WO2018023488A1

WO2018023488A1 - Led device having heat sink

Info

Publication number: WO2018023488A1
Application number: PCT/CN2016/093054
Authority: WO
Inventors: 袁志贤
Original assignee: 袁志贤
Priority date: 2016-08-03
Filing date: 2016-08-03
Publication date: 2018-02-08

Abstract

An LED device having a heat sink, comprising an LED bulb (70), a base (10), a shade (20), a shade fixing ring (30), a cylindrical heat pipe (40), an LED socket (50), and a rosette-shaped heat pipe (60); the LED bulb (70) is fixed into the LED socket (50), the base (10) is arranged at a bottom portion of the entire LED device; the shade (20) is arranged at a right side of the base (10) and fixed onto the base (10), the shade fixing ring (30) is arranged at a right side of the shade (20) to fix the shade (20); the cylindrical heat pipe (40) penetrates the shade (20) and the shade fixing ring (30), and is fixed onto the base (10); the LED socket (50) is arranged within the cylindrical heat pipe (40) to fix the LED bulb (70), the rosette-shaped heat pipe (60) is connected between the cylindrical heat pipe (40) and the LED bulb (70); and the LED bulb (70) penetrates the rosette-shaped heat pipe (60) and is connected onto the LED socket (50). The present LED device having a heat sink has a good heat dissipation effect.

Description

LED device with heat sink

Technical field

The utility model relates to an LED device, in particular to an LED device with a heat sink.

Background technique

LED equipment has the advantages of power saving and long life. It is the current star product, but the temperature has always been a problem that LED equipment must face. If the LED equipment can not effectively dissipate heat and solve the problem of heat source concentration, the light decay speed of the LED equipment will be Greatly improved, the life of the product will not be able to meet the demand. In general, heat dissipation is achieved by adding heat sink fins to the LED lamp housing. Therefore, the current product has different heat sinks in the LED device housing, but the LED devices are installed in the lamp housing, and there is no Air convection, so the heat dissipation effect is limited. In addition, in order to insulate between the LED device and the lamp holder, there is no connection, and the heat cannot be turned on, which easily causes the LED device to overheat.

Utility model content

The technical problem to be solved by the embodiments of the present invention is to provide an LED device with better heat dissipation effect.

The utility model provides an LED device with a heat sink, comprising an LED light bulb, wherein the LED device with a heat sink further comprises a base, a lamp cover, a lampshade fixing ring, a cylindrical heat pipe, an LED lamp holder and a daisy-shaped heat pipe. The LED bulb is fixed in the LED lamp holder, the base is disposed at the bottom of the entire LED device, the lamp cover is disposed on the right side of the base and is fixed on the base, and the lamp cover fixing ring is disposed on the right side of the lamp cover Fixing the lamp cover, the cylindrical heat pipe is passed through the lamp cover and the lamp cover fixing ring and fixed on the base, the LED lamp holder is disposed in the cylindrical heat pipe to fix the LED bulb, and the daisy-shaped heat pipe is connected to the circle The column heat pipe is between the LED bulbs, and the LED bulb is connected to the LED lamp holder through the daisy-shaped heat pipe.

Wherein, the outer edge of the daisy-shaped heat pipe is provided with a plurality of rows of heat pipe gaps, so that the daisy-shaped heat pipe is divided into a plurality of petal-shaped heat conductive sheets.

Wherein, the left side of the LED bulb is connected to the daisy-shaped heat pipe, and the left side of the daisy-shaped heat pipe is connected to the cylindrical heat pipe, and the cylindrical heat pipe is connected to the base.

Wherein, the cylindrical heat pipe and the daisy heat pipe are made of aluminum alloy, copper alloy or heat conductive plastic.

The daisy-shaped heat pipe in the above LED device is elastically deformed when it is in contact with the LED bulb, and can be closely engaged with the heat-dissipating casing of the LED bulb, so that an LED device having better heat dissipation efficiency can be formed.

DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings to be used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description It is only some embodiments of the present invention, and those skilled in the art can obtain other drawings according to the drawings without any creative work;

1 is a schematic exploded view showing a preferred embodiment of an LED device having a heat sink according to the present invention.

FIG. 2 is a schematic structural view of the LED device shown in FIG. 1. FIG.

Figure 3 is a daisy-shaped heat pipe diagram of the LED device shown in Figure 1.

detailed description

Hereinafter, in the embodiments of the present invention, in conjunction with the drawings in the embodiments of the present invention, The technical solutions are described clearly and completely, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

First, it is necessary to explain some of the terms appearing in this article before describing the embodiments. E.g:

The terms "first", "second", and the like are used herein to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, a "first" element may also be referred to as a "second" element without departing from the teachings of the invention.

In addition, it is to be understood that when an element is "connected" or "coupled" to another element, it can be directly connected or directly coupled to the other element or the intermediate element. In contrast, when an element is referred to as “directly connected” or “directly connected” to another element, the.

The various terms appearing herein are merely used to describe the specific embodiments and are not intended to limit the invention. Unless the context clearly indicates otherwise, the singular forms are intended to include the plural.

When the terms "include" and/or "include" are used in the specification, the terms are used to indicate the presence of the features, integers, steps, operations, components and/or components, but do not exclude one or more other features, The existence and/or addition of the whole, steps, operations, elements, components and/or groups thereof.

About the embodiment:

Please refer to FIG. 1-3, which is an LED device with a heat sink of the present invention. A schematic structural view of a preferred embodiment. A preferred embodiment of the LED device having a heat sink includes a base 10, a lamp cover 20, a lampshade retaining ring 30, a cylindrical heat pipe 40, an LED lamp holder 50, a daisy-shaped heat pipe 60, and an LED bulb 70.

The susceptor 10 is disposed at the bottom of the entire LED device. The LED bulb 70 is fixed in the LED lamp holder 50. The daisy-shaped heat pipe 60 is connected to the cylindrical heat pipe 40. The cylindrical heat pipe 40 is connected to the base 10, and the heat generated by the LED bulb 70 is quickly transmitted to the conduction mode. Base 10. The outer edge of the daisy-shaped heat pipe 60 is provided with a heat pipe gap, so that the daisy-shaped heat pipe 60 forms a separate sheet-shaped outer casing, which is elastically deformed when in contact with the LED bulb 70, and thus can be closely integrated with the heat-dissipating casing of the LED bulb 70. Bonding, thus forming an LED device with better heat dissipation efficiency.

Specifically, the LED bulb 70 is fixed in the LED lamp holder 50. The pedestal 10 is disposed at the bottom of the entire LED device. The lamp cover 20 is disposed on the right side of the pedestal 10 and is fixed on the pedestal 10. The lampshade fixing ring 30 is disposed on the right side of the lamp cover 20 to fix the lamp cover 20. The cylindrical heat pipe 40 passes through the lamp cover 20 and the lampshade fixing ring 30 and is fixed on the base 10. The LED lamp holder 50 is disposed on the cylindrical heat pipe. The LED bulb 70 is fixed in the 40, and the daisy-shaped heat pipe 60 is connected between the cylindrical heat pipe 40 and the LED bulb 70. The LED bulb 70 is connected to the LED lamp holder 50 through the daisy-shaped heat pipe 60.

In the embodiment, the cylindrical heat pipe 40 and the daisy heat pipe 60 are made of aluminum alloy, copper alloy or heat conductive plastic.

The above is only the embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Any equivalent structure or equivalent process transformation made by using the specification and the drawings of the present invention, or directly or indirectly applied to other related The technical field is equally included in the scope of patent protection of the present invention.

Claims

An LED device with a heat sink, comprising an LED light bulb, characterized in that: the LED device with a heat sink further comprises a base, a lamp cover, a lamp cover fixing ring, a cylindrical heat pipe, an LED lamp holder and a daisy-shaped heat pipe. The LED bulb is fixed in the LED lamp holder, the base is disposed at the bottom of the entire LED device, the lamp cover is disposed on the right side of the base and is fixed on the base, and the lamp cover fixing ring is disposed on the right side of the lamp cover to be fixed a lamp cover, the cylindrical heat pipe passes through the lamp cover and the lamp cover fixing ring and is fixed on the base, the LED lamp holder is disposed in the cylindrical heat pipe to fix the LED bulb, and the daisy-shaped heat pipe is connected to the cylindrical heat pipe to the LED bulb Between the LED bulbs are connected to the LED socket through a daisy-shaped heat pipe.
The LED device with a heat sink according to claim 1, wherein the outer edge of the daisy-shaped heat pipe is provided with a plurality of rows of heat pipe gaps, and the daisy-shaped heat pipe is divided into a plurality of petal-shaped heat conductive sheets.
The LED device with a heat sink according to claim 1, wherein a left side of the LED bulb is connected to a daisy-shaped heat pipe, and a left side of the daisy-shaped heat pipe is connected to a cylindrical heat pipe, and the cylindrical heat pipe is further The base is connected.
The LED device with a heat sink according to claim 1, wherein the cylindrical heat pipe and the daisy heat pipe are made of aluminum alloy, copper alloy or heat conductive plastic.