.
  • Driver cavity further solidifying material is. This has the advantage that an introduction into the driver cavity is facilitated by the lower initial viscosity vA and / or a higher final viscosity vE or even a
  • the hardening material hardens in particular at the place of its introduction or filling ("cure-in-place"). Due to its comparatively small volume it hardens faster than a driver cavity fully filling
  • thermosetting or hardening material may be a material that is cured by volatilization of certain ingredients (eg, solvent (s), plasticizers, etc.).
  • solvent e.g., solvent (s), plasticizers, etc.
  • the types of curing described above, for example, at room temperature or at an elevated temperature eg.
  • thermosetting thermosetting material may be e.g. Be adhesive.
  • thermosetting thermosetting material may also be a through
  • Cooling hardening material e.g. at least one thermoplastic or a hot melt adhesive. This has the advantage that the solidification happens very quickly and also the
  • Initial viscosity vA is selectively adjustable, e.g. by setting the melting temperature.
  • the thermosetting thermosetting material may also be a material that hardens or solidifies by chemical reactions of the components, e.g. by polyaddition, polycondensation and / or polymerization.
  • a chemically curing thermal interface material may be, but is not limited to, a multicomponent material.
  • the multicomponent material may include a base material to be cured as a first component and a hardener as a second component. It is also a continuing education that dynamic
  • Initial viscosity vA of the thermosetting thermally conductive material is at least 100 Pascal seconds to safely achieve the shape retention or dimensional stability during filling. It is still a continuing education that dynamic
  • the thermal interface material has an ultimate viscosity vE of not more than 400 Pascal seconds, in particular not more than 350 Pascal seconds, in particular not more than 325 Pascal seconds, in particular not more than 300 Pascal seconds. Because so can the heat conduction material or the existing local thermally conductive body
  • a local thermally conductive body may cover or contact a plurality of driver components. This has the advantage that so improved cooling of many
  • the local thermally conductive body is exactly one driver component and that
  • This embodiment is for example both applicable to driver components, which on a
  • the local thermally conductive body may also serve as a fastener, e.g. as an adhesive.
  • a plurality of driver components not located on the printed circuit board of the driver can also be connected to the driver housing by means of a local thermally conductive body.
  • the driver housing may in particular have at least a first housing part and a second housing part.
  • the first housing part and the second housing part like in particular be separately provided components. This facilitates placement of the driver.
  • the first housing part of the driver housing may in particular be a lower housing part, which is open on the front side and has at least one rearward electrical connection contact for connection to a socket.
  • the at least one electrical connection contact may, in particular together with a part of the lower housing part, constitute a part of a base or base region of the semiconductor lamp.
  • Socket may e.g. be formed as a conventional socket, e.g. as an Edison socket (eg of the E type such as E 14 or E27), as a plug-in or bipin socket (eg of the GU type such as GU5.3 or GU10), as a bayonet socket (eg of the type BC , B22 or B22d) or as a tube socket (eg of type G5 or G13).
  • An electrical connection contact may therefore be e.g. a pin or pin, e.g. for a socket of the GU type.
  • the lower housing part or its front-side opening may in particular be closable or concealable by the second housing part.
  • the second housing part is preferably designed as an upper housing part or cover.
  • the lid may in particular be at least one passage, e.g. one
  • the cover may, in particular, have a planar bearing surface on its front side facing away from the lower driver housing, for example for a heat sink (if present) or for a substrate carrying the semiconductor light source (s).
  • the lid may, for example, the
  • the passage of the lid can also be used as guidance and stabilization of the electrical lines, e.g. Cable, for the electrical supply of
  • Semiconductor light sources can be used. This allows the soldering of the substrate to the electrical leads be simplified. It could also laser soldering used. This greatly simplifies machine soldering of the substrate to the electrical leads. Also like an electrical contact via a connector, etc.
  • Housing part widens in the direction of the second housing part and at least one contacted by a local thermally conductive body driver component in the vicinity of the second
  • Housing part is located component. This allows a particularly good heat dissipation of driver components, which are arranged close to the lid. This can be done by the
  • the local thermally conductive body has at least one driver component and the second
  • At least the first housing part is a heat sink or heat dissipation element or "heat sink"
  • the second housing part may be formed as a heat sink or "heat sink”.
  • the first housing part and / or the second housing part may, in particular when used as a heat sink made of metal, for example made of aluminum.
  • This embodiment can be used particularly advantageously for low-voltage lamps, which are operated, for example, with a supply voltage of 12 volts.
  • electrical creepage distances and clearances are maintained.
  • electrically insulating local thermally conductive body that is, if the heat conducting material is electrically insulating in the operable state
  • Air gaps even when contacting current-carrying areas of the driver for example, of tracks or
  • the driver housing may be wholly or partially formed as a heat sink or Heatsink or ratioableitmaschine.
  • the housing parts are not limited thereto, but may also consist of plastic or ceramic, the first housing part and / or the second housing part.
  • driver housing at least one opening (hereinafter referred to as
  • This insertion opening (e.g., a hole) may be used to secure the insertion opening
  • the insertion opening is closed, for the sake of ease of manufacture preferably by means of the heat conduction, but alternatively, for example, by means of a plug or a solder. It is also a development that the semiconductor lamp has a substrate equipped with the at least one semiconductor light source.
  • the substrate may be for example a
  • circuit board (often referred to as "submount"), which with the at least one semiconductor light source
  • the circuit board may e.g. common
  • board material as a base material, e.g. FR4, may be formed as a metal core board or may be ceramic, e.g.
  • the substrate may be annular disk-shaped, with a central hole, for example, serving to pass the forwardly projecting cable duct of the lid.
  • the semiconductor lamp has a light-permeable cover for the substrate and thus also the at least one semiconductor light source and, if appropriate,
  • the translucent portion additionally comprises arranged on the substrate electrical or electronic components.
  • Cover may be, for example, a transparent or opaque (translucent) protective cover and / or at least one optical element (e.g., a reflector, a lens, a lens)
  • optical element e.g., a reflector, a lens, a lens
  • the semiconductor lamp has at least one dedicated heat sink.
  • the heat sink may be made of metal, e.g. Aluminum and / or copper.
  • the heat sink may be e.g. by cast aluminum, as deep-drawn or extruded profile present.
  • the use of the at least one heat sink may be advantageous in particular for semiconductor lamps of higher power.
  • the semiconductor lamp may be a replacement or retrofit lamp for replacing conventional lamps, e.g. to replace a light bulb, a halogen lamp, a
  • Gas discharge lamp a gas discharge tube, a
  • the retrofit semiconductor lamp is particularly suitable for a socket that fits into conventional sockets have, for example, an Edison socket, a bipin socket (eg of the GU type) or a bayonet socket.
  • the invention is particularly advantageously applicable to halogen lamp retrofit lamps, in particular for PAR headlamps, eg of the type PAR 16, or to halogen lamp retrofit lamps for the type MR, for example MR 16 or MR 11.
  • a semiconductor light source comprising at least the following steps: (a) housing a driver in a driver cavity of a driver housing
  • the method gives the same advantages as the semiconductor lamp and can be configured analogously.
  • the heat-conducting material may be introduced in a form-retaining paste-like consistency by means of a hollow needle through an insertion opening in the driver housing.
  • a hollow needle or lance may be inserted into the insertion opening, its tip positioned in the desired region to be filled, and then the thermal interface material pressed out of its tip.
  • the at least one introduction opening likes
  • FIG. 1 shows an exploded view in an oblique view of a semiconductor lamp without a local heat-conducting body
  • FIG. 2 shows the semiconductor lamp as a sectional illustration in FIG
  • Fig.l shows an exploded view in an oblique view of a semiconductor lamp in the form of an LED lamp 1 according to a first embodiment, even without a local thermally conductive body.
  • the LED lamp 1 has, in the order shown, from a rear end to a front end: two terminal contacts projecting in a rearward direction in the form of e.g. PARI 6-kopatiblen connection pins 2, a first
  • Housing part 3 which has a forwardly open side 6, a driver 4 for use in the lower housing part 3, a second housing part of the driver housing in the form of a cover 5 to cover the open side 6 of the lower housing part 3, an annular disc-shaped, thermally highly conductive
  • Adhesive film 7 ("TIM film"), which is to be placed on the front side of the lid 5, an annular disc-shaped substrate 8, which with its back on the adhesive film. 7
  • Semiconductor light sources in the form of light-emitting diodes, LEDs, 9 and a translucent cover in the form of a lens 10.
  • the LED lamp 1 is designed here as a halogen lamp retrofit lamp, in particular of the type PAR16.
  • the terminal pins 2 and the driver housing 3 thus form a GU-type socket.
  • the driver 4 is in the assembled state with the
  • connection pins 2 electrically connected and can be fed via this with a supply voltage.
  • the driver 4 has a printed circuit board 19, which is inserted vertically into the lower housing part 3.
  • the printed circuit board 19 is equipped on both sides with driver components 20. Basically, a diagonally or horizontally mounted driver is also conceivable.
  • the lid 5 serves to close the open side 6 of the lower driver housing 3.
  • the lid 5 has a central, forwardly projecting cable channel 12 through which electrical lines (not shown) for supplying the LEDs 9 from the driver 4 to the Substrate 8 are passed.
  • the cover 5 can be placed on the driver housing 3 in a latching manner and has detent receptacles 16 into which latching lugs 18, which project forwardly, can snap into engagement with an upper edge 17 of the driver housing 3.
  • the lower housing part 3 widens in the direction of the lid 5.
  • the substrate 8 has a central opening 13 to
  • the substrate 8 may be e.g. a ceramic substrate or a metal core board.
  • the LEDs 9 are usually in a separate
  • the LEDs 9 may be deposited in a COB ("chip on board") process on the substrate 8.
  • the LEDs 9 are here formed as packaged LEDs, for example as white light emitting LEDs.
  • the laterally circulating heat sink 11 is e.g. Made of aluminum and to rest on an outside
  • Jacket surface 14 of the driver housing 3 is provided to the
  • the heat sink 11 has several parallel here to the longitudinal direction (vertically) aligned, in
  • FIG. 2 shows a sectional side view of the fully assembled LED lamp 1 (without the LEDs 9).
  • the lower housing part 3 and the lid 5 form a
  • Driver housing 3 which defines a driver cavity 21 therein.
  • the driver is 4
  • a driver 20a of the driver components 20 is connected to the lower case 3 by means of the body 22.
  • Another driver component 20b close to the lid of the driver components 20 is connected to the lower housing part 3 by means of the body 23 and to the lid 5 by means of the body 24.
  • the body 23 may also be dispensed with.
  • the driver component 20a and the capping driver component 20b may each be a hotspot.
  • the thermal interface material 25 is here purely by way of example a thermosetting thermal material 25, e.g. a two-component heat conducting material. It has a dynamic initial viscosity vA of 100 pascal seconds during filling and, after curing, a dynamic final viscosity vE of about 250
  • the filling of theticianleitmaterials 25 can for example be done through the opening 6 of the lower housing part 3, for example, to form the body 22 and 23.
  • the filling of theticianleitmaterials 25 may alternatively or additionally be done by the cable channel 12, in particular for generating the body 23 and 24th
  • the filling of theticianleitmaterials 25 may alternatively or additionally by at least one
  • Insertion opening 26 may then be closed with the heat-conducting material 25.
  • LED lamp 1 is shown here as the LED lamp 1
  • Driver housing 3, 5 and the heat sink 11 are separate components, e.g. by means of an injection molding material 27
  • At least the lower housing part 3 and / or the cover 5 may be a heat sink or a part thereof and for this example consist of metal. On a separate heat sink then likes
  • a number may include exactly the specified number as well as a usual tolerance range, as long as this is not explicitly excluded. , 0

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

L'invention concerne une lampe à semi-conducteur (1) qui est équipée d'au moins une source de lumière à semi-conducteur (9) et qui comprend : un boîtier d'excitateur (3) comportant une cavité d'excitateur (21), un excitateur (4) monté dans la cavité d'excitateur (21) et un corps thermoconducteur local (22, 23, 24) qui relie une partie de l'excitateur à une partie du boîtier d'excitateur (3, 5) par une liaison thermoconductrice. Le corps local thermoconducteur (22, 23, 24) est constitué d'une matière thermoconductrice (25) de consistance pâteuse qui conserve sa forme pendant son introduction dans la cavité d'excitateur (21). L'invention est notamment applicable à des lampes de rattrapage telles que des lampes pour projecteurs PAR, notamment PAR 16 ou des lampes de rattrapage de lampes halogènes du type MR, notamment MR 16.
PCT/EP2014/067911 2013-08-26 2014-08-22 Lampe à semi-conducteur équipée d'un corps thermoconducteur entre l'excitateur et le boîtier d'excitateur WO2015028404A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202013007592.9 2013-08-26
DE201320007592 DE202013007592U1 (de) 2013-08-26 2013-08-26 Halbleiterlampe mit Wärmeleitkörper zwischen Treiber und Treibergehäuse

Publications (1)

Publication Number Publication Date
WO2015028404A1 true WO2015028404A1 (fr) 2015-03-05

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PCT/EP2014/067911 WO2015028404A1 (fr) 2013-08-26 2014-08-22 Lampe à semi-conducteur équipée d'un corps thermoconducteur entre l'excitateur et le boîtier d'excitateur

Country Status (2)

Country Link
DE (1) DE202013007592U1 (fr)
WO (1) WO2015028404A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017120023A1 (de) 2017-08-31 2019-02-28 Ledvance Gmbh Halbleiterlampe und Verfahren zum Herstellen einer Halbleiterlampe

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014213388A1 (de) * 2014-07-09 2016-01-14 Osram Gmbh Halbleiterlampe
DE102014110994A1 (de) * 2014-08-01 2016-02-04 Seidel GmbH & Co. KG Leuchtvorrichtung mit einem Anschlussmodul
DE202016101026U1 (de) * 2016-02-26 2017-05-29 Tridonic Jennersdorf Gmbh LED-Modul
DE102016203920A1 (de) 2016-03-10 2017-09-14 H4X E.U. Leuchte
CN108278504B (zh) 2016-12-30 2021-06-15 朗德万斯公司 照明装置、照明装置用led组件及组装照明装置的方法
DE102019103284A1 (de) * 2019-02-11 2020-08-13 Ledvance Gmbh Treibermodul zur funktionalen Erweiterung von Treibern

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008062675A1 (de) * 2008-12-17 2010-07-01 Osram Gesellschaft mit beschränkter Haftung Elektrische Lampe mit integrierter Elektronik
DE102009024907A1 (de) * 2009-06-15 2010-12-16 Osram Gesellschaft mit beschränkter Haftung Kühlkörper für Halbleiterleuchtelemente
DE102010028481A1 (de) * 2010-05-03 2011-11-03 Osram Gesellschaft mit beschränkter Haftung Elektronikgehäuse für eine Lampe, Halbleiterlampe und Verfahren zum Vergießen eines Elektronikgehäuses für eine Lampe
US20130033165A1 (en) * 2010-04-19 2013-02-07 Sharp Kabushiki Kaisha Heat dissipation device and lighting device
EP2562467A1 (fr) * 2010-04-20 2013-02-27 Sharp Kabushiki Kaisha Dispositif d'éclairage
EP2578925A1 (fr) * 2010-05-31 2013-04-10 Sharp Kabushiki Kaisha Dispositif d'éclairage
WO2013064343A1 (fr) * 2011-11-03 2013-05-10 Osram Gmbh Ensemble circuit d'attaque et son procédé de fabrication

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008062675A1 (de) * 2008-12-17 2010-07-01 Osram Gesellschaft mit beschränkter Haftung Elektrische Lampe mit integrierter Elektronik
DE102009024907A1 (de) * 2009-06-15 2010-12-16 Osram Gesellschaft mit beschränkter Haftung Kühlkörper für Halbleiterleuchtelemente
US20130033165A1 (en) * 2010-04-19 2013-02-07 Sharp Kabushiki Kaisha Heat dissipation device and lighting device
EP2562467A1 (fr) * 2010-04-20 2013-02-27 Sharp Kabushiki Kaisha Dispositif d'éclairage
DE102010028481A1 (de) * 2010-05-03 2011-11-03 Osram Gesellschaft mit beschränkter Haftung Elektronikgehäuse für eine Lampe, Halbleiterlampe und Verfahren zum Vergießen eines Elektronikgehäuses für eine Lampe
EP2578925A1 (fr) * 2010-05-31 2013-04-10 Sharp Kabushiki Kaisha Dispositif d'éclairage
WO2013064343A1 (fr) * 2011-11-03 2013-05-10 Osram Gmbh Ensemble circuit d'attaque et son procédé de fabrication

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017120023A1 (de) 2017-08-31 2019-02-28 Ledvance Gmbh Halbleiterlampe und Verfahren zum Herstellen einer Halbleiterlampe
US10495266B2 (en) 2017-08-31 2019-12-03 Ledvance Gmbh Semiconductor lamp and method for producing a semiconductor lamp

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