TWM301985U - Rapid-assembly structure for LED lamp set and heat dissipation module - Google Patents

Rapid-assembly structure for LED lamp set and heat dissipation module Download PDF

Info

Publication number
TWM301985U
TWM301985U TW095211395U TW95211395U TWM301985U TW M301985 U TWM301985 U TW M301985U TW 095211395 U TW095211395 U TW 095211395U TW 95211395 U TW95211395 U TW 95211395U TW M301985 U TWM301985 U TW M301985U
Authority
TW
Taiwan
Prior art keywords
led
led led
heat dissipation
substrate
lamp
Prior art date
Application number
TW095211395U
Other languages
Chinese (zh)
Inventor
Pai-Chiou Wang
Original Assignee
Augux Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Augux Co Ltd filed Critical Augux Co Ltd
Priority to TW095211395U priority Critical patent/TWM301985U/en
Priority to DE202006015881U priority patent/DE202006015881U1/en
Publication of TWM301985U publication Critical patent/TWM301985U/en
Priority to AU2007100193A priority patent/AU2007100193A4/en
Priority to MYPI20070420A priority patent/MY142350A/en
Priority to KR2020070004641U priority patent/KR20080000016U/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00Protecting lighting devices from damage
    • F21V15/01Housings, e.g. material or assembling of housing parts
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Description

M301985 八、新型說明: 【新型所屬之技術領域】 本創作係有關於-種LED燈具與散熱模組快速組裝結 構,尤指一種可縮短Lm)燈具與散熱模組之裝配時間的 速組裝結構。 、 【先前技術】 由於發光二極體⑽)具有亮度高、省電、壽命長等 諸多優點,而被廣泛地應用在燈具的照明上,其通常係將 多數LH)燈加以排列並連結於一基板上,而組合成一 led ,組,再藉由複數LED燈組的串聯或並聯設置,而達成大 fc圍'、、、射與同冗度之使用需求;另’由於燈的耐埶性 較差,通常需藉助散熱模組來將各Lm)燈所產生的埶量導 離,以使各LED燈能在一較低的溫度下運作,因此兩者在M301985 VIII. New Description: [New Technology Field] This creation department has a quick assembly structure of LED lamps and heat dissipation modules, especially a speed assembly structure that can shorten the assembly time of Lm) lamps and heat dissipation modules. [Prior Art] Since the light-emitting diode (10) has many advantages such as high brightness, power saving, long life, etc., and is widely used in the illumination of lamps, it is usually arranged and connected to a plurality of LH lamps. On the substrate, combined into a led, group, and then connected in series or in parallel by a plurality of LED light groups, to achieve the use of large fc circumference ',,, and the same redundancy; and 'due to the poor resistance of the lamp Usually, a heat dissipation module is required to guide the amount of enthalpy generated by each Lm lamp so that each LED lamp can operate at a lower temperature, so both

使用上係缺一不可,故如何藉由結構的設計,以達成[ED 燈具與散熱模㈣快速組裝,已成為從事該項行業之相關 人士所研究的重要課題。 習知LED燈具與散熱體組裝結構,主要包括一 LED严 …散熱體,該燈具包含一殼體及一容設於殼體: :的LED燈組,在LED帛組之背面貼附接觸有銘製的散熱 =、,、亚,散熱體上設有複數固定孔,另在殼體上設有對應 :气固定孔的螺孔,再以螺絲等固定元件穿入固定孔而螺 於殼體之螺孔中,以達成LED燈具與散熱體的組合。 /、、、:而白知LED燈具與散熱體組裝結構,在實際使用 M301985 =下=問題點’由於其係藉由螺絲等固定元件 力成ΐ Ϊ 時相當的緩慢,不僅需耗費大量的人 支出,而大ΓΓ累:進行螺固,更增加螺絲等元件的成本 其實用性及經濟效益;另由於其係以紹 Ί欠mED燈組進行導、散熱之作用,其 又相當慢,因此所能帶離的熱量有 1 率ϊ ΡΠ、敗、A # Θ 1 j 庄’尤其在尚功 丑也被開發出來後,而使其根本益法滿pb ::::具之散熱需求,更由於其導、散熱 善者 之LED燈的使用壽命被大幅縮短,而待加以改 該行ί,Γϊ!知所產ϊ之問題,本案創作人遂以從事 良,;:太Γ經驗’亚本著精益求精之精神,積極研究改 產生^ 1作『led燈具與散熱模組快速組裝結構』之 【新型内容】 創作之主要目的,在於提供—種led燈具與散熱模 C二:上結構’其係藉由led燈組與均溫板可快速的裝 本時所f耗費的人力成 -处轉何螺絲等固定元件進行螺固,更能降低 几件的成本支出。 又月匕丨牛低 $哉if達成上述之目的,本創作係提供一種led燈具盘 裝結構’包括—led燈具及—散 ㈣D燈具包含—殼體及—⑽燈組,該有、一、容 M301985 孔,於各置孔之内緣凸伸有 有複數支架,並在支架内::::;且於其外緣向外延伸 燈组容設於殼體之容置孔内, 二乂亥 固接於基板底面該散熱模組具有一 支架一側處,該均溫板之-面係與二組: 土附接觸,另—面則為支架之扣合部所屋掣扣 固。 【實施方式】 有關本創作之詳細說明及技術内容,配合圖式說明如 下’然而所附圖式僅提供參考與說明肖,並非用來對本 作加以限制者。 请參照第-至四圖所示,係分別為本創作之立體分解 圖、組合示意圖、組合剖視®及第三圖之A區域局部放大 圖,本創作係提供-寺重LED丈登具與散熱模組快速組裝結 構’其主要包括一 led燈具1及一散熱模組5,其中: "亥LED 4具1包含一殼體1〇及一 LED燈組20,殼體1 〇 之下方成形有一圓錐筒丨丨,於圓錐筒u之頂面形成有一容 置孔12,於容置孔12之内緣凸伸有複數相互對應的止擋塊 13,並於各止擋塊13上分別設有通孔131 ,另在各止擋塊 13上方之容置孔12左侧延伸有定位塊14 ;在圓錐筒11之頂 面向外延伸有二相互對應的支架15,該支架15係呈一倒 L」形’於其短臂内侧分別成形有扣合部ι51 ;又,於 —支架15之間隔處分別設有二倒r ^」形的固定架16,該 M301985 固定架16之末端水平延伸有平板16ι ,並於平板16ι中心 設有穿孔162 ;再者,於圓錐筒n之底端内部設階梯環 17(如第三圖所示)。 該LED燈組20係容設於殼體10之容置孔12内,且其包 含一基板21及複數固接於基板21底面的LED燈22,於基板 21之中間設有一中心孔211 ,並於中心孔211之外周緣環 $又有多數固接孔212 ,另於基板21之一侧設有與殼體1〇之 φ 定位塊14相互貼抵接觸的止轉面213,以使基板21裝入殼 體10後不產生旋轉;於各LED燈22之後方延伸有凸柱 221 ,該凸柱221係用以嵌入基板21之固接孔211而連 於均溫板50之上方貼接有散熱片 熱模組5的導、散熱效能,本實 该散熱扠組5具有一均溫板5〇,該均溫板5〇係設於殼 體10之支架15的一侧邊處,且其之一面係與LE])燈組罚之 基板21相互貼接,另一面則被支架15之扣合部151所壓掣 扣固。另可因應各種不同型態的LED燈組2〇的散熱需求, 片(圖未示),以增加該散The use of the upper system is indispensable, so how to achieve rapid assembly of [ED lamps and cooling modules (4) by structural design has become an important topic for people involved in the industry. The conventional LED lamp and heat sink assembly structure mainly includes an LED heat sink body, and the lamp includes a casing and a LED lamp group: the LED lamp group is attached to the back of the LED group. The heat dissipation=,,,,,,,, the plurality of fixing holes are arranged on the heat dissipating body, and the screw holes corresponding to the gas fixing holes are arranged on the housing, and then the fixing elements are screwed into the fixing holes by screws and the like and screwed into the housing In the hole, to achieve the combination of LED lamps and heat sinks. /,,,: and Baizhi LED lamp and heat sink assembly structure, in the actual use of M301985 = down = problem point 'because it is quite slow by fixing components such as screws, it is not only a lot of people Expenditure, but a lot of tiring: the screwing, the cost of the components such as screws and the cost and practicality; and the fact that it is slow and slow due to the effect of the sufficiency of the mED lamp group. The heat that can be taken away has a rate of ϊ ΡΠ, 败, A # Θ 1 j Zhuang', especially after the ugly ugly has been developed, and its fundamental benefit is full of pb :::: The service life of LED lamps with good guidance and heat dissipation has been greatly shortened, and it is necessary to change the line. Γϊ! Knowing the problem of production, the creator of this case is engaged in good work; The spirit of excellence, actively research and change the production of ^ 1 "LED lighting and rapid assembly of the thermal module" [new content] The main purpose of the creation is to provide a kind of led lamps and cooling modules C two: the upper structure 'the system Quickly installed by led light group and temperature equalizing plate The cost of manpower is reduced - the fixing components such as screws are screwed, which can reduce the cost of several pieces. The month of the yak low $哉if achieves the above purpose, the creation of the system provides a led fixture panel structure 'including - led lamps and - scattered (four) D lamps contain - shell and - (10) lamp group, the one, one, the capacity M301985 hole, there are a plurality of brackets protruding from the inner edge of each hole, and in the bracket::::; and the light bulb extending outwardly on the outer edge thereof is accommodated in the receiving hole of the housing, The heat dissipation module is fixed on the bottom surface of the substrate, and the heat dissipation module has a side of the bracket. The surface of the temperature equalization plate is in contact with the two groups: the soil is attached, and the other surface is the buckle of the fastening portion of the bracket. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The detailed description and technical contents of the present invention are set forth in the accompanying drawings. Please refer to the figures in the four to four figures, which are respectively the three-dimensional exploded view, the combined schematic view, the combined cross-section® and the third enlarged view of the A area of the creation. The creation department provides - the temple heavy LED display and The quick assembly structure of the heat dissipation module mainly includes a LED lamp 1 and a heat dissipation module 5, wherein: "Hai LED 4 has a casing 1 and an LED lamp group 20, and the casing 1 is formed under the crucible There is a conical cylinder, and a receiving hole 12 is formed on the top surface of the conical cylinder u. A plurality of stoppers 13 corresponding to each other are protruded from the inner edge of the receiving hole 12, and are respectively disposed on the respective stoppers 13. There is a through hole 131, and a positioning block 14 extends on the left side of the receiving hole 12 above each of the stopping blocks 13; and two corresponding brackets 15 extend outwardly from the top surface of the conical tube 11, and the bracket 15 is inverted. The L" shape is respectively formed with a fastening portion ι51 on the inner side of the short arm; and a spacer 16 is disposed at the interval of the bracket 15 respectively, and the end of the M301985 holder 16 is horizontally extended. a flat plate 16ι and a perforation 162 in the center of the flat plate 16; further, a step inside the bottom end of the conical cylinder n 17 (as shown in FIG third). The LED lamp unit 20 is disposed in the receiving hole 12 of the housing 10, and includes a substrate 21 and a plurality of LED lamps 22 fixed to the bottom surface of the substrate 21. A central hole 211 is defined in the middle of the substrate 21, and A plurality of fixing holes 212 are formed in the peripheral ring 211 outside the center hole 211, and a rotation preventing surface 213 which is in contact with the φ positioning block 14 of the housing 1 is provided on one side of the substrate 21 to make the substrate 21 After the housing 10 is mounted, no rotation is generated. After the LED lamps 22, a stud 221 is extended. The stud 221 is embedded in the fixing hole 211 of the substrate 21 and connected to the temperature equalizing plate 50. The heat dissipation fork set 5 has a temperature equalizing plate 5〇, and the temperature equalizing plate 5 is disposed at one side of the bracket 15 of the casing 10, and One of the faces and the LE]) base plate 21 of the lamp set are attached to each other, and the other side is pressed and fastened by the engaging portion 151 of the bracket 15. In addition, in response to the heat dissipation requirements of various types of LED lamp sets 2, the film (not shown) is used to increase the dispersion.

體6具有一圓柱形固定段61及一 從固定段61向外擴張的圓 M301985 板形爽孝段62,該固定段61係心嵌人 131而固定,該夾掣段62則係被夾擎於=之通孔 組2。之基板21的相對應面之間 :卜與㈣燈 21緊密貼附接觸,以增加熱傳導效^概板如件以與基板 組合時先將各彈性體6之固定段 之通孔131中,次將LK)燈龟 刀別置入止擋塊13 内,並使LED燈組2。之美板21底面:於殼體1〇之容置孔 奸62上方心夕仏 接於各彈性體6之夾 L上方並=溫板5〇對應於咖燈組2◦而置設於殼 版1ϋ上方,亚壓制均溫板50向下 面被支架15之扣合部151所^周 使均溫板50之頂 具與散熱模組的快速的組】=此,即可達細燈 ^ Μ φ ΑΑ A 、 件以大幅減少裝配時所 而耗費的人力成本;且因不需 螺固,更能降低元件的成本支出/7累、、、糸寺固疋疋件進行 請參閱第五圖所示,係為本創作與 剖視圖,議燈具1更包含-反光罩3〇、== :-固定環32 ’該反光罩3〇係呈 梯環17内/’§亥固定環32可藉由黏膠連接於殼體】0之階 光並1:::通入電流’使其之各led _ 蕤ώ /、产、、里猎由基板21傳導給均溫板5〇,並 :由:溫板5°之氣液相熱傳機制,以將熱量快速帶至上 =與外部的冷空氣進行熱交換,以使各燈 在-較低的溫度下運作,進而延長其使用壽命。 M301985 清苓閱第六圖所示,係為本創作另一實施例之組合示 思圖,该均溫板5〇除可為上述實施例之型態外,其亦可因 應各種不同的空間限制或LED燈組2〇之散熱需求作相應的 變化,本實施例係由一矩形上板51及一對應罩合於上板Η 下方的矩形下板52,於上、下板51、52之内部裝填有毛細 組織及工作流體,並形成有-真空腔;如此,可有效的大 幅提昇導熱效能。 綜上所述,當知本創作之⑽燈具與散熱模組快速組 衣結構已具有產業利用性、新穎性與進步性,又本創作之 f造亦未曾見於同類產品及公開使用,完全符合新型專利 申4要件,爰依專利法提出申請。 即拘述㈣本創作之較佳可行實施例,並非因此 式内專㈣圍’故舉凡運用本創作說明書及圖 ίι之^ %效結構變化,或直接或間接運用於其它相 ==㈣,均同㈣包含於本創作所涵蓋之範圍内, 【圖式簡單說明】 第一圖 第二圖 第三圖 第四圖 第五圖 係本創作之立體分解圖。 係本創作之組合示意圖。 係本創作之組合剖視圖。 係第二圖之Α區域局部放大圖。 之組合剖視 係本創作歧光罩、透光鏡及固定環 10 M301985 圖。 第六圖 係本創作另一實施例之組合示意圖。The body 6 has a cylindrical fixing section 61 and a circle M301985, which is outwardly expanded from the fixing section 61. The fixing section 61 is fixed by the inlaid 131, and the clamping section 62 is clamped. In the through hole group 2 of =. Between the corresponding faces of the substrate 21: the light and the (4) lamp 21 are closely attached to each other to increase the heat conduction effect, such as a piece of the through hole 131 of the fixing section of each elastic body 6 when combined with the substrate. Insert the LK) lamp turtle into the stop block 13 and make the LED group 2. The bottom surface of the beauty board 21 is placed above the clip L of each elastic body 6 on the upper side of the housing 1 and is placed on the shell plate 1 corresponding to the coffee light group 2◦. Above, the sub-pressed temperature equalizing plate 50 is fastened to the lower portion of the holding portion 151 of the bracket 15 to make the top plate of the temperature equalizing plate 50 and the quick-dissipating module of the heat-dissipating module]= this, the fine lamp can be reached Μ φ ΑΑ A, the parts to greatly reduce the labor cost of assembly; and because no need to screw, can reduce the cost of components / 7 tired,,,,,,,,,,,,,,,,,, This is a creative and cross-sectional view. The lamp 1 also includes a reflector 3〇, == :- fixing ring 32 'The reflector 3 is in the ladder ring 17 / ' § Hai fixed ring 32 can be connected by adhesive In the shell] 0 step light and 1::: pass current 'to make each led _ 蕤ώ /, production, and hunter is conducted from the substrate 21 to the temperature equalizing plate 5 〇, and: by: warm plate 5 The gas phase heat transfer mechanism of the gas to quickly bring heat to the upper = heat exchange with the external cold air, so that the lamps operate at - lower temperatures, thereby extending their service life. M301985 is shown in the sixth figure, which is a combination diagram of another embodiment of the present invention. The temperature equalization plate 5 can be in the form of the above embodiment, and can also be adapted to various space constraints. Or the heat dissipation requirement of the LED lamp group 2 is correspondingly changed. In this embodiment, a rectangular upper plate 51 and a corresponding rectangular lower plate 52 corresponding to the lower plate , are disposed inside the upper and lower plates 51 and 52. It is filled with capillary structure and working fluid, and has a vacuum chamber; thus, it can effectively improve the thermal conductivity. In summary, when the Zhizhi creation (10) lighting and cooling module rapid assembly structure has industrial utilization, novelty and progress, and the creation of this creation has not been seen in similar products and public use, fully in line with the new type Patent application 4 requirements, filed in accordance with the patent law. That is to say, (4) the preferred and feasible embodiment of the creation, which is not the exclusive use of this creation manual and the structure of the figure, or directly or indirectly applied to other phases == (four), The same as (4) is included in the scope of this creation, [Simple description of the diagram] The first diagram, the second diagram, the third diagram, the fourth diagram, and the fifth diagram are the three-dimensional exploded view of the creation. A schematic diagram of the combination of the creation. A sectional view of the combination of the creations. A partial enlarged view of the area of the second figure. The combination of the profile of the creation of the mask, light mirror and retaining ring 10 M301985 figure. Figure 6 is a schematic diagram showing the combination of another embodiment of the present creation.

主要元件符號說明】 本創作】 LED燈具1 殼體10 圓錐筒11 容置孔12 止擋塊13 通孔131 定位塊14 支架15 扣合部151 固定架16 平板161 穿孔162 階梯環17 LED燈組20 基板21 中心孔211 固接孔212 止轉面213 LE1D 燈 22 凸柱221 反光罩30 透光鏡31 固定環32 散熱模組5 均溫板50 上板51 下板52 穿線孔53 彈性體6 固定段61 夾掣段62Main component symbol description] This creation] LED lamp 1 housing 10 cone cylinder 11 accommodating hole 12 stop block 13 through hole 131 positioning block 14 bracket 15 fastening portion 151 fixing frame 16 plate 161 perforation 162 step ring 17 LED lamp group 20 Substrate 21 Center hole 211 Fixing hole 212 Stopping surface 213 LE1D Lamp 22 Stud 221 Reflector 30 Transmissive mirror 31 Fixing ring 32 Heat sink module 5 Temperature plate 50 Upper plate 51 Lower plate 52 Threading hole 53 Elastomer 6 Fixed section 61 clamp section 62

Claims (1)

M301985 九、申請專利範圍: 1· 一種LED燈具與散熱模組快速組裝結構,包括: 一 LED燈具,包含: 一 一殼體,具有一容置孔,於容置孔之内緣凸伸有止 叔塊,且於其外緣向外延伸有複數支架,並在支架内側成 形有相互對應的扣合部; 一 纟且組,谷设於殼體之容置孔内,該LED燈組M301985 IX. Patent application scope: 1. A rapid assembly structure of LED lamps and heat dissipation modules, comprising: an LED lamp comprising: a housing having a receiving hole protruding from the inner edge of the receiving hole The second block has a plurality of brackets extending outwardly from the outer edge thereof, and a corresponding fastening portion is formed on the inner side of the bracket; and the group is arranged in the receiving hole of the housing, the LED light group 包含一基板及複數固接於基板底面的LED燈;以及、 一散熱模組,具有一均溫板,其設於殼體之支架一 側’該均溫板之一面係錢D燈組之基板相互貼附接觸, 另一面則被支架之扣合部所壓掣扣固。 2.如申請專·圍第丨項所述之LE]) ㈣組裝結構,其中該殼體之下方成形有-圓錐筒了 = 錐同之頂面形成有所述的容置孔。 、 圍第2項所述之LED燈具與散熱模組 “構,其中該圓錐筒之底端内部設有階梯環。 議二::專:!圍第1項所述之LED燈具與散熱模組 而該LED燈組之基板之一側設有2上方延伸有定位塊, 體之定位塊相互貼抵接觸。Ί 5亥止轉面係與殼 5·如申請專利範圍笫彳 快速組裝結構,其中該支芊係燈具與散熱模組 内側分別成形有所述的扣合部。—㈣L」形’於其短臂 6.如申請專利範圍第1項所述之⑽燈具與散熱模組 M301985 快Π:其中該殼體 4板固定架之末端水平延伸有平板,並 万、十板中心設有穿孔。 … 第1項所述之LED燈具與散熱模組 :::結構,其中該LED燈組之基板上設有複數固接 之固接孔而連接。 冑凸柱’该凸柱用以嵌入基板 心圍第1項所述之LED燈具與散熱模組 上溫板包含一上板及一對應罩合於 板下方的下板,並於上、下板之間形成有—直空胪。 〜且衣、、、.構,其中該均溫板之中心設有—穿線孔。 10.,申請專利範圍第!項所述之LED燈具與散熱模组 、^组叙結構’其更包括有複數彈性體,該彈性體具有— :疋段及-從固定段向外擴張的夾掣段,另該殼 塊設有通孔,該固定段係用以嵌入止播塊之通孔而固定; 该夹掣段則係被夾掣於止播塊與⑽燈組之基板的相對應 面之間。 UThe invention comprises a substrate and a plurality of LED lamps fixed to the bottom surface of the substrate; and a heat dissipation module having a temperature equalizing plate disposed on a side of the bracket of the housing. The one surface of the temperature equalizing plate is a substrate of the money D lamp group The other side is attached to the contact, and the other side is pressed and fastened by the fastening portion of the bracket. 2. If the application is as described in the above article, LE]) (4) The assembled structure in which the underside of the casing is formed with a cone-shaped cylinder = the top surface of the cone is formed with the accommodating hole. The LED lamp and the heat dissipation module according to item 2, wherein the bottom end of the cone is provided with a step ring. Discussion 2:: Special:! The LED lamp and the heat dissipation module described in Item 1 One side of the substrate of the LED lamp group is provided with a positioning block extending upwardly, and the positioning blocks of the body are in contact with each other. Ί 5 止 止 转 系 壳 壳 壳 · · · · · · · · 如 如 如 如The supporting luminaire and the inner side of the heat dissipating module are respectively formed with the engaging portion. - (4) L" shaped 'in the short arm 6. (10) The luminaire and the heat dissipating module M301985 are as described in claim 1 The end of the housing 4 plate holder has a flat plate extending horizontally, and the center of the ten and ten plates is provided with a perforation. The LED lamp and the heat dissipation module of the first aspect are:: the structure, wherein the substrate of the LED lamp group is provided with a plurality of fixing holes for connection.胄 胄 ' 该 ' ' ' ' ' LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED There is a straight space between them. ~ and clothing,, and structure, wherein the center of the temperature equalizing plate is provided with a threading hole. 10. Apply for the patent scope! The LED lamp and the heat dissipation module and the assembly structure of the item further comprise a plurality of elastic bodies, the elastic body has: a 疋 section and a 掣 section which expands outward from the fixed section, and the shell block is provided There is a through hole which is fixed by being inserted into the through hole of the stop block; the pinch section is sandwiched between the stop block and the corresponding surface of the substrate of the (10) lamp group. U
TW095211395U 2006-06-29 2006-06-29 Rapid-assembly structure for LED lamp set and heat dissipation module TWM301985U (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW095211395U TWM301985U (en) 2006-06-29 2006-06-29 Rapid-assembly structure for LED lamp set and heat dissipation module
DE202006015881U DE202006015881U1 (en) 2006-06-29 2006-10-17 Unified construction for an LED lamp with a heat-dissipating arrangement has LED lamp set on a carrier plate and heat-dissipating module with an isothermal plate
AU2007100193A AU2007100193A4 (en) 2006-06-29 2007-03-08 Quick assembling structure for LED lamp and heat dissipating moudle
MYPI20070420A MY142350A (en) 2006-06-29 2007-03-19 Quick assembling structure for led lamp and heat dissipating module
KR2020070004641U KR20080000016U (en) 2006-06-29 2007-03-21 Quick Assembling Structure for LED Lamp and Heat Dissipating Moudle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095211395U TWM301985U (en) 2006-06-29 2006-06-29 Rapid-assembly structure for LED lamp set and heat dissipation module

Publications (1)

Publication Number Publication Date
TWM301985U true TWM301985U (en) 2006-12-01

Family

ID=37576242

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095211395U TWM301985U (en) 2006-06-29 2006-06-29 Rapid-assembly structure for LED lamp set and heat dissipation module

Country Status (5)

Country Link
KR (1) KR20080000016U (en)
AU (1) AU2007100193A4 (en)
DE (1) DE202006015881U1 (en)
MY (1) MY142350A (en)
TW (1) TWM301985U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102472478A (en) * 2009-07-31 2012-05-23 欧司朗股份有限公司 Lighting device and method for assembling a lighting device
US10047946B2 (en) 2007-05-07 2018-08-14 Cree, Inc. Light fixtures and lighting devices

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1898144A3 (en) * 2006-09-08 2010-08-25 Robert Bosch Gmbh Lighting device with several LED components and method for its manufacture
DE102007041126A1 (en) * 2007-08-30 2009-03-05 Osram Opto Semiconductors Gmbh Lighting device, has opto-electronic component i.e. LED, with housing body, and semiconductor chip arranged within housing body with housing base, where base includes connecting components for providing detachable mechanical connections
US9086213B2 (en) 2007-10-17 2015-07-21 Xicato, Inc. Illumination device with light emitting diodes
DE102008017614B8 (en) * 2008-04-04 2010-02-11 Insta Elektro Gmbh lighting device
KR200449542Y1 (en) * 2008-07-30 2010-07-20 박문화 LED stand
DE202009010577U1 (en) * 2009-08-05 2010-12-09 Bjb Gmbh & Co. Kg Lamp base and lamp socket
KR200448163Y1 (en) * 2009-08-18 2010-03-23 가이오산업 주식회사 Heat sink for LED Lighting apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10047946B2 (en) 2007-05-07 2018-08-14 Cree, Inc. Light fixtures and lighting devices
CN102472478A (en) * 2009-07-31 2012-05-23 欧司朗股份有限公司 Lighting device and method for assembling a lighting device

Also Published As

Publication number Publication date
DE202006015881U1 (en) 2006-12-21
KR20080000016U (en) 2008-01-04
AU2007100193A4 (en) 2007-04-19
MY142350A (en) 2010-11-15

Similar Documents

Publication Publication Date Title
TWM301985U (en) Rapid-assembly structure for LED lamp set and heat dissipation module
TWI312400B (en)
TWI375768B (en) Led light tube
TWM458519U (en) Omni-directional projection LED heat dissipation holder and heat dissipating module thereof
TWM436791U (en) High-performance heat-dissipated lamp
TWM348981U (en) Heat dissipation module
TW201251148A (en) Manufacturing method of LED heat conduction device
TW201245621A (en) Light-emitting module with cooling function
CN117267689B (en) Spotlight with high-efficient heat radiation structure
TW200901863A (en) Heat-dissipation module of a light-emitting device
CN109786541B (en) Heat dissipation device
CN106642034B (en) Heat radiation system of track lamp
TW201113468A (en) LED light bulb having multiple-directional projection
ITFI20110161A1 (en) DISSIPATION APPARATUS FOR LED LIGHTING SYSTEMS.
TWI354748B (en) Lamp
TWM298078U (en) LED desk lamp
TW201135143A (en) LED ceiling lamp and heat dissipation module thereof
TWM325447U (en) LED heat sink module
WO2018023488A1 (en) Led device having heat sink
TWI313335B (en)
CN205480282U (en) LED PAR (parabolic aluminum reflector) lamp structure
TWM318092U (en) Stationary LED light
TWM326115U (en) Multi-angle illumination lighting device
TWM296097U (en) Lighting apparatus with heat-dissipating structure
TWM440410U (en) Lamp capable of improving heat dissipation effect

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees