EP2179631A2 - Feuil de support - Google Patents

Feuil de support

Info

Publication number
EP2179631A2
EP2179631A2 EP08758992A EP08758992A EP2179631A2 EP 2179631 A2 EP2179631 A2 EP 2179631A2 EP 08758992 A EP08758992 A EP 08758992A EP 08758992 A EP08758992 A EP 08758992A EP 2179631 A2 EP2179631 A2 EP 2179631A2
Authority
EP
European Patent Office
Prior art keywords
carrier film
less
film according
microns
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP08758992A
Other languages
German (de)
English (en)
Inventor
Michael Schlipf
Katja Widmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ElringKlinger AG
Original Assignee
ElringKlinger AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ElringKlinger AG filed Critical ElringKlinger AG
Publication of EP2179631A2 publication Critical patent/EP2179631A2/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07—Flat, e.g. panels
    • B29C48/08—Flat, e.g. panels flexible, e.g. films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
    • B29C48/50—Details of extruders
    • B29C48/505—Screws
    • B29C48/53—Screws having a varying channel depth, e.g. varying the diameter of the longitudinal screw trunk
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/022—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
    • B29K2027/12—Use of polyvinylhalogenides or derivatives thereof as moulding material containing fluorine
    • B29K2027/18—PTFE, i.e. polytetrafluorethene, e.g. ePTFE, i.e. expanded polytetrafluorethene
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31—Surface property or characteristic of web, sheet or block
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Definitions

  • the invention relates to a carrier film for a flexible printed circuit board with one or more film layers, which are made of a polymer material.
  • High-performance printed circuit boards based on PTFE-coated glass fabric, optionally with a PTFE film lamination, are usually used in such applications.
  • high-performance polymer films are used which are produced on the basis of polyethylene, liquid-crystalline polymers (LCP), polyetheretherketone (PEEK), polyetherimide (PEI) or polyimide (PI).
  • LCP liquid-crystalline polymers
  • PEEK polyetheretherketone
  • PEI polyetherimide
  • PI polyimide
  • PTFE-coated glass fabrics do not have the optimum dielectric properties of PFTE with a relative dielectric constant ⁇ r of approximately 2.4.
  • Air inclusions in the PFTE-coated glass fabrics can lead to defects when a voltage is applied.
  • the emergence of the microvoids is due to the special coating process which requires repeated dipping of the glass fabric into a PTFE dispersion followed by drying and sintering.
  • Residual contents of the emulsifiers contained in the PTFE dispersion and traces of their decomposition products remain in the PTFE-coated glass fabric printed circuit board and adversely affect the performance potential of the PTFE material in this application. In particular, these residues influence the dielectric loss factor (tan ⁇ ) and the relative dielectric constant ⁇ r .
  • PTFE-coated glass fabric has a comparatively rough surface, since at the typically applied application rates, the glass fabric still forms on the surface.
  • a skin effect is the fact that the (negative) charge carriers responsible for the flow of current preferably flow on the surface of an electrical conductor due to their mutual repulsion.
  • the skin effect increases with increasing frequency. In the same direction, the demands on the surface quality also increase.
  • Rough surfaces are also found in peel-made PTFE films.
  • the roughness is here in particular by, based on the peeling process, longitudinally oriented grooves, originating from the paring knife generated.
  • the mechanical properties of by means of peeling process produced PTFE films therefore often differ in comparison of the longitudinal and transverse values.
  • the values determined in the transverse direction in particular the values for tensile strength and elongation at break, can be up to 50% lower than the values determined in the longitudinal direction.
  • Printed circuit boards based on polymers and high-performance polymers are typically characterized by good surface properties.
  • the tendency of many polymers to admit water over time in direct contact with water or even humidity affects the properties of printed circuit boards negatively.
  • the performance data of the original dry state fall off during the life due to the continuing water absorption continues.
  • the relatively strong tendency of the polyimide (PI) to absorb water has proven to be particularly negative for printed circuit board applications.
  • PI-based carrier films a copper foil is conventionally rolled onto the PI carrier foil, which necessitates layer thicknesses of 18 ⁇ m and more for reasons of process technology. If the intended use of the printed circuit board requires lower Cu layer thicknesses, the superfluous Cu layer thickness must be removed by a complex etching process in a downstream process step.
  • Liquid crystalline polymers are characterized by a strongly reduced tendency to absorb water. In the most favorable case, up to a factor of about one hundred reduced water absorption can be observed in comparison with PI. However, LCPs are comparatively brittle, and especially in vibratory applications, mechanical damage or even board cracking can easily occur. In addition, LCPs are very expensive materials and therefore limited to niche applications in printed circuit board construction.
  • the object of the invention is to propose a carrier material for printed circuit boards, which avoids the above-mentioned problems and in particular can be made available at economic cost. This object is achieved by a carrier film according to claim 1.
  • melt flow index (MFI) which is different from zero (ASTM Test D1238-88 at 372 0 C and a load of 5 kg at a maximum extrudate-collection time of 1 hour).
  • thermoplastically processable, substantially fully fluorinated plastic material used in accordance with the invention can be processed into films, in particular in the extrusion process, so that the carrier film according to the invention can be produced in a simple process and with very good surface properties.
  • thermoplastically processable PTFE As a fully fluorinated thermoplastic material, preferably thermoplastically processable PTFE is used. A large number of such materials is described, for example, in WO 01/60911 and WO 03/078481.
  • TFE copolymers in which the comonomer content is less than 3.5 mol% are particularly suitable here since the PTFE properties are largely retained and thermoplastic processing is nevertheless possible. More preferably, the comonomer content is limited to less than about 3 mole%, even more preferred are comonomer levels of less than about 1 mole%, for example, 0.5 mole% or less.
  • Preferred comonomers which, on the one hand, ensure good thermoplastic processability and, on the other hand, leave the material properties largely unchanged relative to PTFE, are hexafluoropropylene, perfluoroalkylvinyl ether, perfluoro- (2,2-dimethyl-1,3-dioxole) and chlorotrifluoroethylene.
  • Polymer blends of PTFE and one or more thermoplastically processable plastics are used in addition to the TFE copolymers as the fully fluorinated plastic material to be used according to the invention.
  • These other plastics are selected in particular from the group of PTFE micropowders.
  • PTFE micropowders These are PTFE types with low molecular weight and low melt viscosity compared to high molecular weight (standard) PTFE. They are typically prepared by either emulsion polymerization, by thermomechanical degradation of high molecular weight PTFE in the extruder, or by jet degradation of high molecular weight PTFE, followed by a milling process.
  • the carrier films according to the invention have a significantly better value than PTFE-coated glass fabrics.
  • the plastic materials to be used according to the invention are distinguished by very good resistance to aging, even at high temperatures and under the action of light, in particular UV light, and a low tendency to cracking and brittleness.
  • the excellent surface properties and outstanding dielectric properties result in lowest levels of attenuation in many electronic applications and enable use in conjunction with higher signal frequencies than conventional polymer and high performance polymer based printed circuit boards.
  • the carrier films according to the invention open up applications in the automotive sector, such as e.g. high-frequency distance radar and others.
  • the carrier films according to the invention can also be produced in several layers with little effort, a particular advantage in highly integrated circuits with high component density.
  • the carrier film according to the invention or one of the layers thereof preferably has a Cu lamination, wherein in particular the carrier film according to the invention can serve as a substrate for the lamination. It can therefore be transferred to thinner Cu layers than is the case in the technique of rolling of Cu films on polymer films so far.
  • the thickness of the Cu layer can vary within wide limits. It is typically between 1 ⁇ m and 20 ⁇ m.
  • One of the advantages of the present invention is the ability to produce particularly thin Cu layers with high adhesion and high uniformity.
  • the chill roll side and the opposite side of the film have slightly different surface roughness. This allows selection of the appropriate side as the side to be laminated (conductor side) to find an optimum between a very good adhesion of the conductive copper layer and low attenuation values, even in high-frequency applications.
  • the polymer material of the carrier film according to the invention preferably has an amorphous content which is about 50% by weight or more.
  • the arithmetic mean roughness of a layer of the carrier film has a value of about 1 ⁇ m or less on a first surface and about 0.8 ⁇ m or less on the opposite side (chill roll side).
  • the surface roughness, expressed by the arithmetic mean roughness, of a layer of the carrier film on a first surface is about 0.6 ⁇ m or less, in particular about 0.3 ⁇ m or less, and on the opposite surface ( Chillrollseite) is about 0.5 microns or less, in particular about 0.25 microns or less.
  • Particularly preferred are films in which the arithmetic mean roughness of the chill roll side is about 0.2 microns or less.
  • preferred carrier films have surfaces of the individual layers with a roughness depth of about 2.5 ⁇ m or less, in particular 2 ⁇ m or less.
  • the present invention further relates to a process for producing a carrier film according to the invention as defined in claim 18.
  • the carrier films produced by the process according to the invention can be particularly well equipped with a Cu lining with good adhesion.
  • Particularly preferred for the lamination are methods for electrodeposition (chemical or electrochemical) of the Cu layer.
  • the activation may include roughening the surface to improve the mechanical bond between the Cu layer and the layer surface.
  • the roughening of the surface may involve treatment thereof by ion beam or ion track technology, and / or plasma jet and / or electron beam and / or laser beam resulting in nanostructuring of the surface.
  • a nanostructured transition layer containing nanocomposites is produced, preferably immediately following the roughening of the surface and more preferably by means of ion and / or plasma processes, preferably immediately after.
  • a copper starting layer is applied by vacuum coating.
  • galvanically ie applied in a chemical or electrochemical process, the main part of the copper layer.
  • the carrier film according to the present invention has the advantage of a significantly improved surface quality, which manifests itself in a lower arithmetic mean roughness and a lower roughness.
  • the desired roughness in the nm range is to be distinguished from the roughness of the surface as described elsewhere. The latter leads to a better mechanical anchoring of the Cu layer on the surface without appreciably impairing the damping properties.
  • the roughening can also be done with chemical etching.
  • roughening is meant in particular the creation of a surface structure in the nm range.
  • the lamination of a surface of a layer of the carrier film may alternatively comprise, in particular, the application of a thin, conductive Cu layer by means of a sputtering method.
  • the sputtering process can be carried out as a PVD or CVD process or by sputtering.
  • the carrier films according to the invention also have over the peeled films a higher average yield stress and a better shrinkage behavior, ie a better dimensional stability, which adds up to a simpler handling of the carrier films according to the invention and a better product quality.
  • a disadvantageous anisotropic behavior is observed in the peeled films, which is avoided in the carrier films produced according to the invention.
  • a laminating method in which the carrier film layer and the copper foil are continuously connected to one another by means of a double-belt press is more advantageous.
  • a so-called roll-to-roll production can be realized, which works much more economically than the discontinuous process with the platen press.
  • two or more layers of the carrier film can be laminated together in a conventional laminating process to form a laminate.
  • the screw 10 comprises a feed zone 12, a compression zone 14 and a metering zone 16.
  • the polymer material used is a TFE copolymer with a comonomer content of 0.5 mol%.
  • the comonomer was perfluoropropyl vinyl ether (PPVE).
  • the film which is preferably produced in the chill roll process, is roughened by means of a special process, which has already been described above.
  • the resulting surface structure can also be described as "nanoclips" structured.
  • a nanostructured, nanocomposite-containing transition layer which preferably has an extension from the surface into the sheet material of 2 ⁇ m or less.
  • a metallization of the film surface takes place by means of copper.
  • This thin Cu layer a so-called copper starting layer, is also called Cu seed layer. It forms an adhesive bond with the carrier film due to the treatment described above.
  • a copper layer having a desired layer thickness for the respective application can then be applied to the copper starting layer.
  • Schematically such films are shown with Cu lamination in Figure 3 of WO 2005/084940. Please refer to the corresponding description of the figures here.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un feuil de support pour des cartes de circuit imprimé conçu particulièrement pour des densités élevées de composants et fabriqué en un matériau polymère consistant en un matériau thermoplastique pratiquement totalement fluoré.
EP08758992A 2007-08-24 2008-06-04 Feuil de support Ceased EP2179631A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710040098 DE102007040098A1 (de) 2007-08-24 2007-08-24 Trägerfolie
PCT/EP2008/004431 WO2009026975A2 (fr) 2007-08-24 2008-06-04 Feuil de support

Publications (1)

Publication Number Publication Date
EP2179631A2 true EP2179631A2 (fr) 2010-04-28

Family

ID=40152557

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08758992A Ceased EP2179631A2 (fr) 2007-08-24 2008-06-04 Feuil de support

Country Status (5)

Country Link
US (1) US8252406B2 (fr)
EP (1) EP2179631A2 (fr)
CN (1) CN101803474B (fr)
DE (1) DE102007040098A1 (fr)
WO (1) WO2009026975A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11549035B2 (en) 2020-12-16 2023-01-10 Saint-Gobain Performance Plastics Corporation Dielectric substrate and method of forming the same
US11596064B2 (en) 2020-07-28 2023-02-28 Saint-Gobain Performance Plastics Corporation Dielectric substrate and method of forming the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101838431B (zh) * 2010-05-21 2012-11-14 广东生益科技股份有限公司 氟树脂混合物、使用其制作的覆铜板及其制作方法
CN111683996B (zh) * 2018-02-07 2023-11-14 大金工业株式会社 含有低分子量聚四氟乙烯的组合物的制造方法
US20210276238A1 (en) * 2018-07-26 2021-09-09 Daikin Industries, Ltd. Molded resin body production method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5359767A (en) * 1993-08-26 1994-11-01 International Business Machines Corporation Method of making multilayered circuit board
US20070158020A1 (en) * 2006-01-06 2007-07-12 Chen-Yuan Tu Method for modificating fluoropolymers and their application

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5006382A (en) * 1981-08-20 1991-04-09 E. I. Du Pont De Nemours And Company Amorphous copolymers of perfluoro-2,2-dimethyl-1,3-dioxole
JPS6056532A (ja) * 1983-09-09 1985-04-02 Unitika Ltd フツ素系延伸フイルムの製造方法
DE3716531A1 (de) * 1987-04-09 1988-10-27 Aeg Isolier Kunststoff Verfahren zum kontinuierlichen herstellen von bandfoermigem basismaterial
EP0291629A3 (fr) * 1987-05-16 1990-02-28 Aeg Isolier- Und Kunststoff Gmbh Procédé de fabrication en continu d'un matériau en forme de ruban
US20030069343A1 (en) 1998-08-06 2003-04-10 Paul Smith Melt-processible poly(tetrafluoroethylene)
US6737165B1 (en) * 1998-08-06 2004-05-18 Omlidon Technologies Llc Melt-processible poly(tetrafluoroethylene)
US6653379B2 (en) * 2001-07-12 2003-11-25 3M Innovative Properties Company Fluoropolymers resistant to stress cracking
DE102004011567A1 (de) 2004-03-02 2005-09-22 Ist - Ionen Strahl Technologie Gmbh Haftfester Verbund und Verfahren zur Herstellung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5359767A (en) * 1993-08-26 1994-11-01 International Business Machines Corporation Method of making multilayered circuit board
US20070158020A1 (en) * 2006-01-06 2007-07-12 Chen-Yuan Tu Method for modificating fluoropolymers and their application

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11596064B2 (en) 2020-07-28 2023-02-28 Saint-Gobain Performance Plastics Corporation Dielectric substrate and method of forming the same
US11805600B2 (en) 2020-07-28 2023-10-31 Saint-Gobain Performance Plastics Corporation Dielectric substrate and method of forming the same
US11549035B2 (en) 2020-12-16 2023-01-10 Saint-Gobain Performance Plastics Corporation Dielectric substrate and method of forming the same

Also Published As

Publication number Publication date
CN101803474A (zh) 2010-08-11
WO2009026975A2 (fr) 2009-03-05
WO2009026975A3 (fr) 2009-07-30
US20100221529A1 (en) 2010-09-02
CN101803474B (zh) 2014-01-29
DE102007040098A1 (de) 2009-02-26
US8252406B2 (en) 2012-08-28

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