EP2510276A1 - Lampe à semi-conducteur - Google Patents

Lampe à semi-conducteur

Info

Publication number
EP2510276A1
EP2510276A1 EP11712502A EP11712502A EP2510276A1 EP 2510276 A1 EP2510276 A1 EP 2510276A1 EP 11712502 A EP11712502 A EP 11712502A EP 11712502 A EP11712502 A EP 11712502A EP 2510276 A1 EP2510276 A1 EP 2510276A1
Authority
EP
European Patent Office
Prior art keywords
light source
heat sink
driver
semiconductor lamp
source substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11712502A
Other languages
German (de)
English (en)
Inventor
Christoph Mahler
Steffen Tegethoff
Thomas Preuschl
Günter HOETZL
Nicole Breidenassel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2510276A1 publication Critical patent/EP2510276A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a semiconductor lamp which has a driver cavity for receiving driver electronics and a light source source equipped with at least one semiconductor light source .
  • a semiconductor lamp which has a driver cavity for receiving driver electronics and a light source source equipped with at least one semiconductor light source .
  • Fig.l has a known LED retrofit lamp
  • the 101 has a heat sink 102, which has a driver cavity 103 for accommodating driver electronics 104.
  • the driver cavity 103 has a rear opening 103a which is closed by a base 105.
  • the base 105 has electrical contacts 106 in order to establish an electrical connection between a lamp socket (o.Fig.) And the driver electronics 104.
  • the driver cavity 103 is inserted into the heat sink by means of a
  • the LED module includes a substrate 109 and at least one light ⁇ diode, LED, 110, wherein the at least one light-emitting diode is arranged on the front side of the substrate 109. 110 and the substrate 109 rests with its back side flat on the base ⁇ plate 107th
  • the substrate 109 may be configured as a circuit board.
  • a cable bushing (o.Fig.) In the base plate 107 is present.
  • the driver electronics 104 is thus located on the other side of the base plate 107 in the interior of the common heat sink 102 with respect to the LED (s) 110.
  • the driver electronics 104 can only be introduced from the rear h through the opening 103a in the driver cavity 103.
  • the outer contour of retrofit lamps is also subject to regulations which require the retrofit lamps to reduce their lateral or electrical contact. have sectional area. If one places as far as possible a separation plane between an upper lamp part and a lower lamp part for aesthetic, production-related or thermal reasons (as in the example shown here between the heat sink 102 and the base 105), the area of a driver electronics board carrying the driver electronics 104 must be 111 be correspondingly small, so that it can always be inserted from behind h in the rear opening 103 a for mounting.
  • the LED retrofit lamp 101 must forward extended toward v ⁇ the to the drive electronics 104 to accommodate a larger height dimension in the heat sink.
  • the prescribed outer contour of the LED retrofit lamp 101 may in some cases no longer be complied with.
  • the object is achieved by a semiconductor lamp, aufwei ⁇ send akulturerkavtician for receiving a driver and a mounted with at least one semiconductor light source ⁇ source substrate, wherein the source substratemaschineerkavmaschine is closed by the light.
  • This semiconductor lamp has the advantage that the dri ⁇ berplatine can now be introduced due to the absence of the base plate from the front in themaschineerkavtician, where in particular in a rearwardly tapered housing has a larger opening is available than in a conventional introduction in the area of rear socket. So can one non-functional driver with wide driver board housed in a compact lamp.
  • the driver may also be referred to as driver electronics, Treiberschal- tung, drive logic, control circuit, etc., and serves, in particular, provided on the base electrical power for driving the at least one semiconductor light source suitable electrical signals ⁇ zuatn.
  • the driver electronics may comprise a plurality of electronic components, which are arranged in particular on a common driver board ⁇ .
  • the driver cavity may also be described as a cavity for receiving the driver.
  • the at least one semiconductor light source ⁇ comprises at least one light emitting diode. If several LEDs are present, they can be lit in the same color or in different colors. A color can be monochrome (eg red, green, blue etc.) or multichrome (eg white).
  • the light emitted by the at least one light-emitting diode can also be an infrared light (IR LED) or an ultraviolet light (UV LED).
  • IR LED infrared light
  • UV LED ultraviolet light
  • Several light emitting diodes can produce a mixed light; eg a white mixed light.
  • the at least one light-emitting diode may contain at least one wavelength-converting phosphor (conversion LED).
  • the at least one light-emitting diode can be present in the form of at least one individually light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate ("submount").
  • the at least one light-emitting diode may be equipped with at least one own and / or ge ⁇ common optical system for beam guidance, for example, at least one Fresnel lens, collimator, and so on.
  • OLEDs organic LEDs
  • diode lasers are used.
  • the mini- at least one light source for example, have at least one diode laser.
  • the light source substrate may in particular be a printed circuit board or circuit board.
  • the semiconductor lamp comprises two mutually attachable on ⁇ housing parts and at least egg ⁇ nes of the housing parts which at least partially encloses grasperkavtician.
  • TheDeutscherkavtician can thus only by means of a housing part or two housing parts formed by the ⁇ .
  • the housing parts can be easily connected to each other by the placement, and the driver cavity can be correspondingly easily closed.
  • the semiconductor lamp can have a common cavity for receiving a driver and a populated with at least one semiconductor light source, the light source substrate, wherein the common cavity is defined by two, in particular separable or attachable to each other, housing parts, in particular as a heat sink formed housing parts, gebil ⁇ det ,
  • a rear housing part comprises the base currency ⁇ rend a front housing part has a light transmission opening on ⁇ .
  • none of the two hous ⁇ parts has a partition (eg, the base plate 8) on which the light source substrate is fully seated with its back and which conducts heat from the at least one semicon ⁇ terlichtetti in the heat sink.
  • a partition eg, the base plate 8
  • a parting plane is perpendicular to a main emission direction of the light or to a longitudinal axis of the semiconductor lamp, in particular parallel to the plane of the light source substrate.
  • the housing parts are designed as a heat sink, of which a front heat sink has at least one light passage opening and of which a rear heat sink has a base (area) or is connected thereto.
  • the driver and at least one semiconductor light source can be minimized because the heat of the more strongly he ⁇ warming heat sink, in particular the front heat sink is worse transferred to the less heated heat sink and the sitting in the less heated heat sink driver , at least on its side facing away from the light source, undergoes less heating by the light ⁇ source.
  • the rear heat sink encloses the driver cavity at least partially.
  • the rear heat sink thus serves mainly or entirely to accommodate the driver, while the front heat sink primarily serves to close the driver cavity and to cool the light source (s).
  • At least one of the heat sinks has projections, in particular cooling fins or cooling struts etc., which extend over the other heat sink.
  • the projections of the front heat sink which significantly cools the light source, fingersartiq or crenellated on the rear heat sink, which significantly cools the driver protrude.
  • both heat sinks in the direction of the respective other heat sink directed Vorsprün ⁇ ge have, which mesh with each other like a comb.
  • the projections can also serve as fastening projections, for example by being designed as clamping contacts.
  • the Fixed To ⁇ -cleaning function of the heat sink or housing parts is also different realized, for example, by a circumferential projecting edge.
  • the front heat sink has at least one material with a thermal conductivity of at least 10 W / (m-K), e.g. with Al, Cu or alloys thereof, with ceramics, or thermally conductive plastic.
  • the rear heat sink has an electrically insulating material with a thermal conductivity of at least 0.5 W / (m-K).
  • the driver need not be electrically isolated by an additional plastic sleeve or foil, which improves the cooling of the driver components.
  • the rear heat sink can also be made of a simple standard plastic.
  • the two housing parts fix the light source substrate between them.
  • the light source substrate may be clamped or pressed in between the two housing parts, in particular for a single fastening.
  • the connected in a loading ⁇ trachtunglander together Scheme- through both housing parts cavity is then by the light source substrate in a front region with the at least one semiconductor light source and divided into a rear region with the driver.
  • the front heat sink is in surface contact with the light source substrate, in particular with its front side carrying the at least one semiconductor light source. This contact surface is as wide as possible constructed around the at least one semiconductor light source and possibly zugehö ⁇ rige optical elements around to realize the best possible heat transfer from the light source substrate to the front heat sink.
  • the front heat sink is in surface contact with the light source substrate via a thermal interface material (TIM) in order to further increase the heat output to the heat sink.
  • TIM may be, for example, a phase change TIM, a thermally conductive adhesive, a TIM tape and / or a heat conducting film.
  • Al ternatively ⁇ the light source substrate can also be a flexible substrate is laminated on the front heatsink.
  • the rear heat sink is in a substantially point and / or line-shaped contact with the light source substrate.
  • the contact of the light source substrate to the rear heat sink is so mini ⁇ mized to a thermal connection between the at least one semiconductor light source and the rear heat sink and thus a thermal load for critical driver components (integrated components, electrolytic capacitors, etc.) on ⁇ due to heating on the part to minimize the at least one semicon ⁇ terlichtée.
  • the light source substrate can be designed, for example, as a metal core board, ceramic board, suitably designed FR4 board and / or flexible board (flex).
  • a metal core board in particular when using an electrically insulating TIM for optimizing the heat conduction from the metal core board into the front heat sink, a solder resist in the region of the contact can also be omitted.
  • one of the housing parts at least partially encloses the driver cavity and the light source substrate is attached to the other of the housing parts (in particular ⁇ special the front heat sink), eg by means of a thermal adhesive or a TIM tape is glued.
  • the light source substrate can be mounted ⁇ on the other housing part and does not need to be specially aligned when assembling the housing parts. In particular, such a direct contact of the light source substrate with the rear heat sink or the like. be avoided.
  • the Lichtierinsub ⁇ strat against the driver cavity enclosing housing part is thermally insulated, for example by a thermally insulating layer and / or by an air gap.
  • the accommodated in themaschinerkavtician driver can be shielded against the min ⁇ least one light source emitted from the waste heat, or vice versa.
  • a front side of the light source substrate is equipped with the at least one semiconductor ⁇ light source and the back of the light source substrate is at least ⁇ with a part of the driver electronics is ⁇ . This allows a particularly compact design.
  • a driver board equipped at least with a part of the driver electronics is a board provided for bending. This allows the Trei ⁇ berplatine particularly compact in Treiberkavmaschine be underweight body ⁇ introduced, eg circulating also on the side walls.
  • the driving board may be performed with the light source substrate einstü ⁇ one piece, for example as a said at least one semiconductor light source and the driver blocks populated printed circuit board. The results in a particularly compact and component- ⁇ -saving design.
  • the at least one semiconductor light source and the driver blocks are arranged on different under ⁇ union sides of the board, resulting in particular ⁇ sondere in a flexible circuit board particularly com pact ⁇ design.
  • at least one connection contact of the semiconductor lamp ⁇ A press connector (press-fit connector) is electrically connected to an equipped at least with a part of the drive electronics of at least one driver board.
  • At least an optical element (lens Re ⁇ Flektor etc.) irreversibly incorporated in the forehand heat exchanger, in particular clamped, to, and comparable cover for example for together ⁇ human rob the two heat sink screws used, for example, a non-destructive opening of the lamp through a Prevent users.
  • screws for assembling the semiconductor lamp can be completely dispensed with, with the front heat sink, the rear heat sink, and the light source sub ⁇ strate, for example, being connected to one another only by gluing and / or clamping.
  • the semiconductor lamp is preferably a retrofit lamp, in particular incandescent retrofit lamp or halogen lamp retrofit lamp.
  • Ele ⁇ elements may be provided with the same reference numerals for clarity.
  • FIG. 2 shows a sectional side view of a semiconductor lamp according to the invention according to a first embodiment; shows an oblique view of a front heat sink of the semiconductor lamp according to the first embodiment ⁇ form;
  • the semiconductor lamp 1 has amaschineerkavtician 2 for receiving a Schwarzerelekt ⁇ ronik 3 and a mounted with at least one semiconductor light source in the form of several LEDs 4 light source substrate 5 (here, a metal core PCB) on.
  • TheDeutscherkavtician 2 is formed within a rear half ⁇ heat sink 6 or vice ben thereof.
  • the driver cavity 2 is bounded behind h by a So ⁇ ckel region 7 of the rear heat sink 6 and v closed by the light source substrate 5 forward.
  • At the base region 7 there are two pin contacts 7a which lead to the driver electronics 3 and supply them with a supply voltage.
  • the driver electronics 3 in turn drives the LEDs 4.
  • a front heat sink 8 is attached from the front v, so that the light source substrate 5 is clamped between the front heat sink 8 and the rear heat sink 6 and fixed so.
  • the front heat sink 8 at its perennial cooling and to obtain a tight fit on the rear cooling body 6, the front heat sink 8 at its perennial cooling and to obtain a tight fit on the rear cooling body 6, the front heat sink 8 at its perennial cooling and to obtain a tight fit on the rear cooling body 6, the front heat sink 8 at its perennial cooling and to obtain a tight fit on the rear cooling body 6, the front heat sink 8 at its perennial cooling and to obtain a tight fit on the rear cooling body 6, the front heat sink 8 at its beidessei- te equidistant to a plurality of cooling fins 9, which protrude to the rear h and serve with respect to the rear heat sink 6 as clamping elements.
  • the rear heat sink 6 and the front heat sink 8 may additionally or alternatively, for example, also glued together, locked and / or screwed.
  • the front heat sink 8 which is provided in Figure 3 in an oblique view DAR, lies with its edge portion 10 over a large area on the front side of the light source substrate 5 in order to kuh ⁇ development of the LEDs 4 to ermögli ⁇ chen a high heat transfer thereof optionally via a heat conducting material (o.Fig.).
  • the rear heat sink 6 contacts the rear side of the light source substrate 5 only with its narrow upper edge (corresponding essentially to a linear contact) in order to minimize heat transfer to itself and thus to the driver cavity 2.
  • a driver board 11, which is equipped with the driver electronics 3, is substantially parallel to the light ⁇ source substrate 5 in the driver cavity 2.
  • the driver electronics 3 can be arranged so that grasperbau ⁇ stones 3a, which are neither sensitive nor even a ho - He generate heat radiation, are arranged on a side facing the light source substrate 5 side of the driver board 11. This avoids overheating the delicate Trei ⁇ berbausteine by the LEDs 4 and the light source substrate 5 and overheating of the light source substrate 5 locally in the region of a highly heat-radiating driver module.
  • the sensitive and / or highly heat lossy driver blocks 3b may be arranged at the 5 the light source substrate from ⁇ facing rear side of the driver board. 11
  • the front heat sink 8 has at least one light ⁇ outlet opening 14, into which the LEDs are inserted 4 from below.
  • a reflector 12 is used with a plurality of LED 4-specific reflector regions 13 in order to be able to form a light emission of the semiconductor lamp 1 in a targeted manner. This results in an optical axis or main emission along a longitudinal axis L of the semiconductor lamp 1.
  • the front heat sink 8 and the reflector 12 can be covered by a translucent cover plate 15 with or without an optical function (lens ⁇ function, diffuser, etc.).
  • the front heat sink 8 consists essentially of a material with a thermal conductivity of at least 10 W / (mK). This material may be electrically conductive and be, for example, an aluminum alloy. Due to the lower heat development of the driver electronics 3, the rear heat sink 6 can in particular be an electrically insulating material with a thermal conductivity of at least 0.5 W / (mK), eg plastic.
  • the driver 3 can be inserted 11 through the large front in themaschineerkavmaschine 2 so that the driver 3, 11 need not be so limited in size and comparatively ⁇ be configured freely. Thus, in particular a slightest ⁇ processing performance driver 3, are provided. 11 By WAIVED assembly so the size limitation, wel ⁇ che eliminated so far results from an introduction by the rear base area.
  • the assembled light source substrate can be placed on the front opening of the rear heat sink 6 5, followed by a plugging of the front heat sink 8 on the rearward heat exchanger 6.
  • the front heat sink 8 and the rear heat sink 6 form a common cavity, which has the light ⁇ outlet openings 14 towards the front.
  • both the populated light source substrate 5 and the driver 3, 11 are accommodated, wherein the driver board 11 divides the common cavity into a rear area and a front area.
  • 4 shows a sectional side view of a semiconductor lamp 21 according to the invention in accordance with a second embodiment .
  • the semiconductor lamp 21 has a similar basic structure as the semiconductor lamp 1. However, now (for wires or the like, for example, alternatively) between the base region 7 and the driver board 11 press-fit pins 22 are provided as electrical connection leads, which themselves ⁇ -supporting after from the base area 7 stand in front. When inserting the driver board 11 this is placed with corresponding hollow vias on the press-fit pins 22.
  • the driver board 11 may similarly have upstanding press-fitting pins 23 which are brought into interference fit with a hollow via of the light source substrate 5 when the light source substrate 5 is placed on the rear heat sink 6. The interference fit connection allows a particularly simple installation.
  • FIG. 5 is a sectional side view of a semiconductor lamp 31 in the form of an incandescent retrofit lamp.
  • the semiconductor lamp 31 can in particular comply with a shape factor of an incandescent lamp and, for example, have a piston 36 which is substantially spherical in section.
  • the pedestal area or pedestal 32 is here formed as an Edison socket with a central electrical contact 33 at a rear tip and a screw thread 34 as the second electrical contact. From the central electrical contact 33 as well as the side of the screw thread 34 is in each case from a press-fit pin 22, which forward from the base 32 protrudes.
  • the press-fit pins 22 can be led, for example, to the driver board 11 which in turn is re-wide ⁇ press-fit pins or otherwise, for example by Ka ⁇ bel 38, electrically connected to the light source substrate.
  • the base 32 shown is optionally filled by a elekt ⁇ driven insulating potting compound 35 to give additional mechanical stability.
  • a elekt ⁇ driven insulating potting compound 35 In the sealing compound 35 optional electrical and / or electronic Bauelemen ⁇ te 39 such as capacitors, resistors, ICs, etc. may be embedded, allowing for even more compact design.
  • the Ver ⁇ casting compound 35 can also be used to form a forwardly projecting guide pin 37 in order to facilitate a correct positioning to the driver board.
  • the LED 11 6 is a sectional side view of a semiconductor lamp 41 according to a third embodiment.
  • the light source substrate 5 and the driver board 11 are now in the form of a single, here: flexible, circuit board 42 before.
  • the printed circuit board 42 is equipped on its outer side or front side 43 with the LEDs 4 and on its inside or back ⁇ side 44 with the driver chips 3.
  • the flexible printed circuit board 42 is about an axis perpendicular to the longitudinal axis L so ge ⁇ bent that the LEDs projecting upward into the light passage opening 14 and the driver modules 3 are directed inwards in the direction of the driver cavity 2.
  • the reaching through the Sockelbe ⁇ rich 7 pins 7a can be connected directly to the circuit board 42.
  • Such a configuration is particularly compact and re ⁇ alisierbar with comparatively few components. So own connection elements between the driver board and the light source substrate can be omitted.
  • FIG. 7 shows a sectional side view of a semiconductor lamp 51 according to a fourth embodiment.
  • the semiconductor lamp 51 has the light source substrate 5 and the driver board 52 as separate components.
  • the driver board 52 is designed as a flexible board and arranged around the longitudinal axis L in the driver cavity 2 angeord- net, where it rests flat on the walls of the driver cavity 2 for effective heat dissipation.
  • a lower tab 53 it can be connected directly to the contact pins 7a, and by means of an upper tab 54 with the Lichtquel- lens substrate 5, for example on Löthöcker 55.
  • This also a compact and inexpensive configuration is achieved, in which now the positioning of the light source substrate 5 and the driver board 52 can be performed separately.
  • the present invention is not limited to the embodiments shown.
  • features of the various execution ⁇ shapes may also be additionally or alternatively exchanged.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention concerne une lampe à semi-conducteur (1; 21; 31; 41; 51) présentant une cavité de circuit d'attaque (2) destinée à loger une électronique de circuit d'attaque (3) et un substrat à source lumineuse (5) pourvu d'au moins une source lumineuse à semi-conducteur (4), la cavité de circuit d'attaque (2) étant fermée par le substrat à source lumineuse (5).
EP11712502A 2010-04-07 2011-03-22 Lampe à semi-conducteur Withdrawn EP2510276A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010003690 2010-04-07
DE102010030702A DE102010030702A1 (de) 2010-04-07 2010-06-30 Halbleiterlampe
PCT/EP2011/054373 WO2011124469A1 (fr) 2010-04-07 2011-03-22 Lampe à semi-conducteur

Publications (1)

Publication Number Publication Date
EP2510276A1 true EP2510276A1 (fr) 2012-10-17

Family

ID=44658241

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11712502A Withdrawn EP2510276A1 (fr) 2010-04-07 2011-03-22 Lampe à semi-conducteur

Country Status (5)

Country Link
US (1) US20130020941A1 (fr)
EP (1) EP2510276A1 (fr)
CN (1) CN102822590A (fr)
DE (1) DE102010030702A1 (fr)
WO (1) WO2011124469A1 (fr)

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CN102822590A (zh) 2012-12-12
US20130020941A1 (en) 2013-01-24
WO2011124469A1 (fr) 2011-10-13

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