DE202006015881U1 - Unified construction for an LED lamp with a heat-dissipating arrangement has LED lamp set on a carrier plate and heat-dissipating module with an isothermal plate - Google Patents
Unified construction for an LED lamp with a heat-dissipating arrangement has LED lamp set on a carrier plate and heat-dissipating module with an isothermal plate Download PDFInfo
- Publication number
- DE202006015881U1 DE202006015881U1 DE202006015881U DE202006015881U DE202006015881U1 DE 202006015881 U1 DE202006015881 U1 DE 202006015881U1 DE 202006015881 U DE202006015881 U DE 202006015881U DE 202006015881 U DE202006015881 U DE 202006015881U DE 202006015881 U1 DE202006015881 U1 DE 202006015881U1
- Authority
- DE
- Germany
- Prior art keywords
- plate
- housing
- construction according
- hole
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
Description
Die Erfindung betrifft eine Zusammenbaukonstruktion für eine LED-Lampe mit einer Wärmeableitanordnung.The The invention relates to an assembly structure for an LED lamp with a heat dissipation arrangement.
Da Leuchtdioden (LEDs) über hohe Helligkeit, geringen Energieverbrauch und lange Lebensdauer verfügen, werden sie zunehmend für LED-Lampen verwendet. Dabei werden im Allgemeinen mehrere LEDs auf einer Trägerplatte angeordnet und miteinander verbunden, um ein LED-Modul zu bilden, und mehrere LED-Module werden seriell oder parallel verbunden, um eine große Beleuchtungsfläche für hohe Helligkeit zu erzielen. Da LEDs eine geringe Wärmebeständigkeit zeigen, ist im Allgemeinen eine Wärmeableitanordnung erforderlich, um die durch eine jeweilige LED erzeugte Wärme abzuführen, so dass sie mit niedrigerer Temperatur betrieben werden kann. Herkömmlicherweise verfügt eine Zusammenbaukonstruktion für eine LED-Lampe über einen LED-Lampensatz und eine Wärmeableiteinheit. Der LED-Lampensatz verfügt über ein Gehäuse, ein in diesem installiertes LED-Modul, eine an der Rückseite desselben angebrachte Wärmeableiteinheit aus Aluminium, mehrere in dieser vorhandene Befestigungslöcher, sowie am Gehäuse ausgebildete Schraubenlöcher, die einem jeweiligen Befestigungsloch entsprechen. Durch das Befestigungsloch wird ein Befestigungselement wie eine Schraube in ein Schraubloch im Gehäuse eingeschraubt, wodurch der LED-Lampensatz und die Wärmeableiteinheit miteinander verbunden werden.There Light-emitting diodes (LEDs) via high brightness, low energy consumption and long life feature, they are increasingly used for LED lamps used. There are generally several LEDs on a carrier plate arranged and connected together to form an LED module, and several LED modules are connected in series or in parallel to a big illumination area for high To achieve brightness. Since LEDs exhibit low heat resistance, generally one is heat dissipating required to dissipate the heat generated by each LED, so that it can be operated at a lower temperature. traditionally, has an assembly construction for a LED lamp over one LED lamp set and a heat dissipation unit. The LED lamp set has a Housing, a in this installed LED module, one attached to the back of the same heat dissipating made of aluminum, several in this existing mounting holes, as well on the housing trained screw holes, which correspond to a respective mounting hole. Through the mounting hole a fastener such as a screw in a screw hole in the case screwed, causing the LED lamp set and the heat dissipation unit together get connected.
Jedoch bestehen bei diesem Zusammenbau noch einige Probleme. Da ein Befestigungselement wie eine Schraube benötigt wird, ist der Zusammenbauprozess relativ langwierig, was nicht nur zu hohen Arbeitskosten führt, sondern es wird auch viel Material verwendet. Dadurch sind die Praxisgerechtheit und die Kosteneffektivität des Aufbaus beeinträchtigt. Da die Wärmeableiteinheit aus Aluminium über keine hohe Wärmeleitfähigkeit verfügt, ist der Wärmeableiteffekt für den LED-Lampensatz mangelhaft. Insbesondere bei Hochleistungs-LEDs besteht das Problem, dass die Lebensdauer dieser LEDs verkürzt sein kann.however There are still some problems with this assembly. As a fastener like a screw is needed is, the assembly process is relatively tedious, which is not only leads to high labor costs, but also a lot of material is used. Thus, the practicality and the cost effectiveness of the construction impaired. There the heat dissipation unit made of aluminum over no high thermal conductivity features, is the heat dissipation effect for the LED lamp set poor. Especially with high power LEDs the problem that the life of these LEDs be shortened can.
Der Erfindung liegt die Aufgabe zugrunde, eine Zusammenbaukonstruktion für eine LED-Lampe mit Wärmeableitanordnung zu schaffen, die einen schnellen Zusammenbau ermöglicht. Erfindungsgemäß werden ein LED-Modul und ein Wärmeableitmodul verwendet. Diese Module sind so aufgebaut, dass keine speziellen Befestigungselemente, wie Schrauben, benötigt werden.Of the Invention is based on the object, an assembly construction for one LED lamp with heat dissipation arrangement to create, which allows a quick assembly. According to the invention an LED module and a heat dissipation module used. These modules are constructed so that no special Fasteners, such as screws, are needed.
Die Erfindung wird nachfolgend anhand von durch Figuren veranschaulichten Ausführungsformen näher erläutert.The Invention will now be illustrated by figures embodiments explained in more detail.
Gemäß den
Der
LED-Lampensatz
Das
LED-Modul
Das
Wärmeableitmodul
Die
Ausführungsform
verfügt
ferner über mehrere
elastische Körper
Beim
Zusammenbauprozess wird der Befestigungsabschnitt
Gemäß der
Wenn
die LED-Lampe eingeschaltet ist, fließt ein Strom durch das LED-Modul
Gemäß der
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095211395U TWM301985U (en) | 2006-06-29 | 2006-06-29 | Rapid-assembly structure for LED lamp set and heat dissipation module |
TW95211395 | 2006-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202006015881U1 true DE202006015881U1 (en) | 2006-12-21 |
Family
ID=37576242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE202006015881U Expired - Lifetime DE202006015881U1 (en) | 2006-06-29 | 2006-10-17 | Unified construction for an LED lamp with a heat-dissipating arrangement has LED lamp set on a carrier plate and heat-dissipating module with an isothermal plate |
Country Status (5)
Country | Link |
---|---|
KR (1) | KR20080000016U (en) |
AU (1) | AU2007100193A4 (en) |
DE (1) | DE202006015881U1 (en) |
MY (1) | MY142350A (en) |
TW (1) | TWM301985U (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1898144A2 (en) * | 2006-09-08 | 2008-03-12 | Robert Bosch Gmbh | Lighting device with several LED components and method for its manufacture |
DE102007041126A1 (en) * | 2007-08-30 | 2009-03-05 | Osram Opto Semiconductors Gmbh | Lighting device, has opto-electronic component i.e. LED, with housing body, and semiconductor chip arranged within housing body with housing base, where base includes connecting components for providing detachable mechanical connections |
WO2009052093A1 (en) * | 2007-10-17 | 2009-04-23 | Xicato, Inc. | Illumination device with light emitting diodes |
DE102008017614B3 (en) * | 2008-04-04 | 2009-09-17 | Insta Elektro Gmbh | lighting device |
WO2011012444A1 (en) * | 2009-07-31 | 2011-02-03 | Osram Gesellschaft mit beschränkter Haftung | Lighting device and method for assembling a lighting device |
WO2011015168A1 (en) * | 2009-08-05 | 2011-02-10 | Bjb Gmbh & Co. Kg | Arrangement of lamp socket and lamp base |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI448644B (en) | 2007-05-07 | 2014-08-11 | Cree Inc | Light fixtures |
KR200449542Y1 (en) * | 2008-07-30 | 2010-07-20 | 박문화 | LED stand |
KR200448163Y1 (en) * | 2009-08-18 | 2010-03-23 | 가이오산업 주식회사 | Heat sink for LED Lighting apparatus |
-
2006
- 2006-06-29 TW TW095211395U patent/TWM301985U/en not_active IP Right Cessation
- 2006-10-17 DE DE202006015881U patent/DE202006015881U1/en not_active Expired - Lifetime
-
2007
- 2007-03-08 AU AU2007100193A patent/AU2007100193A4/en not_active Ceased
- 2007-03-19 MY MYPI20070420A patent/MY142350A/en unknown
- 2007-03-21 KR KR2020070004641U patent/KR20080000016U/en not_active Application Discontinuation
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1898144A2 (en) * | 2006-09-08 | 2008-03-12 | Robert Bosch Gmbh | Lighting device with several LED components and method for its manufacture |
EP1898144A3 (en) * | 2006-09-08 | 2010-08-25 | Robert Bosch Gmbh | Lighting device with several LED components and method for its manufacture |
DE102007041126A1 (en) * | 2007-08-30 | 2009-03-05 | Osram Opto Semiconductors Gmbh | Lighting device, has opto-electronic component i.e. LED, with housing body, and semiconductor chip arranged within housing body with housing base, where base includes connecting components for providing detachable mechanical connections |
WO2009052093A1 (en) * | 2007-10-17 | 2009-04-23 | Xicato, Inc. | Illumination device with light emitting diodes |
US9086213B2 (en) | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
DE102008017614B3 (en) * | 2008-04-04 | 2009-09-17 | Insta Elektro Gmbh | lighting device |
DE102008017614B8 (en) * | 2008-04-04 | 2010-02-11 | Insta Elektro Gmbh | lighting device |
WO2011012444A1 (en) * | 2009-07-31 | 2011-02-03 | Osram Gesellschaft mit beschränkter Haftung | Lighting device and method for assembling a lighting device |
DE102009035517A1 (en) * | 2009-07-31 | 2011-02-03 | Osram Gesellschaft mit beschränkter Haftung | Lighting device and method for mounting a lighting device |
WO2011015168A1 (en) * | 2009-08-05 | 2011-02-10 | Bjb Gmbh & Co. Kg | Arrangement of lamp socket and lamp base |
CN102472480A (en) * | 2009-08-05 | 2012-05-23 | Bjb两合公司 | Arrangement of lamp socket and lamp base |
US8668363B2 (en) | 2009-08-05 | 2014-03-11 | Bjb Gmbh & Co. Kg | Arrangement of lamp socket and lamp base |
Also Published As
Publication number | Publication date |
---|---|
AU2007100193A4 (en) | 2007-04-19 |
TWM301985U (en) | 2006-12-01 |
KR20080000016U (en) | 2008-01-04 |
MY142350A (en) | 2010-11-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20070125 |
|
R081 | Change of applicant/patentee |
Owner name: PYROSWIFT HOLDING CO., LTD., HK Free format text: FORMER OWNER: AUGUX CO., LTD., GUEISHAN, TW Effective date: 20090204 |
|
R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20091118 |
|
R157 | Lapse of ip right after 6 years |
Effective date: 20130501 |